CN108811369B - Printed circuit board edge blind slot processing method - Google Patents
Printed circuit board edge blind slot processing method Download PDFInfo
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- CN108811369B CN108811369B CN201810697063.5A CN201810697063A CN108811369B CN 108811369 B CN108811369 B CN 108811369B CN 201810697063 A CN201810697063 A CN 201810697063A CN 108811369 B CN108811369 B CN 108811369B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for processing a blind slot at the edge of a printed circuit board, which comprises the following steps: 1) arranging a blind groove at the design edge of the printed circuit board, and arranging a metal pattern in the blind groove; 2) carrying out microetching treatment on the metal pattern in the blind groove; 3) performing electrogilding treatment on the metal patterns on the surface of the printed circuit board and in the blind groove; the design blind groove is located in the design edge of the printed circuit board, the redundancy blind groove is located outside the design edge of the printed circuit board, and the redundancy blind groove is provided with a redundancy through hole. According to the invention, through adding the redundant blind groove and the redundant through hole structure, the updating and exchanging degree and speed of the solution in the blind groove in the microetching and electrogilding process are accelerated, so that the solution in the blind groove is fully exchanged, the microetching degree of the metal pattern in the blind groove is uniform, the thickness of the electrogilding layer is full and uniform, and the quality and yield of the microetching and electrogilding of the metal pattern in the blind groove can be effectively improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board processing, in particular to a method for processing a blind slot at the edge of a printed circuit board.
Background
The blind groove of the multilayer printed circuit board is a region with different heights formed by laminating, milling and the like in a local region on the printed circuit board. The main functions of the blind groove are as follows: firstly, the input and output ports of electric signals of each layer inside are realized; secondly, the adhesive tape is used as a cavity and a carrier for adhering and mounting components such as chips, capacitors, resistors and the like; and thirdly, the microwave module is used as a channel for interconnecting microwave modules and is cascaded in a mode of gold wires, gold bands and the like.
The blind slot port which is welded and cascaded by the gold wire and the gold belt at the later stage is usually positioned at the edge of the circuit board, and the thickness of the gold plating layer of the product which is directly plated with gold on copper is generally required to be more than or equal to 3.5 mu m so as to meet the requirement of the welding strength of the gold wire and the gold belt.
In the production process, due to the particularity of the structure of the single-side opening of the blind groove, in the pretreatment process of microetching of electrogilding, the solution exchange in the blind groove is insufficient, the microetching of the graph in the blind groove is very uneven, and manual repair intervention is needed to be added, so that the fine graph of the port is damaged and scrapped frequently; in the process of gold electroplating, the solution exchange at the blind groove position is insufficient, the thickness of the gold layer of the circuit pattern in the blind groove is insufficient, and even the situation that the gold cannot be plated locally occurs, so that the final product is scrapped. The smaller the size of the blind slot, the greater the depth, and the more serious these two problems. Even if the thickness of the gold layer is barely up to the standard, the welding of the gold wire and the gold belt in the later period is difficult.
Disclosure of Invention
The invention provides a processing method of a blind groove at the edge of a printed circuit board, which aims to solve the problems of uneven pre-etching treatment of an inner pattern of the blind groove at the edge of the existing printed circuit board and difficult electrogilding and effectively improve the quality and the yield of the blind groove at the edge of the printed circuit board.
The technical scheme of the invention is as follows:
a printed circuit board edge blind slot processing method comprises the following steps:
1) arranging a blind groove at the design edge of the printed circuit board, and arranging a metal pattern in the blind groove; 2) carrying out microetching treatment on the metal pattern in the blind groove; 3) performing electrogilding treatment on the metal patterns on the surface of the printed circuit board and in the blind groove;
the design blind groove is located in the design edge of the printed circuit board, the redundancy blind groove is located outside the design edge of the printed circuit board, and the redundancy blind groove is provided with a redundancy through hole.
The blind groove can be manufactured by adopting the modes of laminating, depth control milling and the like commonly used in the field; carrying out microetching treatment on the metal pattern in the blind groove by using a chemical solution to remove a blackening/browning layer on the surface of the metal pattern; the redundant through holes can be manufactured by adopting a numerical control drilling method.
