CN108493626A - A four-element dual-polarized microstrip antenna array based on SIC technology - Google Patents
A four-element dual-polarized microstrip antenna array based on SIC technology Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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Abstract
本发明涉及一种基于SIC技术的四单元双极化微带天线阵,包括六层印刷电路板和金属支柱(6),顶层印刷电路板(17)下表面印制矩形寄生贴片(1),第三层印刷电路板(16)上表面印制矩形主贴片(2)和主贴片层反射板(11),第四层印刷电路板(15)上表面印制垂直极化馈线(3)和圆环(8),第五层印刷电路板(14)上表面印制接地板(4),接地板(4)上蚀刻十字型缝隙(9)、圆形开孔(19)和圆形开孔(20),第五层印刷电路板(14)下表面印制水平极化馈线(5)及带状线(10),底层印刷电路板(12)下表面设置有天线底层反射板(13)。本发明具有更宽带宽、更高端口隔离度、更低交叉极化电平。
The invention relates to a four-element dual-polarized microstrip antenna array based on SIC technology, which comprises a six-layer printed circuit board and metal pillars (6), and a rectangular parasitic patch (1) is printed on the lower surface of the top printed circuit board (17) , the upper surface of the third layer printed circuit board (16) is printed with a rectangular main patch (2) and the main patch layer reflector (11), and the upper surface of the fourth layer printed circuit board (15) is printed with a vertically polarized feeder ( 3) and the ring (8), the upper surface of the fifth layer printed circuit board (14) is printed with a grounding plate (4), and the grounding plate (4) is etched with a cross-shaped slit (9), a circular opening (19) and Circular opening (20), horizontally polarized feeder (5) and stripline (10) are printed on the lower surface of the fifth-layer printed circuit board (14), and the bottom surface of the bottom printed circuit board (12) is provided with an antenna bottom reflector board (13). The invention has wider bandwidth, higher port isolation and lower cross polarization level.
Description
技术领域technical field
本发明涉及一种微带天线阵,特别是一种基于SIC技术的四单元双极化微带天线阵,属于天线技术领域。The invention relates to a microstrip antenna array, in particular to a four-unit dual-polarization microstrip antenna array based on SIC technology, which belongs to the technical field of antennas.
背景技术Background technique
随着无线通信和雷达探测的广泛应用,现代天线需要满足大容量通信、收发一体化要求,这就要求天线能够实现宽带、双极化等特点。微带天线具有体积小、重量轻、易共形等优点,而且采用一些频带拓宽技术,如口径耦合馈电、U形槽贴片、高介电常数介质贴片可以满足不同应用的带宽需求,所以在微带天线的基础上设计双极化天线成为了天线设计的一大趋势。微带天线实现双极化的方法有:阵列组合双极化,通过两个极化正交的单极化组合,实现阵列的双极化功能,这种结构体积大、成本高,故而应用受到限制;单元双极化,通过对天线单元的特殊结构设计,在同一天线单元上同时实现两个方向的极化功能,这种结构体积小、重量轻、成本低,因而受到了天线学者的广泛关注。但单元双极化同时也会产生端口间相互干扰,既隔离度和交叉极化问题。With the wide application of wireless communication and radar detection, modern antennas need to meet the requirements of large-capacity communication and integration of sending and receiving, which requires the antenna to be able to achieve broadband, dual polarization and other characteristics. Microstrip antennas have the advantages of small size, light weight, and easy conformality, and some frequency band widening technologies, such as aperture coupling feeding, U-shaped slot patches, and high dielectric constant dielectric patches, can meet the bandwidth requirements of different applications. Therefore, designing dual-polarized antennas on the basis of microstrip antennas has become a major trend in antenna design. The methods of microstrip antenna to achieve dual polarization are: array combination dual polarization, through the combination of two polarizations orthogonal to single polarization, the dual polarization function of the array is realized. This structure is bulky and costly, so its application is limited Restrictions: unit dual polarization, through the special structural design of the antenna unit, the polarization function in two directions can be realized on the same antenna unit at the same time. This structure is small in size, light in weight and low in cost, so it is widely used by antenna scholars focus on. However, the dual polarization of the unit will also cause mutual interference between ports, which is the problem of isolation and cross polarization.
