CN108684160B - Manufacturing method of multi-step blind hole HDI plate - Google Patents
Manufacturing method of multi-step blind hole HDI plate Download PDFInfo
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- CN108684160B CN108684160B CN201810565350.0A CN201810565350A CN108684160B CN 108684160 B CN108684160 B CN 108684160B CN 201810565350 A CN201810565350 A CN 201810565350A CN 108684160 B CN108684160 B CN 108684160B
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- blind hole
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- laser drilling
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000005553 drilling Methods 0.000 claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 239000010949 copper Substances 0.000 claims abstract description 9
- 238000002955 isolation Methods 0.000 claims abstract description 9
- 238000010030 laminating Methods 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 46
- 101100134058 Caenorhabditis elegans nth-1 gene Proteins 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a manufacturing method of a multi-order blind hole HDI board, wherein the order N of a multi-order blind hole is more than or equal to 2, and a region for manufacturing the multi-order blind hole in an inner layer board of a printed circuit board is called a blind hole position, and the manufacturing method comprises the following steps: s1, cutting to obtain an inner core plate, and etching and removing copper at the blind hole position of the inner core plate needing to be provided with the blind hole to form an isolation region through inner layer pattern and etching treatment to obtain an inner layer plate; s2, the inner layer board where the bottom of the blind hole in the finished printed circuit board is located is a bottom layer inner layer board, and laser drilling is carried out on the bottom layer inner layer board by adopting first laser drilling parameters to form a bottom layer blind hole; s3, laminating a second inner-layer laminate on the top of the bottom inner-layer laminate, performing laser drilling by adopting second laser drilling parameters to form two layers of through holes matched with the bottom blind holes in shape, repeatedly laminating and sequentially performing laser drilling to obtain a multilayer production board with N-order blind holes; s4, metalizing the blind holes of the N level; and S5, carrying out subsequent processing to obtain a finished product of the printed circuit board.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a multi-step blind hole HDI board.
Background
The HDI circuit board is also called a high-density interconnection board, and refers to a printed circuit board with the aperture of less than 6mil, the loop diameter (Hole Pad) of a loop of less than 0.25mm, the contact density of more than 130 points/square and the line width/space of less than 3mil/3 mil. The HDI circuit board can reduce the production cost of the multilayer PCB board, increase the line density, and has the advantages of high reliability, good electrical property and the like.
The manufacturing difficulty of the multi-step blind hole HDI board lies in the requirement of multi-step hole stacking, the multi-step hole stacking means higher center alignment degree and more stable hole metallization conduction effect, the conventional technology of the blind hole connection realization mode between adjacent layers is an electroplating hole plugging method, but the electroplating hole plugging method needs multiple laser drilling and is accompanied with multiple times of electroplating, and the cost is higher.
Therefore, how to improve the manufacturing method of the multi-order blind hole HDI plate, simplify the processing flow and reduce the production cost is a problem to be solved in the technical field of the manufacturing of the multi-order blind hole HDI plate.
Disclosure of Invention
The invention provides a manufacturing method of a multi-stage blind hole HDI plate aiming at the problems that the existing electroplating plug hole method needs multiple times of laser drilling and is accompanied with multiple times of electroplating, and the cost is higher.
In order to achieve the purpose, the invention adopts the following technical scheme.
The invention provides a manufacturing method of a multi-order blind hole HDI board, wherein the order N of a multi-order blind hole is more than or equal to 2, a region for manufacturing the multi-order blind hole in an inner layer board of a printed circuit board is called as a blind hole position, and the manufacturing method comprises the following steps:
s1, cutting to obtain inner core boards, respectively manufacturing inner layer circuits on the inner core boards through inner layer patterns and etching treatment, and etching copper at the blind hole positions of the inner core boards needing to be provided with the blind holes to remove to form isolation regions to obtain inner layer boards;
s2, the inner-layer board where the bottom of the blind hole in the finished printed circuit board is located is a bottom-layer inner-layer board, laser drilling is carried out on the bottom-layer inner-layer board by adopting first laser drilling parameters to form a bottom-layer blind hole, and the bottom of the bottom-layer blind hole is closed;
s3, laminating a second inner-layer plate on the top of the bottom-layer inner-layer plate, performing laser drilling on the second inner-layer plate by adopting second laser drilling parameters to form a second-layer through hole matched with the bottom-layer blind hole in shape, communicating the second-layer through hole with the bottom-layer blind hole to form a second-order blind hole, repeatedly laminating and sequentially performing laser drilling to obtain the multilayer production plate with the N-order blind holes;
s4, plating copper on the N-step blind holes by adopting a whole board hole filling electroplating process to metalize the N-step blind holes;
and S5, carrying out subsequent treatment on the multilayer production board by adopting the prior art to obtain a finished product of the printed circuit board.
Preferably, the inner diameter of the isolation region is larger than the diameter of the N-step blind hole on the surface of each inner layer plate.
Preferably, the energy required for finishing the hole pattern in the nth laser drilling parameter is increased by 5-15% relative to the nth-1 laser drilling parameter.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the isolation region is formed by etching and removing the copper at the blind hole position of the inner core plate needing to be provided with the blind hole, and the inner core plates needing to be provided with the blind holes are communicated to form the N-step blind hole by changing the laser drilling parameters, so that only a single-layer hole electroplating is needed, the process is simple and convenient, and the cost can be effectively reduced.
Brief description of the drawings
FIG. 1 is a flow chart of a manufacturing method of a multi-step blind hole HDI board provided by the invention;
FIG. 2 is a structural diagram of a multi-step blind hole HDI board provided by the invention;
FIG. 3 is a schematic view of the bottom blind hole in the bottom inner layer plate and the two layers of through holes in the second inner layer plate being superimposed.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to the following specific embodiments.
Example one
With reference to fig. 1 and fig. 2, the present embodiment provides a manufacturing method of a multi-step blind via HDI board, where an order N of the multi-step blind via is greater than or equal to 2, a region in an inner layer board of a printed circuit board for manufacturing the multi-step blind via is referred to as a blind via, and the manufacturing method includes the following steps:
s1, cutting to obtain inner core boards, respectively manufacturing inner layer circuits on the inner core boards through inner layer patterns and etching treatment, and etching copper at the blind hole positions of the inner core boards needing to be provided with the blind holes to remove to form isolation regions 1 to obtain inner layer boards;
s2, the inner-layer board where the bottom of the blind hole in the finished printed circuit board is located is a bottom-layer inner-layer board, laser drilling is carried out on the bottom-layer inner-layer board by adopting first laser drilling parameters to form a bottom-layer blind hole 11, and the bottom of the bottom-layer blind hole is closed;
s3, laminating a second inner-layer plate on the top of the bottom-layer inner-layer plate, performing laser drilling on the second inner-layer plate by adopting second laser drilling parameters to form a second-layer through hole 12 matched with the bottom-layer blind hole 11 in shape, communicating the second-layer through hole 12 with the bottom-layer blind hole 11 to form a second-order blind hole, and repeatedly laminating and sequentially performing laser drilling to obtain the multilayer production plate with the N-order blind holes;
s4, plating copper on the N-step blind holes by adopting a whole board hole filling electroplating process to metalize the N-step blind holes;
and S5, carrying out subsequent treatment on the multilayer production board by adopting the prior art to obtain a finished product of the printed circuit board.
Specifically, the inner diameter of the isolation region is larger than the diameter of the N-step blind hole on the surface of each inner layer plate, and the energy required by hole arrangement in the Nth laser drilling parameter is increased by 5% -15% relative to the Nth-1 th laser drilling parameter.
Referring to fig. 2 and fig. 3, in this embodiment, N is 2, the 2 nd laser drilling parameter increases the energy of the modified PP parameter by 10% relative to the 1 st laser drilling parameter, so that the bottom opening of the second layer of through hole is enlarged to be matched with the opening of the bottom layer of blind hole, and the pass processed in several times can be properly connected to form a complete second-order blind hole.
According to the invention, the isolation region is formed by etching and removing the copper at the blind hole position of the inner core plate needing to be provided with the blind hole, and the inner core plates needing to be provided with the blind holes are communicated to form the N-step blind hole by changing the laser drilling parameters, so that only a single-layer hole electroplating is needed, the process is simple and convenient, and the cost can be effectively reduced.
The technical contents of the present invention are further illustrated by the examples, so as to facilitate the understanding of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention.
