CN109080014A - A kind of brill processing method - Google Patents
A kind of brill processing method Download PDFInfo
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- CN109080014A CN109080014A CN201811009214.XA CN201811009214A CN109080014A CN 109080014 A CN109080014 A CN 109080014A CN 201811009214 A CN201811009214 A CN 201811009214A CN 109080014 A CN109080014 A CN 109080014A
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- China
- Prior art keywords
- workpiece
- processing method
- brill
- protective plate
- processed
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/021—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by drilling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Drilling And Boring (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Jigs For Machine Tools (AREA)
Abstract
A kind of brill processing method, is related to technical field of mechanical processing, comprising: fixes a protective plate in two end faces of workpiece to be processed, forms one and bore processing assembly；Brill processing is carried out to brill processing assembly；The hardness number for the workpiece to be processed that the hardness of the protective plate is 70%~130%.The brill processing method of the embodiment of the present invention, which can reduce, bores the mechanical damage caused by two end faces of workpiece in process.
Description
Technical field
This application involves but be not limited to technical field of mechanical processing, and in particular to a kind of brill processing method.
Background technique
In semiconductor single crystal material processing, due to crystal growth cycles length, complex process and mold limitation etc., no
The crystal of all specifications may be grown, processing is usually bored on drilling machine according to the hollow drill bit of the customized different size of production requirement
Required cylindrical body out.When boring processing, crystal to be processed is mounted on Drilling machines bench in such a way that bonding or fixture are fixed
On, brill process operation is carried out according to setting program.After boring process finishing, then by crystal removal.
It bores in process, is easy to cause the end face of crystalline material mechanical damage, and this mechanical damage needs are subsequent
It is cut off in technique.
Summary of the invention
For boring in process, workpiece is easy mechanically damaged problem, and the embodiment of the present invention provides a kind of bore and adds
Work method, comprising: fix a protective plate in two end faces of workpiece to be processed, form one and bore processing assembly；To the brill
Processing assembly carries out brill processing；The hardness number for the workpiece to be processed that the hardness of the protective plate is 70%~130%.
The utility model has the advantages that
The brill processing method of the embodiment of the present invention fixes a protective plate in two end faces of workpiece to be processed, due to
The shock absorbing effect of protective plate, to effectively reduce the damage of the machinery caused by two end faces of workpiece in boring process
Wound.
Detailed description of the invention
Attached drawing is used to provide to further understand technical solution of the present invention, and constitutes part of specification, with this
Inventive embodiments technical solution for explaining the present invention together, does not constitute the limitation to technical solution of the present invention.
Fig. 1 is the brill process schematic diagram of one embodiment of the invention；
In the figure, it is marked as 1, upper protective plate, 2, lower protective plate, 3, workpiece, 4, binder, 5, Drilling machines bench, 6, fixture,
7, drill bit, 8, hollow connecting pin.
The direction of two arrows meaning in figure is respectively the direction of rotation of drill bit and direction of feed in one embodiment of the invention.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.It is understood that
It is that specific embodiment described herein is used only for explaining the application, rather than the restriction to the application.
In machining, bores processing and generally refer to that circle under hollow drill bit is bored from workpiece to be processed is installed in mechanical drill
The operation of cylinder.In photovoltaic cell field, it often may require that cylindrical body required under boring from semiconductor single crystal material, some brills
In processing method, two end faces of worked crystal are bored all without any safeguard measure.In boring process, drill bit is according to setting
Before and after program contacts crystal, chisel edge is there are one without stress to the change procedure of unexpected stress.The mutation table of bit force
Now increase for the swing of drill bit, this swing can just reduce until drill bit pierces 1-3mm in crystal, and this swing can be to brill
The crystal end-face of head starting drilling causes big mechanical damage.Similarly, it processes latter stage boring, i.e., drill bit is from stress to not stressing
In the process, the unexpected release of pressure, the crystal end-face that can also stretch out to drill bit cause mechanical damage.This brill processing method for
The crystalline material of bad mechanical property, such as GaAs, indium phosphide and germanium fragile material can all cause two end faces of crystalline material
Mechanical damage, and this mechanical damage needs to cut off in subsequent technique.
