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CN109163814B - Device for improving wavefront measurement and correction precision and using method thereof - Google Patents

Device for improving wavefront measurement and correction precision and using method thereof Download PDF

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Publication number
CN109163814B
CN109163814B CN201810734410.7A CN201810734410A CN109163814B CN 109163814 B CN109163814 B CN 109163814B CN 201810734410 A CN201810734410 A CN 201810734410A CN 109163814 B CN109163814 B CN 109163814B
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wavefront
deformable mirror
incident laser
correction
sampling
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CN109163814A (en
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薛峤
曾发
张晓璐
代万俊
田晓琳
梁樾
李森
宗兆玉
赵军普
邓武
张崑
龙蛟
张君
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Laser Fusion Research Center China Academy of Engineering Physics
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Laser Fusion Research Center China Academy of Engineering Physics
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J9/00Measuring optical phase difference; Determining degree of coherence; Measuring optical wavelength

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  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
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Abstract

The invention relates to a device for improving wavefront measurement and correction precision and a using method thereof, belonging to the technical field of laser system beam quality control, wherein the device comprises a wavefront sensor, a deformable mirror, a controller, a beam shrinking system, a beam splitter and a reflector, an incident laser beam to be corrected is transmitted to the deformable mirror through the beam splitter, the incident laser beam reflected back by the deformable mirror is divided into a sampling beam and an output beam through the beam splitter, the sampling beam is sequentially incident to the reflector, the beam shrinking system and the wavefront sensor, the invention adjusts the aperture of the sampling beam incident on the wavefront sensor by changing the beam shrinking ratio of the beam shrinking system to the sampling beam to obtain the wavefront distortion of a plurality of groups of sampling beams with different apertures, and uses the deformable mirror to carry out wavefront correction to obtain a plurality of groups of different wavefront correction voltages, and finally averages the wavefront distortion and the wavefront correction voltages, the accurate wavefront distortion and the accurate wavefront correction voltage of the incident laser beam are obtained, and the correction result is high in accuracy.

Description

Device for improving wavefront measurement and correction precision and using method thereof
Technical Field
The invention belongs to the technical field of laser system beam quality control, and particularly relates to a device for improving wavefront measurement and correction precision and a using method thereof.
Background
Wavefront distortion seriously affects laser beam quality, and wavefront Measurement and correction techniques based on Hartmann wavefront sensors are widely used in order to eliminate wavefront distortion (Modeling and Control of a deformable mirror, Journal of Dynamic Systems, Measurement, and Control, Vol.124,2002, 297-302). The traditional wavefront correction system comprises a set of deformable mirror, a high-voltage driver, a set of wavefront sensor and a set of control software, wherein the measurement and correction of wavefront distortion are completed according to an experimental result, and the high precision of the wavefront measurement and correction effect is difficult to guarantee.
Disclosure of Invention
Aiming at various defects in the prior art, in order to solve the problems, the inventor adds a beam reducing system in the original wavefront correction system, changes the beam reducing ratio of a light beam by adjusting the beam reducing system, thereby accurately changing the aperture of a sampling light beam incident on a wavefront sensor, the wavefront sensor measures a plurality of groups of sampling light beams with different apertures to correspondingly obtain a plurality of groups of wavefront distortions with different spatial distribution characteristics, then uses a deformable mirror to respectively carry out wavefront correction on each group of wavefront distortions to obtain a plurality of groups of different wavefront correction voltages, and finally averages wavefront distortion and wavefront correction voltage data to obtain high-precision wavefront measurement and correction results.
