CN115966498A - Conveying system for vertical furnace and control method thereof - Google Patents

Abstract

The invention discloses a conveying system for a vertical furnace and a control method thereof, wherein the system comprises the following steps: the transfer platform is provided with a wafer transfer manipulator and a wafer box transfer manipulator on two sides respectively; the transfer platform comprises a platform base, an upright column, a bottom plate and a base, wherein the upright column is arranged on the platform base, the bottom plate is arranged on the upright column, the base is arranged on the bottom plate, and the wafer box conveying manipulator is used for pulling out or inserting the wafer box into the base so as to convey the wafer box on the transfer platform; the side part of the upright post is provided with a first lifting component and a push rod component, the first lifting component is used for driving the push rod component to reciprocate to reach the position of the wafer box, and the push rod component is used for pushing the wafer into the wafer box from the horizontal direction so as to finish wafer arrangement. The invention also discloses a control method based on the transmission system. The vertical furnace automatic positioning device has the advantages of simple structure, easiness in operation, stability in transmission, high positioning accuracy and the like, meets the production requirement of full-automatic transmission of the vertical furnace, and improves the production efficiency of the vertical furnace.

Description

Conveying system for vertical furnace and control method thereof

Technical Field

The invention belongs to the technical field of semiconductor equipment, and particularly relates to a conveying system for a vertical furnace and a control method thereof.

Background

The vigorous development of the information industry has greatly driven the development of the integrated circuit industry, and furnace tube equipment can be used for oxidation, diffusion, alloy and other processes in the manufacturing process of the integrated circuit, and is one of the most important process equipment on the integrated circuit production line. The vertical furnace tube equipment can realize full-automatic transmission, a wafer box for bearing wafers enters from a material inlet of the equipment, and the wafers finally enter a reaction chamber through a series of transmissions. This involves cassette transport by a cassette transfer robot and wafer transport by a wafer transfer robot, and therefore a transfer system is required to transfer the cassette to the wafer.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a conveying system for a vertical furnace and a control method thereof, wherein the conveying system is simple in structure, easy to operate, stable in transmission and high in positioning precision.

In order to solve the technical problems, the invention adopts the following technical scheme:

a conveyor system for a vertical furnace comprising: the wafer transferring device comprises a transfer platform, a wafer transferring manipulator and a wafer box transferring manipulator, wherein the wafer transferring manipulator and the wafer box transferring manipulator are respectively arranged on two sides of the transfer platform; the transfer platform comprises a platform base, an upright column, a bottom plate and a base, wherein the upright column is arranged on the platform base, the bottom plate is arranged on the upright column, the base is arranged on the bottom plate, and the wafer box conveying manipulator is used for pulling out or inserting the wafer box into the base so as to convey the wafer box on the transfer platform; the side part of the upright post is provided with a first lifting component and a push rod component, the first lifting component is used for driving the push rod component to reciprocate in the vertical direction so as to reach the position of the wafer box, and the push rod component is used for pushing the wafer into the wafer box from the horizontal direction so as to finish wafer arrangement.

As a further improvement of the invention, the push rod assembly comprises a first driving assembly and a push rod for pushing the wafer, the first driving assembly is connected with the first lifting assembly, and the output end of the first driving assembly is connected with the push rod; the push rod is driven by the first lifting assembly to reciprocate along the vertical direction, and driven by the first driving assembly to reciprocate along the horizontal direction.

As a further improvement of the invention, a second sensor is arranged at the bottom of the base and used for detecting the placing state of the film box on the base.

As a further improvement of the invention, a buffer and a second driving assembly are arranged at the bottom of the bottom plate, and the output end of the second driving assembly is connected with the buffer; when the second sensor detects that the film box enters the base, the second driving assembly drives the buffer to push the film box to enter the preset position of the base, and secondary positioning of the film box in the base is achieved.

As a further improvement of the invention, a first sensor is arranged on the side part of the bottom plate and used for detecting the placement state of the wafer in the wafer box.

As a further improvement of the present invention, the wafer transfer robot includes: the device comprises a mounting base, a rotating platform and a moving platform; the end part of the mounting base is connected with the rotating base, the rotating base is provided with a rotating platform, the rotating platform is provided with a moving platform, the moving platform is used for bearing a wafer, the rotating base drives the rotating platform to rotate and is used for realizing the reciprocating movement of the wafer in the horizontal direction so as to finish the picking and placing of the wafer on the preset station of the wafer box.

