CN109143783B - 与外涂布光致抗蚀剂一起使用的涂料组合物 - Google Patents
与外涂布光致抗蚀剂一起使用的涂料组合物 Download PDFInfo
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- CN109143783B CN109143783B CN201810563354.5A CN201810563354A CN109143783B CN 109143783 B CN109143783 B CN 109143783B CN 201810563354 A CN201810563354 A CN 201810563354A CN 109143783 B CN109143783 B CN 109143783B
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 77
- 239000008199 coating composition Substances 0.000 title claims abstract description 44
- 239000000203 mixture Substances 0.000 claims abstract description 69
- ISAKRJDGNUQOIC-UHFFFAOYSA-N Uracil Chemical group O=C1C=CNC(=O)N1 ISAKRJDGNUQOIC-UHFFFAOYSA-N 0.000 claims abstract description 24
- 125000001142 dicarboxylic acid group Chemical group 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims description 47
- 239000011347 resin Substances 0.000 claims description 47
- 229920000642 polymer Polymers 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 26
- 239000011248 coating agent Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 14
- 239000003153 chemical reaction reagent Substances 0.000 claims description 11
- 230000003667 anti-reflective effect Effects 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 8
- 229910052736 halogen Inorganic materials 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000004971 Cross linker Substances 0.000 claims description 5
- 125000004429 atom Chemical group 0.000 claims description 5
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims description 4
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 229940035893 uracil Drugs 0.000 claims description 3
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 239000006117 anti-reflective coating Substances 0.000 abstract description 7
- 239000002253 acid Substances 0.000 description 39
- 239000000178 monomer Substances 0.000 description 35
- 125000000217 alkyl group Chemical group 0.000 description 28
- 239000002904 solvent Substances 0.000 description 19
- 230000005855 radiation Effects 0.000 description 18
- 125000003118 aryl group Chemical group 0.000 description 17
- 229910052739 hydrogen Inorganic materials 0.000 description 17
- 239000000243 solution Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 16
- -1 -OH Chemical group 0.000 description 13
- 150000002148 esters Chemical class 0.000 description 13
- 229910052731 fluorine Inorganic materials 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 10
- 239000011541 reaction mixture Substances 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 150000001412 amines Chemical class 0.000 description 8
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 8
- 238000011161 development Methods 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 150000002596 lactones Chemical class 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 229910052717 sulfur Inorganic materials 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 7
- 239000003431 cross linking reagent Substances 0.000 description 7
- 125000004404 heteroalkyl group Chemical group 0.000 description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 7
- 125000002733 (C1-C6) fluoroalkyl group Chemical group 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 6
- 230000003213 activating effect Effects 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 125000000753 cycloalkyl group Chemical group 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 125000005842 heteroatom Chemical group 0.000 description 6
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 6
- 125000002950 monocyclic group Chemical group 0.000 description 6
- KJIFKLIQANRMOU-UHFFFAOYSA-N oxidanium;4-methylbenzenesulfonate Chemical compound O.CC1=CC=C(S(O)(=O)=O)C=C1 KJIFKLIQANRMOU-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 150000002367 halogens Chemical group 0.000 description 5
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 125000005233 alkylalcohol group Chemical group 0.000 description 4
- 150000007942 carboxylates Chemical group 0.000 description 4
- 150000001768 cations Chemical class 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 4
