CN108232035A - Encapsulating structure with venthole - Google Patents

Abstract

The present invention provides a kind of encapsulating structures with venthole, including the substrate for carrying OLED structure, the cover board being arranged on above OLED structure and are evenly distributed between the substrate and cover board, and around the encapsulation cushion rubber of OLED structure；Drier is provided on the downside of the cover board；Venthole is provided on the cover board.Structure of the present invention is during cover board encapsulation fitting; gas between substrate and cover board in cavity is discharged from the hole of cover board, and the protective gas in cavity is avoided to generate extruding to packaging plastic in compression process, washes sealant open; cause sealing not close, so as to improve the service life of OLED device.With traditional mode that vacuumizes, this method technological process is simple, at low cost without Special vacuum equipment.

Description

Package Structure with Air Vents

technical field

The invention relates to the field of packaging of organic light emitting diodes, in particular to a packaging structure with air outlets.

Background technique

As a new generation of display technology, Organic Light Emitting Display (OLED) has the advantages of active light emission, fast response and high contrast. The most attractive thing is that it can be flexible. It has broad application prospects. However, organic light-emitting materials are sensitive to chemical and physical environments, especially to water and oxygen, and the device is prone to aging and has a short service life. Therefore, in order to achieve mass production of OLED devices, the packaging reliability must be solved.

The packaging methods commonly used at present are (1) The traditional OLED packaging technology generally adds a cover plate to the device, and attaches a desiccant inside the cover plate, and then combines the substrate and the cover plate with a sealant such as epoxy resin. (2) Film encapsulation. The current thin-film packaging technology overcomes the disadvantages of poor water vapor and oxygen barrier performance of the sealant, and improves the packaging effect, but the device process is troublesome and the starting price stability needs to be further improved.

At present, the structure of the cover plate package is adopted. When the substrate and the cover plate are bonded, the cavity formed between the substrate and the cover plate is compressed, and the gas in the cavity squeezes the surrounding encapsulant to cause stress and deformation, which may break through. Encapsulation adhesive, which leads to loose adhesion between the encapsulation adhesive and the substrate and cover plate, and the interface between the encapsulation adhesive and the substrate and cover plate will form a water vapor channel, causing water vapor and oxygen in the air to enter the encapsulation cavity, which greatly affects the OLED device performance. The industrial solution is to use a vacuum system to evacuate the device to a certain degree of vacuum, and then package it. Therefore, a more expensive vacuum system is required, and the process is more complicated and the cost is high.

Contents of the invention

Aiming at the deficiencies in the prior art, the invention proposes a simpler, more effective and low-cost cover plate packaging method.

In view of this, the purpose of the present invention is to provide a packaging structure with air outlet, which is characterized in that it includes: a substrate carrying an OLED structure, a cover plate arranged above the OLED structure, and a substrate evenly distributed between the substrate and the cover plate Between and surrounding the encapsulating rubber ring of the OLED structure; a desiccant is provided on the underside of the cover; an air outlet is provided on the cover.

Preferably, the air outlet holes only allow airflow from the lower side of the cover plate to the upper side of the cover plate to pass through.

Preferably, the cover plate is made of glass or metal.

Preferably, the cover plate is a rectangular plate with an area capable of completely covering the OLED structure.

Preferably, the opening area of the air outlet is less than 2mm².

Preferably, the number of the air outlets is one or more.

Preferably, the air outlet hole can be filled and sealed with encapsulation glue.

Preferably, the material of the desiccant is metal calcium powder and/or metal barium powder and/or metal oxide and/or metal carbonate.

Preferably, the OLED structure is replaced by: a quantum dot organic light emitting diode (QLED) structure or a light emitting diode (LED) structure.

In the structure of the present invention and the preferred solution, during the sealing and bonding process of the cover plate, the gas in the cavity between the substrate and the cover plate is discharged from the hole in the cover plate, so as to avoid the extrusion of the sealing glue by the protective gas in the cavity during the compression process. Press and punch the sealing frame glue, resulting in loose sealing, thereby improving the service life of the OLED device. Compared with the traditional vacuuming method, this method has a simple process flow, does not require additional equipment such as special vacuum equipment, and has low cost.

Description of drawings

Fig. 1 is a schematic cross-sectional structure diagram of an embodiment of the present invention;

Fig. 2 is a schematic view 1 of the upper surface structure of an embodiment of the present invention;

Fig. 3 is a schematic view 2 of the upper surface structure of an embodiment of the present invention;

In the figure: 101-substrate, 102-OLED structure, 103-encapsulation rubber ring, 104-cover plate, 105-vent, 106-desiccant.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below through specific embodiments and related drawings.

As shown in FIG. 1 , the embodiment of the present invention includes: a substrate 101, an OLED structure 102 disposed on the substrate 101, an encapsulating rubber ring 103, a cover plate 104, an air outlet 105, and a desiccant 106, wherein the cover plate 104 is a The area of an air outlet 105 structure can completely cover the rectangular plate of the OLED structure 102, and is arranged above the OLED structure 102. The packaging rubber ring 103 is evenly distributed along the edges of the rectangular substrate 101 and the cover plate 104, and surrounds the periphery of the OLED structure 102. The upper surface of the packaging rubber ring 103 is in contact with the cover plate 104 , and the lower surface is in contact with the substrate 101 . A desiccant 106 is disposed on the lower side of the cover plate 104 .

