CN108444324B - Soaking plate - Google Patents
Soaking plate Download PDFInfo
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- CN108444324B CN108444324B CN201810651031.1A CN201810651031A CN108444324B CN 108444324 B CN108444324 B CN 108444324B CN 201810651031 A CN201810651031 A CN 201810651031A CN 108444324 B CN108444324 B CN 108444324B
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- channel
- evaporation
- channels
- evaporation plate
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- 238000002791 soaking Methods 0.000 title claims abstract description 14
- 238000001704 evaporation Methods 0.000 claims abstract description 78
- 230000008020 evaporation Effects 0.000 claims abstract description 55
- 238000009833 condensation Methods 0.000 claims abstract description 34
- 230000005494 condensation Effects 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims description 35
- 239000002131 composite material Substances 0.000 claims description 22
- 230000008021 deposition Effects 0.000 claims description 11
- 230000002209 hydrophobic effect Effects 0.000 claims description 9
- 239000002086 nanomaterial Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 30
- 239000011664 nicotinic acid Substances 0.000 abstract description 5
- 210000003462 vein Anatomy 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 239000005871 repellent Substances 0.000 abstract 2
- 238000010992 reflux Methods 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000012546 transfer Methods 0.000 description 9
- 238000009835 boiling Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000003247 decreasing effect Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000000750 progressive effect Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- PXFBZOLANLWPMH-UHFFFAOYSA-N 16-Epiaffinine Natural products C1C(C2=CC=CC=C2N2)=C2C(=O)CC2C(=CC)CN(C)C1C2CO PXFBZOLANLWPMH-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a soaking plate which comprises an evaporation plate, a condensation plate and a connecting plate, wherein the evaporation plate and the condensation plate are arranged in a positive-to-positive manner, the connecting plate is used for connecting the evaporation plate and the condensation plate to form a closed cavity, working media are filled in the closed cavity, channels for conveying the working media are arranged on the evaporation plate, the channels are distributed along the circumferential direction of the evaporation plate, and the channels diverge from the center of the evaporation plate to the edge. According to the soaking plate, the evaporating plate and the condensing plate are provided with the bionic vein polygonal micro-channel structures, and the walls of the channel of the evaporating plate and the peripheries of the supporting columns are covered with the lyophilic liquid-absorbing cores, so that the walls have lyophilic properties, the capillary properties of the channel liquid-absorbing cores are improved, and the liquid-absorbing speed of the channel liquid-absorbing cores is increased; the liquid-repellent material is covered on the wall surface of the channel of the condensing plate and around the supporting column, so that gradual liquid-repellent from the edge of the condensing plate to the center is realized, the downward circulation speed of working medium in the main channel is accelerated, the working medium return path is shortened, the working medium return speed is accelerated, and the heat dissipation benefit is improved.
Description
Technical Field
The invention relates to the technical field of microelectronic device heat dissipation, in particular to a soaking plate.
Background
With the rapid development of electronic packaging technology, the integration level and performance of electronic chips are continuously improved, so that the power of the chips is continuously increased. The average heat flux density of the current chip surface is already over 100W/cm 2, and the trend is to continue to increase. Meanwhile, the chip after the chip packaging is finished has the problem of hot spot with high local heat, so that the local temperature of the chip is increased rapidly, and the stability of the chip is affected.
In the solution to the chip failure caused by the temperature rise, the conventional cooling modes such as air cooling, liquid cooling, heat pipes and the like are included, and novel heat dissipation modes such as semiconductor cooling, micro-jet flow technology, liquid metal heat dissipation, carbon fiber material heat dissipation and the like are also included. The traditional heat dissipation scheme is limited by various factors such as structure, space, cost, maintainability, noise and the like, and cannot meet the heat dissipation requirement of the future high heat flux electronic element, and the novel heat dissipation technology cannot be applied on a large scale due to the immature technology and the like.
The heat pipe is designed based on the working principle of heat pipe, and has the main structure of casing, liquid sucking core, working medium, etc. and the working principle is that when heat passes through the evaporation area of the heat pipe from heat source, the working medium liquid boils to gasify in the cavity with low vacuum degree, and under the action of pressure difference, the gas flows to the condensation area to heat up while meeting the condensation junction and back to the evaporation area along the liquid sucking core under the action of capillary force, and the heat of the condensation area is taken away by other heat dissipating modes outside the heat pipe. Although the working principle is similar, compared with a one-dimensional linear heat transfer mode of the heat pipe, the heat transfer mode of the flat plate heat pipe is two-dimensional surface heat transfer, so that the flat plate heat pipe has better heat transfer performance and temperature uniformity. However, the existing flat heat pipe working medium reflux mainly depends on capillary force provided by a liquid suction core, the capillary limit and boiling limit of heat exchange are smaller, in addition, due to the existence of the liquid suction core, liquid working medium condensed near a condensation surface cannot flow back immediately and is filled on the liquid suction core near the condensation surface, so that heat transfer resistance is increased, in addition, a large amount of energy sources are consumed for sintering the liquid suction core structure, and sintering quality is difficult to control.
Therefore, how to provide an electronic chip heat dissipating device for accelerating the backflow speed of the heat dissipating liquid working medium and improving the heat exchange efficiency is a technical problem to be solved urgently by those skilled in the art.
Disclosure of Invention
The invention aims to provide a soaking plate which can improve the reflux speed of a heat dissipation liquid working medium and provide a more reliable heat dissipation path and higher heat dissipation efficiency for an integrated chip with high heat generation.
In order to solve the technical problems, the invention provides a soaking plate which comprises an evaporation plate, a condensation plate and a connecting plate, wherein the evaporation plate is arranged opposite to the condensation plate, the connecting plate is used for connecting the evaporation plate and the condensation plate to form a closed cavity, working media are filled in the closed cavity, channels for conveying the working media are arranged on the evaporation plate, the channels are distributed along the circumferential direction of the evaporation plate, and the channels diverge from the center to the edge of the evaporation plate.
Preferably, a cavity for accommodating the working medium is arranged in the center of the evaporation plate.
Preferably, a condensing part for condensing the working medium after phase change is arranged on the condensing plate, and the condensing part and the accommodating cavity are arranged opposite to each other.
Preferably, the channel comprises a transport channel and a capillary channel, the head end of the transport channel is communicated with the containing cavity, and the tail end of the transport channel is communicated with the capillary channel.
Preferably, the channels further comprise a connecting channel for connecting adjacent capillary channels.
Preferably, the condensation plate is further provided with a conveying channel and a secondary capillary channel, the head end of the conveying channel is communicated with the condensation part, and the tail end of the conveying channel is communicated with the secondary capillary channel.
Preferably, the composite liquid absorbing core is arranged on the inner wall of the conveying channel and has lyophilic performance.
Preferably, the thickness of the composite wick decreases from the center to the edge of the evaporation plate.
Preferably, the composite hydrophobic layer is arranged on the inner wall of the conveying channel and has lyophobic performance.
Preferably, the evaporation plate is further provided with a support column for guiding water to the center of the evaporation plate.
The vapor chamber is filled with working medium, channels for conveying the working medium are arranged on the vapor plate, the channels are distributed along the circumferential direction of the vapor plate, and the channels diverge from the center to the edge of the vapor plate. According to the soaking plate, the evaporating plate is provided with the bionic vein structure polygonal micro-channel structure, the copper particle deposition layer formed by electrochemical displacement with the lyophile performance of the nano structure is covered on the wall surface of the channel of the evaporating plate and the periphery of the supporting column to form the composite liquid suction core, the thickness of the deposition layer is decreased according to the increase of the channel level, and due to the porous micro-structure of the deposition layer on the wall surface of the channel of the evaporating plate, the wall surface has lyophile performance, the capillary performance of the liquid suction core of the channel is improved, the liquid suction speed of the liquid suction core of the channel is accelerated, the heat transfer performance of a heat pipe is further improved, the capillary pressure of the liquid suction core of the traditional light channel is improved, meanwhile, the excellent permeability of the linear structure of the channel part is reserved, and the circulation speed of working media is accelerated; the nickel plating layer with the lyophobic performance of the nano structure is covered around the wall surface of the channel of the condensing plate and the supporting column, the nickel plating layer is gradually decreased from the center of the condensing plate along with the increase of the level number, so that the gradual lyophobic effect from the edge of the condensing plate to the center is realized, the lyophobic surface is adopted to strengthen the beaded condensation of the vaporized working medium, the heat transfer resistance is reduced, and the circulation speed of the working medium in the main channel is accelerated. In general, the working medium evaporates to the condensate plate boss part, because the condensate plate support column is around to the progressive lyophobic of central condensation district for boss part vapour flow direction support column, because gravity and capillary attraction's effect for the working medium liquefaction passes through the support column flow direction evaporating plate, because the evaporating plate support column is around to the progressive lyophile of boiling district, can accelerate the working medium and pass through boss microchannel flow direction boiling district, thereby shorten boss working medium reflux path, accelerate working medium reflux speed, improve the radiating benefit.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
FIG. 1 is an exploded view of the overall structure of one embodiment provided by the present invention;
FIG. 2 is a schematic view of the evaporator plate structure shown in FIG. 1;
FIG. 3 is a schematic view of the condensate plate structure shown in FIG. 1;
Fig. 4 is a schematic distribution diagram of the composite wick shown in fig. 2;
FIG. 5 is a schematic diagram showing the distribution of the composite hydrophobic layer shown in FIG. 3.
Wherein, in fig. 1-5:
The evaporator comprises an evaporation plate-1, a condensation plate-2, a connection plate-3, a composite liquid suction core-4, a composite hydrophobic layer-5, a containing cavity-11, a transportation channel-12, a capillary channel-13, a connection channel-14, a support column-15, a condensation part-21, a transportation channel-22, a secondary capillary channel-23 and a communication channel-24.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1,2 and 3, fig. 1 is an exploded view of an overall structure of an embodiment of the present invention; FIG. 2 is a schematic view of the evaporator plate structure shown in FIG. 1; fig. 3 is a schematic view of the condensing plate structure shown in fig. 1.
In a specific embodiment provided by the invention, the soaking plate mainly comprises an evaporation plate 1, a condensation plate 2 and a connecting plate 3, wherein the evaporation plate 1 and the condensation plate 2 are arranged opposite to each other, the connecting plate 3 is used for connecting the evaporation plate 1 and the condensation plate 2 to form a closed cavity, working medium is filled in the closed cavity, channels for conveying the working medium are arranged on the evaporation plate 1, the channels are distributed along the circumferential direction of the evaporation plate 1, and the channels diverge from the center of the evaporation plate 1 to the edge.
In this embodiment, the evaporating plate 1, the condensing plate 2 and the connecting plate 3 are copper plates or aluminum plates with the thickness of 0.4 mm-1 mm, and may be made of other materials, so as to perform stable heat dissipation working medium circulation, which is not particularly limited herein; the evaporating plate 1 and the condensing plate 2 may be circular, or may be other shapes, and the specific shape is determined according to a user process, for example, square, for example, rectangular, which is not particularly limited herein; the evaporating plate 1 and the condensing plate 2 are connected by the connecting plate 3 to form a closed cavity, and heat dissipation working media such as purified water, methanol, ethanol, acetone and other heat dissipation working media can be filled in the closed cavity, so that the heat dissipation requirements of the electronic chip can be met without specific limitation; the evaporation plate 1 is provided with channels for conveying working media, and the channels are distributed along the circumferential direction of the evaporation plate 1 so that the center of the evaporation plate 1 diverges towards the edge of the evaporation plate 1.
Specifically, in the actual heat dissipation working medium reflux process, the heat dissipation working medium is evaporated to the boss part of the condensation plate 2 through the evaporation plate 1, because the periphery of the support column 15 of the condensation plate 2 gradually dredges liquid to the central condensation area, the vapor flow of the boss part is accelerated to the support column 15, and because of the action of gravity and capillary attraction of the composite liquid suction core, the working medium is liquefied and flows to the evaporation plate 1 through the support column 15, and because the periphery of the support column 15 of the evaporation plate 1 gradually affine liquid to the boiling area, the working medium can be accelerated to flow to the boiling area through the boss micro-channel, thereby shortening the boss working medium reflux path, accelerating the working medium reflux speed and improving the heat dissipation efficiency. The flat heat pipe strengthens the evaporation and condensation speed by carrying out super-philic and lyophobic surface modification on the bosses around the evaporation plate 1, the condensation plate 2 and the support column 15, improves the heat exchange performance of an evaporation area and a condensation area, and guides and accelerates the reflux speed of working media so as to improve the whole heat exchange capacity and optimize the heat dissipation effect.
In order to optimize the advantages of the vapor chamber in the above embodiment that the vapor chamber can accelerate the heat dissipation working medium reflux speed and improve the heat exchange efficiency, the condensing plate 2 is provided with a condensing part 21 for condensing the working medium after phase change, and the condensing part 21 is opposite to the cavity 11, the condensing part 21 is connected with the supporting column 15, and the supporting column 15 extends to the cavity 11. The condensing part 21 is arranged opposite to the accommodating cavity 11, so that the liquid condensed by the condensing part 21 can reach the position right above the accommodating cavity 11 in a smaller path, the heat dissipation working medium reflux time is shortened through the support column 15, and the heat dissipation efficiency is improved.
Further, the channel comprises a transportation channel 12 and a capillary channel 13, the head end of the transportation channel 12 is communicated with the containing cavity 11, and the tail end of the transportation channel 12 is communicated with the capillary channel 13. The surfaces of the transportation channel 12 and the capillary channel 13 are covered with a copper particle deposition layer formed by electrochemical displacement of the nano structure and having lyophile performance, and the thickness of the deposition layer is gradually decreased from inside to outside in the evaporation plate 1 according to the increase of the channel number, so that the evaporation plate 1 can enable liquid to flow to the support columns 15 at a faster speed, the reflux speed of a heat dissipation working medium is accelerated, and the heat dissipation efficiency is improved.
Further, the channels also comprise connecting channels 14 for connecting adjacent capillary channels 13. And the transportation channel 12, the capillary channel 13 and the connecting channel 14 form a polygonal micro-channel structure with a bionic vein structure, so that the heat dissipation working medium reflux speed is increased, and the heat dissipation efficiency is improved.
Further, the condensing plate 2 is further provided with a conveying channel 22 and a secondary capillary channel 23, the head end of the conveying channel 22 is communicated with the condensing part 21, the tail end of the conveying channel 22 is communicated with the secondary capillary channel 23, and the conveying channel 22, the secondary capillary channel 23 and the communicating channel 24 form a polygonal micro-channel structure with a bionic vein structure, so that the heat dissipation working medium reflux speed is accelerated, and the heat dissipation efficiency is improved.
Referring to fig. 4 and 5, fig. 4 is a schematic distribution diagram of the composite wick shown in fig. 2; FIG. 5 is a schematic diagram showing the distribution of the composite hydrophobic layer shown in FIG. 3.
The composite wick 4 is formed by a copper particle deposition layer formed by electrochemical displacement with lyophile performance and covered with a nano structure on the surface of the evaporating plate 1, and a composite hydrophobic layer 5 with lyophobic performance and with a nano structure is covered with the surface of the condensing plate 2, wherein the composite hydrophobic layer 5 is preferably a nickel plating layer.
Further, a composite wick 4 having lyophilic properties on the inner wall of the transport channel 12; the thickness of the composite liquid suction core 4 decreases from the center of the evaporation plate 1 to the edge; a composite hydrophobic layer 5 on the inner wall of the conveying channel 22 and having lyophobic properties. By the aid of the design of the lyophile composite liquid suction core 4 and the lyophobic composite hydrophobic layer 5, liquid evaporated by the evaporation plate 1 can flow back to the support columns 15 at a higher speed after being condensed by the condensation plate 2, and similarly, the support columns 15 are changed from lyophobic to lyophobic from top to bottom, so that the condensed liquid can flow back more quickly, the composite liquid suction core 4 on the evaporation plate 1 has lyophobic performance, and the cooling liquid above is sucked back by a higher suction force and is drained into the containing cavity 11, so that the heat dissipation efficiency is accelerated.
Further, the center of the evaporating plate 1 is provided with a cavity 11 for accommodating working medium. The liquid filling rate of the accommodating cavity 11 is limited and selected to be 35% -45%, and 40% is optimal, so that enough working medium is used for evaporation, enough space is also provided for evaporation, and the heat dissipation effect is ensured; the vacuum degree in the cavity is 12.33kPa, the evaporation speed is improved, the rapid evaporation and condensation of the working medium are ensured, and the heat exchange cycle is performed.
To sum up, the vapor chamber provided by this embodiment mainly includes evaporating plate, condensing plate and connecting plate, and evaporating plate and condensing plate just set up, and the connecting plate is used for being connected evaporating plate and condensing plate in order to form airtight cavity, and airtight cavity intussuseption is filled with the working medium, is provided with the channel that is used for carrying the working medium on the evaporating plate, and the channel distributes along evaporating plate circumference, and the channel is diverged to the edge by the center of evaporating plate. According to the soaking plate, the evaporating plate is provided with the bionic vein structure polygonal micro-channel structure, the copper particle deposition layer formed by electrochemical displacement with the lyophile performance of the nano structure is covered on the wall surface of the channel of the evaporating plate and the periphery of the supporting column to form the composite liquid suction core, the thickness of the deposition layer is decreased according to the increase of the channel level, and due to the porous micro-structure of the deposition layer on the wall surface of the channel of the evaporating plate, the wall surface has lyophile performance, the capillary performance of the liquid suction core of the channel is improved, the liquid suction speed of the liquid suction core of the channel is accelerated, the heat transfer performance of a heat pipe is further improved, the capillary pressure of the liquid suction core of the traditional light channel is improved, meanwhile, the excellent permeability of the linear structure of the channel part is reserved, and the circulation speed of working media is accelerated; the nickel plating layer with the lyophobic performance of the nano structure is covered around the wall surface of the channel of the condensing plate and the supporting column, the nickel plating layer is gradually decreased from the center of the condensing plate along with the increase of the level number, so that the gradual lyophobic effect from the edge of the condensing plate to the center is realized, the lyophobic surface is adopted to strengthen the beaded condensation of the vaporized working medium, the heat transfer resistance is reduced, and the circulation speed of the working medium in the main channel is accelerated. In general, the working medium evaporates to the condensate plate boss part, because the condensate plate support column is around to the progressive lyophobic of central condensation district for boss part vapour flow direction support column, because gravity and capillary attraction's effect for the working medium liquefaction passes through the support column flow direction evaporating plate, because the evaporating plate support column is around to the progressive lyophile of boiling district, can accelerate the working medium and pass through boss microchannel flow direction boiling district, thereby shorten boss working medium reflux path, accelerate working medium reflux speed, improve the radiating benefit.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (4)
1. The soaking plate is characterized by comprising an evaporation plate (1), a condensation plate (2) and a connecting plate (3), wherein the evaporation plate (1) is opposite to the condensation plate (2), the connecting plate (3) is used for connecting the evaporation plate (1) with the condensation plate (2) to form a closed cavity, working media are filled in the closed cavity, channels for conveying the working media are arranged on the evaporation plate (1), the channels are distributed along the circumferential direction of the evaporation plate (1), the channels diverge from the center of the evaporation plate (1) to the edge, a containing cavity (11) for containing the working media is arranged at the center of the evaporation plate (1), a condensing part (21) for condensing the working media after phase change is arranged on the condensation plate (2), and the condensing part (21) is opposite to the containing cavity (11);
The evaporation plate (1) is also provided with a support column (15) for guiding water to the center of the evaporation plate (1);
the channel comprises a transportation channel (12) and a capillary channel (13), the head end of the transportation channel (12) is communicated with the containing cavity (11), and the tail end of the transportation channel (12) is communicated with the capillary channel (13);
the surfaces of the transportation channel (12) and the capillary channel (13) are covered with a copper particle deposition layer formed by electrochemical displacement of the nano structure and having lyophile performance, and the thickness of the deposition layer is gradually reduced from inside to outside of the evaporation plate (1) according to the increase of the channel number, so that the evaporation plate (1) can enable liquid to flow towards the support columns (15) at a faster speed.
2. A soaking plate according to claim 1, characterized in that the channels further comprise connecting channels (14) for connecting adjacent capillary channels (13).
3. A soaking plate according to claim 1, characterized in that the condensing plate (2) is further provided with a conveying channel (22) and a secondary capillary channel (23), the head end of the conveying channel (22) is communicated with the condensing part (21), and the tail end of the conveying channel (22) is communicated with the secondary capillary channel (23).
4. A soaking plate according to claim 3, further comprising a composite hydrophobic layer (5) with lyophobic properties provided on the inner wall of the conveying channel (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810651031.1A CN108444324B (en) | 2018-06-22 | 2018-06-22 | Soaking plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810651031.1A CN108444324B (en) | 2018-06-22 | 2018-06-22 | Soaking plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108444324A CN108444324A (en) | 2018-08-24 |
| CN108444324B true CN108444324B (en) | 2024-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810651031.1A Active CN108444324B (en) | 2018-06-22 | 2018-06-22 | Soaking plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108444324B (en) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10859323B2 (en) * | 2018-06-08 | 2020-12-08 | Cooler Master Co., Ltd. | Vapor chamber and manufacturing method for the same |
| CN109307252B (en) * | 2018-09-10 | 2021-03-19 | 长春希达电子技术有限公司 | Phase change liquid and heat transmission module containing same |
| CN109539846A (en) | 2018-11-23 | 2019-03-29 | 西安交通大学 | A kind of flat-plate heat pipe with gradient wetting structure |
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