- 125000003367 polycyclic group Chemical group 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- 239000003981 vehicle Substances 0.000 description 4
- 125000006651 (C3-C20) cycloalkyl group Chemical group 0.000 description 3
- XGQJGMGAMHFMAO-UHFFFAOYSA-N 1,3,4,6-tetrakis(methoxymethyl)-3a,6a-dihydroimidazo[4,5-d]imidazole-2,5-dione Chemical compound COCN1C(=O)N(COC)C2C1N(COC)C(=O)N2COC XGQJGMGAMHFMAO-UHFFFAOYSA-N 0.000 description 3
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 3
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920003270 Cymel® Polymers 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 3
- 150000003973 alkyl amines Chemical class 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000000732 arylene group Chemical group 0.000 description 3
- 125000002619 bicyclic group Chemical group 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 3
- 239000004202 carbamide Substances 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000012043 crude product Substances 0.000 description 3
- 238000010511 deprotection reaction Methods 0.000 description 3
- 238000010790 dilution Methods 0.000 description 3
- 239000012895 dilution Substances 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- VPVSTMAPERLKKM-UHFFFAOYSA-N glycoluril Chemical compound N1C(=O)NC2NC(=O)NC21 VPVSTMAPERLKKM-UHFFFAOYSA-N 0.000 description 3
- 125000001072 heteroaryl group Chemical group 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000000671 immersion lithography Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000006413 ring segment Chemical group 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 125000004641 (C1-C12) haloalkyl group Chemical group 0.000 description 2
- 125000005913 (C3-C6) cycloalkyl group Chemical group 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 2
- BWZVCCNYKMEVEX-UHFFFAOYSA-N 2,4,6-Trimethylpyridine Chemical compound CC1=CC(C)=NC(C)=C1 BWZVCCNYKMEVEX-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- QDFXRVAOBHEBGJ-UHFFFAOYSA-N 3-(cyclononen-1-yl)-4,5,6,7,8,9-hexahydro-1h-diazonine Chemical compound C1CCCCCCC=C1C1=NNCCCCCC1 QDFXRVAOBHEBGJ-UHFFFAOYSA-N 0.000 description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 2
- HENCHDCLZDQGIQ-UHFFFAOYSA-N 3-[3,5-bis(2-carboxyethyl)-2,4,6-trioxo-1,3,5-triazinan-1-yl]propanoic acid Chemical compound OC(=O)CCN1C(=O)N(CCC(O)=O)C(=O)N(CCC(O)=O)C1=O HENCHDCLZDQGIQ-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 2
- XYVQFUJDGOBPQI-UHFFFAOYSA-N Methyl-2-hydoxyisobutyric acid Chemical compound COC(=O)C(C)(C)O XYVQFUJDGOBPQI-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000003282 alkyl amino group Chemical group 0.000 description 2
- 125000005157 alkyl carboxy group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- GDCXBZMWKSBSJG-UHFFFAOYSA-N azane;4-methylbenzenesulfonic acid Chemical compound [NH4+].CC1=CC=C(S([O-])(=O)=O)C=C1 GDCXBZMWKSBSJG-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- FLJPGEWQYJVDPF-UHFFFAOYSA-L caesium sulfate Chemical compound [Cs+].[Cs+].[O-]S([O-])(=O)=O FLJPGEWQYJVDPF-UHFFFAOYSA-L 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 125000002993 cycloalkylene group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 125000002541 furyl group Chemical group 0.000 description 2
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 2
- 125000000592 heterocycloalkyl group Chemical group 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- 239000012454 non-polar solvent Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 235000013772 propylene glycol Nutrition 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 150000004072 triols Chemical class 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- MCJPJAJHPRCILL-UHFFFAOYSA-N (2,6-dinitrophenyl)methyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OCC1=C([N+]([O-])=O)C=CC=C1[N+]([O-])=O MCJPJAJHPRCILL-UHFFFAOYSA-N 0.000 description 1
- MSLTZKLJPHUCPU-WNQIDUERSA-M (2s)-2-hydroxypropanoate;tetrabutylazanium Chemical compound C[C@H](O)C([O-])=O.CCCC[N+](CCCC)(CCCC)CCCC MSLTZKLJPHUCPU-WNQIDUERSA-M 0.000 description 1
