[go: up one dir, main page]

CN108930054B - A metal micro-3D printing method based on self-assembled molecular film control technology - Google Patents

A metal micro-3D printing method based on self-assembled molecular film control technology Download PDF

Info

Publication number
CN108930054B
CN108930054B CN201811041502.3A CN201811041502A CN108930054B CN 108930054 B CN108930054 B CN 108930054B CN 201811041502 A CN201811041502 A CN 201811041502A CN 108930054 B CN108930054 B CN 108930054B
Authority
CN
China
Prior art keywords
metal
self
molecular film
laser
printing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201811041502.3A
Other languages
Chinese (zh)
Other versions
CN108930054A (en
Inventor
张彦振
刘永红
李德格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China University of Petroleum East China
Original Assignee
China University of Petroleum East China
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China University of Petroleum East China filed Critical China University of Petroleum East China
Priority to CN201811041502.3A priority Critical patent/CN108930054B/en
Publication of CN108930054A publication Critical patent/CN108930054A/en
Application granted granted Critical
Publication of CN108930054B publication Critical patent/CN108930054B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/024Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention relates to a novel 3D metal printing method based on a self-assembly molecular membrane control technology, and belongs to the field of 3D metal printing and micro-nano manufacturing. The novel 3D metal printing method needs to add a special organic molecule into the electroplating solution, and the organic molecule can form a layer of compact self-assembled molecular film with good insulation on the whole surface of the printed metal. The molecular film can effectively isolate the printed piece from the electrolyte and can block all electrochemical reactions on the surface of the printed piece. During printing, a certain range of reduction potential is applied to the printed object to enable metal ions in the electroplating solution to perform reduction reaction. The laser is used for removing the self-assembled molecular film adsorbed on the surface of the metal, so that the metal is directly contacted with the electrolyte, and the electrodeposition is only carried out in a laser irradiation area, thereby realizing the metal additive manufacturing at a specified position.

Description

一种基于对自组装分子膜控制技术的金属微3D打印方法A metal micro-3D printing method based on self-assembled molecular film control technology

技术领域technical field

本发明属于增材制造及微纳制造领域,涉及一种基于对自组装分子膜控制技术、激光技术和电化学技术的金属增材制造新方法。The invention belongs to the fields of additive manufacturing and micro-nano manufacturing, and relates to a new metal additive manufacturing method based on self-assembled molecular film control technology, laser technology and electrochemical technology.

技术背景technical background

增材制造技术是一种基于离散堆积成形思想一种成形技术。该技术借助计算机,CAD等工件,对三维实体进行切片分层,用逐层变化的截面来逐层构建三维形体。该技术无需模具和夹具,而且具有构建复杂形状的能力。目前对于塑料等非金属材料的3D打印已经基本达到商业应用的水平。但是对于金属的3D打印,目前还一直处于实验室阶段。Additive manufacturing technology is a forming technology based on the idea of discrete accumulation forming. This technology uses computer, CAD and other workpieces to slice and layer three-dimensional entities, and build three-dimensional shapes layer by layer with sections that change layer by layer. The technology eliminates the need for molds and fixtures and has the ability to build complex shapes. At present, 3D printing of non-metallic materials such as plastics has basically reached the level of commercial application. But for metal 3D printing, it is still in the laboratory stage.

目前的金属3D打印技术的原理主要为金属粉末烧结技术,另外还有熔滴打印技术,超声波3D金属打印技术等。对于金属粉末烧结技术,根据其采用热源的不同,又可分为电子束熔融技术、电子束焊接技术和选择性激光熔融技术等。上述技术的原理非常类似,可统一归类为基于热物理方法的3D金属打印;都需要将金属粉末在指定的位置高温融化,再凝固形成3D金属实体。该融化凝固过程通常会导致被打印金属零件出现表面粗糙、应力集中、晶粒粗大、组织不均匀、气孔、机械强度低等问题。上述问题是采用热物理方法的3D金属打印技术很难克服的。另外,上述技术受热源尺寸和金属粉末大小的限制,通常不能打印特征尺寸小于一个毫米的金属构件。The current principle of metal 3D printing technology is mainly metal powder sintering technology, in addition to droplet printing technology, ultrasonic 3D metal printing technology, etc. For metal powder sintering technology, according to the different heat sources used, it can be divided into electron beam melting technology, electron beam welding technology and selective laser melting technology. The principles of the above technologies are very similar and can be classified as 3D metal printing based on thermophysical methods; they all need to melt metal powder at a specified location at high temperature, and then solidify to form a 3D metal entity. The melting and solidification process usually leads to problems such as surface roughness, stress concentration, coarse grains, uneven structure, pores, and low mechanical strength of the printed metal parts. The above problems are difficult to overcome by 3D metal printing technology using thermophysical methods. In addition, the above techniques are limited by the size of the heat source and the size of the metal powder, and generally cannot print metal components with feature sizes smaller than one millimeter.