As a further improvement of the present invention, the movable platform includes a first movable platform and a second movable platform, the first movable platform and the second movable platform are both provided with ceramic fingers for receiving the wafer, the first movable platform is used for receiving a single wafer, and the second movable platform is used for receiving a plurality of wafers.

As a further improvement of the present invention, the wafer transfer robot further includes a second driving assembly and a third driving assembly, an output end of the second driving assembly is connected to the first moving platform, and an output end of the third driving assembly is connected to the second moving platform; the top of the rotary platform is provided with a first guide rail and a second guide rail; under the drive of the second driving component, the first moving platform moves back and forth along the first guide rail so as to realize the picking and placing of the single wafer; under the drive of the third driving component, the second moving platform moves back and forth along the second guide rail so as to realize the picking and placing of a plurality of wafers.

As a further improvement of the present invention, a third sensor and a fourth sensor are disposed on the movable platform, the third sensor is used for detecting whether the wafer on the movable platform exists or not and the wafer overflows in the forward direction on the movable platform, and the fourth sensor is used for detecting the wafer overflowing in the backward direction on the movable platform.

As a general technical concept, the present invention also discloses a control method based on the above-mentioned transmission system, comprising the steps of:

s1, a wafer box is placed on a base of a transfer platform by a wafer box conveying manipulator, and the first positioning of the wafer box in the base is realized;

s2, a second sensor sends an in-place signal after detecting that the wafer box enters the base, and a second driving assembly drives the buffer to push the wafer box to enter a preset position of the base, so that the second positioning of the wafer box in the base is realized;

s3, detecting whether the wafer overflows from the wafer box by the first sensor;

s4, if no wafer overflows from the wafer box, the first lifting assembly drives the first driving assembly and the push rod to vertically lift so as to reach the position of the wafer, the first driving assembly drives the push rod to horizontally move, the wafer is pushed to a preset position in the wafer box, and wafer sorting is achieved;

s5, after the arrangement of the wafers is finished, the first driving assembly drives the push rod to retract the original point, the first lifting assembly drives the first driving assembly and the push rod to descend to the original point, and the wafer conveying manipulator conveys the wafer to the transfer platform to grab the wafer;

s6, when the wafer is taken, the wafer conveying manipulator rises to a first preset height, the rotating platform rotates to a preset angle, and the moving platform moves the ceramic finger to be under the wafer to be grabbed;

s7, the wafer conveying manipulator continuously rises to a second preset height to enable the ceramic finger to be in contact with the wafer, the third sensor detects whether a wafer signal exists or not, if the wafer signal exists, the wafer conveying manipulator rises to a third preset height again to complete the lifting action of the ceramic finger on the wafer;

s8, the moving platform retracts to the original point, the rotating platform rotates to a preset station where the wafer is to be placed, the moving platform conveys the wafer to the position right above the station where the wafer is to be placed, and the wafer conveying mechanical arm descends to complete placement of the wafer.

Compared with the prior art, the invention has the advantages that:

1. the transfer system for the vertical furnace, disclosed by the invention, has the advantages that a transfer platform with simple structure and high mechanical strength is formed by the platform base, the upright post, the bottom plate and the base, the wafer box transfer mechanical arm and the wafer transfer mechanical arm are arranged on two sides of the transfer platform respectively, the transfer platform is an interactive platform from the wafer box to the wafer, the wafer box transfer mechanical arm takes and places the wafer box on the platform, the wafer transfer mechanical arm takes and places the wafer on the platform, the transmission from the wafer box to the wafer is completed, and the full-automatic transmission of the vertical furnace is realized; furthermore, the lifting assembly and the push rod assembly are arranged on the side portion of the transfer platform, the lifting assembly is used for driving the push rod assembly to lift to the position where the wafer box is located, the push rod assembly pushes the wafer into the preset station in the wafer box along the horizontal direction, the positioning accuracy of the wafer in the wafer box is obviously improved, the breakage rate of the wafer in the conveying process is reduced, and the production efficiency of the vertical furnace equipment is improved.

2. According to the conveying system for the vertical furnace, the second sensor is arranged at the bottom of the base, the placing state of the wafer box on the base is monitored in real time, the state information of the wafer box is related to the buffer arranged at the bottom of the bottom plate and the second driving assembly, and when the second sensor detects that the wafer box enters the base, the second driving assembly drives the buffer to push the wafer box to enter the preset position of the base, so that the secondary positioning of the wafer box in the base is realized, the repeated positioning precision of the wafer box is improved, the safety and reliability of conveying the wafer box are increased, the high-precision wafer and wafer box conveying is realized, and the use requirements of the vertical furnace are well met.

3. The conveying system for the vertical furnace is characterized in that a first moving platform for bearing a single wafer and a second moving platform for bearing a plurality of wafers are arranged on the moving platform of the wafer conveying manipulator at the same time, so that the single wafer and the plurality of wafers are conveyed at the same time; furthermore, the sensor is arranged on the mobile platform, so that the working state on the mobile platform is accurately monitored, and meanwhile, the advancing and retreating directions of the wafer on the mobile platform are accurately monitored, the accuracy and reliability of wafer conveying are obviously improved, and the automation degree and the production efficiency of the vertical furnace equipment are greatly improved.

4. The control method for the conveying system of the vertical furnace is characterized in that the wafer box is placed on the base of the transfer platform through the wafer box conveying manipulator, so that the first positioning of the wafer box on the transfer platform is realized, and then the second positioning of the wafer box on the transfer platform is realized through the cooperation among the second sensor, the second driving assembly and the buffer, so that the high-precision conveying of the wafer box is completed; furthermore, the first sensor is used for detecting the placement state of the wafer in the wafer box, and then the first lifting assembly is matched with the push rod assembly, so that the wafer in the wafer box is sorted, and the high-precision transmission of the wafer is completed; and furthermore, in the process of taking the wafer by using the wafer conveying manipulator, whether a wafer signal exists or not is detected by the third sensor, so that the reliability of taking the wafer is improved, the movable platform is rotated to any wafer taking and placing angle by matching the rotary base and the rotary platform, the wafer taking and placing at multiple angles is realized, and the working efficiency of the vertical furnace equipment is improved.

Drawings

Fig. 1 is a schematic perspective view of a conveyor system for a vertical furnace according to the present invention.

FIG. 2 is a schematic side view of the conveyor system for a vertical furnace according to the present invention.

Fig. 3 is a schematic structural diagram of a relay platform according to the present invention.

FIG. 4 is a schematic view of the mounting structure of the sheet cassette on the transfer platform according to the present invention.

Fig. 5 is a schematic view of the wafer transfer robot in the single wafer transfer mode according to the present invention.

FIG. 6 is a schematic view of the wafer transfer robot in the multi-wafer transfer mode according to the present invention.

Fig. 7 is a schematic view of the wafer transfer robot in the rotation mode according to the present invention.

FIG. 8 is a schematic view of the mounting structure of the wafer transfer robot according to the present invention.

FIG. 9 is a control flow diagram of the conveying system of the present invention.

Illustration of the drawings: 1. a transfer platform; 11. a platform base; 12. a column; 13. a base plate; 14. a base; 15. a first sensor; 16. a first lifting assembly; 161. a support; 17. mounting a plate; 18. a first drive assembly; 19. a push rod; 110. a pressure lever; 111. a spring; 112. a second sensor; 113. a buffer; 114. a second drive assembly; 2. a wafer transfer robot; 21. mounting a base; 22. a rotating base; 23. rotating the platform; 231. a first guide rail; 232. a second guide rail; 24. a first mobile platform; 25. a second mobile platform; 26. a ceramic finger; 27. a third sensor; 28. a fourth sensor; 29. a third drive assembly; 210. a fourth drive assembly; 211. a slider; 212. a second lifting assembly; 2121. a support pillar; 2122. a fifth drive assembly; 3. a cassette transfer robot; 100. a wafer; 200. a cassette.

Detailed Description

The invention is further described below with reference to the drawings and specific preferred embodiments of the description, without thereby limiting the scope of protection of the invention.

Example 1

As shown in fig. 1 to 8, the conveyor system for a vertical furnace of the present invention comprises: the transfer platform 1, a wafer transfer robot 2 for transferring the wafer 100 and a cassette transfer robot 3 for transferring the cassette 200 are respectively arranged on both sides of the transfer platform 1. The transfer platform 1 comprises a platform base 11, upright columns 12, a bottom plate 13 and a base 14, wherein the upright columns 12 are arranged on four vertexes of the platform base 11, the bottom plate 13 is arranged on the top and the middle of the upright columns 12, the base 14 is arranged on the four vertexes of the bottom plate 13, and the wafer box conveying manipulator 3 is used for drawing or inserting the wafer box 200 into the base 14 so as to convey the wafer box 200 on the transfer platform 1; the side of the column 12 is provided with a first lifting assembly 16 and a push rod assembly, the first lifting assembly 16 is used for driving the push rod assembly to reciprocate in the vertical direction to reach the position of the wafer box 200, and the push rod assembly is used for pushing the wafer 100 into the wafer box 200 from the horizontal direction to complete the wafer 100 arrangement. In this embodiment, the structure of the cassette conveying manipulator 3 is conventionally configured, and will not be described herein.

As shown in fig. 3, in this embodiment, the first lifting assembly 16 is mounted on the side of the upright 12 of the transfer platform 1 through a mounting plate 17, the first lifting assembly 16 is composed of a driving assembly (not shown) and a bracket 161 with a sliding slot, an output end of the driving assembly is connected with the push rod assembly, and the push rod assembly is driven by the driving assembly to reciprocate along the sliding slot of the bracket 161. The drive assembly can adopt the form of servo motor or cylinder or hydro-cylinder, can adopt the connected modes such as gear engagement or lead screw or cable between push rod assembly and the drive assembly's the output, as long as can drive push rod assembly along support 161 reciprocal lift steadily can.

In this embodiment, constitute simple structure jointly through platform base 11, stand 12, bottom plate 13 and base 14, transfer platform 1 that mechanical strength is high, transfer platform 1 both sides have set up spool box conveying manipulator 3 and wafer conveying manipulator 2 respectively, this transfer platform 1 is the mutual platform of wafer spool box to wafer, spool box conveying manipulator 3 gets on this platform and puts the wafer spool box, wafer conveying manipulator 2 gets at this platform and puts the wafer, the transmission of spool box to wafer has been accomplished, the full automation transmission of vertical furnace has been realized. Furthermore, the lifting assembly 16 and the push rod assembly are arranged on the side portion of the transfer platform 1, the lifting assembly 16 is used for driving the push rod assembly to lift to the position where the wafer box 200 is located, and the push rod assembly pushes the wafer 100 into the preset station in the wafer box 200 along the horizontal direction, so that the positioning accuracy of the wafer 100 in the wafer box 200 is remarkably improved, the breakage rate of the wafer 100 in the conveying process is reduced, and the production efficiency of the vertical furnace equipment is improved.

As shown in fig. 3, in the present embodiment, the push rod assembly includes a first driving assembly 18 and a push rod 19 for pushing the wafer 100, the first driving assembly 18 is connected to the first lifting assembly 16, and an output end of the first driving assembly 18 is connected to the push rod 19; the push rod 19 is driven by the first lifting assembly 16 to reciprocate in a vertical direction, and the push rod 19 is driven by the first driving assembly 18 to reciprocate in a horizontal direction. In this embodiment, the first driving assembly 18 may be in the form of a servo motor, an air cylinder or an oil cylinder, as long as the push rod 19 can be pushed to move smoothly along the horizontal direction.

As shown in fig. 4, in this embodiment, a pressing rod 110 is disposed at the bottom of the base 14, a spring 111 is disposed at the bottom of the pressing rod 110, a second sensor 112 is disposed at the bottom of the spring 111, and the second sensor 112 is used for detecting the placing state of the cassette 200 on the base 14. Specifically, when cassette 200 is placed in base 14, cassette 200 presses down pressing rod 110, spring 111 compresses, and second sensor 112 sends out an electric signal that cassette 200 is in place; when the cassette 200 is not placed on the base 14, the spring 111 pushes up the pressing rod 110, and the second sensor 112 does not have a detection signal.

Further, a buffer 113 and a second driving assembly 114 are disposed at the bottom of the bottom plate 13, and an output end of the second driving assembly 114 is connected to the buffer 113. When the second sensor 112 detects that the cassette 200 enters the base 14, the second driving assembly 114 drives the buffer 113 to push the cassette 200 to enter a predetermined position of the base 14, so as to position the cassette 200 in the base 14 for the second time. The second driving assembly 114 may be in the form of a servo motor, or an air cylinder or an oil cylinder, as long as it can drive the buffer 113 to push the film cartridge 200 into a preset position in the base 14.

In this embodiment, the second sensor 112 is disposed at the bottom of the base 14, the placing state of the cassette 200 on the base 14 is monitored in real time, and the state information of the cassette 200 is associated with the buffer 113 and the second driving component 114 disposed at the bottom of the bottom plate 13, when the second sensor detects that the cassette enters the base, the second driving component 114 drives the buffer 13 to push the cassette 200 to enter the preset position of the base 14, so as to achieve secondary positioning of the cassette 200 in the base 14, improve the repeated positioning accuracy of the cassette 200, increase the safety and reliability of conveying the cassette 200, achieve high-precision wafer and cassette transmission, and well meet the use requirements of the vertical furnace.

As shown in fig. 3, in the present embodiment, a first sensor 15 is disposed at the middle of the side of the bottom plate 13, and the first sensor 15 is used for detecting the placement state of the wafer 100 in the cassette 200. After the buffer 113 and the second driving assembly 114 are operated, the first sensor 15 is used to detect whether the wafer 100 overflows from the cassette 200, so as to prevent the wafer 100 from being damaged by the pushing rod 19 during the wafer sorting process due to the excessive overflow of the wafer 100.

As shown in fig. 5 to 8, in the present embodiment, in order to improve the working efficiency of the wafer transfer robot 2, the wafer transfer robot 2 is mounted on the second elevating assembly 212. The wafer transfer robot 2 includes: a mounting base 21, a rotating base 22, a rotating platform 23 and a moving platform. One end of the mounting base 21 is connected to the second lifting assembly 212, the other end of the mounting base 21 is connected to the rotary base 22, a moving platform is disposed on the rotary platform 23, the moving platform is used for bearing the wafer 100, and a rotary motor in the rotary base 22 drives the rotary platform 23 to rotate around the rotary base 22, so as to achieve the reciprocating movement of the wafer 100 in the horizontal direction, as shown in fig. 7. Under the driving of the second lifting assembly 212, the mounting base 21 drives the rotating base 22 and the rotating platform 23 to reciprocate in the vertical direction, so as to realize the reciprocating movement of the wafer 100 in the vertical direction, and complete the picking and placing of the wafer 100 on the preset station of the wafer box 200.

In this embodiment, the mounting base 21 is connected to the second lifting assembly 212 and the rotary base 22 respectively, the rotary platform 23 is disposed on the rotary base 22, the moving platform for receiving the wafer 100 is disposed on the rotary platform 23, the mounting base 21 drives the rotary base 22 and the rotary platform 23 to reciprocate in the vertical direction under the driving of the second lifting assembly 212, that is, the wafer 100 moves in the vertical direction, and the rotary platform 23 drives the moving platform to rotate in the horizontal direction under the driving of the rotary base 22, that is, the wafer 100 moves in the horizontal direction, so that the wafer 100 is accurately picked and placed in the wafer box 200.

As shown in fig. 8, in the present embodiment, the second lifting assembly 212 includes a supporting column 2121 and a fifth driving assembly 2122, an output end of the fifth driving assembly 2122 is connected to the mounting base 21, and the mounting base 21 is driven by the fifth driving assembly 2122 to reciprocate along the supporting column 2121.

Further, the mounting base 21 includes a sliding block 211, a sliding slot is formed inside the supporting column 2121, the sliding block 211 is connected to an output end of the fifth driving assembly 2122, and the sliding block 211 is driven by the fifth driving assembly 2122 to reciprocate along the sliding slot of the supporting column 2121. It can be understood that the fifth driving assembly 2122 can be in the form of a servo motor, an air cylinder or an oil cylinder, and the output ends of the sliding block 211 and the fifth driving assembly 2122 can be connected by a gear engagement, a lead screw, a cable, or the like, as long as the mounting base 21 can be driven to smoothly reciprocate along the upright 1.

As shown in fig. 6, in the present embodiment, the movable platform includes a first movable platform 24 and a second movable platform 25, the first movable platform 24 is used for carrying a single wafer, and the second movable platform 25 is used for carrying a plurality of wafers. In this embodiment, the second movable stage 25 can carry four wafers at a time.

As shown in fig. 5, in the present embodiment, the first moving stage 24 and the second moving stage 25 are both provided with ceramic fingers 26, and the ceramic fingers 26 are used for receiving the wafer 100. A single piece of ceramic finger 26 is placed on the first moving platform 24 and four pieces of ceramic finger 26 are placed on the second moving platform 25. When the first mobile platform 24 operates alone, single wafer transmission can be realized; when the second mobile platform 25 operates alone, the four wafers can be transferred; when the first moving platform 24 and the second moving platform 25 operate simultaneously, five wafers can be conveyed, and the high-efficiency operation of the vertical furnace equipment can be realized to the maximum extent.