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- 125000006570 (C5-C6) heteroaryl group Chemical group 0.000 description 1
- 125000006582 (C5-C6) heterocycloalkyl group Chemical group 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- VPVXHAANQNHFSF-UHFFFAOYSA-N 1,4-dioxan-2-one Chemical group O=C1COCCO1 VPVXHAANQNHFSF-UHFFFAOYSA-N 0.000 description 1
- GYQQFWWMZYBCIB-UHFFFAOYSA-N 1-[diazo-(4-methylphenyl)sulfonylmethyl]sulfonyl-4-methylbenzene Chemical compound C1=CC(C)=CC=C1S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)C1=CC=C(C)C=C1 GYQQFWWMZYBCIB-UHFFFAOYSA-N 0.000 description 1
- HMNZROFMBSUMAB-UHFFFAOYSA-N 1-ethoxybutan-1-ol Chemical compound CCCC(O)OCC HMNZROFMBSUMAB-UHFFFAOYSA-N 0.000 description 1
- JLBXCKSMESLGTJ-UHFFFAOYSA-N 1-ethoxypropan-1-ol Chemical compound CCOC(O)CC JLBXCKSMESLGTJ-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- FFKFRQVYUILJCW-UHFFFAOYSA-N 1-hydroxypyrrolidine-2,5-dione;methanesulfonic acid Chemical compound CS(O)(=O)=O.ON1C(=O)CCC1=O FFKFRQVYUILJCW-UHFFFAOYSA-N 0.000 description 1
- QPAWHGVDCJWYRJ-UHFFFAOYSA-N 1-hydroxypyrrolidine-2,5-dione;trifluoromethanesulfonic acid Chemical compound ON1C(=O)CCC1=O.OS(=O)(=O)C(F)(F)F QPAWHGVDCJWYRJ-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- QMBSJPZHUJCMJU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)propanoic acid Chemical compound CCOCCOC(C)C(O)=O QMBSJPZHUJCMJU-UHFFFAOYSA-N 0.000 description 1
- JIXHYWCLUOGIMM-UHFFFAOYSA-N 2-(2-methoxyethoxy)propanoic acid Chemical compound COCCOC(C)C(O)=O JIXHYWCLUOGIMM-UHFFFAOYSA-N 0.000 description 1
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 1
- FVNIIPIYHHEXQA-UHFFFAOYSA-N 2-(4-methoxynaphthalen-1-yl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C12=CC=CC=C2C(OC)=CC=C1C1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 FVNIIPIYHHEXQA-UHFFFAOYSA-N 0.000 description 1
- QRHHZFRCJDAUNA-UHFFFAOYSA-N 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C1=CC(OC)=CC=C1C1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 QRHHZFRCJDAUNA-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- XLLXMBCBJGATSP-UHFFFAOYSA-N 2-phenylethenol Chemical compound OC=CC1=CC=CC=C1 XLLXMBCBJGATSP-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- QQWWKHJWGCWUKU-UHFFFAOYSA-N 4-[2-(2,4-dinitrophenyl)ethyl]benzenesulfonic acid Chemical compound C1=CC(S(=O)(=O)O)=CC=C1CCC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O QQWWKHJWGCWUKU-UHFFFAOYSA-N 0.000 description 1
- HYKBUMWQWWRXJN-UHFFFAOYSA-N 4-[2-(2-nitrophenyl)ethyl]benzenesulfonic acid Chemical compound C1=CC(S(=O)(=O)O)=CC=C1CCC1=CC=CC=C1[N+]([O-])=O HYKBUMWQWWRXJN-UHFFFAOYSA-N 0.000 description 1
- NFGPNZVXBBBZNF-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(N)C=C1 NFGPNZVXBBBZNF-UHFFFAOYSA-N 0.000 description 1
- MMVUZMIOJNPDME-UHFFFAOYSA-N 4-methylbenzenesulfonate;triethylazanium Chemical compound CC[NH+](CC)CC.CC1=CC=C(S([O-])(=O)=O)C=C1 MMVUZMIOJNPDME-UHFFFAOYSA-N 0.000 description 1
- TUARVSWVPPVUGS-UHFFFAOYSA-N 5-nitrouracil Chemical compound [O-][N+](=O)C1=CNC(=O)NC1=O TUARVSWVPPVUGS-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 125000004648 C2-C8 alkenyl group Chemical group 0.000 description 1
- 241000254173 Coleoptera Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YXHKONLOYHBTNS-UHFFFAOYSA-N Diazomethane Chemical class C=[N+]=[N-] YXHKONLOYHBTNS-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical group O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- YPPVLYIFEAESGO-UHFFFAOYSA-N [2,3-bis(methylsulfonyloxy)phenyl] methanesulfonate Chemical compound CS(=O)(=O)OC1=CC=CC(OS(C)(=O)=O)=C1OS(C)(=O)=O YPPVLYIFEAESGO-UHFFFAOYSA-N 0.000 description 1
- OIHCCWXZFYNOJS-UHFFFAOYSA-N [2,3-bis-(4-methylphenyl)sulfonyloxyphenyl] 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OC1=CC=CC(OS(=O)(=O)C=2C=CC(C)=CC=2)=C1OS(=O)(=O)C1=CC=C(C)C=C1 OIHCCWXZFYNOJS-UHFFFAOYSA-N 0.000 description 1
- HKKMPPDCCCBZHM-UHFFFAOYSA-M [4-[(2-methylpropan-2-yl)oxy]phenyl]-diphenylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(OC(C)(C)C)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 HKKMPPDCCCBZHM-UHFFFAOYSA-M 0.000 description 1