In the technical scheme, the redundant blind groove and the redundant through hole structure are added, the difficulty of solution updating and exchanging inside the blind groove in the microetching pretreatment and electrogilding process is reduced, the updating and exchanging degree and speed of the solution inside the blind groove can be accelerated, the solution inside the blind groove is fully exchanged, the microetching degree of the metal graph inside the blind groove is uniform, the thickness of the electrogilding layer is full and uniform, and the quality and yield of microetching and electrogilding of the metal graph inside the blind groove can be effectively improved.
Preferably, the metal pattern inside the blind groove extends from the inside of the design blind groove to the inside of the redundant blind groove.
The contour shape of the redundant blind groove does not need special requirements, and the manufactured redundant blind groove can contain metal patterns and redundant through holes and can accelerate the updating and exchanging degree and speed of the solution in the blind groove. The shape of the redundant blind slot includes, but is not limited to, a circle, an ellipse or a polygon. When the outline of the redundant blind slot is a polygon, one side of the polygon should coincide with the edge blind slot of the printed circuit board.
Preferably, the depth of the redundant blind groove is consistent with that of the design blind groove; the redundancy design value of the redundancy blind groove in the direction from the design blind groove to the redundancy blind groove is 1.0-5.0 mm; and the redundancy design value of the redundancy blind groove in the connecting line direction of two redundancy blind grooves positioned on the same plate edge of the printed circuit board in the same direction is 0.2-3.0 mm.
The redundancy design value refers to the maximum distance of the redundancy blind slot in the corresponding direction, such as: the diameter of the circle in the corresponding direction; or, the length of the rectangle in the corresponding direction; or the height and side length of the triangle in the corresponding direction, etc.
In the above technical solution, the actual value of the redundancy design value should be determined according to the size of the blind slot, the distribution number and the imposition condition.
Preferably, the inner diameter or the side length of the redundant through hole is 0.3-1.5 mm.
The actual value of the inner diameter of the redundant through hole is adjusted according to the size of the blind slot.
Preferably, the number of redundant vias is at least 2.
Preferably, the redundant through holes are uniformly distributed on two sides of the metal pattern in the redundant blind groove.
The contour shape of the redundant through hole is not specially required, and the manufactured redundant through hole is convenient for solution to pass through, so that the degree and the speed of solution exchange in the blind groove are increased. The contour shape of the redundant via includes, but is not limited to, a circle, an ellipse, or a polygon.
Further, the processing method further comprises the following steps of processing the shape: and separating the design blind slot from the redundant blind slot along the design edge of the printed circuit board to obtain the printed circuit board with the edge blind slot. The separation method is preferably a numerical control milling method.
The invention has the following beneficial effects:
through increasing redundant blind groove and redundant through-hole structure for the degree and the speed of microetching and electrogilding in-process blind groove inside solution renewal and exchange make the inside solution of blind groove fully exchange, and the inside metal figure microetching degree of blind groove is even, electrogilding layer thickness is abundant and even, can effectively promote the inside metal figure microetching of blind groove and electrogilding's quality and yield.
Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic structural diagram of a designed blind slot and a redundant blind slot in an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a redundant blind slot and a redundant through hole therein according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of a printed circuit structure with edge blind grooves obtained after the method of the present invention is used for electroplating gold and the profile processing.
Description of reference numerals:
1. designing a blind slot; 2. a printed circuit board design edge; 3. redundant blind slots; 4. a metal pattern; 5. redundant vias.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Example (b):
a printed circuit board edge blind slot processing method comprises the following steps:
1) arranging a blind groove at the design edge of the printed circuit board, and arranging a metal pattern in the blind groove;
2) carrying out microetching treatment on the metal pattern in the blind groove;
3) performing electrogilding treatment on the metal patterns on the surface of the printed circuit board and in the blind groove;
the design blind groove is located in the design edge of the printed circuit board, the redundancy blind groove is located outside the design edge of the printed circuit board, and the redundancy blind groove is provided with a redundancy through hole.
The blind groove can be manufactured by adopting the modes of laminating, depth control milling and the like commonly used in the field; carrying out microetching treatment on the metal pattern in the blind groove by using a chemical solution to remove a blackening/browning layer on the surface of the metal pattern; the redundant through holes can be manufactured by adopting a numerical control drilling method.
In the technical scheme, the redundant blind groove and the redundant through hole structure are added, the difficulty of solution updating and exchanging inside the blind groove in the microetching pretreatment and electrogilding process is reduced, the updating and exchanging degree and speed of the solution inside the blind groove can be accelerated, the solution inside the blind groove is fully exchanged, the microetching degree of the metal graph inside the blind groove is uniform, the thickness of the electrogilding layer is full and uniform, and the quality and yield of microetching and electrogilding of the metal graph inside the blind groove can be effectively improved.
Preferably, the metal pattern inside the blind groove extends from the inside of the design blind groove to the inside of the redundant blind groove, as shown in fig. 1.
The contour shape of the redundant blind groove does not need special requirements, and the manufactured redundant blind groove can contain metal patterns and redundant through holes and can accelerate the updating and exchanging degree and speed of the solution in the blind groove. The shape of the redundant blind slot includes, but is not limited to, a circle, an ellipse or a polygon. When the outline of the redundant blind slot is a polygon, one side of the polygon should coincide with the edge blind slot of the printed circuit board. Exemplarily, the following steps are carried out: the redundant blind groove is semicircular, circular, triangular, rectangular, regular pentagonal and the like.
Preferably, the depth of the redundant blind groove is consistent with that of the design blind groove; the redundancy design value of the redundancy blind groove in the direction from the design blind groove to the redundancy blind groove is 1.0-5.0 mm; and the redundancy design value of the redundancy blind groove in the connecting line direction of two redundancy blind grooves positioned on the same plate edge of the printed circuit board in the same direction is 0.2-3.0 mm. Exemplarily, the following steps are carried out: the redundancy design values of the redundancy blind grooves in the direction from the design blind groove to the redundancy blind groove are 1.0mm, 2.0mm, 2.5mm, 3.5mm and 5 mm; the redundancy design values of the redundancy blind grooves in the connecting line direction of the two redundancy blind grooves positioned on the same plate edge of the printed circuit board in the same direction are 0.2mm, 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0 mm.
The redundancy design value refers to the maximum distance of the redundancy blind slot in the corresponding direction, such as: the diameter of the circle in the corresponding direction; or, the length of the rectangle in the corresponding direction; or the height and side length of the triangle in the corresponding direction, etc.
In the above technical solution, the actual value of the redundancy design value should be determined according to the size of the blind slot, the distribution number and the imposition condition. If the size of the blind slot is large, the redundancy design value is increased; if the blind slot distribution is denser, the redundancy design value can be reduced appropriately.
Preferably, the inner diameter or the side length of the redundant through hole is 0.3-1.5 mm. Exemplarily, the following steps are carried out: the redundant blind groove is circular with the diameter of 1 mm; or the redundant blind slot is a rectangle with the side length of 0.3 mm; or the redundant blind slot is a triangle with the side length of 1.5 mm.
The actual value of the inner diameter of the redundant through hole is adjusted according to the size of the blind slot.
Preferably, the number of redundant vias is at least 2.
Preferably, the redundant through holes are uniformly distributed on two sides of the metal pattern in the redundant blind groove. Exemplarily, the following steps are carried out: the number of the redundant through holes is 2, and the redundant through holes are uniformly distributed on two sides of the metal pattern in the redundant blind groove, as shown in figure 2.
The contour shape of the redundant through hole is not specially required, and the manufactured redundant through hole is convenient for solution to pass through, so that the degree and the speed of solution exchange in the blind groove are increased. The contour shape of the redundant via includes, but is not limited to, a circle, an ellipse, or a polygon. Illustratively, the redundant blind slot profile shape is circular, semi-circular, rectangular, triangular, pentagram, etc.
Further, the processing method further comprises the following steps of processing the shape: and separating the design blind slot from the redundant blind slot along the design edge of the printed circuit board to obtain the printed circuit board with the edge blind slot, as shown in fig. 3. The separation method is preferably a numerical control milling method.
The invention has the following beneficial effects:
through increasing redundant blind groove and redundant through-hole structure for the degree and the speed of microetching and electrogilding in-process blind groove inside solution renewal and exchange make the inside solution of blind groove fully exchange, and the inside metal figure microetching degree of blind groove is even, electrogilding layer thickness is abundant and even, can effectively promote the inside metal figure microetching of blind groove and electrogilding's quality and yield.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.