In order to achieve the purpose, the invention provides the following technical scheme:
a method of using an apparatus for improving the accuracy of wavefront measurement and correction, comprising the steps of:
s1: the deformable mirror does not apply correction voltage, the incident laser beam to be corrected is transmitted to the surface of the deformable mirror through the spectroscope, and the incident laser beam reflected back by the deformable mirror is divided into sampling beams after passing through the spectroscope;
s2: adjusting the focal length of the liquid lens to change the beam-shrinking ratio of the beam-shrinking system to the sampling beam, wherein the sampling beam is incident to the wavefront sensor through the beam-shrinking system to perform wavefront measurement to obtain wavefront distortion, and the measurement result is fed back to the controller and converted into a wavefront correction signal to obtain a wavefront correction voltage;
s3: under the premise of the same beam reduction ratio as that in the step S2, the deformable mirror applies a wavefront correction voltage, the deformable mirror performs wavefront correction on the incident laser beam, and the corrected incident laser beam is transmitted to the spectroscope, wherein a part of the incident laser beam is reflected to the wavefront sensor, and the other part of the incident laser beam is transmitted through the spectroscope and output;
s4: repeating S2-S3 under the condition that the incident laser beams are the same, wherein the beam-shrinking system presents different beam-shrinking ratios, and a plurality of groups of wavefront distortion and wavefront correction voltages are obtained;
s5: respectively averaging a plurality of groups of wavefront distortion and wavefront correction voltages in the step S4 to obtain accurate wavefront distortion and accurate wavefront correction voltage of the incident laser beam;
s6: applying the accurate wavefront correction voltage to the deformable mirror to perform wavefront correction;
wherein the device for improving the accuracy of the wavefront measurement and correction comprises a wavefront sensor, a deformable mirror and a controller, the wave-front sensor, the deformable mirror and the controller form a closed-loop system, and the wave-front sensor further comprises a beam-shrinking system, a spectroscope and a reflector, the spectroscope is obliquely arranged, the beam splitter and the deformable mirror are arranged on the same optical axis, an incident laser beam to be corrected is transmitted to the deformable mirror after passing through the beam splitter, the incident laser beam reflected back by the deformable mirror is divided into a sampling beam and an output beam after passing through the beam splitter, the reflector, the beam contracting system and the wavefront sensor are arranged on the same optical axis, the reflector and the spectroscope are arranged correspondingly, the sampling light beam is sequentially incident to the reflector, the beam-shrinking system and the wavefront sensor, the beam-reducing ratio of the beam-reducing system to the sampling light beam is adjustable, and the beam-reducing system sequentially comprises a lens and a liquid lens with variable focal length along the transmission direction of the sampling light beam;
the liquid lens is electrically connected with the first driver, the control voltage of the first driver is changed to adjust the focal length of the liquid lens, the deformable mirror is electrically connected with the second driver, the control voltage of the second driver is changed to adjust the surface shape of the deformable mirror, the wave front sensor is a Hartmann wave front sensor, and the controller is electrically connected with the wave front sensor and the deformable mirror respectively.
Further, in the step S1, the light field E (x, y) exp [ j φ (x, y) of the incident laser beam],(x,y)∈S0Where x and y represent two directions in a two-dimensional space, respectively, E (x, y) represents the amplitude of the incident laser beam, φ (x, y) represents the wavefront of the incident laser beam, S0Representing a light field region, j represents an imaginary number, and j2=-1。
Further, in step S2, the sub-aperture array of the wavefront sensor divides the sampled light beam to obtain a focal spot array corresponding to the sub-aperture array, and calculates to obtain wavefront distortion, where the light beam field measured by the wavefront sensor is E (x, y) exp [ j phi (x, y)],m1a0≤Q0x≤n1a0,m2b0≤Q0y≤n2b0Wherein Q is0Denotes the beam reduction ratio of the beam reduction system, a0And b0Respectively representing the length and width of a single sub-aperture, m1And n1Respectively expressing the number of sub-aperture sequences, m, corresponding to the length direction of the sampling beam2And n2Respectively representing the number of sub-aperture sequences corresponding to the width direction of the sampling beam.
Further, in step S4, the beam-reducing ratio of the beam-reducing system is adjusted, so that the wavefront sensor respectively performs wavefront measurement on a plurality of groups of sampling light beams with different apertures, and a light beam light field measured by the wavefront sensor is Ei(x,y)exp[jφi(x,y)],mia0≤Qix≤nia0,mjb0≤Qiy≤njb0Wherein i represents the i-th set of measurements, QiRepresents the reduction ratio, m, of the reduction systems in the i-th groupiAnd niRespectively representing the number of sub-aperture sequences, m, corresponding to the length direction of the sampling beamjAnd njSub-apertures respectively representing the width direction correspondence of the sampled beamNumber of radial sequences, phii(x, y) denotes the wave front of the i-th group of incident laser beams, Ei(x, y) represents the amplitude of the i-th group of incident laser beams.
