CN108141987B - Chip heat dissipation device and electronic equipment - Google Patents
Chip heat dissipation device and electronic equipment Download PDFInfo
- Publication number
- CN108141987B CN108141987B CN201680001086.7A CN201680001086A CN108141987B CN 108141987 B CN108141987 B CN 108141987B CN 201680001086 A CN201680001086 A CN 201680001086A CN 108141987 B CN108141987 B CN 108141987B
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- opening
- chip
- heat
- heat dissipation
- heat dissipating
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 84
- 230000005855 radiation Effects 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 230000000694 effects Effects 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 5
- 238000007664 blowing Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A chip heat sink and an electronic apparatus, comprising: a heat radiation main body (10) and a heat radiation fan (20); the heat dissipation body (10) is hollow, two ends of the heat dissipation body are open and form two openings, wherein a first opening (11) at one end is smaller than a second opening (12) at the other end, and the first opening (11) faces the chip; the heat radiation fan (20) is arranged on the top of the second opening (12), and the airflow generated by the heat radiation fan (20) flows from the second opening (12) to the first opening (11) and blows towards the chip. When the gas flows from the second opening (12) to the first opening (11) through the heat radiation fan (20), the first opening (11) is smaller than the second opening (12), the gas is extruded in the process of blowing to the first opening (11), a small throttling effect is generated near the first opening (11), and the temperature of the gas near the first opening (11) is reduced. Therefore, the gas temperature at the first opening (11) is lower than that of the second opening (12), so that the obtained gas with lower temperature is beneficial to reducing the temperature of the chip, and further better heat dissipation effect is obtained.
Description
Technical Field
The present disclosure relates to the field of chip heat dissipation, and in particular, to a chip heat dissipation device and an electronic apparatus.
Background
In the use of the electronic device, a chip disposed on a Printed Circuit Board (PCB) generates a large amount of heat during operation. To solve this problem, a heat sink needs to be added to the chip.
In the prior art, a common method for dissipating heat from a chip is to attach a heat sink to the chip and mount a heat dissipation fan above or around the heat sink, but common heat sinks are all heat sinks composed of a sheet of metal fins at equal intervals.
However, for a chip which generates heat severely, the heat dissipation method cannot meet the heat dissipation requirements of some chips which have strict temperature requirements, and the chip may be burned down because the chip cannot work normally and the heat dissipation is not in time due to the over-high temperature.
Disclosure of Invention
In order to solve the problem that the heat dissipation effect of a chip is poor in the related art, the disclosure provides a chip heat dissipation device and an electronic device.
A chip heat sink comprising: a heat dissipating body and a heat dissipating fan;
the heat dissipation body is hollow, two ends of the heat dissipation body are open and form two openings, wherein a first opening at one end is smaller than a second opening at the other end, and the first opening faces the chip;
the heat radiation fan is arranged at the top of the second opening, and the airflow generated by the heat radiation fan flows from the second opening to the first opening and blows towards the chip.
In one embodiment, a portion of the heat dissipation body is cylindrical, and another portion of the heat dissipation body is arc-shaped and extends inward.
In one embodiment, the heat dissipation body is metal.
In one embodiment, the heat dissipating body is streamlined and inwardly converges.
In one embodiment, the cross-sectional shape of the first opening is matched with that of the chip, and the cross-sectional shape of the second opening is matched with that of the heat dissipation fan.
In one embodiment, the area of the second opening is greater than or equal to 2 times compared with the area of the first opening.
In one embodiment, the heat dissipation body further includes fins disposed inside the heat dissipation body.
In one embodiment, the fins extend towards the first opening direction and converge towards the center of the heat dissipation body.
In one embodiment, the heat dissipating body further comprises a rotating body and a bracket, the rotating body is coaxially arranged with the heat dissipating body, and the bracket is connected with the heat dissipating body;
one end of the rotating body is coaxially connected with the radiating fan, the other end of the rotating body is rotatably connected through a support, and the radiating fan rotates to drive the rotating body to rotate.
In one embodiment, the rotating body is a net-shaped cylinder.
An electronic device, comprising: the heat dissipation device comprises a chip, a heat dissipation main body and a heat dissipation fan;
the chip is arranged on a preset circuit board;
the heat dissipation body is arranged on the circuit board, the heat dissipation body is hollow, two ends of the heat dissipation body are open and form two openings, a first opening at one end is smaller than a second opening at the other end, and the first opening faces the chip;
the heat radiation fan is arranged at the top of the second opening, and the airflow generated by the heat radiation fan flows from the second opening to the first opening and blows to the chip.
