CN105084749A

CN105084749A - Glass disc cutting method

Info

Publication number: CN105084749A
Application number: CN201410195089.1A
Authority: CN
Inventors: 黄家军
Original assignee: Individual
Current assignee: Individual
Priority date: 2014-05-04
Filing date: 2014-05-04
Publication date: 2015-11-25

Abstract

The present invention provides a glass disc cutting method. The method is characterized in that flat glass is bonded to a liner of whom the strength and material is similar to those of the plat glass by an adhesive before cutting. For example, when flat glass is used as the liner, upper glass and lower glass is bonded together, so that during a process of the upper layer glass being cut by a lip of a hollow drill, when the upper glass left only about 1 mm, as the strength of the lower layer glass is the same as that of the upper layer glass, during the drill lip pushing, downward bending deformation of the glass under the drill lip is effectively limited due to the support of the lower glass, thereby avoiding crack edges.

Description

A kind of cutting method of glass wafer

Technical field

The invention belongs to glass processing field, especially a kind of cutting method of glass wafer.

Technical background

The glass wafer of less than one square centimeter, by laser cutting, the glass wafer periphery cut out is neat, attractive in appearance, but efficiency is low, cost is high.Also can drill through with diamond glass drill bit, but lower edge easily fried limit.The reason on fried limit is caused to be that drill bit moves downward a downward pressure, when the thickness of glass under drill bit blade is at below 1mm, just can not bear the pressure under drill bit, high speed rotating drill bit also has dynamic impact forces to glass in addition, and glass is material crisp especially, fried limit is also just difficult to avoid.Conventional solution is exactly respectively install a hollow boring bit up and down, and two drill bits drill through relatively, below drill bit upwards subdrilling 1-2mm, then above drill bit bores downwards again.Fried limit problem can be solved to a certain extent although it is so, but upper and lower two drill bits will be kept coaxial then very difficult.The sidewall of the glass wafer adopting such method to get out has one and significantly bores trace, causing this phenomenon to obtain reason is that upper and lower drill bit disalignment causes.

Summary of the invention

The present invention is to provide a kind of glass wafer cutting method, it is characterized in that: first stick with glue agent before cutting and sheet glass is bonded on the liner plate of the intensity material close with glass.Such as do liner plate with sheet glass, upper and lower two blocks of glass are bonded together, like this when the glass on upper strata is by hollow drill drill lip cutting process, when upper strata glass is only left 1 millimeter, due to lower floor's glass support, and lower floor's glass is identical with upper strata strength of glass, and such drill lip presses down, the downward flexural deformation of glass under drill lip is limited reliably, this avoid the phenomenon on fried limit.If glass is bonded on the lower plank of hardness, because plank hardness is little, can also have larger distortion under ambient pressure, more weak to glass support effect below drill lip like this, glass can also have larger distortion, or easily causes fried limit.Certain liner plate strength ratio glass is larger to be also fine.

The cutting method of above-mentioned glass wafer, what it is characterized in that glass-cutting is hollow boring bit.

Above-mentioned glass wafer cutting method, is characterized in that hollow boring bit glass-cutting liquid cooling.Generally use water cooling.

Above-mentioned glass wafer cutting method, the glue of the upper and lower two-layer sheet glass that it is characterized in that boning can be organic gel, also can be inorganic glue.

Above-mentioned glass wafer cutting method, is characterized in that to add one deck liner plate in face on a glass to prevent glass wafer upper surface from exploding limit, when drill speed is lower (such as per minute tens forwards two or three hundred turns to), also can not add upper liner.Such as make upper liner with the glass of 2-3 mm thick.That time of the bit contact glass surface of high speed rotating can produce moment impact, rotating speed is higher, feeding speed is faster, then impact also larger, this just easily causes glass wafer upper surface to explode limit, and terms of settlement has two, and one is reduce bit rotation velocity and feeding speed, two is that face adds one deck liner plate on a glass, the impact produced during drilling by liner plate bears drill bit.After drill bit pierces certain depth downwards, the whole sword face of drill bit will combined glass glass reliable contacts, and drill bit is smooth running under the restriction of glass, and surging force is also just little.

