CN108429825B - Electronic components and electronic equipment - Google Patents

Abstract

The embodiment of the application provides an electronic assembly, including the sensor, the flexible circuit board, the sealing member, receiver and heat-radiating component, the flexible circuit board is including carrying on the back first face and the second face that sets up mutually, the sensor sets up on the first face of flexible circuit board, the receiver sets up on the second face of flexible circuit board through the sealing member, the sealing member has the inner chamber that feeds through to the vibration portion of receiver, the receiving hole is seted up to the flexible circuit board, the passageway between the vibration portion of receiver to the receiving hole of flexible circuit board forms the sound channel of the sound signal of output receiver, the week side of sealing member is located to the heat-radiating component ring. The electronic component that this application embodiment provided locates the week side of sealing member through the radiator unit ring, can effectually radiate away the heat in the stack subassembly, and the reliability is preferred. In addition, the embodiment of the application also provides electronic equipment.

Description

Electronic components and electronic equipment

technical field

The present application relates to the field of electronic equipment, and in particular, to an electronic component and electronic equipment.

Background technique

With the development of electronic device technology, the demand for thinner and lighter mobile phones is getting higher and higher. In the prior art, in order to realize more and more functions in electronic devices such as mobile phones, more and more devices are integrated inside the mobile phone, and the positional relationship between each device is more and more complicated. It is not conducive to the appearance design of the mobile phone.

SUMMARY OF THE INVENTION

The present application provides an electronic assembly and electronic device.

An embodiment of the present application provides an electronic assembly, including a sensor, a flexible circuit board, a seal, a receiver, and a heat dissipation assembly, the flexible circuit board includes a first surface and a second surface disposed opposite to each other, and the sensor is disposed on the On the first surface of the flexible circuit board, the receiver is disposed on the second surface of the flexible circuit board through the sealing member, the sealing member has an inner cavity connected to the vibration part of the receiver, the The flexible circuit board has a receiving hole, and the channel between the vibration part of the receiver and the receiving hole of the flexible circuit board forms a sound channel for outputting the sound signal of the receiver, and the heat dissipation component is arranged around the seal On the peripheral side of the component, the heat dissipation component is used to radiate the heat transferred to itself to the outside.

On the other hand, an embodiment of the present application further provides an electronic device, including a middle frame and an electronic assembly, and the heat dissipation assembly radiates heat transferred to itself to the middle frame.

In the electronic components and electronic devices provided by the embodiments of the present application, a stack assembly is formed by stacking the sensor, the flexible circuit board and the receiver, and the stacking component can save the X dimension of the electronic component and the electronic device to a limited extent, and the heat dissipation component is arranged around the The peripheral side of the sealing element can effectively radiate the heat in the stacked assembly to the outside, and the reliability is better.

Description of drawings

In order to illustrate the technical solutions of the present application more clearly, the following briefly introduces the accompanying drawings used in the implementation manner. Obviously, the accompanying drawings in the following description are only some implementations of the present application, which are common in the art. As far as technical personnel are concerned, other drawings can also be obtained based on these drawings without the need for creative labor.

1 is a schematic diagram of an electronic device provided by an embodiment of the present application;

FIG. 2 is a schematic diagram of an electronic assembly of the electronic device shown in FIG. 1;

Fig. 3 is a schematic diagram of an electronic assembly shown in Fig. 2;

Figure 4 is an exploded schematic view of the seal shown in Figure 3;

Fig. 5 is the top view of the heat dissipation assembly in Fig. 2;

FIG. 6 is a schematic diagram of another heat dissipation assembly in FIG. 1;

FIG. 7 is a schematic diagram of another angle of the heat dissipation assembly in FIG. 5;

FIG. 8 is a cross-sectional view of the heat dissipation assembly in FIG. 7;

Figure 9 is a cross-sectional view of a cavity surface of the foam in Figure 5;

Figure 10 is a cross-sectional view of another inner cavity surface of the foam in Figure 5;

FIG. 11 is a schematic diagram of the relative relationship between the sensor and the receiver of the electronic assembly shown in FIG. 2;

12 is a schematic diagram of another relative relationship between sensors and receivers of electronic components in other embodiments;

13 is a schematic diagram of yet another relative relationship between sensors and receivers of electronic components in other embodiments;

FIG. 14 is a schematic diagram of the relative relationship between the receiving hole and the vibrating part of the electronic assembly shown in FIG. 2;

15 is a schematic diagram of another relative relationship between the receiving hole and the vibrating part of the electronic component in other embodiments;

FIG. 16 is a schematic diagram illustrating that the sensor and the receiver of the electronic assembly in other embodiments are not arranged side by side;

17 is a schematic diagram of an electronic device having a middle frame;

18 is an exploded schematic view of the electronic device in FIG. 17 having a middle frame;

19 is a schematic diagram of a display module of the electronic device shown in FIG. 1;

FIG. 20 is a schematic diagram of a screen assembly of the display module of FIG. 19

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application.