As shown in fig. 6, in the present embodiment, the wafer picking and placing device further includes a third driving assembly 29, an output end of the third driving assembly 29 is connected to the first moving platform 24, a first guide rail 231 is disposed on the top of the rotating platform 23 along the horizontal direction, and the first moving platform 24 performs reciprocating movement along the first guide rail 231 under the driving of the third driving assembly 29, so as to achieve picking and placing of the single wafer 100.

Further, in the present embodiment, the wafer processing apparatus further includes a fourth driving assembly 210, an output end of the fourth driving assembly 210 is connected to the second moving platform 25, a second guide rail 232 is disposed on the top of the rotating platform 23 along the horizontal direction, and the second moving platform 25 performs reciprocating movement along the second guide rail 232 along the horizontal direction under the driving of the fourth driving assembly 210, so as to achieve the picking and placing of the four wafers 100.

It is understood that in the present embodiment, the third driving assembly 29 and the fourth driving assembly 210 are both servo motors. In other embodiments, the third driving assembly 29 and the fourth driving assembly 210 may also be in the form of air cylinders or oil cylinders, as long as the first moving platform 24 and the second moving platform 25 can be driven to smoothly reciprocate on the rotating platform 23.

As shown in fig. 5, in the present embodiment, a third sensor 27 is disposed on the movable platen, and the third sensor 27 is used for detecting whether the wafer 100 is on the movable platen and the overflow of the wafer 100 in the forward direction on the movable platen. Specifically, each ceramic finger 26 is provided with a third sensor 27 for detecting the in-place state of the wafer, so as to accurately control the in-place state of the wafer 100, thereby improving the picking and placing efficiency of the wafer 100.

Further, a fourth sensor 29 is provided on the movable stage, and the fourth sensor 29 is used to detect an overflow of the wafer 100 in a backward direction on the movable stage. Specifically, each ceramic finger 26 is provided with a fourth sensor 29 for detecting wafer overflow, and when any wafer 100 is shifted backwards, a wafer shift signal is given.

In this embodiment, the first moving platform 24 for carrying a single wafer and the second moving platform 25 for carrying a plurality of wafers are simultaneously disposed on the moving platform, so that the single wafer and the plurality of wafers are simultaneously transferred. Furthermore, the sensor is arranged on the mobile platform, so that the working state on the mobile platform is accurately monitored, and meanwhile, the advancing and retreating directions of the wafer on the mobile platform are accurately monitored, the accuracy and reliability of wafer conveying are obviously improved, and the automation degree and the production efficiency of the vertical furnace equipment are greatly improved.

Example 2

As shown in fig. 9, the control method of the present invention based on the conveying system for a vertical furnace in embodiment 1 includes the steps of:

s1, the wafer box 200 is placed on the base 14 of the transfer platform 1 by the wafer box conveying manipulator 3, and the wafer box 200 presses down the pressing rod 110 to realize the first positioning of the wafer box 200 in the base 14.

S2, the second sensor 112 sends out an in-place signal after detecting that the film box 200 enters the base 14, and the second driving assembly 114 drives the buffer 113 to push the film box 200 to enter a preset position of the base 14, so that the second positioning of the film box 200 in the base 14 is realized.

S3, the first sensor 15 detects whether the wafer 100 overflows from the wafer box 200, so that the wafer 100 is prevented from overflowing too much, and the wafer 100 is prevented from being damaged by the push rod 19 in the process of arranging the wafers.

S4, if the wafer 100 overflows from the wafer box 200, processing according to a conventional processing mode; if no wafer 100 overflows from the wafer box 200, the first lifting assembly 16 drives the first driving assembly 18 and the push rod 19 to vertically lift to reach the position of the wafer 100, and after the push rod 19 reaches the front of the wafer 100, the first driving assembly 18 drives the push rod 19 to horizontally move to push the wafer 100 to a preset position in the wafer box 200, so that the wafer 100 is sorted.

And S5, after the wafer arrangement is finished, the first driving assembly 18 drives the push rod 19 to retract to the original point along the horizontal direction, the first lifting assembly 16 drives the first driving assembly 18 and the push rod 19 to descend to the original point along the vertical direction, and the wafer transfer manipulator 2 grabs the wafer 100 on the transfer platform 1.

S6, when the wafer is taken, the second lifting assembly 212 drives the mounting base 21 to ascend to a preset height, for example, the height of the ceramic finger 26 is 2mm lower than that of the wafer 100 to be grabbed, the rotating platform 23 rotates to a preset angle, for example, a connecting line between the center of the ceramic finger 26 and the center of the wafer 100 to be grabbed is parallel to the moving platform, and the moving platform moves the ceramic finger 26 to be right below the wafer 100 to be grabbed.