发明内容Contents of the invention
针对上述现有技术,本发明所要解决的技术问题是提供一种具有更宽的带宽、更高的端口隔离度、更低的交叉极化电平的基于SIC技术的四单元双极化微带天线阵。In view of the above prior art, the technical problem to be solved by the present invention is to provide a four-unit dual-polarization microstrip based on SIC technology with wider bandwidth, higher port isolation, and lower cross-polarization level antenna array.
为解决上述技术问题,本发明一种基于SIC技术的四单元双极化微带天线阵,包括:六层上下布置的印刷电路板和六十四个金属支柱6,顶层印刷电路板17的下表面印制有四个相同的矩形寄生贴片1,第三层印刷电路板16上表面印制有四个相同的矩形主贴片2和主贴片层反射板11,第四层印刷电路板15上表面印制有垂直极化馈线3和圆环8,第五层印刷电路板14上表面印制接地板4,接地板4上蚀刻有四个十字型缝隙9、六十四个金属支柱圆形开孔19和一个垂直过渡结构圆形开孔20,第五层印刷电路板14下表面印制有水平极化馈线5以及带状线10,带状线10通过金属过孔7与垂直极化馈线3的圆环8相连,底层印刷电路板12下表面设置有天线底层反射板13,每十六个金属支柱6等间距地排列在矩形主贴片2四周,六十四个金属支柱6穿过对应的金属支柱圆形开孔19,且金属支柱的两端分别连接主贴片层反射板11和天线底层反射板13且共同构成基片集成背腔结构。In order to solve the above-mentioned technical problems, a four-element dual-polarization microstrip antenna array based on SIC technology of the present invention includes: six layers of printed circuit boards arranged up and down and sixty-four metal pillars 6, the bottom layer of the top printed circuit board 17 Four identical rectangular parasitic patches 1 are printed on the surface, four identical rectangular main patches 2 and main patch layer reflectors 11 are printed on the upper surface of the third layer printed circuit board 16, and the fourth layer printed circuit board The upper surface of 15 is printed with vertically polarized feeder 3 and ring 8, the upper surface of the fifth-layer printed circuit board 14 is printed with grounding plate 4, and four cross-shaped gaps 9 and sixty-four metal pillars are etched on the grounding plate 4 A circular opening 19 and a circular opening 20 of a vertical transition structure, the lower surface of the fifth layer printed circuit board 14 is printed with a horizontally polarized feeder 5 and a stripline 10, the stripline 10 passes through the metal via 7 and the vertical The circular ring 8 of the polarized feeder 3 is connected, and the bottom surface of the bottom printed circuit board 12 is provided with an antenna bottom reflection plate 13, and every sixteen metal pillars 6 are arranged at equal intervals around the rectangular main patch 2, and sixty-four metal pillars 6 passes through the corresponding circular opening 19 of the metal pillar, and the two ends of the metal pillar are respectively connected to the reflector 11 of the main patch layer and the reflector 13 of the antenna bottom layer to form a substrate integrated cavity back structure.
本发明一种基于SIC技术的四单元双极化微带天线阵,还包括:A kind of four-unit dual-polarized microstrip antenna array based on SIC technology of the present invention also includes:
1.第二层印刷电路板18和底层印刷电路板12为泡沫层,顶层印刷电路板17、第三层印刷电路板16、第四层印刷电路板15和第五层印刷电路板14为介质基板。1. The second layer of printed circuit board 18 and the bottom layer of printed circuit board 12 are foam layers, the top layer of printed circuit board 17, the third layer of printed circuit board 16, the fourth layer of printed circuit board 15 and the fifth layer of printed circuit board 14 are medium substrate.
2.矩形主贴片2和矩形寄生贴片1均为正方形,4个矩形主贴片2呈正方形排列且同一边的两个矩形主贴片之间间隔为0.87倍介质基板介质波长。2. Both the rectangular main patch 2 and the rectangular parasitic patch 1 are square, and the four rectangular main patches 2 are arranged in a square, and the interval between two rectangular main patches on the same side is 0.87 times the wavelength of the medium of the dielectric substrate.
3.每个矩形寄生贴片1均位于对应的矩形主贴片2的正上方且边长均大于矩形主贴片2的边长。3. Each rectangular parasitic patch 1 is located directly above the corresponding rectangular main patch 2 and its side length is greater than that of the rectangular main patch 2 .
4.矩形寄生贴片1、矩形主贴片2、十字形缝隙9的中心在垂直方向对齐。4. The centers of the rectangular parasitic patch 1, the rectangular main patch 2, and the cross-shaped slit 9 are aligned vertically.
5.基于SIC技术的双极化微带天线阵采用等幅反相倒置馈电技术。5. The dual-polarized microstrip antenna array based on SIC technology adopts equal-amplitude anti-phase inversion feeding technology.
6.金属支柱6的半径为0.5mm,金属支柱之间间距2.6mm。6. The radius of the metal pillars 6 is 0.5mm, and the distance between the metal pillars is 2.6mm.
本发明有益效果:相比于一般的双极化微带天线,该天线具有更宽的带宽、更高的端口隔离度、更低的交叉极化电平,能更好的应用于雷达探测、卫星通信等领域。该天线具有剖面低、体积小、成本低等优点。基片集成背腔(Substrate Integrate Cavity,SIC)技术作为基片集成波导(Substrate Integrate Waveguide,SIW)技术的一种衍生技术,除具备导波结构的低插损、低损耗、高效率的特性外,该结构还可以方便的集成在印刷电路中,主要作用在于减小背向辐射,同时增加天线的带宽。该天线以微带天线为基础进行设计,天线集馈电、辐射为一体,结构简单,利用印刷电路工艺进行生产,具有剖面低、重量轻、精度高、成本低等优点;该天线采用SIC技术、寄生贴片技术、缝隙耦合技术增加天线容性、降低天线Q值从而提高了天线工作带宽;该天线采用SIC技术使用六十四根金属支柱构成基片集成背腔结构,减小天线背向辐射,同时减小了馈线间相互耦合又降低了馈线辐射对阵列的影响,提高端口间隔离度降低交叉极化;该天线采用反相倒置馈电技术,使阵子间交叉极化分量相互抵消,降低了天线阵列交叉极化电平。Beneficial effects of the present invention: Compared with the general dual-polarized microstrip antenna, the antenna has wider bandwidth, higher port isolation, and lower cross-polarization level, and can be better applied to radar detection, field of satellite communications. The antenna has the advantages of low profile, small size, and low cost. As a derivative technology of Substrate Integrate Waveguide (SIW) technology, Substrate Integrate Cavity (SIC) technology has the characteristics of low insertion loss, low loss and high efficiency of waveguide structure. , the structure can also be easily integrated in the printed circuit, the main role is to reduce the back radiation, while increasing the bandwidth of the antenna. The antenna is designed on the basis of microstrip antenna. The antenna integrates feed and radiation. It has a simple structure and is produced by printed circuit technology. It has the advantages of low profile, light weight, high precision, and low cost. The antenna adopts SIC technology , parasitic patch technology, slot coupling technology to increase the antenna capacitive, reduce the antenna Q value to improve the antenna operating bandwidth; the antenna adopts SIC technology and uses sixty-four metal pillars to form a substrate integrated back cavity structure, reducing the antenna back At the same time, it reduces the mutual coupling between feeders and the influence of feeder radiation on the array, improves the isolation between ports and reduces cross-polarization; the antenna adopts reverse-phase inversion feeding technology, so that the cross-polarization components between elements cancel each other, Reduced antenna array cross-polarization levels.
附图说明Description of drawings
图1是本发明基于SIC技术的四单元双极化微带天线阵阵列俯视图;Fig. 1 is the top view of the four-element dual-polarization microstrip antenna array array based on SIC technology of the present invention;
图2是本发明基于SIC技术的四单元双极化微带天线阵阵列侧视图;Fig. 2 is a side view of the four-unit dual-polarized microstrip antenna array array based on the SIC technology of the present invention;
图3为本发明基于SIC技术的四单元双极化微带天线阵寄生贴片俯视图;Fig. 3 is the top view of the parasitic patch of the four-element dual-polarized microstrip antenna array based on the SIC technology of the present invention;
图4为本发明基于SIC技术的四单元双极化微带天线阵矩形主贴片2及主贴片层反射板11俯视图;Fig. 4 is the four-unit dual-polarized microstrip antenna array rectangular main patch 2 and the top view of the main patch layer reflector 11 of the present invention based on SIC technology;
图5为本发明基于SIC技术的四单元双极化微带天线阵垂直极化馈线3结构俯视图;5 is a top view of the structure of the four-element dual-polarized microstrip antenna array vertically polarized feeder 3 based on the SIC technology of the present invention;
图6为本发明基于SIC技术的四单元双极化微带天线阵孔径耦合十字缝隙9结构俯视图;6 is a top view of the structure of the four-unit dual-polarized microstrip antenna array aperture coupling cross slot 9 based on the SIC technology of the present invention;
图7为本发明基于SIC技术的四单元双极化微带天线阵水平极化馈线5结构俯视图;FIG. 7 is a top view of the structure of the four-element dual-polarized microstrip antenna array horizontally polarized feeder 5 based on the SIC technology of the present invention;
图8为本发明基于SIC技术的四单元双极化微带天线阵基片集成背腔六十四个金属支柱结构图;Fig. 8 is a structural diagram of sixty-four metal pillars of the four-unit dual-polarized microstrip antenna array substrate integrated back chamber based on the SIC technology of the present invention;
图9为本发明基于SIC技术的四单元双极化微带天线阵驻波比和四路馈电网络相位差与频率的关系图;Fig. 9 is the relationship figure between the VSWR of the four-unit dual-polarized microstrip antenna array based on the SIC technology and the phase difference and frequency of the four-way feed network of the present invention;
图10为本发明基于SIC技术的四单元双极化微带天线阵水平极化和垂直极化阻抗带宽与频率的关系图;Fig. 10 is the relationship diagram of the horizontal polarization and vertical polarization impedance bandwidth and frequency of the four-element dual-polarized microstrip antenna array based on SIC technology in the present invention;
图11(a)为基于SIC技术的四单元双极化微带天线阵水平极化,E面、H面增益及端口隔离度同俯仰角的关系图;Figure 11(a) is a four-element dual-polarized microstrip antenna array based on SIC technology with horizontal polarization, E-plane, H-plane gain and port isolation relationship with pitch angle;
图11(b)为基于SIC技术的四单元双极化微带天线阵垂直极化,E面、H面增益及端口隔离度同俯仰角的关系图;Figure 11(b) is a diagram of the vertical polarization of the four-element dual-polarized microstrip antenna array based on the SIC technology, the relationship between the gain of the E plane and the H plane, and the port isolation and the pitch angle;
图11(c)为不使用SIC技术的四单元双极化微带天线阵水平极化,E面、H面增益及端口隔离度同俯仰角的关系图;Figure 11(c) is a four-element dual-polarized microstrip antenna array horizontally polarized without using SIC technology, and the relationship between E-plane and H-plane gain and port isolation and pitch angle;
图11(d)为不使用SIC技术的四单元双极化微带天线阵垂直极化,E面、H面增益及端口隔离度同俯仰角的关系图;Figure 11(d) is a graph of the relationship between the vertical polarization of the four-element dual-polarized microstrip antenna array without using SIC technology, the gain of the E plane, the H plane, and the port isolation and the pitch angle;
图12为本发明基于SIC技术的四单元双极化微带天线阵有无SIC结构水平极化和垂直极化隔离度与频率的关系图。Fig. 12 is a graph showing the relationship between the horizontal polarization and vertical polarization isolation and frequency of the four-element dual-polarized microstrip antenna array based on the SIC technology of the present invention with or without the SIC structure.
具体实施方式Detailed ways
下面结合附图和实施例对本发明作进一步详细说明。The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.
本实施例提供一种基于SIC技术的四单元双极化微带天线阵,中心频率为9.6GHz,其结构如图1至图2所示,主要包括:This embodiment provides a four-unit dual-polarized microstrip antenna array based on SIC technology, with a center frequency of 9.6 GHz. Its structure is shown in Figures 1 to 2, mainly including:
如图3所示,介质基板17,该基板采用介电常数为2.2的Rogers 5880,厚度为1.016mm,介质17底层印制有四个间距为0.87倍Rogers 5880波长,即18.5mm的正方形寄生贴片1。As shown in Figure 3, the dielectric substrate 17 is Rogers 5880 with a dielectric constant of 2.2 and a thickness of 1.016 mm. The bottom layer of the dielectric 17 is printed with four square parasitic stickers with a spacing of 0.87 times the wavelength of Rogers 5880, that is, 18.5 mm. slice 1.
介质基板18,该基板采用介电常数为1.07的Rohacell HF51泡沫,厚度为3mm。The dielectric substrate 18 is made of Rohacell HF51 foam with a dielectric constant of 1.07 and a thickness of 3 mm.
如图4所示,介质基板16,该基板采用介电常数为2.2的Rogers 5880,厚度为1.016mm,介质16顶层印制有主贴片层反射板11和4个间距为0.87倍Rogers 5880介质波长,即18.5mm的正方形主贴片2。As shown in Figure 4, the dielectric substrate 16 is Rogers 5880 with a dielectric constant of 2.2 and a thickness of 1.016 mm. The top layer of the dielectric 16 is printed with a main patch layer reflector 11 and four Rogers 5880 dielectrics with a spacing of 0.87 times. The wavelength, that is, the square main patch 2 of 18.5mm.
如图5所示,介质基板15,该基板采用介电常数为2.2的Rogers 5880,厚度为0.508mm,介质15顶层印制有垂直极化馈线3。As shown in FIG. 5 , the dielectric substrate 15 is Rogers 5880 with a dielectric constant of 2.2 and a thickness of 0.508 mm. The vertically polarized feeder 3 is printed on the top layer of the dielectric 15 .
如图6、图7和图8所示,介质基板14,该基板采用介电常数为2.2的Rogers 5880,厚度为0.508mm,介质14顶层印制有带有十字形缝隙9的接地板4,底层印制水平极化馈线5,半径为0.5mm的六十四个金属支柱6穿过接地板4的六十四个金属支柱圆形开孔19,与主贴片层反射板11、天线底层反射板13构成天线内部的基片集成背腔;半径为0.2mm的金属过孔7穿过介质基板14及介质基板15,两端分别与带状线10、垂直极化馈线的圆环8相连构成垂直过渡结构。As shown in Figure 6, Figure 7 and Figure 8, the dielectric substrate 14 is Rogers 5880 with a dielectric constant of 2.2 and a thickness of 0.508mm. The top layer of the dielectric 14 is printed with a grounding plate 4 with a cross-shaped gap 9, The bottom layer is printed with a horizontally polarized feeder 5, and sixty-four metal pillars 6 with a radius of 0.5mm pass through the sixty-four metal pillar circular openings 19 of the grounding plate 4, and are connected to the reflector 11 of the main patch layer and the bottom layer of the antenna. The reflector 13 forms the substrate integrated back cavity inside the antenna; the metal via hole 7 with a radius of 0.2mm passes through the dielectric substrate 14 and the dielectric substrate 15, and the two ends are respectively connected to the strip line 10 and the ring 8 of the vertically polarized feeder Form a vertical transition structure.
介质基板12,该基板采用介电常数为1.07的Rohacell HF51泡沫,厚度为2.5mm,介质12底层印制有天线底层反射板13。The dielectric substrate 12 is made of Rohacell HF51 foam with a dielectric constant of 1.07 and a thickness of 2.5mm. The bottom layer of the dielectric 12 is printed with an antenna bottom reflection plate 13 .
如图9、图10、图11(a)、图11(b)、图11(c)、图11(d)和图12所示,本发明实施方式提供的微带阵列天线可在长30mm宽30mm厚8.548mm的尺寸内,实现垂直极化端口阻抗带宽28.51%(8.27-11.02GHz)以及水平极化端口阻抗带宽31.76%(8.05-11.09GHz),带宽范围内隔离度优于42dB,水平交叉极化和垂直交叉极化分别低于-48dB和-35dB的性能。As shown in Figure 9, Figure 10, Figure 11(a), Figure 11(b), Figure 11(c), Figure 11(d) and Figure 12, the microstrip array antenna provided by the embodiment of the present invention can be 30mm in length Within the size of 30mm wide and 8.548mm thick, the impedance bandwidth of the vertically polarized port is 28.51% (8.27-11.02GHz) and the impedance bandwidth of the horizontally polarized port is 31.76% (8.05-11.09GHz). The isolation within the bandwidth range is better than 42dB. Cross-polarization and vertical cross-polarization are below -48dB and -35dB performance, respectively.
本发明实施方式还包括:Embodiments of the present invention also include:
如图1至图8所示,一种基于SIC技术的4单元双极化微带天线阵,该天线阵采用微带天线技术获得低剖面、低成本特性,采用寄生贴片技术增加天线带宽,采用缝隙耦合技术增加天线带宽并实现双极化,使用反相倒置馈电技术降低交叉极化电平,该天线包括六层印刷电路板和六十四个集成金属支柱。As shown in Figures 1 to 8, a 4-element dual-polarized microstrip antenna array based on SIC technology, the antenna array uses microstrip antenna technology to obtain low-profile, low-cost characteristics, and uses parasitic patch technology to increase antenna bandwidth. Slot-coupling technology is used to increase antenna bandwidth and achieve dual polarization, and reverse-phase inversion feeding technology is used to reduce cross-polarization level. The antenna includes six-layer printed circuit boards and sixty-four integrated metal pillars.
六层印刷电路板其特征在于介质12、18为Rohacell HF51泡沫,介质14、15、16、17为Rogers 5880介质板,介质17底层印制有矩形寄生贴片1、介质16顶层印制有矩形主贴片2和主贴片层反射板11,介质15顶层印制有垂直极化馈线3,介质14顶层印制有接地板4,接地板4上蚀刻有四个十字型缝隙9以及六十四个金属支柱圆形开孔19、一个垂直过渡结构圆形开孔20,介质14底层印制有水平极化馈线5及带状线10,带状线10通过金属过孔7与垂直极化馈线3相连,天线底层反射板13放置在介质板12底层,所述六十四个金属支柱其特征在于十六个金属支柱以2.6mm间距均匀地排列在由矩形主贴片2四周,同主贴片层反射板11、天线底层反射板13构成基片集成背腔结构。The six-layer printed circuit board is characterized in that media 12 and 18 are Rohacell HF51 foam, media 14, 15, 16, and 17 are Rogers 5880 dielectric boards, and the bottom layer of media 17 is printed with rectangular parasitic patch 1, and the top layer of media 16 is printed with rectangular The main patch 2 and the main patch layer reflector 11, the vertically polarized feeder 3 is printed on the top layer of the medium 15, the grounding plate 4 is printed on the top layer of the medium 14, and the grounding plate 4 is etched with four cross-shaped slits 9 and sixty Four metal pillar circular openings 19, a vertical transition structure circular opening 20, the bottom layer of the dielectric 14 is printed with a horizontally polarized feeder 5 and a stripline 10, and the stripline 10 is connected to the vertically polarized through the metal via 7. The feeder 3 is connected, and the antenna bottom reflector 13 is placed on the bottom of the dielectric board 12. The sixty-four metal pillars are characterized in that the sixteen metal pillars are evenly arranged around the rectangular main patch 2 at a distance of 2.6 mm. The patch layer reflector 11 and the antenna bottom reflector 13 form a substrate-integrated cavity-back structure.
矩形寄生贴片1位于矩形主贴片2正上方,边长略大于矩形主贴片2,其范围在0.1mm至2mm之间。The rectangular parasitic patch 1 is located directly above the rectangular main patch 2, and the side length is slightly larger than the rectangular main patch 2, and the range is between 0.1mm and 2mm.
矩形寄生贴片1和矩形主贴片2被位于其正下方的十字形缝隙9所激励。The rectangular parasitic patch 1 and the rectangular main patch 2 are excited by the cross-shaped slit 9 directly below them.
介质板15上表面及介质板14下表面分别布有相互正交的垂直极化馈线3和水平极化馈线5。Vertically polarized feeders 3 and horizontally polarized feeders 5 that are perpendicular to each other are arranged on the upper surface of the dielectric board 15 and the lower surface of the dielectric board 14 respectively.
垂直极化馈线3和水平极化馈线5均由一个50Ω到100Ω的T形功分器,两个100Ω到25Ω的多节阻抗变换器,两个25Ω到50Ω的T形功分器以及四条L形馈线构成。Both vertically polarized feeder 3 and horizontally polarized feeder 5 consist of a 50Ω to 100Ω T-shaped power divider, two 100Ω to 25Ω multi-section impedance converters, two 25Ω to 50Ω T-shaped power dividers and four L Shaped feeder composition.
垂直极化馈线3和水平极化馈线5具有相似的U型结构。The vertically polarized feeder 3 and the horizontally polarized feeder 5 have a similar U-shaped structure.
六十四个金属支柱6其特征在于十六个金属支柱为一组,均匀排列在矩形主贴片2的四周,集成金属支柱两端连接主贴片层反射板11和天线底层反射板13,组成基片集成背腔结构。The sixty-four metal pillars 6 are characterized in that sixteen metal pillars form a group and are evenly arranged around the rectangular main patch 2, and the two ends of the integrated metal pillars are connected to the main patch layer reflector 11 and the antenna bottom reflector 13, Composing the substrate integrated back cavity structure.
天线内部半径为0.2mm的金属过孔7,穿过介质板14及介质板15,两端分别与带状线10、垂直极化馈线3的圆环8相连构成垂直过渡结构,减小背向辐射。The metal via hole 7 with an internal radius of 0.2mm passes through the dielectric board 14 and the dielectric board 15, and the two ends are respectively connected with the strip line 10 and the ring 8 of the vertically polarized feeder 3 to form a vertical transition structure, reducing the back radiation.
十字形耦合缝隙9蚀刻在接地板4上,且由于馈线距辐射贴片的距离不同十字形缝隙9臂长略有差异。The cross-shaped coupling slot 9 is etched on the ground plate 4, and the arm length of the cross-shaped slot 9 is slightly different due to the different distances between the feeder and the radiation patch.
所述的垂直极化馈线3和水平极化馈线5距辐射贴片的距离不同导致两馈线尺寸略有不同The different distances between the vertically polarized feeder 3 and the horizontally polarized feeder 5 from the radiation patch lead to slightly different sizes of the two feeders
本发明实施方式还包括:Embodiments of the present invention also include:
如图1至图8所示,一种基于SIC技术的宽带高隔离度低交叉极化双极化微带天线阵,包括六层印刷电路板和六十四个金属支柱,六层印刷电路板其特征在于介质12、18为RohacellHF51泡沫,介质14、15、16、17为Rogers 5880介质板,介质17底层是印制有矩形寄生贴片1、介质16顶层印制有矩形主贴片2和主贴片层反射板11,介质15顶层印制有垂直极化馈线3,介质14顶层印制接地板4,在接地板4上蚀刻有四个十字型缝隙9以及六十四个金属支柱圆形开孔19、一个垂直过渡结构圆形开孔20,介质14底层印制有水平极化馈线5以及带状线10,带状线10通过金属过孔7与垂直极化馈线3相连,天线底层反射板13放置在介质板12底层,所述六十四个金属支柱其特征在于十六个金属支柱以2.6mm间距均匀地排列在由矩形主贴片2四周,同主贴片层反射板11、天线底层反射板13构成基片集成背腔结构。As shown in Figures 1 to 8, a wide-band high-isolation low cross-polarization dual-polarization microstrip antenna array based on SIC technology, including six-layer printed circuit boards and sixty-four metal pillars, six-layer printed circuit boards It is characterized in that media 12 and 18 are RohacellHF51 foam, media 14, 15, 16 and 17 are Rogers 5880 media boards, the bottom layer of media 17 is printed with rectangular parasitic patches 1, and the top layer of media 16 is printed with rectangular main patches 2 and The main patch layer reflector 11, the vertically polarized feeder 3 is printed on the top layer of the medium 15, the ground plate 4 is printed on the top layer of the medium 14, and four cross-shaped slits 9 and sixty-four metal pillar circles are etched on the ground plate 4 shaped opening 19, a circular opening 20 with a vertical transition structure, the bottom layer of the medium 14 is printed with a horizontally polarized feeder 5 and a stripline 10, the stripline 10 is connected to the vertically polarized feeder 3 through a metal via 7, and the antenna The bottom reflection plate 13 is placed on the bottom layer of the dielectric plate 12. The sixty-four metal pillars are characterized in that the sixteen metal pillars are evenly arranged around the rectangular main patch 2 at a distance of 2.6mm, which is the same as that of the main patch layer reflector. 11. The reflector 13 at the bottom of the antenna constitutes a substrate-integrated back cavity structure.
矩形主贴片2之间间隔为0.87倍介质波长,即18.5mm。The distance between the rectangular main patches 2 is 0.87 times the wavelength of the medium, that is, 18.5 mm.
微带天线阵列采用等幅反相倒置馈电技术,既馈电点成镜像对称、馈线输出相位差为一百八十度的等幅信号。The microstrip antenna array adopts equal-amplitude anti-phase inversion feeding technology, that is, the feeding point is mirror-symmetrical, and the feeder output phase difference is 180 degrees of equal-amplitude signal.
矩形主贴片2周围被基片集成背腔围绕。The rectangular main patch 2 is surrounded by a substrate-integrated back cavity.
矩形寄生贴片1、矩形主贴片2、十字形缝隙9的中心在垂直方向对齐。The centers of the rectangular parasitic patch 1 , the rectangular main patch 2 , and the cross-shaped slit 9 are vertically aligned.
垂直极化馈线3与水平极化馈线5分别印制在接地板4的两侧。The vertically polarized feeder 3 and the horizontally polarized feeder 5 are printed on both sides of the ground plate 4 respectively.
包围天线辐射单元的基片集成背腔的金属支柱6的半径为0.5mm,间距2.6mm。The metal pillars 6 of the substrate-integrated back cavity surrounding the antenna radiation unit have a radius of 0.5 mm and a spacing of 2.6 mm.
本发明公开了一种基于SIC技术的四单元双极化微带天线阵,该天线阵使用微带天线技术、SIC技术、寄生贴片技术、缝隙耦合技术、反向倒置馈电技术等技术,实现了微带天线的宽带宽、高隔离度、低交叉极化、低馈电辐射等优异性能。该天线以十字型缝隙耦合微带天线为基础,采用多层结构增加天线的容性降低天线Q值从而拓展带宽。在各阵列单元四周均匀嵌入十六根金属支柱,形成基片集成背腔减小背向辐射。阵列内部的反射板将两层馈电网络隔离开并且抑制馈电微带线的电磁辐射从而提高天线隔离度并降低交叉极化。该天线实现了双极化天线阵的平面化和小型化,且能够实现天线与电路的一体化集成。该发明属于微带贴片天线,可用于卫星通信、雷达定位,合成孔径雷达等诸多方面来使用。The invention discloses a four-unit dual-polarized microstrip antenna array based on SIC technology. The antenna array uses technologies such as microstrip antenna technology, SIC technology, parasitic patch technology, slot coupling technology, and reverse inversion feeding technology. The wide bandwidth, high isolation, low cross polarization, and low feed radiation of the microstrip antenna are realized. The antenna is based on a cross-shaped slot-coupled microstrip antenna, and adopts a multi-layer structure to increase the capacitance of the antenna and reduce the Q value of the antenna to expand the bandwidth. Sixteen metal pillars are evenly embedded around each array unit to form a substrate integrated back cavity to reduce back radiation. The reflector inside the array isolates the two-layer feed network and suppresses the electromagnetic radiation of the feed microstrip line to improve antenna isolation and reduce cross-polarization. The antenna realizes the planarization and miniaturization of the dual-polarization antenna array, and can realize the integrated integration of the antenna and the circuit. The invention belongs to the microstrip patch antenna, which can be used in satellite communication, radar positioning, synthetic aperture radar and many other aspects.
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CN114006172B (en) * | 2021-10-19 | 2022-11-22 | 南京航空航天大学 | Dual-polarized single pulse antenna based on substrate integrated waveguide and strip line feed |
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