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CN108668476A - Casing structure of electronic device and manufacturing method thereof - Google Patents

Casing structure of electronic device and manufacturing method thereof Download PDF

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Publication number
CN108668476A
CN108668476A CN201710205726.2A CN201710205726A CN108668476A CN 108668476 A CN108668476 A CN 108668476A CN 201710205726 A CN201710205726 A CN 201710205726A CN 108668476 A CN108668476 A CN 108668476A
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CN
China
Prior art keywords
transparent
casing
opening
opaque film
casing structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201710205726.2A
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Chinese (zh)
Inventor
张宜穆
官清标
戴文杰
凌正南
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Acer Inc
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Acer Inc
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Filing date
Publication date
Application filed by Acer Inc filed Critical Acer Inc
Priority to CN201710205726.2A priority Critical patent/CN108668476A/en
Publication of CN108668476A publication Critical patent/CN108668476A/en
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • H05K5/0243Mechanical details of casings for decorative purposes

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The invention provides a shell structure of an electronic device, which comprises a transparent shell and an opaque film. The transparent shell is provided with an inner surface and an outer surface which are opposite, and the transparent shell is provided with at least one opening for communicating the inner surface with the outer surface. The opaque film is vacuum-absorbed on the inner surface by exhausting through the at least one opening, and the opaque film is visually exposed to the transparent shell. A method for manufacturing the housing structure is also provided.

Description

电子装置的机壳结构及其制作方法Housing structure of electronic device and manufacturing method thereof

技术领域technical field

本发明涉及一种机壳结构及其制作方法,尤其涉及一种电子装置的机壳结构及其制作方法。The invention relates to a casing structure and a manufacturing method thereof, in particular to a casing structure of an electronic device and a manufacturing method thereof.

背景技术Background technique

在电子装置的机壳结构的研发及设计中,多半会以一种亮丽而新颖(流行)的图形为设计重点,同时搭配显眼的材质而期望能抓获消费者的目光。一般而言,通常是以图形贴纸贴置于机壳结构上,或是在机壳结构的塑胶射出过程中即提供所需图案而使其一体成型制成。In the R&D and design of the casing structure of electronic devices, a bright and novel (popular) graphic is often the focus of the design, and at the same time, it is matched with conspicuous materials in the hope of capturing the attention of consumers. Generally speaking, graphic stickers are usually pasted on the casing structure, or the required pattern is provided during the plastic injection process of the casing structure to make it integrally formed.

惟,前者可能面临使用期间贴纸脱落等情形而不耐使用,后者则需在塑胶射出的模具上进行再加工出所需图案,而造成制造成本增加。因此,本领域的设计者确实有对此进行改善的需求。However, the former may be unusable due to situations such as the sticker falling off during use, while the latter needs to be reprocessed on the plastic injection mold to form the desired pattern, resulting in increased manufacturing costs. Therefore, there is a real need for designers in the field to improve this.

发明内容Contents of the invention

本发明提供一种电子装置的机壳结构及其制作方法,通过在透明壳体的内表面配置不透明薄膜,以让机壳结构具有通透的视觉效果而提高其美观性。The invention provides a shell structure of an electronic device and a manufacturing method thereof. By disposing an opaque film on the inner surface of the transparent shell, the shell structure has a transparent visual effect and improves its aesthetics.

本发明电子装置的机壳结构,包括透明壳体以及不透明薄膜。透明壳体具有相对的内表面与外表面,且透明壳体具有至少一开口以连通内表面与外表面。不透明薄膜经由至少一开口排气以真空吸附在内表面,且不透明薄膜视觉暴露于透明壳体。The shell structure of the electronic device of the present invention includes a transparent shell and an opaque film. The transparent casing has an inner surface and an outer surface opposite to each other, and the transparent casing has at least one opening to communicate with the inner surface and the outer surface. The opaque film is exhausted through at least one opening to absorb the inner surface by vacuum, and the opaque film is visually exposed to the transparent casing.

本发明机壳结构的制作方法,包括:提供透明壳体,其具有至少一开口以连通透明壳体的外表面与内表面;以及提供真空以经由至少一开口排气,而吸附不透明薄膜至透明壳体的内表面。The manufacturing method of the casing structure of the present invention includes: providing a transparent casing, which has at least one opening to communicate with the outer surface and the inner surface of the transparent casing; the inner surface of the shell.

基于上述,通过在透明壳体的内表面配置不透明薄膜,而使不透明薄膜在视觉上是暴露于透明壳体,进而让电子装置的机壳结构具备视觉上的通透感,进而得以提高电子装置的美观性。再者,不透明薄膜是通过真空吸附在透明壳体的内表面,且由于透明壳体具有连通内、外表面的开口,因此所述不透明薄膜在真空过程中,气体能顺利地从所述开口被排出,因此除能提供不透明薄膜朝向透明壳体之内表面驱动的动力,也能有效地排除透明壳体与不透明薄膜之间的气体,而提高两者的结合强度。Based on the above, by arranging an opaque film on the inner surface of the transparent case, the opaque film is visually exposed to the transparent case, so that the casing structure of the electronic device has a visual sense of transparency, thereby improving the performance of the electronic device. aesthetics. Furthermore, the opaque film is adsorbed on the inner surface of the transparent shell by vacuum, and since the transparent shell has an opening connecting the inner and outer surfaces, the gas can be smoothly drawn from the opening during the vacuum process of the opaque film. Therefore, in addition to providing the power to drive the opaque film towards the inner surface of the transparent shell, it can also effectively remove the gas between the transparent shell and the opaque film, thereby improving the bonding strength of the two.

为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

附图说明Description of drawings

图1是依据本发明一实施例的机壳结构的制作流程图。FIG. 1 is a flow chart of manufacturing a casing structure according to an embodiment of the present invention.

图2至图6分别是对应图1制作流程的结构示意图。FIG. 2 to FIG. 6 are schematic structural diagrams corresponding to the production process in FIG. 1 .

图7A与图7B分别是本发明不同实施例的透明壳体的俯视图。。7A and 7B are top views of transparent casings according to different embodiments of the present invention. .

图8是本发明又一实施例的机壳结构的局部剖视图。Fig. 8 is a partial cross-sectional view of a casing structure according to another embodiment of the present invention.

附图标记说明Explanation of reference signs

100:机壳结构100: Case structure

110、210、310、410:透明壳体110, 210, 310, 410: transparent shell

130:不透明薄膜130: opaque film

132:图案132: pattern

140:粘着层140: Adhesive layer

150、250:结合件150, 250: combination parts

G1:段差结构G1: segment structure

P1:第一开口P1: first opening

P2:第二开口P2: second opening

P3:第三开口P3: third opening

P4:第四开口P4: fourth opening

S1:内表面S1: inner surface

S2:外表面S2: Outer surface

VC:真空VC: vacuum

具体实施方式Detailed ways

图1是依据本发明一实施例的机壳结构的制作流程图。图2至图6分别是对应图1制作流程的结构示意图。请参考图1并对照图2至图6,在本实施例中,电子装置例如是笔记本电脑,而所述机壳结构是指显示屏幕的背盖部分,其在视觉上占了电子装置的整体外观的绝大部分。然,本发明所示机壳结构并未因此受限其型式,换句话说,所述机壳结构同样能适用在如移动电话、平板电脑等为人所熟知的电子装置。FIG. 1 is a flow chart of manufacturing a casing structure according to an embodiment of the present invention. FIG. 2 to FIG. 6 are schematic structural diagrams corresponding to the production process in FIG. 1 . Please refer to FIG. 1 and compare FIG. 2 to FIG. 6. In this embodiment, the electronic device is, for example, a notebook computer, and the casing structure refers to the back cover part of the display screen, which visually occupies the entire electronic device. most of the appearance. However, the casing structure shown in the present invention is not limited to its type. In other words, the casing structure can also be applied to well-known electronic devices such as mobile phones and tablet computers.

为完成本实施例所述的机壳结构,请参考图1并对照图2及图3,首先提供透明壳体110,所述透明壳体110具有内表面S1、外表面S2以及连通内表面S1与外表面S2的至少一开口,在此,透明壳体110的材质为塑胶,其通过射出成型制成,其中所述开口是通过模具的靠破面而形成。再者,所述至少一开口包括第一开口P1以及多个第二开口P2,其中第一开口P1位于透明壳体110的中央,而第二开口P2分别位于透明壳体110的边缘或角落,又如图3所示,本实施例的第二开口P2实质上位于透明壳体110的结构转折处。惟,在另一未示出的实施例中,透明壳体仅具有位于中央处的第一开口。此外,在又一未示出的实施例中,透明壳体也可以玻璃制成。In order to complete the casing structure described in this embodiment, please refer to FIG. 1 and compare FIGS. At least one opening with the outer surface S2. Here, the material of the transparent casing 110 is plastic, which is made by injection molding, wherein the opening is formed by the broken surface of the mold. Furthermore, the at least one opening includes a first opening P1 and a plurality of second openings P2, wherein the first opening P1 is located at the center of the transparent casing 110, and the second openings P2 are respectively located at edges or corners of the transparent casing 110, Also as shown in FIG. 3 , the second opening P2 of this embodiment is substantially located at the structural turning point of the transparent casing 110 . However, in another not-shown embodiment, the transparent housing only has the first opening at the center. In addition, in yet another embodiment not shown, the transparent casing can also be made of glass.

接着,请参考图1并对照图4,先在透明壳体110的内表面S1上涂布粘着层140后,再在内表面S1配置不透明薄膜130。在此,不透明薄膜130例如是以不透光的聚对苯二甲酸乙二酯(PET)所制成。接着,请参考图1并对照图5,在此将透明壳体110及所述不透明薄膜130一同置于密闭空间(未示出),并提供真空VC以让不透明薄膜130得以被吸附在透明壳体110的内表面S1。由于前述第一开口P1或/和第二开口P2的存在,故能顺利且平均地提供气体被排出的路径,以驱使不透明薄膜130朝向透明壳体110的内表面S1移近并贴附其上,同时也使残留在不透明薄膜130与粘着层140之间的气体能被有效地排出,因而让不透明薄膜130能通过粘着层140而牢固地贴附在透明壳体110的内表面S1。Next, please refer to FIG. 1 and compare FIG. 4 , first coat the adhesive layer 140 on the inner surface S1 of the transparent casing 110 , and then dispose the opaque film 130 on the inner surface S1 . Here, the opaque film 130 is made of opaque polyethylene terephthalate (PET), for example. Next, please refer to FIG. 1 and compare FIG. 5, where the transparent casing 110 and the opaque film 130 are placed together in a closed space (not shown), and a vacuum VC is provided to allow the opaque film 130 to be adsorbed on the transparent casing. The inner surface S1 of the body 110 . Due to the existence of the first opening P1 and/or the second opening P2, a path for the gas to be discharged can be provided smoothly and evenly, so as to drive the opaque film 130 to move toward the inner surface S1 of the transparent casing 110 and stick thereon. At the same time, the gas remaining between the opaque film 130 and the adhesive layer 140 can be effectively discharged, so that the opaque film 130 can be firmly attached to the inner surface S1 of the transparent casing 110 through the adhesive layer 140 .

最后,请参考图1并对照图6,提供结合件150并将其配置于不透明薄膜130背对透明壳体110的一侧,以让不透明薄膜130是位于结合件150与透明壳体110的内表面S1之间。届此,便完成机壳结构100的制作工序。Finally, referring to FIG. 1 and referring to FIG. 6 , a bonding member 150 is provided and disposed on the side of the opaque film 130 facing away from the transparent casing 110, so that the opaque film 130 is located inside the bonding member 150 and the transparent casing 110 between surfaces S1. At this point, the manufacturing process of the casing structure 100 is completed.

请再参考图5,在本实施例中,不透明薄膜130还具有朝向透明壳体110的图案132,例如是压印在不透明薄膜130表面的微结构,当在图4所示状态时,通过让图案132对准透明壳体110的第一开口P1,便能顺利地让图案132经由第一开口P1而被暴露出透明壳体110。在此不限图案132的位置,其也可从其他开口(如第二开口P2)暴露出透明壳体110,或是直接被透明壳体110不具开口的实体部分所覆盖。Please refer to FIG. 5 again. In this embodiment, the opaque film 130 also has a pattern 132 facing the transparent casing 110, such as a microstructure embossed on the surface of the opaque film 130. When in the state shown in FIG. 4, by letting The pattern 132 is aligned with the first opening P1 of the transparent casing 110 , so that the pattern 132 can be smoothly exposed to the transparent casing 110 through the first opening P1 . The location of the pattern 132 is not limited here, and it can also expose the transparent casing 110 from other openings (such as the second opening P2 ), or be directly covered by a solid part of the transparent casing 110 without openings.

基于上述,通过在透明壳体110的内表面S1配置不透明薄膜130,而达到让机壳结构100在外观上存在通透感,同时也因不透明薄膜130的阻隔,避免配置在机壳结构100内的电子元件会被直视。再者,配置在不透明薄膜130上的图案132也能有效地被透明壳体110所保护。Based on the above, by arranging the opaque film 130 on the inner surface S1 of the transparent casing 110, the case structure 100 has a sense of transparency in appearance, and at the same time, due to the barrier of the opaque film 130, it is avoided to be arranged in the case structure 100. electronic components will be viewed directly. Furthermore, the pattern 132 disposed on the opaque film 130 can also be effectively protected by the transparent case 110 .

图7A与图7B分别是本发明不同实施例的透明壳体的俯视图。与前述实施例不同的是,图7A所示实施例的透明壳体210具有第一开口P1与多个第三开口P3,与前述实施例的第二开口P2类似,这些第三开口P3位于透明壳体210的四个角落,而不同的是,这些第三开口P3实质上是完整地位于内表面S1而非位于结构转折处。请参考图7B,所示多个第四开口P4也是分别完整地位于内表面S1而非位于结构转折处,惟第四开口P4是位于透明壳体310的四个侧边上而非位于角落处。据此,在让不透明薄膜能顺利地与透明壳体相互结合的目的之下,设计者可依据所需位置及结合条件而适当地调整开口在不透明壳体上的位置。7A and 7B are top views of transparent casings according to different embodiments of the present invention. Different from the previous embodiments, the transparent housing 210 of the embodiment shown in FIG. 7A has a first opening P1 and a plurality of third openings P3, similar to the second opening P2 of the previous embodiment, these third openings P3 are located on the transparent The four corners of the casing 210 are different in that the third openings P3 are substantially completely located on the inner surface S1 rather than at structural inflection points. Please refer to FIG. 7B , the plurality of fourth openings P4 shown are also completely located on the inner surface S1 instead of at the structural turning point, but the fourth openings P4 are located on the four sides of the transparent casing 310 instead of at the corners. . Accordingly, for the purpose of smoothly combining the opaque film with the transparent case, the designer can properly adjust the position of the opening on the opaque case according to the required position and combination conditions.

图8是本发明又一实施例的机壳结构的局部剖视图。与前述不同的是,本实施例的透明壳体310的边缘与结合件250彼此相嵌,更进一步地说,在本实施例的电子装置的机壳体结构中,透明壳体310是与另一壳体(未示出)彼此相互结合,而让内表面S1与另一壳体形成容置空间,而让电子装置的电子元件(例如显示器)与所示结合件250、不透明薄膜130是位于所述容置空间中。在此,透明壳体310于其边缘存在段差(stage)结构,因而让透明壳体310与所述另一壳体结合的同时,也能将结合件250夹持其中,进而提高结合件在机壳结构中的结合强度,也有利于通过结合件250而将不透明薄膜130夹持固定在透明壳体310的内表面S1。Fig. 8 is a partial cross-sectional view of a casing structure according to another embodiment of the present invention. The difference from the above is that the edge of the transparent case 310 in this embodiment and the coupling member 250 are embedded with each other. Furthermore, in the housing structure of the electronic device in this embodiment, the transparent case 310 is connected to another A housing (not shown) is combined with each other, and the inner surface S1 forms an accommodating space with the other housing, and the electronic components (such as a display) of the electronic device and the shown coupling member 250 and the opaque film 130 are located in the accommodation space. Here, the transparent casing 310 has a stage structure at its edge, so that when the transparent casing 310 is combined with the other casing, the coupling part 250 can also be clamped therein, thereby improving the mechanical stability of the coupling part. The bonding strength in the shell structure is also beneficial for clamping and fixing the opaque film 130 on the inner surface S1 of the transparent casing 310 by the bonding member 250 .

综上所述,在本发明的上述实施例中,通过在透明壳体的内表面配置不透明薄膜,而使不透明薄膜在视觉上是暴露于透明壳体,进而让电子装置的机壳结构具备视觉上的通透感,进而得以提高电子装置的美观性。To sum up, in the above-mentioned embodiments of the present invention, by disposing an opaque film on the inner surface of the transparent case, the opaque film is visually exposed to the transparent case, thereby allowing the housing structure of the electronic device to have a visual The transparent feeling on the screen can improve the aesthetics of the electronic device.

其中,透明壳体除能提供上述视觉效果外,还能对不透明薄膜上的图案予以覆盖或使其仅从开口露出,而达到保护的效果。Wherein, in addition to providing the above-mentioned visual effect, the transparent casing can also cover the pattern on the opaque film or make it only exposed through the opening, so as to achieve the effect of protection.

其中,透明壳体具有位于其中央的第一开口,以及位于其边缘的第二开口,这些开口用以在真空吸附不透明薄膜至透明机壳的过程中,能产生平均且顺利的排气路径,以有效地避免结合的构件之间存在气隙。Wherein, the transparent casing has a first opening at its center and a second opening at its edge, these openings are used to generate an even and smooth exhaust path during the process of vacuum absorbing the opaque film to the transparent casing, In order to effectively avoid air gaps between the combined components.

虽然本发明已以实施例揭示如上,然其并非用以限定本发明,任何所属技术领域中技术人员,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,故本发明的保护范围当视权利要求所界定者为准。Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention should be defined by the claims.

Claims (13)

1.一种电子装置的机壳结构,包括:1. A casing structure of an electronic device, comprising: 透明壳体,具有相对的内表面与外表面,且所述透明壳体具有至少一开口以连通所述内表面与所述外表面;以及a transparent casing having opposing inner and outer surfaces, and the transparent casing has at least one opening communicating the inner and outer surfaces; and 不透明薄膜,经由所述至少一开口排气以真空吸附于所述内表面,且所述不透明薄膜视觉暴露于所述透明壳体。The opaque film is vacuum-adsorbed on the inner surface through the at least one opening, and the opaque film is visually exposed to the transparent casing. 2.根据权利要求1所述电子装置的机壳结构,其中所述透明壳体的材质为塑胶或玻璃。2. The casing structure of the electronic device according to claim 1, wherein the material of the transparent casing is plastic or glass. 3.根据权利要求1所述电子装置的机壳结构,其中所述至少一开口位于所述透明壳体的中央。3. The casing structure of the electronic device according to claim 1, wherein the at least one opening is located at the center of the transparent casing. 4.根据权利要求1所述电子装置的机壳结构,其中所述至少一开口包括第一开口与多个第二开口,所述第一开口位于所述透明壳体的中央,所述多个第二开口位于所述透明壳体的边缘或角落。4. The casing structure of the electronic device according to claim 1, wherein the at least one opening comprises a first opening and a plurality of second openings, the first opening is located in the center of the transparent casing, and the plurality of openings The second opening is located at the edge or corner of the transparent case. 5.根据权利要求4所述电子装置的机壳结构,其中所述多个第二开口位于所述透明壳体的结构转折处。5. The casing structure of the electronic device according to claim 4, wherein the plurality of second openings are located at structural turning points of the transparent casing. 6.根据权利要求1所述电子装置的机壳结构,还包括结合件,配置于所述不透明薄膜,以使所述不透明薄膜位于所述结合件与所述透明壳体的所述内表面之间。6. The casing structure of the electronic device according to claim 1, further comprising a joint member disposed on the opaque film, so that the opaque film is located between the joint member and the inner surface of the transparent casing between. 7.根据权利要求1所述电子装置的机壳结构,其中所述不透明薄膜具有图案,经由所述至少一开口暴露出所述透明壳体。7. The casing structure of the electronic device according to claim 1, wherein the opaque film has a pattern, and the transparent casing is exposed through the at least one opening. 8.一种机壳结构的制作方法,包括:8. A manufacturing method of a casing structure, comprising: 提供透明壳体,所述透明壳体具有至少一开口以连通所述透明壳体的外表面与内表面;以及providing a transparent case having at least one opening communicating with an outer surface and an inner surface of the transparent case; and 提供真空以经由所述至少一开口排气,而吸附不透明薄膜至所述透明壳体的所述内表面。A vacuum is provided to exhaust air through the at least one opening to attract an opaque film to the inner surface of the transparent housing. 9.根据权利要求8所述机壳结构的制作方法,还包括:9. The manufacturing method of the casing structure according to claim 8, further comprising: 在真空吸附所述不透明薄膜至所述透明壳体之前,涂布粘着层在所述内表面。An adhesive layer is applied to the inner surface before vacuum absorbing the opaque film to the transparent shell. 10.根据权利要求8所述机壳结构的制作方法,还包括:10. The manufacturing method of the casing structure according to claim 8, further comprising: 配置结合件至所述不透明薄膜,以使所述不透明薄膜位于所述内表面与所述结合件之间。A bonding element is disposed to the opaque film such that the opaque film is located between the inner surface and the bonding element. 11.根据权利要求8所述机壳结构的制作方法,其中所述透明壳体是以塑胶射出成型。11. The manufacturing method of the casing structure according to claim 8, wherein the transparent casing is formed by injection molding of plastic. 12.根据权利要求11所述机壳结构的制作方法,其中所述至少一开口是由模具的靠破面而成型。12. The manufacturing method of the casing structure according to claim 11, wherein the at least one opening is formed by a broken surface of a mold. 13.根据权利要求8所述机壳结构的制作方法,还包括:13. The manufacturing method of the casing structure according to claim 8, further comprising: 在所述不透明薄膜上形成图案;以及forming a pattern on the opaque film; and 在真空吸附所述不透明薄膜至所述透明壳体时使所述图案对准所述至少一开口。The pattern is aligned with the at least one opening when the opaque film is vacuum sucked to the transparent case.
CN201710205726.2A 2017-03-31 2017-03-31 Casing structure of electronic device and manufacturing method thereof Withdrawn CN108668476A (en)

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CN102196686A (en) * 2010-03-12 2011-09-21 深圳富泰宏精密工业有限公司 Shell of electronic device and manufacturing method thereof
CN102625610A (en) * 2012-03-14 2012-08-01 苏州佳世达电通有限公司 Shell of electronic product and electronic product having same
CN102717463A (en) * 2011-03-29 2012-10-10 峰盈高分子材料(惠东)有限公司 Device and method for three-dimensional PU object molding
JP2017046087A (en) * 2015-08-25 2017-03-02 金 昌植 Mobile terminal case

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102196686A (en) * 2010-03-12 2011-09-21 深圳富泰宏精密工业有限公司 Shell of electronic device and manufacturing method thereof
CN102717463A (en) * 2011-03-29 2012-10-10 峰盈高分子材料(惠东)有限公司 Device and method for three-dimensional PU object molding
CN102625610A (en) * 2012-03-14 2012-08-01 苏州佳世达电通有限公司 Shell of electronic product and electronic product having same
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