CN108499819A - The production method of in-out box - Google Patents

Abstract

A manufacturing method of an input and output assembly disclosed in the present invention includes: providing a casing and a panel assembly, the casing includes a bottom wall and a side wall extending from the side of the bottom wall, and a groove is surrounded by the bottom wall and the side wall; setting the panel assembly in the groove; disposing caulking glue in a gap between the top of the side wall and the edge of the panel assembly; blowing air to the caulking glue to cure the caulking glue to securely connect the housing and the panel assembly; and wiping the caulking glue located in the gap the cured caulk in the housing so that the cured caulk has approximately the same appearance as the casing. The manufacturing method of the input-output assembly of the present invention solidifies and wipes the caulking glue located in the gap by blowing air, so that the surface of the caulking glue after wiping is rough and in a matte state, so that the appearance of the cured caulking glue is the same as The appearance of the casings, which are usually in a matte state, is roughly the same, which is conducive to the coordination and consistency of product appearance.

Description

How to make input and output components

technical field

The invention relates to an electronic device, in particular to a manufacturing method of an input and output assembly.

Background technique

In the related art, an electronic device such as a mobile phone includes a casing and a panel assembly. The casing is formed with a groove, and the panel assembly is disposed in the groove. The casing and the side of the panel assembly are generally fixedly connected by dispensing glue. However, after the glue is cured, the appearance of the glue is quite different from that of the casing.

Contents of the invention

The invention provides a manufacturing method of an input and output component.

The manufacturing method of the input-output component of the embodiment of the present invention comprises steps:

A housing and a panel assembly are provided, the housing includes a bottom wall and side walls extending from sides of the bottom wall, the bottom wall and the side walls define a groove;

disposing the panel assembly in the groove;

disposing caulk in the gap between the top of the side wall and the edge of the panel assembly;

blowing air to the caulk to cure the caulk to securely connect the housing and the panel assembly; and

Wipe the cured caulking glue in the gap, so that the appearance of the cured caulking glue is substantially the same as that of the casing.

The manufacturing method of the input and output components according to the embodiment of the present invention cures and wipes the caulking glue located in the gap by blowing air, so that the surface of the caulking glue after wiping is rough and in a matte state, so that the surface of the caulking glue after curing is The appearance is roughly the same as that of the shell, which is usually in a matte state, which is conducive to the coordination and consistency of the appearance of the product.

Additional aspects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and comprehensible from the description of the embodiments in conjunction with the following drawings, wherein:

FIG. 1 is a three-dimensional exploded schematic diagram of an input and output assembly according to an embodiment of the present invention;

2 is a schematic plan view of an input and output assembly according to an embodiment of the present invention;

Fig. 3 is a schematic cross-sectional view of the input and output assembly of Fig. 2 along the III-III direction;

Fig. 4 is an enlarged schematic diagram of part IV of the input and output assembly of Fig. 3;

Fig. 5 is a schematic cross-sectional view of the input-output assembly of Fig. 2 along the V-V direction;

Fig. 6 is the enlarged schematic diagram of the VI part of the input and output assembly of Fig. 5;

7 is a schematic flowchart of a method for manufacturing an input-output component according to an embodiment of the present invention;

8 is a schematic diagram of the process of the manufacturing method of the input and output components according to the embodiment of the present invention;

9 is a schematic diagram of the process of step S14 of the manufacturing method of the input and output components according to the embodiment of the present invention;

FIG. 10 is a schematic plan view of an electronic device according to an embodiment of the present invention.

Description of main component symbols:

Electronic device 100, body 20, input and output assembly 10, housing 12, groove 122, side wall 126, long side 1223, long side wall 1224, short side 1225, short side wall 1226, bottom 1228, bottom wall 124, side Wall 126, top 1262, step 128, step face 1282, step lower 1284, step upper 1286, outer side 121, panel assembly 14, edge 142, touch panel 144, touch panel edge 1442, cover 146, cover edge 1462 , cover plate lower surface 1464, upper surface 148, outer edge 1482, anti-overflow strip 16, caulking strip 18, gap 11, opening 112, adhesive strip 19, glue thinning coating 13.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the invention. Furthermore, the present disclosure may repeat reference numerals and/or reference letters in different instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

Referring to FIGS. 1 to 4 , the input and output assembly 10 according to the embodiment of the present invention includes a housing 12 , a panel assembly 14 and a sealing strip 18 .

