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CN108806975A - A kind of capacitor packing material - Google Patents

A kind of capacitor packing material Download PDF

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Publication number
CN108806975A
CN108806975A CN201810597147.1A CN201810597147A CN108806975A CN 108806975 A CN108806975 A CN 108806975A CN 201810597147 A CN201810597147 A CN 201810597147A CN 108806975 A CN108806975 A CN 108806975A
Authority
CN
China
Prior art keywords
packing material
capacitor
capacitor packing
zeolite powder
phenolic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810597147.1A
Other languages
Chinese (zh)
Inventor
夏斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongling City Shengmeida Electronic Manufacturing Co Ltd
Original Assignee
Tongling City Shengmeida Electronic Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tongling City Shengmeida Electronic Manufacturing Co Ltd filed Critical Tongling City Shengmeida Electronic Manufacturing Co Ltd
Priority to CN201810597147.1A priority Critical patent/CN108806975A/en
Publication of CN108806975A publication Critical patent/CN108806975A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10Housing; Encapsulation

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses a kind of capacitor packing material, a kind of capacitor packing material, which is characterized in that it is made by the raw material of following weight parts:Epoxy resin 35-40, phenolic resin 10-20,5506 1-2 of curing agent, zeolite powder 3-5, organic silicon defoamer 1-3, diisocyanate 1-2, glass fibre 1-3, stearic acid 5-7, linseed oil 1-2, alkyl glycosides 1-2.Inventive formulation is simple, and preparation method is simple and easy to do, by being modified to phenolic resin, improves its heat-resisting cold resistance, then by rational formula, increases its elasticity and stability, nontoxic, using stablizing;The addition of zeolite powder and glass fibre can increase the heat-resisting cold resistance of the present invention.

Description

A kind of capacitor packing material
Technical field
The present invention relates to capacitor areas, are exactly a kind of capacitor packing materials.
Background technology
Capacitor, it is capacitance that usually referred to as it, which accommodates the ability of charge, is indicated with letter C.Define 1:Capacitor, Gu Mingsi Justice is ' container of dress electricity ', is a kind of device accommodating charge.Capacitor be the electronic component that is largely used in electronic equipment it One, the separated by direct communication being widely used in circuit couples, and bypasses, filtering, resonant tank, energy conversion, control etc..
The medium filled in capacitor is the not protection of filled media in order to which interelectrode air is isolated, the coat of metal It will be aoxidized, the capacity of capacitor is smaller and smaller, and loss is increasing.The filler material that dry-type capacitor uses is essentially epoxy Resin, epoxy resin can not resist cold heat-resisting, and reliability is not strong, are badly in need of better capacitor packing material and replace epoxy resin.
Invention content
The purpose of the present invention is to provide a kind of heat-resisting capacitor packing materials that resists cold to obtain.
Above-mentioned purpose is realized by following scheme:
A kind of capacitor packing material, which is characterized in that it is made by the raw material of following weight parts:Epoxy resin 35- 40, phenolic resin 10-20, curing agent 55061-2, zeolite powder 3-5, organic silicon defoamer 1-3, diisocyanate 1-2, glass fibers Tie up 1-3, stearic acid 5-7, linseed oil 1-2, alkyl glycosides 1-2.
A kind of capacitor packing material, it is characterised in that:Preparation method is:
(1) after phenolic resin, glass fibre, stearic acid mixing, phenolic resin melting, 50-60 revs/min of stirring are heated to 30-50 minutes, take out, cooling, stripping and slicing freezes 10-20 minutes at -20--10 DEG C, take out modified materials are spare;
(2) citric acid solution of a concentration of 3-4% of surface spraying is obtained in zeolite powder, is dried, 100-200 mesh sieve is crossed in grinding, It is spare that zeolite powder is obtained after must pre-processing;
(3) linseed oil is put into reaction kettle and is heated up to boil, remaining raw material is then added while stirring, stir 30- It is 40 minutes, cooling, stripping and slicing;
(4) lump material is ground, after sieving to get.
A kind of capacitor packing material, it is characterised in that:Heating melting temperature is 100-110 DEG C in step (1).
A kind of capacitor packing material, it is characterised in that:The drying temperature of step (2) is 70-80 DEG C.
A kind of capacitor packing material, it is characterised in that:Sieving in step (4) was 100-120 mesh sieve.
Beneficial effects of the present invention are:Inventive formulation is simple, and preparation method is simple and easy to do, by being carried out to phenolic resin It is modified, its heat-resisting cold resistance is improved, then by rational formula, increases its elasticity and stability, it is nontoxic, using stable; The addition of zeolite powder and glass fibre can increase the heat-resisting cold resistance of the present invention.
Specific implementation mode
A kind of capacitor packing material is made by the raw material of following weight (kg):Epoxy resin 40, phenolic resin 10, curing agent 55061, zeolite powder 5, organic silicon defoamer 3, diisocyanate 2, glass fibre 1, stearic acid 5, linseed oil 2, Alkyl glycosides 2.
A kind of capacitor packing material, preparation method are:
(1) after phenolic resin, glass fibre, stearic acid mixing, 100 DEG C of phenolic resin meltings, 60 revs/min of stirrings are heated to 30 minutes, take out, cooling, stripping and slicing freezes 20 minutes at -20 DEG C, take out modified materials are spare;
(2) citric acid solution of surface spraying a concentration of 3%, 75 DEG C of drying are obtained in zeolite powder, grinding is sieved with 100 mesh sieve, obtained It is spare that zeolite powder is obtained after pretreatment;
(3) linseed oil is put into reaction kettle and is heated up to boil, remaining raw material is then added while stirring, stir 30- It is 40 minutes, cooling, stripping and slicing;
(4) lump material is ground, cross 120 mesh sieve after to get.

Claims (5)

1. a kind of capacitor packing material, which is characterized in that it is made by the raw material of following weight parts:Epoxy resin 35-40, Phenolic resin 10-20, curing agent 55061-2, zeolite powder 3-5, organic silicon defoamer 1-3, diisocyanate 1-2, glass fibre 1-3, stearic acid 5-7, linseed oil 1-2, alkyl glycosides 1-2.
2. a kind of capacitor packing material according to claim 1, it is characterised in that:Preparation method is:
(1) after phenolic resin, glass fibre, stearic acid mixing, phenolic resin melting, 50-60 revs/min of stirring 30-50 are heated to Minute, take out, cooling, stripping and slicing freezes 10-20 minutes at -20--10 DEG C, take out modified materials are spare;
(2) citric acid solution of a concentration of 3-4% of surface spraying is obtained in zeolite powder, is dried, and grinding is crossed 100-200 mesh sieve, obtained pre- It is spare that zeolite powder is obtained after processing;
(3) linseed oil is put into reaction kettle and is heated up to boil, remaining raw material, 30-40 points of stirring are then added while stirring Clock, cooling, stripping and slicing;
(4) lump material is ground, after sieving to get.
3. a kind of capacitor packing material according to claim 2, it is characterised in that:Melting temperature is heated in step (1) It is 100-110 DEG C.
4. a kind of capacitor packing material according to claim 2, it is characterised in that:The drying temperature of step (2) is 70- 80℃。
5. a kind of capacitor packing material according to claim 2, it is characterised in that:Sieving in step (4) was 100-120 mesh sieves.
CN201810597147.1A 2018-06-11 2018-06-11 A kind of capacitor packing material Pending CN108806975A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810597147.1A CN108806975A (en) 2018-06-11 2018-06-11 A kind of capacitor packing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810597147.1A CN108806975A (en) 2018-06-11 2018-06-11 A kind of capacitor packing material

Publications (1)

Publication Number Publication Date
CN108806975A true CN108806975A (en) 2018-11-13

Family

ID=64089041

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810597147.1A Pending CN108806975A (en) 2018-06-11 2018-06-11 A kind of capacitor packing material

Country Status (1)

Country Link
CN (1) CN108806975A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115819986A (en) * 2022-12-06 2023-03-21 广东石成科技有限公司 Capacitor filling composite material and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1546566A (en) * 2003-12-12 2004-11-17 无锡市化工研究设计院 Molding compound for sheet tantalum capacitor
CN1649954A (en) * 2002-04-26 2005-08-03 三菱化学株式会社 Polypropylene aqueous dispersion, polypropylene composite aqueous emulsion composition, and use thereof
WO2008104240A1 (en) * 2007-02-28 2008-09-04 Henkel Ag & Co. Kgaa Active ingredient carrier systems
CN106847503A (en) * 2016-12-31 2017-06-13 刘思言 Capacitor packing material is formulated

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1649954A (en) * 2002-04-26 2005-08-03 三菱化学株式会社 Polypropylene aqueous dispersion, polypropylene composite aqueous emulsion composition, and use thereof
CN1546566A (en) * 2003-12-12 2004-11-17 无锡市化工研究设计院 Molding compound for sheet tantalum capacitor
WO2008104240A1 (en) * 2007-02-28 2008-09-04 Henkel Ag & Co. Kgaa Active ingredient carrier systems
CN106847503A (en) * 2016-12-31 2017-06-13 刘思言 Capacitor packing material is formulated

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115819986A (en) * 2022-12-06 2023-03-21 广东石成科技有限公司 Capacitor filling composite material and preparation method thereof
CN115819986B (en) * 2022-12-06 2023-08-22 广东石成科技有限公司 Capacitance filling composite material and preparation method thereof

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Application publication date: 20181113

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