CN108155109B - Pin welding method of chip - Google Patents
Pin welding method of chip Download PDFInfo
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- CN108155109B CN108155109B CN201711481486.5A CN201711481486A CN108155109B CN 108155109 B CN108155109 B CN 108155109B CN 201711481486 A CN201711481486 A CN 201711481486A CN 108155109 B CN108155109 B CN 108155109B
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- 238000003466 welding Methods 0.000 title claims abstract description 159
- 238000000034 method Methods 0.000 title claims abstract description 33
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 230000001680 brushing effect Effects 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims description 70
- 238000013519 translation Methods 0.000 claims description 61
- 238000001816 cooling Methods 0.000 claims description 60
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 59
- 238000010438 heat treatment Methods 0.000 claims description 55
- 238000005086 pumping Methods 0.000 claims description 47
- 239000003292 glue Substances 0.000 claims description 36
- 238000009434 installation Methods 0.000 claims description 35
- 238000007789 sealing Methods 0.000 claims description 27
- 238000007790 scraping Methods 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 22
- 239000007789 gas Substances 0.000 claims description 21
- 229910052757 nitrogen Inorganic materials 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- 238000005476 soldering Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 230000007723 transport mechanism Effects 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000005012 migration Effects 0.000 claims description 2
- 238000013508 migration Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 3
- 238000012797 qualification Methods 0.000 abstract description 3
- 239000006071 cream Substances 0.000 description 21
- 229910001873 dinitrogen Inorganic materials 0.000 description 19
- 239000003921 oil Substances 0.000 description 14
- 239000003973 paint Substances 0.000 description 7
- 238000000746 purification Methods 0.000 description 7
- 238000007599 discharging Methods 0.000 description 6
- 238000005485 electric heating Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000002146 bilateral effect Effects 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 210000003437 trachea Anatomy 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000001772 blood platelet Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/80009—Pre-treatment of the bonding area
- H01L2224/80024—Applying flux to the bonding area in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
A pin welding method of a chip belongs to the technical field of chip production. The method is characterized in that: the method comprises the following steps: 1) respectively brushing tin paste on the electrode on the back of the chip and the pin, and directly connecting the electrode on the back of the chip and the pin; 2) connecting two poles on the front surface of the chip with corresponding pins through jumper wires, and brushing solder paste between each jumper wire and the corresponding pole and pin of the chip; 3) and moving the chip together with the pins and the jumper wire into a vacuum welding furnace for one-time welding. The pin welding method of the chip ensures that the positive electrode of the chip is stably connected with the corresponding pin, ensures that the pin and the chip are stably connected, has good conductivity, can weld three pins of the chip once, is simple to process, has firm connection with the chip, cannot generate the problem of open welding or disconnection, and has high product qualification rate.
Description
Technical Field
A pin welding method of a chip belongs to the technical field of chip production.
Background
When a high-power chip with three pins, such as a triode, a silicon controlled rectifier and the like, is produced, the pins are required to be connected to three electrodes of the chip respectively, and then silica gel is packaged to complete the production of the chip. The three poles of the chip are distributed on two surfaces of the chip, namely the back surface is provided with one pole, the front surface is provided with two poles, and the two poles on the front surface are separated by the oxide layer. The existing process for welding the chip and the pin usually adopts solder paste to weld the electrode on the back of the chip and the pin, then two electrodes on the front of the chip are respectively connected with the pin through a metal wire, the existing connection mode usually places the metal wire on the upper side of the electrode and the pin corresponding to the chip, and then scrapes the metal wire on the upper side of the metal wire by a scraper, so that the metal wire is melted by utilizing the heat generated by the friction between the scraper and the metal wire, and then the welding of the metal wire, the chip and the pin is completed.
The metal wire is usually a gold wire, a copper wire or an aluminum wire, the gold wire is rarely used due to high price, the copper wire has high melting point and is difficult to weld, and therefore the aluminum wire is the most commonly used metal wire at present. In order to facilitate the melting of the wires, the wires are usually very fine, which results in a high resistance of the wires, and multiple wires need to be connected in parallel at the same time to reduce the resistance of the chip and the pins. However, the metal wire is thin, so that the connection between the metal wire and the chip or the pin is unstable, the conduction is poor, the metal wire is easy to break, the triode or the silicon-controlled rectifier is easy to work unstably, and the service life is short.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the defects of the prior art are overcome, and the pin welding method for the chip which ensures stable connection between the produced triode or silicon controlled tube pin and the chip and good conductivity is provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: the pin welding method of the chip is characterized in that: the method comprises the following steps:
1) respectively brushing tin paste on the electrode on the back of the chip and the pin, and directly connecting the electrode on the back of the chip and the pin;
2) connecting two poles on the front surface of the chip with corresponding pins through jumper wires, and brushing solder paste between each jumper wire and the corresponding pole and pin of the chip;
3) and moving the chip together with the pins and the jumper wire into a vacuum welding furnace for one-time welding.
Preferably, the jumper wire in the step 1) or 3) is a metal plate, two ends of the jumper wire are bent downwards to form a bent part, and a connection point is arranged at the lower end of the bent part.
Preferably, the jumper wire in step 1) or 3) is a copper jumper wire.
Preferably, two connection points of the jumper wire in step 3) are respectively connected with the pole on the front surface of the chip and the corresponding pin.
Preferably, wire jumper and chip pass through the frictioning mechanism and apply paint the tin cream with a brush, the frictioning mechanism is connected with frictioning lift cylinder, the piston rod of frictioning lift cylinder links to each other with the frictioning mechanism and drives the frictioning mechanism and go up and down, the downside of frictioning mechanism is provided with the horizontally frictioning template, is provided with down the gluey hole on the frictioning template.
Preferably, step 1) or 2) the frictioning mechanism include scraper, scraper lift cylinder and frictioning cylinder, the scraper setting is at frictioning template upside, the piston rod of scraper lift cylinder links to each other with the scraper and drives the scraper lift, the frictioning cylinder links to each other with scraper lift cylinder to promote scraper horizontal migration.
Preferably, the upside indent of frictioning template, form and be used for the tin cream to hold the mouth, lower gluey hole all sets up and hold the mouth at the tin cream.
Preferably, the vacuum welding furnace in the step 4) comprises a welding chamber, a furnace cover, a carrying mechanism and a negative pressure pumping module arranged on the furnace cover, the furnace cover is covered on the upper side of the welding chamber, a welding cavity is formed between the welding chamber and the furnace cover, a welding table is arranged on the lower portion of the welding chamber, the bottom of the negative pressure pumping module and the welding table are enclosed to form a closed negative pressure cavity, a heating module is arranged on the welding table, and a shielding gas inlet pipe is arranged on the welding chamber or the furnace cover.
Preferably, the welding bench on be provided with a plurality of stations, all be provided with the bearing portion on the transport mechanism of every station both sides, all be provided with flexible module between every bearing portion and the transport mechanism, the central line of flexible module is parallel with the moving direction of tablet, the flexible portion of flexible module sets up towards the middle part of tablet, the both sides of every station all the symmetry be provided with a plurality ofly with the bearing portion matched with mouth of stepping down.
Preferably, one side of the welding table close to the feeding end is a heating area, one side of the welding table close to the discharging end is a cooling area, a negative pressure pumping module is arranged on the upper side of one end of the heating area close to the cooling area, the negative pressure pumping module can be arranged on the furnace cover in a lifting mode, the bottom of the negative pressure pumping module and the heating area are encircled to form a closed negative pressure cavity, and a shielding gas inlet pipe is arranged on the welding chamber or the furnace cover.
Preferably, the welding platform include polylith hot plate and polylith cooling plate, the heating district is spliced into to the polylith hot plate, the cooling district is spliced into to the polylith cooling plate.
Preferably, the downside of welding chamber be provided with the collection liquid cover, the bottom both sides of collection liquid cover are for the downward slope form gradually by lateral part to middle part, collection liquid cover bottom is equipped with collection liquid cover drain pipe.
Preferably, the protective gas inlet pipe is a main nitrogen inlet pipe, main nitrogen inlet pipes are arranged at two ends of the furnace cover, auxiliary nitrogen inlet pipes are symmetrically arranged at two sides of the middle of the furnace cover, and the auxiliary nitrogen inlet pipes are communicated with the welding chamber.
Preferably, the transport mechanism include the transport pole and set up elevating system, translation mechanism and the mechanism that opens and shuts at the welding chamber downside, the transport pole symmetry is provided with two, and the middle part setting of transport pole is in the welding chamber, the mechanism that opens and shuts links to each other and drives its opening and shutting with two transport poles simultaneously, translation mechanism links to each other with the mechanism that opens and shuts and drives its direction removal along being close to or keeping away from the discharge end, elevating system links to each other with translation mechanism and drives its lift, the inboard at two transport poles is installed to a plurality of flexible module symmetries.
Preferably, the negative pressure pumping module comprises a sealing plate and a negative pressure pumping lifting cylinder, the sealing plate is arranged on the upper side of the welding table and is parallel to the welding table, the bottom of the sealing plate and the welding table are encircled to form a closed negative pressure cavity, and the negative pressure cavity is connected with a negative pressure pumping pipe.
Preferably, the sealing plate is arranged on the lower side of the furnace cover, the negative pressure pumping lifting cylinder is arranged on the upper side of the furnace cover, a piston rod of the negative pressure pumping lifting cylinder is connected with the sealing plate through a connecting pipe, and the connecting pipe is used for communicating the negative pressure cavity with the negative pressure pumping pipe.
Compared with the prior art, the invention has the beneficial effects that:
1. the pin welding method of the chip connects the two positive poles of the chip with the pins through the jumper wires, ensures that the positive poles of the chip are stably connected with the corresponding pins, ensures that the pins and the chip are stably connected, has good conductivity, can weld three pins of the chip once, is simple to process, has firm connection between the pins and the chip, can not generate the problem of open welding or disconnection, and has high product qualification rate, long service life and good product performance.
2. The jumper wire is a metal plate, the cross sectional area is large, the resistance is small under the condition of a certain length, good conductivity between the chip and the pin is guaranteed, the jumper wire is a copper jumper wire, the resistance of copper is smaller than that of aluminum under the condition of the same length and the same cross sectional area, and the resistance between the chip and the pin is further reduced.
3. Scrape gluey mechanism and scrape the tin cream by lower gluey hole, the position one-to-one of the tie point of lower gluey hole and the wire jumper on the lead frame or the utmost point of chip to accurate applying paint the tin cream on the lead frame, improved the stability of applying paint the tin cream greatly, and can guarantee the volume of the tin cream of applying paint with a brush, the qualification rate of applying paint with a brush is high, can also be accurate apply paint the tin cream on the utmost point of chip with a brush, avoid directly communicateing the positive two utmost points of chip, created the condition for adopting the wire jumper connection pin.
4. The scraper lifting mechanism and the frictioning cylinder drive the scraper to move, so that the solder paste is scraped into the lower glue hole, and the solder paste is accurately coated on the lead frame or the chip through the lower glue hole, and the coating efficiency is high.
5. The upside of frictioning template is equipped with the tin cream and holds the mouth, and the tin cream is placed and is held the mouth at the tin cream, and down the jiao kou setting hold the mouth at the tin cream intraorally to in the convenient gluey hole of going into down with the tin cream, can also avoid the tin cream extravagant.
6. Every station both sides of vacuum welding stove all are provided with lets the position mouth, the position of bearing portion can be adjusted to flexible module, thereby can carry out the bearing to the tablet through the both sides of tablet, the tablet is heated and is softened has been avoided, the tablet takes place to warp and breaks away from with transport mechanism when bearing the tablet by the both ends of tablet, make this welding stove can also adapt to the welding of the soft work piece of matter, accommodation is wide, the stable operation, and can avoid welded work piece to take place to warp, the welding quality is improved, the production of defective work has been reduced.
7. The zone of heating can heat the tablet, thereby make the tablet can the rapid weld completion in the negative pressure intracavity, be filled with the protective gas in the weld chamber, thereby can avoid among the heating process tablet and oxygen to take place the reaction, the cooling zone can cool off the tablet, thereby make the tablet temperature that shifts out the weld chamber low, the tablet has been avoided promptly by the oxidation, convenient in time again handles the good tablet of welding, and can not appear in the processing procedure because tablet high temperature variability leads to the processing procedure in tablet deformation, lead to the problem that the defective rate risees, the tablet is direct to contact with the zone of heating or cooling zone, heating and cooling have been realized through heat-conducting mode, compare with the heating mode that adopts the radiation, the rate of heating has been improved greatly, the intensification and the cooling that make the tablet can be quick, the consumption of energy has been reduced.
8. The polylith hot plate splices into the zone of heating, and polylith cooling plate splices into the cooling space to can make and hold polylith tablet in the welding chamber simultaneously, the zone of heating heats polylith tablet simultaneously, makes the tablet can reach welding temperature fast, has improved welding speed.
9. The liquid collecting cover can discharge liquid formed by condensation of the cooling area through the liquid outlet pipe of the liquid collecting cover.
10. Two ends of the furnace cover are provided with main nitrogen gas inlet pipes, and two sides of the middle part of the furnace cover are symmetrically provided with auxiliary nitrogen gas inlet pipes, so that the welding chamber can be quickly filled with nitrogen gas, the preparation time before welding is short, and the use is convenient.
11. The opening and closing mechanism drives the two carrying rods to open and close, and is matched with the lifting mechanism, so that the bearing part extends into the yielding port of the welding table, the material sheets are supported at two ends of the material sheets, and the translation mechanism drives the material sheets to translate through the carrying rods, so that the translation work of the material sheets is completed.
12. The sealing plate and the heating area form a negative pressure cavity in a surrounding mode, and the negative pressure pumping lifting cylinder can drive the sealing plate to lift, so that the material piece can be conveniently moved into or out of the negative pressure cavity.
13. The negative pressure pumping lifting cylinder is connected with the sealing plate through the connecting pipe and drives the sealing plate to lift, and the negative pressure pumping pipe is communicated with the negative pressure cavity through the connecting pipe, so that the mounting connection of the sealing plate is facilitated, and the negative pressure pumping of the negative pressure cavity is facilitated.
Drawings
FIG. 1 is a perspective view of a vacuum welding furnace.
Fig. 2 is a schematic perspective view of the furnace lid.
Fig. 3 is a schematic sectional front view of the furnace lid.
Fig. 4 is a partially enlarged view of a portion a in fig. 3.
Fig. 5 is a front cross-sectional schematic view of an intake plate.
FIG. 6 is a perspective view of the vacuum welding furnace with the cover removed.
Fig. 7 is a partial enlarged view of fig. 6 at B.
Fig. 8 is a schematic view of the installation of the electric putter.
Fig. 9 is a perspective view of a soldering station.
Fig. 10 is a schematic right view of the welding station.
Fig. 11 is a front view of the negative pressure pumping module.
Fig. 12 is a perspective view of the conveyance mechanism.
Fig. 13 is a front view schematically showing the conveyance mechanism.
Fig. 14 is a front cross-sectional schematic view of a purification module.
Fig. 15 is a perspective view of the squeegee mechanism.
Fig. 16 is a partial enlarged view at C in fig. 15.
Fig. 17 is a schematic bottom view of the squeegee stencil.
Fig. 18 is a partial enlarged view at D in fig. 17.
In the figure: 1. frame 2, carrying mechanism 3, furnace cover cylinder 4, furnace cover 5, main nitrogen inlet pipe 6, guide cover 7, purification inlet pipe 8, purification outlet pipe 9, negative pressure pumping module 10, connecting arm 11, swing arm 12, mounting arm 13, connecting rod 14, furnace cover mounting plate 1401, mounting port 15, gas cover 16, auxiliary nitrogen inlet pipe 17, inlet plate 1701, inlet 1702, gas jet hole 18, welding chamber 19, discharging table 1901, discharging table yielding port 20, welding table 21, feeding table 2101, feeding table yielding port 22, mounting plate 23, adjusting spring 24, carrying rod 25, sealing sleeve 26, end cover 2601, carrying port 2602, baffle mounting groove 27, baffle 28, cooling plate 2801, cooling plate yielding port 29, inlet pipe 30, heating plate 3001, heating plate yielding port 31, The electric heating tube 32, the temperature sensor 33, the liquid collecting cover 3301, the liquid collecting cover liquid outlet tube 34, the negative pressure pumping mounting rack 35, the negative pressure pumping lifting cylinder 36, the sealing plate 37, the connecting tube 38, the connecting plate 39, the frictioning base 40, the lifting rack 41, the translation plate 42, the opening and closing mounting rod 43, the opening and closing guide plate 44, the opening and closing guide wheel 45, the carrying mounting arm 46, the carrying lifting cylinder 47, the lifting guide rack 48, the lifting guide block 49, the translation rack 50, the translation rack guide rail 51, the translation plate guide rail 52, the carrying mounting plate 53, the translation motor 54, the translation motor mounting rack 55, the carrying moving rack 56, the opening and closing moving rack 57, the opening and closing motor mounting rack 58, the opening and closing motor 59, the scraper rack 60, the scraper lifting cylinder 61, the purifying box 62, the purifying air inlet tube 63, the, The device comprises a fan 66, a welding oil collecting barrel 67, a coil 68, fins 69, an electric push rod 70, a scraper 71, a glue scraping template 7101, a glue discharging hole 72, a lead frame conveying plate 73, a lead frame conveying frame 74 and a glue scraping lifting cylinder.
Detailed Description
Fig. 1 to 18 are preferred embodiments of the present invention, and the present invention will be further described with reference to fig. 1 to 18.
A pin welding method of a chip comprises the following steps:
1) respectively brushing tin paste on the electrode on the back of the chip and the pin, and directly connecting the electrode on the back of the chip and the pin;
2) connecting two poles on the front surface of the chip with corresponding pins through jumper wires, and brushing solder paste between each jumper wire and the corresponding pole and pin of the chip;
3) and moving the chip together with the pins and the jumper wire into a vacuum welding furnace for one-time welding.
In this embodiment, the jumper wire is a copper jumper wire, the jumper wire is formed by bending a copper plate, two ends of the jumper wire are bent downwards to form an Contraband shape with a downward opening, and the lower ends of the bending parts at the two ends of the jumper wire are provided with connecting points. The lead frames are rectangular copper frames, and each lead frame is connected with a plurality of jumper wires through connecting ribs, so that batch coating of solder paste for the jumper wires is realized. After the solder paste is applied, the jumper wire is cut from the lead frame.
The glue scraping mechanism is adopted to brush the tin paste on the three poles of the chip, the glue scraping mechanism can accurately brush the tin paste, and the tin paste is prevented from directly communicating the two poles on the front side of the chip. And simultaneously, coating solder paste on one ends of the three pins, which are used for being connected with the chip.
And placing the chip on one pin, connecting the pole on the back of the chip with one end of the pin coated with the solder paste, and contacting the solder paste on the pole on the back of the chip with the solder paste on the pin. And then, connecting the two poles on the front surface of the chip with the corresponding pins by using jumper wires, wherein the solder pastes on the two connecting points of the jumper wires are respectively contacted with the solder paste on the poles on the front surface of the chip and the solder paste of the corresponding pins.
And (3) the chip is communicated with the three pins and the two jumper wires and is moved into a vacuum welding furnace together to complete welding, and then the chip which is welded is coated with silica gel to complete the production and the manufacture of the triode or the silicon controlled rectifier.
As shown in fig. 1: the vacuum welding furnace comprises a welding chamber 18, a furnace cover 4, a carrying mechanism 2 and a negative pressure pumping module 9 arranged on the furnace cover 4, wherein the furnace cover 4 covers the upper side of the welding chamber 18, a welding cavity is formed between the welding chamber 18 and the furnace cover 4, a welding table 20 is arranged on the lower portion of the welding chamber 18, the bottom of the negative pressure pumping module 9 and the welding table 20 are enclosed to form a closed negative pressure cavity, a plurality of stations are arranged on the welding table 20, bearing parts are arranged on the carrying mechanism 2 on two sides of each station, a telescopic module is arranged between each bearing part and the carrying mechanism 2, the central line of each telescopic module is parallel to the moving direction of a material sheet, the telescopic parts of the telescopic modules are arranged towards the middle of the material sheet, and a plurality of position yielding ports matched with the bearing parts are symmetrically arranged on two sides of each station. Every station both sides of this wide vacuum welding stove of accommodation all are provided with lets the position mouth, the position of bearing portion can be adjusted to flexible module, thereby can carry out the bearing to the tablet through the both sides of tablet, the tablet is heated and is softened has been avoided, the tablet takes place to warp and breaks away from with transport mechanism when bearing the tablet by the both ends of tablet, make this welding stove can also adapt to the welding of the soft work piece of matter, accommodation is wide, the stable operation, and can avoid the welded work piece to take place to warp, the welding quality is improved, the production of defective work has been reduced.
One side of the welding table 20 close to the feeding end is a heating area, one side of the welding table 20 close to the discharging end is a cooling area, a negative pressure pumping module 9 is arranged on the upper side of one end of the heating area close to the cooling area, the negative pressure pumping module 9 can be installed on the furnace cover 4 in a lifting mode, the bottom of the negative pressure pumping module 9 and the heating area are enclosed to form a closed negative pressure cavity, and a shielding gas inlet pipe is arranged on the welding chamber 18 or the furnace cover 4. This zone of heating of vacuum welding stove can heat the tablet, thereby make the tablet can the rapid weld completion in the negative pressure intracavity, be filled with the protective gas in the welding chamber 18, thereby can avoid the heating process tablet to react with oxygen, the cooling space can cool off the tablet, thereby make the tablet temperature that shifts out the welding chamber 18 low, the tablet has been avoided promptly by the oxidation, the good tablet of convenient in time welding is handled again, and can not appear in the tablet processing procedure because tablet high temperature variability leads to the processing procedure tablet to warp, lead to the problem that the defective rate risees, the tablet is direct to contact with the zone of heating or cooling space, heating and cooling have been realized through heat-conduction, compare with the heating mode that adopts the radiation, the rate of heating has been improved greatly, make the tablet can be quick intensification and cooling, the consumption of energy has been reduced.
Welding chamber 18 is the open cuboid box of upside, and the both ends of welding chamber 18 are feed end and discharge end respectively, and welding chamber 18 installs in 1 upside of frame, and transport mechanism 2 installs on frame 1 of welding chamber 18 downside. The furnace lid 4 is installed on the upper side of the welding chamber 18 and closes the upper side of the welding chamber 18. The negative pressure pumping module 9 is arranged on the furnace cover 4, the lower end of the negative pressure pumping module 9 penetrates through the furnace cover 4 and then extends into the welding chamber 18, and the negative pressure pumping module 9 is arranged between the heating area and the cooling area. The negative pressure pumping module 9 can be provided in plurality to improve the welding speed, and can also be provided in one.
Connecting arms 10 are symmetrically arranged at two ends of the rack 1, the upper ends of the connecting arms 10 extend upwards, the upper ends of the connecting arms 10 are higher than the welding chamber 18, mounting arms 12 are symmetrically arranged at two ends of the furnace cover 4, the mounting arms 12 are horizontally arranged, one end of each mounting arm 12 is fixedly connected with the furnace cover 4, and the other end of each mounting arm is rotatably connected with the upper end of the connecting arm 10. The furnace cover 4 is further connected with a furnace cover cylinder 3 which drives the furnace cover cylinder to open and close, a piston rod of the furnace cover cylinder 3 is connected with a mounting arm 12 through a connecting rod 13 and a swing arm 11, the upper end of the mounting arm 12 is rotatably connected with the middle part of the mounting arm 12, the lower end of the mounting arm 12 is rotatably connected with the middle part of the connecting rod 13, one end of the connecting rod 13 is rotatably connected with the frame 1 or the connecting arm 10, and the other end of the connecting rod is rotatably connected with the piston rod of the furnace cover cylinder 3, so that the furnace cover 4.
As shown in fig. 2: the bell 4 includes the bell cover of upside and the bell mounting panel 14 of downside, and the stove cover is the open cuboid box of downside, and bell mounting panel 14 is the cuboid board, and bell mounting panel 14 sets up the downside at the stove cover and seals the end opening of stove cover. The mounting arm 12 and the negative pressure pumping module are both mounted on a furnace cover mounting plate 14.
In this embodiment, the protective gas is nitrogen gas, the protective gas intake pipe is main nitrogen gas intake pipe 5, the both ends of bell mounting panel 14 all are provided with main nitrogen gas intake pipe 5, the stove housing is stretched out to main nitrogen gas intake pipe 5's upper end, every main nitrogen gas intake pipe 5's upside all is provided with a guide housing 6, 6 intervals of guide housing set up at the upside of the main nitrogen gas intake pipe 5 who corresponds the side and set up with main nitrogen gas intake pipe 5's upper end interval, guide housing 6 is cylindricly, guide housing 6 and the equal vertical setting of main nitrogen gas intake pipe 5, guide housing 6 sets up the upside at the stove housing, and guide housing 6 and the coaxial setting of main nitrogen gas intake pipe, guide housing 6 can lead the pipeline that links to each other with main nitrogen gas intake pipe 5. All be provided with gas hood 15 between every main nitrogen gas intake pipe 5 and the bell mounting panel 14, the left and right sides on gas hood 15 upper portion is by supreme inside slope form gradually down, gas hood 15 sets up between bell mounting panel 14 and bell cover, the uncovered setting of downside of gas hood 15, 15 downside of gas hood and bell mounting panel 14 fixed connection, and 4 downside of bell are provided with the slot hole that is used for gas hood 15 and welding chamber 18 intercommunication, thereby can be with the protection gas all with spout into in the welding chamber 18.
14 upsides of bell mounting panel still are provided with and purify intake pipe 7 and purify outlet duct 8, and it all communicates with welding chamber 18 through gas hood 15 to purify intake pipe 7 and purify outlet duct 8, purifies intake pipe 7 and purifies outlet duct 8 and sets up in the same one side of taking out negative pressure module 9 to can avoid the nitrogen gas temperature to hang down excessively and lead to the soldering oil to liquefy in welding chamber 18, make the tablet temperature lower and then prolonged the weld time of tablet. Purify out trachea 8 and purification module's inlet end intercommunication, purify out trachea 8 and purification module's inlet end intercommunication to can clear up the soldering oil steam that the soldering oil steam in the tin cream produced by the heat, avoid the welding of soldering oil steam influence tablet.
As shown in FIGS. 3-5: auxiliary nitrogen inlet pipes 16 are symmetrically arranged on two sides of the middle part of the furnace cover mounting plate 14. The auxiliary nitrogen inlet pipe 16 is arranged on the upper side of the furnace cover mounting plate 14, and the air outlet end of the auxiliary nitrogen inlet pipe 16 is communicated with the welding chamber 18, so that nitrogen can be sprayed into the welding chamber 18 more uniformly, the nitrogen in the welding chamber 18 is completely discharged, and the reaction between the heated material piece and oxygen is avoided. The middle part downside of bell mounting panel 14 is provided with air inlet plate 17, air inlet plate 17 is rectangular shaped plate, air inlet plate 17's upside is provided with the ascending air inlet 1701 of opening, air inlet 1701 is the slot hole that sets up along air inlet plate 17 length direction, every side of bell mounting panel 14 all is provided with two air inlet plates 17, and two air inlet plates 17 are arranged in proper order along the length direction of bell mounting panel 14, all be provided with a plurality of fumaroles 1702 along the length direction interval on every air inlet plate 17, thereby can guarantee with nitrogen gas even spout in the weld chamber 18. The lower side of the furnace cover mounting plate 14 is provided with an inwards concave mounting hole 1401, the mounting holes 1401 are in one-to-one correspondence with the air inlet plates 17, the upper parts of the air inlet plates 17 are mounted in the mounting holes 1401 of the furnace cover mounting plate 14, an air inlet 1701 of each air inlet plate 17 and the mounting holes 1401 of the furnace cover mounting plate 14 form an air inlet cavity in a surrounding mode, and an air outlet end of the auxiliary nitrogen inlet pipe 16 is communicated with the air inlet cavity, so that nitrogen can be conveniently sprayed into the air inlet cavity.
As shown in FIGS. 6 to 7: the carrying mechanism 2 comprises carrying rods 24 and a lifting mechanism, a translation mechanism and an opening and closing mechanism which are arranged on the lower side of the welding chamber 18, the middle of each carrying rod 24 is arranged in the welding chamber 18, two ends of the welding chamber 18 are sealed through end covers 26, carrying ports 2601 are formed in two sides of each end cover 26, the carrying rods 24 are horizontally arranged along the length direction of the welding chamber 18, the two carrying rods 24 are symmetrically arranged on two sides of the welding chamber 18, and two ends of each carrying rod 24 penetrate through the carrying ports 2601 of the end covers 26 and extend out. The downside level of welding chamber 18 is provided with transport installation arm 45, transport installation arm 45 and transport pole 24 one-to-one, transport installation arm 45 sets up the transport pole 24 downside that corresponds the side, every transport pole 24's both ends all link to each other with the transport installation arm 45 that corresponds the side through mounting panel 22, mounting panel 22's upper end links to each other with transport pole 24, mounting panel 22's lower extreme links to each other with transport installation arm 45, elevating system installs in frame 1, translation mechanism installs on elevating system, opening and shutting mechanism installs on translation mechanism, and opening and shutting mechanism links to each other with two transport poles 24 simultaneously, thereby realized opening and shutting of two transport poles 24, go up and down and translation action, make things convenient for the transport of tablet.
Be provided with adjusting spring 23 between one end of every handling pole 24 and the mounting panel 22, adjusting spring 23 cover is established on handling pole 24, handling pole 24 is close to adjusting spring 23's one end and mounting panel 22 sliding connection, adjusting spring 23 sets up in the mounting panel 22 outside, adjusting spring 23's one end is supported on mounting panel 22, the other end supports the tip at handling pole 24, thereby conveniently adjust the position control spring 23 of handling pole 24 in the axial and can also play the cushioning effect, avoid the impact load that produces in the handling to lead to the tablet to drop.
The underside of the end caps 26 at the ends of the weld chamber 18 are spaced from the upper side of the weld table 20 to form a feed end and a discharge end at the ends of the weld chamber 18, with the end adjacent the heating zone being the feed end of the weld chamber 18 and the end adjacent the cooling zone being the discharge end of the weld chamber 18. Both ends of every end cover 26 all are provided with vertical baffle mounting groove 2602, slidable mounting has baffle 27 in baffle mounting groove 2602, baffle 27 and carrier bar 24 sliding connection, and sealed setting between baffle 27 and the carrier bar 24, baffle 27 seals porthole 2601, thereby can move in the plane of end cover 26 place along with carrier bar 24 at carrier bar 24 transport tablet in-process baffle 27, make baffle 27 seal porthole 2601 all the time, avoid nitrogen gas leakage, still removed the restriction to porthole 2601 size, and then can make things convenient for the setting of the motion trail of carrier bar 24. The baffle 27 also closes the gap between the end cap 26 and the weld station 20, i.e., the feed end or the discharge end, and opens the feed end when the handling bar 24 lifts the web, facilitating movement of the web into or out of the weld chamber 18 and avoiding nitrogen leakage. Sealing sleeves 25 are mounted at both ends of each carrying rod 24, and each carrying rod 24 is slidably and sealingly connected with the baffle 27 through the sealing sleeves 25.
As shown in fig. 8: the carrying rods 24 on two sides of each station are provided with a plurality of supporting parts, the supporting parts are arranged on the inner sides of the carrying rods 24, and a telescopic module is arranged between each supporting part and the carrying rod 24 and is an air cylinder or an electric push rod 69, in the embodiment, the telescopic module is the electric push rod 69. The piston rod of electric putter 69 links to each other with the support portion through support portion installation pole to make the support portion extend to the position that is close to the tablet middle part, more firm when holding up the tablet, electric putter 69 level sets up, and the support portion is installed at electric putter 69's telescopic part downside, and the support portion of every station both sides sets up towards the station middle part.
As shown in FIGS. 9 to 10: welding bench 20 includes polylith hot plate 30 and polylith cooling plate 28, and polylith hot plate 30 sets gradually along the length direction of welding chamber 18, forms the zone of heating, and polylith cooling plate 28 sets gradually along the length direction of welding chamber 18, forms the cooling space, and the cooling space is close to the discharge end setting, and every hot plate 30 and every cooling plate 28 are a station. The negative pressure pumping module 9 is arranged at the upper side of the heating plate 30 close to one end of the cooling area.
The bilateral symmetry of every hot plate 30 is provided with the hot plate and lets a mouthful 3001, the bilateral symmetry of every cooling plate 28 is provided with the cooling plate and lets a mouthful 2801, the portion of holding in the support stretches into the hot plate and lets a mouthful 3001 or the cooling plate let in mouthful 2801 and will keep flat the tablet on hot plate 30 or cooling plate 28 and hold up, make the tablet can wholly place on cold plate 28 or hot plate 30, avoid the tablet to be heated the softening, lead to the tablet to warp, and conveniently take out negative pressure module 9 and hot plate 30's sealed.
A feeding table 21 is arranged outside the feeding end of the welding chamber 18, two ends of the feeding table 21 are respectively provided with a feeding table relief opening 2101 matched with the bearing part, the material sheet is placed on the feeding table 21, and the material sheet can be conveyed to the welding table 20 in the welding chamber 18 by the conveying mechanism 2. The discharge end of welding chamber 18 is provided with ejection of compact platform 19, and the both ends of ejection of compact platform 19 all are provided with let the position mouth 1901 with bearing portion matched with ejection of compact platform, and transport mechanism 2 carries the tablet after the cooling to ejection of compact platform 19 on to make this vacuum welding stove realize the welding of continuity, need not open bell 4 and can realize ejection of compact and feeding.
The bottom of welding chamber 18 is provided with collects liquid cover 33, and the both sides of collecting liquid cover 33 are the downward slope form gradually from the lateral part to the middle part, and collects liquid cover drain pipe 3301 in the middle part both ends symmetry of collecting liquid cover 33, collects the water droplet that the cooling zone liquefaction formed and send out welding chamber 18 outside liquid cover 33 can be collected, avoids causing the hindrance to the welding of tablet in welding chamber 18.
The heating plate 30 is a rectangular plate, and heating plate mounting holes are provided at corners of the heating plate 30. The heating plate 30 is symmetrically provided with electric heating tube mounting holes at both sides, the electric heating tube mounting holes are horizontally arranged through holes, and an electric heating tube 31 is arranged in each electric heating tube mounting hole, so that the uniform heating can be ensured. The middle part of the heating plate 30 is also provided with a horizontal sensor mounting hole which is a blind hole arranged in parallel with the electric heating tube mounting hole, the length of the sensor mounting hole is half of the length of the heating plate 30, and the temperature sensor 32 is arranged in the sensor mounting hole, so that the temperature of the heating plate 30 can be detected in real time.
Cooling plate 28 is length and width respectively with the rectangular board that the length and the width of hot plate 30 equal, the corner of cooling plate 28 is provided with the cooling plate mounting hole, the bilateral symmetry of cooling plate 28 is provided with horizontally inhalant canal, inhalant canal sets up along the length direction of cooling plate 28, and the one end of cooling plate 28 is provided with horizontally drainage channel, drainage channel communicates two inhalant canals to make the temperature of whole cooling plate 28 even, the cooling effect is good. Both ends of the drainage channel and the water inlet channel are provided with connecting parts, so that the connection of the water inlet pipe 29 and the water outlet pipe is convenient.
The welding chamber 18 is arranged on the upper side of the frame 1, and the welding chamber 18 is fixedly connected with the frame 1 through a welding chamber mounting piece. The bilateral symmetry of welding chamber 18 is provided with a plurality of welding chamber installed parts, and the downside both ends symmetry of welding chamber installed part is provided with convex fixed part downwards, is provided with the through-hole on the fixed part, and the welding chamber installed part is through setting up bolt and frame 1 fixed connection in the fixed part through-hole. The both ends symmetry of welding chamber installed part is provided with the shoulder hole, and the diameter on shoulder hole upper portion is greater than the diameter of lower part, all installs the installation round pin on every shoulder hole, and the installation round pin be cylindricly, and the lower extreme of installation round pin is coaxial to be provided with the screw hole, and the screw hole is the blind hole of setting on the installation round pin, and the diameter on installation round pin equals with the diameter on shoulder hole upper portion, and the lower extreme of installation round pin stretches into in the upper portion of shoulder hole and through bolt and 40 fixed connection of welding chamber installed part. The heating plate mounting hole of the heating plate 30 is sleeved on the upper part of the mounting pin so as to complete the mounting of the heating plate 30, and the cooling plate mounting hole of the cooling plate 28 is sleeved on the upper part of the mounting pin so as to complete the mounting of the cooling plate 28, so that the mounting and dismounting are convenient.
As shown in fig. 11: the negative pressure pumping module 9 comprises a negative pressure pumping mounting frame 34, a sealing plate 36, a connecting pipe 37 and a negative pressure pumping lifting cylinder 35, the negative pressure pumping mounting frame 34 is mounted on the upper side of the furnace cover mounting plate 14, the negative pressure pumping lifting cylinder 35 is mounted on the negative pressure pumping mounting frame 34, a piston rod of the negative pressure pumping lifting cylinder 35 is vertically arranged downwards, the sealing plate 36 is arranged on the lower side of the furnace cover mounting plate 14, the sealing plate 36 is horizontally arranged, the bottom of the sealing plate 36 is concave, a sealing ring is arranged on the bottom surface of the sealing plate 36 around the outer edge of the sealing plate, the sealing plate 36 and the heating plate 30 surround a negative pressure cavity, a material piece to be welded is arranged in the negative pressure cavity, a horizontal connecting plate 38 is mounted on the piston rod of the negative pressure pumping lifting cylinder 35, the connecting plate 38 is arranged on the, the lower end of the connecting pipe 37 is communicated with the negative pressure cavity, and the upper end of the connecting pipe 37 is connected with a negative pressure pumping pipe.
As shown in FIGS. 12 to 13: translation plates 41 are arranged on the lower side of the welding chamber 18 at intervals, a carrying and installing arm 45 is arranged between the translation plates 41 and the welding chamber 18, the carrying and installing arm 45 is slidably installed on the translation plates 41 through an installation seat, and a translation mechanism is connected with the translation plates 41 and drives the translation plates 41 to translate along the carrying direction of the material sheets. Horizontal conveying installation plates 52 are arranged on the lower sides of the translation plates 41 at intervals, translation plate guide rails 51 are symmetrically arranged on the two sides of the upper portions of the conveying installation plates 52, the translation plate guide rails 51 are arranged in parallel with the central line of the conveying rod 24, the translation plates 41 are slidably installed on the translation plate guide rails 51 through translation plate sliders arranged on the lower sides, and the conveying installation plates 52 are installed on the lifting mechanism and lift along with the lifting mechanism.
The lifting mechanism comprises a horizontal translation frame 49, a lifting guide block 48, a lifting guide frame 47 and a conveying lifting cylinder 46 which are horizontally arranged, a horizontal translation frame guide rail 50 is installed on the machine frame 1, the translation frame guide rail 50 and a translation plate guide rail 51 are arranged in parallel, and the translation frame 49 is installed on the translation frame guide rail 50 in a sliding mode through a translation frame sliding block on the lower side. The conveying lifting cylinder 46 is horizontally arranged on the machine frame 1, a piston rod of the conveying lifting cylinder 46 is arranged towards the direction of the translation frame 49, and the piston rod of the conveying lifting cylinder 46 is connected with the translation frame 49 and pushes the translation frame 49 to move along the conveying direction of the material sheets. The lifting guide blocks 48 are symmetrically arranged on two sides of the translation frame 49, the lifting guide parts are arranged on the upper sides of the lifting guide blocks 48 and are inclined upwards gradually along the direction close to the conveying lifting cylinder 46, the lifting guide frames 47 correspond to the lifting guide blocks 48 one by one, the lifting guide wheels are rotatably arranged on the lower sides of the lifting guide frames 47 and are attached to the lifting guide parts of the lifting guide blocks 48 on the corresponding sides, and therefore lifting of the conveying installation plate 52 is achieved. The frame 1 is provided with a vertical lifting guide rail, and the lifting mounting plate 52 is slidably mounted on the lifting guide rail through a lifting slider so as to guide the conveying mounting plate 52.
Translation mechanism includes translation frame motor mounting bracket 54, transport removal frame 55 and translation motor 53, and translation motor mounting bracket 54 sets up the downside at transport mounting panel 52, and translation motor 53 installs on translation motor mounting bracket 54, and translation motor 53's output shaft level sets up and with the handling direction parallel arrangement of tablet. The translation motor 53 is coaxially provided with a translation lead screw, the translation lead screw synchronously rotates along with the translation motor 53, the carrying moving frame 55 is slidably arranged on the translation motor mounting frame 54, and the carrying moving frame 55 is provided with a translation nut matched with the translation lead screw. The upper side of the carrying moving frame 55 passes through the carrying mounting plate 52 and then is connected to the translation plate 41 to drive the translation plate 41 to move synchronously, and the carrying moving frame 55 and the carrying mounting plate 52 are arranged in a sliding manner.
The opening and closing mechanism comprises an opening and closing mounting rod 42, an opening and closing guide plate 43, an opening and closing moving frame 56, an opening and closing motor mounting frame 57, an opening and closing moving frame 56 and an opening and closing power module, wherein in the embodiment, the opening and closing power module is an opening and closing motor 58. The opening and closing motor mounting frame 57 is arranged on the lower side of the carrying mounting plate 52, the upper side of the opening and closing motor mounting frame 57 is connected with the translation plate 41 and moves synchronously with the translation plate 41, and the opening and closing motor mounting frame 57 is connected with the carrying mounting plate 52 in a sliding mode. The opening and closing motor 58 is mounted on the opening and closing motor mounting bracket 57. The opening and closing moving frame 56 is slidably mounted on the opening and closing motor mounting frame 57, an opening and closing screw rod is coaxially mounted on an output shaft of the opening and closing motor 58, an opening and closing nut matched with the opening and closing screw rod is arranged on the opening and closing moving frame 56, and the opening and closing motor 58 drives the opening and closing moving frame 56 to move horizontally along the material sheet conveying direction through a screw rod nut pair. The upside of translation board 41 is provided with the installation pole slider, and installation pole 42 slidable mounting opens and shuts is on the installation pole slider, and installation pole 42 that opens and shuts sets up along the transport direction of tablet, and the upside of the carriage 56 that opens and shuts links to each other with installation pole 42 that opens and shuts and drives installation pole 42 synchronous motion that opens and shuts, and the carriage 56 that opens and shuts and transport mounting panel 52 sliding connection. The both ends of installation pole 42 that open and shut all are provided with the deflector 43 that opens and shuts, and the both sides of deflector 43 that opens and shuts all are equipped with the guide part that opens and shuts, and the guide part that opens and shuts is the inward slope form gradually along tablet direction of transport, and the leading wheel 44 that opens and shuts is all installed at the both ends of every transport installation arm 45, still is provided with the spring that opens and shuts that makes the leading wheel 44 that opens and shuts and the guide part that opens and shuts of deflector 43 laminate mutually between two transport installation arms 45. The translation plate 41 is further provided with an installation arm guide rail, the installation arm guide rail is perpendicular to the opening and closing installation rod 42, and the carrying installation arm 45 is slidably installed on the installation arm guide rail through an opening and closing slider.
As shown in fig. 14: purification module includes purifying box 61 and sets up coil pipe 67 and filter screen 64 in purifying box 61, and purifying box 61 is the cuboid box, and one side of purifying box 61 is connected with purifying box intake pipe 62, and the opposite side of purifying box 61 is connected with the purifying box outlet duct, is provided with fan 65 between purifying box outlet duct and the weld chamber 18. Coil pipe 67 sets up in purifying tank 61, and coil pipe 67 still is connected with the oil feed tank, and the oil-out of oil feed tank passes through the circulating pump and communicates with coil pipe 67's one end, and coil pipe 67's the other end and oil feed tank intercommunication to the circulation of coolant oil has been realized. The purification box 61 is also internally provided with fins 68 connected with the coil 67, so that heat exchange with nitrogen can be more quickly carried out, and the temperature of the nitrogen is reduced. One side that purifying box 61 is close to the purifying box outlet duct is provided with filter screen install bin 63, and the purifying box outlet duct leads to filter screen install bin 63 and purifying box 61 intercommunication, and the vertical setting of filter screen 64 is in filter screen install bin 63, and the nitrogen gas after the cooling passes through the discharging of purifying box outlet duct behind the filter screen 64 to carry again to the welding chamber 18 in, filter screen 64 is used for filtering the welding oil after the liquefaction, thereby detach the welding oil steam in the nitrogen gas.
The downside of purifying box 61 still is provided with welding oil collecting vessel 66, and the downside of purifying box 61 is for following the slope form that is less than the other end near the one end of welding oil collecting vessel 66 to can make the liquid after the cooling liquefaction flow into in the welding oil collecting vessel 66.
As shown in FIGS. 15 to 16: the frictioning mechanism is installed on the frictioning base, is equipped with frictioning lift cylinder 74 between frictioning mechanism and the frictioning base, and frictioning lift cylinder 74 has two, and the symmetry sets up in the both sides of frictioning base, and the vertical installation of frictioning lift cylinder 74 is on the frictioning base, and the piston rod of frictioning lift cylinder 74 links to each other with the frictioning mechanism to promote the frictioning mechanism and go up and down. Vertical guide rails are symmetrically arranged on two sides of the frictioning base, a sliding groove is formed in the frictioning mechanism, and the guide rails are matched with the sliding groove, so that the lifting of the frictioning mechanism is guided.
The glue spreading mechanism comprises a scraper blade 70, a scraper blade lifting cylinder 60 and a glue spreading cylinder. The frictioning cylinder is installed on crane 40, and the frictioning cylinder has two, and two frictioning cylinders symmetry set up the both sides at crane 40, and the piston rod of frictioning lift cylinder 74 links to each other with crane 40. Scraper lift cylinder 60 and scraper 70 all have two, and scraper lift cylinder 60 installs on scraper frame 59, and scraper 70 installs on the piston rod of scraper lift cylinder 60, and two scrapers 70 are parallel and the interval sets up. A glue scraping template 71 is arranged on the lifting frame 40 below the scraper 70. When the scraping glue is carried out, when the scraping glue cylinder pushes the scraper 70 to move rightwards, the scraper lifting cylinder 60 on the left side drives the scraper 70 to descend and to be in contact with the scraping glue template 71, when the scraping glue cylinder pushes the scraper 70 to move leftwards, the scraper lifting cylinder 60 on the right side pushes the scraper 70 to move downwards and to be in contact with the scraping glue template 71, when one scraper 70 is in contact with the scraping glue template, the other scraper 70 is lifted, therefore, the tin paste can be scraped twice on the scraping glue template 71 when the scraper frame 59 does reciprocating motion, the efficiency is high, and the tin paste is placed on the scraping glue template 71.
And a conveying mechanism is arranged on the lower side of the glue scraping mold. The conveying mechanism includes a conveying frame 73 and a conveying power mechanism. The conveying power mechanism comprises a conveying motor and a conveying screw rod, the conveying screw rod is rotatably installed on the frictioning base, and the conveying screw rod is located on the lower side of the frictioning template 71. The output shaft of conveying motor and carry lead screw fixed connection, be equipped with on carriage 73 with carry lead screw matched with nut, conveying motor drives and carries lead screw to rotate to realize carriage 73's motion, carriage 73 sets up the downside at frictioning template 71 and sets up with frictioning template 71 interval. The frictioning base is provided with a guide rail for guiding the conveying frame 73, the guide rail is horizontally arranged, and the conveying frame 73 is slidably arranged on the guide rail. Conveyer plate 72 is installed to the carriage 73 upside, lead frame or chip are placed on conveyer plate 72, conveyer plate 73 drives conveyer plate 72 and moves to under the frictioning template 71 and stop motion, frictioning lift cylinder 74 drives crane 40 and descends, thereby make frictioning template 71 and conveyer plate 72 cooperate, scribble the tin cream on lead frame or chip, scribble the completion back of applying paint with a brush, frictioning lift cylinder 74 drives crane 40 and rises, conveyer plate 73 drives conveyer plate 72 and continues the motion, thereby see off lead frame or chip.
Conveying board 72 and carriage 73 interval set up, are equipped with vertical uide pin on the carriage 73, are equipped with the guiding hole with uide pin looks complex on the conveying board 72, and the uide pin slides and stretches into in the guiding hole to the realization is fixed conveying board 72 in the position of horizontal plane. The cover is equipped with delivery board buffer spring on the uide pin between carriage 73 and delivery board 72, delivery board buffer spring is in compression state, thereby promote delivery board 72 and carriage 73 interval setting, when delivery board 72 moves under to frictioning template 71 and frictioning template 71 descends, delivery board buffer spring can play the cushioning effect to delivery board 72, can also make delivery board 72 and frictioning template 71 laminate completely, guarantee to scribble the quality of brushing tin cream on the lead frame.
As shown in FIGS. 17 to 18: the frictioning template 71 is rectangular, and the length and the width of frictioning template 71 all are greater than the length and the width of delivery board 72, and the downside of frictioning template 71 is equipped with the constant head tank that length and width all are the same with delivery board 72 to can with delivery board 72 location fit, the downside of frictioning template 71 still is equipped with and is used for the protruding position complex recess with lead frame or chip, avoids causing the damage to lead frame or chip. The glue scraping template 71 is provided with a plurality of lower glue holes 7101 along the thickness direction, the lower glue holes 7101 correspond to the positions, needing to be coated with solder paste, of the lead frame or the chip one by one, the solder paste is scraped down along the lower glue holes 7101 by the scraper and is accurately coated on the lead frame or the chip, coating is accurate, and coating quality can be well guaranteed. The frictioning template 71 has two kinds, is used for brushing the tin cream for the jumper wire on chip and the lead frame respectively, and the upside indent of frictioning template 71 forms the tin cream and holds the mouth, and lower glue hole 7101 sets up and holds the mouth in the tin cream.
Example 2
Example 2 differs from example 1 in that: the support part is directly arranged on the carrying rod 24, heating plate yielding openings 3001 are arranged at two ends of the heating plate 30, cooling plate yielding openings 2801 are arranged at two ends of the cooling plate 28, and the support part supports the material sheets through two ends of the material sheets.
The foregoing is directed to preferred embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. However, any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present invention are within the protection scope of the technical solution of the present invention.
Claims (12)
1. A pin welding method of a chip is characterized in that: the method comprises the following steps:
1) respectively brushing tin paste on the electrode on the back of the chip and the pin, and directly connecting the electrode on the back of the chip and the pin;
2) connecting two poles on the front surface of the chip with corresponding pins through jumper wires, and brushing solder paste between each jumper wire and the corresponding pole and pin of the chip;
3) the chip, the pin and the jumper wire are moved into a vacuum welding furnace for one-time welding;
the jumper and the chip are coated with solder paste through a glue scraping mechanism, the glue scraping mechanism is connected with a glue scraping lifting cylinder (74), a piston rod of the glue scraping lifting cylinder (74) is connected with the glue scraping mechanism and drives the glue scraping mechanism to lift, a horizontal glue scraping template (71) is arranged on the lower side of the glue scraping mechanism, and a lower glue hole (7101) is formed in the glue scraping template (71); each lead frame is connected with a plurality of jumper wires through connecting ribs, and the jumper wires are cut off from the lead frames after the solder paste is coated; the jumper wire in the step 2) or 3) is a metal plate, two ends of the jumper wire are bent downwards to form a bent part, and a connecting point is arranged at the lower end of the bent part;
the vacuum welding furnace in the step 3) comprises a welding chamber (18), a furnace cover (4), a carrying mechanism (2) and a negative pressure pumping module (9) arranged on the furnace cover (4), wherein the furnace cover (4) covers the upper side of the welding chamber (18), a welding chamber is formed between the welding chamber (18) and the furnace cover (4), a welding table (20) is arranged at the lower part of the welding chamber (18), the bottom of the negative pressure pumping module (9) and the welding table (20) are enclosed to form a sealed negative pressure chamber, a heating module is arranged on the welding table (20), and a protective gas inlet pipe is arranged on the welding chamber (18) or the furnace cover (4); the conveying mechanism (2) comprises two conveying rods (24) and a lifting mechanism, a translation mechanism and an opening and closing mechanism which are arranged on the lower side of the welding chamber (18), the two conveying rods (24) are symmetrically arranged, the middle part of each conveying rod (24) is arranged in the welding chamber (18), the opening and closing mechanism is simultaneously connected with the two conveying rods (24) and drives the two conveying rods to open and close, the translation mechanism is connected with the opening and closing mechanism and drives the two conveying rods to move in the direction close to or far away from the discharge end, the lifting mechanism is connected with the translation mechanism and drives the two conveying rods to lift, and a plurality of telescopic modules are symmetrically arranged on the inner sides of the two conveying rods (24);
the lower side of the welding chamber (18) is horizontally provided with a carrying mounting arm (45), two ends of each carrying rod (24) are connected with the carrying mounting arms (45) on the corresponding side through mounting plates (22), the opening and closing mechanism comprises opening and closing mounting rods (42), opening and closing guide plates (43), an opening and closing moving frame (56), an opening and closing motor mounting frame (57) and an opening and closing motor (58), the opening and closing moving frame (56) is slidably mounted on the opening and closing motor mounting frame (57), opening and closing lead screws are coaxially mounted on output shafts of the opening and closing motor (58), opening and closing nuts matched with the opening and closing lead screws are arranged on the opening and closing moving frame (56), the upper side of the opening and closing moving frame (56) is connected with the opening and closing mounting rods (42) and drives the opening and closing mounting rods (42) to synchronously move, the opening and closing guide plates (43) are arranged at two ends of the opening and closing mounting rods (42, the opening and closing guide part is in an inclined shape gradually inwards along the material sheet conveying direction, the two ends of each conveying installation arm (45) are provided with an opening and closing guide wheel (44), and an opening and closing spring for enabling the opening and closing guide wheel (44) to be attached to the opening and closing guide part of the corresponding opening and closing guide plate (43) is further arranged between the two conveying installation arms (45).
2. The pin soldering method of a chip according to claim 1, wherein: the jumper wire in the step 2) or 3) is a copper jumper wire.
3. The pin soldering method of a chip according to claim 1, wherein: and (3) connecting two connecting points of the jumper wire in the step 3) with the pole on the front surface of the chip and the corresponding pins respectively.
4. The pin soldering method of a chip according to claim 1, wherein: the mechanism of scraping glue include scraper (70), scraper lift cylinder (60) and frictioning cylinder, scraper (70) set up in frictioning template (71) upside, the piston rod of scraper lift cylinder (60) links to each other with scraper (70) and drives scraper (70) and goes up and down, the frictioning cylinder links to each other with scraper lift cylinder (60) to promote scraper (60) horizontal migration.
5. The pin soldering method for a chip according to claim 4, wherein: the upper side of the frictioning template (71) is concave, so that a solder paste containing opening is formed, and the lower glue holes (7101) are formed in the solder paste containing opening.
6. The pin soldering method of a chip according to claim 1, wherein: welding bench (20) on be provided with a plurality of stations, all be provided with the bearing portion on the transport mechanism (2) of every station both sides, all be provided with flexible module between every bearing portion and the transport mechanism (2), the central line of flexible module is parallel with the moving direction of tablet, the flexible portion of flexible module sets up towards the middle part of tablet, the equal symmetry in both sides of every station is provided with a plurality ofly and the bearing portion matched with mouth of stepping down.
7. The pin soldering method of a chip according to claim 1, wherein: one side that welding platform (20) are close to the feed end be the zone of heating, one side that welding platform (20) are close to the discharge end is the cooling zone, the zone of heating is close to the one end upside of cooling zone and is provided with and takes out negative pressure module (9), take out installing on bell (4) that negative pressure module (9) liftable, take out negative pressure module (9) bottom and the zone of heating and surround into inclosed negative pressure chamber, be provided with the protective gas intake pipe on welding chamber (18) or bell (4).
8. The pin soldering method for a chip according to claim 7, wherein: the welding table (20) comprises a plurality of heating plates (30) and a plurality of cooling plates (28), the heating zones are spliced by the plurality of heating plates (30), and the cooling zones are spliced by the plurality of cooling plates (28).
9. The pin soldering method of a chip according to claim 1, wherein: the lower side of the welding chamber (18) is provided with a liquid collecting cover (33), two sides of the bottom of the liquid collecting cover (33) are inclined gradually downwards from the side part to the middle part, and a liquid collecting cover liquid outlet pipe (3301) is arranged at the bottom of the liquid collecting cover (33).
10. The pin soldering method of a chip according to claim 1, wherein: the protective gas inlet pipe is a main nitrogen inlet pipe (5), main nitrogen inlet pipes (5) are arranged at two ends of the furnace cover (4), auxiliary nitrogen inlet pipes (16) are symmetrically arranged on two sides of the middle of the furnace cover (4), and the auxiliary nitrogen inlet pipes (16) are communicated with the welding chamber (18).
11. The pin soldering method of a chip according to claim 1, wherein: the negative pressure pumping module (9) comprises a sealing plate (36) and a negative pressure pumping lifting cylinder (35), the sealing plate (36) is arranged on the upper side of the welding table (20) and is parallel to the welding table (20), the bottom of the sealing plate (36) and the welding table (20) enclose a closed negative pressure cavity, and the negative pressure cavity is connected with a negative pressure pumping pipe.
12. The pin soldering method for a chip according to claim 11, wherein: the sealing plate (36) is arranged on the lower side of the furnace cover (4), the negative pressure pumping lifting cylinder (35) is arranged on the upper side of the furnace cover (4), a piston rod of the negative pressure pumping lifting cylinder (35) is connected with the sealing plate (36) through a connecting pipe (37), and the connecting pipe (37) is used for communicating the negative pressure cavity with the negative pressure pumping pipe.
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CN107963443B (en) * | 2017-12-29 | 2019-07-16 | 山东才聚电子科技有限公司 | A kind of carrying mechanism of vacuum brazing stove |
CN112018019B (en) * | 2020-08-11 | 2023-04-28 | 四川旭茂微科技有限公司 | Jumper wire sucker and jumper wire suction mechanism |
CN113421842B (en) * | 2021-08-23 | 2021-11-16 | 四川旭茂微科技有限公司 | Lead frame wire jumper composite set |
CN115632028B (en) * | 2022-12-08 | 2023-03-10 | 常州铭赛机器人科技股份有限公司 | Lead frame conveying device |
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