CN109032303A - A kind of thermally conductive ointment preparation of computer CPU heat sink - Google Patents
A kind of thermally conductive ointment preparation of computer CPU heat sink Download PDFInfo
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- CN109032303A CN109032303A CN201810888913.XA CN201810888913A CN109032303A CN 109032303 A CN109032303 A CN 109032303A CN 201810888913 A CN201810888913 A CN 201810888913A CN 109032303 A CN109032303 A CN 109032303A
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- zinc oxide
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- xylene
- ammonium chloride
- boron nitride
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- 238000002360 preparation method Methods 0.000 title claims description 3
- 239000002674 ointment Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 39
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims abstract description 37
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 14
- 235000019270 ammonium chloride Nutrition 0.000 claims abstract description 13
- 239000011790 ferrous sulphate Substances 0.000 claims abstract description 13
- 235000003891 ferrous sulphate Nutrition 0.000 claims abstract description 13
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims abstract description 13
- 229910000359 iron(II) sulfate Inorganic materials 0.000 claims abstract description 13
- 229960001922 sodium perborate Drugs 0.000 claims abstract description 13
- YKLJGMBLPUQQOI-UHFFFAOYSA-M sodium;oxidooxy(oxo)borane Chemical compound [Na+].[O-]OB=O YKLJGMBLPUQQOI-UHFFFAOYSA-M 0.000 claims abstract description 13
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 48
- 239000011787 zinc oxide Substances 0.000 claims description 24
- 229910052582 BN Inorganic materials 0.000 claims description 12
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 12
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052921 ammonium sulfate Inorganic materials 0.000 claims description 12
- 235000011130 ammonium sulphate Nutrition 0.000 claims description 12
- 239000002105 nanoparticle Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 239000011863 silicon-based powder Substances 0.000 claims description 12
- 239000008096 xylene Substances 0.000 claims description 12
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 12
- 229910021485 fumed silica Inorganic materials 0.000 claims description 11
- -1 sodium fluorosilicate Chemical compound 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims 1
- JZJNHPJBZWEHPD-UHFFFAOYSA-N [F].[Na] Chemical compound [F].[Na] JZJNHPJBZWEHPD-UHFFFAOYSA-N 0.000 claims 1
- 229910052911 sodium silicate Inorganic materials 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- Organic Chemistry (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明公开了一种计算机CPU散热器用导热膏制备方法，由纳米级氧化锌颗粒、硅粉、氮化硼、二甲苯、氧化锌、氟硅酸钠、二氧化硅、硫酸铵、硅酸锆、氯化铵、过硼酸钠、硫酸亚铁、氢氧化钾、气相二氧化硅制成，与现有技术相比，本发明的配方制成的导热膏具有高效的粘性，将CPU与散热器良好的贴覆，贴覆后的散热器能够良好的传导CPU上的热量，从而提高散热性能，具有推广应用的价值。The invention discloses a method for preparing a heat conduction paste for a computer CPU heat sink. , ammonium chloride, sodium perborate, ferrous sulfate, potassium hydroxide, and fumed silicon dioxide. Compared with the prior art, the thermal paste made by the formula of the present invention has high-efficiency viscosity. Good coating, the heat sink after coating can well conduct the heat on the CPU, thereby improving the heat dissipation performance, and has the value of popularization and application.
Description
技术领域technical field
本发明涉及一种计算机维护用品，尤其涉及一种计算机CPU散热器用导热膏制备方法。The invention relates to a computer maintenance article, in particular to a method for preparing a heat conduction paste for a computer CPU radiator.
背景技术Background technique
导热膏是用来填充CPU与散热片之间的空隙的材料的一种，这种材料又称之为热界面材料。其作用是用来向散热片传导CPU散发出来的热量，继而通过散热片向外部散发热量，使CPU温度保持在一个可以稳定工作的水平，防止CPU因为散热不良而损毁，并延长使用寿命。现有技术中，计算机的CPU导热膏的导热性能较低，从而降低了散热器的使用效果，因此，需要不断的改进与创新。Thermal paste is a kind of material used to fill the gap between the CPU and the heat sink. This material is also called thermal interface material. Its function is to conduct the heat emitted by the CPU to the heat sink, and then dissipate the heat to the outside through the heat sink, so that the CPU temperature can be kept at a level that can work stably, preventing the CPU from being damaged due to poor heat dissipation, and prolonging the service life. In the prior art, the heat conduction performance of the CPU heat conduction paste of the computer is low, thereby reducing the use effect of the heat sink, therefore, continuous improvement and innovation are required.
发明内容Contents of the invention
本发明的目的就在于为了解决上述问题而提供一种计算机CPU散热器用导热膏制备方法。The object of the present invention is just to provide a kind of preparation method of heat conduction paste for computer CPU radiator in order to solve the above problems.
