CN108429047B - Signal transmission device and signal compatible design method applied to same - Google Patents
Signal transmission device and signal compatible design method applied to same Download PDFInfo
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- CN108429047B CN108429047B CN201810212542.3A CN201810212542A CN108429047B CN 108429047 B CN108429047 B CN 108429047B CN 201810212542 A CN201810212542 A CN 201810212542A CN 108429047 B CN108429047 B CN 108429047B
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- signal
- signal transmission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
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- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a signal transmission device and a signal compatible design method applied to the signal transmission device, which are used for improving the signal transmission quality. The signal transmission device includes: the circuit board body, set up the signal source on the circuit board body to and the signal transmission circuit who is connected with the signal source, wherein: the signal transmission circuit comprises a first bonding pad and a second bonding pad which are sequentially connected through a signal transmission line along the direction far away from the signal source; the first bonding pad comprises a first bonding pad part and a second bonding pad part which are arranged at intervals along the direction far away from the signal source; the first pad part and the second pad are used for being connected with corresponding signal output interface devices; the signal transmission paths of the signal output interface devices corresponding to the first bonding pad part and the second bonding pad part are different.
Description
Technical Field
The present invention relates to the field of communications equipment technologies, and in particular, to a signal transmission apparatus and a signal compatibility design method applied thereto.
Background
Currently, in circuit design, some devices need to be designed compatibly, for example, compatible designs that achieve different signal outputs.
As shown in fig. 1, in order to implement a signal compatible design of a device in the prior art, a pin pad 03 for accessing a second signal output interface device is generally disposed in a signal path between a signal source 01 and a first signal output interface device 02, and when a signal needs to be output by using the second signal output interface device, a path between the two signal output interface devices needs to be disconnected after a pin of the second signal output interface device is soldered to the pin pad 03. At present, a resistor 04 is generally connected in series between two signal output interface devices through a compatible resistor pad 06, so that when the first signal output interface device 02 is used for signal output, the resistor 04 is connected into a signal path; as shown in fig. 2, when the second signal output interface device 07 is used for signal output, it is necessary to solder the pin of the second signal output interface device 07 to the pin pad 03 and disconnect the resistor 04 from the compatible resistor pad 06.
The problems existing in the prior art are that: when the second signal output interface device 07 is used to output a signal, a section of trace 05 exists between the second signal output interface device 07 and the resistor 04, and due to the influence of the section of trace 05, a part of the signal transmitted to the second signal output interface device 07 is transmitted to the section of trace 05, which may affect impedance matching of a path, thereby affecting signal quality.
Disclosure of Invention
An embodiment of the present invention provides a signal transmission apparatus and a signal compatibility design method applied thereto, so as to improve signal transmission quality.
In one aspect of the present invention, there is provided a signal transmission apparatus including: the circuit board body, set up in signal source on the circuit board body to and with the signal transmission circuit that the signal source is connected, wherein:
the signal transmission circuit comprises a first bonding pad and a second bonding pad which are sequentially connected through a signal transmission line along the direction far away from the signal source;
the first bonding pad comprises a first bonding pad part and a second bonding pad part which are arranged at intervals along the direction far away from the signal source;
the first bonding pad part and the second bonding pad are used for being connected with corresponding signal output interface devices; the signal transmission paths of the signal output interface devices corresponding to the first bonding pad part and the second bonding pad part are different.
Optionally, when each of the signal transmission circuits includes a plurality of the first pads, signal transmission paths of signal output interface devices respectively corresponding to any two of the first pad portions are different.
Optionally, the signal source includes a signal sending module or a signal receiving module.
Optionally, the number of the signal transmission circuits connected to the signal source is multiple.
Preferably, the first pad portion has an area larger than that of the second pad portion.
Optionally, an area ratio of the first pad portion to the second pad portion is greater than or equal to 4.
Preferably, a gap between the first pad part and the second pad part is 0.5mm or less.
Optionally, the solder is tin-lead solder, silver solder or copper solder.
According to the signal transmission device adopting the technical scheme, the first bonding pad connected with the corresponding signal output interface device is composed of the two bonding pad parts arranged at intervals, so that when the selected signal output interface device is required to be connected with the corresponding first bonding pad, only the pin of the signal output interface device is required to be welded with the first bonding pad part through the solder. And because in the subsequent heating process, the solder is adsorbed on the pin and the first pad part, so that the first pad part and the second pad part which are separated from each other are not connected, and when the first pad is arranged between the signal output interface device connected into the signal transmission device and the signal source, the first pad part and the second pad part of the first pad can be connected through the solder. Compared with the prior art, the signal transmission device has the advantages that signals are directly transmitted from the signal source to the signal output interface device and then to the external equipment, and the signal transmission is less interfered, so the signal transmission quality is better.
In another aspect of the present invention, there is also provided a signal compatibility designing method applied to the signal transmission apparatus, including:
correspondingly welding pins of the selected signal output interface device with the corresponding first pad parts of the signal transmission circuit one by one, or correspondingly welding pins of the selected signal output interface device with the corresponding second pad parts of the signal transmission circuit one by one;
when the first pad is included between the selected signal output interface device and the signal source, the first pad part and the second pad part of the first pad are connected by solder.
According to the signal compatibility design method, the pins of the selected signal output interface device and the corresponding first pad parts are welded through the solder, so that the solder is adsorbed to the pins and the first pad parts in the subsequent heating process, the first pad parts and the second pad parts which are spaced are not connected, and when the first pad is arranged between the signal output interface device connected into the signal transmission device and a signal source, the first pad parts and the second pad parts of the first pad can be connected through the solder. Compared with the prior art, the signal transmission device obtained by the connection method has better signal transmission quality because the signal is directly transmitted from the signal source to the signal output interface device and then to the external equipment and the signal transmission is less interfered.
Drawings
Fig. 1 is a schematic diagram illustrating a signal compatibility design of a signal transmission apparatus according to an embodiment of the prior art;
FIG. 2 is a schematic diagram of a signal compatible design of a signal transmission apparatus according to another embodiment of the prior art;
fig. 3 is a schematic structural diagram of a signal transmission apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a signal compatible design of a signal transmission apparatus according to an embodiment of the present invention;
fig. 5 is a partial structural diagram of a signal compatible design of a signal transmission apparatus according to an embodiment of the invention;
fig. 6 is a partial structural diagram of a signal compatible design of a signal transmission apparatus according to another embodiment of the invention.
Reference numerals:
the prior art comprises the following steps:
01-a signal source; 02-first signal output interface device; 03-a pin pad;
04-resistance; 05-routing; 06-compatible resistance pads; 07-a second signal output interface device.
The invention comprises the following parts:
1-a circuit board body; 2-a signal source; 3-a first pad;
4-a second pad; 5-a first pad portion; 6-a second pad portion;
7-signal output interface device; 8-pin; 9-a signal transmission circuit;
10-solder.
Detailed Description
In order to improve signal transmission quality, embodiments of the present invention provide a signal transmission apparatus and a signal compatible design method applied thereto. In order to make the objects, technical solutions and advantages of the present invention more clear, the present invention is further described in detail by referring to examples below.
As shown in fig. 3, in one aspect of the present invention, there is provided a signal transmission apparatus including: circuit board body 1, set up signal source 2 on circuit board body 1 to and the signal transmission circuit 9 of being connected with signal source 2, wherein:
the signal transmission circuit 9 comprises a first bonding pad 3 and a second bonding pad 4 which are sequentially connected along the direction far away from the signal source 2;
the first pad 3 comprises a first pad part 5 and a second pad part 6 which are arranged at intervals along the direction far away from the signal source 2;
the first pad part 5 and the second pad 4 are used for connecting with corresponding signal output interface devices; the signal transmission paths of the signal output interface devices corresponding to the first pad part 5 and the second pad part 4 are different.
In embodiments of the present invention, the number of first pads may be selected according to the type of signal to be compatibly designed and the quality of the signal transmission. The type of the signal source is not limited, and the signal source may be a signal sending module or a signal receiving module.
According to the signal transmission device adopting the technical scheme, the first bonding pad 3 connected with the corresponding signal output interface device is composed of the two bonding pad parts arranged at intervals, so that when the selected signal output interface device is required to be connected with the corresponding first bonding pad 3, only the pin of the signal output interface device is required to be welded with the first bonding pad part 5 through the solder. As shown in fig. 5, because the fluidity of the solder is enhanced in the subsequent heating process of the signal transmission device, the solder flows along the leads due to the surface tension of the solder and the adsorption of the solder by the first land portions, so that the connection of the spaced first land portions 5 and the spaced second land portions 6 is effectively prevented. As shown in fig. 4, when the first pad 3 is further disposed between the signal output interface device 7 connected into the signal transmission apparatus and the signal source 2, the first pad portion 5 and the second pad portion 6 of the first pad 3 can be connected by solder, and the connection result can be seen in a partial structural schematic diagram of the signal compatible design of the signal transmission apparatus shown in fig. 6. Compared with the prior art, when the signal source 2 is a signal sending module, because the signal is directly transmitted from the signal source 2 to the signal output interface device 7 and then to the external device, the signal transmission is less interfered, and therefore the signal transmission quality of the signal transmission device is better. In the same way, when the signal source is the signal receiving module, the signal transmission quality of the signal transmission device is better.
As shown in fig. 3 and 4, in an alternative embodiment of the present invention, when each signal transmission circuit 9 includes a plurality of first pads 3, signal transmission paths of signal output interface devices respectively corresponding to any two first pad portions 5 are different.
As shown in fig. 3 and 4, in various alternative embodiments of the present invention, the number of the signal transmission circuits 9 is selected according to specific requirements, wherein, the number of the signal transmission circuits may be multiple. It should be noted that the number of the pins 8 of the selected signal output interface device 7 may be the same as or different from the number of the signal transmission circuits 9, and the skilled person may select the number according to the specific requirements.
As shown in fig. 3 and 4, in a preferred embodiment of the present invention, the area of the first pad portion 5 is larger than that of the second pad portion 6. This can effectively increase the reliability of the bonding of the pins 8 of the signal output interface device 7 and the first pad portion 5.
As shown in fig. 3 and 4, the area ratio of the first pad portion 5 to the second pad portion 6 is optionally 4 or more. Therefore, under the condition of ensuring the welding reliability of the pin 8 of the signal output interface device 7 and the first pad part 5, the adsorption capacity of the first pad part 5 to the solder can be enhanced, so that the phenomenon that the solder on the first pad part 5 flows to the second pad part 6 to cause the connection of the two pad parts is effectively avoided.
As shown in fig. 4, in another preferred embodiment of the present invention, a gap between the first pad portion 5 and the second pad portion 6 is 0.5mm or less. When the gap between the first pad part 5 and the second pad part 6 satisfies the range condition, the first pad part 5 and the second pad part 6 which need to be connected can be connected only by the solder 10 coated on the welding surface of the first pad part 5 and the second pad part 6, thereby simplifying the process and reducing the cost.
In the embodiments of the present invention, the specific type of solder is not limited, and may be tin-lead solder, silver solder, or copper solder.
Based on the same inventive concept, as shown in fig. 4, another aspect of the present invention also provides a signal compatibility design method applied to the signal transmission apparatus as described above, including:
correspondingly welding pins 8 of the selected signal output interface device 7 with the first pad parts 5 of the corresponding signal transmission circuit one by one, or correspondingly welding pins 8 of the selected signal output interface device 7 with the second pad parts 4 of the corresponding signal transmission circuit one by one;
when the first pad 3 is included between the selected signal output interface device 7 and the signal source 2, the first pad part 5 and the second pad part 6 of the first pad 3 are connected by solder 10.
As shown in fig. 4, fig. 4 is a schematic structural diagram of a signal compatible design of a signal transmission device according to an embodiment of the present invention. By adopting the signal compatible design method of the technical scheme, the pins 8 of the selected signal output interface device 7 and the corresponding first pad parts 5 are welded by the solder, because the fluidity of the solder is enhanced in the subsequent heating process of the signal transmission device, at this time, as shown in fig. 5, the solder flows along the pins due to the surface tension of the solder and the enhancement of the adsorption capacity of the first pad parts to the solder, so that the connection of the first pad parts 5 and the second pad parts 6 which are spaced apart can be effectively prevented.
As shown in fig. 4, when the first pad 3 is disposed between the signal output interface device 7 connected into the signal transmission device and the signal source 2, and the signal transmission device is heated in the subsequent process, because the fluidity of the solder is enhanced, the first pad portion 5 and the second pad portion 6 of the first pad 3 are connected by the solder 10 on the pad soldering surface, of course, the first pad portion 5 and the second pad portion 6 of the first pad 3 can also be connected by adding the solder, and the connection result can refer to the partial structure schematic diagram of the signal compatible design of the signal transmission device shown in fig. 6. Compared with the prior art, the signal transmission device obtained by the connection method has better signal transmission quality because the signal is directly transmitted from the signal source 2 to the signal output interface device 7 and then to the external equipment when the signal source is a signal sending module. In the same way, when the signal source is the signal receiving module, the signal transmission quality of the signal transmission device is better.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (7)
1. A signal transmission apparatus, comprising: the circuit board body, set up in signal source on the circuit board body to and with the signal transmission circuit that the signal source is connected, wherein:
the signal transmission circuit comprises a first bonding pad and a second bonding pad which are sequentially connected through a signal transmission line along the direction far away from the signal source;
the first bonding pad comprises a first bonding pad part and a second bonding pad part which are arranged at intervals along the direction far away from the signal source;
the first bonding pad part and the second bonding pad are used for being connected with corresponding signal output interface devices; the signal transmission paths of the signal output interface devices corresponding to the first bonding pad part and the second bonding pad part are different;
wherein a gap between the first pad part and the second pad part is less than or equal to 0.5 mm;
when each of the signal transmission circuits includes a plurality of the first pads, signal transmission paths of signal output interface devices respectively corresponding to any two of the first pad portions are different.
2. The signal transmission apparatus of claim 1, wherein the signal source comprises a signal transmitting module or a signal receiving module.
3. The signal transmission device according to claim 1, wherein the signal transmission circuit is plural.
4. The signal transmission device according to claim 1, wherein an area of the first pad portion is larger than an area of the second pad portion.
5. The signal transmission device according to claim 4, wherein an area ratio of the first pad portion to the second pad portion is 4 or more.
6. The signal transmission device according to any one of claims 1 to 5, wherein the signal output interface device is soldered to the first land portion by a solder, the first land portion and the second land portion of the first land portion are connected by a solder, and the solder is a tin-lead solder, a silver solder or a copper solder.
7. A signal compatibility design method applied to the signal transmission device according to any one of claims 1 to 6, characterized by comprising:
correspondingly welding pins of the selected signal output interface device with the corresponding first pad parts of the signal transmission circuit one by one, or correspondingly welding pins of the selected signal output interface device with the corresponding second pad parts of the signal transmission circuit one by one;
when the first pad is included between the selected signal output interface device and the signal source, the first pad part and the second pad part of the first pad are connected by solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810212542.3A CN108429047B (en) | 2018-03-15 | 2018-03-15 | Signal transmission device and signal compatible design method applied to same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810212542.3A CN108429047B (en) | 2018-03-15 | 2018-03-15 | Signal transmission device and signal compatible design method applied to same |
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| CN108429047A CN108429047A (en) | 2018-08-21 |
| CN108429047B true CN108429047B (en) | 2020-11-20 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| SG135183A1 (en) * | 2004-02-13 | 2007-09-28 | Molex Inc | Preferential ground and via exit structures for printed circuit boards |
| CN201142785Y (en) * | 2007-12-14 | 2008-10-29 | 福建星网锐捷网络有限公司 | Differential pairs compatible circuit board |
| CN101636040B (en) * | 2008-07-21 | 2011-12-14 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN201813608U (en) * | 2010-09-07 | 2011-04-27 | 四川九洲电器集团有限责任公司 | PCB (printed circuit board) structure used for processing radio-frequency signals |
| CN102573270B (en) * | 2010-12-10 | 2016-08-03 | 国网山东省电力公司烟台供电公司 | There is the printed circuit board (PCB) of high-speed differential signal wiring structure |
| CN104113355B (en) * | 2013-04-19 | 2017-01-11 | 联发科技（新加坡）私人有限公司 | Electronic device |
| CN104158025A (en) * | 2014-08-26 | 2014-11-19 | 苏州祥龙嘉业电子科技有限公司 | Connector socket used for transmitting high-definition digital signals |
| JP6365309B2 (en) * | 2015-01-07 | 2018-08-01 | 日立金属株式会社 | High-speed transmission cable module |
| CN105680899B (en) * | 2016-03-09 | 2018-08-24 | 宁波萨瑞通讯有限公司 | The realization system and method for frequency range compatibility |
| CN206413247U (en) * | 2016-12-26 | 2017-08-15 | 北京小鸟看看科技有限公司 | A kind of electronic circuit |
| CN106793475A (en) * | 2017-01-24 | 2017-05-31 | 广东欧珀移动通信有限公司 | Printed circuit boards and mobile terminals |
| CN107331995A (en) * | 2017-03-31 | 2017-11-07 | 安费诺商用电子产品(成都)有限公司 | Small spacing high speed Orthogonal back panel connector |
| TWM552685U (en) * | 2017-06-14 | 2017-12-01 | Cvilux Corp | Electrical connector assembly and its adapter board |
| CN206923141U (en) * | 2017-06-23 | 2018-01-23 | 中兴通讯股份有限公司 | Circuit board and mobile terminal |
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Address after: 266555 Qingdao economic and Technological Development Zone, Shandong, Hong Kong Road, No. 218 Applicant after: Hisense Visual Technology Co., Ltd. Address before: 266100 Zhuzhou Road, Laoshan District, Shandong, No. 151, No. Applicant before: QINGDAO HISENSE ELECTRONICS Co.,Ltd. |
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