CN108054496B - Metal base material, middle frame assembly and electronic equipment - Google Patents

Abstract

The embodiment of the application discloses metal substrate, center subassembly and electronic equipment, wherein, the center subassembly includes center and antenna radiator, the center includes the metal substrate, the antenna radiator set up in metal substrate's periphery, the antenna radiator includes the convex part, the convex part is followed the outside formation that extends in surface of antenna radiator, the thickness of antenna radiator is followed the convex part orientation the edge taper of antenna radiator. Therefore, the antenna radiators are arranged on the periphery of the frame in the embodiment of the application, the middle frame has continuity and integrity, and the strength of the middle frame is increased.

Description

Metal substrates, midframe components and electronic equipment

technical field

The present application relates to the technical field of electronic devices, and in particular, to a metal substrate, a middle frame assembly and an electronic device.

Background technique

With the development of network technology and the improvement of the degree of intelligence of electronic devices, users can realize more and more functions through electronic devices, such as calling, chatting, and playing games.

Wherein, the user realizes signal transmission through the antenna of the electronic device in the process of using the electronic device to talk or chat. The manufacturing method of the existing antenna is to disconnect one or more openings on the frame of the middle frame, and set the disconnected part as an antenna. However, setting the disconnected part as an antenna will break the continuity of the frame and reduce the strength of the middle frame.

SUMMARY OF THE INVENTION

Embodiments of the present application provide a metal substrate, a middle frame assembly and an electronic device, which can increase the strength of the middle frame.

In a first aspect, an embodiment of the present application provides a middle frame assembly, including a middle frame and an antenna radiator, the middle frame includes a metal substrate, the antenna radiator is disposed on the periphery of the metal substrate, and the antenna radiator A convex portion is included, the convex portion is formed to extend outward from the surface of the antenna radiator, and the thickness of the antenna radiator gradually becomes thinner from the convex portion toward the edge of the antenna radiator.

In a second aspect, an embodiment of the present application further provides a middle frame assembly, including a middle frame and an antenna radiator, the middle frame includes a metal substrate, the antenna radiator is disposed on the periphery of the metal substrate, and the antenna radiates The body includes a recess formed inwardly from a surface of the antenna radiator, and the thickness of the antenna radiator gradually becomes thicker from the recess to an edge of the antenna radiator.

In a third aspect, an embodiment of the present application further provides a metal base material, the metal base material includes a metal base plate and an extension portion, the extension portion is formed by extending outward from a peripheral edge of the metal base plate, and the extension portion and the extension portion are formed A gap is formed between the metal substrates, the extending portion includes a convex portion, the convex portion is formed to extend outward from the surface of the extending portion, and the thickness of the extending portion is from the convex portion toward the extending portion. The edges are gradually thinned.

In a fourth aspect, an embodiment of the present application further provides a metal base material, the metal base material includes a metal base plate and an extension portion, the extension portion is formed by extending outward from a peripheral edge of the metal base plate, the extension portion and the extension portion are formed A gap is formed between the metal substrates, the extending portion includes a concave portion, the concave portion is formed inwardly from the surface of the extending portion, and the thickness of the extending portion gradually changes from the concave portion to the edge of the extending portion thick.

In a fifth aspect, an embodiment of the present application further provides an electronic device, the electronic device includes a middle frame assembly, and the middle frame assembly is the middle frame assembly described in any one of the above.

In the middle frame assembly provided by the embodiment of the present application, the antenna radiator is arranged at the peripheral position of the metal substrate, the middle frame can be integrally formed, the middle frame has continuity and integrity, and has high strength, which can increase the strength of the middle frame.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 2 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 3 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 4 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 5 is a partial structural schematic diagram of an electronic device provided by an embodiment of the present application.

FIG. 6 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 7 is a schematic structural diagram of an antenna radiator provided by an embodiment of the present application.

FIG. 8 is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application.

FIG. 9 is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application

FIG. 10 is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application.

FIG. 11 is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application.

FIG. 12 is a schematic structural diagram of a middle frame assembly provided by an embodiment of the present application.

FIG. 13 is a schematic structural diagram of a fixed connection between a metal substrate and an antenna radiator according to an embodiment of the present application.

FIG. 14 is another schematic structural diagram of the fixed connection between the metal substrate and the antenna radiator according to the embodiment of the present application.

FIG. 15 is a schematic structural diagram of the cooperation between a middle frame and an earphone jack according to an embodiment of the present application.

FIG. 16 is a schematic structural diagram of a metal substrate provided in an embodiment of the present application.

FIG. 17 is another schematic structural diagram of the metal substrate provided by the embodiment of the present application.

FIG. 18 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 19 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 20 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 21 is another schematic structural diagram of a middle frame assembly provided by an embodiment of the present application.

FIG. 22 is another schematic structural diagram of the cooperation between an antenna radiator and a metal substrate provided by an embodiment of the present application.

FIG. 23 is another schematic structural diagram of the cooperation between an antenna radiator and a metal substrate according to an embodiment of the present application.

FIG. 24 is another schematic structural diagram of the cooperation between an antenna radiator and a metal substrate according to an embodiment of the present application.

