CN108226656B - Electromagnetic field composite passive probe - Google Patents
Electromagnetic field composite passive probe Download PDFInfo
- Publication number
- CN108226656B CN108226656B CN201711464715.2A CN201711464715A CN108226656B CN 108226656 B CN108226656 B CN 108226656B CN 201711464715 A CN201711464715 A CN 201711464715A CN 108226656 B CN108226656 B CN 108226656B
- Authority
- CN
- China
- Prior art keywords
- magnetic field
- electric field
- line
- layer
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims abstract description 104
- 230000005672 electromagnetic field Effects 0.000 title claims abstract description 68
- 239000002131 composite material Substances 0.000 title claims abstract description 62
- 230000005684 electric field Effects 0.000 claims abstract description 168
- 230000005540 biological transmission Effects 0.000 claims abstract description 93
- 238000001514 detection method Methods 0.000 claims abstract description 61
- 238000006243 chemical reaction Methods 0.000 claims abstract description 34
- 230000008054 signal transmission Effects 0.000 claims abstract description 24
- 230000008859 change Effects 0.000 claims abstract description 14
- 230000004907 flux Effects 0.000 claims abstract description 12
- 230000006698 induction Effects 0.000 claims description 67
- 239000004020 conductor Substances 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 19
- 238000005259 measurement Methods 0.000 claims description 15
- 238000004458 analytical method Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 239000004215 Carbon black (E152) Substances 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 5
- 150000002430 hydrocarbons Chemical class 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 16
- 238000010586 diagram Methods 0.000 description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
The invention relates to an electromagnetic field composite passive probe, which comprises a PCB board provided with a plurality of shielding grounding through holes; the PCB comprises a signal detection part and a signal transmission part; the signal detection part comprises a magnetic field coil and an electric field probe; the signal transmission part comprises a magnetic field strip line, a magnetic field CPW-G transmission line, a magnetic field conversion through hole, an electric field strip line, an electric field CPW-G transmission line and an electric field conversion through hole; the signal detection part respectively forms radio frequency signals according to the change of the magnetic flux and the electric field; each radio frequency signal is transmitted out through the transmission structure of the strip line, the conversion through hole and the CPW-G transmission line, so that the low loss and the low reflection of the signal are ensured; through the structural design of the signal detection part and the signal transmission part, the electromagnetic field passive composite probe can simultaneously detect a magnetic field and an electric field and can measure the local high-bandwidth and high-precision electromagnetic field distribution of a circuit board to be measured (including an integrated circuit on the board).
Description
Technical Field
The invention relates to the technical field of electromagnetic detection, in particular to an electromagnetic field composite passive probe.
Background
With the development of technology, electronic devices become more miniaturized, high frequency and high density, resulting in the problem of electromagnetic reliability of products becoming more serious. Interference image reconstruction based on near field measurement is the most effective way to deal with the EMC (Electro magnetic compatibility) design problem today.
In the implementation process, the inventor finds that at least the following problems exist in the conventional technology: when an electronic product works, electromagnetic interference emitted by a radiation source generally has a wide frequency spectrum range, and double physical quantity probes can interfere with each other during detection, so that the distribution of a magnetic field and an electric field is difficult to measure simultaneously.
Disclosure of Invention
Based on this, it is necessary to provide an electromagnetic field composite passive probe for solving the problem that it is difficult to simultaneously test the magnetic field and the electric field in the electromagnetic interference detection.
In order to achieve the above object, an embodiment of the present invention provides an electromagnetic field composite passive probe, including a PCB board provided with a plurality of shielding ground vias; the PCB comprises a signal detection part and a signal transmission part;
the signal detection part comprises a magnetic field coil and an electric field probe which are wired in corresponding wiring layers;
the signal transmission part comprises a magnetic field conversion through hole, an electric field conversion through hole, and a magnetic field strip line, a magnetic field CPW-G transmission line, an electric field strip line and an electric field CPW-G transmission line which are arranged on the corresponding wiring layers;
the first end of the magnetic field strip line is connected with the magnetic field coil, and the second end of the magnetic field strip line is connected with the first end of the magnetic field CPW-G transmission line through the conductive hole wall of the magnetic field conversion through hole; the second end of the magnetic field CPW-G transmission line is connected with a first external signal analysis interface; the first end of the electric field strip line is connected with the electric field probe, and the second end of the electric field strip line is connected with the first end of the electric field CPW-G transmission line through the conductive hole wall of the electric field conversion through hole; and the second end of the electric field CPW-G transmission line is connected with the second external signal analysis interface.
In one embodiment, the magnetic field conversion through hole comprises a magnetic field central through hole and a plurality of magnetic field surrounding through holes which surround the magnetic field central through hole by a preset distance and are used for shielding signal interference; the second end of the magnetic field strip line is connected with the first end of the magnetic field CPW-G transmission line through the conductive hole wall of the magnetic field central through hole;
the electric field conversion through holes comprise an electric field central through hole and a plurality of electric field surrounding through holes which surround the electric field central through hole at a preset distance and are used for shielding signal interference; and the second end of the electric field strip line is connected with the first end of the electric field CPW-G transmission line through the conductive hole wall of the electric field central through hole.
In one embodiment, the wiring layers are a first ground layer, an additional layer, a magnetic field signal layer, a second ground layer, an electric field signal layer, and a third ground layer, which are stacked in sequence.