For some brittleness monocrystal materials, such as GaAs, indium phosphide, the mechanical end face damage for boring processing introducing will certainly
Cause rear road be sliced or edging processing in wafer breakage, so farthest reduce mechanical damage should each link first
Consider and solves.
In one embodiment of the invention, on the basis of above-mentioned brill processing method, to two ends of crystal to be machined material
Face is protected, and bores processing link to the mechanical damage of two end faces of crystal to be effectively reduced.
In specific implementation, a kind of brill processing method, comprising: a protective plate is fixed in two end faces of workpiece to be processed,
It forms one and bores processing assembly；Brill processing is carried out to brill processing assembly；The hardness of the protective plate is 70%~130%
Workpiece to be processed hardness number.
Wherein, two end faces of workpiece to be processed refer to that two end faces of the cylindrical body under boring in boring process are being bored
The end face of workpiece to be processed where before lower.
As an implementation, the protective plate is by gripping means grips on the end face of workpiece to be processed.
As another embodiment, the protective plate is fixed on the end face of workpiece to be processed using binder.
In the present embodiment, after carrying out brill processing to brill processing assembly, the brill processing method further include: will be described
Processing assembly heating water bath is bored to remove binder.
Wherein, the binder can be at least one of paraffin, rosin.For example paraffin is individually used, or use
The mixture of paraffin and rosin.
The binder can also be good using caking property, and the glue of cleaning is easy after boring processing, and glue can be
Epoxide-resin glue, uses the epoxide-resin glue of AB component in the embodiment of the present invention, and the main component of component A is epoxy resin, molten
Agent and auxiliary agent, the main component of B component are curing agent, solvent and auxiliary agent.In view of the cleaning technology of glue and operation after brill processing
Complexity, it is proposed that using the AB glue of following product: the AD1230A/AD3831BR glue of Valtech company production, AD1238A/
AD3848BR glue and AD1339A/ADB glue.
About the selection of binder, not only need in view of bond effect, also need to consider to bore it is easy to clean after processing and
Workpiece end face will not be caused to damage.Such as paraffin or rosin binder, after completing to bore processing, processing combination can will be bored
Fixture progress wax in 60-80 DEG C of water-bath used in body and brill process operates, and the general used time is at 10~30 points
Clock.For selecting epoxide-resin glue that can equally remove photoresist in 60-80 DEG C of water-bath as binder, but the time of removing photoresist is basic
At 12 hours or more, processing efficiency can be seriously affected, if if in order to shorten the time of removing photoresist, it may be considered that use volume fraction for
For 5%~15% industrial acetic as water-bath medium, the time that can will remove photoresist shortens about 1/2, with about when 4~5 hours.
When binder uses at least one of paraffin and rosin, both protective plate and workpiece to be processed are bonded together
Operating method are as follows: protective plate is heated to the melt temperature of binder used, smears the binder in the one side of protective plate,
After to be bonded dose melts, the end face of protective plate and workpiece to be processed is bonded.
When binder uses epoxide-resin glue, glue is applied on protective plate, then by protective plate and work to be processed
The end face of part bonds.The epoxide-resin glue of AB component is needed for component A and B component to be uniformly mixed before use, then be used.Ring
The general room temperature of oxygen resin glue, that is, curable, therefore do not need Heating guard plate.
About the selection of protective plate, the hardness of protective plate need to be close to the hardness of workpiece to be processed, and the hardness of protective plate can be with
For the hardness number of ± 30% workpiece to be processed, i.e., the hardness number of 70%~130% workpiece to be processed, this hardness can preferably be delayed
The swing that percussion bit occurs when pulling out of hole and terminating to bore processing due to stress change, to can effectively avoid caused by workpiece
Mechanical damage.With no restrictions to the material of protective plate, as long as hardness meets above-mentioned requirements, and meet in certain temperature range without meat
The identifiable deflection of eye, does not decompose, is not soluble in water, can fit closely with the end face of workpiece to be processed, that is, meet technique
It needs.Such as the various plates such as waste material or epoxy resin board, phenolic resin plate that workpiece to be processed can be used.Separately
Outside, in practical applications, the size of protective plate only needs to guarantee to have protective plate covering in the brill machining area of workpiece to be processed i.e.
Can, can by protective plate be dimensioned to than bore drill bit for machining outer diameter it is 10mm or more big；In view of boring processing efficiency, protection
Plate thickness is set as 5-10mm.It both may be implemented to improve in this way and bore workpieces processing end face mass effect, be also unlikely to excessively to influence
Bore processing efficiency.
A complete specific embodiment is given below.
Workpiece 3 to be processed is by taking semiconductor single crystal material as an example, such as the brittleness material such as can be GaAs, indium phosphide and germanium
Material, upper protective plate 1 and lower protective plate 2 are all made of the hardness resin backing plate close with the material hardness of workpiece 3, and binder 4 uses
Paraffin.
As shown in Figure 1, electric furnace is arranged 80-150 DEG C of temperature, two resin backing plates are placed on electric furnace heating and equal
Even smearing paraffin.After paraffin melting, two resin backing plates are removed, it is bonding with upper and lower two end faces of workpiece 3 respectively, it compresses
And guarantee that resin backing plate can be with the end face of all standing workpiece 3.After paraffin cooling is firmly bonded, by workpiece 3 and two resin backing plates
Assembly be fixed on Drilling machines bench 5, fixed form is fixed using fixture 6.After having confirmed processing program, drill bit 7 with
It constant speed high speed rotation and moves downward, carries out brill process operation according to setting program.It is entire to bore in process, from brill
The hollow connecting pin 8 of first 7 tail portion is interior to inject cooling water, and cooling water is sprayed from the interior of drill bit 7 when boring processing, realization pair
The cooling of workpiece 3 and waste material rinse.When the drill-through workpiece 3 of drill bit 7 reaches the resin backing plate of lower end surface, 7 feed-disabling of drill bit, so
It is retreated afterwards with constant speed and completes to reset, prepare next processing flow.It completes after boring processing, by workpiece 3 and two resin backing plates
Assembly unloading, is subsequently placed in 10-30 minutes progress wax in 60-80 DEG C of water-bath.It can be added in water-bath certain
The change cerate of concentration can effectively clear up remaining wax on workpiece 3.
In the present embodiment, upper protective plate 1 and lower protective plate 2 are all made of the hardness resin close with the material hardness of workpiece 3
Backing plate.It is raw that 10000 years graphite product Chang Deng domestic production producers of Suzhou Jing Xiang new energy Co., Ltd or Jiangsu Haimen specifically can be used
The epoxy resin board of production.Used epoxy resin board is uniformly mixed by raw material such as epoxy resin, filler, curing agent, warp
The road Guo Ji high temperature bakes, and is solidified into board-like material, then becomes the epoxy resin board met the requirements, color by machining
Generally white, surface is fine and smooth, fine and close.Filler can be alumina powder, real by the mixed ratio for controlling alumina packing
The hardness of existing epoxy resin board and the adjusting of deflection.In the present embodiment, phenolic aldehyde is also can be used in upper protective plate 1 and lower protective plate 2
Resin plate, phenolic resin plate are also known as phenolic resin laminated plates, and principle is immersed in phenolic resin using processing paper (insulating paper),
It is pressed via hot press, is plate laminated product.The GFN system of current Suzhou Guang Hui Science and Technology Ltd. of domestic manufacturer production
Column phenolic resin plate, as the GFN6000 of GFN5000 and the 6mm thickness of GFN3000,5mm thickness of 3mm thickness is used equally for the present embodiment
Bore the protective plate of processing.
In the present embodiment, it is used as protection and padded coaming in two end face binding resin backing plates of crystalline material to be processed,
High-speed rotating drill bit can farthest be improved when starting contact workpiece and boring process finishing, because stress variation causes
Vibration and the mechanical damage caused by crystalline material end face.
In addition, select paraffin to be adhesively fixed as binder in the fixation of both resin backing plate and crystalline material,
Bond effect is good and easy to clean.Traditional gluing knot is avoided to be difficult to the problem of clearing up, farthest protect crystalline material.
In the description of the embodiment of the present invention, it should be noted that the "upper" that is indicated in the upper surface and lower end surface of workpiece,
"lower" orientation or positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description embodiment of the present invention
Simplify description, rather than the structure of indication or suggestion meaning with specific orientation, be constructed and operated in a specific orientation, because
This should not be understood as the limitation to the application.
