CN108255020A - Penetration type laser direct imaging system - Google Patents
Penetration type laser direct imaging system Download PDFInfo
- Publication number
- CN108255020A CN108255020A CN201710057512.5A CN201710057512A CN108255020A CN 108255020 A CN108255020 A CN 108255020A CN 201710057512 A CN201710057512 A CN 201710057512A CN 108255020 A CN108255020 A CN 108255020A
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- laser
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- imaging system
- penetration
- module
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- 238000003384 imaging method Methods 0.000 title claims abstract description 27
- 230000035515 penetration Effects 0.000 title claims description 25
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000003287 optical effect Effects 0.000 claims description 13
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract 3
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
- G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention relates to a transmission laser direct imaging system, which mainly comprises a carrying platform and a laser exposure device which can be relatively displaced in a Y direction, the laser exposure device can scan the substrate on the carrying platform in an X direction to form a latent image pattern on the substrate, and in particular, the laser exposure device is provided with a laser module, it includes a linear laser source and a transmission scanner, the length direction of the linear laser source is inclined to the X direction, the transmission scanner has a polygon mirror, the rotation axis is parallel to the length direction of the linear laser light source, in addition, during the rotation, the facets of the polygon prism allow each laser beam to penetrate and form an inclined strip-shaped exposure spot on the substrate, and projections of exposure spots formed by two adjacent laser beams in the X direction are partially overlapped. The invention can greatly reduce the equipment cost and greatly improve the scanning speed.
Description
Technical field
The present invention is about a kind of laser direct imaging system (Laser Direct Imaging System, LDI), especially
It is a kind of laser direct imaging system being imaged using linear scanning mode.
Background technology
In recent years, the requirement of precision is continuously improved in the manufacturing process of printed circuit board (PCB) so that tradition connects
Touching printing manufacturing process can not gradually meet the requirements.In this regard, many printed circuit board manufacturers transfer to use direct imaging optics
(LDI system) is to solve the problems, such as yield rate and output capacity.Compared to traditional photoetching technique, this laser direct imaging system
System can in the case of without using mask, and circuit board circuit pattern data be sent into computer after can be directly on substrate
To manufacture circuit board, so far not only precision is substantially improved the corresponding required circuit pattern of write-in, and can effectively reduce and be produced into
This.
TaiWan, China patent the 523968th discloses a kind of Direct Laser imaging system, can be under no mask use, directly
It is connected on a substrate surface and forms a latent image pattern (latent image).Wherein, which mainly includes
One laser light source and the reflective scanner between the laser light source and substrate.The laser light source is loaded with to export one
The laser beam of image information.The reflective scanner has a polygonal mirror, and substrate is scanned in rotation, to be formed
The latent image pattern.
It is worth noting that, the scan method of conventional reflective can generate shortcomings.First, as shown in figure 11, make
During with reflective polygonal mirror 9, the height change of substrate 4 can cause the position offset of focus point F3, F4, its latent image figure of related influence
The image quality of case.Furthermore as shown in figure 12, traditional mirror 91 can be because minute surface 91 rotates to the focus point F of laser beam 92
Angle and it is different, substrate 4 is caused to generate image peripheral situation out of focus when being imaged.To improve this shortcomings, in aforementioned
Direct Laser picture system shown in state's Taiwan Patent is to be set on the optical path between the reflective scanner and substrate
A f-theta lens (F-theta lens) are put to make corrections, use raising image quality.
Invention content
Be different from previous reflective laser direct imaging optics, the present invention provide a kind of new penetration laser directly into
It, can be to avoid out of focus or focal shift of reflective scanner etc. by the scanner of its penetration come direct imaging as system
Problem, and its optical system arranged in pairs or groups also is greatly simplified, and is able to that equipment cost is greatly reduced.In addition, the present invention penetrates
The laser explosure device of formula laser direct imaging system uses the linear scanning mode of rows of more laser diodes, more can be with
Greatly improve sweep speed.
Specifically, penetration laser direct imaging system of the present invention mainly includes a microscope carrier and a laser explosure device.
The microscope carrier has a photosensitive layer for one substrate of carrying, the base plate coating.The laser explosure device can be with the microscope carrier in phase in a Y-direction
To displacement, and can be during relative displacement in photosensitive layer linear scan of the X-direction to the substrate, on the photosensitive layer
Form a latent image pattern.