- QFKJMDYQKVPGNM-UHFFFAOYSA-N [benzenesulfonyl(diazo)methyl]sulfonylbenzene Chemical compound C=1C=CC=CC=1S(=O)(=O)C(=[N+]=[N-])S(=O)(=O)C1=CC=CC=C1 QFKJMDYQKVPGNM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000002015 acyclic group Chemical group 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000005210 alkyl ammonium group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000004644 alkyl sulfinyl group Chemical group 0.000 description 1
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 1
- 125000004414 alkyl thio group Chemical group 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000001450 anions Chemical group 0.000 description 1
- 150000001454 anthracenes Chemical class 0.000 description 1
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 238000007080 aromatic substitution reaction Methods 0.000 description 1
- 125000003785 benzimidazolyl group Chemical group N1=C(NC2=C1C=CC=C2)* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000000994 contrast dye Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000006575 electron-withdrawing group Chemical group 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- MJEMIOXXNCZZFK-UHFFFAOYSA-N ethylone Chemical compound CCNC(C)C(=O)C1=CC=C2OCOC2=C1 MJEMIOXXNCZZFK-UHFFFAOYSA-N 0.000 description 1
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000001046 glycoluril group Chemical group [H]C12N(*)C(=O)N(*)C1([H])N(*)C(=O)N2* 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- NUKZAGXMHTUAFE-UHFFFAOYSA-N hexanoic acid methyl ester Natural products CCCCCC(=O)OC NUKZAGXMHTUAFE-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 125000002883 imidazolyl group Chemical group 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 125000001041 indolyl group Chemical group 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000002101 nanobubble Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 125000006502 nitrobenzyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 125000000714 pyrimidinyl group Chemical group 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 125000002943 quinolinyl group Chemical group N1=C(C=CC2=CC=CC=C12)* 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
- 125000000335 thiazolyl group Chemical group 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- TUODWSVQODNTSU-UHFFFAOYSA-M trifluoromethanesulfonate;tris[4-[(2-methylpropan-2-yl)oxy]phenyl]sulfanium Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(OC(C)(C)C)=CC=C1[S+](C=1C=CC(OC(C)(C)C)=CC=1)C1=CC=C(OC(C)(C)C)C=C1 TUODWSVQODNTSU-UHFFFAOYSA-M 0.000 description 1
- 125000005951 trifluoromethanesulfonyloxy group Chemical group 0.000 description 1
- GBXQPDCOMJJCMJ-UHFFFAOYSA-M trimethyl-[6-(trimethylazaniumyl)hexyl]azanium;bromide Chemical compound [Br-].C[N+](C)(C)CCCCCC[N+](C)(C)C GBXQPDCOMJJCMJ-UHFFFAOYSA-M 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/09—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture
- C08G18/092—Processes comprising oligomerisation of isocyanates or isothiocyanates involving reaction of a part of the isocyanate or isothiocyanate groups with each other in the reaction mixture oligomerisation to isocyanurate groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/16—Catalysts
- C08G18/166—Catalysts not provided for in the groups C08G18/18 - C08G18/26
- C08G18/168—Organic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3203—Polyhydroxy compounds
- C08G18/3206—Polyhydroxy compounds aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
- C08G18/78—Nitrogen
- C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
- C08G18/791—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups
- C08G18/792—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing isocyanurate groups formed by oligomerisation of aliphatic and/or cycloaliphatic isocyanates or isothiocyanates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09D201/025—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
- C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
- C09D201/08—Carboxyl groups
-