Claims (3)
1. The manufacturing method of the multi-order blind hole HDI board is characterized in that the order N of the multi-order blind holes is more than or equal to 2, and a region used for manufacturing the multi-order blind holes in an inner layer board of the multi-order blind hole HDI board is called a blind hole position, and comprises the following steps:
s1, cutting to obtain inner core boards, respectively manufacturing inner layer circuits on the inner core boards through inner layer patterns and etching treatment, and etching copper at the blind hole positions of the inner core boards needing to be provided with the blind holes to remove to form isolation regions to obtain inner layer boards;
s2, using an inner layer plate where the bottom of a blind hole in the multi-step blind hole HDI board finished product is located as a bottom layer inner layer plate, performing laser drilling on the bottom layer inner layer plate by adopting first laser drilling parameters to form a bottom layer blind hole, and sealing the bottom of the bottom layer blind hole;
s3, laminating a second inner-layer plate on the top of the bottom-layer inner-layer plate, performing laser drilling on the second inner-layer plate by adopting second laser drilling parameters to form a second-layer through hole matched with the bottom-layer blind hole in shape, communicating the second-layer through hole with the bottom-layer blind hole to form a second-order blind hole, repeatedly laminating and sequentially performing laser drilling to obtain the multilayer production plate with the N-order blind holes;
s4, plating copper on the N-step blind holes by adopting a whole board hole filling electroplating process to metalize the N-step blind holes;
and S5, carrying out subsequent treatment on the multilayer production board to obtain a multi-step blind hole HDI board finished product.
2. The method for manufacturing the HDI board with the multiple steps according to claim 1, wherein an inner diameter of the isolation region is larger than a diameter of the N-step blind hole on the surface of each inner layer board.
3. The method for manufacturing the HDI board with the multiple steps as claimed in claim 1, wherein the laser energy required for arranging the holes in the Nth laser drilling parameter is increased by 5% -15% relative to the laser energy required for arranging the holes in the N-1 th laser drilling parameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810565350.0A CN108684160B (en) | 2018-06-04 | 2018-06-04 | Manufacturing method of multi-step blind hole HDI plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810565350.0A CN108684160B (en) | 2018-06-04 | 2018-06-04 | Manufacturing method of multi-step blind hole HDI plate |
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| Publication Number | Publication Date |
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| CN108684160A CN108684160A (en) | 2018-10-19 |
| CN108684160B true CN108684160B (en) | 2020-10-16 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112888199A (en) * | 2021-01-15 | 2021-06-01 | 浪潮电子信息产业股份有限公司 | Method for forming pin jack of multilayer PCB |
| CN114249600B (en) * | 2021-12-29 | 2023-03-21 | 中国航空制造技术研究院 | Ceramic matrix composite blind hole structure forming method |
| CN114698234B (en) * | 2022-03-30 | 2024-05-31 | 深圳市信维通信股份有限公司 | Method for combining multilayer LCP (liquid crystal display) material substrates |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361538A (en) * | 2011-10-14 | 2012-02-22 | 电子科技大学 | Method for processing printed circuit two-level blind hole |
| CN203482494U (en) * | 2013-08-29 | 2014-03-12 | 深圳市深联电路有限公司 | Any layer interconnectable HDI (high density interconnectable) board |
| CN103717013A (en) * | 2012-09-29 | 2014-04-09 | 上海美维科技有限公司 | Manufacturing method for printed circuit board |
| CN104244613A (en) * | 2014-09-11 | 2014-12-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing plated-through holes in HDI plate |
| CN107995803A (en) * | 2017-12-28 | 2018-05-04 | 赣州市深联电路有限公司 | A kind of random layer interconnected printed circuit board production method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6671951B2 (en) * | 1999-02-10 | 2004-01-06 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board, and method and apparatus for manufacturing the same |
| EP1443810A1 (en) * | 2003-01-23 | 2004-08-04 | Alcatel | Multilayer backplane with vias for pin connection |
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- 2018-06-04 CN CN201810565350.0A patent/CN108684160B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361538A (en) * | 2011-10-14 | 2012-02-22 | 电子科技大学 | Method for processing printed circuit two-level blind hole |
| CN103717013A (en) * | 2012-09-29 | 2014-04-09 | 上海美维科技有限公司 | Manufacturing method for printed circuit board |
| CN203482494U (en) * | 2013-08-29 | 2014-03-12 | 深圳市深联电路有限公司 | Any layer interconnectable HDI (high density interconnectable) board |
| CN104244613A (en) * | 2014-09-11 | 2014-12-24 | 深圳崇达多层线路板有限公司 | Method for manufacturing plated-through holes in HDI plate |
| CN107995803A (en) * | 2017-12-28 | 2018-05-04 | 赣州市深联电路有限公司 | A kind of random layer interconnected printed circuit board production method |
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