电镀技术和电铸技术是基于电化学技术的金属增材制造工艺,已经在工业界取得了非常广泛的应用。目前的电镀技术通常用于金属零件的表面处理,其镀层厚度通常为微米级别。电镀技术不能用于3D金属打印的原因在于起不能实现指定位置的金属沉积。类似与电镀技术,电铸技术为另一种基于电化学原理的金属增材制造技术。电铸技术需要借助芯模,利用电化学原理,使金属在芯模上发生电沉积,然后再与芯模分离以实现金属制品的制造或复制。Electroplating technology and electroforming technology are metal additive manufacturing processes based on electrochemical technology, which have been widely used in the industry. Current electroplating techniques are commonly used for the surface treatment of metal parts, and the thickness of the coating is usually in the micrometer level. The reason why electroplating technology cannot be used for 3D metal printing is that metal deposition cannot be achieved in specified locations. Similar to electroplating technology, electroforming technology is another metal additive manufacturing technology based on electrochemical principles. Electroforming technology requires the use of a mandrel, using electrochemical principles to electrodeposit metal on the mandrel, and then separate from the mandrel to achieve the manufacture or replication of metal products.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种适用于微小金属零部件的增材制造技术。The purpose of the present invention is to provide an additive manufacturing technology suitable for tiny metal parts.

本发明的原理是:通过在电镀液中加入可以在金属表面形成绝缘且致密的自组装分子膜的有机分子,使浸泡在电镀液中的被打印金属部件表面全部被自组装分子膜所覆盖。当对金属部件施加可使电镀液中的金属离子被还原的电势时,该绝缘的自组装分子膜可以阻止金属离子在金属部件表面的电化学反应,从而使整个金属部件表面都不会发生电沉积。该技术利用具有特定能量的激光束或者二维的激光图案照金属部件表面,以去除吸附在其表面的自组装分子膜。当自组装分子膜被去除后,电化学沉积即可发生在激光照射区域。通过控制激光束的运动轨迹或者二维激光图案的形状,即可打印出三维的金属结构。The principle of the present invention is: by adding organic molecules that can form an insulating and dense self-assembled molecular film on the metal surface into the electroplating solution, the surface of the printed metal parts immersed in the electroplating solution is completely covered by the self-assembled molecular film. When a potential that can reduce the metal ions in the electroplating solution is applied to the metal part, the insulating self-assembled molecular film can prevent the electrochemical reaction of the metal ions on the surface of the metal part, so that the entire surface of the metal part will not be electrocuted. deposition. This technology uses a laser beam with a specific energy or a two-dimensional laser pattern to illuminate the surface of a metal part to remove the self-assembled molecular film adsorbed on its surface. After the self-assembled molecular film is removed, electrochemical deposition can take place in the laser-irradiated area. Three-dimensional metal structures can be printed by controlling the trajectory of the laser beam or the shape of the two-dimensional laser pattern.

本发明的特点如下:The characteristics of the present invention are as follows:

1.本发明的金属增材制造是基于电化学的原理,金属在激光方向上的每分钟的生长速度为微米量级,使其非常适合微小金属零部件的生产制造。1. The metal additive manufacturing of the present invention is based on the principle of electrochemistry, and the growth rate of metal per minute in the direction of the laser is in the order of microns, which makes it very suitable for the production of tiny metal parts.

2.由于本发明金属增材原理与电镀一致,所以其打印制造的金属部件没有热应力,工件机械强度高,而且表面光洁。2. Since the principle of the metal additive material of the present invention is consistent with that of electroplating, the metal parts produced by printing have no thermal stress, the mechanical strength of the workpiece is high, and the surface is smooth.

3.通过控制激光图案的变化,可打印制造出结构复杂的微小金属部件。3. By controlling the change of the laser pattern, tiny metal parts with complex structures can be printed.

附图说明Description of drawings

图1为基于对自组装分子膜控制技术的3D金属打印原理示意图Figure 1 is a schematic diagram of the principle of 3D metal printing based on the control technology of self-assembled molecular films

具体实施方式Detailed ways

参见图1。本发明为基于对自组装分子膜控制技术的3D金属打印新方法,具体为将电镀液中加入一种特殊的有机分子,该有机分子可以在被打印金属的表面形成一层致密且绝缘性良好的自组装分子膜。该分子膜可以将被打印件和电解液有效分离,可以阻断被打印件表面的电化学反应。打印过程中,需对被打印件施加一定幅度的可以使电镀液中的金属离子发生还原反应的还原电势。激光的作用在于去除吸附在金属表面的自组装分子膜,使金属直接与电解液接触,从而使电沉积只发生在激光照射区域,实现指定位置的金属增材制造。打印过程中,所用激光的能量密度以能刚好去除自组装分子膜为宜。太大的激光能量密度会导致工件的热融化,损伤工件。See Figure 1. The invention is a new method of 3D metal printing based on the control technology of self-assembled molecular film, specifically adding a special organic molecule into the electroplating solution, the organic molecule can form a dense layer on the surface of the metal to be printed with good insulation self-assembled molecular membranes. The molecular film can effectively separate the printed part and the electrolyte, and can block the electrochemical reaction on the surface of the printed part. During the printing process, it is necessary to apply a certain range of reduction potential to the printed part, which can make the metal ions in the electroplating solution undergo a reduction reaction. The role of the laser is to remove the self-assembled molecular film adsorbed on the metal surface, so that the metal is directly in contact with the electrolyte, so that electrodeposition only occurs in the laser-irradiated area, and metal additive manufacturing at a specified location is realized. During the printing process, the energy density of the laser used is suitable to just remove the self-assembled molecular film. Too much laser energy density will cause thermal melting of the workpiece and damage the workpiece.

当采用直径较小的激光束时,打印过程中需对激光束逐点逐线的进行二维扫描,以实现较大面积金属沉积。When a laser beam with a smaller diameter is used, the laser beam needs to be scanned two-dimensionally point by point and line by line during the printing process to achieve larger area metal deposition.

还可以采用图案形状可编辑的二维激光图案,直接投射与被打印的工件表面。打印过程中,通过调节二维图案的几何形状,便可以打印出三维的金属构件。A two-dimensional laser pattern with an editable pattern shape can also be used to directly project the surface of the workpiece to be printed. During the printing process, three-dimensional metal components can be printed by adjusting the geometry of the two-dimensional patterns.

Claims (3)

1. A metal micro 3D printing method based on a self-assembly molecular membrane control technology is characterized in that: the electroplating solution contains an organic molecule, the organic molecule can be spontaneously adsorbed on the surface of the printed metal to form a compact and insulated self-assembled molecular film, and the molecular film can effectively realize the physical isolation of the workpiece from the electroplating solution and block all electrochemical reactions generated on the surface of the metal; in the printing process, a potential capable of enabling metal ions in electroplating solution to generate reduction reaction on the surface of the workpiece is applied, and meanwhile, laser with proper energy density is adopted to remove the self-assembled molecular film adsorbed on the metal surface, so that the metal surface is directly contacted with the electroplating solution, and the electrochemical deposition is controlled to be only generated in a laser irradiation area.
2. The metallic micro 3D printing method according to claim 1, wherein: the laser may be a laser beam with a small diameter or a laser pattern with an editable two-dimensional shape.
3. The metallic micro 3D printing method according to claim 1, wherein: the energy density of the laser is preferably just enough to remove the self-assembled molecular film.
CN201811041502.3A 2018-09-07 2018-09-07 A metal micro-3D printing method based on self-assembled molecular film control technology Active CN108930054B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811041502.3A CN108930054B (en) 2018-09-07 2018-09-07 A metal micro-3D printing method based on self-assembled molecular film control technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811041502.3A CN108930054B (en) 2018-09-07 2018-09-07 A metal micro-3D printing method based on self-assembled molecular film control technology

Publications (2)

Publication Number Publication Date
CN108930054A CN108930054A (en) 2018-12-04
CN108930054B true CN108930054B (en) 2020-06-09

Family

ID=64443782

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811041502.3A Active CN108930054B (en) 2018-09-07 2018-09-07 A metal micro-3D printing method based on self-assembled molecular film control technology

Country Status (1)

Country Link
CN (1) CN108930054B (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07105174B2 (en) * 1990-08-30 1995-11-13 信越ポリマー株式会社 Method for manufacturing anisotropic conductive film
WO1998014641A1 (en) * 1996-10-02 1998-04-09 Symyx Technologies Potential masking systems and methods for combinatorial library synthesis
SG76591A1 (en) * 1999-02-27 2000-11-21 Aem Tech Engineers Pte Ltd Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
CN1549669A (en) * 2003-05-09 2004-11-24 三洋电机株式会社 Method for producing plate body and method for producing circuit device utilizing the same plate body
JP4833762B2 (en) * 2006-08-07 2011-12-07 株式会社オートネットワーク技術研究所 Partial plating method, connector terminal, and connector terminal manufacturing method
CN103935954B (en) * 2014-04-21 2015-10-28 陕西师范大学 Self-assembled monolayer is utilized to carry out the method for positivity and negativity etching to noble metal
CN107400913A (en) * 2016-05-19 2017-11-28 高·哈里·凡 Electrochemical metal needle tip 3D printer and printing method
CN106863770B (en) * 2017-01-12 2018-10-19 南京航空航天大学 Manufacturing method of structural circuit integrated part based on fused deposition forming technology

Also Published As

Publication number Publication date
CN108930054A (en) 2018-12-04

Similar Documents

Publication Publication Date Title
US11560629B2 (en) Methods of preparing articles by electrodeposition and additive manufacturing processes
Hirt et al. Additive manufacturing of metal structures at the micrometer scale
Ambrosi et al. 3D-printing technologies for electrochemical applications
Kamaraj et al. Numerical study of localized electrochemical deposition for micro electrochemical additive manufacturing
CN103590076B (en) A kind of laser reinforcing electro-deposition quick shaping machining device and method
JP2021511230A (en) 3D printer and its operation method
CA2905536A1 (en) Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
CN102794436A (en) Method of bonding a metal to a substrate
Ayalew et al. A critical review of additive material manufacturing through electrochemical deposition techniques
CN104191053A (en) Method for manufacturing micro-electrolysis cathode movable template
Perera et al. Recent progress in functionalized plastic 3D printing in creation of metallized architectures
CN107999908B (en) Manufacturing method of micro-pit array
JP4737170B2 (en) Method for manufacturing mold shell having temperature control member
CN108930054B (en) A metal micro-3D printing method based on self-assembled molecular film control technology
Rai et al. Electroforming process for microsystems fabrication
Wang et al. Fabrication of microstructure arrays via localized electrochemical deposition
Kim et al. The characteristics of selective 3D metal additive process using electrochemical deposition and nozzle fluid dynamics
Phull et al. Copper electroforming optimization for fused deposition modeling produced ABS components for indirect tooling applications
US20170226649A1 (en) Method and apparatus for manufacturing particles
CN209162216U (en) Metal additive manufacturing device based on laser local electroplating
JP4750681B2 (en) Insulating mold, mold part, molding machine, and method of manufacturing insulating mold
JP3795611B2 (en) Rapid prototyping of metal parts by electrolyte jet machining
CN112059335B (en) Preparation method of multi-window revolving body tool electrode for rotary printing electrolytic machining
Rad et al. Manufacturing of copper-chromium composite using electrochemical additive manufacturing method: a screening study
CN114959801A (en) Method and device for composite machining and manufacturing of limited-area electrochemical layer-by-layer material increase and decrease

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant