CN107509381A - Manufacturing method of shielding cover, shielding cover and mobile terminal - Google Patents

Abstract

The invention provides a method for manufacturing a shielding cover, a shielding cover and a mobile terminal. By manufacturing an upper shell and a lower shell respectively, the upper shell and the lower shell are aligned to form a box, and the upper shell and the lower shell The heat-absorbing phase-change material is injected into the cavity surrounded by the board to form a shielding cover, which not only has good heat dissipation performance, but also because the endothermic phase-change material in the shielding cover can absorb or release a large amount of heat during phase change, Therefore, the temperature of the outer surface of the shielding cover can be increased slowly, which can greatly avoid the formation of hot spots caused by the local temperature of the mobile terminal rising too fast, and can reduce the final temperature of the mobile terminal.

Description

Manufacturing method of shielding cover, shielding cover and mobile terminal

technical field

The invention relates to the field of electronic technology, in particular to a manufacturing method of a shielding cover, a shielding cover and a mobile terminal.

Background technique

With the development and progress of science and technology, electronic technology has developed rapidly and made great progress, and the popularity of electronic products has also increased to an unprecedented height, especially mobile terminals have become an indispensable part of people's lives.

As various functions in mobile terminals become more and more complete, the precision of electronic components in mobile terminals is getting higher and higher, and the number of electronic components is increasing. In order to better protect various precision electronic components and ensure that electronic components Not to be interfered by other electronic components, most of the electronic components are provided with metal shielding covers. On the one hand, it can play a good shielding role, and on the other hand, it can also play a certain role in heat dissipation. It is to install a layer of metal plate or metal mesh, etc., which has poor heat dissipation effect, is prone to overheating and other phenomena, and has potential safety hazards such as damage to electronic components.

Contents of the invention

Embodiments of the present invention provide a method for manufacturing a shielding cover, a shielding cover, and a mobile terminal, so as to solve problems such as poor heat dissipation effect of the existing shielding cover, prone to overheating, and potential safety hazards such as damage to electronic components.

An embodiment of the present invention provides a method for manufacturing a shielding cover, the shielding cover is applied to an electronic device of a mobile terminal, and the method includes:

Make the upper shell plate and the lower shell plate of the shielding cover respectively;

Aligning the upper shell plate and the lower shell plate to form a box, so that a receiving cavity is formed between the upper shell plate and the lower shell plate;

Injecting an endothermic phase change material into the accommodating cavity.

An embodiment of the present invention also provides a shielding cover, the shielding cover includes an upper shell plate, a lower shell plate, a first frame body, a side wall, and a heat-absorbing phase change material, the upper shell plate is opposite to the lower shell plate The first frame is sandwiched between the upper shell and the lower shell, the side wall is located on the side of the lower shell away from the upper shell, and the heat-absorbing phase change material It is filled in the accommodation cavity jointly surrounded by the upper shell plate, the lower shell plate and the first frame body.

An embodiment of the present invention also provides a mobile terminal. The mobile terminal includes a shielding cover. The shielding cover includes an upper shell, a lower shell, a first frame, a side wall, and a heat-absorbing phase change material. The upper shell The plate is arranged opposite to the lower shell, the first frame is sandwiched between the upper shell and the lower shell, and the side wall is located on the side of the lower shell away from the upper shell , the heat-absorbing phase change material is filled in the accommodation cavity jointly surrounded by the upper shell plate, the lower shell plate and the first frame body.

The manufacturing method of the shielding cover, the shielding cover and the mobile terminal provided by the embodiments of the present invention respectively manufacture the upper shell plate and the lower shell plate of the shielding cover; align the upper shell plate and the lower shell plate to form a box, so that A storage cavity is enclosed between the upper shell plate and the lower shell plate; an endothermic phase-change material is injected into the cavity. In this way, by making the upper shell plate and the lower shell plate respectively, aligning the upper shell plate and the lower shell plate to form a box, and injecting the heat-absorbing phase change material into the accommodation cavity surrounded by the upper shell plate and the lower shell plate, thereby Forming the shielding cover not only has better heat dissipation performance, but also because the heat-absorbing phase-change material in the shielding cover can absorb or release a large amount of heat during the phase change, so that the temperature of the outer surface of the shielding cover can rise slowly, which can It can greatly avoid the formation of hot spots caused by the local temperature of the mobile terminal rising too fast, and can reduce the final temperature of the mobile terminal.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a perspective view of a mobile terminal provided by a preferred embodiment of the present invention;

FIG. 2 is a top view of a circuit board in the mobile terminal shown in FIG. 1;

Fig. 3 is the sectional view shown in III-III place among Fig. 2;

4 is a cross-sectional view of a shielding cover provided in another embodiment of the present invention;

Fig. 5 is a cross-sectional view of a shielding cover provided in another embodiment of the present invention;

Fig. 6 is a flow chart of the manufacturing method of the shielding cover shown in Fig. 3;

6 to 12 are partial cross-sectional views during the manufacturing process of the shielding cover shown in FIG. 3 .

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

Please refer to FIG. 1 . FIG. 1 is a perspective view of a mobile terminal provided by a preferred embodiment of the present invention, and FIG. 2 is a top view of a circuit board in the mobile terminal shown in FIG. 1 . As shown in Figures 1 and 2, the mobile terminal 100 includes a display screen 110, a housing 120 and a circuit board 130, the display screen 110 is nested with the housing 120, and the housing 120 is used to carry the The display screen 110, the casing 120 and the display screen 110 together form a receiving chamber, the circuit board 130 is housed in the receiving chamber surrounded by the casing 120 and the display screen 110, wherein the circuit The board 130 is mainly used to carry electronic components such as various circuit modules, wires and batteries of the mobile terminal 100 . The mobile terminal 100 also includes a display area 101 and a peripheral area 102 surrounding the display area 101, the display area 101 can be mainly used to realize the display output function of the mobile terminal 100, and the peripheral area 102 is mainly used for To provide space to set buttons, receivers, sound generating devices, camera modules, infrared sensors and their circuit wiring, etc.

The mobile terminal 100 also includes conventional structures such as a flashlight, a volume adjustment key, and a power key, which will not be repeated here.

In the embodiment of the present invention, the above-mentioned mobile terminal can be any such as: a mobile phone, a tablet computer (Tablet PersonalComputer), a laptop computer (Laptop Computer), a personal digital assistant (personal digital assistant, PDA for short), a mobile Internet device (Mobile Internet Device, MID) or wearable devices (Wearable Device) and other mobile terminals. In addition, although the mobile terminal is given as an example above, it is only used as an example and is not limited to the above-mentioned electronic equipment. Any electronic equipment that can use shielding covers on electronic components such as circuit modules or circuit boards can be included in all electronic equipment. In the scope of protection of the mobile terminal mentioned above.

The circuit board 130 may be a part of the main board of the mobile terminal 100, or may be a circuit board provided separately, and the circuit board 130 may be provided with a processor (not shown), various Various circuits (not shown in the figure) and various functional modules 140 (shown in FIG. 3 ) for realizing different functions, etc.

Please refer to FIG. 3 at the same time. FIG. 3 is a sectional view shown at III-III in FIG. 2 . As shown in FIG. 3 , the mobile terminal 100 further includes a shielding cover 150 , the shielding cover 150 is located on the functional module 140 and covers the functional module 140 . The shielding cover 150 includes an upper shell plate 151, a lower shell plate 152, a first frame body 153, a side wall 154, and a heat-absorbing phase change material 155. The upper shell plate 151 and the lower shell plate 152 are arranged opposite to each other. The first frame body 153 is sandwiched between the upper shell plate 151 and the lower shell plate 152, and is vertically connected to the bottom plates of the upper shell plate 151 and the lower shell plate 152 respectively, and the upper shell plate 151. The lower shell plate 152 and the first frame body 153 together form a storage chamber, and the heat-absorbing phase change material 155 is filled in the upper shell plate 151, the lower shell plate 152 and the second shell plate 151. A frame body 153 together surrounds the receiving cavity.

In addition, heat sinks such as thermal conductive glue and graphite sheets can also be arranged between the shielding cover 150 and the functional module 140 .

In this embodiment, the endothermic phase change material 155 is an endothermic phase change material with high enthalpy. Preferably, the enthalpy of the endothermic phase change material 155 is greater than 100 J/g.

The side wall 154 is located on the side of the lower shell 152 away from the upper shell 151, and forms a box shape without a cover with the lower shell 152, and the side wall 154 is used for shielding The cover 150 covers the functional module 140 and fixes the shielding cover 150 on the circuit board 130 .

Wherein, the first frame body 153 may be vertically connected and fixed on the bottom plate of the upper shell plate 151, and extended from the edge of the bottom plate of the upper shell plate 151 toward the lower shell plate 152, also It may be vertically connected and fixed on the bottom plate of the lower shell plate 152, and extended from the edge of the bottom plate of the lower shell plate 152 toward the upper shell plate 151, or it may be a part of the upper shell plate 151. The edge of the bottom plate extends toward the lower shell 152 to form a first sub-frame, and the edge of the bottom of the lower shell 152 extends toward the upper shell 151 to form a second sub-frame. The frame and the second sub-frame together form the first frame 153 .

In this way, by injecting the endothermic phase-change material into the accommodation cavity surrounded by the upper shell and the lower shell, it not only has better heat dissipation performance, but also because the endothermic phase-change material in the shielding cover can absorb or A large amount of heat is released, so that the temperature of the outer surface of the shielding cover rises slowly, which can greatly prevent the local temperature of the mobile terminal from rising too fast to form a hot spot, and can reduce the final temperature of the mobile terminal.

Please refer to FIG. 4 at the same time. FIG. 4 is a cross-sectional view of a shielding cover provided in another embodiment of the present invention. The shielding cover 450 shown in FIG. 4 is different from the shielding cover 150 shown in FIG. 458 and the second capillary structure 459, the upper cover plate 456 is arranged opposite to the upper shell plate 451, and the upper cover plate 456 and the upper shell plate 451, and are sandwiched between the upper cover plate 456 and the upper shell plate The side walls between 451 together form a first accommodation cavity, the first capillary structure 458 is accommodated in the first accommodation cavity, and a liquid heat dissipation medium is also arranged in the first accommodation cavity , thereby forming a first heat conducting structure.

In this embodiment, the liquid heat dissipation medium is heat dissipation medium such as water or methanol.

The lower cover plate 457 is arranged opposite to the lower shell plate 452, and the lower cover plate 457, the lower shell plate 452, and the side walls sandwiched between the lower cover plate 457 and the lower shell plate 452 jointly surround A second accommodating cavity is formed, the second capillary structure 459 is accommodated in the second accommodating cavity, and a liquid heat dissipation medium is further arranged in the second accommodating cavity, thereby forming a second heat conducting structure.

In this embodiment, both the first heat conduction structure and the second heat conduction structure are vacuum structures, and the heat conduction effect of the first heat conduction structure and the second heat conduction structure can reach 10000 W/mK.

In this embodiment, the upper cover plate 456 is located on the side of the upper shell plate 451 away from the lower shell plate 452, but it is not limited thereto. In other embodiments, the upper cover plate 456 is also It may be located on a side of the upper shell 451 close to the lower shell 452 .

In this embodiment, the lower cover plate 457 is located on the side of the lower shell plate 452 away from the upper shell plate 451, but it is not limited thereto. In other embodiments, the lower cover plate 457 is also It may be located on a side of the lower shell 452 close to the upper shell 451 .

In this embodiment, the first heat conduction structure and the second heat conduction structure are respectively provided on the side of the upper shell plate and the side of the lower shell plate, but it is not limited thereto. The first heat conduction structure is provided on one side of the upper shell, or the second heat conduction structure is only provided on one side of the lower shell, not limited to this.

In this way, by setting the upper cover plate and the lower cover plate on the shielding cover to form the first heat conduction structure and the second heat conduction structure on the side of the upper shell plate and the side of the lower shell plate respectively, the conduction of temperature can be accelerated, thereby accelerating the heat dissipation .

Please refer to FIG. 5 at the same time. FIG. 5 is a cross-sectional view of a shielding cover provided in another embodiment of the present invention. The shielding cover 550 shown in FIG. 5 is different from the shielding cover 150 shown in FIG. The second frame body 5510 is sandwiched between the upper shell plate 551 and the lower shell plate 552, and is vertically connected with the bottom plates of the upper shell plate 551 and the lower shell plate 552 respectively. The second frame body 5510 is connected to the first The frame body 553 is arranged concentrically, and the upper shell plate 551, the lower shell plate 552, the first frame body 553 and the second frame body 5510 together form an accommodation cavity, and the third capillary structure 5511 is located Between the first frame body 553 and the second frame body 5510, and accommodated in the accommodation cavity, and a liquid heat dissipation medium is also arranged in the second accommodation cavity, thereby forming a third heat conduction structure .

Wherein, the accommodating cavity surrounds the accommodating cavity and is spaced apart from the accommodating cavity through the second frame.

In this embodiment, the third heat conduction structure is a vacuum structure, and the heat conduction effect of the third heat conduction structure can reach 10000 W/mK.

Wherein, the second frame body 5510 may be vertically connected and fixed on the bottom plate of the upper shell plate 551, and extended from the edge of the bottom plate of the upper shell plate 551 toward the lower shell plate 552, also It may be vertically connected and fixed on the bottom plate of the lower shell plate 552, and extend from the edge of the bottom plate of the lower shell plate 552 toward the upper shell plate 551, or it may be a part of the upper shell plate 551. The edge of the bottom plate extends toward the lower shell 552 to form a third sub-frame, and the edge of the bottom plate of the lower shell 552 extends toward the upper shell 551 to form a fourth sub-frame. The frame and the fourth sub-frame together form the second frame 5510 .

In this way, by arranging the second frame on the shielding cover, a third heat conduction structure is formed between the upper shell plate and the lower shell plate, and around the receiving chamber, so as to speed up the conduction of temperature, thereby accelerating the heat dissipation.

Please refer to FIG. 6 to FIG. 12 , FIG. 6 is a flow chart of the manufacturing method of the shielding cover shown in FIG. 3 , and FIG. 6 to FIG. 12 are partial cross-sectional views during the manufacturing process of the shielding cover shown in FIG. 3 . As shown in Figure 6, the method includes:

Step 601, making the upper shell plate and the lower shell plate of the shielding cover respectively.

In this step, firstly, the upper shell plate 751 and the lower shell plate 752 are fabricated respectively.

Specifically, a metal material can be used to directly process the upper shell plate 751 through a flat cutting machine, and a metal material can be processed to form a bottom plate by a punching machine, and a first vertical connection with the bottom plate can be formed on the bottom plate. A frame body 753 and a side wall 754 to form a lower shell plate 752, wherein the first frame body 753 and the side wall 754 are respectively located on both sides of the bottom plate of the lower shell plate 752, and are respectively connected to the The bottom plates of the lower shell plate 752 are connected vertically, as shown in FIG. 7 .

In this embodiment, the first frame body 753 is formed on the bottom plate of the lower shell plate 752, but it is not limited thereto. In other embodiments, it may also be formed on the bottom plate of the upper shell plate 751 The first frame body 753 is formed on the top, or a third sub-frame body is formed extending from the edge of the bottom plate of the upper shell plate 751, and a fourth sub-frame body is formed extending from the edge of the bottom plate of the lower shell plate 752. The frame body, the first sub-frame body and the second sub-frame body together form the first frame body 753 .

In this embodiment, the material of the upper shell plate 751 and the lower shell plate 752 is metal with thermal conductivity. Preferably, the material of the upper shell plate 751 and the lower shell plate 752 is nickel nickel.

Step 602 , align the upper shell plate 751 and the lower shell plate 752 to form a box, so that a receiving cavity is formed between the upper shell plate 751 and the lower shell plate 752 .

In this step, after the upper shell plate 751 and the lower shell plate 752 are fabricated, the upper shell plate 751 and the lower shell plate 752 can be aligned to form a box, so that the upper shell plate A receiving cavity is defined between 751 and the lower shell 752 .

Specifically, the first frame body 753 may be welded or bonded to the upper shell plate 751 by using welding technology or glue point bonding technology, so that the upper shell plate 751 and the lower shell plate 751 The shell plate 752 is welded and fixed, so that the upper shell plate 751 and the lower shell plate 752 are arranged oppositely, the first frame body 73 is sandwiched between the upper shell plate 751 and the lower shell plate 752, and The upper shell plate 751 and the lower shell plate 752 are vertically and fixedly connected to the bottom plates respectively, and the upper shell plate 751 , the lower shell plate 752 and the first frame body 753 jointly enclose a receiving chamber.

Step 603, injecting an endothermic phase change material into the storage cavity.

In this step, the endothermic phase-change material 755 is injected into the housing cavity enclosed by the upper shell plate 751, the lower shell plate 752 and the first frame body 753, thereby forming a shielding cover with good heat dissipation performance. 750, as shown in Figure 8.

Wherein, the endothermic phase change material 755 is an endothermic phase change material with high enthalpy. Preferably, the enthalpy of the endothermic phase change material 155 is greater than 100 J/g.

Optionally, after step 203, the method includes:

Detecting whether the endothermic phase-change material seeps out of the shielding cover; if no endothermic phase-change material seeps out of the shielding cover, it is determined that the shielding cover is qualified.

In this step, after injecting the endothermic phase change material 755 to form the shielding cover 750, the shielding cover 750 can be detected to detect whether the endothermic phase change material 755 seeps out of the shielding cover 750 , to detect whether the shielding cover 750 is qualified, if the heat-absorbing phase-change material 755 does not protrude from the shielding cover 750, it can be determined that the shielding cover 750 is qualified and is a qualified product.

Specifically, to detect whether the endothermic phase-change material 755 seeps out of the shielding cover 750 may be to place the shielding cover 750 in an environment with a temperature of 55 degrees Celsius to 65 degrees Celsius for 25 minutes to 35 minutes, To determine whether the endothermic phase change material 755 seeps out.

Preferably, the temperature of the detection environment is 60 degrees Celsius, and the duration is 30 minutes.

Optionally, after step 601, the method includes:

Form a first capillary structure 758 on one side of the upper shell plate 751; make an upper cover plate 756, and align the upper cover plate 756 with the upper shell plate 751 to form a box, so that the first A capillary structure 758 is accommodated in a first accommodating cavity enclosed between the upper shell plate 751 and the upper cover plate 756; a liquid cooling medium is injected into the first accommodating cavity.

In this step, after the upper shell plate 751 is formed, a first capillary structure 758 can be formed on one side of the upper shell plate 751, and then an upper cover plate 756 is formed, and then the upper cover plate 756 It is aligned with the upper shell plate 751 to form a box, so that the upper cover plate 756 and the upper shell plate 751 together form a first accommodating cavity, and the first capillary structure 758 is accommodated in the Into the first accommodating cavity surrounded by the upper cover plate 756 and the upper shell plate 751, and then inject a liquid cooling medium into the first accommodating cavity to form a first heat conduction structure, as shown in FIG. 9 , so that after step 602 and step 603, the shielding cover as shown in FIG. 4 can be fabricated.

Specifically, when the upper cover plate 756 is formed, it can be formed by stamping to form a side plate on the bottom plate of the upper cover plate 756, and make the upper cover plate 756 and the upper shell plate 751 aligned. When forming a box, the bottom plate of the upper cover plate 756 , the upper shell plate 751 and the side plates located on the bottom plate of the upper cover plate 756 jointly define the first accommodating cavity.

In this embodiment, the side plate is formed on the bottom plate of the upper cover plate 756, but it is not limited thereto. In other embodiments, the side plate can also be formed on the upper shell plate 751 superior.

In this embodiment, the first capillary structure 758 is formed on the upper shell plate 751, but it is not limited thereto. In other embodiments, the first capillary structure 758 may also be formed on the upper cover plate 756. First capillary structure 758 .

Wherein, the liquid heat dissipation medium is heat dissipation medium such as water or methanol.

In this embodiment, the first heat conduction structure is a vacuum structure, and the heat conduction effect of the first heat conduction structure can reach 10000 W/mK.

In this way, by arranging the upper cover plate and the lower cover plate on the shielding cover to form the first heat conduction structure on one side of the upper shell plate, the conduction of temperature can be accelerated, thereby accelerating the heat dissipation.

Optionally, after step 601, the method includes:

Make a cover plate, and form a second capillary structure on one side of the lower cover plate; align the lower cover plate and the lower shell plate to form a box, so that the second capillary structure is accommodated in the Into the second accommodating cavity enclosed between the lower cover plate and the lower shell plate; inject liquid cooling medium into the second accommodating cavity.

In this step, after the lower shell plate 752 is formed, a second capillary structure 759 can be formed on one side of the lower shell plate 752, and then the lower cover plate 757 can be formed, and then the lower cover plate 757 and the The lower shell plate 752 is aligned to form a box, so that the lower cover plate 757 and the lower shell plate 752 together form a first accommodating cavity, and the second capillary structure 759 is accommodated in the Into the second accommodating cavity surrounded by the lower cover plate 757 and the lower shell plate 752, and then inject a liquid heat dissipation medium into the second accommodating cavity, thereby forming a second heat conduction structure, as shown in FIG. 10 , Therefore, after step 602 and step 603, the shielding cover as shown in FIG. 4 can be fabricated.

Specifically, while forming the upper cover plate 756, the lower cover plate 757 can be directly processed by a flat cutting machine, and when the upper cover plate 756 is aligned with the upper shell plate 751 to form a box, The bottom plate of the lower cover plate 757 , the lower shell plate 752 and the side wall 754 located on the bottom plate of the lower shell plate 752 jointly define the second accommodating chamber.

In this embodiment, it is described as an example that the bottom plate of the lower cover plate 757, the lower shell plate 752 and the side wall 754 jointly enclose the second accommodating cavity, but it is not limited thereto. , in other implementation manners, the bottom plate of the lower cover plate 757, the lower shell plate 752 and the first frame body 753 may jointly enclose the second accommodating cavity.

In this embodiment, the second capillary structure 759 is formed on the lower cover plate 757, but it is not limited thereto. In other embodiments, the second capillary structure 759 may also be formed on the lower shell plate 752 Second capillary structure 759 .

Wherein, the liquid heat dissipation medium is heat dissipation medium such as water or methanol.

In this embodiment, the second heat conduction structure is a vacuum structure, and the heat conduction effect of the second heat conduction structure can reach 10000 W/mK.

In this way, by arranging the upper cover plate and the lower cover plate on the shielding cover to form the second heat conduction structure on one side of the lower shell plate, the conduction of temperature can be accelerated, thereby accelerating the heat dissipation.

Optionally, the specific step of forming the lower shell may also include:

A second frame body vertically connected to the bottom plate is formed on a bottom plate, and the first frame body and the second frame body are arranged concentrically; formed between the first frame body and the second frame body Tertiary capillary structure.

In this step, the first frame body 753 and the side wall 754 vertically connected to the bottom plate are formed on a bottom plate, so that while the lower shell plate 752 is formed, the second frame body 753 can also be formed on the bottom plate of the lower shell plate 752. frame body 7510, and make the second frame body 7510 and the first frame body 753 concentrically arranged, and then form a third capillary structure 7511 between the first frame body 753 and the second frame body 7510, As shown in FIG. 11 , after step 602 and step 603 , the shielding cover as shown in FIG. 5 can be fabricated.

In this implementation, the second frame body 7510 is formed on the lower shell plate 752 as an example for illustration, but it is not limited thereto. In other embodiments, it may also be formed on the upper shell plate 751 Forming the second frame body 7510 may also be to form a third sub-frame body on the upper shell plate 751, and form a fourth sub-frame body on the lower shell plate 752, the third sub-frame body and the The fourth sub-frame together constitutes the second frame 7510.

Further, step 602 includes:

Align the upper shell plate 751 and the lower shell plate 752 to form a box, so that the upper shell plate 751, the lower shell plate 752, the first frame body 753 and the second frame body 7510 A storage cavity and a storage cavity are enclosed between them, the storage cavity surrounds the storage cavity and is spaced apart from the storage cavity through the second frame body 7510, wherein the third capillary structure 7511 is located in the storage cavity middle.

In this step, after the upper shell plate 751 and the lower shell plate 752 are manufactured, the upper shell plate 751 and the lower shell plate 752 are aligned to form a box, so that the upper shell plate 751 and the lower shell plate 752 The lower shell 752 is arranged opposite to each other, the first frame 753 and the second frame 7510 are sandwiched between the upper shell 751 and the lower shell 752, the upper shell 751, the The lower shell plate 752 and the second frame body 7510 jointly form a storage cavity, and the upper shell plate 751, the lower shell plate 752, the first frame body 753 and the second frame body 7510 jointly form a storage chamber. a housing cavity, the housing cavity surrounds the housing cavity, and is spaced apart from the housing cavity through the second frame body 7510, and the third capillary structure 7511 is located in the housing cavity, as shown in FIG. 12 .

Further, step 603 includes:

Inject a heat-absorbing phase change material into the accommodating chamber from an opening provided on the second frame body; inject liquid into the accommodating chamber from an opening provided on the upper shell plate and/or the lower shell plate heat dissipation medium.

In this step, after the upper shell plate 751 and the lower shell plate 752 are aligned to form a box, the corresponding substances can be injected into each cavity, specifically, from the second frame body 7510 Inject the endothermic phase-change material 755 into the housing cavity, then seal the opening on the second frame body 7510, and then remove from the upper shell plate 751 and/or the lower shell The opening provided on the plate 752 injects a liquid heat dissipation medium into the accommodating cavity, and then seals the openings on the upper shell plate 751 and/or the lower shell plate 752, thereby forming a shielding cover.

In this way, by arranging the second frame on the shielding cover, a third heat conduction structure is formed between the upper shell plate and the lower shell plate, and around the receiving chamber, so as to speed up the conduction of temperature, thereby accelerating the heat dissipation.

The manufacturing method of the shielding cover, the shielding cover and the mobile terminal provided by the embodiments of the present invention respectively manufacture the upper shell plate and the lower shell plate of the shielding cover; align the upper shell plate and the lower shell plate to form a box, so that A storage cavity is enclosed between the upper shell plate and the lower shell plate; an endothermic phase-change material is injected into the cavity. In this way, by making the upper shell plate and the lower shell plate respectively, aligning the upper shell plate and the lower shell plate to form a box, and injecting the heat-absorbing phase change material into the accommodation cavity surrounded by the upper shell plate and the lower shell plate, thereby Forming the shielding cover not only has better heat dissipation performance, but also because the heat-absorbing phase-change material in the shielding cover can absorb or release a large amount of heat during the phase change, so that the temperature of the outer surface of the shielding cover can rise slowly, which can It can greatly avoid the formation of hot spots caused by the local temperature of the mobile terminal rising too fast, and can reduce the final temperature of the mobile terminal.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. A method for making a shielding cover, characterized in that, the shielding cover is applied to an electronic device of a mobile terminal, and the method comprises: Make the upper shell plate and the lower shell plate of the shielding cover respectively; Aligning the upper shell plate and the lower shell plate to form a box, so that a receiving cavity is formed between the upper shell plate and the lower shell plate; Injecting an endothermic phase change material into the accommodating cavity. 2. The method according to claim 1, characterized in that, after the step of injecting an endothermic phase-change material into the accommodating cavity, the step comprises: Detecting whether the endothermic phase-change material seeps out of the shielding cover; If the heat-absorbing phase-change material does not seep out of the shielding cover, it is determined that the shielding cover is qualified. 3. The method according to claim 2, wherein the step of detecting whether the endothermic phase-change material seeps out of the shielding cover comprises: The shielding cover is placed in an environment with a temperature of 55°C to 65°C for 25 minutes to 35 minutes, and it is determined whether there is leakage of the phase-changing material. 4. The method according to claim 1, characterized in that, after the step of making the upper shell plate and the lower shell plate of the shielding cover respectively, the method comprises: forming a first capillary structure on one side of the upper shell; making an upper cover plate, and aligning the upper cover plate and the upper shell plate to form a box, so that the first capillary structure is accommodated between the upper shell plate and the upper cover plate to form a in the first accommodation chamber; A liquid cooling medium is injected into the first accommodating cavity. 5. The method according to claim 1, characterized in that, after the step of making the upper shell plate and the lower shell plate of the shielding cover respectively, the method comprises: making a cover plate, and forming a second capillary structure on one side of the lower cover plate; aligning the lower cover plate and the lower shell plate to form a box, so that the second capillary structure is accommodated in a second accommodating cavity enclosed between the lower cover plate and the lower shell plate ; A liquid cooling medium is injected into the second accommodating cavity. 6. The method according to claim 1, wherein the specific steps of forming the upper shell and/or the lower shell are: Forming a first frame body and a second frame body vertically connected to the bottom plate on a bottom plate, the first frame body and the second frame body are arranged concentrically; A third capillary structure is formed between the first frame body and the second frame body. 7. The method according to claim 6, characterized in that, aligning the upper shell and the lower shell to form a box, so that the upper shell and the lower shell are surrounded by The steps of forming a containment chamber include: Aligning the upper shell plate and the lower shell plate to form a box, so that the upper shell plate, the lower shell plate, the first frame body and the second frame body form a storage cavity and an accommodating cavity, the accommodating cavity surrounds the accommodating cavity and is spaced apart from the accommodating cavity through the second frame body, wherein the third capillary structure is located in the accommodating cavity. 8. The method according to claim 7, wherein the step of injecting an endothermic phase-change material into the accommodating cavity comprises; injecting an endothermic phase-change material into the accommodating cavity from an opening provided on the second frame; The liquid cooling medium is injected into the accommodating cavity from openings provided on the upper shell and/or the lower shell. 9. A shielding cover, characterized in that the shielding cover comprises an upper shell plate, a lower shell plate, a first frame body, a side wall, and a heat-absorbing phase change material, and the upper shell plate is opposite to the lower shell plate The first frame is sandwiched between the upper shell and the lower shell, the side wall is located on the side of the lower shell away from the upper shell, and the heat-absorbing phase change material It is filled in the accommodation cavity jointly surrounded by the upper shell plate, the lower shell plate and the first frame body. 10. A mobile terminal, characterized in that the mobile terminal comprises the shielding cover according to claim 9.