In detail, which has a first laser module, and it is linear which mainly includes one
Laser light source, an optical module and a penetration scanner.The linear laser light source includes multiple laser diodes, along its length
Direction is alternatively arranged, and to export the multiple tracks laser beam being mutually parallel, and the length direction of the linear laser light source favours X
Direction.The optical module has multiple focusing lens units, to respectively correspondingly by multiple laser beam focusing to the base
Plate.The penetration scanner has a rotatable polygon prism, and the shaft of the polygon prism is parallel to the length of the linear laser light source
Direction is spent, and with multiple facets, is injected for multiple laser beam, each facet of the wherein polygon prism can all make each
Incident laser beam generates deviation, and the parallel light extraction after the refraction of the polygon prism, and in the substrate after an angle is rotated
Photosensitive layer an oblique scan path on form a strip exposure spot, and the strip that two adjacent laser beams are formed exposes
The projection of light hot spot in the X direction, which exists, to partly overlap.
Preferably, the laser explosure device further includes a second laser module, structure is identical to the first laser module,
The of strip exposure spot that last one of laser beam of the wherein first laser module is formed and the second laser module
The projection of the strip exposure spot that one of laser beam is formed in the X direction, which exists, to partly overlap.
Preferably, the first laser module of the laser explosure device further includes a water cooling system, first to swash to this
The linear laser light source of optical mode group radiates.
Preferably, each focusing lens unit of the first laser module of the laser explosure device includes a lens barrel and is set on
A condenser lens in the lens barrel, and the lens barrel is just axially sheathed on a pedestal of corresponding laser diode.
Preferably, the polygon prism is set on the optical path between the multiple condenser lens and the microscope carrier of the optical module
On.
Description of the drawings
Fig. 1 is the dimensional structure diagram of penetration laser direct imaging system of the present invention.
Fig. 2 is the dimensional structure diagram of the laser explosure device in the penetration laser direct imaging system of Fig. 1.
Fig. 3 is a close-up schematic view of Fig. 2.
Fig. 4 is the two laser modules of laser explosure device of Fig. 2 and the schematic top plan view of substrate.
Fig. 5 is the dimensional structure diagram of a wherein laser module for the laser explosure device of Fig. 2.
Fig. 6 is the partial cut-away structure diagram of the laser module of Fig. 5.
Fig. 7 is along a sectional schematic diagram of VII-VII line cuttings in Fig. 6.
The A figures of Fig. 8 to C figures are that the polygon prism scanner of the display present invention causes laser beam in base when rotating an angle
The process of a strip laser hot spot is formed on plate.
The schematic diagram of strip laser hot spot that Fig. 9 is formed for the laser explosure device is presented on X-Y coordinate axis.
Figure 10 be display the present invention polygon prism scanner scanning when laser beam energy vertical incidence substrate surface, not because
Substrate height changes and focus point is caused to deviate.
Figure 11 is that multi-facet mirror scanner known to display is focused on when carrying out laser beam scanning caused by substrate height changes
The situation of point offset.
Figure 12 is image peripheral feelings out of focus caused by minute surface is when rotational angle difference is in reflection laser light beam known to display
Shape.
Drawing reference numeral
100 penetration laser direct imaging systems
1 board
11 microscope carriers
12 gantry
2 laser explosure devices
3 control units
4 substrates
41 photosensitive layers
5 first laser modules
51 linear laser light sources
510 laser diodes
511/511a/511b/511l laser beams
512 pedestals
513 boat framves
52 optical modules
520 focusing lens units
521 lens barrels
522 condenser lenses
53 penetration scanners
531 polygon prisms
532 motors
533 facets
54 water cooling systems
6 second laser modules
9 polygonal mirrors
91 minute surfaces
92 laser beams
Specific embodiment
Fig. 1 to Figure 10 is a preferred embodiment for showing penetration laser direct imaging system 100 of the present invention, to incite somebody to action
One digital pattern information writes direct a substrate 4, to form a latent image pattern in a photosensitive layer 41 (Fig. 8) on 4 surface of substrate.
As shown in Figure 1, the penetration laser direct imaging system 100 generally comprises a board 1, a laser explosure device 2 and a control
Unit 3.The laser explosure device 2 is set on gantry 12 for the board 1.The board 1 has a microscope carrier 11, for carrying the substrate
4。
Specifically, the microscope carrier 11 can advance together with substrate 4 thereon along a Y-direction, and swash with this on the gantry 12
2 relative displacement of light exposure device.In addition, the laser explosure device 2 can be during with 11 relative displacement of microscope carrier so that should
The each location point of the photosensitive layer 41 of substrate in the X direction can all be exposed by the selectivity of the laser explosure device 2, at this
The latent image pattern (not shown) of two dimension is formed on photosensitive layer 41.The latent image pattern can via subsequent one development manufacturing process and
It is embodied on the substrate 4.
Fig. 2 is the position relationship schematic diagram for showing the laser explosure device 2 in Fig. 1 and the substrate 4.Wherein, the laser
Exposure device 2 has completely identical in structure first laser module 5 and a second laser module 6.Such as the plan view institute of Fig. 4
Show, first and second laser module 5,6 is parallel each other, but favours direction of advance (the namely Y side of the substrate 4
To).
For simplicity, modern only to illustrate by taking the first laser module 5 as an example, the structure of the second laser module 6 must contrast
The structure of the first laser module 5.As shown in Figures 5 and 6, which includes a linear laser light source 51, a light
Learn component 52, a penetration scanner 53 and a water cooling system 54.Wherein, the length direction (M) of the linear laser light source 51
X-direction (as shown in Figure 4) is favoured, and including multiple laser diodes 510 (as shown in Figure 6), along the linear laser light source 51
Length direction (M) be alternatively arranged, to export the multiple tracks laser beam 511 being mutually parallel.Similarly, which has
There are the multiple focusing lens units 520 in a row set along the length direction (M) of the linear laser light source 51, to respectively correspondingly
Multiple laser beam 511 is focused into the substrate 4.Each focusing lens unit 520 includes a lens barrel 521 and set on the lens barrel
Condenser lens 522 in 521.As shown in fig. 7, the just axial pedestal for being sheathed on corresponding laser diode 510 of the lens barrel 521
On 512, and the pedestal 512 is fixed on a boat frame 513 again again.In this way, can save each laser diode 510 with it is right
Complicated accurately alignment issues each other are needed on optic axis originally between the condenser lens 522 answered.As shown in figure 5, the water cooling
But system 54 connects multiple boat frame 513 of the linear laser light source 51, to swash to the multiple of the linear laser light source 51
Optical diode 510 radiates, to prevent overheating failure.
Again refering to Fig. 6, which has a polygon prism 531 and to drive the polygon prism 531 rotation
One motor 532.The shaft of the polygon prism 531 is parallel to the length direction (M) of the linear laser light source 51, and the polygon prism 531
With multiple facets 533, injected for multiple laser beam 511.The A figures of Fig. 8 to C figures show the polygon prism 531 relative to this
Laser diode 510 rotates the process of an angle.In the process, the laser beam 511 of the laser diode 510 be first from
A starting point position (the A figures of Fig. 8) in one facet 533 of the polygon prism 531 is incident, then changes work from a centre position (Fig. 8
B figures) it is incident, be then finally incident by a terminal point position (C of Fig. 8 schemes).As seen from the figure, per a moment of the polygon prism 531
Face 533 can all make the laser beam 511 of each incidence generate deviation, and the parallel light extraction after the refraction of the polygon prism 531, and
A strip exposure spot S is formed on an oblique scan path (N) of the photosensitive layer 41 of the substrate 4 after an angle is rotated, such as
Shown in the C figures of Fig. 8.
Refering to the strip exposure spot S that shown in the enlarged drawing of Fig. 3, two adjacent laser beam 511a, 511b are formed11、
S12Projection in the X direction, which exists, to partly overlap.Similarly, as shown in figure 9, strip caused by adjacent two laser module 5,6
Laser facula is there is also partly overlapping, strip that last one of laser beam 511l of the wherein first laser module 5 is formed
Exposure spot S1NThe strip exposure spot S formed with first of laser beam 611a of the second laser module 621In X-direction
On projection exist partly overlap.In other words, multiple laser diode 510 of the first laser module 5 can actually be in X side
Upwards to the different location of the photosensitive layer 41 of the substrate 4 expose, and the substrate 4 advance it is scanned during, the control list
3 (Fig. 1) of member can control the laser explosure device 2 multiple laser diode 510 switch, and cause each exposure spot or
Unexposed position forms a pixel points of the latent image pattern, and adjacent pixel points will not generate white space.In addition, such as Figure 10
Shown, the polygon prism 531 of penetration scanner 53 of the invention has the advantages that focusing is accurate, and laser beam is more by this
After the refraction of prism 531, the height change of substrate 4 can't cause focus point F1、F2Position offset.
By above-mentioned setting, penetration laser direct imaging system of the invention is by the scanner of its penetration come directly
Imaging, can be to avoid the out of focus or focal shift of reflective scanner the problems such as, and its optical system arranged in pairs or groups also is able to greatly
Width simplifies, and is able to that equipment cost is greatly reduced.In addition, the laser explosure device of penetration laser direct imaging system of the present invention is adopted
With the linear scanning mode of rows of more laser diodes, sweep speed can be more greatly improved.
Anyway, anyone can illustrate to obtain enough introductions from above-mentioned example, and according to and understand in the present invention
Hold and be different from prior art really, and with the usability in industry and foot tool progressive.It is that the patent of the invention that indeed meets will
Part, whence are filed an application in accordance with the law.
Claims (5)
1. a kind of penetration laser direct imaging system, which is characterized in that the penetration laser direct imaging system includes：
One microscope carrier, for carrying a substrate, the base plate coating has a photosensitive layer；
One laser explosure device, can be with the microscope carrier in relative displacement in a Y-direction, and in displacement process, on the microscope carrier
Location point of the photosensitive layer in an X-direction of substrate can also be exposed by the selectivity of the laser explosure device, to form
One latent image pattern, wherein the laser explosure device has a first laser module, the first laser module includes：
One linear laser light source including spaced multiple laser diodes along its length, is mutually parallel to export
Multiple tracks laser beam, wherein the length direction of the linear laser light source favours X-direction；
One optical module has multiple focusing lens units, to respectively correspondingly by the multiple laser beam focusing to institute
State substrate；And
One penetration scanner, has a rotatable polygon prism, and the shaft of the polygon prism is parallel to the linear laser light
The length direction in source, and with multiple facets, injected for the multiple laser beam, wherein each facet of the polygon prism is all
The laser beam of each incidence can be made to generate deviation, and the parallel light extraction after the refraction of the polygon prism, and in one jiao of rotation
A strip exposure spot, and two adjacent laser beams are formed after degree on an oblique scan path of the photosensitive layer of the substrate
The projection of the strip exposure spot formed in the X direction, which exists, to partly overlap.
2. penetration laser direct imaging system according to claim 1, which is characterized in that the laser explosure device is more
Including a second laser module, structure is identical to the first laser module, wherein last of the first laser module
The strip that first of laser beam of the strip exposure spot that road laser beam is formed and the second laser module is formed
The projection of exposure spot in the X direction, which exists, to partly overlap.
3. penetration laser direct imaging system according to claim 1, which is characterized in that the laser explosure device
First laser module further includes a water cooling system, radiates to the linear laser light source to the first laser module.
4. penetration laser direct imaging system according to claim 1, which is characterized in that the laser explosure device
Each focusing lens unit of first laser module includes a lens barrel and the condenser lens in the lens barrel, and the mirror
Cylinder is just axial to be sheathed on a pedestal of corresponding laser diode.
5. penetration laser direct imaging system according to claim 1, which is characterized in that the polygon prism is set on described
On optical path between the multiple condenser lens and the microscope carrier of optical module.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105143997A TWI625604B (en) | 2016-12-29 | 2016-12-29 | Transmissive laser direct imaging system |
| TW105143997 | 2016-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108255020A true CN108255020A (en) | 2018-07-06 |
Family
ID=62721716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710057512.5A Pending CN108255020A (en) | 2016-12-29 | 2017-01-26 | Penetration type laser direct imaging system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108255020A (en) |
| TW (1) | TWI625604B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109491212A (en) * | 2018-11-02 | 2019-03-19 | 深圳市先地图像科技有限公司 | A kind of device and its application method of laser linear multi mechanical scanning imaging |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI746320B (en) | 2020-12-18 | 2021-11-11 | 財團法人工業技術研究院 | Method and system for generating and updating position distribution graph |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1677237A (en) * | 2004-03-31 | 2005-10-05 | 日立比亚机械股份有限公司 | Pattern exposure method and pattern exposure device |
| US20090002669A1 (en) * | 2007-06-29 | 2009-01-01 | Optical Associates, Inc. | Ultraviolet light-emitting diode exposure apparatus for microfabrication |
| TW201543178A (en) * | 2014-04-15 | 2015-11-16 | Tno | Exposure head, exposure apparatus and method of operating an exposure head |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6560248B1 (en) * | 2000-06-08 | 2003-05-06 | Mania Barco Nv | System, method and article of manufacture for improved laser direct imaging a printed circuit board utilizing a mode locked laser and scophony operation |
| US6396616B1 (en) * | 2000-10-10 | 2002-05-28 | 3M Innovative Properties Company | Direct laser imaging system |
-
2016
- 2016-12-29 TW TW105143997A patent/TWI625604B/en active
-
2017
- 2017-01-26 CN CN201710057512.5A patent/CN108255020A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1677237A (en) * | 2004-03-31 | 2005-10-05 | 日立比亚机械股份有限公司 | Pattern exposure method and pattern exposure device |
| US20090002669A1 (en) * | 2007-06-29 | 2009-01-01 | Optical Associates, Inc. | Ultraviolet light-emitting diode exposure apparatus for microfabrication |
| TW201543178A (en) * | 2014-04-15 | 2015-11-16 | Tno | Exposure head, exposure apparatus and method of operating an exposure head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109491212A (en) * | 2018-11-02 | 2019-03-19 | 深圳市先地图像科技有限公司 | A kind of device and its application method of laser linear multi mechanical scanning imaging |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201823871A (en) | 2018-07-01 |
| TWI625604B (en) | 2018-06-01 |
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Application publication date: 20180706 |