In one embodiment, the first ground layer is wired outside a first magnetic field induction area formed by the magnetic field coil on the first ground layer, and is provided with a first opening communicated with the first magnetic field induction area;
the second grounding layer is arranged outside a second magnetic field induction area formed by the magnetic field coil on the second grounding layer and is provided with a second opening communicated with the second magnetic field induction area;
the third grounding layer is arranged outside a third magnetic field induction area formed by the magnetic field coil on the third grounding layer and is provided with a third opening communicated with the first magnetic field induction area;
the first opening, the second opening and the third opening are aligned and arranged along the axial direction of the shielding grounding through hole;
the signal detection part is also provided with a blind hole;
the magnetic field coil is wired in the magnetic field signal layer and comprises a magnetic field induction line which is wired in a non-closed mode along the boundary of a fourth magnetic field induction area formed by the magnetic field coil in the magnetic field signal layer;
the first end of the magnetic field induction line is connected with the first end of the magnetic field strip line, and the second end of the magnetic field induction line is connected with the first grounding layer and the second grounding layer through the conductive hole wall of the blind hole.
In one embodiment, the electric field probes are routed on the electric field signal layer;
the electric field probe comprises a connecting line and a detecting line for measuring the change of the electric field line;
the connecting wire is arranged outside a fifth magnetic field induction area formed by the magnetic field coil in the electric field signal layer and is provided with a fourth opening communicated with the fifth magnetic field induction area;
the fourth opening is aligned with the first opening, the second opening and the third opening along the axial direction of the shielding grounding through hole;
the middle section of the connecting wire is connected with the first end of the electric field strip line, and the end point is connected with the detecting line.
In one embodiment, the endpoints of the connecting line comprise a first endpoint and a second endpoint;
the detection line comprises a first measurement line and a second measurement line;
the first end point is connected with a first measuring line; the second end point is connected with the second measuring line.
In one embodiment, the conductor strip of the magnetic field stripline is routed on the magnetic field signal layer, the first ground metal strip is routed on the first ground layer, and the second ground metal strip is routed on the second ground layer;
the conductor strip of the electric field strip line is wired on the electric field signal layer, the first grounding metal strip is wired on the second grounding layer, and the second grounding metal strip is wired on the third grounding layer.
In one embodiment, the center conductor strip and the ground conduction strip of the magnetic field CPW-G transmission line are routed on the first ground plane, and the metal ground plane is routed on the additional layer;
the center conductor strip and the ground conduction strip of the electric field CPW-G transmission line are routed on the first ground layer, and the metal ground layer is routed on the additional layer.
In one embodiment, the PCB board is a circuit board of FR4 substrate material;
or
The PCB is a circuit board of a hydrocarbon ceramic substrate material.
In one embodiment, the PCB is a circuit board prepared by LTCC process.
One of the above technical solutions has the following advantages and beneficial effects:
the PCB comprises a signal detection part and a signal transmission part; the signal detection part comprises a magnetic field coil and an electric field probe; the signal transmission part comprises a magnetic field strip line, a magnetic field CPW-G transmission line, a magnetic field conversion through hole, an electric field strip line, an electric field CPW-G transmission line and an electric field conversion through hole; the signal detection part respectively forms radio frequency signals according to the change of the magnetic flux and the electric field; each radio frequency signal is transmitted out through the transmission structure of the strip line, the conversion through hole and the CPW-G transmission line, so that the low loss and the low reflection of the signal are ensured; through the structural design of the signal detection part and the signal transmission part, the electromagnetic field passive composite probe can simultaneously detect a magnetic field and an electric field and can measure the local high-bandwidth and high-precision electromagnetic field distribution of a circuit board to be measured (including an integrated circuit on the board).
Drawings
The foregoing and other objects, features and advantages of the invention will be apparent from the following more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the invention.
Fig. 1 is a schematic structural diagram of an electromagnetic field composite passive probe 1 according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a strip line of an embodiment of the electromagnetic field composite passive probe of the present invention;
FIG. 3 is a schematic structural diagram of a CPW-G transmission line according to an embodiment of the electromagnetic field composite passive probe of the present invention;
FIG. 4 is a schematic structural diagram of a switching via according to an embodiment of the electromagnetic field composite passive probe of the present invention;
fig. 5 is a schematic structural diagram of a first ground plane of an embodiment of the electromagnetic field composite passive probe according to the present invention;
FIG. 6 is a schematic diagram of an additional layer of an embodiment of the electromagnetic field composite passive probe of the present invention;
FIG. 7 is a schematic diagram of a magnetic field signal layer of an embodiment of the electromagnetic field composite passive probe of the present invention;
fig. 8 is a schematic structural diagram of a second ground plane of the electromagnetic field composite passive probe according to the embodiment of the present invention;
FIG. 9 is a schematic diagram of an electric field signal layer of an embodiment of the electromagnetic field composite passive probe of the present invention;
fig. 10 is a schematic structural diagram of a third ground plane of the electromagnetic field composite passive probe according to the embodiment of the present invention;
FIG. 11 is a schematic diagram of an electric field probe in an electric field signal layer according to an embodiment of the electromagnetic field composite passive probe of the present invention;
FIG. 12 is a schematic structural diagram of a mounting hole of an embodiment of the electromagnetic field composite passive probe according to the present invention;
fig. 13 is a schematic diagram of a thickness direction structure of an example of the electromagnetic field composite passive probe according to the present invention.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element and be integral therewith, or intervening elements may also be present. The terms "wiring," "first end," "second end," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
When an electronic product works, electromagnetic interference emitted by a radiation source generally has a wider frequency spectrum range, and double physical quantity probes can interfere with each other during detection, so that the distribution of a magnetic field and an electric field is difficult to measure simultaneously; at present, the design of a broadband near-field composite probe is rarely reported, and a good detection structure and a good transmission structure design are the key for solving the problems.
In order to solve the problem that it is difficult to simultaneously test a magnetic field and an electric field in electromagnetic interference detection, an embodiment of the invention provides an electromagnetic field composite passive probe, as shown in fig. 1, fig. 1 is a schematic structural diagram of an embodiment 1 of the electromagnetic field composite passive probe, and the electromagnetic field composite passive probe comprises a PCB board provided with a plurality of shielding grounding through holes; the PCB comprises a signal detection part and a signal transmission part;
the signal detection part comprises a magnetic field coil and an electric field probe which are wired in corresponding wiring layers;
the signal transmission part comprises a magnetic field conversion through hole, an electric field conversion through hole, and a magnetic field strip line, a magnetic field CPW-G transmission line, an electric field strip line and an electric field CPW-G transmission line which are arranged on the corresponding wiring layers;
the first end of the magnetic field strip line is connected with the magnetic field coil, and the second end of the magnetic field strip line is connected with the first end of the magnetic field CPW-G transmission line through the conductive hole wall of the magnetic field conversion through hole; the second end of the magnetic field CPW-G transmission line is connected with a first external signal analysis interface; the first end of the electric field strip line is connected with the electric field probe, and the second end of the electric field strip line is connected with the first end of the electric field CPW-G transmission line through the conductive hole wall of the electric field conversion through hole; and the second end of the electric field CPW-G transmission line is connected with the second external signal analysis interface.
In particular, the electromagnetic field composite passive probe can comprise two parts of signal detection and signal transmission; the signal detection part may include a magnetic field coil for detecting the magnetic field distribution and an electric field probe for detecting the electric field distribution; the signal transmission part can comprise a strip line corresponding to the magnetic field detection signal and the electric field detection signal, a CPW-G transmission line and a conversion through hole; the signal detection part respectively forms radio frequency signals according to the change of the magnetic flux and the electric field; each radio frequency signal can be transmitted out in a 50 ohm impedance mode through a transmission structure of the strip line, the conversion through hole and the CPW-G transmission line, so that low loss and low reflection of the signal are guaranteed; through the structural design of the signal detection part and the signal transmission part, the electromagnetic field passive composite probe can simultaneously detect a magnetic field and an electric field, is connected to the input end of a spectrum analyzer through an external signal analysis interface (such as a microwave high-frequency connector) to measure radio frequency signals, and can measure the local high-bandwidth and high-precision electromagnetic field distribution of a circuit board to be measured (including an integrated circuit on the board).
It should be noted that the magnetic field coil forms a magnetic field induction area on the PCB; the magnetic field induction area is not shielded by the metal layer and can be used for inducing the change of magnetic flux through magnetic field lines; the shape of the magnetic field induction area mentioned in the embodiment of the invention can be rectangular, polygonal, circular and the like, and can be specifically adjusted according to actual detection requirements and processing requirements; the magnetic field coil may include magnetic field-inducing lines routed along the boundaries of the magnetic field-inducing region; the magnetic field induction line can generate a radio frequency signal according to the magnetic flux change in the magnetic field induction area, and then the signal is transmitted to an external analysis instrument through the magnetic field signal transmission structure; through reasonable design of the magnetic field induction area and the magnetic field induction lines, the electric field rejection ratio can be improved, and the interference of electric field distribution on magnetic field detection is avoided;
the detection structure of the electric field probe is not covered and shielded by the metal grounding layer, so that the detection efficiency of an electric field can be improved, a radio frequency signal is formed according to the change of electric field lines, and the signal is transmitted to an external analysis instrument through the electric field signal transmission structure;
the magnetic field coil and the electric field probe can be positioned on different wiring layers in the signal detection structure and arranged along a preset direction (for example, axially arranged along the shielding grounding through hole); the electric field probe can be wired along the boundary of a magnetic field induction area formed by the magnetic field coil, so that the magnetic flux receiving of the magnetic field coil is not interfered, and the magnetic field coil and the electric field probe can simultaneously measure the local electromagnetic field distribution of the circuit board to be measured;
referring to fig. 2, fig. 2 is a schematic structural diagram of a strip line according to an embodiment of the electromagnetic field composite passive probe of the present invention, where the strip line may be composed of two grounding metal strips and a middle rectangular cross-section conductor strip with a width ω and a thickness t; because both sides have grounding metal strips, the impedance is easy to control, and the shielding is better; the magnetic field strip line and the electric field strip line can be positioned in different wiring layers, and the interference is shielded through respective grounding metal strips, so that the low loss and low reflection of respective signal transmission are ensured;
the CPW-G transmission line can be composed of a dielectric substrate, three conduction bands on the upper surface of the dielectric substrate and a metal grounding layer on the lower surface of the dielectric substrate; the structure of the CPW-G transmission line can be as shown in fig. 3, where fig. 3 is a schematic structural diagram of a CPW-G transmission line according to an embodiment of the electromagnetic field composite passive probe of the present invention, a thin central conductor strip is in the middle, and two sides of the central conductor strip are parallel to each other and are close to each other, and are ground conduction bands; the small distance between the central conductor strip and the grounding conduction strip can realize the low impedance of the circuit, and the transmission impedance of the CPW-G can be changed by adjusting the distance; the metal surface of the grounding conduction band is semi-infinite, but the area of the grounding conduction band is limited in practical processing; the grounding conduction band on the upper surface of the dielectric substrate is connected with the metal grounding layer on the lower surface of the dielectric substrate through the metal filled via hole, so that consistent grounding performance is realized; due to the enhanced grounding structure, the impedance of the grounding plane can be reduced, the impedance design of the CPW-G and the transmission of radio frequency signals can be facilitated, and the radio frequency signals can be transmitted in the form of 50 ohm impedance.
The external signal analysis interface can be used for connecting an external signal analysis instrument; preferably, a solderable SMA (microwave high frequency connector) connector; specifically, the signal analysis instrument may include an oscilloscope, a spectrum analysis instrument, and the like; after the acquired signals are processed by data, interference image reconstruction can be carried out.
The through holes mentioned in the embodiments of the present invention are holes penetrating through the entire printed circuit board, and can be used for realizing internal interconnection or as mounting positioning holes of components; the cylindrical surface of the hole wall can be plated with a layer of metal by a chemical deposition method to be used for communicating copper foils needing to be communicated with each other in the middle, and the function of electrically connecting, fixing or positioning devices can be achieved; the shielding grounding through hole is connected with a grounding layer and can be used for inhibiting interference, and particularly, the shielding grounding through hole can be connected with the grounding layer of the top layer and the bottom layer of the PCB; the conversion through hole can be used for converting the strip line transmission structure into a CPW-G transmission line structure, the conduction between the conductor strip of the strip line and the central conductor strip of the CPW-G transmission line is realized through the conductive hole wall, the transmission impedance matching is ensured, the signal attenuation is inhibited, and the transmission resonance is reduced;
specifically, the dielectric substrate of the PCB of the probe can be made of a high-frequency substrate material; preferably, the dielectric substrate can be made of FR4 material, hydrocarbon ceramic material (such as Rogers4350B), etc., or the PCB board can be made by LTCC process; through reasonable structural design and selection of PCB dielectric layer materials, the application frequency range of the electromagnetic field composite passive probe can be 1MHz (megahertz) -20GHz (gigahertz);
furthermore, the structure of the probe can adopt different sizes, and the external connector can adopt different types; the magnetic field intensity H can be obtained by the probex(or H)y) Electric field intensity EzThe magnitude of the magnetic field signal and the magnitude of the electric field signal can be obtained through calculation and calibration; the spatial resolution of the probe can be calibrated by scanning the width of the known microstrip line;
specifically, a network analyzer and a microstrip line can be used for building an electromagnetic field composite passive probe calibration system; the microstrip line for calibration can be considered as an external standard that can be used to transmit a standard field; the standard component can generate a certain radio frequency electric field, and the probe scans the standard component to obtain the spatial resolution; the specific scanning method comprises the following steps: detecting at different positions by using a probe, detecting the field intensity, and drawing a relation graph of the field intensity at different positions along with the positions to further obtain the spatial resolution; by the calibration system and the scanning method, the measurement result of the electromagnetic field composite passive probe can be detected and calibrated.
In a specific embodiment, referring to fig. 4, fig. 4 is a schematic structural diagram of a switching through hole according to an embodiment of the electromagnetic field composite passive probe of the present invention, where the magnetic field switching through hole includes a magnetic field central through hole and a plurality of magnetic field surrounding through holes surrounding the magnetic field central through hole by a predetermined distance for shielding signal interference; the second end of the magnetic field strip line is connected with the first end of the magnetic field CPW-G transmission line through the conductive hole wall of the magnetic field central through hole;
the electric field conversion through holes comprise an electric field central through hole and a plurality of electric field surrounding through holes which surround the electric field central through hole at a preset distance and are used for shielding signal interference; and the second end of the electric field strip line is connected with the first end of the electric field CPW-G transmission line through the conductive hole wall of the electric field central through hole.
Specifically, the central through hole can be used for converting a stripline transmission structure into a CPW-G transmission line structure, ensuring transmission impedance matching and inhibiting transmission resonance; and the surrounding vias can be used to suppress signal attenuation;
it should be noted that the magnetic field center through hole and the electric field center through hole belong to a center through hole; the central through hole realizes the conduction between the conductor strip of the strip line and the central conductor strip of the CPW-G transmission line through the conductive hole wall;
the magnetic field surrounding through hole and the electric field surrounding through hole belong to surrounding through holes; the surrounding through hole surrounds the central through hole, is positioned within a preset distance of the central through hole and is connected with a grounding layer of the PCB, so that transmission impedance matching can be ensured, and transmission resonance is inhibited; the number of the surrounding through holes and the preset distance of the central through hole can be adjusted according to parameters such as the structure of the probe, the size of the transmission structure, the thickness of the medium substrate of the substrate and the like;
through the reasonable structural design of the conversion through hole, the electromagnetic field composite probe provided by the embodiment of the invention can transmit radio-frequency signals in a 50 ohm impedance mode, and the low loss and low reflection of the signals are ensured in the transmission process; the structure of the conversion through hole ensures the transmission impedance matching of the probe, inhibits signal attenuation and transmission resonance, and improves the electric field detection efficiency.
Preferably, in one particular embodiment, as shown in FIG. 4, the number of surrounding through holes is six.
Specifically, the number of surrounding through holes may be six; the six surrounding through holes are located within the preset distance of the central through hole, so that impedance mismatch caused by the central through hole can be compensated, transmission impedance is guaranteed to be 50 ohms, and transmission efficiency of the probe is improved.
In a specific embodiment, the wiring layers are a first ground layer, an additional layer, a magnetic field signal layer, a second ground layer, an electric field signal layer and a third ground layer, which are stacked in sequence.
Referring to fig. 5 to 10, fig. 5 is a schematic structural diagram of a first ground plane of an embodiment of the electromagnetic field composite passive probe according to the present invention; FIG. 6 is a schematic diagram of an additional layer of an embodiment of the electromagnetic field composite passive probe of the present invention; FIG. 7 is a schematic diagram of a magnetic field signal layer of an embodiment of the electromagnetic field composite passive probe of the present invention; fig. 8 is a schematic structural diagram of a second ground plane of the electromagnetic field composite passive probe according to the embodiment of the present invention; FIG. 9 is a schematic diagram of an electric field signal layer of an embodiment of the electromagnetic field composite passive probe of the present invention; fig. 10 is a schematic structural diagram of a third ground plane of the electromagnetic field composite passive probe according to the embodiment of the present invention;
specifically, the PCB may include a first wiring layer, a second wiring layer, a third wiring layer, a fourth wiring layer, a fifth wiring layer, and a sixth wiring layer, which are sequentially stacked; the first wiring layer (a ground metal may be routed in a hatched portion in fig. 5), the fourth wiring layer (a ground metal may be routed in a hatched portion in fig. 8), and the sixth wiring layer (a ground metal may be routed in a hatched portion in fig. 10) are ground layers, the second wiring layer is an additional layer (a ground metal may be routed in a hatched portion in fig. 6), the third wiring layer is a magnetic-field signal layer, and the fifth wiring layer is an electric-field signal layer;
it should be noted that the ground layer can be used to shield interference; additional layers may be used to form the CPW-G structure; the signal layer can be used for signal transmission;
specifically, the embodiment of the invention can adopt a four-layer PCB or a multi-layer PCB.
The interference of an electric field of a piece to be detected can cause that the magnetic field and the electric field are difficult to be distinguished at high frequency, thereby influencing the accuracy of detection data of the probe;
to this end, in a specific embodiment, as shown in fig. 5, 7, 8, and 10, the first ground layer is wired outside the first magnetic-field-sensing area where the magnetic-field coil is formed in the first ground layer, and is provided with a first opening communicating with the first magnetic-field-sensing area;
the second grounding layer is arranged outside a second magnetic field induction area formed by the magnetic field coil on the second grounding layer and is provided with a second opening communicated with the second magnetic field induction area;
the third grounding layer is arranged outside a third magnetic field induction area formed by the magnetic field coil on the third grounding layer and is provided with a third opening communicated with the first magnetic field induction area;
the first opening, the second opening and the third opening are aligned and arranged along the axial direction of the shielding grounding through hole;
the signal detection part is also provided with a blind hole;
the magnetic field coil is wired in the magnetic field signal layer and comprises a magnetic field induction line which is wired in a non-closed mode along the boundary of a fourth magnetic field induction area formed by the magnetic field coil in the magnetic field signal layer;
the first end of the magnetic field induction line is connected with the first end of the magnetic field strip line, and the second end of the magnetic field induction line is connected with the first grounding layer and the second grounding layer through the conductive hole wall of the blind hole.
Specifically, the magnetic field coil forms a magnetic field induction region in each wiring layer and is provided with an opening in each ground layer, the opening being connected to the magnetic field induction region of the corresponding layer; the magnetic field coil forms a magnetic field induction area in the magnetic field signal layer, and the magnetic field induction line is non-closed wiring metal along the magnetic field induction area; one end of the magnetic field induction line is connected with the magnetic field strip line, and the other end of the magnetic field induction line is connected with the adjacent ground layer through the conductive hole wall of the blind hole to form a closed test loop;
it should be noted that the magnetic field induction region is not shielded by the metal layer, and can be used for inducing the change of magnetic flux through the magnetic field lines; the magnetic field induction lines are arranged along the magnetic field induction area and can generate radio frequency signals according to the magnetic flux change in the magnetic field induction area; furthermore, the openings are aligned in the axial direction of the shielding grounding through hole, namely, the opening connected with the magnetic field induction area is arranged in the direction perpendicular to the PCB surface and can be used for passing through electric field lines, the magnetic field induction lines can penetrate through the area arranged by the openings, the electric field lines passing through the opening are received, mutual induction electric field signals are generated and eliminated through the grounding layer, and therefore signal interference is suppressed, and the electric field rejection ratio and the accuracy of probe detection data are improved;
through the reasonable design of the magnetic field induction area and the magnetic field induction lines, the electric field rejection ratio can be improved, the interference of electric field distribution on magnetic field detection is avoided, and then the simultaneous detection of the magnetic field and the electric field is realized.
In a specific embodiment, referring to fig. 9 and 11, fig. 11 is a schematic structural diagram of an electric field probe in an electric field signal layer according to an embodiment of the electromagnetic field composite passive probe of the present invention, where the electric field probe is wired in the electric field signal layer;
the electric field probe comprises a connecting line and a detecting line for measuring the change of the electric field line;
the connecting wire is arranged outside a fifth magnetic field induction area formed by the magnetic field coil in the electric field signal layer and is provided with a fourth opening communicated with the fifth magnetic field induction area;
the fourth opening is aligned with the first opening, the second opening and the third opening along the axial direction of the shielding grounding through hole;
the middle section of the connecting wire is connected with the first end of the electric field strip line, and the end point is connected with the detecting line.
Specifically, the field coil forms a fifth magnetic field induction region in the electric field signal layer; the connecting line of the electric field probe is arranged along the boundary of the fifth magnetic field induction area, and is provided with a fourth opening which is connected with the fifth magnetic field induction area and is aligned with the first opening, the second opening and the third opening; the connecting line comprises a middle section, a first end point and a second end point, wherein the first end point and the second end point are arranged at two ends of the middle section; the middle section of the connecting line can be connected with the electric field strip line, and the first end point and/or the second end point can be connected with a detection line for measuring the change of the electric field line;
it should be noted that, the connecting line is wired along the fifth magnetic field sensing area, so that interference to magnetic flux can be avoided; the fourth opening formed by the connecting line is aligned with other openings, and forms an electric field line channel with the first opening, the second opening and the third opening, and the magnetic field induction lines can penetrate through the aligned areas of the openings, receive the electric field lines passing through the openings, generate mutual induction electric field signals and eliminate the mutual induction electric field signals through the ground layer, so that signal interference is inhibited, and the electric field rejection ratio and the accuracy of probe detection data are improved; the detection line connected with the end point of the connecting line is not shielded by a metal structure and is not influenced by the acquisition of magnetic field signals, and the distribution information of the electric field can be efficiently detected.
Further, in a specific embodiment, as shown in fig. 9 and 11, the end points of the connecting line include a first end point and a second end point;
the detection line comprises a first measurement line and a second measurement line;
the first end point is connected with a first measuring line; the second end point is connected with the second measuring line.
Specifically, the connection line provided with the fourth opening includes a first end point and a second end point, and the detection line may include a first measurement line and a second measurement line; the first measuring line can be connected with the first end point, and the second measuring line can be connected with the second end point;
it should be noted that the signal detection structure of the plurality of measurement lines can improve the efficiency of the electric field probe for detecting the electric field distribution.
