CN108140732B - 含阻挡膜的制品及其用于3d tsv封装体用预施加底部填充膜的用途 - Google Patents
含阻挡膜的制品及其用于3d tsv封装体用预施加底部填充膜的用途 Download PDFInfo
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- CN108140732B CN108140732B CN201680054601.8A CN201680054601A CN108140732B CN 108140732 B CN108140732 B CN 108140732B CN 201680054601 A CN201680054601 A CN 201680054601A CN 108140732 B CN108140732 B CN 108140732B
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Abstract
本发明提供了延长底部填充膜工作寿命的含稳定的底部填充膜的组件。根据本发明的某些方面,还提供了延长底部填充膜储存期限的含稳定的底部填充膜的组件。在本发明的某些方面中,还提供了延长底部填充膜工作寿命的方法。在本发明的另一些方面中,还提供了延长底部填充膜储存期限的方法。
Description
技术领域
本发明涉及延长底部填充膜工作寿命的含稳定的底部填充膜的组件。本发明还涉及延长底部填充膜储存期限的含稳定的底部填充膜的组件。在另一个方面中,本发明涉及延长底部填充膜工作寿命的方法。在还有一个方面中,本发明还涉及延长底部填充膜储存期限的方法。
发明内容
根据本发明,提供了延长底部填充膜工作寿命的含稳定的底部填充膜的组件。根据本发明的某些方面,还提供了延长底部填充膜储存期限的含稳定的底部填充膜的组件。
在本发明的某些方面中,还提供了延长底部填充膜工作寿命的方法。在本发明的另一些方面中,还提供了延长底部填充膜储存期限的方法。
附图说明
图1示出了用于底部填充膜组件的现有技术制品(format),其包括在涂层防粘衬垫和压敏粘合剂(PSA)带之间的底部填充膜层。
图2示出了本发明的示例性底部填充膜组件,其包括在涂层防粘衬垫和阻挡膜之间的底部填充膜层,其中压敏粘合剂(PSA)带被施加在阻挡膜的暴露侧上。
图3示出了本发明的另一示例性底部填充膜组件,其包括在涂层防粘衬垫和聚烯烃膜之间的底部填充膜层。
图4示出了本发明的还有一种示例性底部填充膜组件,其包括在涂层防粘衬垫和阻挡膜之间的底部填充膜层。
图5示出了本发明的另一示例性底部填充膜组件,其包括在涂层防粘衬垫和压敏粘合剂带之间的底部填充膜,其中PSA带由两层组成:一层是 PSA层,另一层是聚烯烃背衬带。
图6示出了本发明的还有一种示例性底部填充膜组件,其包括在涂层防粘衬垫和压敏粘合剂带之间的底部填充膜,其中PSA带由两层组成:一层是PSA层,另一层是含氟聚合物。
具体实施方式
根据本发明,提供了一种或多种含有底部填充膜的组件,所述组件包括:
底部填充膜层,其位于以下部件之间:
涂层防粘衬垫,和
阻挡膜。
各种底部填充膜被考虑用于本发明中。在一些实施方案中,底部填充膜包含热固性树脂。示例性热固性树脂包括环氧类树脂、马来酰亚胺类树脂、纳特酰亚胺(nadimide)类树脂、衣康酰胺类树脂、丙烯酸酯类树脂、氰酸酯类树脂、硅树脂、氧杂环丁烷树脂、聚酯类树脂、聚氨酯类树脂、聚酰亚胺类树脂、三聚氰胺类树脂、脲醛类树脂、酚醛类树脂等以及它们中任意两种以上的混合物。
环氧树脂
多种环氧官能化树脂被考虑用于本发明中,例如基于双酚A的液体型环氧树脂、基于双酚A的固体型环氧树脂、基于双酚F的液体型环氧树脂 (例如Epiclon EXA-835LV)、基于苯酚-酚醛清漆树脂的多官能环氧树脂、双环戊二烯型环氧树脂(例如Epiclon HP-7200L)、萘型环氧树脂等、以及它们中任意两种以上的混合物。
考虑用于本发明中的示例性环氧官能化树脂包括脂环族醇的双环氧化物、氢化双酚A(可作为Epalloy 5000市售得到)、六氢邻苯二甲酸酐的双官能脂环族缩水甘油酯(可作为Epalloy 5200市售得到)、Epiclon EXA-835LV、 Epiclon HP-7200L等、以及它们中任意两种以上的混合物。