FIG. 25 is another schematic structural diagram of the cooperation between an antenna radiator and a metal substrate provided by an embodiment of the present application.

FIG. 26 is a schematic structural diagram of the cooperation between an antenna radiator and a connecting portion according to an embodiment of the present application.

FIG. 27 is another schematic structural diagram of the cooperation between the antenna radiator and the connecting portion provided by the embodiment of the present application.

FIG. 28 is another schematic structural diagram of a middle frame assembly provided by an embodiment of the present application.

FIG. 29 is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application.

FIG. 30 is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application.

FIG. 31 is another schematic structural diagram of the metal substrate provided by the embodiment of the present application.

FIG. 32 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Embodiments of the present application provide a metal substrate, a middle frame assembly, and an electronic device. The detailed descriptions will be given below.

In this embodiment, description will be made from the perspective of a middle frame assembly, which may be specifically provided in an electronic device, such as a mobile phone, a tablet computer, a PDA (Personal Digital Assistant, PDA), and the like.

Please also refer to 1, FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device 1 includes a casing 10 , an antenna radiator 20 , a printed circuit board 30 , a display screen 40 , and a battery 50 .

The casing 10 may include a cover plate 11 , a middle frame 12 and a rear cover 13 , and the cover plate 11 , the middle frame 12 and the rear cover 13 are combined to form the casing 10 . The closed space formed by the frame 12 and the back cover 13 is used to accommodate components such as the antenna radiator 20 , the printed circuit board 30 , the display screen 40 , and the battery 50 . In some embodiments, the cover 11 is covered on the middle frame 12 , the rear cover 13 is covered on the middle frame 12 , the cover 11 and the rear cover 13 are located on the opposite sides of the middle frame 12 , the cover 11 and the rear cover 13 Relatively arranged, the closed space of the housing 10 is located between the cover plate 11 and the rear cover 13 .

In some embodiments, the housing 10 may be a metal housing. It should be noted that the material of the housing 10 in the embodiment of the present application is not limited to this, and other methods may also be used. For example, the housing 10 may include a plastic part and a metal part. For another example, the casing 10 may be a plastic casing. For another example, the casing 10 may be a casing structure in which metal and plastic cooperate with each other. The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire.

It should be noted that the structure of the housing in the embodiment of the present application is not limited to this. For example, the rear cover and the middle frame are integrally formed to form a middle frame 12 structure. Specifically, the housing 10 includes a cover plate 11 and a middle frame 12 . The cover plate 11 and the middle frame 12 are fixed to each other to form a closed space for accommodating the antenna radiator 20 , the printed circuit board 30 , the display screen 40 , and the battery 50 . and other devices.

The periphery of the casing 10 includes a first side portion 101 , a second side portion 102 , a third side portion 103 and a fourth side portion 104 that are connected end to end. The first side portion 101 and the third side portion 103 are arranged opposite to each other, and the second side portion 102 and the fourth side portion 104 are arranged opposite to each other.

Please refer to FIG. 2 , which is another schematic structural diagram of an electronic device provided by an embodiment of the present application. The casing 10 may be provided with an earphone hole 105 , a microphone hole 106 , a speaker hole 108 , and a universal serial bus interface hole 107 on its periphery. The earphone hole 105 , the microphone hole 106 , the speaker hole 108 , and the USB interface hole 107 are all through holes.

The antenna radiator 20 is installed inside the casing 10 . The antenna radiator 20 is used for transmitting wireless signals to the outside, or receiving wireless signals sent by other electronic devices. The antenna radiator 20 may be, for example, a radio frequency antenna, a Bluetooth antenna, a wireless fidelity (WiFi) antenna, or the like.

In some embodiments, the antenna radiator 20 may be provided on the cover plate 11 , the antenna radiator 20 may be provided on the middle frame 12 , and the antenna radiator 20 may be provided on the back cover 13 . In some embodiments, the antenna radiator 20 is set on the middle frame 12 as an example for description, and the antenna radiator 20 is set on the middle frame 12 to form a middle frame assembly. That is, the middle frame assembly includes the middle frame 12 and the antenna radiator 20 .

Wherein, the antenna radiator 20 may be directly integrally formed with the middle frame 12 . Specifically, the middle frame 12 may include a metal substrate, such as a metal substrate made of magnesium alloy, and the antenna radiator 20 is also made of magnesium alloy, and the metal substrate antenna radiator 20 is injection-molded in the same process. The antenna radiator 20 may also be fixed on the middle frame 12 in a detachable fixing manner, for example, by screwing the antenna radiator to the middle frame 12 . It should be noted that the fixing method of the antenna radiator 20 and the middle frame 12 is not limited to this, and can also be limited and fixed by means of clip connection, plug connection, and glue sticking. Therefore, the antenna radiator is arranged at the peripheral position of the metal substrate, the middle frame can be integrally formed, the middle frame has continuity and integrity, and the strength is high, which can increase the strength of the middle frame.

In some embodiments, the antenna radiator 20 is disposed at the position of the third side portion 103 of the housing 10 , or the antenna radiator 20 is adjacent to the third side portion 103 of the housing 10 , or the antenna radiator 20 is close to The third side of the housing 10 . Also, the antenna radiator 20 is close to the second side portion 102 . Specifically, the antenna radiator 20 is located at a corner position between the third side portion 103 and the second side portion 102 .