The invention has the beneficial effects that:
compared with the traditional wavefront measurement and correction technology, the aperture of the sampling light beam incident on the wavefront sensor is changed by accurately controlling the focal length of the liquid lens, the wavefront distortion of a plurality of groups of sampling light beams with different apertures is obtained, the deformable mirror is used for performing wavefront correction respectively to obtain a plurality of groups of different wavefront correction voltages, the wavefront distortion and the wavefront correction voltages are averaged finally, the accurate wavefront distortion and the accurate wavefront correction voltages of the incident laser beam are obtained, and the correction result precision is high.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2(a) is a diagram of wavefront distortion measured by a wavefront sensor before correction at a beam reduction ratio of 5.35: 1;
FIG. 2(b) is a plot of corrected wavefront distortion measured by the wavefront sensor at a beam reduction ratio of 5.35: 1;
FIG. 3(a) is a diagram of wavefront distortion measured by a wavefront sensor before correction at a beam reduction ratio of 5.45: 1;
FIG. 3(b) is a plot of corrected wavefront distortion measured by the wavefront sensor at a beam reduction ratio of 5.45: 1;
FIG. 4(a) is a diagram of wavefront distortion measured by a wavefront sensor before correction at a beam reduction ratio of 5.55: 1;
FIG. 4(b) is a plot of corrected wavefront distortion measured by the wavefront sensor at a beam reduction ratio of 5.55: 1;
FIG. 5(a) is a diagram of wavefront distortion measured by a wavefront sensor before correction at a beam reduction ratio of 5.66: 1;
FIG. 5(b) is a plot of corrected wavefront distortion measured by the wavefront sensor at a beam reduction ratio of 5.66: 1;
FIG. 6(a) is a diagram of wavefront distortion measured by a wavefront sensor before correction at a beam reduction ratio of 5.76: 1;
FIG. 6(b) is a plot of corrected wavefront distortion measured by the wavefront sensor at a beam reduction ratio of 5.76: 1;
FIG. 7(a) is a diagram of wavefront distortion before application of a precise wavefront correction voltage;
fig. 7(b) is a wavefront distortion diagram after applying a precise wavefront correction voltage.
In the drawings: 1-incident laser beam, 2-wavefront sensor, 3-deformable mirror, 4-spectroscope, 5-reflector, 6-lens, 7-liquid lens, 8-sampling beam.
Detailed Description
In order to make the technical solutions of the present invention better understood, the following description of the technical solutions of the present invention with reference to the accompanying drawings of the present invention is made clearly and completely, and other similar embodiments obtained by a person of ordinary skill in the art without any creative effort based on the embodiments in the present application shall fall within the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.
The first embodiment is as follows:
as shown in fig. 1, a device for improving wavefront measurement and correction accuracy includes a wavefront sensor 2, a deformable mirror 3, a beam shrinking system, a beam splitter 4, a reflecting mirror 5 and a controller, wherein the wavefront sensor 2, the deformable mirror 3 and the controller form a closed loop system, the beam splitter 4 is obliquely arranged, the beam splitter 4 and the deformable mirror 3 are arranged on the same optical axis, after an incident laser beam 1 to be corrected passes through the beam splitter 4, most of the incident laser beam transmits to the deformable mirror 3, a small part of the incident laser beam is directly reflected and output, after the incident laser beam 1 reflected back by the deformable mirror 3 passes through the beam splitter 4 again, the incident laser beam 1 is divided into a sampling beam 8 and an output beam, and the sampling beam 8 sequentially enters the reflecting mirror 5, the beam shrinking system and the wavefront sensor 2. That is to say, the reflecting mirror 5, the beam contracting system and the wavefront sensor 2 are arranged on the same optical axis, and the reflecting mirror 5 and the spectroscope 4 are correspondingly arranged, so that the sampling light beam 8 can be incident to the reflecting mirror 5. In this embodiment, the included angle between the beam splitter 4 and the optical axis of the incident laser beam 1 is 45 °.
The beam-reducing system has adjustable beam-reducing ratio to the sampling light beam 8, and comprises a lens 6 and a liquid lens 7 with variable focal length in sequence along the transmission direction of the sampling light beam 8. The liquid lens 7 is electrically connected with a first driver, the control voltage of the first driver is changed to adjust the focal length of the liquid lens 7, the deformable mirror 3 is electrically connected with a second driver, and the control voltage of the second driver is changed to adjust the surface shape of the deformable mirror 3. The wavefront sensor 2 is preferably a Hartmann wavefront sensor, and the controller is respectively electrically connected with the wavefront sensor 2 and the deformable mirror 3.
