CN108679465B - LED lamp - Google Patents
LED lamp Download PDFInfo
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- CN108679465B CN108679465B CN201810493002.7A CN201810493002A CN108679465B CN 108679465 B CN108679465 B CN 108679465B CN 201810493002 A CN201810493002 A CN 201810493002A CN 108679465 B CN108679465 B CN 108679465B
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- heat dissipation
- heat
- light source
- plug valve
- piston
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 84
- 238000005507 spraying Methods 0.000 claims abstract description 36
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 239000000110 cooling liquid Substances 0.000 claims abstract description 24
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052753 mercury Inorganic materials 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 3
- 239000007788 liquid Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 241001621399 Lampris Species 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/56—Cooling arrangements using liquid coolants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides an LED lamp, comprising: the LED lamp comprises a heat dissipation shell, a light source plate and a heat radiator, wherein the heat dissipation shell and the light source plate jointly enclose to form a heat dissipation cavity, the heat radiator is arranged in the heat dissipation cavity, the LED lamp also comprises a thermal driving piece arranged in the heat dissipation cavity and a cooling device filled with cooling liquid, a spraying opening used for spraying the cooling liquid is formed in the cooling device, and a plug valve is arranged on the spraying opening; one end of the thermal driving piece is connected with the radiator or the light source plate to sense the temperature, and the other end of the thermal driving piece acts on the plug valve; the thermal driving piece drives the plug valve to move through the heated extension of the thermal driving piece, so that the plug valve is separated from the spraying opening, and cooling liquid in the cooling device is sprayed into the heat dissipation cavity from the spraying opening to dissipate heat.
Description
Technical Field
The invention relates to the field of LED lamps, in particular to an LED lamp which can refrigerate instantly and reduce the temperature of the lamp rapidly when the heat of the lamp reaches a certain limit temperature.
Background
A light Emitting diode (led), which is a solid semiconductor device capable of converting electrical energy into visible light, can directly convert electricity into light. Compared with the common lamp (such as an incandescent lamp and the like), the LED lamp has the advantages of energy conservation, long service life, good applicability, short response time, environmental protection and the like.
The existing LED lamp has various heat dissipation modes, for example, in the LED lamp with the heat radiator disclosed in the Chinese utility model with the patent application number of CN201220110438.1, the heat radiator is directly adopted for heat dissipation; or in an LED filament lamp disclosed in Chinese Utility model patent application No. CN201620238798.8, a semiconductor refrigerator is adopted to assist in heat dissipation; or in an LED lamp disclosed in chinese utility model patent application No. CN201521085638.6, a combination of a heat sink and air convection is used to dissipate heat. However, the heat dissipation effect of the existing heat dissipation structure has a certain linear law, which is a continuous and stable heat dissipation process, and even if the heat dissipation function of the heat sink is too strong, the linear law cannot be broken through in a short time, so that the lamp is cooled instantly. Under overload states such as the LED lamp continuously works for a very long time or is overloaded, the heat dissipation of the radiator often reaches the limit capacity and cannot maintain the temperature of the whole lamp, and as the temperature continues to rise, the influence on the service life of the LED lamp is very large, and even the LED lamp can be directly scrapped. Under such circumstances, it is highly desirable to design a structure capable of instantly cooling and rapidly reducing the temperature of the lamp.
Disclosure of Invention
Therefore, the invention provides the LED lamp which can instantly refrigerate and quickly reduce the temperature of the lamp when the heat of the lamp reaches a certain limit temperature.
In order to achieve the above object, the present invention provides an LED lamp, including: the light source board is arranged on the mounting opening in a sealing mode and forms a heat dissipation cavity together with the heat dissipation shell in a surrounding mode, and the heat radiator is arranged in the heat dissipation cavity and is in thermal contact with the light source board; the cooling device is provided with a spraying opening for spraying cooling liquid, and the spraying opening is provided with a plug valve; one end of the thermal driving piece is connected with the radiator or the light source plate to sense the temperature, and the other end of the thermal driving piece acts on the plug valve; the thermal driving piece drives the plug valve to move through the heated extension of the thermal driving piece, so that the plug valve is separated from the spraying opening, and cooling liquid in the cooling device is sprayed into the heat dissipation cavity from the spraying opening to dissipate heat.
Furthermore, the thermal driving part is a memory spring, one end of the memory spring is connected with the radiator or the light source plate, the other end of the memory spring is connected with the plug valve, the memory spring is heated and extended and drives the plug valve to be separated from the spraying opening, and the memory spring drives the plug valve to reseal the spraying opening when cooling and recovering.
Further, the thermal drive includes: piston cylinder, piston and piston rod, the piston cylinder sets up on radiator or light source board, the piston sets up in the piston cylinder and encloses with the piston cylinder and close and form a sealed piston cavity, be equipped with the drive division that can expend with heat and contract with cold in the piston cavity, the piston rod is connected the piston corresponds the cock valve, the drive division is heated the expansion and is driven piston and piston rod and extend, and then contradicts and makes the cock valve break away from on the cock valve the sprinkler orifice.
Still further, the driving part is a memory spring or mercury.
Furthermore, a plurality of heat dissipation holes penetrating through the heat dissipation cavity are formed in the heat dissipation shell.
Still further, the radiator is a heat dissipation column arranged on the light source board in an array mode, and the heat dissipation column corresponds to the heat dissipation hole in the heat dissipation shell.
Further, still include radiator fan, radiator fan acts on the heat dissipation cavity.
Still further, the radiator fan is further provided with an on-off key, the heated extension of the thermal driving part also acts on the on-off key to start the radiator fan, the thermal driving part is cooled and retracted to separate from the key, and the radiator fan stops.
Further, still include the printing opacity cover, the printing opacity covers the light source board and is connected to on the heat dissipation shell.
Through the technical scheme provided by the invention, the method has the following beneficial effects:
when the temperature of the lamp rises sharply, the thermal driving part drives the plug valve to move through the self heated extension so as to enable the plug valve to be separated from the spraying opening, the cooling liquid in the cooling device is sprayed into the heat dissipation cavity from the spraying opening, if the cooling liquid is directly sprayed onto the radiator, the light source plate or the heat dissipation shell, the cooling liquid is heated and volatilized, a large amount of heat is taken away, the whole lamp can be instantly cooled, the temperature is rapidly reduced, and the lamp is protected from being damaged by high temperature. Simultaneously, the sealed setting of light source board is in the installation opening, and the light source surface and the heat dissipation cavity of separation light source board avoid the coolant liquid to drip to the light source surface of light source board and cause abnormalities such as short circuit.
Drawings
Fig. 1 is a schematic perspective view of an LED lamp according to a first embodiment;
FIG. 2 is a schematic cross-sectional view of an LED lamp according to a first embodiment;
fig. 3 is an exploded schematic view of an LED lamp according to a first embodiment;
FIG. 4 is a schematic cross-sectional view of an LED lamp according to a second embodiment;
fig. 5 is a schematic cross-sectional view of an LED lamp according to a third embodiment.
Detailed Description
To further illustrate the various embodiments, the invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. Those skilled in the art will appreciate still other possible embodiments and advantages of the present invention with reference to these figures. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The invention will now be further described with reference to the accompanying drawings and detailed description.
Example one
Referring to fig. 1 to 3, an LED lamp provided in this embodiment includes: the light source module comprises a heat dissipation shell, a light source board 20 and a heat sink 30, wherein the heat dissipation shell is provided with an installation opening, the light source board 20 is hermetically arranged on the installation opening and is enclosed with the heat dissipation shell to form a heat dissipation cavity 10, and a plurality of heat dissipation holes 111 penetrating through the heat dissipation cavity 10 are formed in the heat dissipation shell. The heat sink 30 is a heat dissipation column arranged on the light source board in an array, and the heat dissipation column 30 corresponds to the heat dissipation hole 111 on the heat dissipation housing, so as to satisfy heat dissipation in a normal working state.
Specifically, the heat dissipation shell includes: the present invention relates to a hollow cylindrical body 11 having two open ends, and a cover 12 covering a first end opening (i.e., an upper end opening) of the cylindrical body 11, wherein a second end opening (i.e., a lower end opening) of the cylindrical body 11 is a mounting opening.
The cooling device comprises a heat-radiating cavity 10, a thermal driving part 51 arranged in the heat-radiating cavity, and a cooling device 40 filled with cooling liquid (such as liquid nitrogen, liquid carbon dioxide and the like), wherein a spraying opening for spraying the cooling liquid is formed in the cooling device 40, and a plug valve 41 is arranged on the spraying opening; one end of the thermal driving member 51 is connected to the light source plate (or arranged on the radiator) to sense the temperature, and the other end acts on the plug valve 41; the thermal driving member 51 drives the plug valve 41 to move by self thermal expansion, so that the plug valve 41 is separated from the spraying opening, and the cooling liquid in the cooling device 40 is sprayed into the heat dissipation cavity 10 from the spraying opening for heat dissipation.
Specifically, in this embodiment, the thermal driving member 51 is a memory spring, one end of the memory spring 51 is connected to the light source board 20 (in other embodiments, it may be connected to the heat sink), the other end is connected to the plug valve 41, the memory spring 51 is heated to expand and drive the plug valve 41 to disengage from the spray opening, and when the memory spring 51 is cooled and restored, the plug valve 41 is driven to reseal the spray opening. The memory spring is conventional, such as a CuZnAl memory alloy spring, etc., and those skilled in the art can select the type and model of the memory spring according to specific requirements, and detailed description is omitted here.
Specifically, in this embodiment, the light source module further includes a light transmissive cover 21, and the light transmissive cover 21 covers the light source board 20 and is connected to the heat dissipation housing.
The working principle is as follows: under normal working conditions of the lamp, heat is transferred to the heat dissipation shell through the heat sink 30 and dissipated through air convection between the heat dissipation holes 111. When the load is reached and the heat dissipation cannot be satisfied, the memory spring 51 is heated and extended along with the temperature rise to a certain value, and drives the plug valve 41 to be separated from the spraying opening, the cooling liquid in the cooling device 40 is sprayed into the heat dissipation cavity 10 from the spraying opening, if the cooling liquid is directly sprayed onto the heat dissipation shell, the light source plate 20 and the heat sink 30, the cooling liquid is vaporized, volatilized and absorbs a large amount of heat, so that the temperature of the whole lamp is instantly reduced, and the abnormal condition of the whole lamp caused by the continuous rise of the temperature is prevented. At this time, the memory spring 51 retracts to the original length and drives the plug valve 41 to block the spraying opening again, so that the cooling device 40 can be used for a plurality of times.
Further, in this embodiment, the cooling liquid in the cooling device 40 is preferably a volatile and non-flammable cooling liquid, such as liquid nitrogen and liquid carbon dioxide. In other embodiments, for a lamp with a lower trigger temperature or a larger temperature allowable buffer range, the cooling liquid may also be cooled by alcohol or cooling water.
Further, in this embodiment, the heat sink 30 is a heat dissipation column disposed on the light source board 20 in an array, and the heat dissipation column 30 corresponds to the heat dissipation hole 111 on the heat dissipation housing, so as to satisfy the heat dissipation under the normal working condition. In other embodiments, the heat sink may also be a conventional LED lamp heat sink as disclosed in chinese utility model patent application No. CN201120563012.7 or other conventional structures.
Further, in the present embodiment, the light source board 20 is integrated with a control circuit, a power circuit and a light source circuit, and the structure composition and connection relationship of the above circuits are conventional technologies, and will not be described in detail herein.
Example two
The LED lamp provided in this embodiment has substantially the same structure as that in the first embodiment, except that: referring to fig. 4, in the present embodiment, the thermal driving member includes: the piston cylinder 52 is arranged on the heat sink 30 or the light source board 20, in this embodiment, the piston 53 is arranged in the piston cylinder 52 and surrounds the piston cylinder 52 to form a sealed piston cavity, a driving portion capable of expanding with heat and contracting with cold is arranged in the piston cavity, the piston rod 54 is connected to the piston 53 and corresponds to the plug valve 41, and the driving portion expands with heat to drive the piston 53 and the piston rod 54 to extend, so as to abut against the plug valve 41 to enable the plug valve 41 to be separated from the spray opening.
Further, in this embodiment, the driving portion is made of mercury, and the piston rod are driven to extend upward and retract downward by expansion and contraction of mercury. In other embodiments, the mercury can be replaced by alcohol or the memory spring in the first embodiment, and the same effect can be achieved.
Further, in this embodiment, the thermal driving member is not fixedly connected to the plug valve, but drives the plug valve 41 to disengage from the spraying opening by an interference manner, and the plug valve 41 cannot be driven to reseal the spraying opening when retracted. With this arrangement, an elastic member (not shown) can be disposed between the plug valve 41 and the spraying opening, and when the plug valve 41 loses the resisting force of the thermal driving member, the plug valve reseals the spraying opening by the elastic restoring force of the elastic member, and the specific structural connection manner thereof can be easily realized by those skilled in the art, and will not be described in detail herein. Alternatively, in other embodiments, the resilient member may not be needed if the cooling fluid in the cooling device 40 is a disposable consumable, i.e., the cooling fluid is only used for one cooling.
EXAMPLE III
The LED lamp provided in this embodiment has substantially the same structure as that in the second embodiment, except that: referring to fig. 5, in the present embodiment, the heat dissipation device further includes a heat dissipation fan 60, the heat dissipation fan 60 is disposed on the cover 12, and an air outlet of the heat dissipation fan 60 corresponds to the heat dissipation cavity 10, so as to act on the heat dissipation cavity 10.
The heat dissipation fan 60 further has an on-off switch 61, in this embodiment, the on-off switch 61 is a switch button disposed on the power supply circuit of the heat dissipation fan 60, the on-off switch 61 is disposed on the surface of the cooling device 40, and the thermal driving member has two contact ends, i.e., the piston rod 54 has two contact ends for respectively abutting against the plug valve 41 and the on-off switch 61.
The extension of the thermal driving member simultaneously pushes against the plug valve 41 and the switch key 61, and the plug valve 41 is separated from the spraying opening, so that the cooling liquid is sprayed into the heat dissipation cavity 10. Meanwhile, the switch 61 is closed, so that the power supply circuit of the cooling fan 60 is closed and conducted, and the cooling fan 60 starts to work to form cooling air flow to help the cooling liquid to vaporize and circulate. The auxiliary heat dissipation function is achieved.
In other embodiments, the switch key 61 may also be a touch switch, so that a control module, such as a single chip, may be disposed in the lamp; the touch switch senses the touch of the thermal driving part and outputs the touch to the control module, and the control module controls the radiating fan to work. The specific structural models and connection modes of the touch switch and the control module are conventional technologies, and can be easily realized by those skilled in the art, and detailed description is omitted here.
According to the technical scheme provided by the invention, when the temperature of the lamp rises sharply, the plug valve is driven to move by the thermal driving piece through the self heated extension, so that the plug valve is separated from the spraying opening, the cooling liquid in the cooling device is sprayed into the heat dissipation cavity from the spraying opening, and if the cooling liquid is directly sprayed onto a radiator, a light source plate or a heat dissipation shell, the cooling liquid is heated and volatilized to take away a large amount of heat, so that the whole lamp can be instantly cooled, the temperature is rapidly reduced, and the lamp is protected from being damaged by high temperature. Simultaneously, the sealed setting of light source board is in the installation opening, and the light source surface and the heat dissipation cavity of separation light source board avoid the coolant liquid to drip to the light source surface of light source board and cause abnormalities such as short circuit.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. An LED light fixture comprising: the light source board is arranged on the mounting opening in a sealing mode and forms a heat dissipation cavity together with the heat dissipation shell in a surrounding mode, and the heat radiator is arranged in the heat dissipation cavity and is in thermal contact with the light source board; the method is characterized in that: the cooling device is provided with a spraying opening for spraying cooling liquid, and the spraying opening is provided with a plug valve; one end of the thermal driving piece is connected with the radiator or the light source plate to sense the temperature, and the other end of the thermal driving piece acts on the plug valve; the thermal driving piece drives the plug valve to move through the heated extension of the thermal driving piece, so that the plug valve is separated from the spraying opening, and cooling liquid in the cooling device is sprayed into the heat dissipation cavity from the spraying opening to dissipate heat.
2. The LED light fixture of claim 1 wherein: the hot driving piece is a memory spring, one end of the memory spring is connected with the radiator or the light source plate, the other end of the memory spring is connected with the plug valve, the memory spring is heated and extends to drive the plug valve to be separated from the spraying opening, and the memory spring drives the plug valve to reseal the spraying opening when cooling and recovering.
3. The LED light fixture of claim 1 wherein: the thermal drive member includes: piston cylinder, piston and piston rod, the piston cylinder sets up on radiator or light source board, the piston sets up in the piston cylinder and encloses with the piston cylinder and close and form a sealed piston cavity, be equipped with the drive division that can expend with heat and contract with cold in the piston cavity, the piston rod is connected the piston corresponds the cock valve, the drive division is heated the expansion and is driven piston and piston rod and extend, and then contradicts and makes the cock valve break away from on the cock valve the sprinkler orifice.
4. The LED light fixture of claim 3 wherein: the driving part is a memory spring or mercury.
5. The LED light fixture of claim 1 wherein: the heat dissipation shell is also provided with a plurality of heat dissipation holes penetrating through the heat dissipation cavity.
6. The LED lamp of claim 5, wherein: the heat radiator is a heat dissipation column arranged on the light source board in an array mode, the heat dissipation column corresponds to the heat dissipation holes in the heat dissipation shell, and therefore heat on the heat dissipation column is dissipated through air convection among the heat dissipation holes.
7. The LED light fixture of claim 1 wherein: still include radiator fan, radiator fan acts on the heat dissipation cavity.
8. The LED light fixture of claim 7 wherein: the heat radiation fan is also provided with an on-off key, the heated extension of the heat driving part also acts on the on-off key to start the heat radiation fan, the heat driving part is cooled and retracted to separate from the key, and the heat radiation fan stops.
9. The LED light fixture of claim 1 wherein: still include the printing opacity cover, the printing opacity covers the light source board and is connected to on the heat dissipation shell.
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CN201810493002.7A CN108679465B (en) | 2018-05-22 | 2018-05-22 | LED lamp |
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CN201810493002.7A CN108679465B (en) | 2018-05-22 | 2018-05-22 | LED lamp |
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CN108679465B true CN108679465B (en) | 2020-06-12 |
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CN110056789A (en) * | 2019-04-08 | 2019-07-26 | 高建文 | A kind of LED lamp tube of good heat dissipation effect |
CN110335555B (en) * | 2019-06-15 | 2021-06-18 | 义乌市航英科技有限公司 | Advertisement frame |
CN111706798A (en) * | 2020-06-12 | 2020-09-25 | 浙江远恒电子科技有限公司 | Lamp heat dissipation equipment based on principle of expansion with heat and contraction with cold |
CN114559409B (en) * | 2022-04-27 | 2022-07-05 | 南通茂业电子科技有限公司 | Electromagnetic chuck controller device arranged in high-temperature equipment |
CN117167698B (en) * | 2023-11-02 | 2024-01-26 | 江苏恒鹏智能电气有限公司 | Street lamp monitoring device |
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CN102588929A (en) * | 2011-12-16 | 2012-07-18 | 陈志明 | Radiating method for high-power LED light source and radiating device for same |
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CN207179378U (en) * | 2017-09-08 | 2018-04-03 | 江苏明月照明电器有限公司 | A kind of LED using radiating structure is towards day lamp |
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CN205332145U (en) * | 2015-12-13 | 2016-06-22 | 重庆市灿宏机械制造有限公司 | Heat dissipation device for LED lamps |
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JP2002150805A (en) * | 2000-11-14 | 2002-05-24 | Orc Mfg Co Ltd | Electrodeless lamp device |
CN102588929A (en) * | 2011-12-16 | 2012-07-18 | 陈志明 | Radiating method for high-power LED light source and radiating device for same |
CN202469999U (en) * | 2012-03-16 | 2012-10-03 | 深圳市聚纳光电有限公司 | Light emitting diode (LED) lamp cooling device with humidification effect |
EP3184877A1 (en) * | 2015-12-25 | 2017-06-28 | LongWide Technology Inc. | Led illumination apparatus and manufacturing method thereof |
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