S7, the second lifting component 212 drives the mounting base 21 to lift by 2mm, so that the ceramic finger 26 is in contact with the wafer 100, the third sensor 27 detects whether a wafer signal exists, and if the wafer signal exists, the second lifting component 212 drives the mounting base 21 to lift by 2mm, so that the lifting action of the ceramic finger 26 on the wafer 100 is completed.

S8, the moving platform retracts to the original point, the rotating base 22 drives the rotating platform 23 to rotate to a preset position where a wafer to be placed is placed, after the rotating platform 23 rotates in place, the moving platform conveys the wafer 100 to a position 2mm above the position where the wafer to be placed is placed, and then the second lifting assembly 212 drives the mounting base 21 to descend for 4mm, and the wafer 100 is placed.

In this embodiment, the magazine 200 is placed on the base 14 of the transfer platform 1 by the magazine conveying manipulator 3, so that the magazine 200 is positioned on the transfer platform 1 for the first time, and then the second sensor 112, the second driving assembly 114 and the buffer 13 are matched with each other, so that the magazine 200 is positioned on the transfer platform 1 for the second time, and the high-precision magazine transmission is completed. Further, the first sensor 15 is used for detecting the placing state of the wafer 100 in the wafer box 200, and then the first lifting assembly 16 is matched with the push rod assembly, so that the wafer 100 in the wafer box 200 is sorted, and the high-precision wafer transmission is completed. Still further, in the process of taking the wafer by using the wafer conveying manipulator 2, whether a wafer signal exists or not is detected by the third sensor 27, so that the reliability of taking the wafer is improved, the movable platform is rotated to any wafer taking and placing angle through the matching of the rotary base 22 and the rotary platform 23, the multi-angle wafer taking and placing is realized, and the working efficiency of the vertical furnace equipment is improved.

Although the present invention has been described with reference to the preferred embodiments, it is not intended to be limited thereto. Those skilled in the art can make many possible variations and modifications to the disclosed embodiments, or equivalent modifications, without departing from the spirit and scope of the invention, using the methods and techniques disclosed above. Therefore, any simple modification, equivalent replacement, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the scope of the protection of the technical solution of the present invention.

Claims (10)

1. A conveyor system for a vertical furnace, comprising: the transfer platform (1), both sides of the transfer platform (1) are respectively provided with a wafer conveying manipulator (2) for conveying a wafer (100) and a wafer box conveying manipulator (3) for conveying a wafer box (200); the transfer platform (1) comprises a platform base (11), an upright post (12), a bottom plate (13) and a base (14), wherein the upright post (12) is arranged on the platform base (11), the bottom plate (13) is arranged on the upright post (12), the base (14) is arranged on the bottom plate (13), and the wafer box conveying manipulator (3) is used for drawing out or inserting the wafer box (200) into the base (14) so as to convey the wafer box (200) on the transfer platform (1); the wafer arranging device is characterized in that a first lifting assembly (16) and a push rod assembly are arranged on the side portion of the upright post (12), the first lifting assembly (16) is used for driving the push rod assembly to reciprocate in the vertical direction to reach the position of the wafer box (200), and the push rod assembly is used for pushing a wafer (100) into the wafer box (200) from the horizontal direction to finish wafer (100) arranging.

2. The transfer system for a vertical furnace according to claim 1, wherein the pusher assembly comprises a first driving assembly (18) and a pusher (19) for pushing the wafer (100), the first driving assembly (18) is connected with the first elevating assembly (16), and an output end of the first driving assembly (18) is connected with the pusher (19); the push rod (19) is driven by the first lifting assembly (16) to reciprocate along the vertical direction, and the push rod (19) is driven by the first driving assembly (18) to reciprocate along the horizontal direction.

3. The conveyor system for vertical furnaces as claimed in claim 1, characterized in that the base (14) is provided at the bottom with a second sensor (112), the second sensor (112) being used to detect the state of placement of the cassettes (200) on the base (14).

4. The conveyor system for vertical furnaces as claimed in claim 3, characterised in that the bottom of the floor (13) is provided with a buffer (113) and a second drive assembly (114), the output of the second drive assembly (114) being connected to the buffer (113); when the second sensor (112) detects that the film box (200) enters the base (14), the second driving component (114) drives the buffer (113) to push the film box (200) to enter a preset position of the base (14), and secondary positioning of the film box (200) in the base (14) is achieved.