The specific correction process is as follows:
firstly, the deformable mirror 3 does not apply the correction voltage, the incident laser beam 1 to be corrected is transmitted to the surface of the deformable mirror 3 through the spectroscope 4, the incident laser beam 1 reflected back by the deformable mirror 3 is divided into a sampling beam 8 through the spectroscope 4, the focal length of the liquid lens 7 is adjusted, so as to change the beam-shrinking ratio of the beam-shrinking system to the sampling beam 8, the sampling beam 8 is incident to the wavefront sensor 2 through the beam-shrinking system to perform wavefront measurement, so as to obtain wavefront distortion, the measurement result is fed back to the controller and converted into a wavefront correction signal, so as to obtain a wavefront correction voltage, under the premise of ensuring that the beam shrinkage ratio is not changed, the deformable mirror 3 applies wavefront correction voltage, the deformable mirror 3 performs wavefront correction on the incident laser beam 1, the corrected incident laser beam 1 is transmitted to the spectroscope 4, wherein, a part of the incident laser beam 1 is reflected to the wavefront sensor 2, and the other part of the incident laser beam 1 is transmitted through the spectroscope 4 and output.
The light field E (x, y) exp [ j φ (x, y) of the incident laser beam 1],(x,y)∈S0Where x and y represent two directions in a two-dimensional space, respectively, E (x, y) represents the amplitude of the incident laser beam 1, φ (x, y) represents the wavefront of the incident laser beam 1, S0Representing a light field region. The sub-aperture array of the wave-front sensor 2 divides the sampling light beam 8 to obtain a focal spot array corresponding to the sub-aperture array, wave-front distortion is obtained through calculation, and the light beam light field measured by the wave-front sensor 2 is E (x, y) exp [ j phi (x, y)],m1a0≤Q0x≤n1a0,m2b0≤Q0y≤n2b0Wherein Q is0Denotes the beam reduction ratio of the beam reduction system, a0And b0Respectively representing a single sub-apertureLength and width of the diameter, m1And n1Respectively expressing the number of sub-aperture sequences, m, corresponding to the length direction of the sampling beam 82And n2Respectively, the number of the sub-aperture sequences corresponding to the width direction of the sampling beam 8.
Then, under the condition that the incident laser beams are the same, the beam reduction ratio of the beam reduction system is adjusted, the beam reduction system presents different beam reduction ratios, so that the wavefront sensor 2 respectively performs wavefront measurement on a plurality of groups of sampling beams 8 with different apertures, and the light beam light field measured by the wavefront sensor 2 is as follows:
Ei(x,y)exp[jφi(x,y)],mia0≤Qix≤nia0,mjb0≤Qiy≤njb0wherein i represents the i-th set of measurements, QiRepresents the reduction ratio, m, of the reduction systems in the i-th groupiAnd niRespectively representing the number of sub-aperture sequences, m, corresponding to the length direction of the sampling beam 8jAnd njRespectively representing the number of sub-aperture sequences, phi, corresponding to the width direction of the sampling beam 8i(x, y) denotes the wave front of the i-th group of incident laser beams 1, Ei(x, y) represents the amplitude of the i-th group of incident laser beams 1.
And finally, averaging a plurality of groups of wavefront distortion and wavefront correction voltages respectively to obtain the accurate wavefront distortion and the accurate wavefront correction voltage of the incident laser beam 1, and applying the accurate wavefront correction voltage to the deformable mirror 3 for forward wavefront correction.
Example two:
parts of this embodiment that are the same as those of the first embodiment are not described again, except that:
the aperture of an incident laser beam 1 is 30 multiplied by 30mm, the wavelength is 1053nm, the aperture of a spectroscope 4 is 80 multiplied by 80mm, the reflectivity of laser light with the wavelength of 1053nm is 1%, a deformable mirror 3 is a piezoelectric film driven wavefront corrector, parameters are shown in table 1, the aperture of a reflector 5 is 80 multiplied by 80mm, the reflectivity of laser light with the wavelength of 1053nm is 99.95%, the aperture of a lens 6 is 50 multiplied by 50mm, the focal length is 60cm, the aperture of a liquid lens 7 with variable focal length is 9 multiplied by 9mm, the focal length can be continuously changed from 5cm to infinity by controlling voltage, a wavefront sensor 2 is a Hartmann wavefront sensor, and parameters are shown in table 2.
Table 1: main technical parameters of wave-front corrector
Effective caliber 30mm×30mm
Driver number and layout 5X 5 Square
Minimum closed loop bandwidth 1hz
Actuator stroke 10μm
Correctable Zernike aberration orders Less than or equal to 10 steps
Surface reflectivity ≥99.95%@1053nm
Table 2: main technical parameters of wave-front sensor
The specific correction process is as follows:
according to the technical parameters of the wavefront sensor, the sub-aperture size is 0.3mm × 0.3mm, so when the beam-reducing ratio of the beam-reducing system is adjusted, the reduced light beam should correspond to an integer number of sub-apertures as much as possible.
1. The focal length of the liquid lens 7 is adjusted to be 11.2cm, and at the moment, the liquid lens 7 and the lens 6 realize a beam reduction ratio of 5.35:1, and the aperture of the incident laser beam 1 is changed from 30mm to 5.6 mm. The wavefront distortion measured by the Hartmann wavefront sensor is shown in FIG. 2(a), and the value of the wavefront distortion pv is 1.6 μm. This aberration is corrected in a closed loop by the deformable mirror 3, and the corrected wavefront distortion is shown in fig. 2(b), and the value of the wavefront distortion pv is 0.57 μm.
2. The focal length of the liquid lens 7 is adjusted to be 11cm, and at the moment, the liquid lens 7 and the lens 6 realize a beam reduction ratio of 5.45:1, so that the aperture of an incident beam is changed from 30mm to 5.5 mm. The wavefront distortion measured by the Hartmann wavefront sensor is shown in FIG. 3(a), and the value of the wavefront distortion pv is 2.02 μm. This aberration is corrected in a closed loop by the deformable mirror 3, and the corrected wavefront distortion has a wavefront distortion pv value of 0.84 μm as shown in fig. 3 (b).
3. The focal length of the liquid lens 7 is adjusted to be 10.8cm, and at the moment, the liquid lens 7 and the lens 6 realize a beam reduction ratio of 5.55:1, so that the aperture of an incident beam is changed from 30mm to 5.4 mm. The wavefront distortion measured by the Hartmann wavefront sensor is shown in FIG. 4(a), and the value of the wavefront distortion pv is 2.42 μm. This aberration is corrected in a closed loop by the deformable mirror 3, and the corrected wavefront distortion is shown in fig. 4(b), and the value of the wavefront distortion pv is 1.18 μm.
4. The focal length of the liquid lens 7 is adjusted to be 10.6cm, and at the moment, the liquid lens 7 and the lens 6 realize a beam reduction ratio of 5.66:1, so that the aperture of an incident beam is changed from 30mm to 5.3 mm. The wavefront distortion measured by the Hartmann wavefront sensor is shown in FIG. 5(a), and the value of the wavefront distortion pv is 2.81 μm. This aberration is corrected in a closed loop by the deformable mirror 3, and the corrected wavefront distortion is 1.31 μm in value of the wavefront distortion pv as shown in fig. 5 (b).
5. The focal length of the liquid lens 7 is adjusted to be 10.4cm, and at the moment, the liquid lens 7 and the lens 6 realize a beam reduction ratio of 5.76:1, so that the aperture of an incident beam is changed from 30mm to 5.2 mm. The wavefront distortion measured by the Hartmann wavefront sensor is shown in FIG. 6(a), and the value of the wavefront distortion pv is 3.16 μm. This aberration is corrected in a closed loop by the deformable mirror 3, and the corrected wavefront distortion is 1.4 μm in value of the wavefront distortion pv as shown in fig. 6 (b).
As described above, by changing the focal length of the liquid lens 7, the size of the beam incident on the hartmann wavefront sensor after beam reduction is changed, and then wavefront distortion is measured and corrected in a closed loop manner to obtain five sets of experimental results. Finally, averaging the five sets of experimental results including wavefront distortion data and wavefront correction voltage data yields more accurate experimental data than conventional methods. Meanwhile, the wavefront distortion measured by the Hartmann wavefront sensor is as shown in FIG. 7(a), and the value of the wavefront distortion pv is 2.36 μm. The wavefront correction is performed by applying the precise wavefront correction voltage to the distorting mirror 3, and the corrected wavefront distortion is shown in fig. 7(b), and the value of the wavefront distortion pv is 1.04 μm.
