CN109130512B

CN109130512B - Chip, ink box and ink box taking-out method

Info

Publication number: CN109130512B
Application number: CN201710510439.2A
Authority: CN
Inventors: 邱涌群; 陈伟健
Original assignee: Zhuhai Ninestar Management Co Ltd
Current assignee: Zhuhai Ninestar Management Co Ltd
Priority date: 2017-06-28
Filing date: 2017-06-28
Publication date: 2024-02-23
Anticipated expiration: 2037-06-28
Also published as: CN109130512A

Abstract

The invention provides a chip, an ink box and a method for taking out the ink box, wherein the chip is used for being electrically connected with a contact pin in a printer holding part and comprises a first chip part and a second chip part, a plurality of first terminals are arranged on the first chip part, the first terminals comprise first contact parts which are contacted with the contact pin, a plurality of second terminals are arranged on the second chip part, the second terminals comprise second contact parts which are contacted with the contact pin, the first chip part comprises a first surface and a second surface which are oppositely arranged, the second chip part is connected with the first chip part, a plurality of first through grooves which are used for accommodating the contact pin are arranged on the first chip part, the first through grooves penetrate through the first surface and the second surface, and at least one part of the first through grooves is covered by at least one part of the second contact parts. The first through groove on the chip can play a role in guiding the contact pins in the mounting process, so that the occurrence of chip contact dislocation is avoided, the chip and the contact pins can be better contacted, and the practicability of the chip is further improved.

Description

Chip, ink box and ink box taking-out method

Technical Field

The invention relates to the technical field of printing imaging, in particular to a chip, an ink box and a method for taking out the ink box.

Background

There are many kinds of chips for printers, which are used to store information such as factory information, ink amount information, ink cartridge type information, ink color, etc., and the chips for inkjet printers play a decisive role for the normal operation of inkjet printers.

In which, chinese patent 201320875786.2 discloses a cartridge chip, a cartridge and an ink jet printer, referring to fig. 1-2, in the prior art, the chip 4 includes five lower chip contacts 41 and four upper chip contacts 42, when the cartridge chip 4 contacts with the cartridge chip contact pins of the pin structure 5, the lower chip contacts 41 include contact portions 411 at the ends thereof, the contact portions 411 abut with the protruding portions 511 of the lower cartridge chip contact pins 51, and the upper chip contacts 42 include contact portions 421 at the ends thereof, the contact portions 421 abut with the protruding portions 521 of the upper cartridge chip contact pins 52.

However, in implementing the present technical solution, the following drawbacks exist in the prior art: since the contact portion for making contact with the stylus 51 is a pointed convex structure, the pointed convex structure is difficult to manufacture, the precision is difficult to control, and the processing and manufacturing difficulties are high; in addition, in the installation, when chip and contact pin upper row contact, can receive the lateral force that the contact pin gave, the chip rocks easily, and then can arouse chip contact dislocation easily, influences the normal use of chip.

Disclosure of Invention

The invention provides a chip, an ink box and a method for taking out the ink box, which can effectively solve the problems of the prior art that the processing and manufacturing difficulty is high, the chip contact dislocation is easy to cause, and the normal use of the chip is affected.

An aspect of the present invention is to provide a chip for electrically connecting with a contact pin in a printer holding portion, the chip including a first chip portion on which a plurality of first terminals are provided, the first terminals including first contact portions that contact the contact pin, and a second chip portion on which a plurality of second terminals are provided, the second terminals including second contact portions that contact the contact pin, the first chip portion including oppositely disposed first and second faces, the second chip portion being connected with the first chip portion, the first chip portion being provided with a plurality of first through grooves for accommodating the contact pin, the first through grooves penetrating the first and second faces, at least a portion of the first through grooves being covered by at least a portion of the second contact portions.

A further aspect of the present invention is to provide a chip for electrical connection with contact pins in a printer holding portion, the contact pins including a first group of contact pins and a second group of contact pins having different heights and being staggered with each other, the chip including a first chip portion on which a plurality of first terminals are provided, the first terminal including a first contact portion with the first group of contact pins, and a second chip portion on which a plurality of second terminals are provided, the second terminal including a second contact portion with the second group of contact pins, the first chip portion including a first face and a second face disposed opposite to each other, the second chip portion being connected to the first chip portion, the first chip portion being provided with a plurality of first through grooves for accommodating the second group of contact pins, the first through grooves penetrating the first face and the second face, at least a part of the first through grooves being covered with at least a part of the second contact portion.

Another aspect of the present invention is to provide an ink cartridge for being detachably mounted on a holding portion of a printer, including the above-described chip.

In a further aspect of the present invention, there is provided a method for taking out an ink cartridge, on which the chip described above is mounted, the ink cartridge including a case and a chip frame provided at a side portion of the case, the chip frame being connected to the chip; the method comprises the following steps:

moving the chip rack in a direction intersecting the mounting direction; the chip is separated from the contact pin along with the movement of the chip frame; and taking out the ink box.

In a further aspect of the present invention, there is provided a method for taking out an ink cartridge, wherein the ink cartridge is provided with the chip described above, and a first chip portion and a second chip portion in the chip are movably connected; the method comprises the following steps:

the second chip portion is separated from the first chip portion when the first chip portion passes over a second set of contact pins; the second chip part is separated from the second group of contact pins; and taking out the ink box.

The chip, the ink box and the ink box taking-out method provided by the invention have the advantages that the terminal structure with the pointed bulge is abandoned, and the difficulty in manufacturing and processing is reduced; the first chip part and the second chip part are connected and combined to form a whole chip, so that part of at least one first through groove is covered by at least one part of second contact part, in the mounting process, the first through groove can play a role in guiding the contact pins in the mounting process, the occurrence of chip contact dislocation is avoided, the chip and the contact pins can be better contacted, the normal use effect of the chip is guaranteed, the practicability of the chip is improved, and the popularization and application of the market are facilitated.

Drawings

FIG. 1 is a schematic view of a conventional ink cartridge;

FIG. 2 is a schematic diagram of a second ink cartridge according to the prior art;

fig. 3a1 is a schematic structural diagram of a first chip portion in a chip according to an embodiment of the invention;

fig. 3a2 is a schematic diagram of a second structure of a first chip portion in the chip according to the embodiment of the invention;

FIG. 3b1 is a schematic diagram illustrating a structure of a second chip portion in the chip according to an embodiment of the invention;

FIG. 3b2 is a schematic diagram of a second chip portion of the chip according to the embodiment of the invention;

FIG. 3c1 is a schematic diagram illustrating a chip structure according to an embodiment of the invention;

FIG. 3c2 is a schematic diagram of a chip according to an embodiment of the invention;

FIG. 4a is a schematic diagram of another chip according to an embodiment of the present invention;

FIG. 4b is a schematic diagram of a second chip according to an embodiment of the present invention;

fig. 5a is a schematic view of a stylus according to an embodiment of the present invention;

fig. 5b is a schematic diagram of a stylus according to an embodiment of the present invention;

fig. 6a is a schematic diagram showing a structure of a chip contacted with a contact pin according to an embodiment of the present invention;

fig. 6b is a schematic diagram of a second structure of the chip in contact with the contact pin according to the embodiment of the present invention;

fig. 6c is a schematic diagram of a third embodiment of the present invention in which a chip contacts a stylus;

FIG. 7a is a schematic diagram of a cross-sectional structure of a chip according to an embodiment of the invention;

FIG. 7a1 is an enlarged partial schematic view of FIG. 7 a;

FIG. 7b is a schematic diagram showing a cross-sectional structure of a chip according to an embodiment of the invention;

FIG. 7b1 is an enlarged partial schematic view of FIG. 7 b;

