CN108764436B - Single-interface strip unit, single-interface strip, module and smart card - Google Patents
Single-interface strip unit, single-interface strip, module and smart card Download PDFInfo
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- CN108764436B CN108764436B CN201810942969.9A CN201810942969A CN108764436B CN 108764436 B CN108764436 B CN 108764436B CN 201810942969 A CN201810942969 A CN 201810942969A CN 108764436 B CN108764436 B CN 108764436B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 81
- 239000011889 copper foil Substances 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000003466 welding Methods 0.000 claims description 72
- 238000003801 milling Methods 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000014759 maintenance of location Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 description 16
- 238000005538 encapsulation Methods 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The application provides a single-interface strip unit, which comprises a base material, wherein one surface of the base material is covered with copper foil, the copper foil is used as a copper foil surface, 8 contacts of C1-C8 are arranged on the copper foil surface, and the contacts are electrically isolated from each other through an insulating tape; any two contacts of C4, C6 and C8 are used as a first contact and a second contact; holes are arranged on the substrate areas corresponding to the first contact, the second contact, the C1 contact, the C2 contact, the C3 contact, the C5 contact and the C7 contact; the areas where the first contact and the second contact are located extend to adjacent contacts respectively to form a first extension area and a second extension area; the application further provides a strip and a module of the unit using the single-interface strip, and a smart card using the module. The application has better compatibility and higher popularization flexibility.
Description
Technical Field
The present application relates to the field of smart cards, and in particular, to a single interface stripe unit, a single interface stripe, a module, and a smart card.
Background
The existing dual-interface smart chip card (IC card) has the contact and non-contact read-write operation functions, and the dual-interface IC module on the market mainly uses special dual-interface strip package, and the dual-interface strip contains two layers of copper foils, namely, a contact surface (hereinafter, a front surface can be used for meaning) copper foil is used for a contact interface, and a welding surface (or a pressure welding surface and an encapsulation surface, hereinafter, a welding surface can be used for meaning) copper foil is used for a non-contact interface, so that the front and back two layers of copper foils are required to be manufactured on the strip, and etching, nickel plating, gold plating and other processes are required to be performed on the strip. This results in a dual interface strip price that is higher than Shan Jiemian strips.
The contact and circuit of the welding surface are formed in the strip production process, and after the module packaging process, the non-contact interface circuit of the chip and the antenna coil loop embedded in the card are conducted, so that the non-contact function of the IC card is realized. The industry refers to a large module with 8 contacts as an 8PIN module according to ISO standards. While a small module with 6 contacts is called a 6PIN module. The 8 contact interface pads of the 8pin module are identified by C1, C2, …, C8, respectively, according to ISO-7816. Wherein C4 and C8 are designed as reserved areas and have no practical use, whereas C6 was originally designed to power the EEPROM, but since the program voltage (Programming Voltage) required by the EEPROM is controlled directly from the chip later, C6 is usually not used anymore.
Based on the above, in the prior art, a single interface tape is used to package a dual interface module, for example, the invention of patent No. 201710245152.1 is applied, and the principle is that the non-contact interface gold wire and the card-based antenna of the module welding surface are bridged by punching the base material through the reserved and unused C4, C8 and C6 areas on the 8pin module, so that the copper foil manufacturing of the welding surface is omitted. However, the design is limited to the existing C4, C8 or C6 region on the 8pin module, so that the position of the non-antenna bonding pad is not consistent with the existing design, and therefore, the compatibility of the dual-interface module in the sealing and testing and card manufacturing processes is poor, and the further popularization of the dual-interface module in the market is not flexible.
Disclosure of Invention
In order to solve the problems, the single-interface strip unit comprises a base material, wherein one surface of the base material is covered with copper foil, 8 contacts of C1-C8 are arranged on the copper foil surface as a copper foil surface, and the contacts are electrically isolated from each other through an insulating tape;
Any two contacts of C4, C6 and C8 are used as a first contact and a second contact; holes are arranged on the substrate areas corresponding to the first contact, the second contact, the C1 contact, the C2 contact, the C3 contact, the C5 contact and the C7 contact;
The areas where the first contact and the second contact are located extend to adjacent contacts respectively to form a first extension area and a second extension area; and the substrate areas corresponding to the first extension area and the second extension area are respectively provided with a first base hole and a second base hole.
Preferably, the side where the C5-C8 contact is located is set as the width of the single interface strip unit, the sides where the C1, C5 are located are set as the height of the single interface strip unit, a coordinate axis is established by taking the center of the single interface strip unit as an origin, an axis parallel to the width is set as an x axis, an axis parallel to the height is set as a y axis, the actual height of the single interface strip unit is set as l, the minimum remaining height of the single interface strip unit is h, the widths of C2, C3, C6 and C7 are all a, the widths of C1, C4, C5 and C8 are all b, and the height of the insulating tape separating the two contacts is set as s;
Then it is possible to obtain:
the extension region of C8 on C6 and C7 is as follows: The extension at C5 ranges from:
the extension of C6 over C5 ranges from: the extension at C7 ranges from: the extension at C8 ranges from:
the extension region of C4 on C3 and C2 is as follows: the extension of C4 over C1 ranges from:
The application also provides a single-interface strip using the single-interface strip unit, wherein the single-interface strip is composed of at least two single-interface strip units.
The application also provides a module using the single-interface strip unit, wherein the module comprises the single-interface strip unit and a chip;
The surface, opposite to the copper foil surface, of the single-interface strip unit is a welding surface, and the chip is arranged on the welding surface;
The welding surface is provided with contact surface bonding pads at positions of holes corresponding to the contacts, and the holes enable the contacts to be electrically conducted with the corresponding contact surface bonding pads;
the chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which is correspondingly and electrically connected with the contact surface bonding pads of the C1, C2, C3, C5 and C7 contacts;
The contact surface bonding pads of the first contact and the second contact are respectively LA contact surface bonding pads and LB contact surface bonding pads;
The LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the chip LA bonding pad and the chip LB bonding pad;
an antenna LA welding pad and an antenna LB welding pad are respectively arranged on the welding surface of the single-interface strip unit at the positions of the first base hole and the second base hole; the first and second base holes electrically communicate the first and second contacts with the antenna LA bond pad and the antenna LB bond pad.
The application also provides an intelligent card using the module, which comprises a card base, a module and an antenna coil, wherein the antenna coil is arranged in the card base, a milling groove is formed in the surface of the card base, and the module is inlaid in the milling groove;
the antenna LA bonding pad and the antenna LB bonding pad are electrically connected to both ends of the antenna coil loop, respectively.
Preferably, the card base is provided with an antenna LA pad and an antenna LB pad, and the antenna LA pad and the antenna LB pad are respectively connected with two ends of the antenna coil loop;
The antenna LA bond pad and the antenna LB bond pad are electrically connected to the antenna LA bond pad and the antenna LB bond pad, respectively.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are respectively arranged at two opposite ends of the milling groove on the card base, and the antenna LA bonding pad and the antenna LB bonding pad are respectively arranged at positions corresponding to the antenna LA bonding pad and the antenna LB bonding pad.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are connected with two ends of the antenna coil loop by adopting an antenna enameled wire direct welding method.
Preferably, the antenna LA bonding pad and the LB bonding pad are connected with the antenna LA bonding pad and the antenna LB bonding pad by welding or conductive adhesive.
The application also provides a single-interface strip unit, which comprises a base material, wherein one surface of the base material is covered with copper foil, the copper foil surface is used as a copper foil surface, a central area is arranged on the copper foil surface, 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area, and the copper foil area of the C5 contacts surrounds the central area; the contacts are electrically isolated from each other by an insulating tape;
a third contact is arranged between the C1 contact and the C5 contact, and a fourth contact is arranged between the C3 contact and the C7 contact; the third contact, the fourth contact and other contacts are isolated through insulating electrification respectively;
holes are formed in the substrate areas corresponding to the third contact, the fourth contact, the C1 contact, the C2 contact, the C3 contact, the C5 contact, the C6 contact and the C7 contact;
and the third contact and the fourth contact are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate region.
Preferably, the side where C5-C7 is located is set as the width of the single interface strip unit, the sides where C3 and C7 are located is set as the height of the single interface strip unit, the center of the single interface strip unit is taken as the origin to establish a coordinate axis, the axis parallel to the width is taken as the x axis, the axis parallel to the height is taken as the y axis, the actual height of the single interface strip unit is set as l, the minimum reserved heights of the contacts are p, the widths of C2 and C6 are C, the widths of C1, C3, C5 and C7 are d, the height is m, the height of the insulating tape isolating the two contacts is set as s,
The range with the third contact is:
Wherein,
The range of the fourth contact is: Wherein,
Preferably, either the third or the fourth contact is replaced by a C6 and/or a C6 extending extension to the adjacent contact.
Preferably, the sides where C5, C6 and C7 are located are set as the width of the single interface strip unit, the sides where C3 and C7 are located are set as the height of the single interface strip unit, the center of the single interface strip unit is taken as the origin to establish a coordinate axis, the axis parallel to the width is taken as the x axis, the axis parallel to the height is taken as the y axis, the actual height of the single interface strip unit is set as l, the minimum reserved height of the module is h, the widths of C1, C3, C5 and C7 are d, the widths of C2 and C6 are C, and the height of the insulating strip isolating the two contacts is s;
the extension of C6 in the C5 region is:
then the extension of C6 in the C7 region is:
The application also provides a single-interface strip using the single-interface strip unit, wherein the single-interface strip is composed of at least two single-interface strip units.
The application also provides a module using the single-interface strip unit, wherein the module comprises the single-interface strip unit and a chip;
The surface, opposite to the copper foil surface, of the single-interface strip unit is a welding surface, and the chip is arranged on the welding surface;
A contact surface bonding pad is arranged on the welding surface at the position of the hole corresponding to the contact; the holes enable the contacts to be electrically conducted with corresponding contact surface bonding pads;
The chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which are correspondingly and electrically connected with the contact surface bonding pads of the C1, C2, C3, C5 and C7 contacts;
The positions of the corresponding holes of the third contact and the fourth contact on the welding surface are respectively provided with an LA contact surface bonding pad and an LB contact surface bonding pad; the third contact and the fourth contact are electrically communicated with the LA contact surface bonding pad and the LB contact surface bonding pad through corresponding holes;
The LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the chip LA bonding pad and the chip LB bonding pad;
And the welding surfaces of the single-interface strip units are respectively provided with an antenna LA welding pad and an antenna LB welding pad at the positions of the third base hole and the fourth base hole, and the third base hole and the fourth base hole enable the third contact and the fourth contact to be electrically conducted with the antenna LA welding pad and the antenna LB welding pad.
The application also provides an intelligent card using the module, which comprises a card base, a module and an antenna coil, wherein the antenna coil is arranged in the card base, a milling groove is formed in the surface of the card base, and the module is inlaid in the milling groove;
the antenna LA bonding pad and the antenna LB bonding pad are electrically connected to both ends of the antenna coil loop, respectively.
Preferably, the card base is provided with an antenna LA pad and an antenna LB pad, and the antenna LA pad and the antenna LB pad are respectively connected with two ends of the antenna coil loop;
The antenna LA bond pad and the antenna LB bond pad are electrically connected to the antenna LA bond pad and the antenna LB bond pad, respectively.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are respectively arranged at two opposite ends of the milling groove on the card base, and the antenna LA bonding pad and the antenna LB bonding pad are respectively arranged at positions corresponding to the antenna LA bonding pad and the antenna LB bonding pad.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are connected with two ends of the antenna coil loop by adopting an antenna enameled wire direct welding method.
Preferably, the antenna LA bonding pad and the LB bonding pad are connected with the antenna LA bonding pad and the antenna LB bonding pad by welding or conductive adhesive.
The application also provides a single-interface strip unit which comprises a base material, wherein one surface of the base material is covered with copper foil, the copper foil surface is used as a copper foil surface, a central area is arranged on the copper foil surface, and 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area; the contacts are electrically isolated from each other by an insulating tape;
A fifth contact is arranged between the C1 contact and the C5 contact, and a sixth contact is arranged between the C3 contact and the C7 contact; wherein the central region is surrounded by an extended copper foil region; the extended copper foil area is an extended copper foil area of a fifth contact, an extended copper foil area of a sixth contact or a combination of the extended copper foil areas of the fifth contact and the sixth contact;
The fifth contact and the sixth contact are isolated by an insulating tape; the fifth contact, the sixth contact and other contacts are isolated by insulating electrification respectively;
Holes are formed in the substrate areas corresponding to the fifth contact, the sixth contact, the C1 contact, the C2 contact, the C3 contact, the C5 contact, the C6 contact and the C7 contact;
and the fifth contact and the sixth contact are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate region.
Preferably, all or part of the holes are arranged on the extended copper foil area of the corresponding contact.
Preferably, the side where C5-C7 is located is set as the width of the single interface strip unit, the sides where C3 and C7 are located is set as the height of the single interface strip unit, the center of the single interface strip unit is taken as the origin to establish a coordinate axis, the axis parallel to the width is taken as the x axis, the axis parallel to the height is taken as the y axis, the actual height of the single interface strip unit is set as l, the minimum reserved heights of the contacts are p, the widths of C2 and C6 are C, the widths of C1, C3, C5 and C7 are d, the height is m, the height of the insulating tape isolating the two contacts is set as s,
The range of the copper foil area with the fifth contact disposed between C1 and C5 is:
Wherein,
The range of the copper foil area where the sixth contact is disposed between C3 and C7 is: Wherein,
Preferably, either the fifth contact or the sixth contact is replaced by C6 and/or an extension of C6 towards the adjacent contact.
Preferably, the sides where C5, C6 and C7 are located are set as the width of the single interface strip unit, the sides where C3 and C7 are located are set as the height of the single interface strip unit, the center of the single interface strip unit is taken as the origin to establish a coordinate axis, the axis parallel to the width is taken as the x axis, the axis parallel to the height is taken as the y axis, the actual height of the single interface strip unit is set as l, the minimum reserved height of the module is h, the widths of C1, C3, C5 and C7 are d, the widths of C2 and C6 are C, and the height of the insulating strip isolating the two contacts is s;
the extension of C6 in the C5 region is:
then the extension of C6 in the C7 region is:
The application also provides a single-interface strip using the single-interface strip unit, wherein the single-interface strip is composed of at least two single-interface strip units.
The application also provides a module using the single-interface strip unit, wherein the module comprises the single-interface strip unit and a chip;
The surface, opposite to the copper foil surface, of the single-interface strip unit is a welding surface, and the chip is arranged on the welding surface;
A contact surface bonding pad is arranged on the welding surface at the position of the hole corresponding to the contact; the holes enable the contacts to be electrically conducted with corresponding contact surface bonding pads;
The chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which are correspondingly and electrically connected with the contact surface bonding pads of the C1, C2, C3, C5 and C7 contacts;
The positions of the corresponding holes of the third contact and the fourth contact on the welding surface are respectively provided with an LA contact surface bonding pad and an LB contact surface bonding pad; the third contact and the fourth contact are electrically communicated with the LA contact surface bonding pad and the LB contact surface bonding pad through corresponding holes;
The LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the chip LA bonding pad and the chip LB bonding pad;
And the welding surfaces of the single-interface strip units are respectively provided with an antenna LA welding pad and an antenna LB welding pad at the positions of the third base hole and the fourth base hole, and the third base hole and the fourth base hole enable the third contact and the fourth contact to be electrically conducted with the antenna LA welding pad and the antenna LB welding pad.
The application also provides an intelligent card using the module, which comprises a card base, a module and an antenna coil, wherein the antenna coil is arranged in the card base, a milling groove is formed in the surface of the card base, and the module is inlaid in the milling groove;
the antenna LA bonding pad and the antenna LB bonding pad are electrically connected to both ends of the antenna coil loop, respectively.
Preferably, the card base is provided with an antenna LA pad and an antenna LB pad, and the antenna LA pad and the antenna LB pad are respectively connected with two ends of the antenna coil loop;
The antenna LA bond pad and the antenna LB bond pad are electrically connected to the antenna LA bond pad and the antenna LB bond pad, respectively.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are respectively arranged at two opposite ends of the milling groove on the card base, and the antenna LA bonding pad and the antenna LB bonding pad are respectively arranged at positions corresponding to the antenna LA bonding pad and the antenna LB bonding pad.
Preferably, the antenna LA bonding pad and the antenna LB bonding pad are connected with two ends of the antenna coil loop by adopting an antenna enameled wire direct welding method.
Preferably, the antenna LA bonding pad and the LB bonding pad are connected with the antenna LA bonding pad and the antenna LB bonding pad by welding or conductive adhesive.
According to the invention, the gold wires and the card-based antennas of the non-contact interface of the welding surface of the module are bridged on the expansion areas of the C4, C8 and C6 areas of the module through the punching of the base material, so that the copper foil manufacturing of the welding surface is omitted, the design is not limited to the existing C4, C8 or C6 areas in the module, the position of the non-antenna bonding pad is consistent with the existing design, the good compatibility is realized in the sealing, testing and card manufacturing processes, and the market popularization is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings to those skilled in the art.
Fig. 1 is a schematic diagram of the overall structure of a dual-interface smart card using a single-interface strip in the prior art.
Fig. 2 is a diagram showing the positions of the antenna LA pads and the antenna LB pads on the milling grooves in the present embodiment 1.
Fig. 3 is a structural diagram of an 8pin module in embodiment 1.
Fig. 4 is a structural diagram of a 6pin module in embodiment 2.
Fig. 5 is a structural diagram of a 6pin module in embodiment 3.
Reference numerals:
1-card-base 2-module 3-antenna coil 4 chip
5 Contact surface bonding pad 6 antenna LA bonding pad 7 antenna LB bonding pad
8-Chip LA bonding pad 9-chip LB bonding pad 10-chip contact surface bonding pad
11 Third contact 12 fourth contact
21 Milling flutes 22 antenna LA pad 23 antenna LB pad 24 insulating tape
25 Extend copper foil area 26 encapsulates glue area 27 fifth contact 28 sixth contact.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The single interface strip in the application refers to a strip coated with copper foil on one side of a substrate, and a chip is arranged on the other side of the substrate, and the single interface strip is used for electrically conducting the copper foil and the chip by arranging antenna pad holes on the substrate.
The modules for the smart card are divided into two types, an 8pin module and a 6pin module, and the internal structures thereof are shown in fig. 3 and 4, respectively.
Example 1
In this embodiment, as shown in fig. 1, the smart card of the present application includes a card base 1, a module 2, and an antenna coil 3, where the antenna coil 3 is disposed inside the card base 1, a milling groove 21 is disposed on the surface of the card base 1, and the module 2 is embedded in the milling groove 21;
the module 2 of the application comprises a single interface strip unit and a chip; the single-interface strip units are formed by cutting single-interface strips, that is to say, the single-interface strips are formed by a plurality of single-interface strip units.
The single-interface strip unit comprises a base material, wherein one surface of the base material is covered with copper foil, 8 contacts of C1-C8 are arranged on the surface where the copper foil is located, and the contacts are electrically isolated from each other through an insulating tape; in this embodiment, the substrate is an epoxy glass substrate.
The module of the smart card comprises a single-interface strip unit and a chip 4, wherein the chip 4 is arranged on the other surface of the copper-clad surface of the base material of the single-interface strip; the whole structure of the dual-interface smart card is shown in fig. 1 and 2, and comprises a card base 1, an antenna coil 3 inside the card base 1 and a module 2 embedded in a milling groove 21 of the card base 1;
As shown in fig. 3, the positions and the sizes of 8 contacts of the C1-C8 contacts meet the ISO7816 standard, and holes penetrating through the base material are formed in the base material areas corresponding to the first contact, the second contact, the C1, the C2, the C3, the C5 and the C7 contacts; the contact surface bonding pad of each contact is arranged at the position of the corresponding hole and is arranged on the reverse side of the surface of the copper foil of the module; through the holes, the contact is electrically conducted with the contact surface bonding pad;
in the prior art, C6 was earlier defined as the programming voltage contact point (Vpp), which is now not commonly used, in practice only for SWP interfaces in SIM cards; while C4 and C8 are reserved, are used in practice for USB high speed interfaces, or other shaped antenna interfaces, and are not currently in common use.
Thus, we extend C4 to the outside regions of C3, C2 and C1; extending C8 to the outer side areas of C7, C6 and C5 to form two extension areas;
The side of the module where C5-C8 is located is set to be the width of the module, the sides where C1 and C5 are located are set to be the height of the module, and in order to enable the module to be read, the height of the module must be greater than a certain reserved height, that is, the range of the extension area from C8 to C5, C6 and C7 must be set to be the area from the side where C5-C8 is located to be less than a certain height.
The method comprises the steps of establishing a coordinate axis by taking the center of a module as an origin, setting an axis parallel to the width of the smart card module as an x axis, setting an axis parallel to the height of the smart card module as a y axis, setting the actual height of the module as l (comprising insulating strips on two sides), setting the minimum reserved height of the module as h, setting the widths of the insulating strips between contacts as s, setting the widths of C2, C3, C6 and C7 as a (excluding insulating strips on two sides), and setting the widths of C1, C4, C5 and C8 as b (excluding insulating strips on two sides);
Then it is possible to obtain:
the extension region of C8 on C6 and C7 is as follows: The extension at C5 ranges from:
the extension of C6 over C5 ranges from: the extension at C7 ranges from: the extension at C8 ranges from:
the extension region of C4 on C3 and C2 is as follows: the extension of C4 over C1 ranges from:
In this embodiment, the height of the module is 12.6mm, and according to the definition of ISO/IEC 7816-2, it is possible to obtain a minimum reserved height of 9.62mm for the module to be read by a card reader, wherein the width of the insulating tape 24 electrically separating the two contacts is 0.15mm;
It is possible to obtain a maximum height of the extension zone of C8 which can be set to C5, C6, C7 of (12.6-9.62)/2-0.15=1.34 mm;
Similarly, the maximum height of the extension region of C4 on the C1, C2, C3 contacts may be: (12.6-9.62)/2-0.15=1.34 mm;
An antenna pad hole is respectively formed on the epoxy glass substrate of the module with the C4 and C8 settable extension areas, and in this embodiment, the antenna pad hole is in a shape of an annular racetrack or an ellipse, and the size is 2.2 x 1mm; setting an antenna LA welding pad 6 and an antenna LB welding pad 7 at antenna pad holes on the welding surface of the module, wherein one surface of the copper foil covered on the module is the copper foil surface of the module, and one surface of the copper foil covered on the module is the welding surface;
The chip 4 is provided with a chip LA bonding pad 8, a chip LB bonding pad 9 and 5 chip contact surface bonding pads 10 connected with the contact surface bonding pads 5 of C1, C2, C3, C5 and C7 contacts;
The antenna coil 3 is provided with an antenna LA pad 22 and an antenna LB pad 23 on both sides of the slot 21, the antenna LA pad 22 and the antenna LB pad 23 being connected to both ends of the loop of the antenna coil 3, respectively.
The antenna LA bond pad 6 and the antenna LB bond pad 7 on the module 2 are electrically connected to the antenna LA bond pad 8 and the antenna LB bond pad 9 on the antenna coil 3, respectively.
The contact surface bonding pads of the contacts where the antenna LA bonding pad 6 and the antenna LB bonding pad 7 are positioned are respectively electrically connected with the chip LA bonding pad 8 and the chip LB bonding pad 9;
the antenna LA pads 8 and the antenna LB pads 9 are respectively arranged at two ends of the milling groove 21, and the antenna LA and LB pads correspond to the antenna LA and LB pads in position.
The bonding pads arranged on the module 2 and the chip 4 conform to the ISO7816 standard.
And C8 is subjected to the same design change as C4, and under the condition that the height of the module is larger than the minimum reserved height, the contact areas of C7, C6 and C5 are extended to form an extension area, punching is carried out on the extension area, and an antenna LB welding pad is arranged at the punching position of the welding surface of the module to form another bridge connection.
With the above arrangement, the antenna LA bond pad 6, the antenna LB bond pad 7, and the contact surface pad 5 are naturally conducted by copper foil on the circuit, and bridge the chip 4 and the antenna coil 3.
In addition to bonding the contact pads of C1, C2, C3, C5, C7 to the corresponding chip contact pads by gold wires, the chip LA pads 8 are electrically connected to the contact pads of C8 by gold wires (or other forms) during the module packaging process. The LB pads 9 of the chip are also electrically connected to the C4 contact pads.
In the encapsulation process, the die is covered with an encapsulation compound on the soldering face of the module 2, the gold wires and the contact face pads of C1, C2, C3, C5, C6, C7 and C4, C8 are covered with an encapsulation compound and cured, while the rest including the antenna LA soldering pads 6 and the antenna LB soldering pads 7 are exposed. And after the module is packaged, performing a test procedure.
Finally, the antenna LA bonding pad 6 of the module 2 and the antenna LB bonding pad 7 are electrically connected with the antenna LA bonding pad 22 and the antenna LB bonding pad 23 of the antenna coil 3 respectively by using welding or other methods, and then the module 2 is flatly embedded in the milling groove 21 and is adhered and fixed on the surface of the card base, and the antenna connecting part is hidden.
As an alternative embodiment, any of the C4 and C8 bridges of the above embodiment may be replaced by a C6 contact, where one of the LA pads or LB pads of the chip is electrically connected to the contact surface pad of the C6 by gold wire bonding or the like.
When using C6 contacts instead, bridging may be formed by punching holes in the C6 contacts or in the extension of C6 to adjacent contacts in case the height of the module is greater than the minimum retention height.
The connection between the antenna LA and the LB bonding pads and the antenna LA and LB bonding pads on the module may be performed by other methods than soldering, such as conductive adhesive connection, or by directly soldering the antenna enamel wire (omitting the antenna LA and LB bonding pads).
If the design size also needs to be compatible with other industry standards which the card must conform to, the size is calculated separately to be compatible.
Embodiment two:
The dual-interface smart card in the embodiment adopts a 6pin module, and the 6pin module comprises a single-interface strip unit and a chip; the single-interface strip units are formed by cutting single-interface strips, that is to say, the single-interface strips are formed by a plurality of single-interface strip units.
A central area is arranged in the center of a single-interface strip unit used by the 6pin module, and 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area, wherein a copper foil area of the C5 contacts surrounds the central area; the contacts are electrically isolated from each other by an insulating tape;
a separate metal contact 11 (i.e. a third contact) is arranged between C1 and C5;
A separate metal contact 12 (i.e., a fourth contact) is provided between C3 and C7, the third and fourth contacts being represented in fig. 4 by the shaded portions; the third contact 11 and the fourth contact 12 are isolated from other contacts by an insulating charge.
The third contact 11, the fourth contact 12 and the other 6 contacts are also respectively provided with a contact surface bonding pad 5;
Base holes are respectively arranged on the base materials of the third contact 11 and the fourth contact 12, and an antenna LA welding pad 6 and an antenna LB welding pad 7 are respectively arranged on the two base holes;
As in the embodiment, the contact surface pads 5 of C1, C2, C3, C5, C7 are electrically connected to the corresponding chip contact surface pads 10 on the chip 4; the contact surface bonding pads 5 of the contacts where the antenna LA bonding pads 6 and the antenna LB bonding pads 7 are located are electrically connected with the chip LA bonding pads 8 and the chip LB bonding pads 9, respectively;
The antenna LA bond pad 6 and the antenna LB bond pad 7 are electrically connected to the antenna LA bond pad 22 and the antenna LB bond pad 23, respectively.
Wherein the side where C5-C7 is located is set as the width of the single interface strip unit, the sides where C3 and C7 are located are set as the height of the single interface strip unit, the center of the single interface strip unit is taken as the origin to establish a coordinate axis, the axis parallel to the width is taken as the x axis, the axis parallel to the height is taken as the y axis, the actual height of the single interface strip unit is set as l (including two side insulating strips), the minimum reserved height of the contacts is p, the widths of C2 and C6 are C (excluding two side insulating strips), the widths of C1, C3, C5 and C7 are d (excluding two side insulating strips), the height of the insulating strip between the two contacts is set as s,
The range with the third contact is:
Wherein,
The range of the fourth contact is:
Wherein,
According to the minimum allowable height 2.0mm and the minimum reserved height 9.62mm of each contact defined by ISO/IEC 7816-2, the maximum heights of the third contact 11 and the fourth contact 12 can be calculated to be 9.62-2 x 2-2 x 0.15=5.32 mm, and the third contact 11 arranged between C1 and C5 equally divides C1 and C5; the fourth contact 12 provided between C3 and C7 equally divides C3 and C7, the third contact 11 has a width of C1, and the fourth contact 12 has a width of C3.
The dimensions of the antenna LA and LB bond pads were respectively set to be oval or racetrack loop with a length and width of 1.5 x 0.8 mm.
The method of gold wire soldering of other contacts, the encapsulation method of the module, the arrangement of the antenna LA and LB pads on the card base, the connection method of the module and the card antenna, etc. are the same as in the embodiment of the 8-contact dual interface smart card.
In the above method, as another alternative embodiment, it is also possible if any one of the two bridge areas is replaced by a C6 bridge. In which case its corresponding antenna LA or LB bond pad is disposed opposite the C6 copper foil area.
In this case, if necessary, C6 and its bonding pads may also be extended appropriately to take the area of C5, C7, and similar to the embodiment, the sides where C5, C6, C7 are located on the dual-interface smart card are set as the width of the module, the sides where C3, C7 are located are set as the height of the module, the center of the module is taken as the origin to establish a coordinate axis, the axis parallel to the width is taken as the x-axis, the axis parallel to the height is taken as the y-axis, the actual height of the module is set as l, the minimum reserved height of the module is h (the minimum reserved height refers to fig. 3), the widths of C1, C3, C5, C7 are d (excluding the two-side insulating tapes), and the widths of C2, C6 are C (excluding the two-side insulating tapes);
the extension of C6 in the C5 region is:
then the extension of C6 in the C7 region is:
if the bridge area is designed to be in consideration of other industry standards in size, the size is calculated separately.
Embodiment III:
the dual-interface smart card in this embodiment adopts a 6pin module, as shown in fig. 5, and has a total of 6 contacts of C1, C2, C3, C5, C6, and C7, the copper foil surface of the 6pin module is provided with a central area, and a total of 6 contacts of C1, C2, C3, C5, C6, and C7 are provided around the central area; the contacts are electrically isolated from each other by an insulating tape;
A fifth contact 27 is provided between the C1 contact and the C5 contact, and a sixth contact 28 is provided between C3 and C7; wherein the central region is surrounded by an extended copper foil region 25; the extended copper foil area 25 may be an extended copper foil area of the fifth contact, an extended copper foil area of the sixth contact, or a combination of the extended copper foil areas of the fifth contact and the sixth contact;
The fifth contact and the sixth contact are isolated by insulating electrification; the fifth contact, the sixth contact and other contacts are isolated by insulating electrification respectively.
Shown in fig. 5 is the case where the extended copper foil area 25 surrounding the central area is entirely the copper foil area of the fifth contact 27, in which case the fifth contact 27, the sixth contact 28, and the other 6 contact areas are provided with contact surface pads, respectively; base holes are respectively arranged on the base materials corresponding to the fifth contact 27 and the sixth contact 28, and antenna LA and LB welding pads are respectively arranged on the two base holes;
As can be seen from fig. 5, the holes where the contact pads of the fifth contact are located are arranged on the extended copper foil area, and all or part of the holes may be arranged on the extended copper foil area of the corresponding contact, in this embodiment, for packaging convenience, the contact pads are all arranged in the encapsulation glue range 26, and the antenna LA and LB soldering pads are arranged outside the encapsulation glue range 26.
In the second embodiment, the contact surface pads 5 of C1, C2, C3, C5, and C7 are electrically connected to the corresponding chip contact surface pads on the chip 4 respectively; the contact surface bonding pads of the contacts where the antenna LA and the LB bonding pads are positioned are respectively electrically connected with the chip LA and the chip LB bonding pads;
The antenna LA and LB bonding pads are respectively and electrically connected with the antenna LA and LB bonding pads.
Wherein the side where C5-C7 is located is set as the width of the single interface strip unit, the sides where C3 and C7 are located are set as the height of the single interface strip unit, the center of the single interface strip unit is taken as the origin to establish a coordinate axis, the axis parallel to the width is taken as the x axis, the axis parallel to the height is taken as the y axis, the actual height of the single interface strip unit is set as l (including two side insulating strips), the minimum reserved height of the contacts is p (excluding two side insulating strips), the widths of C2 and C6 are C (excluding two side insulating strips), the widths of C1, C3, C5 and C7 are d (excluding two side insulating strips), the height is m (excluding two side insulating strips), the height of the insulating strips isolating two contacts is s,
Then there is a fifth contact in the range between C1 and C5:
Wherein,
The sixth contact ranges between C3 and C7: Wherein,
The method of soldering gold wires of other contacts, the encapsulation method of the module, the arrangement of the antenna LA and LB pads on the card base, the connection method of the module and the card antenna, and the like are the same as those of the embodiment.
In the above method, as another alternative embodiment, it is also possible if any one of the two bridge areas is replaced by a C6 bridge. In which case its corresponding antenna LA or LB bond pad is disposed opposite the C6 copper foil area.
In this case, if necessary, C6 and its bonding pad may be properly extended to the copper foil region of C5, C7, and the range of extension may be the same as that of the embodiment.
If the bridge area is designed to be in consideration of other industry standards in size, the size is calculated separately.
While preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts.
It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the application. It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (32)
1. A single interface strip unit comprises a base material, wherein one surface of the base material is covered with copper foil, the copper foil is used as a copper foil surface, 8 contacts of C1-C8 are arranged on the copper foil surface, and the contacts are electrically isolated from each other through an insulating tape;
Any two contacts of C4, C6 and C8 are used as a first contact and a second contact; holes are arranged on the substrate areas corresponding to the first contact, the second contact, the C1 contact, the C2 contact, the C3 contact, the C5 contact and the C7 contact;
The areas where the first contact and the second contact are located extend to the outer side areas of the adjacent contacts respectively to form a first extension area and a second extension area; the substrate areas corresponding to the first extension area and the second extension area are respectively provided with a first base hole and a second base hole;
Setting the side where C5-C8 is located as the width, setting the sides where C1 and C5 are located as the height, and setting the height to be larger than a certain reserved height so that C1-C8 can be read;
The first extension area is arranged from the side where C5-C8 is located to the area which is smaller than a certain height from the side, and the second extension area is arranged from the side where C1-C4 is located to the area which is smaller than a certain height from the side.
2. The single-interface strip unit according to claim 1, wherein the side where the C5-C8 contact is located is set as the width of the single-interface strip unit, the sides where the C1, C5 are located is set as the height of the single-interface strip unit, a coordinate axis is established by taking the center of the single-interface strip unit as an origin, an axis parallel to the width is set as an x axis, an axis parallel to the height is set as a y axis, the actual height of the single-interface strip unit is set as l, the minimum remaining height of the single-interface strip unit is set as h, the widths of C2, C3, C6, and C7 are all a, the widths of C1, C4, C5, and C8 are all b, and the height of an insulating tape separating two contacts is set as s;
Then it is possible to obtain:
the extension region of C8 on C6 and C7 is as follows: The extension at C5 ranges from:
the extension of C6 over C5 ranges from: the extension at C7 ranges from: the extension at C8 ranges from:
the extension region of C4 on C3 and C2 is as follows: the extension of C4 over C1 ranges from:
3. A single interface strip using the single interface strip unit of claim 1 or 2, wherein the single interface strip is comprised of at least two of the single interface strip units.
4. A module using the single interface strip unit of claim 1 or 2, wherein the module comprises a single interface strip unit and a chip;
The surface, opposite to the copper foil surface, of the single-interface strip unit is a welding surface, and the chip is arranged on the welding surface;
The welding surface is provided with contact surface bonding pads at positions of holes corresponding to the contacts, and the holes enable the contacts to be electrically conducted with the corresponding contact surface bonding pads;
the chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which is correspondingly and electrically connected with the contact surface bonding pads of the C1, C2, C3, C5 and C7 contacts;
The contact surface bonding pads of the first contact and the second contact are respectively LA contact surface bonding pads and LB contact surface bonding pads;
The LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the chip LA bonding pad and the chip LB bonding pad;
an antenna LA welding pad and an antenna LB welding pad are respectively arranged on the welding surface of the single-interface strip unit at the positions of the first base hole and the second base hole; the first and second base holes electrically communicate the first and second contacts with the antenna LA bond pad and the antenna LB bond pad.
5. A smart card using the module of claim 4, comprising a card base, a module and an antenna coil, wherein the antenna coil is arranged inside the card base, a milling groove is arranged on the surface of the card base, and the module is embedded in the milling groove;
the antenna LA bonding pad and the antenna LB bonding pad are electrically connected to both ends of the antenna coil loop, respectively.
6. The smart card of claim 5, wherein an antenna LA pad and an antenna LB pad are provided on the card base, the antenna LA pad and the antenna LB pad being connected to both ends of the antenna coil loop, respectively;
The antenna LA bond pad and the antenna LB bond pad are electrically connected to the antenna LA bond pad and the antenna LB bond pad, respectively.
7. The smart card of claim 6, wherein the antenna LA bond pad and the antenna LB bond pad are disposed at opposite ends of the slot in the card base, respectively, the antenna LA bond pad and the antenna LB bond pad being disposed at positions corresponding to the antenna LA bond pad and the antenna LB bond pad, respectively.
8. The smart card of claim 5, wherein the antenna LA bond pads and the antenna LB bond pads are connected to both ends of the antenna coil loop by means of antenna wire direct bonding.
9. The smart card of claim 6, wherein the antenna LA bond pads and the LB bond pads are connected to the antenna LA bond pads and the antenna LB bond pads by soldering or conductive adhesive.
10. The single-interface strip unit comprises a base material, wherein one surface of the base material is covered with copper foil, the copper foil surface is used as a copper foil surface, a central area is arranged on the copper foil surface, 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area, and the copper foil area of the C5 contacts surrounds the central area; the contacts are electrically isolated from each other by an insulating tape;
A third contact is arranged between the C1 contact and the C5 contact, and a fourth contact is arranged between the C3 contact and the C7 contact; the third contact, the fourth contact and other contacts are isolated through insulating electrification respectively; the third contact point evenly divides the C1 contact point and the C5 contact point, and the fourth contact point evenly divides the C3 contact point and the C7 contact point;
Holes are formed in substrate areas corresponding to the third contact, the fourth contact, the C1 contact, the C2 contact, the C3 contact, the C5 contact and the C7 contact;
and the third contact and the fourth contact are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate region.
11. The single interface strip unit according to claim 10, wherein the side where C5-C7 is located is set as the width of the single interface strip unit, the sides where C3, C7 are located is set as the height of the single interface strip unit, a coordinate axis is established with the center of the single interface strip unit as the origin, an axis parallel to the width is set as the x-axis, an axis parallel to the height is set as the y-axis, the actual height of the single interface strip unit is set as l, the minimum retention heights of the contacts are p, the widths of C2 and C6 are C, the widths of C1, C3, C5, C7 are d, the heights are m, the height of the insulating tape separating the two contacts is set as s,
The range with the third contact is:
Wherein,
The range of the fourth contact is: Wherein,
12. The single interface strip unit of claim 10, wherein either the third contact or the fourth contact is replaced with C6 and/or an extension of C6 to an adjacent contact.
13. The single-interface strip unit of claim 12, wherein the sides where C5, C6, C7 are located are set as the width of the single-interface strip unit, the sides where C3, C7 are located are set as the height of the single-interface strip unit, a coordinate axis is established with the center of the single-interface strip unit as an origin, an axis parallel to the width is set as an x-axis, an axis parallel to the height is set as a y-axis, the actual height of the single-interface strip unit is set as l, the minimum retention height of the module is h, the widths of C1, C3, C5, C7 are d, the widths of C2, C6 are C, and the height of the insulating strip separating the two contacts is s;
the extension of C6 in the C5 region is:
then the extension of C6 in the C7 region is:
14. A single interface strip using a single interface strip element as claimed in any one of claims 10 to 13, wherein the single interface strip is made up of at least two of the single interface strip elements.
15. A module using the single interface strip element of any of claims 10-13, wherein the module comprises a single interface strip element and a chip;
The surface, opposite to the copper foil surface, of the single-interface strip unit is a welding surface, and the chip is arranged on the welding surface;
A contact surface bonding pad is arranged on the welding surface at the position of the hole corresponding to the contact; the holes enable the contacts to be electrically conducted with corresponding contact surface bonding pads;
The chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which are correspondingly and electrically connected with the contact surface bonding pads of the C1, C2, C3, C5 and C7 contacts;
The positions of the corresponding holes of the third contact and the fourth contact on the welding surface are respectively provided with an LA contact surface bonding pad and an LB contact surface bonding pad; the third contact and the fourth contact are electrically communicated with the LA contact surface bonding pad and the LB contact surface bonding pad through corresponding holes;
The LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the chip LA bonding pad and the chip LB bonding pad;
And the welding surfaces of the single-interface strip units are respectively provided with an antenna LA welding pad and an antenna LB welding pad at the positions of the third base hole and the fourth base hole, and the third base hole and the fourth base hole enable the third contact and the fourth contact to be electrically conducted with the antenna LA welding pad and the antenna LB welding pad.
16. A smart card using the module of claim 15, comprising a card base, a module, and an antenna coil, the antenna coil being disposed inside the card base, the card base surface being provided with a milling groove, the module being embedded in the milling groove;
the antenna LA bonding pad and the antenna LB bonding pad are electrically connected to both ends of the antenna coil loop, respectively.
17. The smart card of claim 16, wherein an antenna LA pad and an antenna LB pad are provided on the card base, the antenna LA pad and the antenna LB pad being connected to both ends of the antenna coil loop, respectively;
The antenna LA bond pad and the antenna LB bond pad are electrically connected to the antenna LA bond pad and the antenna LB bond pad, respectively.
18. The smart card of claim 17, wherein the antenna LA bond pad and the antenna LB bond pad are disposed at opposite ends of the slot in the card base, respectively, the antenna LA bond pad and the antenna LB bond pad being disposed at positions corresponding to the antenna LA bond pad and the antenna LB bond pad, respectively.
19. The smart card of claim 16, wherein the antenna LA bond pads and the antenna LB bond pads are connected to both ends of the antenna coil loop by means of antenna wire direct bonding.
20. The smart card of claim 17, wherein the antenna LA bond pads and the LB bond pads are connected to the antenna LA bond pads and the antenna LB bond pads by soldering or conductive adhesive.
21. A single-interface strip unit comprises a base material, wherein one surface of the base material is covered with copper foil, the copper foil surface is used as a copper foil surface, a central area is arranged on the copper foil surface, and 6 contacts of C1, C2, C3, C5, C6 and C7 are arranged around the central area; the contacts are electrically isolated from each other by an insulating tape;
A fifth contact is arranged between the C1 contact and the C5 contact, and a sixth contact is arranged between the C3 contact and the C7 contact; wherein the central region is surrounded by an extended copper foil region; the extended copper foil area is an extended copper foil area of a fifth contact, an extended copper foil area of a sixth contact or a combination of the extended copper foil areas of the fifth contact and the sixth contact;
The fifth contact and the sixth contact are isolated by an insulating tape; the fifth contact, the sixth contact and other contacts are isolated by insulating electrification respectively; the fifth contact point evenly divides the C1 contact point and the C5 contact point, and the sixth contact point evenly divides the C3 contact point and the C7 contact point;
Holes are formed in the substrate areas corresponding to the fifth contact, the sixth contact, the C1 contact, the C2 contact, the C3 contact, the C5 contact, the C6 contact and the C7 contact;
and the fifth contact and the sixth contact are respectively provided with a third base hole and a fourth base hole at positions corresponding to the substrate region.
22. The single interface strip unit of claim 21, wherein all or part of the holes are provided on the extended copper foil regions of the respective contacts.
23. The single interface strip unit of claim 21, wherein the side where C5-C7 is located is set as the width of the single interface strip unit, the sides where C3, C7 are located is set as the height of the single interface strip unit, a coordinate axis is established with the center of the single interface strip unit as the origin, an axis parallel to the width is set as the x-axis, an axis parallel to the height is set as the y-axis, the actual height of the single interface strip unit is set as l, the minimum retention heights of the contacts are p, the widths of C2 and C6 are C, the widths of C1, C3, C5, C7 are d, the height is m, the height of the insulating tape separating the two contacts is set as s,
The range of the copper foil area with the fifth contact disposed between C1 and C5 is:
Wherein,
The range of the copper foil area where the sixth contact is disposed between C3 and C7 is: Wherein,
24. The single interface strip unit of claim 21, wherein either the fifth contact or the sixth contact is replaced with C6 and/or an extension of C6 to an adjacent contact.
25. The single interface strip unit of claim 24, wherein the sides where C5, C6, C7 are located are set as the width of the single interface strip unit, the sides where C3, C7 are located are set as the height of the single interface strip unit, a coordinate axis is established with the center of the single interface strip unit as the origin, an axis parallel to the width is set as the x axis, an axis parallel to the height is set as the y axis, the actual height of the single interface strip unit is set as l, the minimum retention height of the module is h, the widths of C1, C3, C5, C7 are d, the widths of C2, C6 are C, and the height of the insulating strip separating the two contacts is s;
the extension of C6 in the C5 region is:
then the extension of C6 in the C7 region is:
26. A single interface strip using the single interface strip element of any of claims 22-25, wherein the single interface strip is comprised of at least two of the single interface strip elements.
27. A module using the single interface strip element of any of claims 22-25, wherein the module comprises a single interface strip element and a chip;
The surface, opposite to the copper foil surface, of the single-interface strip unit is a welding surface, and the chip is arranged on the welding surface;
A contact surface bonding pad is arranged on the welding surface at the position of the hole corresponding to the contact; the holes enable the contacts to be electrically conducted with corresponding contact surface bonding pads;
The chip is provided with a chip LA bonding pad, a chip LB bonding pad and a chip contact surface bonding pad which are correspondingly and electrically connected with the contact surface bonding pads of the C1, C2, C3, C5 and C7 contacts;
The positions of the corresponding holes of the fifth contact and the sixth contact on the welding surface are respectively provided with an LA contact surface bonding pad and an LB contact surface bonding pad; the fifth contact and the sixth contact are electrically communicated with the LA contact surface bonding pad and the LB contact surface bonding pad through corresponding holes;
The LA contact surface bonding pad and the LB contact surface bonding pad are respectively and electrically connected with the chip LA bonding pad and the chip LB bonding pad;
And the welding surfaces of the single-interface strip units are respectively provided with an antenna LA welding pad and an antenna LB welding pad at the positions of the third base hole and the fourth base hole, and the third base hole and the fourth base hole enable the fifth contact and the sixth contact to be electrically conducted with the antenna LA welding pad and the antenna LB welding pad.
28. A smart card using the module of claim 27, comprising a card base, a module, and an antenna coil, the antenna coil being disposed inside the card base, the card base surface being provided with a milling slot, the module being embedded in the milling slot;
the antenna LA bonding pad and the antenna LB bonding pad are electrically connected to both ends of the antenna coil loop, respectively.
29. The smart card of claim 28, wherein an antenna LA pad and an antenna LB pad are provided on the card base, the antenna LA pad and the antenna LB pad being connected to both ends of the antenna coil loop, respectively;
The antenna LA bond pad and the antenna LB bond pad are electrically connected to the antenna LA bond pad and the antenna LB bond pad, respectively.
30. The smart card of claim 29, wherein the antenna LA bond pad and the antenna LB bond pad are disposed at opposite ends of the slot in the card base, respectively, the antenna LA bond pad and the antenna LB bond pad being disposed at positions corresponding to the antenna LA bond pad and the antenna LB bond pad, respectively.
31. The smart card of claim 28, wherein the antenna LA bond pads and the antenna LB bond pads are connected to both ends of the antenna coil loop by means of antenna wire direct bonding.
32. The smart card of claim 29, wherein the antenna LA bond pads and the LB bond pads are connected to the antenna LA bond pads and the antenna LB bond pads by soldering or conductive adhesive.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810942969.9A CN108764436B (en) | 2018-08-17 | 2018-08-17 | Single-interface strip unit, single-interface strip, module and smart card |
| PCT/CN2019/099598 WO2020034885A1 (en) | 2018-08-17 | 2019-08-07 | Single interface stripe unit, single interface stripe, module and smart card |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810942969.9A CN108764436B (en) | 2018-08-17 | 2018-08-17 | Single-interface strip unit, single-interface strip, module and smart card |
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| CN108764436A CN108764436A (en) | 2018-11-06 |
| CN108764436B true CN108764436B (en) | 2024-07-02 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205845082U (en) * | 2016-06-17 | 2016-12-28 | 北京同方微电子有限公司 | A kind of Novel double-interface smart card band |
| CN208781268U (en) * | 2018-08-17 | 2019-04-23 | 恒宝股份有限公司 | A kind of list interface stripe cell, single interface band, module and smart card |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2947392B1 (en) * | 2009-06-29 | 2019-05-10 | Idemia France | METHOD FOR ELECTRICALLY CONNECTING TWO ORGANS BETWEEN THEM |
| FR2996944B1 (en) * | 2012-10-15 | 2018-05-04 | Smart Packaging Solutions Sps | SIMPLIFIED ELECTRONIC MODULE FOR A CHIP CARD WITH A DOUBLE COMMUNICATION INTERFACE |
| CN103199024B (en) * | 2012-12-31 | 2016-06-01 | 深圳市华鑫精工机械技术有限公司 | The manufacture method of a kind of double-interface card and production equipment |
| CN206639242U (en) * | 2017-04-14 | 2017-11-14 | 恒宝股份有限公司 | A kind of double-interface smart card using single interface band |
| CN108764436B (en) * | 2018-08-17 | 2024-07-02 | 恒宝股份有限公司 | Single-interface strip unit, single-interface strip, module and smart card |
-
2018
- 2018-08-17 CN CN201810942969.9A patent/CN108764436B/en active Active
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- 2019-08-07 WO PCT/CN2019/099598 patent/WO2020034885A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205845082U (en) * | 2016-06-17 | 2016-12-28 | 北京同方微电子有限公司 | A kind of Novel double-interface smart card band |
| CN208781268U (en) * | 2018-08-17 | 2019-04-23 | 恒宝股份有限公司 | A kind of list interface stripe cell, single interface band, module and smart card |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020034885A1 (en) | 2020-02-20 |
| CN108764436A (en) | 2018-11-06 |
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