It should be noted that the antenna radiator 20 may also be disposed in other positions, for example, please refer to FIG. 3 , which is another schematic structural diagram of the electronic device according to the embodiment of the present application. The difference between the electronic device shown in FIG. 3 and the electronic device shown in FIG. 1 is that the antenna radiator 20 is disposed at the position of the first side portion 101 of the housing 10 , and the antenna radiator 20 may be close to the fourth side portion 104 . Also close to the second side 102 is possible. It should be noted that, in some other embodiments, the antenna radiator 20 may also be disposed at the position of the second side portion 102 of the casing 10 or at the position of the fourth side portion 104 of the casing 10 , which is not repeated here. An example.

Wherein, the printed circuit board 30 is installed in the housing 10, the printed circuit board 30 can be the main board of the electronic device 1, and the printed circuit board 30 can be integrated with a motor, a microphone 62, a speaker 64, an earphone interface 61, One, two or more of functional components 60 such as a universal serial bus interface 63, a camera, a distance sensor, an ambient light sensor, a receiver, and a processor. The printed circuit board 30 can be integrated with a microphone 62 , a speaker 64 , an earphone interface 61 , and a universal serial bus interface 63 . The headphone jack 61 is arranged at the headphone hole 105 position, the microphone 62 is arranged at the microphone hole 106 position, the USB interface 63 is arranged at the USB interface hole 107 position, and the speaker 64 is arranged at the speaker hole 108 position.

In some embodiments, the printed circuit board 30 is fixed within the housing 10 . Specifically, the printed circuit board 30 can be screwed to the middle frame 12 by screws, or can be snap-fitted to the middle frame 12 by means of snaps. It should be noted that, the specific way of fixing the printed circuit board 30 to the middle frame 12 in the embodiment of the present application is not limited to this, and other ways, such as a way of co-fixing by a buckle and a screw, is also possible.

The battery 50 is installed in the housing 10 , and the battery 50 is electrically connected to the printed circuit board 30 to provide power to the electronic device 1 . The case 10 may serve as a battery cover for the battery 50 . The casing 10 covers the battery 50 to protect the battery 50 , specifically, the back cover covers the battery 50 to protect the battery 50 and reduce damage to the battery 50 due to collision, drop, etc. of the electronic device 1 .

Wherein, the display screen 40 is installed in the casing 10 , and at the same time, the display screen 40 is electrically connected to the printed circuit board 30 to form the display surface of the electronic device 1 . The display screen 40 includes a display area 111 and a non-display area 112 . The display area 111 may be used to display the screen of the electronic device 1 or for the user to perform touch manipulation or the like. The top area of the non-display area 112 is provided with openings for sound and light transmission, and the bottom of the non-display area 112 can be provided with functional components such as fingerprint modules and touch buttons. The cover plate 11 is mounted on the display screen 40 to cover the display screen 40 to form the same display area and non-display area as the display screen 40 . For details, please refer to the display area and non-display area of the display screen 40 .

It should be noted that the structure of the display screen 40 is not limited to this. For example, the display screen may be a full screen or a heterosexual screen. Specifically, please refer to FIG. 4 , which is another schematic structural diagram of the electronic device provided by the embodiment of the present application. The difference between the electronic device in FIG. 4 and the electronic device in FIG. 1 is that the non-display area is directly formed on the display screen 40, for example, the non-display area of the display screen 40 is set as a transparent structure or a through-hole structure, so that the light signal Through, or directly in the non-display area of the display screen 40 to open holes or gaps for light transmission, the front camera, distance sensor, ambient light sensor, etc. can be set in the non-display area, so that the front camera Photo, photoelectric sensor detection.

It should also be noted that, in some embodiments, the display screen 40 may also not include a non-display area, but may be arranged in a full-screen structure, and the distance sensor and the ambient light sensor may be arranged below the display screen.

In some embodiments, the antenna radiator 20 is disposed at the peripheral position of the housing 10 . It can be understood that during the process of installing the functional component 60 and the antenna radiator 20 on the casing 10 , crossover or overlap is likely to occur, which will additionally occupy the internal space of the electronic device 1 and increase the thickness of the electronic device 1 . Please refer to FIG. 5. FIG. 5 is a schematic structural diagram of a part of an electronic device provided by an embodiment of the present application. In some embodiments, the antenna radiator 20 is fixed on the casing 10 , and the antenna radiator 20 is provided with an escape space 29 , the escape space 29 penetrates the antenna radiator 20 , and specifically, the escape space 29 extends from the part of the casing 10 The antenna radiator 20 is penetrated toward the outside.

Therefore, in the embodiment of the present application, when the functional component 60 needs to be installed, the functional component 60 can be placed in the position of the avoidance space 29 . For example, please refer to FIG. 6 , which is another schematic structural diagram of an electronic device provided by an embodiment of the present application. This FIG. 6 shows the position where the functional component 60 is provided in the avoidance space 29 . Or the device is avoided through the avoidance space 29 ; or a signal is transmitted through the avoidance space 29 , such as transmission of an acoustic signal, an optical signal, and the like. Furthermore, the height of the intersecting or overlapping portion of the functional component 60 and the antenna radiator 20 during installation can be reduced, the space occupied by the functional component 60 and the antenna radiator 20 can be greatly reduced, and the electronic device 1 can be made thinner and lighter.

In some embodiments, please refer to FIG. 7 , which is a schematic structural diagram of an antenna radiator provided by an embodiment of the present application. The antenna radiator 20 is provided with an avoidance groove 21 , that is, the avoidance space 29 includes the avoidance groove 21 , and the avoidance groove 21 penetrates the antenna radiator 20 . Wherein, the escape groove 21 may be one or two or more. For example, please refer to FIG. 8 , which is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application. The difference between the antenna radiator shown in FIG. 8 and the antenna radiator shown in FIG. 7 is that the antenna radiator 20 shown in FIG. 8 includes a first escape groove 211 and a second escape groove 212 , that is, the escape groove 21 includes a first The avoidance groove 211 and the second avoidance groove 212 . It should be noted that the avoidance groove 21 may further include a third avoidance groove or more avoidance grooves. In some embodiments, the avoidance groove 21 may have a rectangular structure or an arc-shaped structure. It can be understood that the avoidance groove 21 can also be of other structures, for example, the avoidance groove 21 is of an irregular structure.

In some embodiments, please refer to FIG. 9 . FIG. 9 is another schematic structural diagram of an antenna radiator provided in an embodiment of the present application. The antenna radiator 20 is provided with an avoidance hole 28 , that is, the avoidance space 29 includes the avoidance hole 28 , the avoidance hole 28 penetrates the antenna radiator 20 . Wherein, the avoidance hole 28 is a through hole structure. Further, the avoidance hole 28 may be one or two or more. For example, please refer to FIG. 10 , which is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application. The difference between the antenna radiator shown in FIG. 10 and the antenna radiator shown in FIG. 9 is that the antenna radiator 20 shown in FIG. 10 includes a first avoidance hole 281 and a second avoidance hole 282 , that is, the avoidance hole 28 includes a first avoidance hole 281 The avoidance hole 281 and the second avoidance hole 282 . It should be noted that the avoidance hole 28 may further include a third avoidance hole or more avoidance holes. In some embodiments, the avoidance hole 28 may be a rectangular structure, or may be a circular structure, such as an oval structure. It can be understood that, the avoidance hole 28 may also have other structures, for example, the avoidance hole 28 is an irregular structure.

It should be noted that the structure of the avoidance space 29 in the embodiment of the present application is not limited to this. For example, the avoidance space 29 includes a groove structure and a through hole structure. Specifically, please refer to FIG. 11 , which is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application. The antenna radiator 20 includes an escape groove 21 and an escape hole 28 . That is, the escape space 29 includes the escape groove 21 and the escape hole 28 . The avoidance space 29 may include at least one avoidance groove 21 and at least one avoidance hole 28 at the same time. The avoidance hole and the avoidance groove can be referred to the above content, and will not be repeated here.

In some embodiments, the antenna radiator 20 is installed and fixed at the peripheral position of the housing 10 to form a housing assembly. Specifically, the antenna radiator 20 is installed and fixed at the peripheral position of the middle frame 12 to form a middle frame assembly. More specifically, please refer to FIG. 12 , which is a schematic structural diagram of a middle frame assembly according to an embodiment of the present application. The middle frame assembly 70 includes the middle frame 12 and the antenna radiator 20 .

The material of the antenna radiator 20 can be magnesium alloy. It should be noted that, for the antenna radiator, reference may be made to the above content, which will not be repeated here. The antenna radiator 20 is provided with an escape groove 21 . The avoidance space 29 in the embodiment of the present application is described by taking the avoidance groove 21 as an example.

The middle frame 12 may include a metal substrate 121 and a non-metallic substrate 122 that are fixedly connected to each other. The metal substrate 121 and the non-metallic substrate 122 are formed by injection molding to form an integral middle frame 12 structure. It should be noted that, for the middle frame 12, reference may be made to the above content, which is not repeated here.

The material of the metal substrate 121 can be magnesium alloy. Specifically, please refer to FIGS. 13 and 14. FIG. 13 is a schematic structural diagram of a fixed connection between a metal substrate and an antenna radiator provided by an embodiment of the present application, and FIG. 14 is a schematic diagram of a fixed connection between the metal substrate and the antenna radiator provided by the embodiment of the present application. Another schematic diagram of the structure. The metal substrate 121 may be provided with a receiving groove 1211, the receiving groove 1211 is directly formed on the surface of the metal substrate 121, and the receiving groove 1211 can receive the functional component 60, which can not only reduce the space occupied by the functional component 60, but also The assembly 60 acts as a limiter. The metal substrate 121 has a receiving bottom wall 1212 at the position of the receiving groove 1211 . When the functional component 60 is placed in the receiving groove 1211 , it is attached to the receiving bottom wall 1212 , and the receiving bottom wall 1212 plays a bearing role for the functional component 60 . .

In some embodiments, the antenna radiator 20 is disposed at a peripheral position of the metal substrate 121 . The antenna radiator 20 may be integrally formed with the metal substrate 121 , for example, the antenna radiator 20 and the metal substrate 121 are injection-molded in the same mold. The antenna radiator 20 is formed to extend outward from the periphery of the metal substrate 121 . It should be noted that, in some other embodiments, the antenna radiator 20 may also be fixedly connected to the metal substrate 121, such as welding, or other fixing methods, or other detachable fixing methods. A gap 1213 is formed between the antenna radiator 20 and the metal substrate 121 .

In some embodiments, the avoidance groove 21 penetrates the antenna radiator 20 from the position of the notch 1213 to the outer direction of the antenna radiator 20 .

The material of the non-metal substrate 122 may be plastic. After the metal substrate 121 is formed, the structure of the middle frame 12 may be formed by injection molding on the metal substrate 122 . Wherein, part of the non-metallic substrate 122 is filled to the position of the notch 1213, and the antenna radiator 20 and the metal substrate 121 are connected into an integral structure to increase the strength of each part.

In some embodiments, various functional components 60 , such as earphone jacks, receivers, microphones, etc., may be installed in the avoidance slot 21 or the avoidance hole 28 . In other words, various functional components 60 , such as an earphone jack, a receiver, a microphone, etc., can be avoided at the position of the avoidance groove 21 or the avoidance hole 28 . The embodiments of the present application are described below by taking the installation of an earphone jack at the position of the avoidance groove 21 as an example.

Specifically, please refer to FIG. 15 . FIG. 15 is a schematic structural diagram of the cooperation between a middle frame and an earphone jack according to an embodiment of the present application. The earphone jack 61 can be placed on the middle frame 12 and placed in the position of the avoidance groove 21 . More specifically, the earphone jack 61 is placed in the receiving groove 1211 of the metal substrate 121 and placed in the avoiding groove 21 . A part of the earphone jack 61 is placed in the receiving groove 1211 of the metal substrate 121 , and the other side of the earphone jack 61 is placed in the escape groove 21 . It should be noted that, in the embodiment of the present application, the earphone jack 61 may not be placed in the avoidance groove 21 , but only the avoidance groove can be used for avoidance.

In some embodiments, the avoidance groove 21 includes an avoidance bottom wall 22 and two avoidance side walls 23 , and the antenna radiator 20 is provided with a step 24 on the avoidance bottom wall 22 . In some embodiments, the step 24 includes a first step 241 and a second step 242, the first step 241 is adjacent to one of the two avoidance side walls 23, the second step 242 is adjacent to the other of the two avoidance side walls 23, The height of the first step 241 is the same as the height of the second step 242 . The first step 241 and the second step 242 jointly limit the headphone jack 61 , which has a better limiting effect on the headphone jack 61 . It should be noted that, in the embodiment of the present application, no steps or only one step may be provided, and the heights of the first step and the second step in the embodiment of the present application may also be different. The structure of the avoidance groove 21 in the embodiment of the present application is set according to the specific structure of the earphone jack 61 .

In some embodiments, the storage slot 1211 and the avoidance slot 21 communicate with each other, and the headphone jack 61 can be directly placed in the storage slot 1211 and the avoidance slot 21 . The storage bottom wall 1212 and the avoidance bottom wall 22 are on the same plane, so that the headphone jack 61 placed in the storage slot 1211 and the avoidance slot 21 can be placed stably, and the bearing and limiting effect of the headphone jack 61 is better.

Wherein, the metal substrate 121 can be directly obtained through technological processing, and can also be obtained through purchase.

In the processing process, the metal substrate 121 and the antenna radiator 20 of the integrated structure can usually be formed in one process. Here, the metal substrate 121 and the antenna radiator 20 of the integrated structure are defined as metal substrates. In addition, when purchasing, the metal substrate 121 and the antenna radiator 20 are generally provided integrally. Similarly, the metal substrate 121 and the antenna radiator 20 in an integrated structure are defined as metal substrates. Specifically, please refer to FIG. 16 and FIG. 17 , FIG. 16 is a schematic structural diagram of a metal substrate provided by an embodiment of the present application, and FIG. 17 is another structural schematic diagram of a metal substrate provided by an embodiment of the present application. The metal substrate 2 includes a metal substrate 121 made of magnesium alloy and an extension portion 20 made of magnesium alloy.

Wherein, the extension part 20 can be used as an antenna radiator to send and receive signals. For details of the extension portion 20, reference may be made to the above-mentioned antenna radiator, which will not be repeated here.

Wherein, the metal substrate 121 can refer to the above content, and details are not repeated here.

It should be noted that the structures of the frame assembly 70 and the metal substrate 2 in the embodiments of the present application are not limited to this, and the specific positions and structures of the antenna radiators are not limited to the above contents, and specific examples are as follows.

In some embodiments, please refer to FIG. 18 and FIG. 20 , FIG. 18 is another schematic structural diagram of the electronic device provided by the embodiment of the present application, and FIG. 20 is another structural schematic diagram of the electronic device provided by the embodiment of the present application. The antenna radiator 20 may be disposed in the middle of the third side portion 103 .

In some embodiments, please refer to FIG. 19 , which is another schematic structural diagram of an electronic device provided by an embodiment of the present application. The antenna radiator 20 may be disposed in the middle of the first side portion 101 .

In some embodiments, please refer to FIG. 21 , which is another schematic structural diagram of a middle frame assembly provided by an embodiment of the present application. The middle frame assembly 70 may include a metal substrate 121 , a non-metallic substrate 122 and an antenna radiator 20 . The metal substrate 121 and the non-metallic substrate 122 can refer to the above content, which will not be repeated here. The material of the antenna radiator 20 can be referred to the above content, which will not be repeated here.

Specifically, please refer to FIG. 22 . FIG. 22 is another schematic structural diagram of the cooperation between an antenna radiator and a metal substrate provided by an embodiment of the present application. The antenna radiator 20 may be formed by extending from the middle of the peripheral edge of the metal substrate 121 to the side of the metal substrate 121 . For example, the antenna radiator 20 shown in FIG. 21 extends from the middle of the periphery of the metal substrate 121 toward one of the side portions of the metal substrate 121 . The antenna radiator 20 is connected by a connecting portion 123 when extending from the middle portion to the outer portion of the peripheral edge of the metal substrate 121 . The connecting portion 123 , the antenna radiator 20 and the metal substrate 121 can be integrally formed with magnesium alloy material. It should be noted that the antenna radiator 20 extends from the middle of the peripheral edge of the metal substrate 121 to the side of the metal substrate 121. The peripheral center of the metal substrate 121 may be the center of one end of the metal substrate 121, or it may be offset to one side.

It should be noted that, in some other embodiments, the antenna radiator 20 may also extend from the middle of the periphery of the metal substrate 121 toward the other side of the metal substrate 121 . For details, please refer to FIG. 23 , which is an embodiment of the present application. Another structural schematic diagram of the cooperation between the antenna radiator and the metal substrate provided in the example.

It should also be noted that, in other embodiments, the antenna radiator 20 may also extend from the middle of the periphery of the metal substrate 121 toward the two sides of the metal substrate 121 . For details, please refer to FIG. 24 , which is an embodiment of the present application. Another structural schematic diagram of the cooperation between the antenna radiator and the metal substrate provided in the example. More specifically, please refer to FIG. 25. FIG. 25 is another schematic structural diagram of the cooperation between the antenna radiator and the metal substrate provided by the embodiment of the present application. A gap 1213 is formed between the antenna radiator 20 and the metal substrate 121 , the gap can be referred to the above content, and details are not repeated here. The antenna radiator 20 extends to two sides of the metal substrate 121 to form two parts, and the two parts can be arranged in equal lengths or unequal lengths, for example, one side is long and the other side is short. It should be noted that the specific structure of the antenna radiator 20 may be set according to the specific structure of the electronic device 1 .

Please refer to FIG. 26 . FIG. 26 is a schematic structural diagram of the cooperation between an antenna radiator and a connecting portion according to an embodiment of the present application. The connecting portion 123 may be connected to one side of the antenna radiator 20 , or may be connected to the middle or other positions of the antenna radiator 20 .

Please refer to FIG. 27 . FIG. 27 is another schematic structural diagram of the cooperation between the antenna radiator and the connecting portion according to the embodiment of the present application. The antenna radiator 20 may be provided with an avoidance space 29, and the avoidance space 29 may refer to the above content for details.

Please refer to FIG. 28 , FIG. 28 is another schematic structural diagram of a middle frame assembly provided by an embodiment of the present application. A through hole 124 may also be formed on the connecting portion 123 , and the through hole 124 may be used to install the functional component 60 .

Please refer to FIG. 29. FIG. 29 is another schematic structural diagram of the antenna radiator provided by the embodiment of the present application. The antenna radiator 20 may include a convex portion 25 extending outward from the surface of the antenna radiator 20 . The thickness of the antenna radiator 20 gradually becomes thinner from the middle of its surface to the positions on both sides thereof, or the thickness of the antenna radiator 20 gradually becomes thinner from the middle of its surface to the thickness of its edge positions, or the thickness of the antenna radiator 20 gradually becomes thinner. The thickness gradually becomes thicker from both sides of its surface to its middle. The protruding portion 25 can increase the strength of the antenna radiator 20 , reduce extrusion deformation of the antenna radiator 20 during injection molding of the non-metallic substrate 122 , and reduce damage during transportation, installation or impact. It should be noted that the convex portion 25 may also be close to one side of the antenna radiator 20 , for example, the thickness of the antenna radiator 20 gradually becomes thicker or thinner from one side of its surface to the other side.

In some embodiments, the convex portion 25 may be an arc-shaped structure or a polygonal structure. In some embodiments, the convex portion 25 is located on the side of the antenna radiator 20 away from the notch 1213 . Specifically, the convex portion 25 and the notch 1213 are located on two sides of the antenna radiator 20 respectively.

It should be noted that, in some other embodiments, please refer to FIG. 30 , which is another schematic structural diagram of an antenna radiator provided by an embodiment of the present application. The antenna radiator 20 may also include a concave portion 26 , the concave portion 26 is formed inwardly from the middle of the surface of the antenna radiator 20 . The thickness of the antenna radiator 20 gradually becomes thicker from the middle part of the surface to the positions on both sides thereof, or the thickness of the antenna radiator 20 gradually becomes thinner from the two sides to the middle part thereof. The concave portion 25 can increase the connection area between the antenna radiator 20 and the non-metallic substrate 122, increase the connection strength of the antenna radiator 20 and the non-metallic substrate 122, and prevent separation.

In some embodiments, the concave portion 26 may be an arc-shaped structure or a polygonal structure. In some embodiments, the recess 26 is adjacent to the notch 1213 .

Please refer to FIG. 31 . FIG. 31 is another schematic structural diagram of the metal substrate provided by the embodiment of the application. The antenna radiator 20 in the metal substrate 2 extends from the middle of the peripheral edge of the metal substrate 121 toward the side of the metal substrate 121 . , or in other words, the extension portion 20 in the metal substrate 2 is formed to extend from the middle portion of the peripheral edge of the metal substrate 121 toward the side portion of the metal substrate 121 . For details, please refer to the above content, which will not be repeated here.

In some embodiments, referring to FIG. 32 , FIG. 32 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.

The electronic device 1 includes signal sources 41 , 42 , 43 , 44 and 45 . Each signal source is used to generate a wireless signal. For example, the signal source 41 is used to generate a Bluetooth signal, the signal source 42 is used to generate a Wireless-Fidelity (Wi-Fi) signal, the signal source 43 is used to generate a high frequency radio frequency signal, and the signal source 44 is used to generate an intermediate frequency radio frequency signal, the signal source 45 is used to generate the low frequency radio frequency signal.

The electronic device 1 also includes matching circuits 31 , 32 , 33 , 34 , 35 . The matching circuit 31 is connected to the signal source 41 , the matching circuit 32 is connected to the signal source 42 , the matching circuit 33 is connected to the signal source 43 , the matching circuit 34 is connected to the signal source 44 , and the matching circuit 35 is connected to the signal source 45 . Each matching circuit may include electronic components such as power amplifiers and filters. Each matching circuit is used to perform power amplification, filtering and other processing on the wireless signal generated by the connected signal source.

The electronic device 1 also includes a combiner 91 . The combiner 91 is connected to the matching circuits 34 and 35 . Wherein, the combiner 91 is used to perform carrier aggregation on the uplink radio frequency signal or divide the frequency of the downlink radio frequency signal.

The electronic device 1 further includes antenna radiators 51 , 52 , 53 and an antenna radiator 54 . The antenna radiators 51 , 52 , 53 , and 54 are respectively connected to the matching circuits 31 , 32 , 33 and the combiner 91 . The antenna radiators 51 , 52 , and 53 may be antenna radiators disposed inside the electronic device 1 . For example, the antenna radiators 51 , 52 and 53 may be antenna radiators provided on the circuit board of the electronic device 1 . The antenna radiator 54 may be an extension provided on the middle frame of the electronic device 1 . For example, the antenna radiator 54 may be a magnesium alloy extension on the middle frame of the electronic device 1 .

Each antenna radiator is used to send and receive radio frequency signals. For example, the antenna radiator 51 is used to send and receive Bluetooth signals, the antenna radiator 52 is used to send and receive Wi-Fi signals, the antenna radiator 53 is used to send and receive high frequency radio frequency signals, and the antenna radiator 54 is used to send and receive medium and low frequency radio frequency signals. Wherein, the medium and low frequency radio frequency signal is a carrier aggregation signal of the intermediate frequency radio frequency signal and the low frequency radio frequency signal.

The electronic device 1 also includes switches 81 , 82 , 83 , 84 . The switches 81 , 82 , 83 and 84 are respectively connected to the antenna radiators 51 , 52 , 53 and 54 . The switches 81, 82, 83, 84 may be single-pole single-throw switches.

The electronic device 1 also includes ground points 71 , 72 , 73 , 74 . The ground points 71 , 72 , 73 and 74 are respectively connected to the switches 81 , 82 , 83 and 84 . The grounding points 71 , 72 , 73 , and 74 are used to ground the antenna radiators 51 , 52 , 53 , and 54 , respectively. The switches 81 , 82 , 83 , and 84 are used to connect or disconnect the grounding points 71 , 72 , 73 , and 74 , respectively.

It should be noted that, for the antenna radiator 54 in the figure, reference may be made to the above-mentioned antenna radiator 20, and details are not described herein again.

Those skilled in the art can understand that the structures of the electronic device 1 shown in FIGS. 1 to 4 do not constitute a limitation on the electronic device 1 . The electronic device 1 may comprise more or fewer components than shown, or combine certain components, or a different arrangement of components. The electronic device 1 may further include a memory, a Bluetooth module, and the like, which will not be repeated here.

The metal substrate, the middle frame assembly and the electronic equipment provided by the embodiments of the present application have been introduced in detail above. The principles and implementations of the present application are described with specific examples in this paper. The descriptions of the above embodiments are only used to help understanding. this application. At the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific embodiments and application scope. To sum up, the content of this specification should not be construed as a limitation to the present application.

Claims (11)

1. A middle frame assembly is characterized by comprising a middle frame and an antenna radiating body, wherein the middle frame comprises a metal substrate and a non-metal substrate, the antenna radiating body is arranged on the periphery of the metal substrate, a gap is formed between the antenna radiating body and the metal substrate, the non-metal substrate is arranged in the gap and is fixedly connected with the antenna radiating body and the metal substrate respectively, the antenna radiating body is provided with an avoiding groove, the metal substrate is provided with a containing groove, the containing groove is communicated with the avoiding groove, the avoiding groove and the containing groove are used for placing an earphone interface, a receiver or a microphone together, the antenna radiating body comprises an avoiding bottom wall and two avoiding side walls, the avoiding bottom wall is provided with a step, the metal substrate comprises an containing bottom wall, the containing bottom wall is positioned at the containing groove, the accommodating bottom wall and the avoiding bottom wall are on the same plane, and the avoiding side wall, the step and the accommodating bottom wall are used for limiting an earphone interface, a receiver or a microphone which are arranged in the accommodating groove and the avoiding groove;

the antenna radiator includes a convex portion formed to extend outward from a surface of the antenna radiator, and a thickness of the antenna radiator is gradually thinner from the convex portion toward an edge of the antenna radiator.

2. The center frame assembly of claim 1, wherein the boss is an arcuate structure.

3. The middle frame assembly according to claim 1, wherein the antenna radiator and the metal substrate are integrally formed, and both the antenna radiator and the metal substrate are made of magnesium alloy.

4. A middle frame assembly is characterized by comprising a middle frame and an antenna radiating body, wherein the middle frame comprises a metal substrate and a non-metal substrate, the antenna radiating body is arranged on the periphery of the metal substrate, a gap is formed between the antenna radiating body and the metal substrate, the non-metal substrate is arranged in the gap and is fixedly connected with the antenna radiating body and the metal substrate respectively, the antenna radiating body is provided with an avoiding groove, the metal substrate is provided with a containing groove, the containing groove is communicated with the avoiding groove, the avoiding groove and the containing groove are used for placing an earphone interface, a receiver or a microphone together, the antenna radiating body comprises an avoiding bottom wall and two avoiding side walls, the avoiding bottom wall is provided with a step, the metal substrate comprises an containing bottom wall, the containing bottom wall is positioned at the containing groove, the accommodating bottom wall and the avoiding bottom wall are on the same plane, and the avoiding side wall, the step and the accommodating bottom wall are used for limiting an earphone interface, a receiver or a microphone which are arranged in the accommodating groove and the avoiding groove;

the antenna radiator includes a recess formed by being depressed inward from a surface of the antenna radiator, and a thickness of the antenna radiator becomes gradually thicker from the recess to an edge of the antenna radiator.

5. The middle frame assembly according to claim 4, wherein said recess is an arcuate structure.

6. The middle frame assembly according to claim 4, wherein the antenna radiator and the metal substrate are integrally formed, and both the antenna radiator and the metal substrate are made of magnesium alloy.

7. The metal substrate is characterized by comprising a metal substrate and an extension part, wherein the extension part is formed by extending the periphery of the metal substrate outwards, a notch is formed between the extension part and the metal substrate, an avoiding groove is formed in the extension part, the metal substrate is provided with a containing groove, the containing groove is communicated with the avoiding groove, the avoiding groove is used for placing an earphone interface, a receiver or a microphone together with the containing groove, the extension part comprises an avoiding bottom wall and two avoiding side walls, the avoiding bottom wall is provided with a step, the metal substrate comprises an containing bottom wall, the containing bottom wall is located at the containing groove position, the containing bottom wall is located on the same plane, the avoiding side walls are located on the step, and the containing bottom wall is used for limiting the earphone interface, the receiver and the avoiding groove, A receiver or a microphone;

the extension part comprises a convex part formed by extending outwards from the surface of the extension part, and the thickness of the extension part is gradually thinner from the convex part to the edge of the extension part.

8. The metal substrate according to claim 7, wherein the protrusion and the notch are located on both sides of the extension portion, respectively.

9. The metal substrate is characterized by comprising a metal substrate and an extension part, wherein the extension part is formed by extending the periphery of the metal substrate outwards, a notch is formed between the extension part and the metal substrate, an avoiding groove is formed in the extension part, the metal substrate is provided with a containing groove, the containing groove is communicated with the avoiding groove, the avoiding groove is used for placing an earphone interface, a receiver or a microphone together with the containing groove, the extension part comprises an avoiding bottom wall and two avoiding side walls, the avoiding bottom wall is provided with a step, the metal substrate comprises an containing bottom wall, the containing bottom wall is located at the containing groove position, the containing bottom wall is located on the same plane, the avoiding side walls are located on the step, and the containing bottom wall is used for limiting the earphone interface, the receiver and the avoiding groove, A receiver or a microphone;

the extension part includes a recess formed to be depressed inward from a surface thereof, and a thickness of the extension part becomes thicker gradually from the recess to an edge of the extension part.

10. The metal substrate according to claim 9, wherein the recess and the indentation are adjacent.

11. An electronic device, characterized in that the electronic device comprises a middle frame assembly, wherein the middle frame assembly is the middle frame assembly according to any one of claims 1 to 6.

Images