FIG. 7c is a schematic diagram of a cross-sectional structure of a chip according to an embodiment of the invention;

FIG. 7c1 is an enlarged partial schematic view of FIG. 7 c;

FIG. 8a is a schematic diagram of a first chip portion according to another embodiment of the invention;

FIG. 8b is a schematic diagram of a second chip portion according to another embodiment of the present invention;

FIG. 8c is a schematic diagram of a chip according to another embodiment of the present invention;

FIG. 8d is a schematic diagram of a second chip according to an embodiment of the present invention;

fig. 9 is a schematic diagram showing a structure of a chip contacted with a contact pin according to an embodiment of the present invention;

FIG. 10a is a schematic diagram illustrating a structure of a chip according to another embodiment of the present invention;

FIG. 10b is a schematic diagram of a second chip according to an embodiment of the present invention;

fig. 11 is a schematic diagram showing a structure of a chip in contact with a contact pin according to an embodiment of the present invention;

FIG. 12 is a schematic diagram of a chip according to an embodiment of the present invention;

fig. 13a is a schematic diagram of a structure in which a first chip portion is connected to a second chip portion through a connection portion according to an embodiment of the present invention;

Fig. 13b is a schematic diagram of a second structure in which a first chip portion is connected to a second chip portion through a connection portion according to an embodiment of the present invention;

FIG. 13c is a schematic view showing an expanded structure of the first chip portion and the second chip portion connected by the connection portion according to the embodiment of the present invention;

fig. 14a is a schematic diagram showing a structure of a chip in contact with a contact pin according to an embodiment of the present invention;

fig. 14b is a schematic diagram showing a structure of a chip in contact with a contact pin according to an embodiment of the present invention;

FIG. 15 is a schematic diagram of a chip carrier according to an embodiment of the invention;

FIG. 16a is a schematic diagram showing a split structure of an ink cartridge and a chip according to an embodiment of the present invention;

FIG. 16b is a schematic diagram showing a mounting structure of an ink cartridge and a chip according to an embodiment of the present invention;

FIG. 17 is a schematic view of a retaining portion according to an embodiment of the present invention;

FIG. 18 is a schematic diagram II of a mounting structure of an ink cartridge and a chip according to an embodiment of the present invention;

FIG. 19a is a schematic view of an ink cartridge according to an embodiment of the present invention;

FIG. 19b is a schematic diagram showing a split structure of an ink cartridge and a chip according to an embodiment of the present invention;

FIG. 20 is a second schematic structural view of a retaining portion according to an embodiment of the present invention;

FIG. 21 is a third schematic view of a retaining portion according to an embodiment of the present invention;

FIG. 22 is a schematic view of an ink cartridge according to an embodiment of the present invention;

FIG. 23 is a schematic diagram III of a split structure of an ink cartridge and a chip according to an embodiment of the present invention;

fig. 24 is a diagram showing the positional relationship between the chip and the stylus when the chip is separated from the ink cartridge according to the embodiment of the present invention;

FIG. 25 is a schematic diagram showing a structure of a chip mounted on a chip carrier according to an embodiment of the present invention;

fig. 26a is a schematic view of a first structure of a chip carrier contacting a contact pin according to an embodiment of the present invention;

fig. 26b is a schematic diagram showing a second structure of the contact between the chip carrier and the contact pin according to the embodiment of the present invention.

FIG. 27 is a flow chart of a method of removing an ink cartridge according to an embodiment of the present invention;

fig. 28 is a flow chart of another method for removing an ink cartridge according to an embodiment of the present invention.

Detailed Description

The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.

In this technical scheme, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; unless explicitly stated and defined otherwise; and the terms "mounted," "connected," "secured," and the like are to be construed broadly, as they are, for example, fixedly attached, detachably attached, or integrally attached. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

As can be seen from fig. 3a1 to 3c2, the present embodiment provides a chip 1 for electrically connecting with a contact pin 4 in a printer holding portion, the chip 1 includes a first chip portion 100 and a second chip portion 200, the first chip portion 100 is provided with a plurality of first terminals 106, the first terminals 106 include a first contact portion 1061 contacting with the contact pin 4, the second chip portion 200 is provided with a plurality of second terminals 206, the second terminals 206 include a second contact portion 2061 contacting with the contact pin 4, the first chip portion 100 includes a first face 101 and a second face 102 disposed opposite to each other, the second chip portion 200 is connected with the first chip portion 100, the first chip portion 100 is provided with a plurality of first through grooves 105 for accommodating the contact pin 4, the first through grooves 105 penetrate the first face 101 and the second face 102, and a part of at least one first through groove 105 is covered by at least a part of the second contact portion 2061.

As shown in fig. 3a1-3a2, the first chip 100 may be rectangular parallelepiped, and of course, in specific applications, the first chip 100 may be configured to have a square structure, which has a first surface 101-a sixth surface (not shown in the drawings), where the first surface 101 is opposite to the second surface 102, the third surface 103 is opposite to the fourth surface 110, and the fifth surface opposite to the sixth surface may include a first substrate 104, where the first substrate 104 is used to carry electrical components such as the first through groove 105, the first terminal 106, the first contact portion 1061, and the positioning portion 107, where the first contact portion 1061 is at least a part of the first terminal 106. The first through groove 105, the first terminal 106, and the positioning portion 107 may be provided on the first substrate 104. The positioning portion 107 is used for positioning the first chip portion 100/chip 1, for example: the positioning portion 107 may be a hole (as shown in fig. 3a 1), in which case the positioning portion 107 may engage with a positioning post on the ink cartridge/chip carrier to fix the first chip portion 100 on the ink cartridge/chip carrier; the positioning portion 107 may be a part of any one of the first surface 101 to the sixth surface, and the first chip portion 100 may be fixed to the chip carrier/ink cartridge by using the surface as the positioning portion 107; the positioning portion 107 may also be used to achieve a positioning connection between the first chip portion 100 and the second chip portion 200. It will be appreciated that the number of positioning portions 107 may be one or more.

In addition, in the present embodiment, the number of the first through grooves 105 is plural, and as shown in fig. 3a1, the number of the first through grooves 105 is 4. It is understood that the number of the first through grooves 105 may be 2, 3, 5, etc. The first through groove 105 may be circular, elliptical, U-shaped (as shown in fig. 3a 1), irregular, etc., and the first through groove 105 is configured to receive the contact pin 4 and has a space for receiving the contact pin 4, but it should be noted that there is no contact portion in the first through groove 105, and thus the first through groove 105 is not electrically connected to the contact pin 4. Further, the number of the first terminals 106 in the present embodiment is plural, and may be 2, 3, 4, 5 (as shown in fig. 3a 1). Typically, the first terminal 106 is formed by copper plating on the first substrate 104. The first terminal 106 has a first contact portion 1061 thereon which contacts the contact pin 4 on the holding portion. The number of the first contact portions 1061 may or may not correspond to the number of the first terminals 106. Wherein 2 first terminals 106 may be in contact with the contact pins 4 in 1 holding portion, and at this time, the 2 first terminals 106 have 1 first contact portion 1061 thereon; alternatively, 1 first terminal 106 is in contact with the contact pin 4 of the 2 holding portions, and at this time, 2 first contact portions 1061 are provided on 1 first terminal 106.

As shown in fig. 3b1-3b2, the second chip portion 200 in the present embodiment may have a rectangular parallelepiped structure, and has a first surface 201 to a sixth surface (not shown in the drawings), and may also include a second substrate 204, where the second substrate 204 is used to carry electrical components such as a positioning portion 207, a memory 208, a second through slot 205, a second terminal 206, and a second contact portion 2061; the specific shape, function, and number of the second chip portion 200, the positioning portion 207 on the second chip portion 200, the second terminal 206, and the second contact portion 2061 in this embodiment may be similar to the specific shape, function, and number of the first chip portion 100, the positioning portion 107 on the first chip portion 100, the first terminal 106, and the first contact portion 1061, which are not described herein.