在某些实施方案中,环氧组分可以包括两种以上不同双酚类环氧化物的组合。这些双酚类环氧化物可以选自双酚A、双酚F或双酚S环氧树脂、或者它们的组合。另外,可以使用相同类型树脂(例如A、F或S)中的两种以上不同的双酚环氧化物。
考虑用于本发明中的双酚环氧化物的市售可得实例包括双酚F型环氧化物(例如来自Nippon Kayaku,Japan的RE-404-S和来自Dai Nippon Ink& Chemicals,Inc.的EPICLON 830(RE1801)、830S(RE1815)、830A(RE1826) 和830W,以及来自Resolution的RSL1738、YL-983U)和双酚A型环氧树脂(例如来自Resolution的YL-979和980)。
可从Dai Nippon市售得到的上述双酚环氧化物被作为粘度比基于双酚 A环氧化物的常规环氧化物低得多的液体未稀释的表氯醇-双酚F环氧化物推广,并且其具有与液体双酚A环氧树脂相似的物理性质。双酚F环氧树脂具有比双酚A环氧树脂低的粘度,这两种类型的环氧树脂之间的所有其它参数相同;所述双酚F环氧树脂提供了较低的粘度并因此提供了快速流动的底部填充密封剂材料。这四种双酚F环氧树脂的EEW为165~180。 25℃粘度为3,000~4,500cps(除了粘度上限为4000cps的RE1801)。RE1815 和830W的可水解氯化物含量据报告为200ppm,RE1826的可水解氯化物含量据报告为100ppm。
可从Resolution市售得到的上述双酚环氧化物被作为含低氯化物的液体环氧化物推广。双酚A环氧化物的EEW(g/eq)为180~195,25℃粘度为 100~250cps。YL-979的总氯化物含量据报道为500~700ppm,YL-980 的总氯化物含量据报道为100~300ppm。双酚F环氧树脂的EEW(g/eq)为165~180,25℃粘度为30~60。RSL-1738的总氯化物含量据报道为500~ 700ppm,YL-983U的总氯化物含量据报道为150~350ppm。
除了双酚环氧化物之外,还考虑将其它环氧化合物用作本发明配制物的环氧组分。例如,可以使用脂环族环氧化物,例如3,4-环氧基环己基甲基-3,4-环氧基环己基碳酸酯。还可以使用单官能、二官能或多官能反应性稀释剂来调节所得树脂材料的粘度和/或降低其Tg。示例性反应性稀释剂包括丁基缩水甘油醚、甲苯基缩水甘油醚、聚乙二醇缩水甘油醚和聚丙二醇缩水甘油醚等。
适合用于本发明中的环氧树脂包括酚类化合物的多缩水甘油基衍生物,例如来自Resolution的以商品名EPON市售可得的那些,如EPON 828、 EPON 1001、EPON 1009和EPON1031;来自Dow Chemical Co.的DER 331、 DER 332、DER 334和DER 542;和来自NipponKayaku的BREN-S。其它合适的环氧化物包括由多元醇等制备的多环氧化物和酚醛清漆的多缩水甘油基衍生物,后者例如为来自Dow Chemical的DEN 431、DEN 438和DEN 439。甲酚类似物也可从Ciba Specialty Chemicals Corporation以商品名 ARALDITE市售得到,例如ARALDITE ECN 1235、ARALDITE ECN 1273 和ARALDITE ECN 1299。SU-8是可由Resolution获得的双酚A型环氧酚醛清漆。胺、氨基醇和多羧酸的多缩水甘油基加合物也可用于本发明中,其市售可得树脂包括来自F.I.C Corporation的GLYAMINE 135、GLYAMINE 125和GLYAMINE 115;来自Ciba Specialty Chemicals的ARALDITE MY-720、ARALDITE 0500和ARALDITE 0510以及来自Sherwin-Williams Co.的PGA-X和PGA-C。
任选用于本发明中的合适的单官能环氧共反应物稀释剂包括粘度低于环氧组分的粘度的那些,通常粘度小于约250cps的那些。
单官能环氧共反应物稀释剂应具有下述环氧基团,其具有约6~约28 个碳原子的烷基;所述单官能环氧共反应物稀释剂的实例包括C6-28烷基缩水甘油醚、C6-28脂肪酸缩水甘油酯和C6-28烷基酚缩水甘油醚等。
在包含这种单官能环氧共反应物稀释剂的情况下,基于组合物的总重量,这种共反应物稀释剂应以约0.5重量%~约10重量%的量使用;在一些实施方案中,基于组合物的总重量,这种共反应物稀释剂应以约0.25重量%~约5重量%的量使用。
环氧树脂组分应当以约1重量%~约20重量%的量存在于组合物中;在一些实施方案中,本发明配制物包含约2重量%~约18重量%的环氧树脂;在一些实施方案中,本发明配制物包含约5重量%~约15重量%的环氧树脂。
在一些实施方案中,本发明中使用的环氧树脂组分是硅烷改性的环氧树脂,例如包括以下组分的组合物:
(A)以下结构涵盖的环氧树脂组分:
其中:
Y可以存在或不存在,且当Y存在时其为直接键合(direct bond)、CH2、 CH(CH3)2、C=O或S,
此处R1为烷基、烯基、羟基、羧基和卤素,且
此处x为1~4;
(B)以下结构涵盖的环氧官能化烷氧基硅烷:
R1-Si(OR2)3
其中:
R1为含环氧乙烷的部分,且
R2为具有1~10个碳原子的烷基或者经烷氧基取代的烷基、芳基或芳烷基;和
(C)组分(A)和(B)的反应产物。
一种这样的硅烷改性的环氧树脂的实例作为芳香族环氧树脂(例如双酚A、E、F或S环氧树脂或联苯基环氧树脂)和环氧硅烷的反应产物形成,其中所述环氧硅烷由以下结构所涵盖:
R1-Si(OR2)3
其中:
R1是含环氧乙烷的部分,其实例包括2-(乙氧基甲基)环氧乙烷、2-(丙氧基甲基)环氧乙烷、2-(甲氧基甲基)环氧乙烷和2-(3-甲氧基丙基)环氧乙烷,且
R2是具有1~10个碳原子的烷基或者经烷氧基取代的烷基、芳基或芳烷基。
在一个实施方案中,R1是2-(乙氧基甲基)环氧乙烷且R2是甲基。
用以制备硅烷改性的环氧树脂的芳香族环氧树脂的理想化结构包括:
其中:
Y可以存在或不存在,且当Y存在时,其是直接键合、CH2、CH(CH3)2、 C=O或S,
R1是烷基、烯基、羟基、羧基或卤素,且
x是1~4。
当然,当x是2~4时,还可考虑芳香族环氧树脂的扩链形式也被该结构所涵盖。
例如,芳香族环氧树脂的扩链形式可由以下结构所涵盖:
在一些实施方案中,硅氧烷改性的环氧树脂具有以下结构:
-(O-Si(Me)2-O-Si(Me)(Z)-O-Si(Me)2-O-Si(Me)2)n-
其中:
Z是-O-(CH2)3-O-Ph-CH2-Ph-O-(CH2-CH(OH)-CH2-O-Ph-CH2-Ph-O-)n- CH2-环氧乙烷,且
n为约1~4。
在一些实施方案中,硅氧烷改性的环氧树脂通过在适合于促进其反应的条件下使以下组分的组合接触而制得:
环氧乙烷-CH2-O-Ph-CH2-Ph-O-(CH2-CH(OH)-CH2-O-Ph-CH2-Ph-O-)n- CH2-环氧乙烷,
其中,“n”为约1~4。
硅烷改性的环氧树脂也可以是芳香族环氧树脂、环氧硅烷和芳香族环氧树脂与环氧硅烷的反应产物的组合。反应产物可以由芳香族环氧树脂和环氧硅烷以1:100~100:1的重量比、例如1:10~10:1的重量比制备。
考虑用于本发明组合物中的环氧单体的量足以使得所得配制物包含约1~20重量%的所述环氧树脂。在某些实施方案中,所得配制物包含约2~ 18重量%的所述环氧树脂。在某些实施方案中,所得配制物包含约5~15 重量%的所述环氧树脂。
环氧固化剂任选地与环氧单体组合使用。示例性环氧固化剂包括脲、脂肪族和芳香族胺、胺硬化剂、聚酰胺、咪唑、双氰胺、酰肼、脲-胺混合固化体系、自由基引发剂(例如过氧酯、过氧碳酸酯、氢过氧化物、烷基过氧化物、芳基过氧化物、偶氮化合物等)、有机碱、过渡金属催化剂、酚、酸酐、路易斯酸、路易斯碱等。
当存在环氧固化剂时,本发明组合物包含约0.1~2重量%的所述环氧固化剂。在某些实施方案中,本发明组合物包含约0.5~5重量%的环氧固化剂。
马来酰亚胺、纳特酰亚胺或衣康酰亚胺
考虑用于本发明中的马来酰亚胺、纳特酰亚胺或衣康酰亚胺分别是具有以下结构的化合物:
其中:
m是1~15,
p是0~15,
各个R2独立地选自氢或低级烷基(例如C1-5),且
J是包含有机基团或有机硅氧烷基团的单价或多价基团,和
它们中两种以上的组合。
在本发明的一些实施方案中,J是选自以下基团中的一价或多价基团:
-烃基或经取代的烃基类(species),其通常具有约6~约500个碳原子,其中烃基类选自烷基、烯基、炔基、环烷基、环烯基、芳基、烷基芳基、芳基烷基、芳基烯基、烯基芳基、芳基炔基或炔基芳基;然而,前提条件为只有当X包含两种以上不同类的组合时,X可以是芳基;
-亚烃基(hydrocarbylene)或经取代的亚烃基类,其通常具有约6~约500个碳原子,其中亚烃基类选自亚烷基、亚烯基、亚炔基、亚环烷基、亚环烯基、亚芳基、烷基亚芳基(alkylarylene)、芳基亚烷基(arylalkylene)、芳基亚烯基(arylalkenylene)、烯基亚芳基(alkenylarylene)、芳基亚炔基 (arylalkynylene)或炔基亚芳基(alkynylarylene),
-杂环或经取代的杂环类,其通常具有约6~约500个碳原子,
-聚硅氧烷,或
-聚硅氧烷-聚氨酯嵌段共聚物,以及
上述基团中的一种或多种与连接体(linker)的组合,所述连接体选自:共价键、-O-、-S-、 -NR-、-NR-C(O)-、-NR-C(O)-O-、-NR-C(O)-NR-、-S-C(O)-、-S-C(O)-O- 、-S-C(O)-NR-、-O-S(O)2-、-O-S(O)2-O-、-O-S(O)2-NR-、-O-S(O)-、-O-S(O)-O-、-O-S(O)-NR-、-O-NR-C(O)-、-O-NR-C(O)-O-、-O-NR-C(O)- NR-、-NR-O-C(O)-、-NR-O-C(O)-O-、-NR-O-C(O)-NR-、-O-NR-C(S)-、- O-NR-C(S)-O-、-O-NR-C(S)-NR-、-NR-O-C(S)-、-NR-O-C(S)-O-、-NR-O- C(S)-NR-、-O-C(S)-、-O-C(S)-O-、-O-C(S)-NR-、 -NR-C(S)-、-NR-C(S)-O-、-NR-C(S)-NR-、-S-S(O)2-、-S-S(O)2-O-、 -S-S(O)2-NR-、-NR-O-S(O)-、-NR-O-S(O)-O-、-NR-O-S(O)-NR-、 -NR-O-S(O)2-、-NR-O-S(O)2-O-、 -NR-O-S(O)2-NR-、-O-NR-S(O)-、-O-NR-S(O)-O-、-O-NR-S(O)-NR-、 -O-NR-S(O)2-O-、-O-NR-S(O)2-NR-、-O-NR-S(O)2-、-O-P(O)R2-、-S-P(O)R2- 或-NR-P(O)R2-;其中,各个R独立地为氢、烷基或经取代的烷基。
示例性组合物包括以下那些:其中,J为氧代烷基、硫代烷基、氨基烷基、羧基烷基、氧代烯基、硫代烯基、氨基烯基、羧基烯基、氧代炔基、硫代炔基、氨基炔基、羧基炔基、氧代环烷基、硫代环烷基、氨基环烷基、羧基环烷基、氧代环烯基、硫代环烯基、氨基环烯基、羧基环烯基、杂环基、氧代杂环基、硫代杂环基、氨基杂环基、羧基杂环基、氧代芳基、硫代芳基、氨基芳基、羧基芳基、杂芳基、氧代杂芳基、硫代杂芳基、氨基杂芳基、羧基杂芳基、氧代烷基芳基、硫代烷基芳基、氨基烷基芳基、羧基烷基芳基、氧代芳基烷基、硫代芳基烷基、氨基芳基烷基、羧基芳基烷基、氧代芳基烯基、硫代芳基烯基、氨基芳基烯基、羧基芳基烯基、氧代烯基芳基、硫代烯基芳基、氨基烯基芳基、羧基烯基芳基、氧代芳基炔基、硫代芳基炔基、氨基芳基炔基、羧基芳基炔基、氧代炔基芳基、硫代炔基芳基、氨基炔基芳基或羧基炔基芳基、氧代亚烷基、硫代亚烷基、氨基亚烷基、羧基亚烷基、氧代亚烯基、硫代亚烯基、氨基亚烯基、羧基亚烯基、氧代亚炔基、硫代亚炔基、氨基亚炔基、羧基亚炔基、氧代亚环烷基、硫代亚环烷基、氨基亚环烷基、羧基亚环烷基、氧代亚环烯基、硫代亚环烯基、氨基亚环烯基、羧基亚环烯基、氧代亚芳基、硫代亚芳基、氨基亚芳基、羧基亚芳基、氧代烷基亚芳基、硫代烷基亚芳基、氨基烷基亚芳基、羧基烷基亚芳基、氧代芳基亚烷基、硫代芳基亚烷基、氨基芳基亚烷基、羧基芳基亚烷基、氧代芳基亚烯基、硫代芳基亚烯基、氨基芳基亚烯基、羧基芳基亚烯基、氧代烯基亚芳基、硫代烯基亚芳基、氨基烯基亚芳基、羧基烯基亚芳基、氧代芳基亚炔基、硫代芳基亚炔基、氨基芳基亚炔基、羧基芳基亚炔基、氧代炔基亚芳基、硫代炔基亚芳基、氨基炔基亚芳基、羧基炔基亚芳基、亚杂芳基、氧代亚杂芳基、硫代亚杂芳基、氨基亚杂芳基、羧基亚杂芳基、含杂原子的二价或多价环状部分、含氧杂原子的二价或多价环状部分、含硫杂原子的二价或多价环状部分、含氨基杂原子的二价或多价环状部分或者含羧基杂原子的二价或多价环状部分。
丙烯酸酯
考虑用于本发明实践中的丙烯酸酯是本领域中公知的。例如,参见美国专利No.5,717,034,其全部内容在此通过援引加入的方式纳入。
考虑用于本发明中的示例性丙烯酸酯包括单官能(甲基)丙烯酸酯、二官能(甲基)丙烯酸酯、三官能(甲基)丙烯酸酯和多官能(甲基)丙烯酸酯等。
示例性单官能(甲基)丙烯酸酯包括苯基苯酚丙烯酸酯、甲氧基聚乙烯丙烯酸酯、丙烯酰氧基乙基琥珀酸酯、脂肪酸丙烯酸酯、甲基丙烯酰氧基乙基邻苯二甲酸、苯氧基乙二醇甲基丙烯酸酯、脂肪酸甲基丙烯酸酯、β-羧乙基丙烯酸酯、丙烯酸异冰片酯、丙烯酸异丁酯、丙烯酸叔丁酯、丙烯酸羟乙酯、丙烯酸羟丙酯、丙烯酸二氢环戊二乙基酯、甲基丙烯酸环己酯、甲基丙烯酸叔丁酯、甲基丙烯酸二甲基氨基乙酯、甲基丙烯酸二乙基氨基乙酯、甲基丙烯酸叔丁基氨基乙酯、丙烯酸4-羟基丁酯、丙烯酸四氢糠酯、丙烯酸苄酯、乙基卡必醇丙烯酸酯、丙烯酸苯氧基乙酯、甲氧基三乙二醇丙烯酸酯、单季戊四醇丙烯酸酯、二季戊四醇丙烯酸酯、三季戊四醇丙烯酸酯和聚季戊四醇丙烯酸酯等。
示例性二官能(甲基)丙烯酸酯包括:己二醇二甲基丙烯酸酯、甲基丙烯酸羟基丙烯酰氧基丙基酯、己二醇二丙烯酸酯、丙烯酸氨基甲酸酯(urethane acrylate)、环氧丙烯酸酯、双酚A型环氧丙烯酸酯、改性环氧丙烯酸酯、脂肪酸改性环氧丙烯酸酯、胺改性双酚A型环氧丙烯酸酯、甲基丙烯酸烯丙酯、乙二醇二甲基丙烯酸酯、二乙二醇二甲基丙烯酸酯、乙氧基化双酚 A二甲基丙烯酸酯、三环癸烷二甲醇二甲基丙烯酸酯、甘油二甲基丙烯酸酯、聚丙二醇二丙烯酸酯、丙氧基化乙氧基化双酚A二丙烯酸酯、9,9-双 (4-(2-丙烯酰氧基乙氧基)苯基)芴、三环癸烷二丙烯酸酯、二丙二醇二丙烯酸酯、聚丙二醇二丙烯酸酯、PO改性的新戊二醇二丙烯酸酯、三环癸烷二甲醇二丙烯酸酯和1,12-十二烷二醇二甲基丙烯酸酯等。
示例性三官能(甲基)丙烯酸酯包括:三羟甲基丙烷三甲基丙烯酸酯、三羟甲基丙烷三丙烯酸酯、三羟甲基丙烷乙氧基三丙烯酸酯、聚醚三丙烯酸酯和甘油丙氧基三丙烯酸酯等。
示例性多官能(甲基)丙烯酸酯包括:二季戊四醇聚丙烯酸酯、二季戊四醇六丙烯酸酯、季戊四醇四丙烯酸酯、季戊四醇乙氧基四丙烯酸酯和双三羟甲基丙烷四丙烯酸酯等。
考虑用于本发明实践中的另外的示例性丙烯酸酯包括美国专利No. 5,717,034中描述的那些,在此将其全部内容通过援引加入的方式纳入本文。
氰酸酯类树脂
考虑用于本发明实践中的氰酸酯单体包含两个以上成环氰酸酯(-O-C ≡N)基团,其在加热时环化三聚合形成经取代的三嗪环。因为在氰酸酯单体的固化期间不形成离去基团或挥发性副产物,所以固化反应被称为加成聚合。可用于本发明实践中的合适的多氰酸酯单体包括例如1,1-双(4-氰酰苯基)甲烷、1,1-双(4-氰酰苯基)乙烷、2,2-双(4-氰酰苯基)丙烷、双(4-氰酰苯基)-2,2-丁烷、1,3-双[2-(4-氰酰苯基)丙基]苯、双(4-氰酰苯基)醚、4,4'-二氰酰联苯、双(4-氰酰基-3,5-二甲基苯基)甲烷、三(4-氰酰苯基)乙烷、氰化酚醛清漆、1,3-双[4-氰酰苯基-1-(1-甲基亚乙基)]苯、氰化苯酚二环戊二烯加合物等。本发明使用的多氰酸酯单体可容易地通过在酸受体的存在下使适当的二元或多元酚与卤化氰反应来制备。
可任选地与本发明的多氰酸酯单体组合的单体选自进行加成聚合的那些单体。这样的单体包括乙烯基醚、二乙烯基醚、二烯丙基醚、二甲基丙烯酸酯、二炔丙基醚、混合的炔丙基烯丙基醚、单马来酰亚胺和双马来酰亚胺等。这类单体的实例包括环己烷二甲醇单乙烯基醚、三烯丙基氰尿酸酯、1,1-双(4-烯丙氧基苯基)乙烷、1,1-双(4-炔丙氧基苯基)乙烷、1,1-双(4- 烯丙氧基苯基-4'-炔丙氧基苯基)乙烷、3-(2,2-二甲基三亚甲基缩醛)-1-马来酰亚胺苯、2,2,4-三甲基六亚甲基-1,6-双马来酰亚胺和2,2-双[4-(4-马来酰亚胺苯氧基)苯基]丙烷等。
考虑用于本发明实践中的另外的氰酸酯是在本领域中公知的。例如,参见美国专利No.5,718,941,在此将其全部内容通过援引加入的方式纳入本文。
硅树脂
考虑用于本发明实践中的硅树脂是本领域中公知的。例如,参见美国专利No.5,717,034,在此将其全部内容通过援引加入的方式纳入本文。
氧杂环丁烷树脂
氧杂环丁烷(即1,3-环氧丙烷)是分子式为C3H6O的杂环有机化合物,其含具有三个碳原子和一个氧原子的四元环。术语氧杂环丁烷通常也指任何含有氧杂环丁烷环的有机化合物。例如,参见Burkhard等人,Angew.Chem. Int.Ed.2010,49,9052–9067,在此将其全部内容通过援引加入的方式纳入本文。
聚酯类树脂
考虑用于本发明实践中的聚酯是指通过多元醇(也被称为多羟基醇)与饱和或不饱和二元酸反应形成的缩合聚合物。使用的典型多元醇是二醇,如乙二醇;通常使用的酸是邻苯二甲酸和马来酸。水,作为酯化反应的副产物,被持续移除从而推动反应完成。使用不饱和聚酯和添加剂(例如苯乙烯)会降低树脂的粘度。最初液态的树脂通过交联链被转化为固体。这是通过在不饱和键处产生自由基来完成的,其中所述自由基在链式反应中增长到相邻分子中的其它不饱和键,从而在该过程中连接相邻的链。
聚氨酯类树脂
考虑用于本发明实践中的聚氨酯是指由通过氨基甲酸酯(carbamate或urethane)连接体(link)连接的有机单元的链构成的聚合物。聚氨酯聚合物通过使异氰酸酯与多元醇反应而形成。用以制造聚氨酯的异氰酸酯和多元醇均每个分子平均含有两个以上官能团。
聚酰亚胺类树脂
考虑用于本发明实践中的聚酰亚胺是指由通过酰亚胺键(即 C(O)-N(R)-C(O)-)连接的有机单元的链构成的聚合物。聚酰亚胺聚合物可以通过各种反应形成,即通过使二酐和二胺反应、通过二酐和二异氰酸酯之间的反应等形成。
三聚氰胺类树脂
考虑用于本发明实践中的三聚氰胺是指由三聚氰胺(即1,3,5-三嗪 -2,4,6-三胺)和甲醛通过聚合制成的硬质热固性塑料材料。当其为丁基化形式时,其可以溶解在正丁醇和/或二甲苯中。其可以用以与其它树脂——例如醇酸树脂、环氧树脂、丙烯酸树脂和聚酯树脂——交联。
脲醛类树脂
考虑用于本发明实践中的脲醛是指由在弱碱(mild base)(例如氨或吡啶)的存在下加热的脲和甲醛制成的不透明热固性树脂或塑料。
酚醛类树脂
考虑用于本发明实践中的酚醛是指通过苯酚或经取代的苯酚与甲醛反应获得的合成聚合物。
考虑用于本发明中的底部填充膜层通常具有约5μm~约200μm的厚度。在一些实施方案中,膜厚度落入约5~150μm的范围内。在一些实施方案中,膜厚度落入约5~100μm的范围内。在一些实施方案中,膜厚度落入约5~75μm的范围内。在一些实施方案中,膜厚度落入约5~60μm 的范围内。
考虑用于本发明中的示例性涂层防粘衬垫包括基本上不与底部填充膜层发生化学相互作用的材料,包括用以防止底部填充膜表面粘附的材料,例如基于纸或塑料的膜片。示例性材料是基于塑料的材料,例如PET、聚烯烃、硅树脂等。
考虑用于本发明中的阻挡膜是对进入或离开其表面的化学迁移基本上不渗透的材料。示例性阻挡膜包括聚对苯二甲酸乙二醇酯、氟代聚烯烃、全氟聚烯烃、硅树脂层等。
考虑用于本发明中的氟代聚烯烃包括ETFE(乙烯与四氟乙烯的共聚物)、全氟烷氧烃、PCTFE(聚氯特氟隆膜)、FEP(氟化乙烯-丙烯共聚物)、 PVDF(聚偏二氟乙烯)等。
本发明实践中采用的阻挡膜通常具有约1nm~约200μm的厚度。在一些实施方案中,本发明中使用的阻挡膜具有约10nm~200μm的厚度。在一些实施方案中,本发明中使用的阻挡膜具有约100nm~200μm的厚度。在一些实施方案中,本发明中使用的阻挡膜具有约100nm~100μm 的厚度。在一些实施方案中,本发明中使用的阻挡膜具有约50nm~100μ m的厚度。在一些实施方案中,本发明中使用的阻挡膜具有约10~50μm 的厚度。在一些实施方案中,本发明中使用的阻挡膜具有约5~50μm的厚度。
在某些实施方案中,本发明组件还包括在阻挡膜的暴露侧上的压敏粘合剂带。例如,参见图2。示例性压敏粘合剂包含基于丙烯酸类聚合物、橡胶、乙烯-乙酸乙烯酯共聚物、腈、苯乙烯嵌段共聚物等的弹性体。
在一些实施方案中,本发明组件包括:
包含树脂、硬化剂和填料的底部填充膜层,
聚对苯二甲酸乙二醇酯(PET)涂层防粘衬垫,和
氟代聚烯烃阻挡膜,
其中所述底部填充膜基本上不与阻挡膜相互作用,并且保持其对于用于底部填充应用中而言有利的性质。
在一些实施方案中,本发明组件包括:
包含树脂、硬化剂和填料的底部填充膜层,
聚对苯二甲酸乙二醇酯(PET)涂层防粘衬垫,
氟代聚烯烃阻挡膜,和
在阻挡膜的暴露侧上的压敏粘合剂(PSA)带,所述粘合剂包含基于丙烯酸类聚合物、橡胶、乙烯-乙酸乙烯酯共聚物、腈、苯乙烯嵌段共聚物等的弹性体,
其中所述底部填充膜基本上不与PSA相互作用,并且保持其对于用于底部填充应用中而言有利的性质。
在一些实施方案中,本发明组件包括:
包含树脂、硬化剂和填料的底部填充膜层,
聚对苯二甲酸乙二醇酯(PET)涂层防粘衬垫,
包含在含氟聚合物背衬层上的压敏粘合剂(PSA)层的PSA带,
其中所述底部填充膜基本上不与背衬带相互作用,并且保持其对于用于底部填充应用中而言有利的性质。
根据本发明的另一实施方案,提供了延长由涂层防粘衬垫支持的底部填充膜层的储存期限的方法,所述方法包括将阻挡膜施加到所述底部填充膜层的暴露侧上。
如本文所述,考虑用于本发明中的底部填充膜层包含一种或多种热固性树脂。
如本文中还详细描述的,考虑用于本发明中的阻挡膜对进入或离开其表面的化学迁移基本上不渗透。
根据本发明的又一实施方案,提供了延长由涂层防粘衬垫支持的底部填充膜层的工作寿命的方法,所述方法包括将阻挡膜施加到所述底部填充膜层的暴露侧上。
根据本发明的又一实施方案,提供了包含粘附于对于其而言合适的基材上的本文所述的底部填充膜的物品。
考虑用于本发明中的合适基材包括聚对苯二甲酸乙二醇酯、聚甲基丙烯酸甲酯、聚烯烃(例如聚乙烯、聚丙烯等)、聚碳酸酯、环氧树脂、聚酰亚胺、聚酰胺、聚酯、玻璃、具有氮化硅钝化的Si芯片、具有聚酰亚胺钝化的Si芯片、BT衬底、裸Si、SR4衬底、SR5衬底等。
本发明物品中所述底部填充膜与所述基材的粘附性通常用SiN芯片/PI 芯片/SiO2(尺寸:3.81×3.81×700mm3)测试时为至少5kg/cm2,其中,所述芯片在120℃/1kg力下附着在BT衬底上5秒,然后通过用30分钟将温度从室温升至175℃而固化,然后在175℃下保持5小时。
可以使用本发明材料来制备各种物品,包括例如倒装芯片封装体、堆叠芯片、混合存储立方体和TSV装置等。
本发明的多个方面通过以下非限制性实施例示例说明。这些实施例是为了示例说明的目的,而不是对本发明的任何实践的限制。应该理解,在不脱离本发明的精神和范围的情况下可以进行变化和修改。本领域普通技术人员容易了解如何合成或商业获得本文所述的试剂和组分。
实施例1
制备第一组件,其包含在PET涂层防粘衬垫和压敏粘合剂带之间的基于丙烯酸酯化学的底部填充膜(厚度为20~40μm)(参见图1)。然后评价所得组件的工作寿命特性。
制备第二组件,其包含在涂层防粘衬垫和阻挡膜之间的相同底部填充膜,并且还包含施加在阻挡膜的暴露表面上的压敏粘合剂带(参见图2)。然后评价所得组件的工作寿命特性。
表1中给出了第一和第二组件的结果。
表1
表1中给出的结果表明,不存在阻挡膜的现有技术的组件——例如制品I(参见图1)——在工作寿命测试期间显示出显著的材料性能变化。例如, DSC峰值温度上移(up-shifted)>10℃,ΔT增加>2倍,反应热降至>50%。
相比之下(参见制品II,图2),通过使用阻挡膜制备的组件的底部填充膜显示出很大改善的稳定性。
实施例2
另外的组件如下制备。制备第三组件,其包含在涂层防粘衬垫和聚烯烃膜之间的底部填充膜(参见图3)。然后评价所得组件的工作寿命特性。
制备第四组件,其包含在涂层防粘衬垫和阻挡膜之间的底部填充膜(参见图4)。然后评价所得组件的工作寿命特性。
表2给出了第三和第四组件的结果。
表2
制品III(参见图3——不含阻挡膜)和制品IV(图4)之间的比较显示了,底部填充材料在工作寿命测试过程中经历了显著的材料特性变化,例如DSC峰值温度上移了>7℃,ΔT增加了>2倍,反应热降至>30%。
相比之下,包含阻挡膜的制品IV(图4)的组件中的底部填充膜显示出高得多的稳定性。
实施例3
另外的组件如下制备。制备第五组件,其包含在涂层防粘衬垫和压敏粘合剂带之间的底部填充膜(参见图5)。该PSA带由两层组成:一层是PSA 层,另一层是聚烯烃背衬带。然后评价所得组件的工作寿命特性。
制备第六组件,其包含在涂层防粘衬垫和压敏粘合剂带之间的底部填充膜(参见图6)。该PSA带由两层组成:一层是PSA层,另一层是含氟聚合物。然后评价所得组件的工作寿命特性。
表3中给出了第五和第六组件的结果。
表3
制品V(参见图5——不含阻挡膜)和制品VI(图6)之间的比较显示了,底部填充材料在工作寿命测试过程中经历了显著的材料特性变化,例如DSC初始温度下移了<130℃,且DSC变为多重峰。
相比之下,包含阻挡膜的制品VI(图6)组件中的底部填充膜显示出高得多的稳定性。
除了本文所示和所描述的那些之外,本发明的各种修改对于以上描述的领域的技术人员来说将是显而易见的。这些修改也意图落入所附权利要求的范围内。
本说明书中提及的专利和出版物指示了本发明所属领域的技术人员的水平。这些专利和出版物通过援引加入的方式纳入本文,其程度如同每个单独的申请或出版物具体且逐一地通过援引加入的方式纳入本文一样。
以上描述是对本发明的具体实施方案的示例说明,但并不意味着对其实践的限制。以下权利要求书(包括其所有等同物)均旨在限定本发明的范围。
Claims (10)
1.含有底部填充膜的组件,所述组件包括:
包含热固性树脂的底部填充膜层,所述底部填充膜层位于以下部件之间:
涂层防粘衬垫,其中所述涂层防粘衬垫基本上不与所述底部填充膜层发生化学相互作用并且是防止所述底部填充膜表面粘附的基于纸或塑料的膜片,和
阻挡膜,其中所述阻挡膜对进入或离开其表面的化学迁移基本上不渗透并且包含选自以下的氟代聚烯烃:ETFE(乙烯与四氟乙烯的共聚物)、全氟烷氧烃、PCTFE(聚氯特氟隆)膜、FEP(氟化乙烯-丙烯共聚物)或PVDF(聚偏二氟乙烯),
其中所述组件还包括:
在所述阻挡膜的暴露侧上的压敏粘合剂带层。
2.如权利要求1所述的组件,其中所述底部填充膜是热固性树脂。
3.如权利要求2所述的组件,其中所述热固性树脂选自:环氧类树脂、马来酰亚胺类树脂、纳特酰亚胺类树脂、衣康酰胺类树脂、丙烯酸酯类树脂、氰酸酯类树脂、硅树脂、氧杂环丁烷树脂、聚酯类树脂、聚氨酯类树脂、聚酰亚胺类树脂、三聚氰胺类树脂、脲醛类树脂、酚醛类树脂以及它们中任意两种以上的混合物。
4.如权利要求1所述的组件,其中所述底部填充膜层具有约5μm~约200μm的厚度。
5.如权利要求1所述的组件,其中所述涂层防粘衬垫是基于塑料的。
6.如权利要求5所述的组件,其中所述涂层防粘衬垫选自PET、聚烯烃或硅树脂。
7.如权利要求1所述的组件,其中所述阻挡膜具有约1nm~约200μm的厚度。
8.如权利要求1所述的组件,其中所述压敏粘合剂是弹性体丙烯酸类树脂。
9.如权利要求1所述的组件,其中:
所述底部填充膜层包含树脂、硬化剂和填料,
所述涂层防粘衬垫包含PET,且
其中所述底部填充膜基本上不与所述阻挡膜相互作用,并且保持其对于用于底部填充应用中而言有利的性质。
10.如权利要求7所述的组件,其中:
所述底部填充膜层包含树脂、硬化剂和填料,
所述涂层防粘衬垫包含PET,且
在所述阻挡膜的暴露侧上的所述压敏粘合剂带包含基于丙烯酸类聚合物、橡胶、乙烯-乙酸乙烯酯共聚物、腈或苯乙烯嵌段共聚物的弹性体,
其中所述底部填充膜基本上不与所述阻挡膜相互作用,并且保持其对于用于底部填充应用中而言有利的性质。
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