Claims (7)
1. A printed circuit board edge blind slot processing method is characterized by comprising the following steps:
1) arranging a blind groove at the design edge of the printed circuit board, and arranging a metal pattern in the blind groove; 2) carrying out microetching treatment on the metal pattern in the blind groove; 3) performing electrogilding treatment on the metal patterns on the surface of the printed circuit board and in the blind groove;
the design blind slot is positioned in the design edge of the printed circuit board, the redundancy blind slot is positioned outside the design edge of the printed circuit board, and a redundancy through hole is arranged in the redundancy blind slot; the depth of the redundant blind groove is consistent with that of the design blind groove; the redundant blind grooves are designed in the direction from the designed blind groove to the redundant blind groove and in the vertical direction along the extending direction of the blind grooves.
2. The method of claim 1, wherein the metal pattern in the blind groove extends from the designed blind groove to the redundant blind groove.
3. The method for processing the blind groove on the edge of the printed circuit board according to claim 1, wherein the depth of the redundant blind groove is consistent with that of the designed blind groove; the redundancy design value of the redundancy blind groove in the direction from the design blind groove to the redundancy blind groove is 1.0-5.0 mm; and the redundancy design value of the redundancy blind groove in the connecting line direction of two redundancy blind grooves positioned on the same plate edge of the printed circuit board in the same direction is 0.2-3.0 mm.
4. The method for processing the blind slot on the edge of the printed circuit board as claimed in claim 1, wherein the inner diameter or the side length of the redundant through hole is 0.3-1.5 mm.
5. The printed circuit board edge blind via machining method of claim 1, wherein the number of the redundant through holes is at least 2.
6. The method of claim 1, wherein the redundant through holes are uniformly disposed on two sides of the metal pattern inside the redundant blind groove.
7. The method for processing the blind slot on the edge of the printed circuit board according to any one of claims 1 to 6, wherein the processing method further comprises the following steps: and separating the design blind slot from the redundant blind slot along the design edge of the printed circuit board to obtain the printed circuit board with the edge blind slot.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810697063.5A CN108811369B (en) | 2018-06-29 | 2018-06-29 | Printed circuit board edge blind slot processing method |
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| CN201810697063.5A CN108811369B (en) | 2018-06-29 | 2018-06-29 | Printed circuit board edge blind slot processing method |
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| CN108811369A CN108811369A (en) | 2018-11-13 |
| CN108811369B true CN108811369B (en) | 2021-09-24 |
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| CN110121239B (en) * | 2019-04-10 | 2021-06-04 | 江门崇达电路技术有限公司 | Manufacturing method of mechanical blind hole and half hole |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682365A (en) * | 2016-03-29 | 2016-06-15 | 江门崇达电路技术有限公司 | Method of manufacturing semi-metallized platform on PCB |
| CN106211630A (en) * | 2016-08-31 | 2016-12-07 | 开平依利安达电子第三有限公司 | A kind of circuit board manufacturing jig of brown copper billet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5383095A (en) * | 1993-10-29 | 1995-01-17 | The Whitaker Corporation | Circuit board and edge-mountable connector therefor, and method of preparing a circuit board edge |
| US6105246A (en) * | 1999-05-20 | 2000-08-22 | International Business Machines Corporation | Method of making a circuit board having burr free castellated plated through holes |
| JP2012069854A (en) * | 2010-09-27 | 2012-04-05 | Cmk Corp | Multilayer printed wiring board and manufacturing method therefor |
| CN103391682B (en) * | 2012-05-10 | 2016-07-06 | 深南电路有限公司 | The processing method with the pcb board of step groove |
| CN103079350B (en) * | 2012-12-28 | 2015-04-29 | 广州杰赛科技股份有限公司 | Method for processing patterns in blind slot of printed circuit board |
| CN104039086B (en) * | 2014-06-06 | 2016-11-02 | 中国航天科技集团公司第九研究院第七七一研究所 | A kind of three-dimensional salient point printed circuit board and preparation method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682365A (en) * | 2016-03-29 | 2016-06-15 | 江门崇达电路技术有限公司 | Method of manufacturing semi-metallized platform on PCB |
| CN106211630A (en) * | 2016-08-31 | 2016-12-07 | 开平依利安达电子第三有限公司 | A kind of circuit board manufacturing jig of brown copper billet |
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