In addition, when the first chip portion 100 and the second chip portion 200 are connected, the whole chip 1 may be formed, specifically, the second chip portion 200 may be abutted against the first chip portion 100, further, the first surface 101 of the first chip portion 100 may be abutted against the second surface 202 of the second chip portion 200, and the connection manner may be any of the following manners: the first chip part 100 and the second chip part 200 are welded together; the first chip part 100 and the second chip part 200 are combined together in a mode of positioning buckles, positioning posts and other connecting pieces and positioning holes; the first chip part 100 and the second chip part 200 are adhered together by an adhesive. Of course, other connection manners may be adopted by those skilled in the art, so long as the first chip portion 100 and the second chip portion 200 can be ensured to be stably and effectively connected, and no detailed description is provided herein.

When the first chip portion 100 and the second chip portion 200 form the whole chip 1, the first contact portion 1061 and the second contact portion 2061 may be disposed at intervals, and specifically, the first contact portion 1061 and the second contact portion 2061 may be disposed at intervals; further, referring to fig. 3c1 to 3c2, it is understood that a portion of at least one first through groove 105 in the first chip portion 100 may be covered by at least a portion of the second contact portion 2061, specifically, if a direction perpendicular to the first face 101 and the second face 102 of the first chip portion 100 is defined as a Z direction, and a direction in which the second chip portion 200 points toward the first chip portion 100 is a +z direction, the second contact portion 2061 is on a-Z axis side of the first through groove 105, and a +z direction position of the second contact portion 2061 corresponds to positions of all the first through grooves 105, so that the second contact portion 2061 may cover a portion of the first through groove 105. Of course, in the specific arrangement, the +z direction position of the second contact portion 2061 may be set to correspond to the positions of all the first through grooves 105, which may correspond to the positions of part of the first through grooves 105, so that the second contact portion 2061 on the second terminal 206 may cover a part of at least one first through groove 105, which may further ensure better contact between the chip 1 and the contact pins 4.

The chip 1 provided by the embodiment eliminates a pointed bulge structure in the background technology, and reduces the difficulty in manufacturing and processing; through combining the first chip part 100 and the second chip part 200 to form a whole chip 1, when the whole chip 1 is formed, a part of at least one first through groove 105 is covered by at least one part of the second contact part 2061, so that in the mounting process, the first through groove 105 can play a role in guiding the contact pin 4 in the mounting process, the occurrence of the contact dislocation condition of the chip 1 is avoided, the better contact between the chip 1 and the contact pin 4 is ensured, the normal use effect of the chip 1 is ensured, the practicability of the chip 1 is further improved, and the popularization and the application of the market are facilitated.

As can be seen from the foregoing embodiment with continued reference to fig. 3a1-3c2, the first chip portion 100 is provided with the first contact portion 1061 and the first through groove 105, and the specific positional relationship between the first contact portion 1061 and the first through groove 105 is not limited in this embodiment, and a person skilled in the art may set the first chip portion 100 according to specific design requirements, and preferably, the first chip portion 100 may further include a third surface 103 intersecting the first surface 101 and the second surface 102, and the first contact portion 1061 and the first through groove 105 may be set at a one-to-one interval when the first chip portion 100 is viewed from a direction perpendicular to the third surface 103.

Similarly, in this embodiment, the specific positional relationship between the first terminal 106 and the first through slot 105 is not limited, and those skilled in the art may set the first chip portion 100 according to specific design requirements, preferably, the first terminal 106 and the first through slot 105 are spaced apart from each other when viewing the first chip portion 100 from the direction perpendicular to the third surface 103, and in particular, referring to fig. 3a1-3a2, the first terminal 106 and the first through slot 105 may be spaced apart from each other, where the number of the first terminals 106 is greater than 1 of the first through slots 105. Of course, those skilled in the art may also use other arrangements to set the positional relationship between the first terminals 106 and the first through grooves 105, and between the first contact portions 1061 and the first through grooves 105, for example, an evenly spaced arrangement may be used, where the number of the first terminals 106 and the number of the first through grooves 105 may be the same or different, and the number of the first contact portions 1061 and the number of the first through grooves 105 may be the same or different.

Through the arrangement of the first terminals 106 in the first chip part 100 and the first through grooves 105 at intervals, and the arrangement of the first contact parts 1061 and the first through grooves 105 at intervals, the intervals between the first terminals 106 in the first chip part 100 can be increased, so that the designable space of the first contact parts 1061 is larger, the manufacturing difficulty and the process difficulty are reduced, meanwhile, in the mounting process of the chip 1 and the contact pins 4, the first through grooves 105 can form a guiding effect on the contact pins 4 in the mounting process, the occurrence of the contact dislocation condition of the chip 1 is avoided, the better contact between the chip 1 and the contact pins 4 is further ensured, and the practicability of the chip 1 is improved.

As can be seen with continued reference to fig. 3a1-3c2 and 4b, when the first contact portion 1061 is specifically disposed, the first chip portion 100 further has a fourth surface 110 disposed opposite to the third surface 103, and the first contact portion 1061 is closer to the third surface 103 than the fourth surface 110; at this time, as for the first contact portion 1061, it is preferable that the first contact portion 1061 be provided on an end portion near the third face 103 of the first chip portion 100. Specifically, at the end of the first contact portion 1061 closer to the third surface 103 than the fourth surface 110, the first contact portion 1061 may be provided on any one of the first surface 101, the second surface 102, and the third surface 103; alternatively, the first contact portion 1061 may be provided on the first face 101 and the second face 102; alternatively, the first contact portion 1061 is provided on the first surface 101 and the third surface 103; alternatively, the first contact portion 1061 may be disposed on the first surface 101, the second surface 102, and the third surface 103, and preferably, the first contact portion 1061 may be disposed only on the first surface 101.

Since the first contact portion 1061 is at least a part of the first terminal 106, the first terminal 106 may be located on only any one of the first surface 101, the second surface 102, and the third surface 103 (as shown in fig. 3a1, the first terminal 106 may be located on the first surface 101 and the second surface 102, may be located on the first surface 101 or the third surface 103, and may be located on the first surface 101, the second surface 102, and the third surface 103 (as shown in fig. 4 b), and among these, the first terminal 106 may be located on only the first surface 101 is preferable.

In this embodiment, when the first contact portion 1061 is disposed, the first contact portion 1061 is disposed closer to the third face 103 than the fourth face 110 of the first chip portion 100, specifically, the first contact portion 1061 may be disposed on an end of the ink cartridge closer to the third face 103, and the first contact portion 1061 is disposed closer to the contact pin 4, so that the chip 1 may be further guaranteed to be in contact with the contact pin 4 better, and the use stability and reliability of the chip 1 are improved.

With continued reference to fig. 3a1-3c2, for the second chip part 200, the second chip part 200 may include a first surface 201 to a sixth surface (not shown in the drawings), wherein the first surface 201 is disposed opposite to the second surface 202, the third surface 203 is disposed opposite to the fourth surface 210, the fifth surface is disposed opposite to the sixth surface, and the third surface 203 may intersect the first surface 201 and the second surface 202; at this time, the second chip part 200 may be provided with a plurality of second through grooves 205 for receiving the contact pins 4, the second through grooves 205 penetrating the first surface 201 and the second surface 202, and a portion of at least one second through groove 205 being covered by at least a portion of the first contact part 1061.