本发明通过以下技术方案来实现上述目的：The present invention achieves the above object through the following technical solutions:
本发明包括以下步骤：The present invention comprises the following steps:
（1）准备纳米级氧化锌颗粒、硅粉、氮化硼、二甲苯、氧化锌、氟硅酸钠、二氧化硅、硫酸铵、硅酸锆、氯化铵、过硼酸钠、硫酸亚铁、氢氧化钾、气相二氧化硅；(1) Prepare nano-sized zinc oxide particles, silicon powder, boron nitride, xylene, zinc oxide, sodium fluorosilicate, silicon dioxide, ammonium sulfate, zirconium silicate, ammonium chloride, sodium perborate, ferrous sulfate , potassium hydroxide, fumed silica;
（2）精准称取所述纳米级氧化锌颗粒10-20g、所述硅粉53-6g、所述氮化硼1-3g、所述二甲苯0.5-2g、所述氧化锌0.2-6g、所述氟硅酸钠10-15g、所述二氧化硅1-5g、所述硫酸铵0.5-2g、所述硅酸锆4-6g、所述氯化铵3-5g、所述过硼酸钠4-7g、所述硫酸亚铁0.2-1.2g、所述氢氧化钾1-3g、所述气相二氧化硅0.5-1g备用；(2) Accurately weigh 10-20g of the nano-sized zinc oxide particles, 53-6g of the silicon powder, 1-3g of the boron nitride, 0.5-2g of the xylene, 0.2-6g of the zinc oxide, The sodium fluorosilicate 10-15g, the silicon dioxide 1-5g, the ammonium sulfate 0.5-2g, the zirconium silicate 4-6g, the ammonium chloride 3-5g, the sodium perborate 4-7g, 0.2-1.2g of the ferrous sulfate, 1-3g of the potassium hydroxide, and 0.5-1g of the fumed silica are used for later use;
（3）将纳米级氧化锌颗粒、硅粉、氮化硼、二甲苯、氧化锌、氟硅酸钠混合，进行充分搅拌；(3) Mix nano-sized zinc oxide particles, silicon powder, boron nitride, xylene, zinc oxide, and sodium fluorosilicate, and fully stir;
（4）加入二氧化硅、硫酸铵、硅酸锆、氯化铵混合；(4) Add silica, ammonium sulfate, zirconium silicate and ammonium chloride to mix;
（5）加过硼酸钠、硫酸亚铁在温度200℃、1000r/min条件下分散；(5) Add sodium perborate and ferrous sulfate to disperse at a temperature of 200°C and 1000r/min;
（6）加入氢氧化钾、气相二氧化硅充分搅拌出料；(6) Add potassium hydroxide and fumed silica to fully stir and discharge;
（7）出料后冷却包装即制得导热膏。(7) Cool the package after discharge to obtain thermal paste.
优选的，所述步骤（2）中含所述纳米级氧化锌颗粒15g、所述硅粉5g、所述氮化硼2g、所述二甲苯1g、所述氧化锌5g、所述氟硅酸钠12g、所述二氧化硅3g、所述硫酸铵1g、所述硅酸锆5g、所述氯化铵5g、所述过硼酸钠5g、所述硫酸亚铁1g、所述氢氧化钾2g、所述气相二氧化硅1g。Preferably, the step (2) contains 15g of the nano-sized zinc oxide particles, 5g of the silicon powder, 2g of the boron nitride, 1g of the xylene, 5g of the zinc oxide, and the fluorosilicic acid Sodium 12g, the silicon dioxide 3g, the ammonium sulfate 1g, the zirconium silicate 5g, the ammonium chloride 5g, the sodium perborate 5g, the ferrous sulfate 1g, the potassium hydroxide 2g , 1 g of the fumed silica.
本发明的有益效果在于：The beneficial effects of the present invention are:
本发明是一种计算机CPU散热器用导热膏制备方法，与现有技术相比，本发明的配方制成的导热膏具有高效的粘性，将CPU与散热器良好的贴覆，贴覆后的散热器能够良好的传导CPU上的热量，从而提高散热性能，具有推广应用的价值。The invention relates to a method for preparing a heat conduction paste for a computer CPU heat sink. Compared with the prior art, the heat conduction paste made of the formula of the present invention has high-efficiency viscosity, and the CPU and the heat sink are well pasted, and the heat dissipation after pasting is excellent. The cooler can well conduct the heat on the CPU, thereby improving the heat dissipation performance, and has the value of popularization and application.
