Drawings
FIG. 1 is a block diagram of an automatic repair circuit of a memory according to a first embodiment of the present invention.
FIG. 2 is a block diagram of an automatic repair circuit of a memory according to a second embodiment of the present invention.
FIG. 3 is a block diagram of an automatic repair circuit of a memory according to a third embodiment of the present invention.
FIG. 4 is a block diagram of an automatic repair circuit of a memory according to a fourth embodiment of the present invention.
[ notation ] to show
100 memory automatic repair circuit
101 decoding circuit
102 inspection circuit
103 latch enable circuit
104 latch circuit
105E type fuse circuit
200 memory automatic repair circuit
201 decoding circuit
202 inspection circuit
203 latch enable circuit
204_1, 204_2 latch circuit
205_1, 205_ 2E type fuse circuit
206 comparison circuit
300 memory automatic repair circuit
301 decoding circuit
302 checking circuit
303 latch enable circuit
304_1, 304_2 latch circuit
305_1, 305_ 2E type fuse circuit
306 comparison circuit
400 memory automatic repair circuit
401 decoding circuit
402 checking circuit
403 latch enabling circuit
404_1, 404_2 latch circuit
405_1, 405_ 2E type fuse circuit
406 comparison circuit
Detailed Description
Certain terms are used throughout the description and following claims to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This description and the appended claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. Also, the term "coupled" is used herein to encompass any direct or indirect electrical connection. Thus, if a first device couples to a second device, that connection may be through a direct electrical connection, or through an indirect electrical connection via other devices and connections.
FIG. 1 is a block diagram of an automatic repair circuit of a memory according to a first embodiment of the present invention. Referring to fig. 1, the automatic repair circuit 100 includes a decoding circuit 101, a checking circuit 102, a latch enable circuit 103, a latch circuit 104 and an E-type fuse circuit 105.
The decoding circuit 101 is configured to receive an input address (e.g., the input address a1 of fig. 1) and perform decoding according to whether the input address a1 is the same as one of the bad addresses FAm-FAn. When the input address a1 is the same as one of the bad addresses FAm-FAn, the decoding circuit 101 selects a redundant word line previously assigned to the bad address instead of a normal word line. These defective addresses FAm through FAn are usually stored in a plurality of E-type fuse circuits. For simplicity, only one E-type fuse circuit 105 is shown in this embodiment.
Referring to fig. 1, when the input address a1 is identical to one of the bad addresses FAm-FAn, the decoding circuit 101 generates a control signal CS. The check circuit 102 receives and checks the input address a1 to determine whether the input address a1 corresponds to a word line having a defect. The check circuit 102 generates a check result IR to the latch enable circuit 103. In the present embodiment, the check circuit 102 is located in the automatic memory repair circuit 100. In other embodiments, however, the check circuit 102 is external to the memory auto-repair circuit 100. The checking circuit 102 may be in various forms of hardware, software, or firmware.
The latch enable circuit 103 is configured to selectively generate an enable signal EN1 according to the control signal CS and the check result IR. When the control signal CS is asserted, indicating that the input address a1 is identical to one of the bad addresses FAm-FAn, the latch enable circuit 103 prevents the enable signal EN1 from being transmitted to the latch circuit 104. When the check result IR is generated, indicating that the input address a1 does not correspond to a word line with defects, the latch enable circuit 103 prevents the enable signal EN1 from being transmitted to the latch circuit 104. In other cases, the enable signal EN1 is sent from the latch enable circuit 103 to the latch circuit 104. The latch circuit 104 is configured to receive the input address a1 and store the input address a1 to the E-fuse circuit 105 as a bad address FA1 after receiving the enable signal EN 1. When the bad address FA1 is stored by the E-fuse circuit 105, the decoding circuit 101 compares the input address A1 with the defective address FA1 after receiving the input address A1. Since both are the same, the decoding circuit 101 selects a redundancy word line RWL1 corresponding to the defect address FA1 to be turned on.
Further, the automatic repair circuit 100 has three conditions during operation. In the first situation, when the input address A1 is different from one of the bad addresses FAm-FAn, and the check result IR indicates that the input address A1 does not correspond to a word line having a defect, the latch enable circuit 103 prevents the enable signal EN1 from being transmitted to the latch circuit 104. Therefore, the latch circuit 104 does not store the input address a1 as a bad address. The decoding circuit 101 decodes the input address a1 and accesses a normal word line WL1 corresponding to the input address a 1. In the second situation, when the input address a1 is identical to one of the bad addresses FAm-FAn, the control signal CS is generated to the latch enable circuit 103, such that the enable signal EN1 is not transmitted to the latch circuit 104. Therefore, the latch circuit 104 does not store the input address a 1. The decoding circuit 101, upon receiving the input address a1 for decoding, selects a redundant word line previously assigned to the bad address. In a third situation, when the input address A1 is different from one of the bad addresses FAm FAn, and the checking result IR indicates that the input address A1 corresponds to a word line having a defect, the latch enable circuit 103 generates the enable signal EN1 to the latch circuit 104. Therefore, the latch circuit 104 stores the input address a1 to the E-type fuse circuit 105 as a bad address FA 1. The decoding circuit 101 receives the input address a1 and then selects the redundancy word line RWL1 corresponding to the bad address FA1 to be turned on.