Further, the second chip portion 200 is seen from a direction perpendicular to the third surface 203, and the second contact portions 2061 are arranged at intervals from the second through grooves 205, specifically, the second contact portions 2061 may be arranged at intervals from the second through grooves 205. Similarly, the second terminals 206 are spaced apart from the second through grooves 205 when the second chip portion 200 is viewed from a direction perpendicular to the third surface 203, and specifically, the second terminals 206 may be spaced apart from the second through grooves 205 one by one.

In addition, the specific placement position of the second contact portion 2061 is not limited in this embodiment, and a person skilled in the art may perform placement according to specific design requirements, and the second chip portion 200 further has a fourth surface 210 opposite to the third surface 203, where the second contact portion 2061 is closer to the third surface 203 than the fourth surface 210; preferably, the second contact portion 2061 may be disposed on an end portion near the third surface 203 of the second chip portion 200. Specifically, the second contact portion 2061 is provided on any one of the first surface 201, the second surface 202, and the third surface 203; alternatively, the second contact 2061 is disposed on the first surface 201 and the second surface 202; alternatively, the second contact 2061 is disposed on the first surface 201 and the third surface 203; alternatively, the second contact portion 2061 is disposed on the first surface 201, the second surface 202 and the third surface 203, and preferably, the second contact portion 2061 may be disposed only on the second surface 202.

Since the second contact portion 2061 is at least a part of the second terminal 206, the second terminal 206 may be located on only any one of the first surface 201, the second surface 202, and the third surface 203 (as shown in fig. 3b2, the second terminal 206 is disposed on the first surface 201), may be located on the first surface 201 and the second surface 202, may be located on the first surface 201 or the third surface 203, and may be located on the first surface 201, the second surface 202, and the third surface 203, for the second terminal 206, wherein the second terminal 206 may be preferably located on only the second surface 202.

It should be noted that, the specific shape, arrangement and functional effects of the second through groove 205, the second contact portion 2061 and the second terminal 206 in this embodiment are similar to those of the first through groove 105, the first contact portion 1061 and the first terminal 106 in the above embodiment, and the detailed description thereof will be omitted herein.

After the first chip portion 100 and the second chip portion 200 are combined and connected, the first chip portion 100 and the second chip portion 200 may be abutted, specifically, as shown in fig. 3c1-3c2, the second surface 202 of the second chip portion 200 may be abutted with the first surface 101 of the first chip portion 100, and the number of the first through grooves 105 is 4, and the number of the first contact portions 1061 is 5; the number of the second contact portions 2061 is 4 and the number of the second through slots 205 is 5, at this time, at least a part of the second contact portions 2061 may cover a part of the at least one first through slot 105 and at least a part of the first contact portions 1061 may cover a part of the at least one second through slot 205 for the chip 1 as a whole, thereby effectively guiding the mounting of the contact pins 4 and ensuring the contact effect of the contact pins 4 with the chip 1.

By arranging the second contact portion 2061 closer to the third surface 203 than the fourth surface 210 of the second chip portion 200 when the second contact portion 2061 is arranged, specifically, the second contact portion 2061 may be arranged at an end of the ink cartridge close to the third surface 203, and the second contact portion 2061 is closer to the contact pin 4, so that the chip 1 may be better contacted with the contact pin 4, and the use stability and reliability of the chip 1 are improved.

Further, referring to fig. 5a-5b, another chip 1 is provided for electrically connecting with the contact pins 4 in the printer holding portion, the contact pins 4 include a first group of contact pins 401 and a second group of contact pins 402 which are different in height and are staggered with each other, the chip 1 includes a first chip portion 100 and a second chip portion 200, a plurality of first terminals 106 are provided on the first chip portion 100, the first terminals 106 include a first contact portion 1061 contacting the first group of contact pins 401, a plurality of second terminals 206 are provided on the second chip portion 200, the second terminals 206 include a second contact portion 2061 contacting the second group of contact pins 402, the first chip portion 100 includes a first face 101 and a second face 102 which are oppositely disposed, the second chip portion 200 is connected with the first chip portion 100, a plurality of first through grooves 105 for accommodating the second group of contact pins 402 are provided on the first chip portion 100, the first through grooves 105 penetrate the first face 101 and the second face 102, and at least one portion of the first through grooves 105 is covered by at least one portion 2061.

Further, the second chip part 200 includes a first surface 201 and a second surface 202 disposed opposite to each other, and a plurality of second through grooves 205 for accommodating the first group of pins 401 are disposed on the second chip part 200, and the second through grooves 205 penetrate through the first surface 201 and the second surface 202, and a portion of at least one second through groove 205 is covered by at least a portion of the first contact portion 1061.

The chip structure in this embodiment is the same as the chip structure corresponding to the above-mentioned fig. 3a1-3c2 and 4a-4b, and specific reference may be made to the above-mentioned descriptions, which are not repeated here.

In addition, as for the structure of the stylus 4, referring to fig. 5a to 5b, the stylus 4 may include a first group of styluses 401 and a second group of styluses 402 staggered in the vertical and Z-axis directions, in which the first group of styluses 401 and the second group of styluses 402 are located at positions different in height; also, the first group of contact pins 401 and the second group of contact pins 402 may each include: the stylus 4 has a certain elasticity, and when pressure is applied to the head 405 or the stem 404 of the stylus 4, the stylus 4 rotates accordingly.

With continued reference to fig. 6a-6c, when the chip 1 is in contact with the contact pins 4, the first contact portion 1061 is in contact with the first set of contact pins 401, the second contact portion 2061 is in contact with the second set of contact pins 402, the first through slot 105 is for receiving the second set of contact pins 402, and the second through slot 205 is for receiving the first set of contact pins 401.

In the case of providing the first chip portion 100 and the second chip portion 200, the first substrate 104 and the second substrate 204 may be made of the same material, or may be made of different materials. Specifically, one way of implementation is: the first chip part 100 may be a hard board, and the hard board part may be made of FR-4 material, and the hard board part is not deformed when a force is applied, and has the characteristics of fixed shape and size and not deformed; the second chip part 200 may be a flexible board chip, and the flexible board part may be made of flexible circuit board FPC material, and has a flexible characteristic, and is easy to bend and deform. At this time, when the second contact portion 2061 is in contact with the second group of contact pins 402, the second contact portion 2061 may deform under the contact force imparted by the contact pins 4 to the second chip portion 200. Specifically, referring to fig. 7a-7a1, for the second chip portion 200, it may be a flexible board chip, where when the second chip portion 200 views the chip 1 in a direction perpendicular to the third surface 203 of the second chip portion 200, the deformed second contact portions 2061 are arranged in a row with the first contact portions 1061; alternatively, after the second contact portion 2061 is deformed, the second terminals 206 are arranged in a row with the first terminals 106.

Specifically, after the chip 1 is bonded to the contact pins 4, the second group of contact pins 402 is bonded to the second chip portion 200, and because the contact pins 4 generate a force on the second contact portion 2061 on the second chip portion 200, the second contact portion 2061 is deformed downward (in the T direction), so that the second terminal 206 is also deformed downward (in the T direction); as shown in fig. 7a to 7a1, after the chip 1 contacts the contact pins 4 in the mounting direction T, the deformed positions of the second terminals 206 are aligned with the first terminals 106, that is, the second terminals 206 and the first terminals 106 are all arranged in the L1; the deformed second contact portion 2061 is disposed in a row with the first contact portion 1061, that is, the second contact portion 2061 and the first contact portion 1061 are disposed in a horizontal straight line L1. At this time, the second contact portion 2061 may be disposed immediately below the first through groove 105 (-in the direction of the Z axis).