In one embodiment, the heat dissipation body is provided with a gap with the surface of the chip, so that the airflow blown out from the heat dissipation body is diffused to the outside after being blown towards the chip.
In one embodiment, the chip further comprises a metal frame mounted on the circuit board, wherein the metal frame is opposite to the upper part of the chip; and a mounting hole is formed in the upper surface of the metal frame, the mounting hole is matched with the first opening, and the first opening is mounted in the mounting hole and connected with the mounting hole.
In one embodiment, the heat dissipation body further comprises fins disposed inside the heat dissipation body; the fins extend towards the first opening direction and are folded towards the center of the heat dissipation main body.
In one embodiment, the heat dissipating body further comprises a rotating body and a bracket, the rotating body is coaxially arranged with the heat dissipating body, and the bracket is connected with the heat dissipating body; one end of the rotating body is coaxially connected with the radiating fan, the other end of the rotating body is rotatably connected through a support, and the radiating fan rotates to drive the rotating body to rotate.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:
when gas passes through radiator fan from the second open to the in-process that first open flows, because first open be less than the second open, then gas will receive the extrusion blowing to first open in-process, produce a miniature throttle effect this moment in first open near, can arouse that the temperature of first open near gas reduces. Therefore, the temperature of the gas at the first opening is lower than that of the gas at the second opening, so that the obtained gas with lower temperature is beneficial to reducing the temperature of the chip, and further a better heat dissipation effect is obtained.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic diagram of a chip heat sink device shown in an exemplary embodiment;
FIG. 2 is a cross-sectional view of a heat dissipating body shown in an exemplary embodiment;
FIGS. 3A-3B are cross-sectional and top views, respectively, of an exemplary embodiment showing fins of a heat sink body;
FIG. 4 is a schematic view of a rotator and bracket within a heat dissipating body shown in an exemplary embodiment;
FIG. 5 is a schematic structural view of a rotary body corresponding to FIG. 4;
FIG. 6 is a schematic diagram of an electronic device shown in an exemplary embodiment;
fig. 7 is a schematic diagram of an electronic device provided with a metal frame according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus consistent with certain aspects of the invention, as detailed in the appended claims.
Fig. 1 is a schematic diagram illustrating a chip heat sink according to an exemplary embodiment. For example, a chip heat sink includes: a heat radiating body 10 and a heat radiating fan 20. The heat dissipation body 10 is hollow, two ends of the heat dissipation body are open and form two openings, wherein a first opening 11 at one end is smaller than a second opening 12 at the other end, and the first opening 11 faces the chip. The heat dissipation fan 20 is disposed on the top of the second opening 12, and the airflow generated by the heat dissipation fan 20 flows from the second opening 12 to the first opening 11 and blows towards the chip.
When the air flows from the second opening 12 to the first opening 11 through the heat dissipation fan 20, the first opening 11 is smaller than the second opening 12, the air is squeezed in the process of blowing to the first opening 11, and a small throttling effect is generated near the first opening 11, so that the air temperature of the air near the first opening 11 is reduced. Therefore, the gas temperature at the first opening 11 is lower than the gas temperature at the second opening 12, so that the obtained gas with a lower temperature is beneficial to reducing the temperature of the chip, and a better heat dissipation effect is obtained.
Referring to fig. 2, in an exemplary embodiment, a portion of the heat dissipating body 10 is cylindrical, and another portion is curved and extends inward, forming a shape like an inverted "mineral water bottle", which is easy to manufacture industrially. In other embodiments, the heat dissipating body 10 is integrally formed, and is streamlined (not shown) and inwardly convergent to form a small opening, and the shape of the streamlined heat dissipating body 10 is easy to guide the airflow.
In order to better improve the heat dissipation effect, the heat dissipation body 10 is made of metal materials such as gold, silver, copper, iron, aluminum alloy, and copper alloy, because the heat conduction effect of the metal is good. In this embodiment, the heat dissipating body 10 is made of aluminum, which is suitable for manufacturing at a low cost.
In an exemplary embodiment, the second opening 12 of the heat dissipating body 10 is larger than the first opening 11, and for better selecting a better opening width, the throttling effect is more obvious according to different ratios of the opening areas.
The detailed experimental effect values are referred to the following table (area ratio: ratio of area of the second opening 12/area of the first opening 11; temperature difference: difference between gas temperature near the second opening 12 and gas temperature near the first opening 11):
| area ratio | 1 | 1.5 | 2 | 2.5 | 3 | 3.5 | 4 |
| Temperature difference | 1.60℃ | 2.37℃ | 5.02℃ | 5.15℃ | 5.37℃ | 5.86℃ | 6.03℃ |
Considering the cost and the practical product application, the ratio of the area of the second opening 12 to the area of the first opening 11 is too large, which results in a larger outer casing using the chip heat dissipation device and is not suitable for the market demand. Of course, the too small area ratio results in a small difference between the gas temperature near the second opening 12 and the gas temperature near the first opening 11, i.e. the cooling amplitude does not achieve the better cooling effect. Through experimental data, the area ratio and the temperature difference are comprehensively compared, when the area ratio is 2 or more, the corresponding temperature difference reaches more than 5 ℃, and the temperature difference is slowly increased along with the continuous increase of the area ratio; when the area ratio is less than 2, the temperature difference value has obvious amplitude reduction. Therefore, in the present embodiment, the area of the second opening 12 is preferably greater than or equal to 2 times the area of the first opening 11.
In an exemplary embodiment, the first opening 11 of the heat dissipation body 10 has a sectional shape matched with that of the chip, and the second opening 12 has a sectional shape matched with that of the heat dissipation fan 20. In the present embodiment, matching can be understood as: the shape of the cross section of the first opening 11 is the same as that of the cross section of the chip or slightly larger or smaller, so that gas can be accurately blown to the chip, and the optimal cooling effect is realized; in addition, the cross-sectional shape of the second opening 12 matches the cross-sectional shape of the heat dissipation fan 20, and the heat dissipation fan 20 can just cover the second opening 12, so that the airflow generated by the heat dissipation fan 20 is completely guided into the second opening 12 without air leakage. By adopting the above-mentioned "matching" arrangement, the air flow generated by the heat dissipation fan 20 can be effectively guided into the heat dissipation main body 10 and accurately blown to the chip.
Referring to fig. 3A-3B, in an exemplary embodiment, the heat dissipating body 10 further includes a fin 13 disposed inside the heat dissipating body 10. The number of the fins 13 can increase the heat dissipation area of the heat dissipation body 10, and the heat of the heat dissipation body 10 can be taken away in time. The material of the fins 13 is metal, and the optimum material is the same as that of the heat dissipating body 10.
Further, the fins 13 extend toward the first opening 11 and converge toward the center of the heat dissipating body 10. I.e. the fins 13 are spiral-like structures that rotate inwards and downwards (like helical blades). The air blown into the heat dissipating main body 10 by the heat dissipating fan 20 forms an ordered airflow under the guiding action of the fins 13, which can reduce the wind noise generated by the disordered flow of the wind, and can quickly guide the air to the first opening 11, thereby improving the heat dissipating efficiency.
Referring to fig. 4, in an exemplary embodiment, the heat dissipating body 10 further includes a rotating body 14 and a bracket 15, the rotating body 14 is disposed coaxially with the heat dissipating body 10, and the bracket 15 is connected with the heat dissipating body 10; one end of the rotating body 14 is coaxially connected with the heat dissipation fan 20, and the other end is rotatably connected with the bracket 15, and the heat dissipation fan 20 rotates to drive the rotating body 14 to rotate. Like this, the rotator 14 that sets up in the heat dissipation main part 10 can form the whirlwind in the heat dissipation main part 10, has strengthened the interior gas flow's of heat dissipation main part 10 intensity and the speed of circulation for the gas that blows off from first uncovered 11 is stronger, cooperates at the lower gas temperature of first uncovered 11 department, further improves the radiating effect of chip.
Referring to fig. 5, the rotating body 14 is a net-shaped cylinder, which can reduce the weight of the rotating body 14. In addition, the mesh of the net-shaped rotating body 14 is provided with outward fan blades (not shown), when the fan blades rotate along with the rotating body 14, the air volume of the fan blades can be increased, the air flow efficiency in the heat dissipation main body 10 is improved, and the heat dissipation effect of the chip is further improved.
In other embodiments, the rotating body 14 is in the shape of an inverted cone (not shown), and the "hurricane" generated by the rotation of the rotating body 14 in the shape of an inverted cone is similar to its own shape, so as to further enhance the airflow intensity inside the heat dissipating body 10, and provide stronger airflow intensity for effectively improving the heat dissipating effect of the chip.
FIG. 6 is an electronic device shown in accordance with an example embodiment. The electronic device includes: a chip 30, a heat dissipating body 10, and a heat dissipating fan 20.
And the chip 30 is arranged on a preset circuit board. The heat dissipation body 10 is installed on the circuit board, the heat dissipation body 10 is hollow, two ends of the heat dissipation body are open and form two openings, wherein a first opening 11 at one end is smaller than a second opening 12 at the other end, and the first opening 11 faces the chip 30. The heat dissipation fan 20 is disposed on the top of the second opening 12, and the airflow generated by the heat dissipation fan 20 flows from the second opening 12 to the first opening 11 and blows towards the chip 30.
Since the first opening 11 is smaller than the second opening 12, the gas will be squeezed in the process of blowing to the first opening 11, and a small throttling effect is generated near the first opening 11, which will cause the temperature of the gas near the first opening 11 to decrease. It can be seen that the gas temperature at the first opening 11 is lower than the gas temperature at the second opening 12, and the lower temperature gas obtained thereby is beneficial to the reduction of the temperature of the chip 30, i.e. the electronic device comprising the above chip 30, the heat dissipating body 10 and the heat dissipating fan 20 can overcome the device failure caused by the higher temperature of the chip 30.
In an exemplary embodiment, the heat dissipation body 10 is provided with a gap with the surface of the chip 30, so that the airflow blown out from the heat dissipation body 10 is diffused to the outside after being blown toward the chip 30. Specifically, the first opening 11 of the heat dissipation body 10 is fixed to the chip 30 to be heat dissipated, and the first opening 11 cannot be directly adhered to the surface of the chip 30, which may result in the failure of gas circulation, the failure of throttling effect, and the failure of heat dissipation. Set up certain clearance and just can lead gas to the outside, realize effective cooling.
Referring to fig. 7, in other embodiments, the electronic device further includes a metal frame 40 mounted on the circuit board, the metal frame 40 facing over the chip 30; the upper surface of the metal frame 40 is provided with a mounting hole, the mounting hole is matched with the first opening 11, and the first opening 11 is arranged in the mounting hole and connected with the mounting hole. In this embodiment, the metal frame 40 is a thin metal aluminum, a mounting hole with a size slightly larger than the first opening 11 is drilled on the metal frame, and the first opening 11 of the heat dissipating body 10 is mounted in the drilled mounting hole and fixed, so as to realize a gap between the heat dissipating body 10 and the chip 30.
In an exemplary embodiment, regarding the technical solutions and the extended solutions of the heat dissipation main body 10 and the heat dissipation fan 20, the solutions are the same as the solutions of the heat dissipation main body 10 and the heat dissipation fan 20 described in any one of the above embodiments, and are also applicable to the heat dissipation main body 10 and the heat dissipation fan 20 in the electronic device in this embodiment, which are not described again here.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (13)
1. A chip heat sink, comprising: a heat dissipating body and a heat dissipating fan;
the heat dissipation body is hollow, two ends of the heat dissipation body are open and form two openings, wherein a first opening at one end is smaller than a second opening at the other end, and the first opening faces the chip;
the heat radiation fan is arranged at the top of the second opening, and the airflow generated by the heat radiation fan flows from the second opening to the first opening and blows to the chip;
the heat dissipation body further comprises a rotating body and a support, the rotating body and the heat dissipation body are coaxially arranged, and the support is connected with the heat dissipation body; one end of the rotating body is coaxially connected with the radiating fan, the other end of the rotating body is rotatably connected through a support, and the radiating fan rotates to drive the rotating body to rotate; the rotator is a reticular cylinder.
2. The chip heat sink according to claim 1, wherein a portion of the heat dissipating body is cylindrical and another portion is arc-shaped and extends inward.
3. The chip heat sink according to claim 1, wherein the heat dissipating body is a metal.
4. The chip heat sink according to claim 1, wherein the heat dissipating body is streamlined and inwardly converges.
5. The heat dissipating device as claimed in claim 1, wherein the first opening has a cross-sectional shape matching a cross-sectional shape of a chip, and the second opening has a cross-sectional shape matching a cross-sectional shape of the heat dissipating fan.
6. The chip heat sink according to claim 1, wherein the area of the second opening is greater than or equal to 2 times the area of the first opening.
7. The chip heat sink according to any one of claims 1 to 6, wherein the heat sink body further comprises fins disposed inside the heat sink body.
8. The chip heat sink according to claim 7, wherein the fins extend toward the first opening and converge toward the center of the heat sink body.
9. An electronic device, comprising: a chip, the heat dissipating body as claimed in any one of claims 1 to 6, and a heat dissipating fan;
the chip is arranged on a preset circuit board;
the heat dissipation body is arranged on the circuit board, the heat dissipation body is hollow, two ends of the heat dissipation body are open and form two openings, a first opening at one end is smaller than a second opening at the other end, and the first opening faces the chip;
the heat radiation fan is arranged at the top of the second opening, and the airflow generated by the heat radiation fan flows from the second opening to the first opening and blows to the chip.
10. The electronic device according to claim 9, wherein the heat dissipating body is provided with a gap from a surface of the chip so that an air flow blown out from the heat dissipating body is diffused to the outside after being blown toward the chip.
11. The electronic device of claim 10, further comprising a metal frame mounted on the circuit board, the metal frame facing over the chip; and a mounting hole is formed in the upper surface of the metal frame, the mounting hole is matched with the first opening, and the first opening is mounted in the mounting hole and connected with the mounting hole.
12. The electronic device of claim 9, wherein the heat-dissipating body further comprises fins disposed inside the heat-dissipating body; the fins extend towards the first opening direction and are folded towards the center of the heat dissipation main body.
13. The electronic device according to claim 9, wherein the heat dissipating body further comprises a rotating body disposed coaxially with the heat dissipating body and a bracket connected with the heat dissipating body; one end of the rotating body is coaxially connected with the radiating fan, the other end of the rotating body is rotatably connected through a support, and the radiating fan rotates to drive the rotating body to rotate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/095973 WO2018032493A1 (en) | 2016-08-19 | 2016-08-19 | Chip heat dissipation apparatus and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108141987A CN108141987A (en) | 2018-06-08 |
| CN108141987B true CN108141987B (en) | 2020-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680001086.7A Expired - Fee Related CN108141987B (en) | 2016-08-19 | 2016-08-19 | Chip heat dissipation device and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108141987B (en) |
| WO (1) | WO2018032493A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708863B (en) * | 2019-09-30 | 2021-10-15 | 苏州经贸职业技术学院 | An air compression circuit heat dissipation substrate |
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| TW527089U (en) * | 2002-05-31 | 2003-04-01 | Aopen Inc | Heat-dissipating apparatus and fan duct of heat-dissipating apparatus |
| CN101256992A (en) * | 2007-02-28 | 2008-09-03 | 长春藤控股有限公司 | Heat radiating device |
| CN201218573Y (en) * | 2008-05-30 | 2009-04-08 | 李金刚 | Taper-shaped internal spiral water-absorption type rinsing air purifying device |
| CN202873259U (en) * | 2012-10-31 | 2013-04-10 | 陈晃涵 | Automatic heat dissipation of heat dissipation fins and the structure of the outer cover |
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| GB2296132B (en) * | 1994-12-12 | 1999-02-24 | Siemens Plessey Electronic | Improvements in or relating to cooling systems |
| US5876278A (en) * | 1997-05-29 | 1999-03-02 | Cheng; Henry | Cooling device |
| TWM277990U (en) * | 2005-04-08 | 2005-10-11 | High Tech Comp Corp | Transmission device capable of cooling a handheld electronic device |
| CN2864797Y (en) * | 2006-01-04 | 2007-01-31 | 元山科技工业股份有限公司 | Graphics card assembly with cooling fan |
| CN101872751A (en) * | 2009-04-22 | 2010-10-27 | 陈亮合 | Necking and bundling airflow device of chip radiator |
| CN102213984A (en) * | 2010-04-09 | 2011-10-12 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating system |
| CN102419624A (en) * | 2011-12-08 | 2012-04-18 | 周志农 | Air guiding heat dissipation device for computer |
| CN202372911U (en) * | 2011-12-08 | 2012-08-08 | 周志农 | Air deflecting and radiating device for computer |
| CN203302766U (en) * | 2013-05-13 | 2013-11-27 | 陈卫 | Bowl capable of fast cooling |
| CN204423292U (en) * | 2015-02-17 | 2015-06-24 | 张虎 | Super-silent computer power cooling system |
| CN205278929U (en) * | 2015-12-17 | 2016-06-01 | 东莞市晟勤电子科技有限公司 | LED automobile headlamp |
-
2016
- 2016-08-19 WO PCT/CN2016/095973 patent/WO2018032493A1/en active Application Filing
- 2016-08-19 CN CN201680001086.7A patent/CN108141987B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW527089U (en) * | 2002-05-31 | 2003-04-01 | Aopen Inc | Heat-dissipating apparatus and fan duct of heat-dissipating apparatus |
| CN101256992A (en) * | 2007-02-28 | 2008-09-03 | 长春藤控股有限公司 | Heat radiating device |
| CN201218573Y (en) * | 2008-05-30 | 2009-04-08 | 李金刚 | Taper-shaped internal spiral water-absorption type rinsing air purifying device |
| CN202873259U (en) * | 2012-10-31 | 2013-04-10 | 陈晃涵 | Automatic heat dissipation of heat dissipation fins and the structure of the outer cover |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108141987A (en) | 2018-06-08 |
| WO2018032493A1 (en) | 2018-02-22 |
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