Claims (10)
1. a kind of brill processing method, comprising:
A protective plate is fixed in two end faces of workpiece to be processed, one is formed and bores processing assembly；
Brill processing is carried out to brill processing assembly；
Wherein, the hardness number for the workpiece to be processed that the hardness of the protective plate is 70%~130%.
2. boring processing method as described in claim 1, it is characterised in that: the protective plate is fixed on to be processed using binder
On the end face of workpiece.
3. boring processing method as claimed in claim 2, it is characterised in that: the binder is at least one in paraffin and rosin
Kind.
4. boring processing method as claimed in claim 3, which is characterized in that
It includes: that protective plate is heated to binder used that a protective plate step is fixed in two end faces in workpiece to be processed
Melt temperature, the binder is smeared in the one side of protective plate, after to be bonded dose melts, by protective plate and workpiece to be processed
End face bonding.
5. boring processing method as claimed in claim 3, which is characterized in that
After carrying out brill processing to brill processing assembly, the brill processing method further include: set brill processing assembly
It is heated 10~30 minutes in 60-80 DEG C of water-bath, to remove binder.
6. boring processing method as claimed in claim 2, it is characterised in that: the binder is epoxide-resin glue.
7. boring processing method as claimed in claim 6, it is characterised in that:
After carrying out brill processing to brill processing assembly, the brill processing method further include: set brill processing assembly
It in the acetic acid that volume fraction is 5%~15%, and is heated 4~5 hours at a temperature of 60-80 DEG C, to remove binder.
8. boring processing method as described in claim 1, it is characterised in that: the protective plate is epoxy resin board or phenolic resin
Plate.
9. boring processing method as described in claim 1, it is characterised in that: the workpiece to be processed is semiconductor single crystal material.
10. boring processing method as claimed in claim 9, it is characterised in that: the material of the workpiece to be processed is GaAs, phosphorus
Change indium or germanium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811009214.XA CN109080014A (en) | 2018-08-31 | 2018-08-31 | A kind of brill processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811009214.XA CN109080014A (en) | 2018-08-31 | 2018-08-31 | A kind of brill processing method |
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| Publication Number | Publication Date |
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| CN109080014A true CN109080014A (en) | 2018-12-25 |
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| CN201811009214.XA Pending CN109080014A (en) | 2018-08-31 | 2018-08-31 | A kind of brill processing method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1467796A (en) * | 2002-06-10 | 2004-01-14 | �ն��繤��ʽ���� | Adhesive sheet for dicing glass substrate and method of dicing glass substrate |
| CN102285011A (en) * | 2011-08-07 | 2011-12-21 | 江西金葵能源科技有限公司 | Method for cutting solar-grade polycrystalline silicon sheets by using diamond wires |
| CN102959626A (en) * | 2010-09-30 | 2013-03-06 | Hoya株式会社 | Method for manufacturing magnetic-disk glass substrate |
| CN104690615A (en) * | 2015-03-20 | 2015-06-10 | 肖衍盛 | Processing method for drilling sapphire glass |
| CN105084749A (en) * | 2014-05-04 | 2015-11-25 | 黄家军 | Glass disc cutting method |
| CN105690585A (en) * | 2016-03-22 | 2016-06-22 | 沈丽明 | Multi-line cutting process of tantalic acid gallium lanthanum crystal |
-
2018
- 2018-08-31 CN CN201811009214.XA patent/CN109080014A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1467796A (en) * | 2002-06-10 | 2004-01-14 | �ն��繤��ʽ���� | Adhesive sheet for dicing glass substrate and method of dicing glass substrate |
| CN102959626A (en) * | 2010-09-30 | 2013-03-06 | Hoya株式会社 | Method for manufacturing magnetic-disk glass substrate |
| CN102285011A (en) * | 2011-08-07 | 2011-12-21 | 江西金葵能源科技有限公司 | Method for cutting solar-grade polycrystalline silicon sheets by using diamond wires |
| CN105084749A (en) * | 2014-05-04 | 2015-11-25 | 黄家军 | Glass disc cutting method |
| CN104690615A (en) * | 2015-03-20 | 2015-06-10 | 肖衍盛 | Processing method for drilling sapphire glass |
| CN105690585A (en) * | 2016-03-22 | 2016-06-22 | 沈丽明 | Multi-line cutting process of tantalic acid gallium lanthanum crystal |
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Application publication date: 20181225 |