On the basis of the above embodiment, as can be seen with continued reference to fig. 7b-7b1, unlike the embodiment corresponding to fig. 7a-7a1, the second chip portion 200 in this embodiment is a hard board chip, and the material may be FR-4 material, and in general, the hard board chip may default to be free from deformation. At this time, when the first chip part 100 and the second chip part 200 are connected, the chip 1 is viewed in a direction perpendicular to the third surface 203 of the second chip part 200, and the deformed second contact parts 2061 and the first contact parts 1061 are arranged in two rows, that is, the first contact parts 1061 are arranged on the horizontal straight line L2, and the second contact parts 2061 are arranged on the horizontal straight line L3; alternatively, the second terminals 206 are arranged in two rows with the first terminals 106, that is, the first terminals 106 are arranged in a horizontal line L2, and the second terminals 206 are arranged in a horizontal line L3.

Specifically, when the second surface 102 of the first chip portion 100 is in contact with the second surface 202 of the second chip portion 200, the first terminals 106 and the second terminals 206 provided on the first substrate 104 and the second substrate 204, respectively, may be formed by copper plating on the substrates, and therefore, after the chip 1 is in contact with the contact pins 4 in the mounting direction T, the positions of the second terminals 206 are aligned in two rows with the first terminals 106, and the positions of the second contact portions 2061 are aligned in two rows with the first contact portions 1061. Further, the second contact portion 2061 may be disposed inside the first through groove 105.

On the basis of the above embodiments, as can be seen with continued reference to fig. 7c-7c1, unlike the embodiments corresponding to fig. 7a-7a1 and 7b-7b1, the first chip part 100 and the second chip part 200 in this embodiment are connected by the intermediate part 5; the intermediate portion 5 may be a separately provided connection structure, and may be provided on the first chip portion 100 or the second chip portion 200, such that a gap is formed between the first chip portion 100 and the second chip portion 200 after the first chip portion 100 and the second chip portion 200 are connected by the intermediate portion 5, and the first terminal 106 and the second terminal 206 are provided in the gap. At this time, as for the intermediate portion 5, the intermediate portion 5 is provided between the first chip portion 100 and the second chip portion 200, the first chip portion 100 further includes a third face 103 intersecting the first face 101 and the second face 102, the chip 1 is viewed in a direction perpendicular to the third face 103 of the first chip portion 100, and the height of the intermediate portion 5 is the sum of the copper plating thickness of the first terminal 106 and the copper plating thickness of the second terminal 206. Further, the chip 1 is seen in a direction perpendicular to the third face 103 of the first chip part 100, and the intermediate portion 5, the first terminal 106, and the second terminal 206 are arranged in a row, that is, the intermediate portion 5, the first terminal 106, and the second terminal 206 are arranged in a row on the horizontal straight line L4; alternatively, the first contact portion 1061 and the second contact portion 2061 are disposed in a row, that is, the first contact portion 1061 and the second contact portion 2061 are disposed in a row on the horizontal straight line L4.

Specifically, the first surface 101 of the first chip portion 100 is disposed opposite to the second surface 202 of the second chip portion 200, and there is an intermediate portion 5 between the first chip portion 100 and the second chip portion 200, and the length of the intermediate portion 5 in the direction T is the sum of the copper plating thicknesses of the first terminal 106 and the second terminal 206, so that the intermediate portion 5, the first terminal 106, and the second terminal 206 may be arranged in a row due to the presence of the intermediate portion 5, and the first contact portion 1061 is at least a part of the first terminal 106 and the second contact portion 2061 is at least a part of the second terminal 206, so that the first contact portion 1061 and the second contact portion 2061 may also be arranged in a row in the direction T, and further, the second contact portion 2061 is disposed directly below the first through groove 105 (-Z axis direction). In this way, the intermediate portion 5 is disposed between the first chip portion 100 and the second chip portion 200, so that the first chip portion 100 and the second chip portion 200 are not in direct contact, and the chip is prevented from being damaged due to the uneven surface of the first surface 201 of the first chip portion 100 and the second surface 202 of the second chip portion 200 and the rigid contact therebetween.

The first chip portion 100 and the second chip portion 200 in this embodiment may be abutted to each other, or connected through the middle portion 5, and the first chip portion 100 and the second chip portion 200 may be made of the same material or different materials, so that the realizable mode of the chip 1 structure is effectively expanded, the chip 1 structure is flexible and various, the user can conveniently set the corresponding chip 1 structure according to specific design requirements, and the application range of the chip 1 is further expanded.

As will be appreciated with continued reference to fig. 10a-10b, other manners of connecting the first chip portion 100 and the second chip portion 200 in combination may be adopted, and in particular, the second chip portion 200 may include the joint portion 6, the second terminal 206 is connected to one side end of the joint portion 6, and the second chip portion 200 is connected to the first chip portion 100 through the joint portion 6.

The bonding portion 6 may be a bonding mechanism provided between the first chip portion 100 and the second chip portion 200, or may be a bonding mechanism provided between the second terminals 206. Wherein the second terminal 206 may be a copper sheet, the second terminal 206 may communicate with the first chip part 100 through the joint part 6. As shown in fig. 10a-10b, the second terminals 206 are suspended from the joint 6, so that the second terminals 206 have a certain movement space with respect to the joint 6, and since the second contact portion 2061 is at least a part of the second terminals 206, the second contact portion 2061 also has a certain movement space with respect to the joint 6, so that when the chip 1 contacts the contact pins 4, the second group of contact pins 402 gives a certain contact force to the second chip portion 201, the second chip portion 200 moves under the action of the contact force, and in particular, the second chip portion 200 can move with respect to the first chip portion 100. Further, the second contact portion 2061 and the first contact portion 1061 after being moved may be arranged in a row when the chip 1 is seen in a direction perpendicular to the third surface 203 of the second chip portion 200; alternatively, the second terminals 206 and the first terminals 106 may be arranged in a row after the second contact portion 2061 is moved.

Specifically, as shown in fig. 11, when the second group of contact pins 402 is engaged with the second terminals 206, the second terminals 206 move in the-T direction/-Z direction under the force of the second group of contact pins 402, and the second contact portion 2061 also moves in the-T direction/-Z direction under the force of the second group of contact pins 402, so that the first contact portion 1061 is aligned in the direction T.

The second chip portion 200 in this embodiment is connected to the first chip portion 100 through the joint portion 6, so that not only is the stable reliability of connection between the first chip portion 100 and the second chip portion 200 ensured, but also the connection mode between the first chip portion 100 and the second chip portion 200 is expanded, and the chip 1 is convenient to process and manufacture.

On the basis of the above embodiment, as can be seen with continued reference to fig. 12, unlike the embodiment corresponding to fig. 10a-10b, in this embodiment, the first chip portion 100 and the second chip portion 200 are movably connected by the joint portion 6, preferably, the first chip portion 100 and the second chip portion 200 are hinged by the joint portion 6, after the first chip portion 100 and the second chip portion 200 are connected, the second chip portion 200 can move (including a moving manner such as rotation, movement, etc.) relative to the first chip portion 100, at this time, the first chip portion 100 and the second chip portion 200 can not move or rotate relative to the second chip portion 200, and the second chip portion 200 can rotate or move relative to the first chip portion 100, for example, an angle formed between the second chip portion 200 and the first chip portion 100 is adjusted, so that the first chip portion 100 is perpendicular, intersected or parallel to the second chip portion 200, and when the first chip portion 100 and the second chip portion 200 are parallel, the first chip portion 100 is disposed to the second chip portion 200 and the plurality of chip portions are abutted against the second chip portion 109.

Another way that can be achieved is: referring to fig. 13a to 13c, the first chip part 100 is movably connected to the second chip part 200 through the connection part 7, preferably, the first chip part 100 is hinged to the second chip part 200 through the connection part 7, one end of the connection part 7 is connected to the end of the first chip part 100, and the other end is connected to the end of the second chip part 200, so that it is possible to realize that the first chip part 100 and the second chip part 200 can move (including a moving manner such as rotation, movement, etc.) relatively after the first chip part 100 is connected to the second chip part 200, and at this time, the first chip part 100 can move or rotate relative to the second chip part 200, and the second chip part 200 can also rotate or move relative to the first chip part 100. The chip 1 is composed of a combination of a first chip part 100, a second chip part 200, and a connection part 7. It will be appreciated that the connection portion 7 has a flexible character and is prone to bending and deformation, for example, the connection portion 7 is manufactured from flexible circuit board FPC material. Further, a folding line may be provided on the connection portion 7 to fold the first chip portion 100 and the second chip portion 200 into the chip 1 through the connection portion 7. At this time, the chip 1 may be produced in a folding manner, that is, the first chip part 100 and the second chip part 200 are folded by a folding line provided on the connection part 7, thereby forming the chip 1 described above. However, this method is complicated in production process, and a folding line is provided where the connection portion 7 is folded, which may cause a folding trace to be offset from a predetermined folding line when the chip 1 is folded, resulting in a misalignment between terminals. In addition, the chip circuit may be disconnected due to the folding manner. Therefore, it is preferable to manufacture the chip 1 in an unfolded manner, and the chip 1 manufactured in an unfolded manner is not easily misplaced between terminals in a manner of welding or bonding the positioning buckle to the positioning hole or bonding the positioning post to the positioning hole or the adhesive, and the disconnection of the chip circuit is not caused.

In a specific application, referring to fig. 14a-14b, it is known that the chip 1 in this embodiment may be in contact with the contact pins 4, and in particular, the chip 1 may be mounted on a chip holder, where the chip holder may be configured as shown in fig. 15, and the chip holder is mounted on an ink cartridge, so that the chip 1 is electrically connected to the contact pins 4. Wherein, since the second chip portion 200 is movable relative to the first chip portion 100, the chip frame also rotates along with the chip 1 after the chip 1 is mounted on the chip frame, and the ink cartridge requiring the chip frame is relatively space-consuming and has a complex structure relative to the connecting structure of the first chip portion 100 and the second chip portion 200 which are not relatively movable; therefore, in the present embodiment, the second chip portion 200 and the first chip portion 100 are configured to be relatively movable, so that the chip 1 and the chip holder can be conveniently mounted and dismounted, and the chip 1 is not required to be integrally rotated, so that the structure is simple, the occupied space is small, and miniaturization of the ink cartridge and the printer can be easily realized.

On the basis of the above embodiment, as can be seen with continued reference to fig. 4a, the chip 1 in this embodiment is further provided with a third terminal 3 which is not in contact with the contact pin 4; wherein the third terminal 3 is disposed on the first chip portion 100; alternatively, the third terminal 3 is disposed on the second chip portion 200; alternatively, the third terminal 3 is provided on the first chip part 100 and the second chip part 200.

In particular, the third terminal 3 may be used to detect whether there is a short circuit condition between the first terminals 106 or between the second terminals 206 or between the first terminals 106 and the second terminals 206; the third terminal 3 can also be used for detecting whether water stains or ink stains or water drops exist on the surface of the chip 1; the third terminal 3 may also be used for detecting other. As shown in fig. 4a, when the third terminal 3 is located on the first chip portion 100, the setting position of the third terminal 3 is the same as the setting position of the first terminal 106, and the above description is specifically referred to, and will not be repeated here. If the third terminal 3 is located on the second chip portion 200, the setting position of the third terminal 3 is the same as the setting position of the second terminal 206, and the above description is specifically referred to, and will not be repeated here. By the third terminal 3, the connection state of the first terminal 106 and the second terminal 206 on the first chip part 100 and the second chip part 200 can be effectively detected, and the safety and reliability of the use of the chip 1 are further improved.

As can be seen with continued reference to fig. 8a-8d, the first chip portion 100 in this embodiment may further be provided with a third through slot 108, where the third through slot 108 penetrates the first surface and the second surface; at this time, as for the first contact portion 1061, the first contact portion 1061 may be disposed within the third through-slot 108; alternatively, the first contact portion 1061 may be provided on the first face or the second face on the edge of the third through slot 108; alternatively, the first contact portion 1061 may be provided on the first and second faces on the edge of the third through slot 108; alternatively, the first contact portion 1061 may be disposed within the first, second, and third through slots 108.

At this time, when the chip 1 contacts with the contact pins 4, as shown in fig. 9, the first group of contact pins 401 contacts with the first contact portion 1061 provided in the third through-slot 108, the second group of contact pins 402 contacts with the second contact portion 2061, and the first contact portion 1061 is effectively protected by the third through-slot 108, so that the first contact portion 1061 is prevented from being damaged easily, and the contact pins 4 are guided when the chip 1 contacts with the contact pins 4, so that the contact effect of the chip 1 with the contact portion is ensured, and the stability and reliability of the chip 1 in use are further improved.

Referring to fig. 16a-16b, 18, 19a-19b, the present embodiment provides an ink cartridge 8 for detachably mounting on a holding portion 10 of a printer, wherein a chip 1 of any of the above embodiments is provided on the ink cartridge 8.

The ink box 8 provided by the embodiment ensures that the terminal in the chip 1 abandons the pointed bulge structure in the background technology by arranging the chip 1 in the embodiment, thereby reducing the difficulty of manufacturing and processing; specifically, be chip 1 wholly through being connected the combination with first chip portion and second chip portion for a part of at least one first logical groove is covered by at least a portion second contact portion, like this in the installation, first logical groove can play the guide effect to the contact pin, has avoided arousing the production of chip 1 contact dislocation condition easily, has guaranteed chip 1 and contact pin can be better contact, has guaranteed the normal result of use of ink horn 8 simultaneously, and then has improved the practicality of ink horn 8, is favorable to popularization and application in the market.

On the basis of the above-described embodiment, with continued reference to fig. 16a to 16b, the ink cartridge 8 in this embodiment is for mounting on the holding portion 10, the holding portion 10 being the holding portion 10 shown in fig. 17, specifically, the direction T is the direction in which the chip 1/ink cartridge 8 is mounted on the holding portion 10 for the specific structure of the holding portion 10. The holding portion 10 may simultaneously mount a plurality of ink cartridges 8, the plurality of ink cartridges 8 may be ink cartridges 8 of different colors or different widths, and as shown in fig. 17, the holding portion 10 has 4 mounting positions 1002, and the ink cartridges 8 may be mounted on the 4 mounting positions 1002. The holding portion 10 further includes: a restricted portion 1004, a stylus holder 1003, a stylus, and an ink needle 1001, wherein the restricted portion 1004 is used to restrict the ink cartridge 8, and prevent the ink cartridge 8 from moving in the-T direction and disengaging from the holding portion 10. The stylus holder 1003 is provided with a stylus, and the stylus holder 1003 can fix the stylus. The contact pins may be in contact with terminals on the chip 1 (including the first terminal 106 and the second terminal 206) to establish electrical communication between the cartridge 8 and the holder 10.

