CN108668492B - Housing structure of electronic device and method of making the same - Google Patents
Housing structure of electronic device and method of making the same Download PDFInfo
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
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- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
本发明提供一种电子装置的机壳结构,包括壳体、硅胶层以及结合件。壳体的材质为金属且具有外表面与内表面。硅胶层配置于外表面,且硅胶层的边缘延伸至内表面。结合件配置于该内表面,以使硅胶层的边缘被夹持在壳体与结合件之间。另提供一种机壳结构的制作方法。
The present invention provides a casing structure of an electronic device, comprising a casing, a silicone layer and a coupling member. The casing is made of metal and has an outer surface and an inner surface. The silicone layer is arranged on the outer surface, and the edge of the silicone layer extends to the inner surface. The coupling member is arranged on the inner surface so that the edge of the silicone layer is clamped between the casing and the coupling member. A method for manufacturing the casing structure is also provided.
Description
技术领域technical field
本发明涉及一种机壳结构及其制作方法,尤其涉及一种电子装置的机壳结构及其制作方法。The invention relates to a casing structure and a manufacturing method thereof, in particular to a casing structure of an electronic device and a manufacturing method thereof.
背景技术Background technique
电子装置的外观造型已成为消费者选择产品的考量因素之一,因此设计制造商持续推出许多不同外型设计与外观设计的电子装置以期获得消费者的青睐,部分甚至以玻璃材质作为让电子装置的机壳材料,以求达到通透美观的视觉效果。The appearance of electronic devices has become one of the factors that consumers consider when choosing products. Therefore, design manufacturers continue to introduce many electronic devices with different appearance designs and appearance designs in order to win the favor of consumers. In order to achieve a transparent and beautiful visual effect.
惟,以笔记本电脑为例,在现有的电子装置皆朝向轻薄短小的外型设计趋势下,玻璃材质虽能提高外观效果,但受限于材料特性,因此在重量与制造成本上无法与原有金属或塑胶材质的机壳具备相当的竞争力,故仅空有效果但在设计上令人却步。However, taking notebook computers as an example, under the trend of light, thin and short design of existing electronic devices, although glass material can improve the appearance effect, it is limited by material characteristics, so it cannot be compared with the original in terms of weight and manufacturing cost. Cases with metal or plastic materials are quite competitive, so they are only effective but prohibitive in design.
发明内容SUMMARY OF THE INVENTION
本发明提供一种电子装置的机壳结构及其制作方法,其通过在金属材质的机壳上配置硅胶层以达到拟态玻璃的视觉效果。The invention provides a casing structure of an electronic device and a manufacturing method thereof, which can achieve the visual effect of imitating glass by disposing a silica gel layer on the casing made of metal.
本发明的电子装置的机壳结构,包括壳体、硅胶层以及结合件。壳体具有外表面与内表面,壳体的材质为金属。硅胶层配置于外表面,且硅胶层的边缘延伸至内表面。结合件配置于内表面,以使硅胶层的边缘被夹持于壳体与结合件之间。The casing structure of the electronic device of the present invention includes a casing, a silica gel layer and a bonding member. The shell has an outer surface and an inner surface, and the material of the shell is metal. The silica gel layer is disposed on the outer surface, and the edge of the silica gel layer extends to the inner surface. The binding element is arranged on the inner surface, so that the edge of the silicone layer is clamped between the casing and the binding element.
本发明的机壳结构的制作方法,包括冲压成型出金属壳体,金属壳体具有外表面与内表面;真空吸附硅胶层于外表面,且使硅胶层的边缘内折入内表面。配置塑胶结合件于内表面,以使硅胶层的边缘被夹持在内表面与塑胶结合件之间。The manufacturing method of the casing structure of the present invention includes punching and forming a metal shell, the metal shell having an outer surface and an inner surface; vacuum adsorbing the silica gel layer on the outer surface, and folding the edge of the silica gel layer into the inner surface. The plastic bonding element is arranged on the inner surface, so that the edge of the silicone layer is clamped between the inner surface and the plastic bonding element.
基于上述,通过在金属壳体的外表面配置硅胶层,并让硅胶层的边缘得以延伸并内折入金属壳体的内表面,而再以塑胶结合件配置于金属壳体的内表面而将硅胶层夹持其中,并让硅胶层位于外表面的部分得以被拉撑。如此一来,硅胶层与金属机壳的结合,能让电子装置的机壳结构得以产生拟态玻璃的效果,也即让金属机壳通过硅胶层的通透视觉效果而提升其美观性。Based on the above, by disposing the silicone layer on the outer surface of the metal shell, and allowing the edge of the silicone layer to extend and fold into the inner surface of the metal shell, and then disposing the plastic bonding element on the inner surface of the metal shell, the The silicone layer is sandwiched therein, and the part of the silicone layer on the outer surface can be stretched. In this way, the combination of the silicone layer and the metal casing can make the casing structure of the electronic device produce the effect of mimicking glass, that is, the metal casing can improve its aesthetics through the transparent visual effect of the silicone layer.
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合附图作详细说明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.
附图说明Description of drawings
图1是依据本发明一实施例的机壳结构的制作流程图。FIG. 1 is a flow chart of the fabrication of a casing structure according to an embodiment of the present invention.
图2至图5是对应图1制作流程的结构示意图。FIG. 2 to FIG. 5 are schematic structural diagrams corresponding to the manufacturing process of FIG. 1 .
图6与图7分别是本发明不同实施例的机壳结构的示意图。FIG. 6 and FIG. 7 are schematic diagrams of casing structures according to different embodiments of the present invention, respectively.
附图标记说明Description of reference numerals
10、30、40:机壳结构10, 30, 40: case structure
20:真空腔室20: Vacuum Chamber
21:治具21: Jig
100:金属壳体100: Metal shell
110:基层110: Grassroots
120:处理层120: Processing Layer
122:图案层122: Pattern Layer
130:段差结构130: Level difference structure
200:粘着层200: Adhesive layer
300:色层300: color layer
400:硅胶层400: Silicone layer
500:塑胶结合件500: Plastic joints
C:切角C: Cut corners
F1:外表面F1: outer surface
F2:内表面F2: inner surface
F1a、F2a:局部F1a, F2a: Local
L1、L2:光线L1, L2: light
R:圆角R: rounded corners
R1a、R1b:拉力R1a, R1b: tension
S1~S7:步骤S1~S7: Steps
具体实施方式Detailed ways
图1是依据本发明一实施例的机壳结构的制作流程图。图2至图5是对应图1制作流程的结构示意图。请参考图1并分别对照图2至图5,在本实施例中,电子装置例如是笔记本电脑,而所述机壳结构是指显示屏幕的背盖部分,其在视觉上占了电子装置的整体外观的绝大部分。然,本发明所示机壳结构并未因此受限其型式,换句话说,所述机壳结构同样能适用于如移动电话、平板电脑等为人所熟知的电子装置。FIG. 1 is a flow chart of the fabrication of a casing structure according to an embodiment of the present invention. FIG. 2 to FIG. 5 are schematic structural diagrams corresponding to the manufacturing process of FIG. 1 . Please refer to FIG. 1 and compare FIGS. 2 to 5 respectively. In this embodiment, the electronic device is, for example, a notebook computer, and the casing structure refers to the back cover of the display screen, which visually occupies the space of the electronic device. The vast majority of the overall appearance. However, the casing structure shown in the present invention is not limited to its type. In other words, the casing structure can also be applied to well-known electronic devices such as mobile phones and tablet computers.
在本实施例所述的机壳结构,其通过金属壳体与硅胶层而得以产生拟态玻璃的视觉效果。首先,如图1及图2所示,在步骤S1中,冲压成型出金属壳体100,且所述金属壳体100具有外表面F1及内表面F2;接着,在步骤S2中,对金属壳体100的外表面F1进行表面处理而形成处理层120。在此所述表面处理包括蚀刻制程,也即将外表面F1予以侵蚀而形成微结构,本实施例仅以蚀刻为例,因此使金属壳体100产生未被蚀刻的基层110以及位于外表面F1的图案层122,其中图案层122为处理层120的至少部分微结构。反过来说,本实施例的金属机壳100,其是以存在处理层120的部分视为其外表面F1,而不存在处理层120的部分视为其内表面F2。In the casing structure described in this embodiment, the metal casing and the silica gel layer can produce the visual effect of mimicking glass. First, as shown in FIG. 1 and FIG. 2 , in step S1, a
接着,请参考图1并对照图3,在步骤S3中,在金属壳体100的外表面F1涂布色层300,并在步骤S4中,在金属壳体100的外表面F1涂布粘着层200,在此是先对外表面F1上漆而完成所述色层300后,再在其上涂胶,以使粘着层200覆盖色层300。但本实施例并不以此为限,使用者可依据需求省略步骤S3,或将步骤S3、S4对调,或使漆、胶两者混和而以单次涂布即完成所需效果。再者,前述以微结构所形成的图案层122也能因光线L1、L2路径改变而在视觉上产生颜色效果。此外,前述在金属壳体100上造成的微结构也能使外表面F1具有较高粗糙度,而有利于粘着层200或色层300与金属壳体间的结合强度,在此所述粘着层200例如是透明状的primer,以利于将金属与硅胶结合在一起。Next, please refer to FIG. 1 and compare with FIG. 3 , in step S3 , the
接着,请参考图1并对照图4A、图4B,在步骤S5中,先行提供硅胶层400,其可通过射出或压制而形成立体物件,且由于具备可挠性,因此如图4A所示,先行将硅胶层400穿套在金属壳体100上;接着,在步骤S6中,以真空吸附方式让硅胶层400通过前述粘着层200而贴附在金属壳体100的外表面F1上,而将前述步骤所产生的粘着层200、色层300与图案层122等包覆其内。Next, please refer to FIG. 1 and compare FIGS. 4A and 4B. In step S5, a
如图4A所示,所成型出的硅胶层400为立体物件,也就是说先成型出与金属壳体100的外表面F1轮廓一致的立体物件(硅胶层400),接着再使金属机壳100以其外表面F1穿套(wear)硅胶层400,其中正是因现有玻璃或相关材料受限于材质的硬脆(hard andbrittle)特性,明显不若硅胶层400来的具有可挠性,因此采用硅胶层400能使机壳结构的制作过程中有效地提高制作效率并降低材料的耗损率。As shown in FIG. 4A , the molded
值得注意的是,在步骤S5中,将硅胶层400穿套至金属机壳100后,硅胶层400的边缘需从外表面F1进一步地延伸并内折入内表面F2。再者,在步骤S6中,将金属机壳100与其上的硅胶层400一同置入真空腔室20而放置于治具21上,以利进行真空处理,在此过程中,通过真空吸取而得以排出前述穿套动作中可能残留在金属机壳100与硅胶层400之间的空气,以提高硅胶层400通过粘着层200而与金属机壳之间的结合强度。It should be noted that, in step S5, after the
最后,请参考图1并对照图5,在步骤S7中,配置塑胶结合件500至金属壳体100的内表面F2,以使硅胶层400的边缘被夹持在塑胶结合件500与金属壳体100的内表面F2之间,同时如图5所示,塑胶结合件500实质上是与金属壳体100之间存在多个结合部位,因而得以通过多个拉力R1a、R1b而达到让硅胶层400在外表面F1的部分产生拉撑的效果。Finally, referring to FIG. 1 and referring to FIG. 5 , in step S7 , the
在本实施例中,塑胶结合件500是以(模内)射出成型方式而与金属壳体100的内表面F2结合。在另一实施例中,制作者也可以胶合方式将塑胶结合件500贴附在内表面F2。在此,塑胶结合件500例如是笔记本电脑内用以配置及组装显示屏幕的相关元件的结构件。In this embodiment, the plastic joint 500 is combined with the inner surface F2 of the
届此,便完成机壳结构10的制作过程。At this point, the manufacturing process of the
基于上述,由于在金属壳体100的外表面F1配置有硅胶层400,且硅胶层400为透明状态,而其厚度是0.3mm至1mm,除避免射出成型时因厚度过薄而破损外,也在与金属壳体100结合后,硅胶层400除能顺利地让光线通过外,还能因此产生光线折射,进而使金属壳体100在外表面F1的图纹(前述图案层122或/与色层300)得以通过硅胶层400的光学特性而产生不同的视觉效果,而让本实施例的机壳结构10能与其他配置有玻璃的机壳结构具备相同的视觉效果而达到拟态玻璃的目的,且此举无须面临因玻璃材质而对应产生的特性限制及制造成本等问题。Based on the above, since the
在其他未示出的实施例中,硅胶层也可加入其他材料而具备不同程度的透光度(光线穿透率及折射率)或造成光线散射等效果,而让前述视觉效果能更加多样化,同时,也可与金属壳体100的表面处理效果(例如喷砂、拉丝等处理方式)而予以搭配不同透光度的硅胶层,以产生不同的视觉效果。In other not-shown embodiments, other materials can also be added to the silicone layer to have different degrees of light transmittance (light transmittance and refractive index) or to cause light scattering and other effects, so that the aforementioned visual effects can be more diverse At the same time, silica gel layers with different light transmittances can be matched with the surface treatment effects of the metal shell 100 (such as sandblasting, wire drawing, etc.) to produce different visual effects.
请再参考图5,在本实施例中,塑胶结合件500实质上抵接在金属壳体100位于内侧的弯折处,也即横跨所示内表面F2的局部F2a及外表面F1的局部F1a,以提高金属壳体100与塑胶结合件500的结合力,也能因此达到稳固硅胶层400边缘的效果。然本发明并未限制塑胶结合件与金属壳体的结合型式,图6与图7分别是本发明不同实施例的机壳结构的示意图。请先参考图6,在本实施例中,机壳结构30的金属壳体100在内表面F2与外表面F1的衔接处(外表面F1邻接在内表面F2处)存在圆角R,因此本实施例的塑胶结合件500与内表面F2之间需对应地以段差(stage)结构(或转折结构)130而相互嵌合。接着请参考图7,类似地,本实施例的机壳结构40的金属壳体100在内表面F2与外表面F1的衔接处(外表面F1邻接在内表面F2处)存在切角C,因此本实施例的塑胶结合件500与内表面F2之间也需对应地以段差结构(或转折结构)130而相互嵌合。Referring again to FIG. 5 , in this embodiment, the
换句话说,前述图5所示实施例,塑胶结合件500的内表面F2不存在段差结构,则塑胶结合件500需以横跨内表面F2与外表面F1的方式结合至金属壳体100,而在图6及图7的实施例中,通过设置在内表面F2的段差结构则使塑胶结合件500仅需抵接在内表面F2即可完成结合动作。无论图5至图7任一实施例,使用者可依据金属壳体100的尺寸或其内的空间配置需求,而采取适当的对应方案。In other words, in the aforementioned embodiment shown in FIG. 5 , the inner surface F2 of the
综上所述,在本发明的上述实施例中,通过在金属壳体的外表面配置硅胶层,并让硅胶层的边缘得以延伸并内折入金属壳体的内表面,而再以塑胶结合件配置于金属壳体的内表面而将硅胶层夹持其中,并让硅胶层位于外表面的部分得以被拉撑。如此一来,硅胶层与金属机壳的结合,能让电子装置的机壳结构得以产生拟态玻璃的效果,也即让金属机壳通过硅胶层的通透视觉效果而提升其美观性。To sum up, in the above-mentioned embodiments of the present invention, the silica gel layer is arranged on the outer surface of the metal shell, and the edge of the silica gel layer is extended and folded into the inner surface of the metal shell, and then bonded with plastic The part is arranged on the inner surface of the metal shell to sandwich the silicone layer, and the part of the silicone layer on the outer surface can be stretched. In this way, the combination of the silicone layer and the metal casing can make the casing structure of the electronic device produce the effect of mimicking glass, that is, the metal casing can improve its aesthetics through the transparent visual effect of the silicone layer.
虽然本发明已以实施例揭示如上,然其并非用以限定本发明,任何所属技术领域中技术人员,在不脱离本发明的精神和范围内,当可作些许的更动与润饰,故本发明的保护范围当视权利要求所界定者为准。Although the present invention has been disclosed above with examples, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the invention shall be determined by the claims.
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