Of the present invention benefiting is, owing to there being the protection of levels liner plate, and middle viscose glue is fixing, can not explode limit like this at cutting process middle layer glass wafer, and glass is cut completely, and glass wafer is still bonded on liner plate, can not explode limit.Such simple glass tapping machine can excise high-quality glass wafer.

Accompanying drawing explanation

Fig. 1 is fried limit glass wafer schematic diagram

The sheet glass of Tu2Shi You lower floor liner plate

Tu3Shi You lower floor liner plate glass wafer

Fig. 4 has levels liner plate glass wafer

1-sheet glass, 2-adhesive-layer, 3-lower floor liner plate, 4-lower floor liner plate, 5-adhesive-layer, 6-glass wafer, 7-adhesive-layer, 8-upper liner

Embodiment

Fig. 1 is fried limit glass wafer schematic diagram.Glass wafer edge is broken.

The sheet glass of Tu2Shi You lower floor liner plate, has sheet glass 1, middle adhesive-layer 2 and lower floor's liner plate 3 to form, lower floor's liner plate 3 be 3 mm thick common building sheet glass.Sheet glass is common building sheet glass, and viscose glue is with the good glue paste of taxi driver brothers.The sheet glass glued is put into glass punching machine hole.Drill bit is hollow drill bit.With both sides inside and outside water cooling hollow drill bit in boring procedure.After drilling through sheet glass, the glass wafer taken off as shown in Figure 3.By upper strata glass wafer 6, middle adhesive-layer 5 and lower floor's liner plate glass wafer 4 are formed, the lower surface of glass wafer 6 owing to having liner plate sheet glass 3 to support in drilling process and adhesive-layer 2 fixing, so can not limit be exploded.And as the lower surface of the glass wafer 4 of liner plate because below is without closely to support and fixing, so still can limit be exploded.Sheet glass in Fig. 3 is put into water boiling, then disk 4 and disk 6 separately, so just can obtain a complete glass wafer 6.

When boning layer glass plate, adhesive linkage can be as far as possible thinner, can save viscose glue on the one hand, and the distortion of adhesive-layer also can be lacked on the other hand, avoids the generation of fried limit situation.

As shown in Figure 4, this is the glass wafer cut from the glass multi-ply wood that triplex glass is bonded together.Upper and lower layer glass is liner plate.Glass wafer 8 and 4 is as liner plate, protection intermediate glass disk 6.When hollow glass bore start rotating speed high, enter drilling speed degree too fast time, will cause very large impact to glass top surface, such impact also can cause glass wafer 8 upper surface to explode limit.In this three layer interlayers glass, wherein the upper and lower glass can be thinner, and we use the glass that 2-3MM is thick, and middle layer glass is that we will drill through, upper strata glass bears the impact just starting bit contact and bring, and lower floor's glass then gets up to support and the effect of fixing intermediate glass.When drill bit gos deep into the superiors glass 1--2 mm thick, drill bit and glass close contact, the swing of the circumferential direction of upper strata glass restriction drill bit, just reduces a lot to the impact of glass like this.After increasing protection liner plate, owing to there being the protection of liner plate, the surging force of drill bit reduces, and so just can improve the speed of rotation of drill bit, improves drilling disk efficiency.

Above example is just to an explanation of the present invention, Fig. 4 is that triplex glass is bonded together, and we can also more multi-layered glassy bond together certainly, and such as five layers of glassy bond together, such cutting efficiency is higher, and this all should be included within the scope of the claims in the present invention.

Claims

1. a glass wafer cutting method, is characterized in that: first stick with glue agent before cutting and sheet glass is bonded on the liner plate of the intensity material close with glass.

2. the cutting method of glass wafer according to claim 1, what it is characterized in that glass-cutting is hollow boring bit.

3. glass wafer cutting method according to claim 1, is characterized in that hollow boring bit glass-cutting liquid cooling.Generally use water cooling.

4. glass wafer cutting method according to claim 1, the glue of the upper and lower two-layer sheet glass that it is characterized in that boning can be organic gel, also can be inorganic glue.

5. glass wafer cutting method according to claim 1, is characterized in that to add one deck liner plate in face on a glass to prevent glass wafer upper surface from exploding limit, when drill speed is lower, also can not add upper liner.