CN104538555A - OLED packaging structure and OLED packaging method - Google Patents

Abstract

The invention provides an OLED packaging structure and an OLED packaging method. The OLED encapsulation structure comprises an encapsulation cover plate (1), a substrate (2), an OLED device (21), a desiccant (11) disposed on the encapsulation cover plate (1) at the periphery of the OLED device (21), and a sealant (12) positioned on the periphery of the desiccant (11) to bond the package cover (1) and the substrate (2); the package cover (1) corresponds to the area of the OLED device (21) A circle of grooves (103) is provided on the periphery of the groove (103), and several circles of concave-convex structures (101) are arranged on the periphery of the groove (103), the desiccant (11) is arranged in the groove (103), and the frame glue (12) arranged between the concave-convex structure (101) and the substrate (2). The OLED encapsulation structure can improve the bonding strength between the encapsulation cover plate and the base plate, reduce the distance between the encapsulation cover plate and the base plate, and effectively block the infiltration of water vapor and oxygen.

Description

OLED packaging structure and OLED packaging method

technical field

The invention relates to the field of display technology, in particular to an OLED packaging structure and an OLED packaging method.

Background technique

In the field of display technology, flat panel display technologies such as LCD (Liquid Crystal Display) and OLED (Organic Light-Emitting Diode) displays have gradually replaced cathode ray tube (CRT, Cathode Ray Tube) displays. Among them, OLED has many advantages such as self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, nearly 180° viewing angle, wide temperature range, flexible display and large-area full-color display, etc. It is widely used in mobile phone screens, computer monitors, full-color TVs, etc., and is recognized by the industry as the most promising display device.

The OLED has an anode, an organic light emitting layer, and a cathode sequentially formed on a substrate. The biggest problem that restricts the development of the OLED industry and the biggest defect of OLED is the short life of OLED. The reason for the short life of OLED is mainly that the electrodes and light-emitting layer organic materials that make up OLED devices are resistant to pollutants, water vapor, and oxygen in the atmosphere. It is very sensitive, and it is prone to electrochemical corrosion in an environment containing water vapor and oxygen, causing damage to OLED devices. Therefore, the OLED must be effectively encapsulated to prevent water vapor and oxygen from entering the OLED.

OLED packaging mainly includes the following methods: desiccant packaging, UV glue packaging (also known as Damonly packaging), UV glue and filling glue packaging (also known as Dam&Fill packaging), glass glue packaging (also known as Frit packaging), etc. Among them, UV glue packaging technology is the earliest and most commonly used technology for OLED packaging. It has the following characteristics: no solvent or a small amount of solvent is used, which reduces the pollution of the solvent to the environment; it consumes less energy and can be cured at low temperature. It is suitable for UV-sensitive materials; fast curing speed, high efficiency, can be used in high-speed production lines, small footprint of curing equipment, etc. However, the sealant used in UV glue packaging is an organic material, and its molecular gap is large after curing. The traditional OLED packaging method is adopted, because the sealant has curing defects, porosity, and weak bonding with the substrate and the packaging cover. For other reasons, water vapor and oxygen are more likely to permeate into the inner sealing area through the gap, resulting in faster degradation of OLED device performance and shortened lifespan.

Therefore, by effectively encapsulating the OLED, ensuring a good internal sealing of the OLED device and minimizing the contact between the OLED device and oxygen and water vapor in the external environment are very important for the stable performance of the OLED device and prolonging the service life of the OLED. In order to achieve a better encapsulation effect, the existing encapsulation structure and encapsulation method still need to be further improved to block the path of water vapor and oxygen infiltrating into the OLED encapsulation structure.

Contents of the invention

The purpose of the present invention is to provide an OLED packaging structure, which can improve the bonding strength between the packaging cover plate and the substrate, and reduce the distance between the packaging cover plate and the substrate, effectively prevent the infiltration of water vapor and oxygen, and the packaging effect is better , help to improve the performance of the OLED device and prolong the service life of the OLED device.

Another object of the present invention is to provide an OLED packaging method, which can firmly bond the packaging cover plate and the substrate together, and reduce the distance between the packaging cover plate and the substrate, effectively blocking the infiltration of water vapor and oxygen, and effectively It is helpful to improve the performance of the OLED device, prolong the service life of the OLED device, and has a simple manufacturing process and a good packaging effect.

To achieve the above object, the present invention provides an OLED packaging structure, comprising a packaging cover, a substrate opposite to the packaging cover, an OLED device located on the substrate between the packaging cover and the substrate, A desiccant disposed on the encapsulation cover on the periphery of the OLED device area, and a sealant on the periphery of the desiccant to bond the encapsulation cover and the substrate;

A circle of grooves is provided on the periphery of the packaging cover plate corresponding to the area of the OLED device, and several circles of concave-convex structures are arranged on the periphery of the groove, the desiccant is arranged in the groove, and the sealant is arranged in the groove. Between the concave-convex structure and the substrate.

Both the package cover plate and the substrate are glass substrates.

The concave-convex structure includes a raised portion protruding from the surface of the packaging cover, and a concave portion adjacent to the raised portion and recessed into the surface of the packaging cover, and the sealant completely fills the concave portion And cover the raised portion.

The sections of the protruding part and the recessed part are both trapezoidal.

The height of the protrusion protruding from the surface of the packaging cover is 0.1-10um; the surface of the concave-convex structure and the groove is a rough surface. The desiccant is calcium chloride, and the desiccant is flush with the surface of the package cover.

The present invention also provides an OLED encapsulation method, comprising the following steps:

Step 1, providing a packaging cover plate and a substrate, and the OLED device is arranged on the substrate;

Step 2, making several circles of concave-convex structures on the outer side of the packaging cover plate corresponding to the OLED device area;

Step 3, making a circle of grooves on the packaging cover plate on the inner side of the concave-convex structure and the outer side corresponding to the OLED device area, and roughening the surface of the concave-convex structure and the groove;

Step 4, coating frame glue on the concave-convex structure;

Step 5, filling the inside of the groove with desiccant;

Step 6. Relatively attach the packaging cover plate and the substrate under vacuum conditions, and use UV light irradiation to cure the frame glue, so as to bond the packaging cover plate and the substrate together to complete the OLED device. encapsulation.

In the OLED encapsulation method, the concave-convex structure and the groove are produced by an etching method; and the surface of the concave-convex structure and the groove is roughened by a plasma surface treatment method.

The concave-convex structure includes a raised portion protruding from the surface of the packaging cover, and a concave portion adjacent to the raised portion and recessed into the surface of the packaging cover, and the sealant completely fills the concave portion And cover the raised portion.

The sections of the raised portion and the depressed portion are trapezoidal; the height of the raised portion protruding from the surface of the package cover is 0.1-10um; the desiccant is calcium chloride, and the desiccant and the The surface of the package cover is flush.

Beneficial effects of the present invention: a kind of OLED encapsulation structure provided by the present invention, by arranging concave-convex structure on the encapsulation cover plate coating sealant position, ensures that there is enough space between encapsulation cover plate and substrate to fill encapsulant, improves The bonding strength between the package cover plate and the substrate, and reduce the distance between the package cover plate and the substrate, block the infiltration path of water vapor and oxygen, effectively block the infiltration of water vapor and oxygen, and the packaging effect is better. At the same time, by setting the desiccant To reduce the water vapor penetrating through the sealant to the internal sealing area of the OLED, it helps to improve the performance of the OLED device and prolong the service life of the OLED device. The invention provides an OLED encapsulation method. The position of the encapsulation cover plate coated with frame glue is made into a concave-convex structure, ensuring that there is enough space between the encapsulation cover plate and the substrate to fill the encapsulant, and improving the distance between the encapsulation cover plate and the substrate. The bonding strength between them, and reduce the distance between the package cover plate and the substrate, block the infiltration path of water vapor and oxygen, effectively block the infiltration of water vapor and oxygen, and at the same time, by filling the desiccant, reduce the penetration into the OLED through the frame glue The water vapor in the internal sealing area helps to improve the performance of the OLED device and prolong the service life of the OLED device, and the manufacturing process is simple and the packaging effect is good.

Description of drawings

The technical solutions and other beneficial effects of the present invention will be apparent through the detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings.

In the attached picture,

Fig. 1 is the schematic diagram of OLED packaging structure of the present invention;

Fig. 2 is the flowchart of OLED packaging method of the present invention;

Fig. 3 is the schematic diagram of the step 1 of OLED packaging method of the present invention;

Fig. 4 is the schematic diagram of the step 2 of OLED packaging method of the present invention;

5 is a schematic diagram of step 3 of the OLED encapsulation method of the present invention;

6 is a schematic diagram of step 4 of the OLED encapsulation method of the present invention;

7 is a schematic diagram of step 5 of the OLED packaging method of the present invention;

FIG. 8 is a schematic diagram of Step 6 of the OLED encapsulation method of the present invention.

Detailed ways

In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

Please refer to FIG. 1 , the present invention provides an OLED package structure, including a package cover 1 , a substrate 2 opposite to the package cover 1 , and a substrate located between the package cover 1 and the substrate 2 . 2, the desiccant 11 disposed on the encapsulation cover 1 at the periphery of the OLED device 21 area, and the desiccant 11 at the periphery of the desiccant 11 to bond the encapsulation cover 1 and the substrate 2 Frame glue12.

Specifically, a circle of grooves 103 is provided on the periphery of the packaging cover plate 1 corresponding to the area of the OLED device 21, and several circles of concave-convex structures 101 are arranged on the periphery of the groove 103, and the desiccant 11 is arranged in the groove. In 103 , the sealant 12 is disposed between the concave-convex structure 101 and the substrate 2 . The concave-convex structure 101 enables enough space between the package cover 1 and the substrate 2 to be filled with the sealant 12 , which can improve the bonding strength between the package cover 1 and the substrate 2 .

Both the packaging cover 1 and the substrate 2 are transparent substrates, preferably, the packaging cover 1 and the substrate 2 are both glass substrates.

Further, the concave-convex structure 101 includes a protruding portion 102 protruding from the surface of the package cover 1 , and a recess 104 adjacent to the protruding portion 102 and recessed into the surface of the package cover 1 . The sealant 12 completely fills the recessed portion 104 and covers the raised portion 102 , since the raised portion 102 protrudes a certain height relative to the surface of the package cover 1 , the gap between the package cover 1 and the substrate 2 is reduced. The distance between water vapor and oxygen is blocked, the infiltration of water vapor and oxygen is effectively blocked, and the permeation rate of water vapor and oxygen is reduced.

Both the protruding portion 102 and the concave portion 104 have trapezoidal cross-sections. Preferably, the height of the protruding portion 102 protruding from the surface of the packaging cover 1 is 0.1-10 um.

Furthermore, the surface of the concave-convex structure 101 and the groove 103 is preferably a rough surface, so that the sealant 12 can be bonded more firmly.

The desiccant 11 is preferably calcium chloride, and the desiccant 11 is flush with the inner surface of the packaging cover 1 .

In the above-mentioned OLED packaging structure, a concave-convex structure 101 is provided at the position where the sealant 12 is coated on the package cover 1 to ensure that there is enough space between the package cover 1 and the substrate 2 to fill the sealant 12, and improve the packaging cover 1. The bonding strength between the substrate 2 and the distance between the package cover 1 and the substrate 2 are reduced, the infiltration path of water vapor and oxygen is blocked, and the infiltration of water vapor and oxygen is effectively blocked, and the packaging effect is better. At the same time, by setting a desiccant 11 to reduce water vapor penetrating through the sealant 12 to the internal sealing area of the OLED, which helps to improve the performance of the OLED device and prolong the service life of the OLED device. Please refer to Fig. 2, the present invention also provides a kind of OLED encapsulation method, comprises the following steps:

Step 1, as shown in FIG. 3 , provide a packaging cover plate 1 and a substrate 2 , and the substrate 2 is provided with an OLED device 21 .

Both the packaging cover 1 and the substrate 2 are transparent substrates, preferably, the packaging cover 1 and the substrate 2 are both glass substrates.

Step 2. As shown in FIG. 4 , several rings of concave-convex structures 101 are formed on the packaging cover plate 1 outside the region corresponding to the OLED device 21 .

Specifically, the concave-convex structure 101 can be fabricated by etching or other methods.

The concave-convex structure 101 includes a protruding portion 102 protruding from the surface of the package cover 1 , and a recess 104 adjacent to the protruding portion 102 and recessed into the surface of the package cover 1 . Further, the cross-sections of the protruding portion 102 and the recessed portion 104 are trapezoidal. Preferably, the protruding height of the protruding portion 102 from the surface of the packaging cover 1 is 0.1-10 um.

Step 3. As shown in FIG. 5 , make a circle of grooves 103 on the packaging cover 1 inside the concave-convex structure 101 and outside the area corresponding to the OLED device 21 , and align the concave-convex structure 101 with the concave-convex structure 101 The surface of the groove 103 is roughened.

Specifically, the groove 103 can be fabricated by etching or other methods; and the concave-convex structure 101 and the groove 103 can be roughened by using a plasma surface treatment (plasma) method.

Step 4, as shown in FIG. 6 , coating the sealant 12 on the concave-convex structure 101 , so that the sealant 12 completely fills the concave portion 104 and covers the raised portion 102 .

Step 5, as shown in FIG. 7 , coating the desiccant 11 inside the groove 103 .

The desiccant 11 is preferably calcium chloride; the desiccant 11 is flush with the surface of the package cover 1 .

Step 6. As shown in FIG. 8 , relatively attach the package cover 1 and the substrate 2 under vacuum conditions, and use UV light irradiation to cure the sealant 12 , so that the package cover 1 and the substrate 2 are bonded together to complete the packaging of the OLED device 21.

In the above OLED encapsulation method, the position where the sealant 12 is coated on the encapsulation cover plate 1 is made into a concave-convex structure 101, so as to ensure that there is enough space between the encapsulation cover plate 1 and the substrate 2 to fill the encapsulant 12, and improve the encapsulation cover plate. 1 and the substrate 2, reduce the distance between the package cover 1 and the substrate 2, block the infiltration path of water vapor and oxygen, effectively block the infiltration of water vapor and oxygen, and at the same time fill the desiccant 11 , reducing the water vapor penetrating through the sealant 12 to the internal sealing area of the OLED, which helps to improve the performance of the OLED device and prolong the service life of the OLED device, and the manufacturing process is simple and the packaging effect is good.

In summary, the OLED packaging structure of the present invention, by setting the concave-convex structure on the position where the sealant is coated on the package cover plate, ensures that there is enough space between the package cover plate and the substrate to fill the frame glue, and improves the sealing effect between the package cover plate and the substrate. The bonding strength between the substrates, and reduce the distance between the package cover and the substrate, block the infiltration path of water vapor and oxygen, effectively block the infiltration of water vapor and oxygen, the packaging effect is better, and at the same time reduce the penetration by setting a desiccant The moisture that the sealant penetrates into the sealed area inside the OLED helps to improve the performance of the OLED device and prolong the service life of the OLED device. In the OLED encapsulation method of the present invention, the position where the sealant is coated on the encapsulation cover plate is made into a concave-convex structure, ensuring that there is enough space between the encapsulation cover plate and the substrate to fill the encapsulant, and improving the distance between the encapsulation cover plate and the substrate. Bonding strength, and reduce the distance between the package cover plate and the substrate, block the infiltration path of water vapor and oxygen, effectively block the infiltration of water vapor and oxygen, and at the same time, by filling the desiccant, reduce the penetration of the sealant into the OLED internal seal The water vapor in the area helps to improve the performance of the OLED device and prolong the service life of the OLED device, and the manufacturing process is simple and the packaging effect is better.

As mentioned above, for those of ordinary skill in the art, various other corresponding changes and deformations can be made according to the technical scheme and technical concept of the present invention, and all these changes and deformations should belong to the protection scope of the claims of the present invention .

Claims (10)

1. A kind of OLED encapsulation structure, it is characterized in that, comprise encapsulation cover plate (1), the substrate (2) that is oppositely arranged with described encapsulation cover plate (1), be positioned at described encapsulation cover plate (1) and substrate (2) ) between the OLED device (21) on the substrate (2), the desiccant (11) located on the encapsulation cover (1) at the periphery of the OLED device (21) area, and the The outer periphery of the desiccant (11) bonds the sealant (12) between the package cover (1) and the substrate (2); A circle of grooves (103) is provided on the periphery of the packaging cover plate (1) corresponding to the region of the OLED device (21), and several circles of concave-convex structures (101) are arranged on the periphery of the groove (103). The desiccant (11) is arranged in the groove (103), and the sealant (12) is arranged between the concave-convex structure (101) and the substrate (2). 2. The OLED packaging structure according to claim 1, characterized in that, the packaging cover plate (1) and the substrate (2) are both glass substrates. 3. The OLED encapsulation structure according to claim 1, characterized in that, the concave-convex structure (101) comprises a protruding portion (102) protruding from the surface of the encapsulation cover plate (1), and part (102) adjacent to and recessed into the recessed part (104) on the surface of the package cover (1), the sealant (12) completely fills the recessed part (104) and covers the raised part (102 ). 4. The OLED encapsulation structure according to claim 3, characterized in that, cross-sections of the raised portion (102) and the recessed portion (104) are both trapezoidal. 5. The OLED packaging structure according to claim 4, characterized in that, the height of the protrusion (102) protruding from the surface of the packaging cover (1) is 0.1-10um; the concave-convex structure (101) The surface with the groove (103) is a rough surface. 6. The OLED encapsulation structure according to claim 1, characterized in that the desiccant (11) is calcium chloride, and the desiccant (11) is flush with the surface of the encapsulation cover plate (1). 7. A method for encapsulating OLEDs, comprising the steps of: Step 1, providing a packaging cover (1) and a substrate (2), the substrate (2) being provided with an OLED device (21); Step 2, making several circles of concave-convex structures (101) on the outer side of the area corresponding to the OLED device (21) on the packaging cover plate (1); Step 3, making a circle of grooves (103) on the inside of the concave-convex structure (101) on the packaging cover (1) and outside the area corresponding to the OLED device (21), and forming a circle of grooves (103) on the concave-convex structure ( 101) roughening the surface with the groove (103); Step 4, coating frame glue (12) on the concave-convex structure (101); Step 5, filling the inside of the groove (103) with desiccant (11); Step 6. Relatively attach the packaging cover (1) and the substrate (2) under vacuum conditions, and use UV light irradiation to cure the frame glue (12), so that the packaging cover (1) It is bonded with the substrate (2) to complete the packaging of the OLED device (21). 8. The OLED encapsulation method according to claim 7, characterized in that, the concave-convex structure (101) and the groove (103) are made by etching; the concave-convex structure (101) is surfaced by using a plasma surface treatment method rough handling. 9. The OLED encapsulation method according to claim 7, characterized in that, the concave-convex structure (101) comprises a protruding portion (102) protruding from the surface of the encapsulation cover plate (1), and part (102) adjacent to and recessed into the recessed part (104) on the surface of the package cover (1), the sealant (12) completely fills the recessed part (104) and covers the raised part (102 ). 10. The OLED encapsulation method according to claim 9, characterized in that, the sections of the raised portion (102) and the recessed portion (104) are trapezoidal; the raised portion (102) protrudes from the The height of the surface of the package cover (1) is 0.1-10um; the desiccant (11) is calcium chloride, and the desiccant (11) is flush with the surface of the package cover (1).