In this embodiment, the substrate 101 is made of rectangular transparent glass, the cover plate 104 is made of rectangular transparent glass with an air outlet 105 , the sealing rubber ring 103 is made of UV glue, and the OLED structure 102 is used for lighting or display.

In this embodiment, before packaging, the substrate 101 and the cover plate 104 need to be ultrasonically cleaned with acetone, alcohol and deionized water respectively and dried.

The desiccant 106 coated on the inner surface of the cover plate 104 is a solid patch desiccant made of one or more of metal calcium powder, metal barium powder, metal oxide, and metal carbonate. The desiccant 106 has a uniform thickness and does not cover the air outlet holes 105 on the cover plate 104 .

In this embodiment, the air outlet 105 can be designed as a single air hole that only allows the airflow from the lower side of the cover plate 104 to the upper side of the cover plate 104 to pass through, so as to facilitate the discharge of gas in the sealed cavity during packaging operations.

The opening area of the air outlet 105 is less than 2 mm², which is beneficial to the subsequent sealing of the air outlet 105 .

As shown in FIG. 2 , the air outlet hole 105 can be designed as a circular hole with a diameter of 0.5-2.0 mm.

As shown in FIG. 3 , the air outlet hole 105 can also be designed as a slit with a width of 0.5-1.0 mm.

According to the actual requirements of packaging, the number of air outlets 105 can also be set to be multiple, so as to ensure a better exhaust effect when the exhaust volume of a single air outlet 105 is limited.

In the process of realizing the structure of the embodiment of the present invention, it is necessary to apply and cure the encapsulation glue between the substrate 101 and the cover plate 104 first, and then seal the air outlet 105 on the cover plate 104 after forming the encapsulation rubber ring 103 Fill and solidify.

Wherein, the width of the packaging rubber ring 103 should be as wide as possible, so as to extend the water vapor channel formed between the sealed cavity and the outside world.

When filling the encapsulant of the vent hole 105 , it is necessary to fill the round hole or the wide gap.

In this embodiment, the preparation process of each functional layer of the OLED structure 102 is carried out in a high vacuum environment by means of evaporation, and packaged in a glove box filled with high-purity nitrogen to ensure that the OLED structure 102 is not damaged by water vapor and oxygen.

When the structure of this embodiment is used for packaging operations, it can ensure that the packaging rubber ring 103 is completely attached to the substrate 101 and the cover plate 104 without stress deformation, and the interface between the packaging glue and the substrate 101 and the cover plate 104 can be avoided as much as possible. channel, effectively improving the service life of the OLED device.

In this embodiment, only the encapsulation of the OLED structure 102 is shown, but under the design idea of the present invention, replacing the OLED structure 102 with a quantum dot organic light-emitting diode (QLED) structure or a light-emitting diode (LED) structure will not Affect the realization of the efficacy of the device structure provided by the present invention and the purpose of the invention.

It should be noted that, for the sake of clarity, the drawings of this embodiment exaggerate the thickness of layers and regions, but as a schematic diagram, it should not be considered as strictly reflecting the proportional relationship of geometric dimensions. The drawings of the specification are schematic illustrations of idealized embodiments of the invention, and the illustrated embodiments of the invention should not be considered limited to the specific shapes of the regions shown in the drawings, but include resulting shapes (such as manufacturing-induced deviations ). The representation as a rectangle in this embodiment is schematic and should not be considered as limiting the scope of the present invention.

Claims (9)

1. A packaging structure with an air outlet, characterized in that it comprises: a substrate carrying an OLED structure, a cover plate arranged above the OLED structure, and evenly distributed between the substrate and the cover plate, and surrounding the OLED structure The packaging rubber ring; the underside of the cover is provided with a desiccant; the cover is provided with an air outlet. 2 . The package structure with an air outlet according to claim 1 , wherein the air outlet only allows air flow from the lower side of the cover plate to the upper side of the cover plate to pass through. 3 . 3. The packaging structure with vent holes according to claim 1, wherein the material of the cover plate is glass or metal. 4. The package structure with air outlet according to claim 1, characterized in that: the cover plate is a rectangular plate with an area capable of completely covering the OLED structure. 5. The package structure with air outlet according to claim 1, characterized in that: the opening area of the air outlet is less than 2mm². 6. The packaging structure with air outlets according to claim 1, wherein the number of said air outlets is one or more. 7. The packaging structure with air outlets according to claim 1, wherein the air outlets can be filled and sealed with encapsulation glue. 8. The packaging structure with air outlet according to claim 1, characterized in that: the material of the desiccant is metal calcium powder and/or metal barium powder and/or metal oxide and/or metal carbonic acid thing. 9. The packaging structure with air outlets according to claim 1, characterized in that: the OLED structure is replaced by: a quantum dot organic light emitting diode (QLED) structure or a light emitting diode (LED) structure.