具体实施方式Detailed ways
下面对本发明作进一步说明：The present invention will be further described below:
本发明包括以下步骤：The present invention comprises the following steps:
（1）准备纳米级氧化锌颗粒、硅粉、氮化硼、二甲苯、氧化锌、氟硅酸钠、二氧化硅、硫酸铵、硅酸锆、氯化铵、过硼酸钠、硫酸亚铁、氢氧化钾、气相二氧化硅；(1) Prepare nano-sized zinc oxide particles, silicon powder, boron nitride, xylene, zinc oxide, sodium fluorosilicate, silicon dioxide, ammonium sulfate, zirconium silicate, ammonium chloride, sodium perborate, ferrous sulfate , potassium hydroxide, fumed silica;
（2）精准称取所述纳米级氧化锌颗粒10-20g、所述硅粉53-6g、所述氮化硼1-3g、所述二甲苯0.5-2g、所述氧化锌0.2-6g、所述氟硅酸钠10-15g、所述二氧化硅1-5g、所述硫酸铵0.5-2g、所述硅酸锆4-6g、所述氯化铵3-5g、所述过硼酸钠4-7g、所述硫酸亚铁0.2-1.2g、所述氢氧化钾1-3g、所述气相二氧化硅0.5-1g备用；(2) Accurately weigh 10-20g of the nano-sized zinc oxide particles, 53-6g of the silicon powder, 1-3g of the boron nitride, 0.5-2g of the xylene, 0.2-6g of the zinc oxide, The sodium fluorosilicate 10-15g, the silicon dioxide 1-5g, the ammonium sulfate 0.5-2g, the zirconium silicate 4-6g, the ammonium chloride 3-5g, the sodium perborate 4-7g, 0.2-1.2g of the ferrous sulfate, 1-3g of the potassium hydroxide, and 0.5-1g of the fumed silica are used for later use;
（3）将纳米级氧化锌颗粒、硅粉、氮化硼、二甲苯、氧化锌、氟硅酸钠混合，进行充分搅拌；(3) Mix nano-sized zinc oxide particles, silicon powder, boron nitride, xylene, zinc oxide, and sodium fluorosilicate, and fully stir;
（4）加入二氧化硅、硫酸铵、硅酸锆、氯化铵混合；(4) Add silica, ammonium sulfate, zirconium silicate and ammonium chloride to mix;
（5）加过硼酸钠、硫酸亚铁在温度200℃、1000r/min条件下分散；(5) Add sodium perborate and ferrous sulfate to disperse at a temperature of 200°C and 1000r/min;
（6）加入氢氧化钾、气相二氧化硅充分搅拌出料；(6) Add potassium hydroxide and fumed silica to fully stir and discharge;
（7）出料后冷却包装即制得导热膏。(7) Cool the package after discharge to obtain thermal paste.
优选的，所述步骤（2）中含所述纳米级氧化锌颗粒15g、所述硅粉5g、所述氮化硼2g、所述二甲苯1g、所述氧化锌5g、所述氟硅酸钠12g、所述二氧化硅3g、所述硫酸铵1g、所述硅酸锆5g、所述氯化铵5g、所述过硼酸钠5g、所述硫酸亚铁1g、所述氢氧化钾2g、所述气相二氧化硅1g。Preferably, the step (2) contains 15g of the nano-sized zinc oxide particles, 5g of the silicon powder, 2g of the boron nitride, 1g of the xylene, 5g of the zinc oxide, and the fluorosilicic acid Sodium 12g, the silicon dioxide 3g, the ammonium sulfate 1g, the zirconium silicate 5g, the ammonium chloride 5g, the sodium perborate 5g, the ferrous sulfate 1g, the potassium hydroxide 2g , 1 g of the fumed silica.
以上显示和描述了本发明的基本原理和主要特征及本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned embodiments, and what described in the above-mentioned embodiments and the description only illustrates the principles of the present invention, and the present invention will also have other functions without departing from the spirit and scope of the present invention. Variations and improvements are possible, which fall within the scope of the claimed invention. The protection scope of the present invention is defined by the appended claims and their equivalents.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111477601A (en) * | 2020-05-12 | 2020-07-31 | 江苏满江红金属新材料科技有限公司 | High-heat-dissipation semiconductor slurry and preparation method thereof |
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| US20120006509A1 (en) * | 2009-03-20 | 2012-01-12 | University Of South Carolina | Nanofluids for Thermal Management Systems |
| CN106125864A (en) * | 2016-06-28 | 2016-11-16 | 太仓陶氏电气有限公司 | A kind of cpu heat of CNT heat conduction |
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| CN111477601B (en) * | 2020-05-12 | 2023-05-09 | 江苏满江红金属新材料科技有限公司 | High-heat-dissipation semiconductor slurry and preparation method thereof |
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