5. The transfer system for vertical furnaces according to claim 1 characterized in that the side of the base plate (13) is provided with a first sensor (15), the first sensor (15) being used to detect the state of placement of the wafers (100) in the cassette (200).

6. The transfer system for vertical furnaces according to any one of claims 1 to 5, characterised in that the wafer transfer robot (2) comprises: the device comprises a mounting base (21), a rotating base (22), a rotating platform (23) and a moving platform; the tip and the rotating base (22) of mount pad (21) are connected, be equipped with rotary platform (23) on rotary base (22), be equipped with moving platform on rotary platform (23), moving platform is used for bearing wafer (100), rotary base (22) drive rotary platform (23) rotatory for realize wafer (100) reciprocating motion in the horizontal direction, get on the station of predetermineeing of completion wafer (100) spool box (200) and put.

7. The transfer system for a vertical furnace according to claim 6, wherein the moving platform comprises a first moving platform (24) and a second moving platform (25), the first moving platform (24) and the second moving platform (25) are respectively provided with a ceramic finger (26) for receiving the wafer (100), the first moving platform (24) is used for bearing a single wafer, and the second moving platform (25) is used for bearing a plurality of wafers.

8. The transfer system for vertical furnaces according to claim 6 wherein the wafer transfer robot (2) further comprises a second drive assembly (29) and a third drive assembly (210), the output of the second drive assembly (29) being connected to the first moving platform (24) and the output of the third drive assembly (210) being connected to the second moving platform (25); a first guide rail (231) and a second guide rail (232) are arranged at the top of the rotating platform (23); under the drive of the second driving assembly (29), the first moving platform (24) reciprocates along the first guide rail (231) to realize the pick-and-place of the single wafer (100); under the drive of the third driving assembly (210), the second moving platform (25) reciprocates along the second guide rail (232) to realize the picking and placing of the plurality of wafers (100).

9. The transfer system for vertical furnace according to claim 6, wherein said movable platform is provided with a third sensor (27) and a fourth sensor (28), said third sensor (27) is used for detecting whether the wafer (100) is on the movable platform and the wafer (100) overflows on the movable platform in the forward direction, and said fourth sensor (28) is used for detecting the wafer (100) overflows on the movable platform in the backward direction.

10. A control method of a conveyor system for a vertical furnace according to any one of claims 1 to 9, characterized by comprising the steps of:

s1, a wafer box (200) is placed on a base (14) of a transfer platform (1) by a wafer box conveying manipulator (3), and first positioning of the wafer box (200) in the base (14) is achieved;

s2, sending an in-place signal after the second sensor (112) detects that the film box (200) enters the base (14), and driving the buffer (113) to push the film box (200) to enter a preset position of the base (14) by the second driving assembly (114) to realize second positioning of the film box (200) in the base (14);

s3, detecting whether the wafer (100) overflows from the wafer box (200) by the first sensor (15);

s4, if no wafer (100) overflows from the wafer box (200), the first lifting assembly (16) drives the first driving assembly (18) and the push rod (19) to vertically lift so as to reach the position of the wafer (100), the first driving assembly (18) drives the push rod (19) to horizontally move, the wafer (100) is pushed to the preset position in the wafer box (200), and the wafer (100) is sorted;

s5, after the arrangement of the wafers is finished, the first driving assembly (18) drives the push rod (19) to retract to the original point, the first lifting assembly (16) drives the first driving assembly (18) and the push rod (19) to descend to the original point, and the wafer transfer manipulator (2) grabs the wafer (100) on the transfer platform (1);

s6, when the wafer is taken, the wafer conveying manipulator (2) rises to a first preset height, the rotating platform (23) rotates to a preset angle, and the moving platform moves the ceramic finger (26) to be under the wafer (100) to be grabbed;

s7, the wafer transmission manipulator (2) continuously rises to a second preset height to enable the ceramic finger (26) to be in contact with the wafer (100), the third sensor (27) detects whether a wafer (100) signal exists or not, if the wafer (100) signal exists, the wafer transmission manipulator (2) rises to a third preset height again to complete the lifting action of the ceramic finger (26) on the wafer (100);

s8, the moving platform retracts to the original point, the rotating platform (23) rotates to a preset workpiece placing station, the moving platform conveys the wafer (100) to the position right above the workpiece placing station, and the wafer conveying manipulator (2) descends to complete placement of the wafer (100).

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