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Abstract
在优选的方面,提供了有机涂料组合物,特别是与外涂光致抗蚀剂一起使用的抗反射涂料组合物,其包含1)一个或多个经取代尿嘧啶部分;和2)一个或多个反应的二羧酸基团。
Description
技术领域
本发明涉及用于微电子应用的组合物,并且确切地说,抗反射涂料组合物。本发明的优选组合物包含具有一个或多个经取代尿嘧啶部分和一个或多个反应的脂肪族二羧酸基团的树脂。本发明的优选组合物与外涂布光致抗蚀剂组合物一起使用并且可称为底部抗反射组合物或“BARC”。
背景技术
光致抗蚀剂是用于将图像转移到衬底的感光膜。在衬底上形成光致抗蚀剂涂层并且随后通过光掩模使光致抗蚀剂层暴露于活化辐射源。在暴露之后,使光致抗蚀剂显影,从而得到允许衬底的选择性加工的浮雕图像。
用于暴露光致抗蚀剂的活化辐射的反射通常对光致抗蚀剂层中图案化的图像的分辨率造成限制。来自衬底/光致抗蚀剂界面的辐射的反射可产生光致抗蚀剂中的辐射强度的空间变化,导致显影时的非均一光致抗蚀剂线宽。辐射还可从衬底/光致抗蚀剂界面散射到光致抗蚀剂的不预期暴露的区域中,再次导致线宽变化。
用于减少反射辐射问题的一种方法为使用插入在衬底表面与光致抗蚀剂涂层之间的辐射吸收层。参见US 20030004901;76915556;US 2006057501;US 2011/0033801;JP05613950B2;JP05320624B2;以及KR1270508B1。
对于许多高性能光刻应用,利用特定抗反射组合物以提供所需性能特性,如最优吸收特性和涂布特征。参见例如上文所提到的专利文献。尽管如此,电子装置制造商不断地寻求抗反射涂层上方图案化的光致抗蚀剂图像的增加的分辨率并且转而需要抗反射组合物的不断增加的性能。
为了获得更高的分辨率,蚀刻底部抗反射涂层(BARC)所需的时间减少了。减少蚀刻时间可以使成像抗蚀剂层的损伤最小化,从而提高分辨率。下层组合物层相对于光致抗蚀剂层的蚀刻速率可以确定在干法蚀刻步骤期间有多少抗蚀剂损失。芯片制造商日益要求快速蚀刻BARC。
因此将期望具有与外涂布光致抗蚀剂一起使用的新颖抗反射组合物。将尤其期望具有展现增强的性能且可提供图案化到外涂布光致抗蚀剂中的图像的增加的分辨率的新颖抗反射组合物。在其它性能中,表现出快干蚀刻速率的下层涂料组合物将是非常需要的。
发明内容
我们现在提供新的下层涂料组合物,其包含一种或多种树脂,所述树脂包含1)一个或多个经取代尿嘧啶部分;和2)一个或多个反应的二酸基团。如本文所提及的,二酸基团在与其它材料反应以形成树脂之前将具有两个羧基(-COOH)部分。
在某些优选的方面,涂料组合物树脂可以进一步包含3)一个或多个经取代异氰脲酸酯部分。
我们发现,本发明的优选涂料组合物可以在抗蚀剂等离子体蚀刻剂中表现出快速的蚀刻速率。参见例如在之后的实例中阐述的结果。
组合物的树脂的优选尿嘧啶部分被电负性基团如硝基和卤素特别是氟取代。本发明组合物的树脂的优选的反应的二酸基团包括不具有芳香族取代的二酸基团(即脂肪族二酸基团)。
所述组合物的优选树脂具有相对高的Ohnishi参数值,如至少7,更优选7至14或8至12或9至12。如本文所提及的,Ohnishi参数值代表作为NT/(NC-NO)的函数的聚合物中的有效碳含量,其中NT是原子总数,NC是碳原子数,并且NO是氧原子的数量。
本发明的优选树脂包括基于树脂总重量包含尿嘧啶和反应的二羧酸组分的量为20至70重量%的那些树脂,甚至更优选其中尿嘧啶和反应的二羧酸组分的存在量基于树脂总重量为20或30至40、50或60重量%。
本发明优选的涂料组合物还可以包含单独的交联剂组分。这种交联剂可以与树脂组分反应,例如在组合物的涂层热处理过程中,在其上涂覆光致抗蚀剂层之前。优选的交联剂包括胺基材料,如甘脲材料。
在与外涂布光致抗蚀剂一起使用时,涂料组合物可涂覆于衬底上,如上面可具有一个或多个有机或无机涂层的半导体晶片。涂覆的涂层可任选地在用光致抗蚀剂层外涂布之前经热处理。如所提及,此类热处理可引起涂料组合物层的硬化,包括交联。此类交联可包括硬化和/或一种或多种组合物组分之间的共价键形成反应且可调节涂料组合物层的水接触角。
此后,光致抗蚀剂组合物可涂覆于涂料组合物层上方,接着通过图案化活化辐射对涂覆的光致抗蚀剂组合物层成像并且成像的光致抗蚀剂组合物层经显影,得到光致抗蚀剂浮雕图像。
多种光致抗蚀剂可与本发明的涂料组合物组合使用(即外涂布)。与本发明的下层涂料组合物一起使用的优选光致抗蚀剂为化学放大抗蚀剂,其含有一种或多种光敏化合物和含有在存在光生酸的情况下经历解块或裂解反应的单元的树脂组分。
本发明进一步提供形成光致抗蚀剂浮雕图像和包含涂布有单独或与光致抗蚀剂组合物组合的本发明的涂料组合物的衬底(如微电子晶片衬底)的新颖制品的方法。
本发明的其它方面论述于下文中。
附图说明
图1是显示本发明实例1-4的蚀刻结果评估的图。
具体实施方式
如所讨论的,我们现在提供新的下层涂料组合物,其包含一种或多种树脂,所述树脂包含1)一个或多个经取代尿嘧啶部分(例如下式(I));和2)一个或多个反应的二酸基团(例如下式(III))。在某些优选的方面,涂料组合物树脂可以进一步包含3)一个或多个经取代异氰脲酸酯部分(例如下式(II))。如所讨论的,二酸基团在与其它材料反应形成树脂之前将具有两个羧基(-COOH)部分。优选的二酸基团可以含有额外的氧含量,如一个或多个醚键(适当地1、2或3个醚键)和一个或多个羟基(适当地1、2或3个羟基)。在某些方面,优选的二酸基团不含任何芳族部分。在某些另外的方面,优选的二酸基团不含有任何碳-碳不饱和键。
在一个方面,聚合物可以从包含具有下式经取代尿嘧啶部分的单体或树脂获得:
其中:
R1可为氢、-C(O)R、-C(O)OR、经取代或未经取代的C1-C12烷基(例如未经取代的C1-C12烷基和C1-C12卤烷基)、经取代或未经取代的2-5元杂烷基(例如经取代或未经取代的C1-C12烷基醇、经取代或未经取代的C1-C12烷基羧基、经取代或未经取代的C1-C12烷基酯、经取代或未经取代的C1-C12烷基胺或经取代或未经取代的C1-C12烷基醛)、经取代或未经取代的C3-C6环烷基、经取代或未经取代的5至6元杂环烷基、经取代或未经取代的苯基或经取代或未经取代的5至6元杂芳基;
R2可为氢、卤素、-NO2、-N3、-CN、-C(O)R、-C(O)OR、-C(O)H、-C(O)OH、-C(O)OCH3、-OH、-OCH3、-SO2R、-S(O2)OR、-NHR、-NHRR′、经取代或未经取代的C1-C12烷基(例如未经取代的C1-C12烷基及C1-C12卤烷基)、经取代或未经取代的2-12元杂烷基(例如经取代或未经取代的C1-C12烷基醇、经取代或未经取代的C1-C12烷基羧基、经取代或未经取代的C1-C12烷基酯、经取代或未经取代的C1-C12烷基胺或经取代或未经取代的C1-C12烷基醛)、经取代或未经取代的C3-C6环烷基、经取代或未经取代的5至8元杂环烷基、经取代或未经取代的5至12元芳基(例如苯基、蒽或萘基)、或经取代或未经取代的5至8元杂芳基;并且
R和R′可以独立地为氢或经取代或未经取代的C1-C3烷基、或经取代或未经取代的C1-C3杂烷基,如经取代或未经取代的C1-C3烷基醇、经取代或未经取代的C1-C12烷基羧基或经取代或未经取代的C1-C12烷基胺。
优选的R1包括C1-C4烷基羧酸或C1-C4烷基酯,其可以是支链或直链的并且任选经未取代的C1-C3烷基、未取代的C1-C3烷氧基或C1-C3卤烷基取代。优选的R2包括卤素、-NO2、-N3、-CN、-C(O)R、-C(O)OR、-C(O)H、-C(O)OH、-C(O)OCH3、-OH、-OCH3、-SO2R、-S(O2)OR。其它优选的R2可以包括吸电子基团,如卤素、-NO2、-N3或-CN。
示例性的经取代尿嘧啶部分可以包括:
在一个方面,聚合物可以从包含一个或多个具有式(II)的异氰脲酸酯部分的单体或树脂获得:
其中R1适合为氢或非氢取代基。优选的R1包括经取代或未经取代的C1-C4烷基醇、经取代或未经取代的C1-C4烷基羧基或经取代或未经取代的C1-C4烷基酯基,其可为支链或直链的并且任选经C1-C3烷基、未经取代的C1-C3烷氧基或C1-C3卤烷基取代。
示例性的经取代异氰脲酸酯单体可以包括:
在一个方面,聚合物可以从包含具有式(III)的二羧酸基团的单体或树脂获得,
其中:
n1和n2可以独立地为0至100的整数;
Q1可为独立的键、-O-、-S-、-NHR-或-CRR′-;
A1、A2、A3以及A4可以独立地为氢、脂肪族基团(例如C1-C12烷基)或经取代或未经取代的C1-C12杂烷基(例如C1-C12烷基醇);并且
本文描述了R和R′。
优选的Q1是键、-O-或-CRR′-,其中R和R′独立地为氢、C1-C4烷基或C1-C4烷基醇。优选的A1、A2、A3以及A4可以独立地为氢、直链或支链C1-C4烷基如甲基和乙基,或C1-C4烷基醇。优选的n1和n2独立地为0至30、0至10或0至5的整数。
示例性的脂肪族二羧酸基团可以包括:
示例性的优选聚合物可以包含以下结构:
如本文中所提及,适合的杂烷基包括任选经取代的C1-20烷氧基、优选地具有1至约20个碳原子的任选经取代的烷硫基;优选地1至约20个碳原子的任选经取代的烷基亚磺酰基;优选地具有1至约20个碳原子的任选经取代的烷基磺酰基;和优选地具有1至约20个碳原子的任选经取代的烷基胺。
还应理解,除非另有说明,否则术语“杂烷基”包括“杂脂环”基团。杂脂环基团是具有一个或多个杂(例如N、O或S)环原子的非芳香族环基团。优选的杂脂环基团具有5至20个环原子和1、2或3个N、O或S环原子。
术语“烷基”是指饱和脂肪族基的基团,包括直链烷基、支链烷基、环烷基(脂环族)、烷基取代的环烷基和环烷基取代的烷基。在优选的方面,直链或支链烷基在其主链中具有30个或更少的碳原子(例如非环状的C1-C30、支链的C3-C30)、优选26或更少、更优选20或更少、并且还更优选4或更少。
还应理解,除非另有说明,否则术语“烷基”包括“碳脂环”基团。
如本文中所提及,术语“碳脂环基”意味着非芳香族基的每一环成员都是碳。碳脂环基可具有一个或多个内环碳-碳双键,其限制条件是所述环不是芳香族环。术语任选经取代的“环烷基”意味着非芳香族基的每一环成员都是碳,并且碳环不具有任何内环碳-碳双键。举例来说,环己基、环戊基和金刚烷基是环烷基以及碳脂环基。碳脂环基团和环烷基可以包含一个环或多个(例如2、3、4或更多)桥连、稠合或其它共价连接的环。
如本文中所提及,“杂芳基”包括具有1-3个杂原子(如果单环)、1-6个杂原子(如果双环)或1-9个杂原子(如果三环)的芳香族5-8元单环、8-12元双环或11-14元三环环系统,所述杂原子选自O、N或S(例如碳原子和1-3、1-6或1-9个N、O或S杂原子,分别为如果单环、双环或三环),其中每一环的0、1、2、3或4个原子可以经取代基取代。杂芳基的实例包括呲啶基、呋喃基(furyl/furanyl)、咪唑基、苯并咪唑基、嘧啶基、苯硫基或噻吩基、喹啉基、吲哚基、噻唑基等。
“任选经取代的”各种材料和取代基(包括以上式(I)、(II)、(III)的基团R、R′、R1、R2、A1、A2、A3以及A4)可适当地在一个或多个可用位置经例如以下各者取代:卤素(F、Cl、Br、I);硝基;羟基;氨基;烷基,如C1-8烷基;烯基,如C2-8烯基;烷基氨基,如C1-8烷基氨基;碳环芳基,如苯基、萘基、蒽基;杂烷基等等。
多种树脂可充当下层涂料组合物的树脂组分。
本发明的涂料组合物的尤其优选的树脂可包含聚酯键。聚酯树脂可通过一种或多种多元醇试剂与一种或多种含羧基(如羧酸、酯、酸酐等)化合物的反应容易地制备。适合的多元醇试剂包括二醇、甘油和三醇,如二醇,如二醇为乙二醇、1,2-丙二醇、1,3-丙二醇、丁二醇、戊二醇、环丁基二醇、环戊基二醇、环己基二醇、二羟甲基环己烷,和三醇,如甘油、三羟甲基乙烷、三羟甲基丙烷等。
包含一个或多个经取代尿嘧啶部分和一个或多个二羧酸基团的树脂可以容易地制备。例如,含有所需基团的单体可以聚合。优选的合成阐述于以下实例中。
优选地,本发明的下层涂料组合物的树脂将具有约1,000至约10,000,000道尔顿,更通常约2,000至约10,000道尔顿的重量平均分子量(Mw)和约500至约1,000,000道尔顿的数目平均分子量(Mn)。本发明组合物的树脂的分子量(Mw或Mn)通过凝胶渗透色谱法适当地测定。
树脂组分将为许多优选实施例中的下层涂料组合物的主要固体组分。举例来说,一或树脂适当地可按涂料组合物的总固体含量计的50到99.9重量%,更通常按涂料组合物的总固体含量计的80或85到95、98或99+(或甚至100)重量%存在。如本文中所提及,涂料组合物的固体是指除了溶剂载体以外的涂料组合物的所有材料。
如上所述,在某些实施例中,除了具有经取代尿嘧啶部分和脂肪族二羧酸基团的树脂或其它材料之外,本发明的涂料组合物可以包含交联剂。举例来说,涂料组合物可包括胺基交联剂,如三聚氰胺材料,包括三聚氰胺树脂,如由Cytec Industries制造且以Cymel300、301、303、350、370、380、1116和1130的商品名销售;甘脲,包括购自Cytec Industries的那些甘脲;和基于苯并三聚氰胺和脲的材料,包括树脂,如以名称Cymel 1123和1125购自Cytec Industries的苯并三聚氰胺树脂和以Powderlink 1174和1196的名称购自CytecIndustries的脲树脂。除可商购以外,此类胺基树脂可例如通过丙烯酰胺或甲基丙烯酰胺共聚物与甲醛于含醇溶液中的反应,或者通过N-烷氧基甲基丙烯酰胺或甲基丙烯酰胺与其它适合单体的共聚制备。
含有i)一个或多个经取代尿嘧啶部分(例如式(I)),ii)一个或多个反应的二羧酸基团(例如式(III))和/或iii)一个或多个异氰脲酸酯部分(例如式(II))的本发明的涂料组合物的树脂通常以占涂料组合物总固体(除溶剂载体之外的所有组分)的约5至100重量%的量存在,更通常至少约20、30、40、50、60、70、80、90或100重量%的涂料组合物总固体(除溶剂载体之外的所有组分)。
优选的本发明的涂料组合物还可含有热酸产生剂化合物。通过热酸产生剂的活化的涂料组合物的热诱导交联一般为优选的。
用于涂料组合物的适合的热酸产生剂化合物包括离子或大体上中性的热酸产生剂,例如芳烃磺酸铵盐(例如甲苯磺酸铵盐),用于在抗反射组合物涂层的固化期间催化或促进交联。通常,一种或多种热酸产生剂以组合物的总干燥组分(除了溶剂载剂的所有组分)的约0.1至10重量%,更优选地总干燥组分的约0.5至2重量%的浓度存在于涂料组合物中。
本发明的涂料组合物(尤其用于反射控制应用)还可含有吸收用于曝光外涂布光致抗蚀剂层的辐射的额外染料化合物。其它任选的添加剂包括表面均化剂,例如可以商品名Silwet 7604获得的均化剂,或购自3M Company的表面活性剂FC 171或FC 431。
本发明的下层涂料组合物还可含有其它材料,如光酸产生剂,包括与外涂布光致抗蚀剂组合物一起使用的如所论述的光酸产生剂。关于光酸产生剂在抗反射组合物中的此类用途的论述,参见美国专利6261743。
为了制造本发明的液体涂料组合物,涂料组合物的组分溶解于适合溶剂中,如一种或多种氧基异丁酸酯,尤其为甲基-2-羟基异丁酸酯、乳酸乙酯或如2-甲氧基乙醚(二乙二醇二甲醚)、乙二醇单甲醚和丙二醇单甲醚的二醇醚中的一或多者;具有醚和羟基部分两者的溶剂,如甲氧基丁醇、乙氧基丁醇、甲氧基丙醇和乙氧基丙醇;2-羟基异丁酸甲酯;酯,如溶纤剂乙酸甲酯、溶纤剂乙酸乙酯、丙二醇单甲醚乙酸酯、二丙二醇单甲醚乙酸酯和其它溶剂,如二元酯,碳酸亚丙酯和γ-丁内酯。溶剂中的干式组分的浓度将取决于若干因素,如涂覆方法。一般来说,下层涂料组合物的固体含量在涂料组合物的总重量的约0.5至20重量%范围内变化,优选地,固体含量在涂料组合物的约0.5至10重量范围内变化。
光致抗蚀剂
与下层涂料组合物一起使用的光致抗蚀剂通常包含聚合物和一种或多种酸产生剂。一般优选的是正型抗蚀剂并且抗蚀剂聚合物具有赋予抗蚀剂组合物碱性水溶性的官能团。举例来说,优选的是包含极性官能团(如羟基或羧酸酯基)或在光刻处理后可释放此类极性部分的酸不稳定基团的聚合物。优选地,聚合物以足以使得抗蚀剂可用碱性水溶液显影的量用于抗蚀剂组合物中。
酸产生剂还适当地与包含含有芳香族基(如包括酚的任选经取代的苯基、任选经取代的萘基和任选经取代的蒽)的重复单元的聚合物一起使用。含有任选经取代的苯基(包括酚)的聚合物尤其适合于许多抗蚀剂系统,包括用EUV和电子束辐射成像的那些抗蚀剂系统。对于正性作用抗蚀剂,聚合物优选地也含有一个或多个包含酸不稳定基团的重复单元。举例来说,在含有任选经取代的苯基或其它芳香族基的聚合物的情况下,聚合物可包含含有一个或多个酸不稳定部分的重复单元,如通过使丙烯酸酯或甲基丙烯酸酯化合物的单体与酸不稳定酯(例如丙烯酸叔丁酯或甲基丙烯酸叔丁酯)聚合而形成的聚合物。此类单体可以与一种或多种包含芳基(如任选地苯基)的其它单体(例如苯乙烯或乙烯基苯酚单体)共聚。
用于形成此类聚合物的优选单体包括:具有下式(V)的酸不稳定单体、下式(VI)的含内酯单体、用于调节碱性显影剂中的溶解速率的下式(VII)的碱可溶单体和下式(VIII)的生酸单体,或包含前述单体中的至少一个的组合:
其中每一Ra独立地为H、F、-CN、C1-10烷基或C1-10氟烷基。在式(V)的酸可脱保护单体中,Rb独立地为C1-20烷基、C3-20环烷基、C6-20芳基或C7-20芳烷基,并且每一Rb为独立的或至少一个Rb键结到相邻Rb以形成环状结构。在式(VI)的含内酯单体中,L为单环、多环或稠合多环C4-20含内酯基团。在式(VII)的碱可溶性单体中,W为卤代或非卤代、芳香族或非芳香族C2-50含羟基有机基团,其pKa小于或等于12。在式(VIII)的酸产生单体中,Q为含酯或非酯的且为氟化或非氟化的,并且为C1-20烷基、C3-20环烷基、C6-20芳基或C7-20芳烷基;A为含酯或非含酯的且为氟化或非氟化的,且为C1-20烷基、C3-20环烷基、C6-20芳基或C7-20芳烷基;Z-为阴离子部分,包含羧酸根、磺酸根、磺酰胺阴离子或磺酰亚胺阴离子;并且G+为硫或阳离子。
例示性酸可脱保护单体包括但不限于:
或包含至少一种前述单体的组合,其中Ra为H、F、-CN、C1-6烷基或C1-6氟烷基。
适合的内酯单体可为下式(IX)的单体:
其中Ra为H、F、-CN、C1-6烷基或C1-6氟烷基,R为C1-10烷基、环烷基或杂环烷基,并且w为0至5的整数。在式(IX)中,R直接连接到内酯环上或通常连接到内酯环和/或一个或多个R基团上,并且酯部分直接连接或经由R间接连接到内酯环上。
示例性的含内酯的单体包括:
或包含至少一种前述单体的组合,其中Ra为H、F、-CN、C1-10烷基或C1-10氟烷基。
适合的碱可溶单体可为下式(X)的单体:
其中每一Ra独立地为H、F、-CN、C1-10烷基或C1-10氟烷基,A为含羟基或非含羟基、含酯或非含酯、氟化或非氟化的C1-20亚烷基、C3-20亚环烷基、C6-20亚芳基或C7-20亚芳烷基,并且x为0至4的整数,其中当x为0时,A为含羟基的C6-20亚芳基。
例示性碱可溶性单体包括具有以下结构的那些单体:
或包含至少一种前述单体的组合,其中Ra为H、F、-CN、C1-6烷基或C1-6氟烷基。
优选的酸产生单体包括式(XI)或(XII)的那些单体:
其中每一Ra独立地为H、F、-CN、C1-6烷基或C1-6氟烷基,A为经氟取代的C1-30亚烷基、经氟取代的C3-30亚环烷基、经氟取代的C6-30亚芳基或经氟取代的C7-30亚烷基-亚芳基,并且G+是硫或阳离子。
优选地,在式(XI)和式(XII)中,A为-[(C(R1)2)xC(=O)O]b-C((R2)2)y(CF2)z-基团或邻位、间位或对位取代的-C6F4-基团,其中每一R1和R2各自独立地为H、F、-CN、C1-6氟烷基或C1-6烷基,b为0或1,x为1至10的整数,y和z独立地为0至10的整数,并且y+z的总和为至少1。
例示性优选的酸产生单体包括:
或包含至少一种前述单体的组合,其中每一Ra独立地为H、F、-CN、C1-6烷基或C1-6氟烷基,k适合地为0至5的整数;并且G+是硫或阳离子。如在本文各种式中所提及的G+可为如本文中所公开的酸产生剂并且包含氧代-二氧杂环戊烷部分和/或氧代-二噁烷部分。
其中X为S或I;每一R0为卤代或非卤代的并且独立地为C1-30烷基、多环或单环C3-30环烷基、多环或单环C4-30芳基;或包含至少一种前述基团的组合,其中当X为S时,R0基团中的一个任选地通过单键连接到一个相邻R0基团,并且a为2或3,其中当X为I时,a为2,或当X为S时,a为3。
例示性酸产生单体包括具有下式的那些单体:
特别适用于本发明正性作用化学放大光致抗蚀剂中的具有酸不稳定解块基团的聚合物已经公开于欧洲专利申请0829766A2(具有缩醛的聚合物和缩酮聚合物)和欧洲专利申请EP0783136A2(包括1)苯乙烯;2)羟基苯乙烯;和3)酸不稳定基团(确切地说丙烯酸烷酯酸不稳定基团)单元的三元共聚物和其它共聚物中。
用于在低于200nm,如193nm下成像的光致抗蚀剂的其它优选树脂包含以下通式(I)、(II)和(III)的单元:
用于在低于200nm,如193nm下成像的光致抗蚀剂的优选树脂包含以下通式(I)、(II)和(III)的单元:
其中:R1为(C1-C3)烷基;R2为(C1-C3)亚烷基;L1为内酯基;并且n为1或2。
用于本发明光致抗蚀剂中的聚合物的分子量和多分散性可适当地大幅变化。适合的聚合物包括Mw为约1,000至约50,000、更通常约2,000至约30,000并且分子量分布为约3或更小、更通常分子量分布为约2或更小的那些聚合物。
优选的本发明负性作用组合物包含在暴露于酸后将固化、交联或硬化的材料和两种或更多种如本文中所公开的酸产生剂的混合物。优选的负性作用组合物包含聚合物粘合剂(如酚系或非芳香族聚合物)、交联剂组分和本发明的光敏组分。此类组合物和其用途已经公开于Thackeray等人的欧洲专利申请0164248和美国专利第5,128,232号中。用作聚合物粘合剂组分的优选酚系聚合物包括酚醛清漆和聚(乙烯基苯酚),如上文所论述的那些组分。优选的交联剂包括胺基材料,包括三聚氰胺,甘脲,苯并胍胺基材料和尿素基材料。三聚氰胺-甲醛聚合物通常尤其适合。此类交联剂为可商购的,例如三聚氰胺聚合物、甘脲聚合物、基于脲的聚合物和苯并胍胺聚合物,如由Cytec以商品名称Cymel 301、303、1170、1171、1172、1123和1125以及Beetle 60、65和80销售的那些交联剂。
尤其优选的本发明光致抗蚀剂可用于浸没式光刻应用中。关于优选浸没式光刻光致抗蚀剂和方法的论述,参见例如Rohm and Haas Electronic Materials的U.S.7968268。
本发明的光致抗蚀剂还可包含单一酸产生剂或相异酸产生剂的混合物,通常2或3种不同酸产生剂的混合物,更通常由总共2种相异酸产生剂组成的混合物。光致抗蚀剂组合物包含以在暴露于活化辐射后足以在组合物的涂层中产生潜像的量采用的酸产生剂。举例来说,酸产生剂将适当地以按光致抗蚀剂组合物的总固体计1到20重量%的量存在。
适合的酸产生剂为化学放大光致抗蚀剂领域中已知的并且包括例如:盐,例如三氟甲烷磺酸三苯基锍、三氟甲烷磺酸(对叔丁氧基苯基)二苯基锍、三氟甲烷磺酸三(对叔丁氧基苯基)锍、对甲苯磺酸三苯基锍;硝基苯甲基衍生物,例如2-硝基苯甲基-对甲苯磺酸盐、2,6-二硝基苯甲基-对甲苯磺酸盐以及2,4-二硝基苯甲基-对甲苯磺酸盐;磺酸酯,例如1,2,3-三(甲烷磺酰基氧基)苯、1,2,3-三(三氟甲烷磺酰基氧基)苯以及1,2,3-三(对甲苯磺酰基氧基)苯;重氮甲烷衍生物,例如双(苯磺酰基)重氮甲烷、双(对甲苯磺酰基)重氮甲烷;乙二肟衍生物,例如双-O-(对甲苯磺酰基)-α-二甲基乙二肟和双-O-(正丁烷磺酰基)-α-二甲基乙二肟;N-羟基酰亚胺化合物的磺酸酯衍生物,例如N-羟基丁二酰亚胺甲磺酸酯、N-羟基丁二酰亚胺三氟甲磺酸酯;以及含卤素的三嗪化合物,例如2-(4-甲氧基苯基)-4,6-双(三氯甲基)-1,3,5-三嗪以及2-(4-甲氧基萘基)-4,6-双(三氯甲基)-1,3,5-三嗪。
如本文中所提及,酸产生剂可在暴露于活化辐射,如EUV辐射、电子束辐射、193nm波长辐射或其它辐射源后产生酸。如本文中所提及的酸产生剂化合物也可称为光酸产生剂化合物。
本发明的光致抗蚀剂也可含有其它材料。举例来说,其它任选的添加剂包括光化和造影染料、抗条纹剂、塑化剂、速度增强剂和敏化剂。此类任选的添加剂通常将以较小浓度存在于光致抗蚀剂组合物中。
或者或另外,其它添加剂可包括淬灭剂,其为非光可破坏碱,如基于氢氧化物、羧酸盐、胺、亚胺和酰胺的那些碱。优选地,此类淬灭剂包括C1-30有机胺、亚胺或酰胺,或可为强碱(例如氢氧化物或醇盐)或弱碱(例如羧酸盐)的C1-30季铵盐。例示性淬灭剂包括胺,如三丙胺、十二烷胺、三(2-羟丙基)胺、oltetrakis(2-羟丙基)乙二胺;芳基胺,如二苯胺、三苯胺、氨基苯酚和2-(4-氨基苯基)-2-(4-羟基苯基)丙烷,受阻胺,如二氮杂双环十一烯(DBU)或二氮杂二环壬烯(DBN),或离子淬灭剂,包括季烷基铵盐,如氢氧化四丁铵(TBAH)或乳酸四丁铵。
表面活性剂包括氟化和非氟化的表面活性剂,并且优选是非离子的。例示性氟化非离子表面活性剂包括全氟C4表面活性剂,如可自3M Corporation购得的FC-4430和FC-4432表面活性剂;和氟二醇,如来自Omnova的POLYFOX PF-636、PF-6320、PF-656和PF-6520氟表面活性剂。
光致抗蚀剂进一步包括一般适合于溶解、分配和涂布光致抗蚀剂中所用组分的溶剂。例示性溶剂包括苯甲醚;醇,包括乳酸乙酯、1-甲氧基-2-丙醇和1-乙氧基-2丙醇;酯,包括乙酸正丁酯、乙酸1-甲氧基-2-丙酯、甲氧基乙氧基丙酸酯、乙氧基乙氧基丙酸酯;酮,包括环己酮和2-庚酮;以及包含至少一种前述溶剂的组合。
平版印刷加工
在使用中,本发明的涂料组合物通过如旋涂的多种方法中的任一种以涂层形式涂覆到衬底。涂料组合物一般以约0.02与0.5μm之间的干燥层厚度,优选地约0.04与0.20μm之间的干燥层厚度涂覆于衬底上。衬底适当地为任何用于涉及光致抗蚀剂的方法中的衬底。举例来说,衬底可为硅、二氧化硅或铝-氧化铝微电子晶片。也可采用砷化镓、碳化硅、陶瓷、石英或铜衬底。还适当地采用用于液晶显示器或其它平板显示器应用的衬底,例如玻璃衬底、氧化铟锡涂布衬底等。还可采用用于光学和光电装置(例如波导)的衬底。
优选地,涂覆的涂层在光致抗蚀剂组合物涂覆于下层涂料组合物上方之前固化。固化条件将随着底层涂料组合物的组分而变化。确切地说,固化温度将取决于涂料组合物中采用的特定酸或酸(热)产生剂。典型固化条件为约80℃至225℃下持续约0.5至5分钟。固化条件优选地使得涂料组合物涂层大体上不溶于使用的光致抗蚀剂溶剂以及显影剂溶液。
在此类固化之后,光致抗蚀剂涂覆于涂覆的涂料组合物的表面上。如同底部涂料组合物层的涂覆,外涂布光致抗蚀剂可通过任何标准方法,如通过旋涂、浸涂、弯月面涂布或滚涂来涂覆。在涂布后,光致抗蚀剂涂层通常通过加热干燥以去除溶剂,优选地直到抗蚀剂层无粘性。最优地,应基本上不出现底部组合物层与外涂布光致抗蚀剂层的互混。
抗蚀剂层接着用活化辐射,如以常规方式穿过遮罩的248nm、193nm或EUV辐射成像。曝光能量足以有效地活化抗蚀剂系统的光敏组分以在抗蚀剂涂层中产生图案化图像。通常,曝光能量的范围介于约3至300mJ/cm2并且部分取决于采用的曝光工具和特定抗蚀剂和抗蚀剂处理。曝光的抗蚀剂层可在必要时经受曝光后烘烤以在涂层的曝光与未曝光区域之间产生或增强溶解性差异。举例来说,负型酸硬化光致抗蚀剂通常需要曝光后加热以诱导酸促进的交联反应,并且许多化学放大正性作用抗蚀剂需要曝光后加热以诱导酸促进的脱除保护基反应。通常,曝光后烘烤条件包括约50℃或更高的温度,更确切地说约50℃至约160℃范围内的温度。
光致抗蚀剂层还可曝光于浸没式光刻系统中,即其中曝光工具(尤其投影透镜)与光致抗蚀剂涂布衬底之间的空间由浸没流体,如水或与一种或多种添加剂(如可提供增强的折射率的流体的硫酸铯)混合的水占据。优选地,浸没流体(例如水)已经处理以避免气泡,例如水可经脱气以避免纳米气泡。
本文中提及“浸没曝光”或其它类似术语指示曝光在此类流体层(例如水或具有添加剂的水)插入在曝光工具与经涂布的光致抗蚀剂组合物层之间的情况下进行。
曝光的光致抗蚀剂层接着用能够选择性地去除膜的一部分以形成光致抗蚀剂图案的适合显影剂处理。在负型显影方法中,光致抗蚀剂层的未曝光区域可通过用适合非极性溶剂处理选择性地去除。关于负型显影的适合程序,参见U.S.2011/0294069。用于负型显影的典型非极性溶剂为有机显影剂,如选自酮、酯、烃和其混合物的溶剂,例如丙酮、2-己酮、2-庚酮、乙酸甲酯、乙酸丁酯和四氢呋喃。用于NTD方法中的光致抗蚀剂材料优选地形成可与有机溶剂显影剂形成负像或与如氢氧化四烷基铵溶液的水性碱显影剂形成正像的光致抗蚀剂层。优选地,NTD光致抗蚀剂是基于具有酸敏(可脱保护)基团的聚合物,所述基团在脱除保护基时形成羧酸基和/或羟基。
或者,曝光的光致抗蚀剂层的显影可通过用能够选择性地去除膜的曝光部分(其中光致抗蚀剂是正型)或去除膜的未曝光部分(其中光致抗蚀剂在曝光区域中可交联,即为负型)的适合显影剂处理曝光层来实现。优选地,光致抗蚀剂为正型的,其基于具有在脱除保护基时形成羧酸基的酸敏(可脱保护)基团的聚合物,并且显影剂优选地为金属离子自由氢氧化四烷基铵溶液,如0.26N氢氧化四甲基铵水溶液。图案通过显影形成。
显影的衬底可接着根据所属领域中众所周知的程序在缺乏光致抗蚀剂的那些衬底区域,例如缺乏光致抗蚀剂的化学蚀刻或镀敷区域上选择性地处理。适合的蚀刻剂包括氢氟酸蚀刻溶液和等离子体气体蚀刻,如氧等离子体蚀刻。等离子气体蚀刻去除下层涂层。
如所讨论的,在某些方面,可以适当采用湿法蚀刻工艺。湿蚀刻可适当地通过用湿蚀刻组合物暴露待蚀刻的表面(例如金属氮化物,或涂布有一个或多个有机层和/或无机层的金属氮化物)一定时间和温度以有效蚀刻表面(例如金属氮化物表面和/或其上的涂层)来进行。示例性的湿蚀刻组合物包括氢氧化铵和过氧化物如过氧化氢的水性混合物,或酸如硫酸和过氧化物如过氧化氢的混合物。示例性组合物参见US 2006/0226122。下面的例子还提供了示例性的湿法蚀刻工艺条件。如本文所提及,“湿法蚀刻工艺”是指用流体组合物处理由邻接的光致抗蚀剂限定的衬底区域(在光致抗蚀剂图像的显影之后),所述流体组合物通常为酸性或碱性的,与过氧化剂组合,但在任何情况下与等离子体干法蚀刻不同。
以下非限制性实例是对本发明的说明。
聚合物合成:
比较聚合物实例1
在3颈250毫升圆底烧瓶中加入28.6g三(2-羟乙基)异氰脲酸酯、7.2g三(2-羧乙基)异氰脲酸酯、14.3g二丁基萘二甲酸酯、50.0g 1,4-丁二醇、0.33g对甲苯磺酸一水合物作为催化剂、33.3g苯甲醚作为溶剂。在搅拌下将其加热至设定温度(155℃)。反应混合物运行7小时,然后将溶液冷却至室温。粗品用THF(50g)稀释以分离。将反应混合物用甲基叔丁基醚和异丙醇(反应混合物的×10过量)的混合物沉淀,然后过滤并在40℃下真空干燥24小时。将完全干燥的粉末稀释至15重量%。第二步分离步骤与第一步相同。
比较聚合物实例2
向3颈250毫升圆底烧瓶中加入30.4g三(2-羟乙基)异氰脲酸酯、20.1g三(2-羧乙基)异氰脲酸酯、20.1g 1,4-丁二醇、0.54g对甲苯磺酸酸一水合物作为催化剂、34.2g茴香醚作为溶剂。在搅拌下将其加热至设定温度(150℃)。反应混合物运行3.5小时,然后将溶液冷却至室温。粗品用THF(80g)稀释以分离。用异丙醇(反应混合物的×10过量)使反应混合物沉淀,然后过滤并在40℃下真空干燥24小时。将完全干燥的粉末稀释至15重量%。第二步分离步骤与第一步相同。
聚合物实例1
在3颈250毫升圆底烧瓶中装入14.6g三(2-羟乙基)异氰脲酸酯、5.4g 5-硝基尿嘧啶、9.4g二羟乙酸、10.6g 1,2-丙二醇、0.53g的对甲苯磺酸一水合物作为催化剂、40g的苯甲醚作为溶剂。在搅拌下将其加热至设定温度(150℃)。反应混合物运行9小时,然后将溶液冷却至室温。粗品用THF(80g)稀释以分离。用异丙醇(反应混合物的×10过量)使反应混合物沉淀,然后过滤并在40℃下真空干燥24小时。将完全干燥的粉末稀释至15重量%。第二步分离步骤与第一步相同。
BARC组合物
比较BARC实例1
将3.198g比较聚合物1、0.570g作为交联剂的四甲氧基甲基甘脲、0.030g对甲苯磺酸铵盐和0.002g作为均化剂的polyfox 656溶于96.2g混合溶剂(HBM/GBL 90/10wt/wt)以获得溶液。所有制备的溶液通过超高分子量聚乙烯膜过滤器过滤。使用旋转器将所述溶液涂布在硅晶片上,并将所述晶片在热板上于205℃下加热1分钟以形成抗反射涂层。用光谱椭偏仪测量抗反射涂层表明在193nm的折射率n为1.89和消光系数k为0.29。
比较BARC实例2
将5.583g比较聚合物2、0.297g作为交联剂的四甲氧基甲基甘脲、0.047g三乙基铵对甲苯磺酸盐和0.003g作为均化剂的polyfox 656溶于94.07g HBM溶剂以获得溶液。所有制备的溶液通过超高分子量聚乙烯膜过滤器过滤。使用旋转器将所述溶液涂布在硅晶片上,并将所述晶片在热板上于205℃下加热1分钟以形成抗反射涂层。用光谱椭偏仪测量抗反射涂层表明193nm的折射率n为1.96和消光系数k为0.29。
BARC实例3
将3.407g聚合物1、0.611g作为交联剂的四甲氧基甲基甘脲、0.05g 2,4,6-三甲基呲啶对甲苯磺酸盐和0.002g作为均化剂的polyfox 656溶于95.93g HBM溶剂以获得溶液。所有制备的溶液通过超高分子量聚乙烯膜过滤器过滤。使用旋转器将所述溶液涂布在硅晶片上,并将所述晶片在热板上于205℃下加热1分钟以形成抗反射涂层。用光谱椭偏仪测量抗反射涂层表明在193nm的折射率n为1.83和消光系数k为0.20。
蚀刻速率评估
使用以下条件,用CCP型蚀刻器测定H2/N2的蚀刻速率:气流400 H2/700 N2 12秒,20mT RF功率,温度20℃。两片晶片用BARC涂布,以1500rpm旋转,并在205℃下烘烤。测量膜厚度。然后蚀刻BARC涂覆的晶片12秒。再次测量每个BARC的膜厚度。还计算了组合物的聚合物的Ohnishi参数值。结果显示于图1和下表1中。
[表1]
样品 | Ohnishi参数 | 蚀刻速率(对比参考1) |
比较BARC实例1 | 6.30 | 1.00 |
比较BARC实例2 | 6.88 | 1.27 |
BARC实例3 | 10.45 | 1.54 |
Claims (11)
1.一种经涂布衬底,包含:
(a)在衬底上的涂料组合物层,所述涂料组合物包含含有一个或多个经取代尿嘧啶部分和一个或多个反应的二羧酸基团的树脂,
所述树脂通过聚合1)含有一个或多个经取代尿嘧啶部分的第一试剂和2)含有一个或多个脂肪族二羧酸基团的第二试剂的步骤而获得;和
(b)所述涂料组合物层上的光致抗蚀剂层,
所述树脂具有至少7的Ohnishi参数值,
所述Ohni shi参数值代表作为NT/(NC-NO)的函数的聚合物中的有效碳含量,其中NT是原子总数,NC是碳原子数,并且NO是氧原子的数量。
2.根据权利要求1所述的衬底,其中所述树脂还包含一个或多个异氰脲酸酯部分。
3.根据权利要求1或2所述的衬底,其中尿嘧啶部分被卤素或硝基取代。
4.根据权利要求1至3中任一项所述的衬底,其中所述树脂可通过聚合1)包含一个或多个经取代尿嘧啶部分的第一试剂,2)包含一个或多个二羧酸基团的第二试剂和3)包含一个或多个异氰脲酸酯部分的第三试剂而获得。
5.根据权利要求1至4中任一项所述的衬底,其中所述树脂包含基于树脂总重量20至70重量%的量的所述尿嘧啶和反应的二羧酸组分。
6.根据权利要求1至5中任一项所述的衬底,其中所述树脂包含聚酯键。
7.一种形成光致抗蚀剂浮雕图像的方法,包含:
(a)在衬底上涂覆涂料组合物,所述涂料组合物包含含有一个或多个经取代尿嘧啶部分和一个或多个反应的二羧酸基团的树脂,所述树脂通过聚合1)含有一个或多个经取代尿嘧啶部分的第一试剂和2)含有一个或多个脂肪族二羧酸基团的第二试剂的步骤而获得;
(b)在所述涂料组合物层上涂覆光致抗蚀剂组合物层;以及
(c)使所述光致抗蚀剂层曝光并且显影以提供抗蚀剂浮雕图像,
所述树脂具有至少7的Ohnishi参数值,
所述Ohni shi参数值代表作为NT/(NC-NO)的函数的聚合物中的有效碳含量,其中NT是原子总数,NC是碳原子数,并且NO是氧原子的数量。
8.一种与外涂光致抗蚀剂组合物一起使用的抗反射组合物,所述抗反射组合物包含含有一个或多个经取代尿嘧啶部分和一个或多个反应的二羧酸基团的树脂,
所述树脂通过聚合1)含有一个或多个经取代尿嘧啶部分的第一试剂和2)含有一个或多个脂肪族二羧酸基团的第二试剂的步骤而获得,
所述树脂具有至少7的Ohnishi参数值,
所述Ohni shi参数值代表作为NT/(NC-NO)的函数的聚合物中的有效碳含量,其中NT是原子总数,NC是碳原子数,并且NO是氧原子的数量。
9.根据权利要求8所述的抗反射组合物,其中所述树脂还包含一个或多个异氰脲酸酯部分。
10.根据权利要求8或9所述的抗反射组合物,其中所述树脂包含聚酯键。
11.根据权利要求8至10中任一项所述的抗反射组合物,其中所述组合物包含交联剂组分。
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JP2019008281A (ja) | 2019-01-17 |
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KR102159557B1 (ko) | 2020-09-25 |
TWI707005B (zh) | 2020-10-11 |
US20180364575A1 (en) | 2018-12-20 |
KR20180136890A (ko) | 2018-12-26 |
CN109143783A (zh) | 2019-01-04 |
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