In a specific embodiment, as shown in fig. 5, 7, and 8, the conductor strip of the magnetic field stripline is routed on the magnetic field signal layer, the first ground strap is routed on the first ground layer, and the second ground strap is routed on the second ground layer;
referring to fig. 8-10, the conductor strips of the electric field striplines are routed in the electric field signal layer, the first ground strap is routed in the second ground layer, and the second ground strap is routed in the third ground layer.
Specifically, the strip line may be composed of two grounding metal strips and a middle conductor strip; specifically, the conductor strip of the magnetic field strip line is wired on the magnetic field signal layer of the PCB and can be used for transmitting signals; the grounding metal strips of the magnetic field strip lines are respectively positioned on the first grounding layer and the second grounding layer of the PCB and can be used for shielding interference and controlling the transmission impedance of the strip line conductor strips; conductor strips of the electric field strip lines are arranged on an electric field signal layer of the PCB and can be used for transmitting signals; the grounding metal strips of the electric field strip lines are respectively positioned on the second grounding layer and the third grounding layer of the PCB and can be used for shielding interference and controlling the transmission impedance of the strip line conductor strips;
the first end of the magnetic field strip line is connected with the electric field probe, the second end of the magnetic field strip line can be connected with the CPW-G transmission line through the magnetic field conversion through hole, and the transmission structure can ensure transmission impedance matching and inhibit signal attenuation and transmission resonance; the first end of the electric field strip line is connected with the electric field probe, the second end of the electric field strip line can be connected with the CPW-G transmission line through the electric field conversion through hole, and the transmission structure can ensure transmission impedance matching and inhibit signal attenuation and transmission resonance; the signal transmission structure design of the two physical quantities ensures that the electromagnetic field composite passive probe has higher detection bandwidth and ensures high-precision electromagnetic field distribution measurement, and can realize local high-bandwidth and high-precision electromagnetic field distribution measurement of a circuit board to be measured (including an integrated circuit on the board).
In one specific embodiment, as shown in fig. 5 and 6, the center conductor strip and the ground conduction strip of the magnetic field CPW-G transmission line are routed on the first ground plane, and the metal ground plane is routed on the additional layer;
the center conductor strip and the ground conduction strip of the electric field CPW-G transmission line are routed on the first ground layer, and the metal ground layer is routed on the additional layer.
Specifically, the CPW-G transmission line may be composed of a dielectric substrate, three conduction bands on an upper surface of the dielectric substrate, and a metal ground layer on a lower surface of the dielectric substrate; specifically, the central conductor strip of the CPW-G transmission line and the ground conduction strips on both sides of the central conductor strip may be routed on the first ground layer, and the metal ground layer may be routed on an additional layer adjacent to the first ground layer for enhanced grounding structure, so that the CPW-G transmission line may have a wider effective bandwidth and a larger impedance range;
the central conductor strip of the CPW-G transmission line is a thin central conductor strip, and the two sides of the central conductor strip, which are parallel to the central conductor strip and are close to the central conductor strip, are ground conduction strips; the small distance between the central conductor strip and the grounding conduction strip can realize the low impedance of the circuit, and the impedance of the circuit can be changed by adjusting the distance; the metal surface of the grounding conduction band is semi-infinite, but the area of the grounding conduction band is limited in practical processing; the ground conduction band of the first ground layer is connected with the metal ground layer of the first signal layer through the metal-filled via hole, and therefore consistent grounding performance is achieved.
In a specific embodiment, as shown in fig. 12, fig. 12 is a schematic structural diagram of a mounting hole of an electromagnetic field composite passive probe according to an embodiment of the present invention, and the PCB further includes a mounting hole for connecting an external three-dimensional linkage detection device.
Specifically, the PCB of the electromagnetic field composite probe is also provided with a mounting hole which can be used for mounting the probe on external three-dimensional linkage detection equipment; the electromagnetic field composite probe can be used for efficiently measuring the circuit board to be measured through the control of the three-dimensional linkage detection equipment.
In order to realize high detection bandwidth of the electromagnetic field composite probe, a PCB (printed Circuit Board) can be made of high-frequency substrate materials;
preferably, in a specific embodiment, the PCB board is a circuit board of FR4 substrate material;
or
Referring to fig. 12, the PCB board is a circuit board of a hydrocarbon ceramic substrate material.
Specifically, for high-frequency electric field detection, a circuit board made of FR4 substrate material (e.g., a glass fiber epoxy resin copper clad laminate) can be used; specifically, the FR4 substrate material has heat resistance of about 300 ℃, working frequency of several GHz and dielectric constant of about 4.3;
alternatively, the electromagnetic field composite probe may also employ a circuit board of a hydrocarbon ceramic substrate material (e.g., Rogers 4350B); specifically, for example, the substrate material of the Rogers4 series can have a dielectric constant of about 3.5 and a dissipation factor of less than 0.004;
the substrate characteristics of the high-frequency substrate material may include: the dielectric constant must be small and relatively stable; the dielectric loss of the signal transmission system is required to be small, and the smaller the dielectric loss is, the smaller the signal loss is; the low water absorption and the high water absorption can influence the dielectric constant and the dielectric loss when being affected with damp; heat resistance, chemical resistance, impact strength, peel strength, and the like must also be good; the circuit board made of the high-frequency substrate material can ensure transmission impedance matching, inhibit signal attenuation and transmission resonance and ensure the electric field detection efficiency.
In a specific embodiment, the PCB is a circuit board prepared by LTCC process.
Specifically, the electromagnetic field composite probe can adopt a circuit board prepared by an LTCC process;
it should be noted that the characteristics of LTCC include: the ceramic material has the characteristics of excellent high-frequency and high-speed transmission and wide passband; according to different ingredients, the dielectric constant of the LTCC material can be changed in a large range, and a high-conductivity metal material is used as a conductor material in a matched manner, so that the quality factor of a circuit system can be improved, and the flexibility of circuit design is improved; compared with the common PCB circuit substrate, the heat conduction performance is better, the heat dissipation design of the electronic equipment is greatly optimized, and the reliability is high; good compatibility with other multilayer wiring technologies, such as hybrid multilayer substrates that combine LTCC with thin film wiring technologies to achieve higher packing density and better performance;
the circuit board prepared by the LTCC process can ensure transmission impedance matching, inhibit signal attenuation and transmission resonance and ensure the electric field detection efficiency.
In order to facilitate understanding of the structural design of the electromagnetic field composite probe of the present invention, a probe made of Rogers4350B substrate material is taken as an example, as shown in fig. 12 and 13, fig. 13 is a schematic diagram of a thickness direction structure of an example of the electromagnetic field composite passive probe of the present invention, wherein the thickness of the first layer of copper (corresponding to the first wiring layer and the first ground layer) may be 35 μm (micrometer); the first media substrate may have a thickness of 16.6 mils; the thickness of the second layer of copper (corresponding to the second wiring layer, additional layer described above) may be 35 μm; the thickness of the first insulating thin sheet is 4 mil; the thickness of the third layer of copper (corresponding to the third wiring layer, magnetic field signal layer described above) may be 35 μm; the second dielectric substrate may have a thickness of 13.3 mils; the thickness of the fourth copper layer (corresponding to the fourth wiring layer and the second ground layer) may be 35 μm; the second insulating sheet may have a thickness of 8 mils; the thickness of the fifth layer of copper (corresponding to the fifth wiring layer, electric field signal layer described above) may be 18 μm; the third dielectric substrate may have a thickness of 13.3 mils; the thickness of the sixth layer of copper (corresponding to the sixth wiring layer, third ground layer described above) may be 18 μm; the conductor strip of the magnetic field strip line at the third copper layer may have a length of 76mm (millimeters), a width of 15.748 mils, and a thickness of 35 μm; the conductor strip of the electric field strip line at the fifth copper layer may have a length of 76mm (millimeters), a width of 8mil, and a thickness of 18 μm; the center conductor strip of the CPW-G transmission line at the first copper layer may have a length of 6.35mm, a width of 0.72mm, and a thickness of 35 μm; the thickness of the metal ground layer of the CPW-G transmission line at the second copper layer may be 35 μm; the dielectric substrate of the CPW-G transmission line may be the first dielectric substrate and may have a thickness of 16.6 mils.
The PCB of the electromagnetic field composite passive probe comprises a signal detection part and a signal transmission part; the signal detection part comprises a magnetic field coil and an electric field probe; the signal transmission part comprises a magnetic field strip line, a magnetic field CPW-G transmission line, a magnetic field conversion through hole, an electric field strip line, an electric field CPW-G transmission line and an electric field conversion through hole; the signal detection part respectively forms radio frequency signals according to the change of the magnetic flux and the electric field; each radio frequency signal is transmitted out through the transmission structure of the strip line, the conversion through hole and the CPW-G transmission line, so that the low loss and the low reflection of the signal are ensured; through the structural design of the signal detection part and the signal transmission part, the electric field rejection ratio can be improved, the electromagnetic field passive composite probe can simultaneously detect a magnetic field and an electric field, and the local high-bandwidth and high-precision electromagnetic field distribution of a circuit board to be measured (including an integrated circuit on the board) can be measured.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711464715.2A CN108226656B (en) | 2017-12-28 | 2017-12-28 | Electromagnetic field composite passive probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711464715.2A CN108226656B (en) | 2017-12-28 | 2017-12-28 | Electromagnetic field composite passive probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108226656A CN108226656A (en) | 2018-06-29 |
| CN108226656B true CN108226656B (en) | 2020-04-03 |
Family
ID=62646563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711464715.2A Active CN108226656B (en) | 2017-12-28 | 2017-12-28 | Electromagnetic field composite passive probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108226656B (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109061320B (en) * | 2018-07-27 | 2020-12-08 | 中国电子产品可靠性与环境试验研究所（工业和信息化部电子第五研究所、中国赛宝实验室） | Electromagnetic Field Composite Probes and Detection Systems |
| CN109596897A (en) * | 2018-11-15 | 2019-04-09 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | The compound passive probe of electromagnetic field |
| CN109884412B (en) * | 2019-01-28 | 2021-04-13 | 北京航空航天大学 | Ultra-wideband electric field probe adopting U-shaped structure |
| CN109655770B (en) * | 2019-01-30 | 2023-05-23 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Differential magnetic field probe |
| CN109884562B (en) * | 2019-03-29 | 2021-04-16 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Differential magnetic field detection module and magnetic field probe |