In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features of the embodiments may be combined with each other unless there is conflict.

Many specific details are set forth in the following description to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

Furthermore, the following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present application may be practiced. The directional terms mentioned in this application, such as "length", "width", "thickness", etc., only refer to the directions of the attached drawings, therefore, the directional terms used are for better, clearer description and It is understood that this application does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the application. Unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection ; It can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal connection of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

Please refer to FIG. 1 , which is a schematic diagram of an electronic device 100 from a first perspective. The electronic device 100 includes the electronic assembly 1 . The electronic assembly 1 is accommodated inside the electronic device 100 , and is used to implement functions such as receiving calls of the electronic device 100 . The electronic device 100 may be any device with electronic components, for example, a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device and other smart devices. For the convenience of description, the electronic device 100 is defined with reference to the first viewing angle, the width direction of the electronic device 100 is defined as the X direction, the length direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device is defined as the Z direction .

1 and 2, the electronic component 1 includes a sensor 11, a receiver 13, a sealing member 14, a flexible circuit board 12 and a heat dissipation component 15. The flexible circuit board 12 includes a first surface 121 and a second surface disposed opposite to each other 122, the sensor 11 is disposed on the first surface 121 of the flexible circuit board 12, the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12 through the sealing member 14, and the sealing member 14 has an inner cavity connected to the vibration part 132 of the receiver 13, the flexible circuit board 12 has a receiving hole 123, and the vibration part 132 of the receiver 13 is between the receiving hole 123 of the flexible circuit board 12 The sound channel 131 for outputting the sound signal of the receiver 13 is formed by the sound channel 131 , and the heat dissipation component 14 is arranged around the peripheral side of the sealing member 14 , and the heat dissipation component 14 is used to radiate the heat transferred to itself.

When the electronic assembly 1 with this structure is arranged in the electronic device 100 , the sensor 11 , the flexible circuit board 12 and the receiver 13 are stacked in sequence along the Z direction of the electronic device 100 , saving the dimensions of the electronic assembly 1 and the electronic device 100 in the X direction. In addition, the heat dissipation component 15 is arranged around the peripheral side of the seal, which can effectively radiate the heat in the stacking component to the outside, so as to avoid the heat of the stacking component being concentrated due to the stacking of many devices and unable to dissipate, which affects the life of the electronic component 1. , better reliability.

Please refer to FIG. 2 and FIG. 3 together. The first surface 121 and the second surface 122 of the flexible circuit board 12 are respectively opposite sides of the flexible circuit board 12 . The surface area is large and can carry components. Correspondingly, the edges of the board surface of the flexible circuit board 12 are respectively the first side S1 and the second side S2 arranged opposite to each other, and the third side S3 and the fourth side S4 arranged opposite to each other. The fourth side S4 is respectively connected between the first side S1 and the second side S2, and the second side S2 extends away from the first side S1, so that the flexible circuit The board 12 is electrically connected to the circuit board. That is, the flexible circuit board 12 has a substantially long rectangular shape. The first side S1 and the second side S2 are shorter sides in the flexible circuit board 12 than the third side S3 and the fourth side S4 . That is, when the flexible circuit board 12 is disposed in the electronic device 100, it is generally arranged in a strip shape along the Y direction of the electronic device 100, so as to be extended to be electrically connected to the circuit board.

In one embodiment, as shown in FIG. 2 , the sensor 11 is disposed on the first surface 121 of the flexible circuit board 12 , and the sensor 11 is electrically connected to the flexible circuit board 12 .

It can be understood that the sensor 11 includes at least one of a distance sensor, a light sensor or a photoelectric sensor. In this embodiment, the sensor 11 is a light sensor. The light sensor 11 is disposed close to the screen of the electronic device 100 so as to adjust the brightness of the screen of the electronic device 100 according to the light in the environment where the electronic device 100 is located. The medium sensed by the light sensor 11 is light, and the electronic device 100 does not need to drill holes or set a special structure to pass the light. The stacking further optimizes the structure of the electronic device 100 and is beneficial to the X direction of the electronic device 100 .

In an embodiment, please refer to FIG. 2 , the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12 through the sealing member 14 , and the flexible circuit board 12 has a receiver hole 123 for the receiver. The channel between the vibration part 132 of the 13 and the receiving hole 123 of the flexible circuit board 12 forms a sound channel 131 for outputting the sound signal of the receiver 13 .

Wherein, the area of the second surface 122 of the flexible circuit board 12 is slightly larger than that of the receiver 13, that is, the size of the flexible circuit board 12 does not occupy too much space in the electronic device 100, and the receiver 13 can also be arranged on the flexible circuit board 100. When the circuit board 12 is on the second side 122 , the orthographic projection area of the receiver 13 on the flexible circuit board 12 is located in the area occupied by the second side 122 of the flexible circuit board 12 , that is, the flexible circuit board 12 completely covers the receiver 13 . Of course, in other embodiments, the size of the flexible circuit board 12 may also be much larger than the area of the receiver 13 .

In one embodiment, please refer to FIG. 2 and FIG. 4 , the sealing member 14 for sealingly connecting the flexible circuit board 12 to the receiver 13 has an inner cavity 14a connected to the vibration part 132 of the receiver 13 , so that the flexible circuit board After the 12 is sealed on the receiver 13 by the sealing member 14, the sound signal on the vibration part 132 of the receiver 13 can pass through the inner cavity 14a of the sealing member 14 to be output from the receiving hole 123 of the flexible circuit board 12.

Please refer to FIG. 2 and FIG. 4 , the sealing member 14 is a hollow annular shape, disposed between the second surface 122 of the flexible circuit board 12 and the receiver 13 , and the sealing member 14 just surrounds the edge of the vibration part 132 of the receiver 13 . In this way, after the flexible circuit board 12 and the receiver 13 are hermetically connected, the cavity formed between the vibration part 132 of the receiver 13 and the flexible circuit board 12 is a part of the sound channel 131 of the receiver 13, in order to facilitate the transmission of the sound signal of the receiver 13 To the outside, a receiving hole 123 is opened on the flexible circuit board 12 , and the receiving hole 123 is connected to the cavity formed between the vibration part 132 of the receiver 13 and the flexible circuit board 12 to form a sound channel 131 .

After the receiver 13 receives the audio signal, the vibrating part 132 of the receiver 13 vibrates to form a sound signal, the sound signal is transmitted from the vibration cavity to the receiving hole 123, and is transmitted to the outside through the receiving hole 123, so that the receiving function of the receiver 13 can be realized.

The structure of the sealing member 14 can be specifically as follows:

In an optional embodiment, please refer to FIG. 4 , the sealing member 14 includes a foam 141 and an adhesive layer 142, the foam 141 is hollowed out to form the inner cavity 14a, and the adhesive layer 142 is respectively disposed on the On the opposite sides of the foam 141 , the sealing member 14 is bonded between the flexible circuit board 12 and the receiver 13 .

When the electronic assembly 1 is installed in the electronic device 100 , due to the elasticity of the foam 141 , the electronic assembly 1 can be adaptively adjusted in the Z-direction space, and the foam 141 as the sealing member 14 has better sealing performance, and the receiver 13 has better sealing performance. The sound signal is not easily leaked from the foam, which affects the output of the sound signal from the receiver 13 .

Please refer to FIG. 2 and FIG. 5 , the heat dissipation component 15 is disposed on the sealing member 14 to dissipate heat for the electronic component 1 . Wherein, since the sealing member 14 has a certain height, the heat dissipation component 15 is arranged on the sealing member 14, and the height of the sealing member 14 is utilized to avoid additionally increasing the size of the electronic component 1 in the Z direction. In addition, since the flexible circuit board 12 mainly carries the sensor 11 and the receiver 13, the concentrated heat is relatively large. The heat on the flexible circuit board 12 is dissipated.

The heat dissipation component 15 is annularly arranged on the sealing member 14 . It can be understood that the heat dissipation component 15 can be a ring-shaped structure, and is sleeved on the peripheral side of the foam 141 . It can be understood that the heat dissipation assembly 15 can also be arranged in a ring shape and disposed on the peripheral side of the foam 141 .

Specifically, the heat dissipation component 15 is substantially annular in shape, and has a hollow portion 15 a in the middle. When the heat dissipation component 15 is sleeved on the foam 141 in the sealing member 14 , the hole wall of the hollow portion 15 a is close to the peripheral side of the foam 141 . .

The structure of the heat dissipation assembly includes but is not limited to the following embodiments:

In this embodiment, please refer to FIG. 5 , the heat dissipation component 15 includes a heat dissipation portion 151 and at least one heat pipe 152 connected to the peripheral surface 151d of the heat dissipation portion 151 , and the heat dissipation portion 151 is arranged around the seal. On the peripheral side of the sealing member 14 , one end of the at least one heat conducting pipe 152 extends in a direction away from the sealing member 14 . Of course, in other embodiments, the heat dissipation portion is a graphite ring. Of course, in other embodiments, please refer to FIG. 6 , a plurality of grooves U are defined on the peripheral side of the sealing member 14 , and the heat dissipation component 15 includes a plurality of annularly arranged along the peripheral surface of the sealing member 14 . Heat dissipation protrusions, one of the heat dissipation protrusions is embedded in a groove U of the sealing member, and the end of the heat dissipation protrusion T extends in a direction away from the sealing member 14 .

The heat dissipation assembly 15 is composed of a heat dissipation part 151 and a heat conduction pipe 152, and can effectively absorb the heat on the sealing member 14, the flexible circuit board 12 and the receiver 13 through the heat dissipation part 151, and then conduct it to the heat conduction pipe 152, so as to effectively dissipate the electronic The heat from component 1 is conducted out.

Specifically, please refer to FIG. 5 , the heat dissipation portion 151 is substantially annular, with a hollow portion 151 a in the middle. When the heat dissipation portion 151 is sleeved on the foam 141 in the sealing member 14 , the hole wall of the hollow portion 151 a is close to the foam. Circumferential side of cotton 141.

Referring to FIG. 5 , the heat dissipation portion 151 has a first abutting surface 151b and a second abutting surface 151c disposed opposite to each other, and a peripheral surface 151d connected between the first abutting surface 151b and the second abutting surface 151c.

It can be understood that, referring to FIG. 2 , the first abutting surface 151b is in close contact with the second surface 122 of the flexible circuit board 12 so as to transfer the heat on the flexible circuit board 12 to itself, and the second abutting surface 151c is in contact with the receiver. 13 is in close contact, so that the heat on the receiver 13 can be transferred to itself, and the heat dissipation part 15 can dissipate the heat.

Further, referring to FIG. 5 , the circumference of the peripheral surface 151d of the heat dissipation portion 151 gradually increases along the circumference from the receiver 13 to the flexible circuit board 12 . Specifically, the edge of the first abutting surface 151b is flush with the edge of the flexible circuit board 12 .

Specifically, please refer to FIG. 5 , the outer peripheral surface of the heat dissipation portion 151 is tapered. The first contact surface 151b of the heat dissipation part 151 covers all the area of the flexible circuit board 12 not covered by the sealing member 14 to absorb the heat on the flexible circuit board 12 as much as possible, thereby further improving the reliability of the electronic component 1 .

In this embodiment, please refer to FIG. 5 , one end of the heat pipe 152 is connected to the heat dissipation part 151 , the other end of the heat pipe 152 extends in a direction away from the electronic component 1 , and the other end of the heat pipe 152 can be connected to the electronic device. Contact with other structures such as the middle frame or the back cover, etc., so as to conduct the heat conducted by the heat dissipation portion 151 to the outside to reduce the heat on the electronic component 1 .

The heat dissipation process of the heat dissipation assembly 15 is as follows: the heat on the sealing member 14 , the flexible circuit board 12 and the receiver 13 is absorbed by the heat dissipation part 151 , and then conducts to the heat conduction pipe 152 , thereby effectively conducting the heat of the electronic assembly 1 out.

The electronic assembly 1 and the electronic device 100 provided by the embodiments of the present application form a stacking assembly by stacking the sensor 11 , the flexible circuit board 12 and the receiver 13 , and the stacking assembly can save the X dimension of the electronic assembly 1 and the electronic device 100 to a limited extent. , and the heat dissipation component 15 is arranged around the peripheral side of the sealing member 14 , which can effectively radiate the heat in the stacking component to the outside, and has better reliability.

Further, please refer to FIG. 7 and FIG. 8 , the heat dissipation portion 151 includes an elastic ring 1511 sleeved on the sealing member 14 and a metal ring 1512 sleeved on the elastic portion 1511 , and the metal ring 1512 has a gap 1512a and at least one hollow hole 1512b, and the one heat pipe 152 is connected to the elastic ring 1511 through one of the hollow holes 1512b.

By arranging the heat dissipation part 151 as a composite structure of the elastic ring 1511 and the metal ring 1512, the elastic ring 1511 can be preferably fixed on the foam 141, and the stability of the installation of the heat dissipation part 1511 can be ensured through the close contact with the foam 141 . In addition, the elastic ring 1511 can be elastically deformed, and the installation adaptability is better, while the metal ring 1512 is a rigid structure, which can play a supporting role while dissipating heat.

Referring to FIG. 7 , the elastic ring 1511 is protruded with a heat pipe 152 , that is, the heat pipe 152 and the elastic ring 1511 are integrally formed. The heat transfer pipe 152 is an elastically deformable structure, so that the heat transfer pipe 152 has greater flexibility when extending.

Please refer to FIG. 8 , since the metal ring 1512 has a gap 1512a , after the metal ring 1512 is sleeved on the elastic ring 1511 , the size of the metal ring 1512 can be relatively adjusted according to the size of the elastic ring 1511 , so that the metal ring 1512 and the elastic ring 1511 are tightly connected fixed.

The number of air escape openings 1512b on the metal ring 1512 is the same as that of the heat conducting pipes 152 . The void 1512b is mainly used for passing the heat pipe 152 on the elastic ring 1511 through.

It can be understood that the material of the elastic ring 1511 is silica gel, which has better thermal conductivity. The material of the metal ring 1512 is aluminum, which has good thermal conductivity.

Further, please refer to FIG. 9 , the area of the orthographic projection of the inner cavity 14 a of the foam 141 on the receiver 13 includes the area where the vibration part 132 of the receiver 13 is located. That is, the opening of the inner cavity 14a of the foam 141 is larger than the size of the vibration part 132 of the receiver 13, which ensures that the sound signal of the vibration part 132 can pass through the inner cavity 14a of the foam 141 completely. Of course, in other embodiments, the area of the orthographic projection of the inner cavity 14a of the foam 141 on the receiver 13 may also overlap with the area where the vibration part 132 of the receiver 13 is located.

Optionally, please refer to FIG. 9 , the foam 141 has an inner cavity surface 141a, the inner cavity surface 141a surrounds the inner cavity 14a, and the inner cavity surface 14a is a tapered surface. That is, the inner cavity surface 14a of the foam 141 is a tapered surface, and the foam 141 has a first opening 1411 and a second opening 1412 opposite to each other, the first opening 1411 is close to the receiver 13, the inner cavity The diameter of the surface 14a gradually increases along the direction from the first opening 1411 to the second opening 1412 . The foam 141 with such a structure has the function of amplifying sound, so that when the sound signal of the receiver 13 goes from the first opening 1411 to the second opening 1412, the sound signal is affected by the conical cavity surface 141a of the foam 141. The amplified and amplified sound signal is then output through the receiving hole 123 on the flexible circuit board 12 .

Optionally, please refer to FIG. 10 , the foam 141 has an inner cavity surface 141b, the inner cavity surface 141b surrounds and forms the inner cavity, and the inner cavity surface 141b is a curved surface. The inner cavity surface 141b has a first circular arc segment q1 and a second circular arc segment q2 which are connected in sequence, and the diameter formed around the connection between the first circular arc segment q1 and the second circular arc segment q2 is as follows. The minimum diameter of the inner cavity surface 141b. That is, the inner cavity surface 141b of the foam 141 is a drum surface that protrudes toward the central axis of the inner cavity of the foam 141 . The inner cavity surface 141b of the drum head enables the sound signal of the receiver 13 to first decrease and then increase when passing through the inner cavity of the foam 141 , and then output through the receiver hole 123 on the flexible circuit board 12 .

The structure of the inner cavity surface 141b of the foam 141 replaces the prior art by adjusting the vibration part 132 of the receiver 13 to control various needs of the sound signal of the receiver 13 , which is more conducive to improving the sound performance of the receiver 13 .

It can be understood that, referring to FIG. 9 and FIG. 10 , grooves 1413 may be recessed on the outer sides of the above two foams 141 , and the grooves 1413 may be embedded with the heat dissipation portion 151 .

Further, please refer to FIG. 11 , the area D1 of the orthographic projection of the sensor 11 on the flexible circuit board 12 is located in the area D2 of the orthographic projection of the receiver 13 on the flexible circuit board 12 . The sensor 11 and the receiver 13 overlap in the Z direction, reducing the size of the flexible circuit board 12 carried between the sensor 11 and the receiver 13, so that when the electronic component 1 is assembled in the circuit board, the size of the electronic component 1 in the X direction is saved , the structure of the electronic device 100 is further optimized. Of course, in other embodiments, as shown in FIG. 12 , the orthographic projection area of the sensor 11 and the receiver 13 on the flexible circuit board 12 may also partially overlap, that is, the orthographic projection of the sensor 11 on the flexible circuit board 12 The area D1 partially overlaps with the area D2 of the orthographic projection of the receiver 13 on the flexible circuit board 12 ; or as shown in FIG. 13 , the area D1 of the orthographic projection of the sensor 11 on the flexible circuit board 12 The areas D2 of the orthographic projection of the receiver 13 on the flexible circuit board 12 are staggered from each other, and so on.

It can be understood that, referring to FIG. 11 , the sensor 11 is disposed near the connection between the first side S1 and the third side S3 of the flexible circuit board 12 . The sensor 11 is arranged at the corner of the flexible circuit board 12 and is far from the connection between the flexible circuit board 12 and the circuit board, so that when the electronic component 1 is arranged on the electronic device 100, the sensor 11 is close to the top of the electronic device 100, thereby reducing the the size of the non-display area of the electronic device 100.

It can be understood that, referring to FIG. 14 , the sound channel 131 and the sensor 11 are arranged side by side along the direction from the third side S3 to the fourth side S4 .

Wherein, as shown in FIG. 14 , the area of the orthographic projection of the receiver hole 123 on the receiver 13 overlaps with the range where the vibration part 132 of the upper part of the receiver 13 is located. That is, the receiving hole 123 is aligned with a part of the vibrating part 132 on the receiver 13 . That is, the size of the receiver hole 123 is smaller than the size of the vibration part 132 of the receiver 13 . Correspondingly, the area D3 of the orthographic projection of the receiving hole 123 on the flexible circuit board 12 is located in the area D4 of the orthographic projection of the vibration part 132 of the receiver 13 on the flexible circuit board 12 . A sound guide structure can be additionally covered on the receiver hole 123 to ensure the sound output of the receiver 13 . That is, the area D3 of the orthographic projection of the hole of the receiver hole 123 on the flexible circuit board 12 is located in the area D4 of the orthographic projection of the vibration part 132 of the receiver 13 on the flexible circuit board 12 . The receiving hole 123 is close to the corners of the first side S1 and the fourth side S4, so that the sound channel 131 and the sensor 11 are arranged side by side. The receiving hole 123 is arranged side by side with the sensor 11 , which can reduce the demand for the non-display area of the electronic device 100 and increase the screen ratio of the electronic device 100 . Of course, in other embodiments, please refer to FIG. 15 , the size of the receiving hole 123 may be half of the vibration part 132 of the receiver 13 , or, referring to FIG. 16 , the receiving hole 123 and the sensor 11 are arranged in different rows.

Further, please refer to FIG. 17 and FIG. 18 , the electronic device 100 further includes a middle frame 3, and the middle frame 3 has a first middle frame surface 3a and a second middle frame surface 3b arranged opposite to each other, and the first middle frame surface 3a is used for Facing the display module 2 , an accommodating portion 31 is formed on the second middle frame surface 3 b , and the accommodating portion 31 is used for arranging the electronic component 1 .

The sensor 11 in the electronic assembly 1 is attached to the second middle frame surface 3b. Correspondingly, the second middle frame surface 3b has a first middle frame hole 3c for aligning the sensor 11 and a first middle frame hole 3c for aligning the flexible circuit board. The second middle wide hole 3d of the receiving hole 123 on the 12; to ensure that the electronic component 1 can still work normally after being installed on the middle frame 3. The heat pipe in the heat dissipation assembly 15 abuts on the accommodating portion 31 to transfer the heat from the electronic assembly 1 to the middle frame, so as to improve the reliability of the electronic assembly 1 .

Further, please refer to FIG. 1 and FIG. 17 , the electronic device 100 further includes a display module 2 , and the display module 2 is disposed on the first middle frame surface 3 a of the middle frame 3 .

The display module 2 has a non-display area Z2, the non-display area Z2 is provided with a receiving window 21a, the electronic component 1 is arranged on the non-display area Z2, and the sound channel 131 of the electronic component 1 is connected to the receiving window 21a.

In an embodiment, please refer to FIG. 19 and FIG. 20 together, the display module 2 includes a cover plate 21 and a screen assembly 22 which are stacked and connected in sequence. The display module 2 is connected with the casing of the electronic device 100 to form a closed cavity of the electronic device 100, the electronic component 1 is accommodated in the cavity, and the receiving hole 123 and the sensor 11 in the electronic component 1 are aligned with the display module The non-display area Z2 of group 2, so that the sound signal in the receiver 13 can be transmitted to the receiver window 21a through the receiver hole 123, so that the user can listen to the sound signal through the receiver window 21a, and the sensor 11 is aligned with the display module 2 can also enable the sensor 11 to receive external light to work. The non-display area Z2 is an area of the electronic device 100 that is not used for displaying electronic images.

Since the sensor 11 , the flexible circuit board 12 and the receiver 13 are stacked, when the electronic component 1 of this structure is arranged in the electronic device 100 , the sensor 11 , the flexible circuit board 12 and the receiver 13 are stacked in sequence along the Z direction of the electronic device 100 . , the size of the non-display area Z2 in the X direction of the electronic device 100 is saved, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 can be improved.

In one embodiment, as shown in FIG. 19 , the display module 2 further has a display area Z1 , and the display area Z1 surrounds the non-display area Z2 .

It can be understood that, as shown in FIG. 20 , the display module 2 includes a cover plate 21 and a screen assembly 22 that are stacked and connected in sequence, and the screen assembly 22 has two short sides S5 arranged opposite to each other, and a Two long sides S6, the two long sides S6 are respectively connected between the two short sides S5, one of the short sides S5 is recessed towards the direction of the other short side S5 to form a groove 22a, so The area of the display module 2 inside the groove 22a is the non-display area Z2, the area of the display module 2 outside the groove 22a is the display area Z1, and the cover plate 21 is opened The receiving window 21a. Of course, in other embodiments, the display module 2 can also be a screen assembly 22, and the display module 2, that is, an edge of the screen assembly 22 defines a groove 22a to form a non-display area Z2, and the display module 2 is located in the The area other than the non-display area Z2 is the display area Z1.

As shown in FIG. 1 and FIG. 20 , that is, the display module 2 formed by the cover plate 21 and the screen assembly 22 is the display area Z1 except for the recess 22 a . The groove 22a is formed in the middle of one short side of the screen assembly 22 . The cover plate 21 defines a receiving window 21 a corresponding to the receiving hole 123 . It can be understood that the receiving window 21a is in the shape of a long strip, and its size is approximately twice that of the receiving hole 123 . The portion of the cover plate 21 corresponding to the groove 22a may be coated by printing to form the non-display area Z2 of the display module 2 . Since the sensor 11, the flexible circuit board 12 and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, the size of the groove 22a in the X direction is reduced, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 can be increased. It can be understood that the electronic assembly 1 is disposed facing the display module 2, and the receiver 13 is at least partially aligned with the non-display area Z2.

In an embodiment, please refer to FIG. 1 and FIG. 20 , a groove 22a is formed on an edge of the display module 2 to form a non-display area Z2, and the area of the display module 2 outside the non-display area Z2 is In the display area Z1, the electronic component 1 is disposed facing the display module 2, and the receiver 13 is at least partially aligned with the non-display area Z2, that is, at least part of the receiver 13 on the display module 2 The orthographic projection area of is located in the non-display area Z2. The receiver 13 is partially aligned with the non-display area Z2, which further reduces the size of the non-display area Z2 in the Y direction, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 can be further improved.

Further, at least part of the orthographic projection area of the sensor 11 on the display module 2 is located in the non-display area Z2.

Part of the structure of the receiver 13 and the sensor 11 is located in the groove 22a, and the range of the orthographic projection of the remaining structure of the receiver 13 and the sensor 11 on the display module 2 is located in the display area Z1 of the display module 2. The size of the non-display area Z2 in the Y direction is reduced, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 can be further improved. Of course, in other embodiments, referring to FIG. 20 , the entire electronic component 1 may be located in the groove 22a.

It can be understood that, as shown in FIG. 20 , the electronic component 1 is located at the corners of the groove 22a, so that other components, such as a camera module, etc., can be continuously arranged in the X direction of the groove 22a. Of course, in other embodiments, as shown in FIG. 19 , the electronic component 1 may also be located in the middle of the groove 22 a , and other components are located on both sides of the electronic component 1 respectively.

When assembling the electronic device 100 provided by the embodiment of the present application, firstly, the sensor 11 is disposed on the flexible circuit board 12 and is electrically connected to the flexible circuit board 12 , and then the sensor 11 is disposed on the flexible circuit board 12 , and then the receiver 13 is placed on the flexible circuit board 12 . The sealing member 14 is arranged on the flexible circuit board 12, and the heat dissipation component 15 is arranged around the electronic component 1; Then the middle frame 3 is assembled against the display module 2, so that the receiving hole 123 of the electronic assembly 1 is aligned with the receiving window 21a on the cover plate 21, and the partial structure of the receiver 13 and the sensor 11 is located in the groove 22a The range of the orthographic projection of the remaining structures of the receiver 13 and the sensor 11 on the display module 2 is located within the range of the display area Z1 of the display module 2 .

The electronic assembly 1 and the electronic device 100 provided by the embodiments of the present application form a stacking assembly by stacking the sensor 11 , the flexible circuit board 12 and the receiver 13 , and the stacking assembly can save the X dimension of the electronic assembly 1 and the electronic device 100 to a limited extent. , and the heat dissipation component 15 is arranged around the peripheral side of the sealing member 14 , which can effectively radiate the heat in the stacking component to the outside, and has better reliability.

The above are the preferred embodiments of the present application. It should be pointed out that for those of ordinary skill in the art, some improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also regarded as the present invention. The scope of protection applied for.

Claims (15)

1. An electronic assembly, characterized in that it comprises a sensor, a flexible circuit board, a sealing member, a receiver and a heat dissipation assembly, the flexible circuit board comprises a first surface and a second surface arranged opposite to each other, and the sensor is arranged on the On the first surface of the flexible circuit board, the receiver is disposed on the second surface of the flexible circuit board through the sealing member, the sealing member has an inner cavity connected to the vibration part of the receiver, the The flexible circuit board has a receiving hole, and the channel between the vibration part of the receiver and the receiving hole of the flexible circuit board forms a sound channel for outputting the sound signal of the receiver, and the heat dissipation component is arranged around the seal On the peripheral side of the component, the heat dissipation component is used to radiate the heat transferred to itself to the outside. 2 . The electronic assembly according to claim 1 , wherein a plurality of grooves are defined on the peripheral side of the sealing member, and the heat dissipation assembly comprises a plurality of heat dissipation rings arranged along the peripheral surface of the sealing member. 3 . A protrusion, one of the heat dissipation protrusions is embedded in a groove of the sealing member, and the end of the heat dissipation protrusion extends in a direction away from the sealing member. 3 . The electronic assembly according to claim 1 , wherein the heat dissipation assembly comprises a heat dissipation part and at least one heat pipe connected to the peripheral surface of the heat dissipation part, and the heat dissipation part is arranged around the seal. 4 . One end of the at least one heat conducting pipe extends in a direction away from the sealing member. 4 . The electronic component according to claim 3 , wherein the heat dissipation portion has a first abutting surface and a second abutting surface opposite to each other, and the peripheral surface is connected to the first abutting surface. 5 . and the second abutting surface, the first abutting surface and the second abutting surface are respectively abutted on the second surface of the flexible circuit board and the receiver. 5 . The electronic assembly according to claim 4 , wherein the peripheral surface of the heat dissipation portion gradually increases along the peripheral length from the receiver to the flexible circuit board. 6 . 6 . The electronic assembly of claim 5 , wherein an edge of the first abutting surface is flush with an edge of the flexible circuit board. 7 . 7 . The electronic component according to claim 3 , wherein the heat dissipation part comprises an elastic ring sleeved on the sealing member and a metal ring sleeved on the elastic part, and the metal ring is sleeved on the elastic part. 8 . There is a gap and at least one hollow hole on the upper part, and the one heat conduction pipe is connected to the elastic ring through one of the hollow holes. 8 . The electronic assembly of claim 3 , wherein the heat dissipation portion is a graphite ring. 9 . 9 . The electronic assembly according to claim 1 , wherein the sealing member is an adhesive layer, the sealing member is coated on the flexible circuit board, and the sealing member surrounds the the vibrating portion of the receiver, so that the space occupied by the seal surrounding the vibrating portion of the receiver forms the inner cavity; and/or, The sealing member is an adhesive layer, the sealing member is applied to the receiver, and the sealing member surrounds the vibration part of the receiver, so that the sealing member surrounds the vibration part of the receiver. The space forms the inner cavity. 10. The electronic assembly according to any one of claims 1 to 8, wherein the sealing member comprises a foam and an adhesive layer, the foam is hollowed out to form the inner cavity, and the adhesive layer is respectively disposed on the inner cavity. On the opposite sides of the foam, the seal is bonded between the flexible circuit board and the receiver. 11 . The electronic assembly according to claim 10 , wherein the area of the orthographic projection of the inner cavity of the foam on the receiver includes an area where the vibration part of the receiver is located. 12 . 12 . The electronic assembly according to claim 10 , wherein the foam has an inner cavity surface, the inner cavity surface surrounds the inner cavity, and the inner cavity surface is a tapered surface. 13 . 13 . The electronic assembly according to claim 12 , wherein the foam has a first opening and a second opening opposite to each other, the first opening is close to the receiver, and the diameter of the inner cavity surface is 13 . It gradually increases along the direction from the first opening to the second opening. 14. The electronic assembly according to any one of claims 1 to 8, wherein the area of the orthographic projection of the sensor on the flexible circuit board is located in the orthographic projection of the receiver on the flexible circuit board in the area. 15. An electronic device, characterized in that it comprises a middle frame and the electronic assembly according to any one of claims 1 to 14, wherein the middle frame is in contact with the heat dissipation assembly, and the heat dissipation assembly will transmit to its own Heat is radiated outward onto the middle frame.

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