The present invention has been described in detail, and it should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

Claims (4)

1. A method of using an apparatus for improving the accuracy of wavefront measurement and correction, comprising the steps of:
s1: the deformable mirror does not apply correction voltage, the incident laser beam to be corrected is transmitted to the surface of the deformable mirror through the spectroscope, and the incident laser beam reflected back by the deformable mirror is divided into sampling beams after passing through the spectroscope;
s2: adjusting the focal length of the liquid lens to change the beam-shrinking ratio of the beam-shrinking system to the sampling beam, wherein the sampling beam is incident to the wavefront sensor through the beam-shrinking system to perform wavefront measurement to obtain wavefront distortion, and the measurement result is fed back to the controller and converted into a wavefront correction signal to obtain a wavefront correction voltage;
s3: under the premise of the same beam reduction ratio as that in the step S2, the deformable mirror applies a wavefront correction voltage, the deformable mirror performs wavefront correction on the incident laser beam, and the corrected incident laser beam is transmitted to the spectroscope, wherein a part of the incident laser beam is reflected to the wavefront sensor, and the other part of the incident laser beam is transmitted through the spectroscope and output;
s4: repeating S2-S3 under the condition that the incident laser beams are the same, wherein the beam-shrinking system presents different beam-shrinking ratios, and a plurality of groups of wavefront distortion and wavefront correction voltages are obtained;
s5: respectively averaging a plurality of groups of wavefront distortion and wavefront correction voltages in the step S4 to obtain accurate wavefront distortion and accurate wavefront correction voltage of the incident laser beam;
s6: applying the accurate wavefront correction voltage to the deformable mirror to perform wavefront correction;
wherein the device for improving the accuracy of the wavefront measurement and correction comprises a wavefront sensor, a deformable mirror and a controller, the wave-front sensor, the deformable mirror and the controller form a closed-loop system, and the wave-front sensor further comprises a beam-shrinking system, a spectroscope and a reflector, the spectroscope is obliquely arranged, the beam splitter and the deformable mirror are arranged on the same optical axis, an incident laser beam to be corrected is transmitted to the deformable mirror after passing through the beam splitter, the incident laser beam reflected back by the deformable mirror is divided into a sampling beam and an output beam after passing through the beam splitter, the reflector, the beam contracting system and the wavefront sensor are arranged on the same optical axis, the reflector and the spectroscope are arranged correspondingly, the sampling light beam is sequentially incident to the reflector, the beam-shrinking system and the wavefront sensor, the beam-reducing ratio of the beam-reducing system to the sampling light beam is adjustable, and the beam-reducing system sequentially comprises a lens and a liquid lens with variable focal length along the transmission direction of the sampling light beam;
the liquid lens is electrically connected with the first driver, the control voltage of the first driver is changed to adjust the focal length of the liquid lens, the deformable mirror is electrically connected with the second driver, the control voltage of the second driver is changed to adjust the surface shape of the deformable mirror, the wave front sensor is a Hartmann wave front sensor, and the controller is electrically connected with the wave front sensor and the deformable mirror respectively.
2. The method of using an apparatus for improving the accuracy of wavefront measurement and correction according to claim 1, wherein in step S1, the light field E (x, y) exp [ j φ (x, y) of the incident laser beam],(x,y)∈S0Where x and y represent two directions in a two-dimensional space, respectively, E (x, y) represents the amplitude of the incident laser beam, φ (x, y) represents the wavefront of the incident laser beam, S0Representing a light field region, j represents an imaginary number, and j2=-1。
3. The method of using the apparatus for improving wavefront measurement and correction accuracy of claim 2, wherein in step S2, the sub-aperture array of the wavefront sensor divides the sampled light beam to obtain the focal spot array corresponding to the sub-aperture array, and calculates to obtain the wavefront distortion, and the light field of the light beam measured by the wavefront sensor is E (x, y) exp [ j Φ (x, y)],m1a0≤Q0x≤n1a0,m2b0≤Q0y≤n2b0Wherein Q is0Denotes the beam reduction ratio of the beam reduction system, a0And b0Respectively representing the length and width of a single sub-aperture, m1And n1Respectively expressing the number of sub-aperture sequences, m, corresponding to the length direction of the sampling beam2And n2Respectively representing the number of sub-aperture sequences corresponding to the width direction of the sampling beam.
4. The method as claimed in claim 3, wherein in step S4, the beam reduction ratio of the beam reduction system is adjusted so that the wavefront sensor performs wavefront measurement on several groups of sampling beams with different apertures, respectively, and the light field of the beam measured by the wavefront sensor is Ei(x,y)exp[jφi(x,y)],mia0≤Qix≤nia0,mjb0≤Qiy≤njb0Wherein i represents the i-th set of measurements, QiRepresents the reduction ratio, m, of the reduction systems in the i-th groupiAnd niRespectively representing the number of sub-aperture sequences, m, corresponding to the length direction of the sampling beamjAnd njRespectively representing the number of sub-aperture sequences, phi, corresponding to the width direction of the sampled beami(x, y) denotes the wave front of the i-th group of incident laser beams, Ei(x, y) tableShowing the amplitude of the i-th set of incident laser beams.
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