| CN109884561B (en) * | 2019-03-29 | 2021-04-20 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Magnetic field detection module and magnetic field probe |
| CN110045171B (en) * | 2019-04-02 | 2021-04-20 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Radio frequency voltage current composite probe |
| CN110095656B (en) * | 2019-05-27 | 2021-03-09 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Probing Modules and Probes |
| WO2021119898A1 (en) * | 2019-12-16 | 2021-06-24 | 瑞声声学科技(深圳)有限公司 | Transmission line |
| US11889770B2 (en) | 2020-04-16 | 2024-01-30 | International Business Machines Corporation | Low loss conductive line using bridged conductor |
| CN112213565B (en) * | 2020-08-14 | 2022-12-09 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Electromagnetic Field Passive Probes and Detection Systems |
| CN112526221B (en) * | 2020-10-26 | 2023-04-14 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Electromagnetic Field Composite Probes and Detection Systems |
| CN113238098B (en) * | 2021-05-12 | 2022-03-29 | 厦门大学 | Broadband Electric Field Probe for Simultaneous Measurement of Two-Component Electric Fields |
| CN113960374A (en) * | 2021-10-09 | 2022-01-21 | 中国舰船研究设计中心 | Near-field measurement composite electromagnetic probe |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1110010A (en) * | 1993-08-31 | 1995-10-11 | 日立磁铁心股份有限公司 | Strip line-type high-frequency element |
| DE4440937A1 (en) * | 1994-10-31 | 1996-07-11 | Gunter Dipl Ing Langer | Field source for testing electromagnetic compatibility testing, using passive magnetic field probe |
| CN101452033A (en) * | 2009-01-08 | 2009-06-10 | 福建星网锐捷网络有限公司 | Electromagnetic compatibility test probe for cable common mode signal and test equipment |
| CN203259600U (en) * | 2013-05-22 | 2013-10-30 | 浪潮电子信息产业股份有限公司 | Near field measuring tool for electromagnetic field |
| CN203456568U (en) * | 2013-09-26 | 2014-02-26 | 安徽蓝麦通信科技有限公司 | Signal transmission board of double grounding conductor |
| CN104062512A (en) * | 2014-06-11 | 2014-09-24 | 工业和信息化部电子第五研究所 | Two-way board-level radio frequency magnetic field probe |
| CN204666743U (en) * | 2015-05-07 | 2015-09-23 | 郴州市久隆旺高科电子有限公司 | A kind of test cabinet with electromagnetic compatibility test probe |
| CN204740272U (en) * | 2015-06-02 | 2015-11-04 | 瑞斯康达科技发展股份有限公司 | Passive probe |
| CN105717466A (en) * | 2016-04-08 | 2016-06-29 | 北京航空航天大学 | Broadband minitype near field magnetic field measurement probe |
| CN205426973U (en) * | 2016-03-24 | 2016-08-03 | 吉林大学 | Anti electromagnetic pulse coupling interference 's passive probe |
-
2017
- 2017-12-28 CN CN201711464715.2A patent/CN108226656B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1110010A (en) * | 1993-08-31 | 1995-10-11 | 日立磁铁心股份有限公司 | Strip line-type high-frequency element |
| DE4440937A1 (en) * | 1994-10-31 | 1996-07-11 | Gunter Dipl Ing Langer | Field source for testing electromagnetic compatibility testing, using passive magnetic field probe |
| CN101452033A (en) * | 2009-01-08 | 2009-06-10 | 福建星网锐捷网络有限公司 | Electromagnetic compatibility test probe for cable common mode signal and test equipment |
| CN203259600U (en) * | 2013-05-22 | 2013-10-30 | 浪潮电子信息产业股份有限公司 | Near field measuring tool for electromagnetic field |
| CN203456568U (en) * | 2013-09-26 | 2014-02-26 | 安徽蓝麦通信科技有限公司 | Signal transmission board of double grounding conductor |
| CN104062512A (en) * | 2014-06-11 | 2014-09-24 | 工业和信息化部电子第五研究所 | Two-way board-level radio frequency magnetic field probe |
| CN204666743U (en) * | 2015-05-07 | 2015-09-23 | 郴州市久隆旺高科电子有限公司 | A kind of test cabinet with electromagnetic compatibility test probe |
| CN204740272U (en) * | 2015-06-02 | 2015-11-04 | 瑞斯康达科技发展股份有限公司 | Passive probe |
| CN205426973U (en) * | 2016-03-24 | 2016-08-03 | 吉林大学 | Anti electromagnetic pulse coupling interference 's passive probe |
| CN105717466A (en) * | 2016-04-08 | 2016-06-29 | 北京航空航天大学 | Broadband minitype near field magnetic field measurement probe |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108226656A (en) | 2018-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108226656B (en) | Electromagnetic field composite passive probe | |
| CN108152606B (en) | Electric field passive probe | |
| CN108184306B (en) | Electric field passive probe | |
| Chou et al. | Magnetic near-field probes with high-pass and notch filters for electric field suppression | |
| CN109061320B (en) | Electromagnetic Field Composite Probes and Detection Systems | |
| Chou et al. | Space difference magnetic near-field probe with spatial resolution improvement | |
| CN102576048B (en) | A device interface board with cavity back for very high frequency applications | |
| CN109884562B (en) | Differential magnetic field detection module and magnetic field probe | |
| CN109655770B (en) | Differential magnetic field probe | |
| CN109596897A (en) | The compound passive probe of electromagnetic field | |
| CN112526221B (en) | Electromagnetic Field Composite Probes and Detection Systems | |
| US9804195B2 (en) | HF measuring probe contacting assembly | |
| CN109884561B (en) | Magnetic field detection module and magnetic field probe | |
| CN112698251A (en) | Magnetic field passive probe and magnetic field detection device | |
| CN114966230A (en) | Electromagnetic field probe | |
| Chou et al. | Electric field coupling suppression using via fences for magnetic near-field shielded-loop coil probes in low temperature co-fired ceramics | |
| JP5024587B2 (en) | Magnetic field detector and current measuring method used for magnetic field and current measurement | |
| CN115327453A (en) | Electromagnetic field composite probe | |
| CN112213565B (en) | Electromagnetic Field Passive Probes and Detection Systems | |
| Sivaraman et al. | Broad band PCB probes for near field measurements | |
| Namahoot et al. | Design of a low‐cost 1‐20 GHz magnetic near‐field probe with FR‐4 printed circuit board | |
| Kayano et al. | Transmission characteristics and shielding effectiveness of shielded-flexible printed circuits for differential-signaling | |
| Rider et al. | Crosstalk and EMI in mixed-signal/microwave multi-layer pc boards | |
| Yamagiwa et al. | Experimental extraction method for primary and secondary parameters of shielded-flexible printed circuits | |
| CN115516327B (en) | electromagnetic field sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |