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CN115225746B - Electronic equipment - Google Patents

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Publication number
CN115225746B
CN115225746B CN202211148894.XA CN202211148894A CN115225746B CN 115225746 B CN115225746 B CN 115225746B CN 202211148894 A CN202211148894 A CN 202211148894A CN 115225746 B CN115225746 B CN 115225746B
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groove
sound
electronic device
hole
bracket
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CN115225746A (en
Inventor
吴江
王传果
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Honor Device Co Ltd
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Honor Device Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0277Details of the structure or mounting of specific components for a printed circuit board assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279Improving the user comfort or ergonomics
    • H04M1/0283Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/03Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本申请提供一种电子设备,其包括中框、电路板、支架和第一扬声器单元,所述电路板包括安装面,所述支架包括避让槽;所述避让槽沿着所述支架厚度方向向所述支架内凹陷,所述第一扬声器单元定位于所述安装面上并与所述电路板电性连接,所述电路板和所述支架层叠且装于所述中框,在所述电子设备厚度方向上,所述第一扬声器单元收容于所述避让槽内。

Figure 202211148894

The present application provides an electronic device, which includes a middle frame, a circuit board, a bracket, and a first speaker unit. The circuit board includes a mounting surface, and the bracket includes an avoidance groove; The bracket is recessed, the first speaker unit is positioned on the mounting surface and electrically connected to the circuit board, the circuit board and the bracket are stacked and mounted on the middle frame, and the electronic In the thickness direction of the device, the first speaker unit is accommodated in the escape groove.

Figure 202211148894

Description

电子设备Electronic equipment

技术领域technical field

本申请涉及通讯设备技术领域,尤其涉及一种电子设备。The present application relates to the technical field of communication equipment, and in particular to an electronic equipment.

背景技术Background technique

随着科学技术的不断发展,手机等电子设备被广泛地应用于人们的日常生活和工作中,已经成为人们必不可少的日常用品。目前的电子设备中,扬声器模组和摄像头模组占据了手机内部大量空间,特别是扬声器模组在厚度上需要一定空间,需要在电路板上开设通槽避让,这样就会占用电路板的空间,影响电路板的器件布局和使用;如果避开电路板,就会增加电子设备整体厚度。With the continuous development of science and technology, electronic devices such as mobile phones are widely used in people's daily life and work, and have become indispensable daily necessities for people. In the current electronic equipment, the speaker module and the camera module occupy a lot of space inside the mobile phone, especially the speaker module needs a certain space in thickness, and it is necessary to open a slot on the circuit board to avoid it, which will occupy the space of the circuit board , affecting the device layout and use of the circuit board; if the circuit board is avoided, the overall thickness of the electronic device will be increased.

发明内容Contents of the invention

本申请提供一种电子设备,实现减少扬声器模组在电路板上的占用空间,且避免增加电子设备厚度。The present application provides an electronic device, which reduces the occupied space of the speaker module on the circuit board and avoids increasing the thickness of the electronic device.

本申请一实施例提供的电子设备,包括中框、电路板、支架和第一扬声器单元,所述电路板包括安装面,所述支架包括避让槽;所述避让槽沿着所述支架厚度方向向所述支架内凹陷,所述第一扬声器单元定位于所述安装面上并与所述电路板电性连接,所述电路板和所述支架层叠且装于所述中框,在所述电子设备厚度方向上,所述第一扬声器单元收容于所述避让槽内。An electronic device provided by an embodiment of the present application includes a middle frame, a circuit board, a bracket, and a first speaker unit, the circuit board includes a mounting surface, and the bracket includes an avoidance groove; the avoidance groove is along the thickness direction of the bracket recessed into the bracket, the first speaker unit is positioned on the mounting surface and electrically connected to the circuit board, the circuit board and the bracket are stacked and mounted on the middle frame, and the In the thickness direction of the electronic equipment, the first speaker unit is accommodated in the escape groove.

本申请实施例电子设备中,将第一扬声器单元安装于电路板的表面,通过在支架上设置避让槽来为第一扬声器单元提供厚度方向的空间,可以避免在电路板上开孔,增加电路板使用面积,而且利用摄像头模组的装饰件空间收容支架,可以避免增加电子设备的厚度空间。In the electronic device of the embodiment of the present application, the first speaker unit is installed on the surface of the circuit board, and the first speaker unit is provided with a space in the thickness direction by providing an escape groove on the bracket, which can avoid opening holes on the circuit board and increase the number of circuits. The usage area of the board can be reduced, and the bracket can be accommodated by the decorative part space of the camera module, which can avoid increasing the thickness space of the electronic device.