In addition, the specific implementation manner of the chip 1 mounted on the ink cartridge 8 in this embodiment is not limited, and a person skilled in the art may set the implementation manner according to specific design requirements, where, as shown in fig. 16a-16b, the ink cartridge 8 may include an ink outlet 803, a first housing 8011 and a second housing 8012 connected to the first housing 8011, the ink outlet 803 may be disposed at a lower end of the first housing 8011, a mounting portion 804 is disposed at a side portion of the second housing 8012, the chip 1 is mounted on the chip frame 9, and the chip frame 9 is mounted in the mounting portion 804 through an elastic member 806. Specifically, the side end of the mounting portion 804 may be provided with a track hole 805, and the chip rack 9 is provided with a rotation shaft 902 and a supporting portion 903, where the rotation shaft 902 is used to move along the track hole 805; when the chip carrier 9 is mounted in the mounting portion 804, the supporting portion 903 abuts against the elastic member 806. It is to be understood that the ink cartridge 8 in the present embodiment may further include a plurality of housings 801 to be mated, and is not limited to the first housing 8011 and the second housing 8012 described above.

In addition, as for the chip rack 9, referring to fig. 15 and 25, it can be seen that the chip rack 9 may include a lower bracket 905 movably connected to the upper bracket 904, a first chip portion fixed on the upper bracket 904, and a second chip portion fixed on the lower bracket 905, wherein the upper bracket 904 may move with the movement of the first chip portion, and the lower bracket 905 may move with the movement of the second chip portion. Specifically, the chip frame 9 may be provided with a positioning column 901, a rotation shaft 902, and a supporting portion 903, where the positioning column 901 cooperates with the positioning portion on the chip 1, so that the chip 1 may be fixed to the chip frame 9, and the chip 1 may move along with the movement of the chip frame 9. The rotation shaft 209 may move or rotate along a track hole 805 on the housing 801. The support portion 903 is a portion abutting against the elastic body, and the chip holder 9 can move and rotate along the trajectory hole 805 while pressing the elastic member 806 under an external force, and as shown in fig. 16b, when the ink cartridge 8 is mounted on the mounting portion 804 along the mounting direction T, the ink outlet 803 is engaged with the ink tube 1005, and the chip 1 is engaged with the stylus, thereby realizing the mounting of the chip 1 on the ink cartridge 8.

As for a specific structure of the ink cartridge 8, referring to fig. 18, in which the ink cartridge 8 is for mounting on the holding portion 10 as shown in fig. 17, specifically, the ink cartridge 8 may include a housing 801, a side portion of the housing 801 is provided with a chip frame 807, the chip frame 807 is connected to the chip 1, and the chip 1 is mounted on the housing 801 by the chip frame 807. An elastic member may be provided between the chip carrier 807 and the housing 801. A track hole 805 is provided at a side end of the housing 801, an operation portion 8071 is provided on the chip rack 807, and the chip rack 807 is mounted on the housing 801 by a rotation shaft 808, the rotation shaft 808 being for moving (moving or rotating) along the track hole 805; when pressure is applied to the operation portion 8071, the rotation shaft 808 moves (moves or rotates) along the track hole 805, and the chip 1 is mounted on the housing 801 along with the movement (movement or rotation) of the chip carrier 807.

Specifically, the ink cartridge 8 may further include a housing 801 and an ink outlet 803 disposed at a lower end of the housing 801, and unlike the embodiments shown in fig. 16a-16b, the chip 1 is connected to the chip holder 807 (may be directly connected, or may be connected through the chip holder 9 or an intermediate member), and the movement/rotation of the chip holder 807 may drive the chip 1 to move/rotate. When the ink cartridge 8 is mounted on the holding portion 10 in the mounting direction T with the ink cartridge 8, the operator's finger presses the operation portion 8071 of the chip rack 807, and the rotation shaft 808 of the chip rack 807 moves or rotates in the track hole 805, driving the chip 1 to move or rotate, whereby the position of the chip 1 changes from before, the chip 1 moves inside the ink cartridge 8 along with the chip rack 807, and then the ink cartridge 8 is mounted in the holding portion 10. When the ink cartridge 8 is taken out from the mounting portion 804 in a direction-T opposite to the mounting direction T, the operator's finger presses the operation portion 8071 of the chip rack 807, and the rotation shaft 808 of the chip rack 807 moves or rotates in the track hole 805, driving the chip 1 to move or rotate in a reverse direction, whereby the position of the chip 1 changes from before, the chip 1 moves with the movable member, breaks away from the stylus, and then the ink cartridge 8 is taken out from the holding portion 10; according to the process, the ink box 8 and the chip 1 are simple in mounting and dismounting process and easy to realize, and the practicability of the ink box 8 is improved.

Further, as for the structure of the holding portion 10, there is another structure, specifically referring to fig. 20 to 21, in which the structure of the ink cartridge 8 as shown in fig. 22 to 23 can be mounted, specifically, the holding portion 10 may include a restricted portion 1004, a catch hole 1007, an ink tube 1005, a stylus, and a lever 1006, wherein the restricted portion 1004 may have 2, one is a recessed structure, and one is provided on the lever 1006, the structure of the ink cartridge 8 adapted to be mounted in the holding portion 10 is as shown in fig. 22 to 23, specifically, both sides of the ink cartridge 8 are provided with a first catch 809 and a second catch 810, and when the ink cartridge 8 is mounted on the holding portion 10, the restricted portion 1004 is engaged with the first catch 809, the catch hole 1007 is engaged with the second catch 810, and the ink tube 1005 is engaged with the ink outlet 803, respectively.

As can be seen from fig. 27, the present embodiment provides a method for removing the ink cartridge 8 in fig. 16a-16b, 18, 19a-19b for being mounted in the holding portion 10 corresponding to fig. 17, when the ink cartridge 8 needs to be removed from the holding portion 10, wherein the ink cartridge is mounted with the chip in any one of the embodiments, and the ink cartridge includes a housing and a chip rack disposed on a side portion of the housing, and the chip rack is connected to the chip; the method comprises the following steps:

S101: moving the chip rack in a direction intersecting the mounting direction; wherein, the direction crossing the installation direction may be a direction inclined or perpendicular to the installation direction; specifically, the chip carrier is moved by applying pressure to the operation portion.

S102: the chip is separated from the contact pin along with the movement of the chip frame; since the chip is connected to the chip holder, the movement of the chip holder drives the chip to move, so that the chip is separated from the contact pins, and the positions of the chip and the contact pins are shown in fig. 24.

S103: and taking out the ink box.

The implementation process of the ink cartridge taking out in this embodiment is the same as the implementation process of the embodiment corresponding to fig. 18, and reference is specifically made to the above description, and details are not repeated here.

The method for taking out the ink box is simple in operation method and easy to realize, and is convenient for a user to replace and maintain the ink box in time, so that the practicability of the method for taking out the ink box is improved.

As can be seen from fig. 28, this embodiment provides another method for taking out the ink cartridge 8 in fig. 22-23, which is used to mount the ink cartridge 8 in the holding portion 10 corresponding to fig. 20-21, when the ink cartridge 8 needs to be detached from the holding portion 10, the ink cartridge is mounted with the chip in any one of the embodiments, and the first chip portion and the second chip portion in the chip are movably connected; the method comprises the following steps:

S201: the second chip portion is separated from the first chip portion when the first chip portion passes through the second group of contact pins;

s202: the second chip part is separated from the second group of contact pins;

s203: and taking out the ink box.

Specifically, when the ink cartridge is taken out in the-T direction, the positional relationship of the chip 1 and the contact pins 4 is as shown in fig. 22, the second terminals pass over the second group of contact pins 402 when the chip 1 is rotated and moved, and the ink cartridge can be taken out from the holding portion when the second terminals pass over the second group of contact pins 402. When the ink cartridge is taken out from the holding portion, as shown in fig. 26a, since the first chip portion and the second chip portion are movably connected, the second group of contact pins 402 is located on the upstream side in the direction-T, and therefore, the second group of contact pins 402 will block the second chip portion from continuing to move in the direction-T; as the cartridge continues to move in the direction-T, the first chip part is separated from the second chip part, i.e. the upper support 904 is separated from the lower support 905 in the drawing, while the chip and the chip holder 9 move and rotate along the trajectory of the trajectory hole under the dual force of the withdrawal force and the force imparted by the stylus to the second chip part, as shown in fig. 26 b. When the second terminal passes over the second group of contact pins 402, the contact pins are not exerting a force on the chip 1, and at this time, the ink cartridge can be taken out from the holding portion.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.

Claims

1. A chip for electrical connection with a contact pin in a printer holding part, characterized in that the chip comprises a first chip part and a second chip part, the first chip part is provided with a plurality of first terminals, the first terminals comprise first contact parts which are contacted with the contact pin, the second chip part is provided with a plurality of second terminals, the second terminals comprise second contact parts which are contacted with the contact pin, the first chip part comprises a first surface and a second surface which are oppositely arranged, the second chip part is connected with the first chip part, the first chip part is provided with a plurality of first through grooves for accommodating the contact pin, the first through grooves penetrate through the first surface and the second surface, and at least one part of the first through grooves is covered by at least one part of the second contact parts;

The second chip part comprises a first surface and a second surface which are oppositely arranged, a plurality of second through grooves used for accommodating the contact pins are arranged on the second chip part, the second through grooves penetrate through the first surface and the second surface, and at least one part of the second through grooves is covered by at least one part of the first contact part.

2. The chip of claim 1, wherein the first chip portion further comprises a third face intersecting the first and second faces, the first chip portion being viewed from a direction perpendicular to the third face, the first contact portion being disposed spaced apart from the first through slot.

3. The chip of claim 2, wherein the first chip portion further has a fourth face disposed opposite the third face, the first contact portion being closer to the third face than the fourth face; the first contact portion is disposed on an end portion of the third face that is close to the first chip portion.

4. The chip of claim 3, wherein the first contact portion is provided on any one of the first face, the second face, and the third face; or,

the first contact part is arranged on the first surface and the second surface; or,

The first contact part is arranged on the first surface and the third surface; or,

the first contact portion is disposed on the first, second, and third faces.

5. The chip of claim 4, wherein the second chip portion further comprises a third surface intersecting the first and second surfaces, the second chip portion being viewed from a direction perpendicular to the third surface, the second contact portion being spaced apart from the second through slot.

6. The chip of claim 5, wherein the second chip portion further has a fourth surface disposed opposite the third surface, the second contact portion being closer to the third surface than the fourth surface; the second contact portion is disposed on an end portion of the third surface near the second chip portion.

7. The chip of claim 6, wherein the second contact portion is provided on any one of the first surface, the second surface, and the third surface; or,

the second contact part is arranged on the first surface and the second surface; or,

the second contact part is arranged on the first surface and the third surface; or,

The second contact portion is disposed on the first, second and third surfaces.

8. The chip of claim 1, wherein the first chip portion abuts the second chip portion.

9. The chip of claim 8, wherein the first face of the first chip portion abuts the second face of the second chip portion.

10. A chip for electrical connection with contact pins in a printer holding portion, the contact pins including a first group of contact pins and a second group of contact pins having different heights and being staggered with each other, characterized in that the chip includes a first chip portion on which a plurality of first terminals are provided, the first terminals including a first contact portion with the first group of contact pins, and a second chip portion on which a plurality of second terminals are provided, the second terminals including a second contact portion with the second group of contact pins, the first chip portion including a first face and a second face disposed opposite to each other, the second chip portion being connected to the first chip portion, the first chip portion being provided with a plurality of first through grooves for accommodating the second group of contact pins, the first through grooves penetrating the first face and the second face, a portion of at least one of the first through grooves being covered by at least a portion of the second contact portion;

The second chip part comprises a first surface and a second surface which are oppositely arranged, a plurality of second through grooves used for accommodating the first group of contact pins are arranged on the second chip part, the second through grooves penetrate through the first surface and the second surface, and at least one part of the second through grooves is covered by at least one part of the first contact parts.

11. The chip of claim 10, wherein the second contact portion deforms under the force of contact imparted by the second set of contact pins to the second chip portion when the second contact portion is in contact with the second set of contact pins.

12. The chip of claim 11, wherein the second chip portion further comprises a third surface intersecting the first surface and the second surface, the second chip portion is a flexible board chip, and the deformed second contact portion is arranged in a row with the first contact portion when the chip is viewed in a direction perpendicular to the third surface of the second chip portion.

13. The chip of claim 10, wherein the second chip portion further comprises a third surface intersecting the first surface and the second surface, the second chip portion is a hard-sheet chip, the chip is viewed in a direction perpendicular to the third surface of the second chip portion,

After the chip contacts with the contact pins, the second contact parts and the first contact parts are arranged in two rows, and the second contact parts are arranged in the first through grooves.

14. The chip of claim 10, wherein the first chip portion and the second chip portion are connected by an intermediate portion disposed between the first chip portion and the second chip portion, the first chip portion further comprising a third face intersecting the first face and the second face, the chip being viewed from a direction perpendicular to the third face, the first contact portion and the second contact portion being disposed in a row.

15. The chip of claim 10, wherein the second chip part includes a joint part, the second terminal is connected to one side end of the joint part, and the first chip part is movably connected to the second chip part through the joint part.

16. The chip of claim 10, wherein the second chip portion moves under the force of contact imparted to the second chip portion by the second set of contact pins when the chip is in contact with the contact pins, the second chip portion being movable relative to the first chip portion.

17. The chip of any one of claims 10-16, wherein the first chip portion further comprises a third face intersecting the first face and the second face, the chip being viewed in a direction perpendicular to the third face of the first chip portion after the first chip portion is connected to the second chip portion, the first contact portion being spaced apart from the second contact portion.

18. The chip according to any one of claims 10-16, wherein the chip is further provided with a third terminal which is not in contact with the contact pin;

the third terminal is arranged on the first chip part; or,

the third terminal is arranged on the second chip part; or,

the third terminal is disposed on the first chip portion and the second chip portion.

19. The chip of any one of claims 10-16, wherein a third through slot is further provided in the first chip portion, the third through slot extending through the first and second faces;

the first contact part is arranged in the third through groove; or,

the first contact part is arranged on a first surface or a second surface on the edge of the third through groove; or,

The first contact part is arranged on a first surface and a second surface on the edge of the third through groove; or,

the first contact part is arranged in the first surface, the second surface and the third through groove.

20. An ink cartridge for removable mounting on a holder of a printer, comprising the chip of any one of claims 1-19.

21. The ink cartridge as claimed in claim 20, wherein the ink cartridge includes a case, a side portion of the case being provided with a mounting portion, the chip being mounted on a chip carrier; the mounting portion may mount at least a portion of the chip and the chip carrier.

22. The ink cartridge as in claim 21, wherein an elastic member is disposed between the chip carrier and the housing; the side end of the mounting part is provided with a track hole, the chip rack is provided with a rotating shaft and a supporting part, and the rotating shaft can move along the track hole; when the chip rack is installed in the ink box, the supporting part is abutted with the elastic piece.

23. The ink cartridge of claim 22, wherein the chip holder is further provided with an operation portion, and when the chip contacts the operation portion, a force is applied to the operation portion, and the chip holder and the chip move along the trajectory hole.

24. The ink cartridge of claim 21, wherein the chip carrier includes a lower carrier movably coupled to the upper carrier, the first chip portion being secured to the upper carrier, the second chip portion being secured to the lower carrier.