The casing 12 includes a bottom wall 124 and a side wall 126 extending from a side of the bottom wall 124 . The bottom wall 124 and the side wall 126 define a groove 122 . The casing 12 includes an anti-spill strip 16 protruding inward from the sidewall 126 and extending along a circumferential direction of the sidewall 126 . The panel assembly 14 is received in the groove 122 . The panel assembly 14 includes an edge 142 of the panel assembly 14 mating with the side wall 126 and an upper surface 148 connected to the edge 142 . The anti-spill strip 16 seals the gap 11 between the side wall 126 and the edge 142 . The caulk strip 18 is formed by disposing caulk glue between the top 1262 and the edge 142 of the sidewall 126 and curing. The sealing strip 18 is fixedly connected to the housing 12 and the panel assembly 14 .

The input and output assembly 10 according to the embodiment of the present invention sets the anti-overflow strip 16, so that the anti-overflow strip 16 seals the gap 11 between the side wall 126 and the edge 142, thereby preventing subsequent setting of the curing shell 12 and the panel assembly 14 for caulking When glued, caulk seeps into groove 122 to contaminate housing 12 and/or panel assembly 14 .

The casing 12 includes a bottom wall 124 and a side wall 126 extending from the bottom wall 124 , the bottom wall 124 and the side wall 126 define a groove 122 . The casing 12 is roughly rectangular in shape, and the casing 12 is a carrier of the electronic device 100 for carrying most parts of the electronic device 100 . The housing 12 can be made of plastic or metal, or plastic and metal can be used to form an integrated structure through in-mold injection molding. In one example, the material of the bottom wall 124 is metal, and the material of the side wall 126 is plastic. The bottom wall 124 can be put into a mold first, and then molten plastic is injected into the mold to form the side wall 126 after the plastic solidifies. , so that the shell 12 is obtained.

In some embodiments, the anti-overflow strip 16 and the side wall 126 are separate structures, and the anti-overflow strip 16 is mounted on the inner side of the side wall 126 along the circumferential direction of the side wall 126 .

Certainly, in some other embodiments, the anti-overflow strip 16 and the side wall 126 are integrally structured, for example, the anti-overflow strip 16 and the side wall 126 may be formed by injection molding.

In some embodiments, when the anti-overflow strip 16 and the side wall 126 are separate structures, the anti-overflow strip 16 includes foam. At this time, the foam can be pasted on the inner side of the side wall 126 by double-sided tape. The foam has elasticity, and the use of foam as the anti-overflow strip 16 can not only prevent subsequent caulking glue from penetrating into the groove 122 to pollute the housing 12 and/or panel assembly 14, but also can be used as a buffer material, 14 protects the panel assembly 14 when impacted. In addition, the foam is easy to obtain and light in weight, which can reduce the weight of the casing 12 and the panel assembly 14 while improving production efficiency and reducing costs.

In some embodiments, the side wall 126 includes an inner side 1222 , the bottom wall 124 includes a bottom surface 1228 connected to the inner side 1222 , and the inner side 1222 is a plane perpendicular to the bottom surface 1228 .

In some embodiments, the sidewall 126 includes an inner surface 1222 , the bottom wall 124 includes a bottom surface 1228 connected to the inner surface 1222 , and the inner surface 1222 is an inclined surface extending upward and outward from the edge of the bottom surface 1228 .

The inner surface 1222 may be perpendicular to the bottom surface 1228, or may extend upwards and outwards from the edge of the bottom surface 1228, and the specific structure of the input and output assembly 10 may be selected according to requirements.

In some embodiments, the panel assembly 14 includes a touch panel 144 and a cover 146 covering the touch panel 144 . The lateral dimension of the cover 146 is larger than that of the touch panel 144 such that the edge 142 forms a stepped surface between the cover 146 and the touch panel 144 . Edges 142 include cover edge 1462 and touch panel edge 1442 . The anti-spill strip 16 seals the gap 11 between the side wall 126 and the edge 1442 of the touch panel. The sealing strip 18 is fixedly connected to the edge 1462 of the cover plate and the side wall 126 .

In this way, the edge 1462 of the cover plate is connected to the sidewall 126 of the groove 122 through the sealing strip 18 , so that the panel assembly 14 is fixedly connected to the casing 12 .

Specifically, the material of the cover plate 146 may be made of light-transmitting materials such as glass, ceramics, or sapphire. Since the cover 146 is an input part of the electronic device 100 , the cover 146 is often touched by bumps or scratches. For example, when a user puts the electronic device 100 into a pocket, the cover 146 may be scratched and damaged by a key in the user's pocket. Therefore, the material of the cover plate 146 can be a material with relatively high hardness, such as the above sapphire material. Alternatively, a hardened layer is formed on the surface of the cover plate 146 to improve the scratch resistance of the cover plate 146 .

Specifically, the touch panel 144 includes a display module (not shown) and a touch layer (not shown) disposed on the display module. The display module is, for example, a liquid crystal display module (LCD Module, LCM). Of course, the display module can also be a flexible display module. The touch layer is used for receiving user's touch input to generate a signal for controlling the content displayed by the display module.

The touch panel 144 and the cover plate 146 are bonded and fixed together by optical glue (Optically Clear Adhesive, OCA). light.

In one example, the panel assembly 14 can be formed through the following steps: first provide the touch panel 144 and the cover plate 146, then apply optical glue on the touch panel 144, and finally stick the cover plate 146 on the optical glue, so that The cover plate 146 and the touch panel 144 are fixed together.

In some embodiments, the sidewall 126 includes a long sidewall 1224 and a short sidewall 1226 connecting the long sidewall 1224 , and the anti-overflow strip 16 is disposed on the inner side of the long sidewall 1224 along the length direction of the long sidewall 1224 . In this way, the size of the long sidewall 1224 is relatively large, and the anti-overflow strip 16 is arranged on the inner side of the long sidewall 1224 along the length direction of the long sidewall 1224 to help seal the gap 11 between the sidewall 126 and the edge 1226 .

Please refer to FIG. 5 and FIG. 6 together. In some embodiments, the groove 122 is substantially rectangular, and the sidewall 126 includes a long sidewall 1224 and a short sidewall 1226 connecting the long sidewall 1224. The short sidewall 1226 is formed with Step 128 , the panel assembly 14 is supported on the step 128 and bonded to the step 128 . In this way, the step 128 acts as a support for the panel assembly 14 , which facilitates the stable connection of the panel assembly 14 to the casing 12 . Specifically, in this embodiment, the cover plate 146 is supported on the step 128 and fixed with the step 128 , and the touch panel 144 is located on one side of the step 128 .

In another embodiment, the short sidewall 1226 can omit the step 128 and have the same structure as the long sidewall 1224 , and the anti-overflow strip 16 can also be attached thereto.

The present invention also provides a manufacturing method of the input-output assembly, the manufacturing method of the input-output assembly in the embodiment of the present invention can be used to manufacture the input-output assembly 10 forming the embodiment of the present invention. Specifically, the manufacturing method of the input-output component according to the embodiment of the present invention will be described in detail below.

Referring to Fig. 7 and Fig. 8, the manufacturing method of the input and output components according to the embodiment of the present invention includes the following steps:

S12: provide the housing 12 and the panel assembly 14, the housing 12 includes a bottom wall 124 and a side wall 126 extending from the side of the bottom wall 124, the bottom wall 124 and the side wall 126 are surrounded by a groove 122; S14: the panel The component 14 is arranged in the groove 122;

S16: disposing caulking glue in the gap 11 between the top 1262 of the side wall 126 and the edge 142 of the panel assembly 14;

S18: Blowing air to the caulking glue to cure the caulking glue to securely connect the shell 12 and the panel assembly 14 .

S20: Wipe the cured caulking glue in the gap 11, so that the appearance of the cured caulking glue is roughly the same as that of the casing 12

The manufacturing method of the input-output assembly according to the embodiment of the present invention cures and wipes the caulking glue located in the gap 11 by blowing air, so that the surface of the caulking glue after wiping is rough and in a matte state, so that the cured caulking glue The appearance of the shell is substantially the same as that of the shell 12 which is usually in a matte state, which is conducive to the coordination and consistency of the appearance of the product.

It can be understood that the caulking glue located in the gap 11 can be cured by blowing to make the viscosity of the caulking glue higher. After the caulking glue with higher viscosity is wiped, the surface of the caulking glue is rough and matte, while the shell The body 12 is usually in a matte state, so that the appearance of the cured caulking glue can be consistent with the appearance of the shell 12, so that the appearance of the product is coordinated and consistent.

In step S14 , the panel assembly 14 can be sucked by the suction cup, and then put into the groove 122 , and the anti-spill strip 16 is in contact with the edge 142 , so that the gap 11 between the side wall 126 and the edge 142 can be sealed. It should be pointed out that the anti-overflow strip 16 seals the gap 11 at the bottom of the side wall 126 and the edge 142 .

In step S16, caulking glue can be dispensed in the upper part of the gap 11 by a glue dispenser. Caulking glue can cure naturally or it can be cured by other means. For example, when the caulking glue is UV glue, the glue can be cured by irradiating the glue with ultraviolet rays.

It should be pointed out that in step S18, the caulking glue to be wiped is not fully cured glue. It is understandable that after the caulking glue is fully cured, the caulking glue loses its fluidity and has a smooth surface that cannot be wiped off. In addition, the fully cured caulking glue has a certain hardness, and forcible wiping may damage the panel assembly 14 or the casing 12 during the wiping process.

In some embodiments, the panel assembly 14 includes a touch panel 144 and a cover 146 covering the touch panel 144 . The lateral dimension of the cover 146 is larger than that of the touch panel 144 such that the edge 142 forms a stepped surface between the cover 146 and the touch panel 144 . The edge 142 includes a cover edge 1462 and a touch panel edge 1442 . Step S16 includes:

providing caulking glue in the gap 11 between the top 1262 of the side wall 126 and the edge 1462 of the cover;

Step S18 includes:

The caulking glue is cured to securely connect the shell 12 and the cover edge 1462 .

In this way, the casing 12 and the cover plate edge 1462 are connected and fixed by the caulking glue 18 formed by curing the caulking glue, so that the panel assembly 14 is fixed in the groove 122 .

In some embodiments, the gap 11 is formed with an upward facing opening 112, and the step of disposing caulking glue in the gap 11 between the top 1262 of the side wall 126 and the edge 1462 of the cover plate includes the following steps:

Put caulking glue into the gap 11 through the opening 112 .

The dispensing head is generally in the shape of a needle, and can put caulking glue into the gap 11 through the opening 112 . In one example, the input and output assembly 10 may be fixed and accommodated by a clamp, and then the dispensing head moves along the gap 11 in a circle, and puts caulking glue into the gap 11 through the opening 112 . In this way, the filling of the bonding glue is realized.

In some embodiments, step S18 includes:

Cure the caulking glue in an environment of 20-25°C.

In one example, the caulk is cured at 20°C; in another example, the caulk is cured at 22°C; and in yet another example, the caulk is cured at 25°C. The curing temperature in the range of 20-25°C is not specifically limited here.

In this way, the curing of the caulking glue is realized. It can be understood that after the caulking glue is completely cured, the caulking glue loses its fluidity, and the fully cured caulking strip 18 has a certain hardness, so that the subsequent removal of the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 The caulking glue is inconvenient and may even damage the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 during removal. The caulking glue cured in the environment of 20-25° C. for more than five minutes has not yet reached a fully cured state, which is beneficial for subsequent removal of the caulking glue located on the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 . In addition, 20-25° C. is a normal temperature environment, curing the caulking glue in a normal temperature environment makes the curing conditions of the caulking glue simple and easy to implement, thereby reducing the manufacturing cost of the input and output assembly 10 .

Referring to Fig. 8, in some embodiments, the manufacturing method of the input-output assembly also includes the steps before step S14:

Anti-overflow glue is arranged on the inner side of the side wall 126 along the circumferential direction of the side wall 126;

curing the anti-spill glue to form at least one anti-spill strip 16;

Step S14 includes:

The panel assembly 14 is positioned in the recess 122 with the anti-spill strip 16 sealing the gap 11 between the side wall 126 and the edge 142 .

Before step S14, the anti-overflow strip 16 is set to seal the gap 11 between the side wall 126 and the edge 142, which can prevent the caulking glue from penetrating into the groove 122 and contaminating the shell when the caulking glue of the casing 12 and the panel assembly 14 is subsequently set. Body 12 and/or panel assembly 14.

In some embodiments, the groove 122 is roughly rectangular, and the sidewall 126 includes a long sidewall 1224 and a short sidewall 1226 connecting the long sidewall 1224, and anti-overflow glue is provided on the sidewall 126 along the circumference of the sidewall 126. The steps include the following steps:

Anti-spill glue is provided on the inner side of the long sidewall 1224 along the length direction of the long sidewall 1224 .

In this way, the anti-overflow glue can be disposed on the inner side of the long side wall 1224 of the side wall 126 .

In some embodiments, the step of disposing anti-spill glue on the inner side of the long sidewall 1224 along the length direction of the long sidewall 1224 includes the following steps:

The anti-spill glue is continuously provided on the inner side of the long sidewall 1224 along the length direction of the long sidewall 1224 .

In this way, the size of the long sidewall 1224 is relatively large, and the anti-overflow strip 16 is arranged on the inner side of the long sidewall 1224 along the length direction of the long sidewall 1224 to help seal the gap 11 between the sidewall 126 and the edge 1226 . In addition, the anti-overflow glue is continuously distributed on the long side wall 1224, so that the anti-overflow strip 16 after the anti-overflow glue is solidified is continuous on the inner side of the long side wall 1224, preventing the discontinuous dot coating of the anti-overflow strip 16 from causing The inability of the anti-spill strip 16 to form a continuous sealing ring makes it less effective in sealing the gap 11 between the side wall 126 and the edge 142 .

In some embodiments, the anti-spill glue includes silicone glue.

Silicone glue has strong adhesion and good moisture resistance. Using silicone glue as the anti-overflow glue can make the anti-overflow strip 16 formed by curing the anti-overflow glue better in airtightness and moisture resistance. In addition, the silicone glue can also adapt to large temperature changes, so that the anti-overflow strip 16 will not reduce the sealing effect due to temperature changes. Of course, the sealing glue can also be silicone glue. The anti-overflow glue and sealing glue can also be UV glue and other glues with good fluidity.

In some embodiments, the step of curing the anti-spill glue to form at least one anti-spill strip 16 comprises the following steps:

Cure the anti-spill glue in an environment of 20-25°C for more than five minutes.

In one example, the anti-spill glue is cured in an environment of 20°C, and the curing time is 15 minutes; in another example, the anti-spill glue is cured in an environment of 22°C, and the curing time is 12 minutes; in yet another example , Curing the anti-spill glue in an environment of 25°C, the curing time is 6 minutes. The curing temperature in the range of 20-25° C. and the curing time in the range of more than five minutes are not specifically limited here.

In this way, 20-25° C. is a normal temperature environment, and curing the anti-overflow glue in a normal temperature environment makes the curing conditions of the anti-overflow glue simple and easy to implement, thereby reducing the manufacturing cost of the input-output assembly 10 .

In some embodiments, the curing time of the anti-spill glue is less than the complete curing time of the anti-spill glue. In one example, the full curing time of the anti-overflow glue is greater than 25 minutes, while in the present invention, the anti-overflow glue has a curing time of 10 minutes.

In this way, after the anti-overflow glue is solidified for a period of time, the panel assembly 14 is arranged in the groove 122, so that the tightness between the panel assembly 14 and the groove 122 can be compared with that of the panel assembly 14 when the anti-overflow glue is not cured. The tightness of the case in the groove 122 is small, which facilitates disassembly in the subsequent maintenance process. In addition, before the anti-overflow glue is completely cured, the panel assembly 14 is arranged in the groove 122, which can avoid the poor sealing effect caused by the reduced fluidity of the anti-overflow glue due to the complete curing of the anti-overflow glue.

It can be understood that after the anti-overflow glue is completely cured, the anti-overflow glue loses its fluidity. At this time, the panel assembly 14 is set in the groove 122, and the anti-overflow glue cannot be deformed according to the extrusion of the panel assembly 14 and the groove 122. Better sealing effect. In addition, the anti-overflow strip 16 formed by the fully cured anti-overflow glue is not smooth and has a certain hardness, which will cause obstacles when the panel assembly 14 is placed into the groove 122 .

In some embodiments, the panel assembly 14 includes a touch panel 144 and a cover plate 146 covering the touch panel 144. The lateral dimension of the cover plate 146 is larger than the transverse dimension of the touch panel 144 such that the edge 142 is on the cover plate 146. A step surface is formed between the touch panel 144, the edge 142 includes a cover edge 1462 and a touch panel edge 1442, the panel assembly 14 is arranged in the groove 122 and the anti-overflow strip 16 is sealed between the side wall 126 and the edge 142 The steps for gap 11 include:

The panel assembly 14 is disposed in the groove 122 and the anti-spill strip 16 seals the gap between the side wall 126 and the edge 1442 of the touch panel.

In this way, the anti-overflow strip 16 can seal the gap 11 between the side wall 126 and the edge 1442 of the touch panel. It can prevent the caulking glue from penetrating into the groove 122 to contaminate the casing 12 and/or the panel assembly 14 when the caulking glue of the casing 12 and the panel assembly 14 is cured later.

Referring to FIG. 9, in some embodiments, the groove 122 is substantially rectangular, the side wall 126 includes an inner side 1222, the inner side 1222 includes a long side 1223 and a short side 1225 connecting the long side 1223, and the short side 1225 is formed with a step 128, the step 128 includes a step surface 1282, a step bottom 1284 connecting the step surface 1282 and the long side 1223 and a step top 1286 connecting the step surface 1282, and the anti-overflow glue is arranged on the inner side of the side wall 126 along the circumferential direction of the side wall 126 The steps include the following steps:

The anti-overflow glue is arranged continuously along the length direction of the lower part 1284 of the step.

In this way, the anti-overflow glue can be continuously distributed on the bottom of the step 1284, so that the anti-overflow strip 16 after the anti-overflow glue is cured is continuous on the bottom of the step 1284, preventing the anti-overflow caused by the discontinuous dot coating of the anti-overflow strip 16 The inability of the strip 16 to form a continuous sealing ring makes sealing the gap 11 between the side wall 126 and the edge 142 less effective.

It can be understood that the anti-overflow glue coated on the long side wall 1224 and the short side wall 1226 is continuous, so that the anti-overflow strip 16 formed after the anti-overflow glue coated along the circumference of the side wall 126 is cured can form a Closed seal.

In some embodiments, step S14 includes the following steps:

Adhesive glue is set on the step surface;

supporting the panel assembly on the stepped surface; and

Cures the bonding glue to bond step faces and panel components.

In this way, the panel assembly 14 is supported and fixed on the stepped surface 1282 by the adhesive strip 19 formed by curing the adhesive glue. The step 128 acts as a support for the panel assembly 14 , which facilitates the stable connection of the panel assembly 14 to the housing 12 .

Specifically, the components of the bonding glue and the anti-overflow glue may be the same, for example, both are the above-mentioned silicone glue. In addition, the panel assembly 14 includes a touch panel 144 and a cover plate 146 covering the touch panel 144, the longitudinal dimension of the cover plate 146 is larger than the longitudinal dimension of the touch panel 144, and the cover plate 146 of the panel assembly 14 rests on the step surface At 1282 , the touch panel 144 of the panel assembly 14 is bonded to the anti-overflow strip 16 formed by curing the anti-overflow glue at the bottom of the step 1284 .

In some embodiments, the step of removing the caulk on the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 includes the following steps:

The caulking glue on the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 is removed.

During the process of dotting the caulking glue into the gap 11 from the opening 112, since the gap 11 is very narrow, when the amount of glue flowing out from the dispensing head is too much, the caulking glue 13 will easily overflow to the outer side 121 of the housing 12 and the panel The upper surface 148 of the assembly 14 . Therefore, after the caulking glue is cured, it is necessary to wipe off the caulking glue so that the outer side 121 of the housing 12 and the upper surface 148 of the panel assembly 14 are free of the caulking glue.

In some embodiments, the step of removing the caulk on the upper surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 includes the steps of:

Use a lint-free cloth to wipe off the caulk on the upper surface 148 of the panel assembly 14 and the outside 121 of the housing 12 .

The surface of the dust-free cloth is soft and has good cleaning efficiency. Using the dust-free cloth to wipe off the caulking glue can obtain higher cleaning efficiency without damaging the surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 . In one example, the input and output assembly 10 can be fixed with a clamp first, then the dust-free cloth is clamped by the manipulator, and finally the manipulator is controlled to move to wipe off the caulking glue on the surface 148 of the panel assembly 14 and the outer side 121 of the housing 12 . It can be understood that when the caulking glue on the glue-repellent coating 13 is wiped off, the glue-repellent coating 13 is also removed.

Referring to FIG. 10 , the input-output component 10 according to the embodiment of the present invention can be applied to an electronic device 100 . The electronic device 100 includes a body 20 on which the input-output assembly 10 is disposed. The electronic device 100 includes but is not limited to a mobile phone, a tablet computer or a wearable device.

Specifically, the electronic device 100 further includes battery covers (not shown in the figure), and the battery covers are respectively located on the side of the casing 12 opposite to the panel assembly 14 .

In the description of this specification, descriptions referring to the terms "one embodiment", "certain embodiments", "exemplary embodiments", "example", "specific examples", or "some examples" are meant to be combined with Specific features, structures, materials, or characteristics described in the preceding embodiments or examples are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the invention is defined by the claims and their equivalents.

Claims (14)

1. A manufacturing method of an input-output assembly, characterized in that, comprising: A housing and a panel assembly are provided, the housing includes a bottom wall and side walls extending from sides of the bottom wall, the bottom wall and the side walls define a groove; disposing the panel assembly in the groove; disposing caulk in the gap between the top of the side wall and the edge of the panel assembly; blowing air to the caulk to cure the caulk to securely connect the housing and the panel assembly; and Wipe the cured caulking glue in the gap, so that the appearance of the cured caulking glue is substantially the same as that of the casing. 2. The manufacturing method of the input-output assembly according to claim 1, wherein the panel assembly comprises a touch panel and a cover plate covering the touch panel, the lateral dimension of the cover plate is larger than the The lateral dimension of the touch panel is such that the edge forms a stepped surface between the cover plate and the touch panel, the edge includes the edge of the cover plate and the edge of the touch panel, and the edge of the side wall The step of providing caulking glue in said gap between the top and said edge comprises the following steps: disposing the caulking glue in the gap between the top of the side wall and the edge of the cover plate; The step of curing the caulking glue to fixedly connect the housing and the panel assembly includes: curing the caulking glue to fixedly connect the casing and the edge of the cover plate. 3. The manufacturing method of the input-output assembly according to claim 1, wherein the gap is formed with an upward facing opening, and the gap between the top of the side wall and the edge is set The steps for caulking glue include the following steps: Put the caulk into the gap through the opening. 4. The manufacturing method of the input-output assembly according to claim 1, wherein the step of curing the caulking glue comprises the following steps: The caulking glue is cured in an environment of 20-25°C. 5. The manufacturing method of the input-output assembly according to claim 1, characterized in that, the manufacturing method of the input-output assembly further comprises the steps before the step of arranging the panel assembly in the groove: Anti-spill glue is provided on the inner side of the side wall along the circumferential direction of the side wall; curing the anti-spill glue to form at least one anti-spill strip; The step of arranging the panel assembly in the groove comprises: The panel assembly is positioned in the groove with the spill strip sealing a gap between the side wall and the edge. 6. The manufacturing method of the input-output assembly according to claim 1, wherein the groove is roughly rectangular, and the sidewalls include long sidewalls and short sidewalls connecting the long sidewalls, the The step of arranging the anti-spill glue on the inner side of the side wall along the circumferential direction of the side wall comprises the following steps: The anti-spill glue is provided on the inner side of the long side wall along the length direction of the long side wall. 7. The manufacturing method of the input and output assembly according to claim 6, wherein the step of arranging the anti-overflow glue on the inner side of the long side wall along the length direction of the long side wall comprises the following steps step: The anti-overflow glue is continuously provided on the inner side of the long side wall along the length direction of the long side wall. 8. The manufacturing method of the input and output assembly according to claim 5, wherein the step of curing the anti-overflow glue to form at least one anti-overflow strip comprises the following steps: The anti-spill glue is cured in an environment of 20-25° C. for more than five minutes. 9. The manufacturing method of the input-output assembly according to claim 5, wherein the curing time of the anti-overflow glue is shorter than the complete curing time of the anti-overflow glue. 10. The manufacturing method of the input-output assembly according to claim 5, wherein the panel assembly comprises a touch panel and a cover plate covering the touch panel, the lateral dimension of the cover plate is larger than the The lateral size of the touch panel is such that the edge forms a stepped surface between the cover plate and the touch panel, the edge includes the edge of the cover plate and the edge of the touch panel, and the panel assembly is arranged The step of sealing the gap between the side wall and the edge in the groove and with the spill strip includes: The panel assembly is arranged in the groove and the anti-spill strip seals the gap between the side wall and the edge of the touch panel. 11. The manufacturing method of the input-output assembly as claimed in claim 5, wherein the groove is approximately rectangular, the side wall includes an inner surface, and the inner surface includes a long side and a connection connecting the long side. Short side, the short side is formed with a step, the step includes a step surface, a step below the step connecting the step surface and the long side, and a step above the step connecting the step surface, the circumference along the inner surface The step of providing anti-spill glue on the inner side comprises the following steps: The anti-overflow glue is continuously arranged along the length direction below the step. 12. The manufacturing method of the input-output assembly according to claim 11, wherein the step of arranging the panel assembly in the groove comprises the following steps: Adhesive glue is arranged on the step surface; supporting the panel assembly on the stepped surface; and The bonding glue is cured to bond the step surface and the panel assembly. 13. The manufacturing method of the input-output assembly as claimed in claim 1, characterized in that, the manufacturing method of the input-output assembly further comprises the following steps after the step of curing the caulking glue: The caulking glue located on the upper surface of the panel assembly and the outer side of the casing is removed. 14. The manufacturing method of the input-output assembly according to claim 13, wherein the step of removing the caulking glue located on the upper surface of the panel assembly and the outside of the housing comprises the following steps: Use a dust-free cloth to wipe off the caulking glue located on the upper surface of the panel assembly and the outer side of the housing.