FIG. 2 is a block diagram of an automatic repair circuit 200 for a memory according to a second embodiment of the present invention. Referring to fig. 2, the automatic repair circuit 200 includes a decoding circuit 201, a checking circuit 202, a latch enable circuit 203, two latch circuits 204_1 and 204_2, two E-type fuse circuits 205_1 and 205_2, and a comparison circuit 206.
In the present embodiment, the input address A1 has been stored in the latch circuit 204_1 according to the enable signal EN1, so the defective address FA1 is stored by the E-type fuse circuit 205_ 1. The decoding circuit 201 is configured to receive an input address (e.g., the input address a2 of fig. 2) and perform decoding according to whether the input address a2 is the same as one of the bad addresses FAm-FAn. When the input address A2 is the same as one of the bad addresses FAm-FAn, the decoding circuit 201 selects a redundant word line previously assigned to the bad address.
In addition, when the input address a2 is identical to one of the bad addresses FAm-FAn, the decoding circuit 201 generates the control signal CS. The check circuit 202 receives and checks the input address a2 to determine whether the input address a2 corresponds to a word line having a defect. The check circuit 202 generates the check result IR to the latch enable circuit 203.
The comparing circuit 206 is used for comparing the input address a1 with the input address a2 to generate a comparison signal COM. The latch enable circuit 203 is configured to selectively generate an enable signal EN2 according to the control signal CS, the check result IR and the comparison signal COM. When the control signal CS is asserted, indicating that the input address a2 is identical to one of the bad addresses FAm-FAn, the latch enable circuit 203 prevents the enable signal EN2 from being asserted. When the check result IR is generated, indicating that the input address a2 does not correspond to a word line having a defect, the latch enable circuit 203 prevents the enable signal EN2 from being transmitted. When the comparison circuit 260 compares the input address A2 and finds the same address A1 previously stored in the latch circuit 204_1, the latch enable circuit 203 prevents the enabling signal EN2 from being transmitted. In other cases, the enable signal EN2 is sent from the latch enable circuit 203 to the latch circuit 204_ 2. After receiving the input address a2, the latch circuit 204_2 stores the input address a2 to the E-fuse circuit 205_2 as a bad address FA2 according to the enable signal EN 2. After the bad address FA2 is stored in the E-fuse circuit 205_2, after the decoding circuit 201 receives the input address a2, if the input address a2 is the same as the bad address FA2, the decoding circuit 201 selects a redundant word line RWL2 corresponding to the bad address FA2 to be turned on.
Further, the automatic repair circuit 200 has four conditions during operation. In the first situation, when the comparison signal COM indicates that the input address a2 is different from the input address a1, the input address a2 is different from one of the bad addresses FAm-FAn, and the check result IR indicates that the input address a2 does not correspond to a word line having a defect, the latch enable circuit 203 prevents the enable signal EN2 from being transmitted to the latch circuit 204_ 2. Therefore, the latch circuit 204_2 does not store the input address a2 as a bad address. The decoding circuit 201 decodes the input address a2 and accesses a normal word line WL2 corresponding to the input address a 2. In the second situation, when the comparison signal COM indicates that the input address a2 is different from the input address a1 and the input address a2 is the same as one of the bad addresses FAm-FAn, the control signal CS is generated to the latch enable circuit 203 such that the enable signal EN2 is not transmitted to the latch circuit 204_ 2. Therefore, the latch circuit 204_2 does not store the input address a2 as a bad address. The decoding circuit 201 receives the input address a2 for decoding, and selects a redundant word line previously assigned to the bad address. In a third situation, when the comparison signal COM indicates that the input address a2 is different from the input address a1, the input address a2 is different from one of the bad addresses FAm-FAn, and the check result IR indicates that the input address a2 corresponds to a word line with a defect, the latch enable circuit 203 generates the enable signal EN2 to the latch circuit 204_ 2. Therefore, the latch circuit 204_2 stores the input address A2 to the E-type fuse circuit 205_2 as a defective address FA 2. The decoding circuit 201 receives the input address a2 and then selects the redundant word line RWL2 corresponding to the defective address FA2 to be turned on. In the last case, when the comparison signal COM indicates that the input address A2 is the same as the input address A1, the latch enable circuit 203 does not generate the enable signal EN2 to the latch circuit 204_ 2. Therefore, the latch circuit 204_2 does not store the input address a 2. The decoding circuit 201 receives the input address a2 and then selects the redundancy word line RWL1 corresponding to the bad address FA1 to be turned on. With the control signal CS and the comparison signal COM, the decoding circuit 201 only accesses a normal word line or a redundant word line according to an input address.
FIG. 3 is a block diagram of an automatic repair circuit of a memory according to a third embodiment of the present invention. Referring to fig. 3, the automatic repair circuit 300 includes a decoding circuit 301, a checking circuit 302, a latch enable circuit 303, two latch circuits 304_1 and 304_2, two E-type fuse circuits 305_1 and 305_2, and a comparison circuit 306. The operation principle of the checking circuit 302, the latch enable circuit 303, the latch circuits 304_1 and 304_2, the E-type fuse circuits 305_1 and 305_2, and the comparing circuit 306 is the same as that of the embodiment shown in fig. 2. The difference between the second embodiment and the third embodiment is that when the input address A1 is stored in the E-fuse circuit 305_1 as the bad address FA1, the E-fuse circuit 305_1 generates a blowing signal B1 to the latch circuit 304_ 1. When the fuse signal B1 is received by the latch circuit 304_1, the latch circuit 304_1 will not store any more input addresses. Similarly, when the input address A2 is stored in the E-fuse circuit 305_2 as the bad address FA2, the E-fuse circuit 305_2 generates a blowing signal B2 to the latch circuit 304_ 2. When the fuse signal B2 is received by the latch circuit 304_2, the latch circuit 304_2 will not store any more input addresses.
Then, after the power of the automatic memory repair circuit 300 is interrupted and the power is restored, if the E-fuse circuits 305_1 and 305_2 have stored the defective addresses FA1 and FA2 by the blowing signals B1 and B2, the latch circuits 304_1 and 304_2 will not store any more input addresses, thereby avoiding the problem of repeated selection.
FIG. 4 is a block diagram of an automatic repair circuit 400 for a memory according to a fourth embodiment of the present invention. Referring to fig. 4, the automatic repair circuit 400 includes a decoding circuit 401, a checking circuit 402, a latch enable circuit 403, two latch circuits 404_1 and 404_2, two E-type fuse circuits 405_1 and 405_2, and a comparison circuit 406. The operation principle of the decoding circuit 401, the checking circuit 402, the latch enable circuit 403, the latch circuits 404_1 and 404_2, the E-type fuse circuits 405_1 and 405_2, and the comparison circuit 406 is the same as that of the embodiment shown in fig. 2 and 3. The difference between the fourth embodiment and the former embodiment is that the latch circuits 404_1 and 404_2 are used for storing a specific address, such as the specific addresses SA1 and SA2 shown in FIG. 4, instead of storing the input addresses A1 and A2. Referring to FIG. 4, after the latch enable circuit 403 receives an Active Command (ACT) and test mode commands RT1/RT2, the memory automatic repair circuit 400 enters a specific test mode. During a specific test mode, the latch enable circuit 403 ignores the check result IR and the comparison signal COM, generates the enable signal EN1 in response to the test mode command RT1 and generates the enable signal EN2 in response to the test mode command RT 2. Then, the latch circuit 404_1 stores the address SA1 specified by the active command ACT when the enable signal EN1 is asserted, and the latch circuit 404_2 stores the address SA2 specified by the active command ACT instead of the bad address when the enable signal EN2 is asserted.
In the above embodiments, the addresses received by the decoding circuit, the checking circuit, the latching circuit and the comparing circuit in fig. 1 to 4 are row addresses (row addresses), and the decoding circuit only selects a normal word line or a redundant word line to be turned on according to the row addresses. However, the present invention should not be limited thereto. The decoding circuit, the checking circuit, the latch circuit and the comparison circuit can receive a column address, and the decoding circuit can access a normal bit line or a redundant bit line to be opened according to the column address. By generating the control signal CS, the comparison signal COM and the check result IR, the automatic repair circuit of the memory disclosed in the present invention can avoid the problem of repeated selection.
While the technical content and the technical features of the invention have been disclosed, those skilled in the art can make various substitutions and modifications based on the teaching and the disclosure of the invention without departing from the spirit of the invention. Accordingly, the scope of the present invention should not be limited to the embodiments disclosed, but should include various alternatives and modifications without departing from the invention, which are encompassed by the appended claims.