一种实施例中,所述电子设备包括第二扬声器单元和出音缝,所述中框包括安装槽,所述电路板包括避让孔,所述避让孔沿所述电路板的厚度方向贯穿所述电路板,所述安装槽沿着所述中框厚度方向贯穿所述中框,所述第二扬声器单元穿设于所述避让孔,且覆盖所述安装槽的开口,所述安装槽形成所述第二扬声器单元的前音腔,所述出音缝连通所述第二扬声器单元的前音腔与所述电子设备的外部。In one embodiment, the electronic device includes a second speaker unit and a sound output slot, the middle frame includes a mounting slot, and the circuit board includes an avoidance hole, and the avoidance hole penetrates through the circuit board along the thickness direction of the circuit board. In the above circuit board, the installation groove runs through the middle frame along the thickness direction of the middle frame, the second speaker unit penetrates the escape hole and covers the opening of the installation groove, and the installation groove forms In the front sound chamber of the second speaker unit, the sound outlet connects the front sound chamber of the second speaker unit with the outside of the electronic device.

一种实施例中,所述第二扬声器单元的体积小于所述第一扬声器单元的体积。在外放场景,由于所述第二扬声器单元的体积小,其前音腔体积夜宵,第二扬声器可作为高音单元使用,第一扬声器作为低音单元,提升立体声效果。In an embodiment, the volume of the second speaker unit is smaller than the volume of the first speaker unit. In the external playback scene, due to the small size of the second speaker unit and the volume of the front sound cavity, the second speaker can be used as a tweeter, and the first speaker can be used as a bass unit to enhance the stereo effect.

一种实施例中,所述第一扬声器单元为高音单元或全频单元,所述第二扬声器单元为全频单元。本实施例中,具有多个扬声器单元,可以实现多音频效果,而且所述出音缝可作为通话时出音的缝隙,由于人耳无法与出音缝完全贴合密封,因此出音缝的声音会向外扩散,变为漏音,影响通话隐私性,对于此问题,第一扬声器单元通过扬声孔发出与出音缝相位相反的声波,以抵消出音缝的漏音,提升通话隐私性。In one embodiment, the first speaker unit is a tweeter unit or a full-range unit, and the second speaker unit is a full-range unit. In this embodiment, there are a plurality of speaker units, which can realize multi-audio effects, and the sound output gap can be used as a gap for sound output during a call. Since the human ear cannot completely fit and seal the sound output gap, the sound output gap The sound will spread outward and become sound leakage, which will affect the privacy of the call. For this problem, the first speaker unit emits sound waves that are opposite in phase to the sound slot through the speaker hole to offset the sound leakage of the sound slot and improve call privacy sex.

一种实施例中,所述中框设有端部边框和设于所述端部边框的扬声孔,所述避让槽包括槽底壁,所述槽底壁上凹陷有功能槽,所述第一扬声器单元覆盖所述功能槽,以使所述功能槽形成所述第一扬声器的前音腔,所述扬声孔连通所述第一扬声器单元的前音腔和所述中框的外部。In one embodiment, the middle frame is provided with an end frame and a speaker hole provided on the end frame, the avoidance groove includes a groove bottom wall, and a functional groove is recessed on the groove bottom wall, and the The first speaker unit covers the functional groove, so that the functional groove forms the front sound cavity of the first speaker, and the sound hole communicates with the front sound cavity of the first speaker unit and the outside of the middle frame .

一种实施例中,所述中框包括凸块,所述凸块上设有连通槽,所述连通槽沿着所述中框厚度方向延伸,所述连通槽与所述扬声孔连通,所述支架包括通音孔,所述通音孔连通所述第一扬声器单元的前音腔和所述连通槽。本实施例结构简单便于制作,第一扬声器单元通过所述通音孔、连通槽及扬声孔将声音传递到电子设备外部。In one embodiment, the middle frame includes a protrusion, the protrusion is provided with a communication groove, the communication groove extends along the thickness direction of the middle frame, the communication groove communicates with the speaker hole, The bracket includes a sound hole, and the sound hole communicates with the front sound cavity of the first speaker unit and the communication groove. The structure of this embodiment is simple and easy to manufacture. The first speaker unit transmits the sound to the outside of the electronic device through the sound hole, the communication groove and the sound hole.

一种实施例中,所述支架包括支架本体和凸台,所述支架本体包括第一面和与所述第一面背向设置的第二面,所述凸台位于所述第二面,所述避让槽凹设于所述第一面;In one embodiment, the bracket includes a bracket body and a boss, the bracket body includes a first surface and a second surface opposite to the first surface, the boss is located on the second surface, The avoidance groove is recessed on the first surface;

所述第一面上还凸设有安装凸起,所述通音孔包括依次连通的第一音孔、第二音孔和第三音孔,所述第一音孔沿着所述支架长度方向贯穿所述功能槽的槽侧壁,所述第二音孔设于所述凸台和所述安装凸起内部并沿着所述支架厚度方向延伸,所述第三音孔贯穿所述安装凸起,所述凸块与所述安装凸起对接,所述第三音孔与所述连通槽相对并连通。所述支架利用自身厚度和述安装凸起设置通音孔,有效利用部分结构,可以节省支架面积。There is also a mounting protrusion protruding from the first surface, and the sound hole includes a first sound hole, a second sound hole and a third sound hole connected in sequence, and the first sound hole is along the length of the bracket The direction runs through the groove side wall of the functional groove, the second sound hole is arranged inside the boss and the installation protrusion and extends along the thickness direction of the bracket, and the third sound hole passes through the installation The protrusion is in contact with the installation protrusion, and the third sound hole is opposite to and communicated with the communication groove. The bracket utilizes its own thickness and the mounting protrusions to set sound holes, effectively utilizing part of the structure, and saving the area of the bracket.

一种实施例中,所述安装凸起一端沿着所述支架宽度方向延伸有延伸部分,所述延伸部分位于所述安装凸起远离所述避让槽的一端,所述第三音孔由所述安装凸起端部延伸至所述延伸部分,且沿着所述延伸部分长度方向延伸;In one embodiment, one end of the installation protrusion has an extension part extending along the width direction of the bracket, the extension part is located at the end of the installation protrusion away from the avoidance groove, and the third sound hole is formed by the The end of the installation protrusion extends to the extension part and extends along the length direction of the extension part;

所述连通槽由所述凸块的上表面向所述凸块内凹陷,所述连通槽的开口位于所述凸块的表面,且所述连通槽沿着所述中框宽度方向延伸,所述扬声孔贯穿所述连通槽的一个槽侧壁。The communication groove is recessed from the upper surface of the protrusion to the inside of the protrusion, the opening of the communication groove is located on the surface of the protrusion, and the communication groove extends along the width direction of the middle frame, so The sound hole runs through a side wall of the communicating groove.

一种实施例中,所述凸块包括第一斜面,所述第一斜面背向所述端部边框倾斜设置,所述扬声孔贯穿连通槽的槽底壁并与所述连通槽连通;In one embodiment, the protrusion includes a first slope, the first slope is inclined away from the end frame, and the sound hole passes through the bottom wall of the communication groove and communicates with the communication groove;

所述安装凸起设有延伸部分,所述延伸部分位于所述安装凸起远离所述避让槽的一端,所述延伸部分包括第二斜面,所述第二斜面背向所述安装凸起且相较于所述支架的第一面倾斜,所述第三音孔贯穿所述第二斜面,所述第一斜面和所述第二斜面相对接,所述第三音孔与所述连通槽相对并连通。本实施例中,通过在所述凸块设置第一斜面,来减小凸块的体积,避免电路板上的缺口面积过大,节省电路板的面积。The installation protrusion is provided with an extension part, the extension part is located at the end of the installation protrusion away from the escape groove, the extension part includes a second slope, the second slope faces away from the installation protrusion and Compared with the first surface of the bracket, the third sound hole runs through the second slope, the first slope and the second slope are in contact, and the third sound hole is connected to the communication groove relative and connected. In this embodiment, the volume of the bump is reduced by providing the first slope on the bump, so as to prevent the area of the gap on the circuit board from being too large and save the area of the circuit board.

一种实施例中,所述中框包括中板和与所述中板连接的所述端部边框,所述中板包括第一表面和与所述第一表面背向设置的第二表面,所述凸块凸设于所述中板的第一表面并与所述端部边框连接;In one embodiment, the middle frame includes a middle plate and the end frame connected to the middle plate, the middle plate includes a first surface and a second surface opposite to the first surface, The bump is protruded on the first surface of the middle plate and connected with the end frame;

所述连通槽包括第一连通槽和与所述第一连通槽连通的第二连通槽,所述第一连通槽的一个开口位于所述凸块背向所述中板的表面,所述第一连通槽的另一个开口位于所述第二连通槽的一个槽侧壁上;第二连通槽的开口位于所述中板的第二表面。The communication groove includes a first communication groove and a second communication groove connected with the first communication groove, an opening of the first communication groove is located on the surface of the protrusion facing away from the middle plate, the first communication groove The other opening of a communication groove is located on a groove side wall of the second communication groove; the opening of the second communication groove is located on the second surface of the middle plate.

一种实施例中,所述第一连通槽包括第一槽侧壁,所述第一槽侧壁相较于所述第一连通槽的开口倾斜,部分所述扬声孔贯穿第一槽侧壁;In one embodiment, the first communication groove includes a first groove side wall, the first groove side wall is inclined compared with the opening of the first communication groove, and part of the sound hole runs through the first groove side wall;

所述第二连通槽由所述第二表面向所述中板内凹陷形成,所述第二连通槽包括槽底壁和子槽,所述子槽由所述槽底壁向中板内部凹陷形成,所述子槽包括两个倾斜侧壁和连接两个所述倾斜侧壁的底壁,另一部分所述扬声孔贯穿所述底壁,所述第一连通槽的另一个开口位于一个所述倾斜侧壁上并朝向所述扬声孔。本实施例中,通过在中框的两个面来设置连通槽,即,设置异形连通槽,可以减小凸块的体积,进而减小电路板上为凸块开设的缺口的面积,进而节省电路板的面积。The second communication groove is formed by indenting the second surface into the middle plate, the second communication groove includes a groove bottom wall and a sub-groove, and the sub-groove is formed by indenting the groove bottom wall into the middle plate , the sub-trough includes two inclined side walls and a bottom wall connecting the two inclined side walls, another part of the sound hole runs through the bottom wall, and the other opening of the first communication slot is located at one of the on the sloped side wall and towards the sound hole. In this embodiment, by setting the communication grooves on the two faces of the middle frame, that is, setting the special-shaped communication grooves, the volume of the bump can be reduced, thereby reducing the area of the gap opened for the bump on the circuit board, thereby saving The area of the circuit board.

一种实施例中,所述第三音孔的一个开口位于所述第二斜面上,所述第三音孔包括孔壁,所述孔壁的延伸方向与所述第三音孔的延伸方向相交,所述第二音孔的一个开口贯穿所述孔壁与所述第三音孔连通。本实施例中的第三音孔横截面积大于第二音孔的横截面积,第三音孔用于与连通槽连通,实现与扬声孔连通,可以提高发声音效。In one embodiment, an opening of the third sound hole is located on the second slope, the third sound hole includes a hole wall, and the extension direction of the hole wall is the same as the extension direction of the third sound hole. An opening of the second sound hole passes through the hole wall and communicates with the third sound hole. In this embodiment, the cross-sectional area of the third sound hole is greater than that of the second sound hole, and the third sound hole is used to communicate with the communication groove to realize communication with the speaker hole, which can improve the sound effect.

一种实施例中,所述电子设备包括摄像头模组和装饰件,所述装饰件包括收容槽,所述电路板还包括安装避让孔,所述安装避让孔沿着所述电路板厚度方向贯穿所述电路板,所述安装避让孔与所述第一扬声器单元间隔设置;In one embodiment, the electronic device includes a camera module and a decorative part, the decorative part includes a receiving groove, and the circuit board further includes an installation avoidance hole, and the installation avoidance hole runs through the circuit board along the thickness direction On the circuit board, the installation avoidance hole is spaced apart from the first speaker unit;

所述摄像头模组穿设所述安装避让孔,所述装饰件装于中框上,所述摄像头模组和所述支架的凸块收容于所述收容槽内。本实施例中,利用收容摄像头模组的装饰件空间来容纳收容第一扬声器单元的支架,避免增加电子设备的厚度。The camera module passes through the installation avoidance hole, the decorative part is installed on the middle frame, and the camera module and the protrusion of the bracket are accommodated in the receiving groove. In this embodiment, the space of the decorative part for accommodating the camera module is utilized to accommodate the bracket accommodating the first speaker unit, so as to avoid increasing the thickness of the electronic device.

一种实施例中,所述电子设备包括屏幕,所述中框包括中板、与中框连接的端部边框和出音槽,所述中板包括第一表面和与所述第一表面背向设置的第二表面,所述出音槽凹设于所述第二表面,所述出音槽包括凹设于所述端部边框的内侧面的缝隙和与所述安装槽连通的连接区,所述屏幕装于所述第二表面并覆盖所述连接区,所述屏幕与所述缝隙形成所述出音缝。出音缝设于显示屏的一侧便于使用者听取声音。In one embodiment, the electronic device includes a screen, the middle frame includes a middle plate, an end frame connected to the middle frame, and a sound outlet groove, the middle plate includes a first surface and a back surface connected to the first surface. facing the second surface, the sound outlet groove is recessed on the second surface, and the sound outlet groove includes a gap recessed on the inner surface of the end frame and a connection area communicated with the installation groove , the screen is installed on the second surface and covers the connection area, and the screen and the gap form the sound outlet gap. The sound output slot is arranged on one side of the display screen so that the user can listen to the sound.

附图说明Description of drawings

为了更清楚地说明本申请实施例的技术方案,下面将对本申请实施例所需要使用的附图进行说明。In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will describe the drawings required for the embodiments of the present application.

图1是本申请实施例提供的电子设备的结构示意图;FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

图2是图1所示电子设备在另一个角度下的结构示意图;Fig. 2 is a schematic structural view of the electronic device shown in Fig. 1 at another angle;

图3是图2所示电子设备的一个角度分解结构示意图;Fig. 3 is a schematic diagram of an angle decomposition structure of the electronic device shown in Fig. 2;

图4是图1所示电子设备的一个角度分解结构示意图;Fig. 4 is a schematic diagram of an angle decomposition structure of the electronic device shown in Fig. 1;

图5是图3所示电子设备的中框的结构示意图;Fig. 5 is a schematic structural diagram of a middle frame of the electronic device shown in Fig. 3;

图6是图4所示中框在另一个角度下的结构示意图;Fig. 6 is a structural schematic view of the middle frame shown in Fig. 4 at another angle;

图7是图5所示的中框的一个角度的截面示意图;Fig. 7 is a schematic cross-sectional view of an angle of the middle frame shown in Fig. 5;

图8是图6所示的中的一个角度的截面示意图;Fig. 8 is a schematic cross-sectional view of an angle shown in Fig. 6;

图9是图3所示电子设备中电路板的结构示意图;Fig. 9 is a schematic structural view of the circuit board in the electronic device shown in Fig. 3;

图10 是图3所示电子设备部分结构组装示意图;Fig. 10 is a schematic diagram of the partial structure assembly of the electronic device shown in Fig. 3;

图11是图3所示电子设备中支架的结构示意图;Fig. 11 is a schematic structural view of the bracket in the electronic device shown in Fig. 3;

图12是图11所示支架在另一个角度下的结构示意图;Fig. 12 is a schematic structural view of the bracket shown in Fig. 11 at another angle;

图13是图12所示支架的平面结构示意图;Fig. 13 is a schematic plan view of the bracket shown in Fig. 12;

图14是图2所示的电子设备的一个角度的部分结构剖视图;Fig. 14 is a partial structural cross-sectional view of an angle of the electronic device shown in Fig. 2;

图15是图2所示的电子设备的另一个角度的部分结构剖视图;Fig. 15 is a partial structural cross-sectional view from another angle of the electronic device shown in Fig. 2;

图16是图1所示电子设备一角度的剖面结构示意图;Fig. 16 is a schematic cross-sectional structure diagram of an angle of the electronic device shown in Fig. 1;

图17是图1所示电子设备另一角度的剖面结构示意图;Fig. 17 is a schematic cross-sectional structure diagram of another angle of the electronic device shown in Fig. 1;

图18是本申请第二实施例提供的电子设备的分解结构示意图;FIG. 18 is a schematic diagram of an exploded structure of an electronic device provided in a second embodiment of the present application;

图19是图18所示电子设备的支架的另一个角度下的结构示意图;Fig. 19 is a schematic structural view of the bracket of the electronic device shown in Fig. 18 at another angle;

图20是本申请第二实施例提供的电子设备部分结构组装示意图;Fig. 20 is a schematic diagram of the partial structure assembly of the electronic device provided by the second embodiment of the present application;

图21是图17所示的电子设备的组装后的截面示意图;FIG. 21 is a schematic cross-sectional view of the assembled electronic device shown in FIG. 17;

图22是本申请第三实施例提供的电子设备的分解结构示意图;Fig. 22 is a schematic diagram of an exploded structure of an electronic device provided in a third embodiment of the present application;

图23是图22所示电子设备的支架的一个角度下的结构示意图;FIG. 23 is a schematic structural view of the bracket of the electronic device shown in FIG. 22 at an angle;

图24是图22所示电子设备的支架的另一个角度下的结构示意图;FIG. 24 is a schematic structural view of the bracket of the electronic device shown in FIG. 22 at another angle;

图25是本申请第三实施例提供的电子设备部分结构组装示意图;Fig. 25 is a schematic diagram of the partial structure assembly of the electronic device provided by the third embodiment of the present application;

图26是图25所示的电子设备的组装后的一角度的截面示意图。FIG. 26 is a schematic cross-sectional view from an angle after assembly of the electronic device shown in FIG. 25 .

具体实施方式Detailed ways

下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

请参阅图1至图2,图1是本申请实施例提供的电子设备1000的结构示意图,图2是图1所示电子设备1000在另一个角度下的结构示意图。Please refer to FIG. 1 to FIG. 2 . FIG. 1 is a schematic structural diagram of an electronic device 1000 provided by an embodiment of the present application, and FIG. 2 is a schematic structural diagram of the electronic device 1000 shown in FIG. 1 at another angle.

电子设备1000可以是手机、平板电脑、笔记本电脑、车机、智能手表、智能手环、POS机(point of sales terminal,销售点终端)等电子产品。本申请实施例以电子设备1000是手机为例进行说明。其中,为了便于描述,定义电子设备1000的宽度方向为X轴方向,电子设备1000的长度方向为Y轴方向,电子设备1000的厚度方向为Z轴方向,X轴方向、Y轴方向和Z轴方向两两相互垂直。需要说明的是,本申请中涉及的“顶”、“底”、“上”、“下”、“左”和“右”等方位用词,是参考附图1所示的方位进行的描述,以朝向Y轴正方向为“顶”,以朝向Y轴负方向为“底”,以朝向Z轴正方向为“上”,以朝向Z轴负方向为“下”,以朝向X轴正方向为“右”,以朝向X轴负方向为“左”,其并不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。The electronic device 1000 may be an electronic product such as a mobile phone, a tablet computer, a notebook computer, a car machine, a smart watch, a smart bracelet, a POS machine (point of sales terminal, point of sale terminal), and the like. The embodiment of the present application is described by taking the electronic device 1000 as a mobile phone as an example. Wherein, for the convenience of description, it is defined that the width direction of the electronic device 1000 is the X-axis direction, the length direction of the electronic device 1000 is the Y-axis direction, the thickness direction of the electronic device 1000 is the Z-axis direction, and the X-axis direction, the Y-axis direction and the Z-axis direction The directions are perpendicular to each other. It should be noted that the orientation words such as "top", "bottom", "upper", "lower", "left" and "right" involved in this application are described with reference to the orientation shown in Figure 1 , take the positive direction of the Y-axis as "top", the negative direction of the Y-axis as "bottom", the positive direction of the Z-axis as "up", the negative direction of the Z-axis as "down", and the positive direction of the X-axis The direction is "right", and the negative direction toward the X-axis is "left", which does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a reference to this application. limits.

请参阅图3和图4,图3是图2所示电子设备1000的一个角度分解结构示意图,图4是图1所示电子设备1000的一个角度分解结构示意图。电子设备1000包括壳体10、屏幕20、电路板30、支架40、处理器(图未示)、摄像模组、扬声器模组(图未示)、电源模组(图未示)和装饰件70。屏幕20安装于壳体10的一侧。电路板30、支架40、处理器、摄像模组、扬声器模组和电源模组均安装于壳体10的内侧。处理器可安装于电路板30,且与电路板30电连接。其中,处理器可为电子设备1000的CPU(central processing unit,中央处理器)。装饰件70安装于壳体10的另一侧,且覆盖支架40。Please refer to FIG. 3 and FIG. 4 , FIG. 3 is a schematic diagram of an angle-decomposed structure of the electronic device 1000 shown in FIG. 2 , and FIG. 4 is a schematic diagram of an angle-decomposed structure of the electronic device 1000 shown in FIG. 1 . The electronic device 1000 includes a casing 10, a screen 20, a circuit board 30, a bracket 40, a processor (not shown), a camera module, a speaker module (not shown), a power module (not shown) and decorative parts 70. The screen 20 is mounted on one side of the casing 10 . The circuit board 30 , the bracket 40 , the processor, the camera module, the speaker module and the power supply module are all installed inside the casing 10 . The processor can be mounted on the circuit board 30 and electrically connected to the circuit board 30 . Wherein, the processor may be a CPU (central processing unit, central processing unit) of the electronic device 1000 . The decoration part 70 is mounted on the other side of the casing 10 and covers the bracket 40 .

扬声器模组位于电子设备1000的顶部,且用作电子设备1000的顶部扬声器模组。扬声器模组包括第二扬声器单元63和第一扬声器单元62。第二扬声器单元63可为高频单元,且可用作电子设备1000的听筒。第二扬声器单元63可通过电路板30接收处理器发送的音频信号,并根据音频信号振动发声,声音扩散至外界环境中,实现电子设备1000的听筒发声。第一扬声器单元62与电路板30电连接,以实现与处理器之间的电连接。其中,第一扬声器单元62可为全频单元,且可用作电子设备1000的喇叭,也可以是低频单元,提升立体声效果。第一扬声器单元62可通过电路板30接收处理器发送的音频信号,并根据音频信号振动发声,声音扩散至外界环境中,实现电子设备1000的喇叭发声。在其他实施例中,第二扬声器单元63和第一扬声器单元62可均为全频单元,扬声器模组可实现三声道发声,有助于提升扬声器模组的发声质量。电子设备1000还设有扬声孔80和出音缝90,本实施例的扬声孔80和出音缝90位于电子设备的顶部。在其他实施例中,第二扬声器单元63可以省略,省略后,第一扬声器单元62出音方式可以通过扬声孔80和出音缝90,也可以是扬声孔80,或者是出音缝90。The speaker module is located on the top of the electronic device 1000 and serves as a top speaker module of the electronic device 1000 . The speaker module includes a second speaker unit 63 and a first speaker unit 62 . The second speaker unit 63 can be a high-frequency unit, and can be used as an earpiece of the electronic device 1000 . The second speaker unit 63 can receive the audio signal sent by the processor through the circuit board 30 , and vibrate and sound according to the audio signal, and the sound diffuses into the external environment, so that the earpiece of the electronic device 1000 can emit sound. The first speaker unit 62 is electrically connected to the circuit board 30 to realize an electrical connection with the processor. Wherein, the first speaker unit 62 can be a full-frequency unit, and can be used as a speaker of the electronic device 1000, or can be a low-frequency unit to enhance the stereo effect. The first speaker unit 62 can receive the audio signal sent by the processor through the circuit board 30 , and vibrate and sound according to the audio signal, and the sound diffuses into the external environment, so that the speaker of the electronic device 1000 can sound. In other embodiments, both the second speaker unit 63 and the first speaker unit 62 can be full-range units, and the speaker module can realize three-channel sound, which helps to improve the sound quality of the speaker module. The electronic device 1000 is also provided with a speaker hole 80 and a sound outlet slot 90 , and the speaker hole 80 and the sound outlet slot 90 in this embodiment are located on the top of the electronic device. In other embodiments, the second speaker unit 63 can be omitted. After omitting, the sound output mode of the first speaker unit 62 can pass through the speaker hole 80 and the sound output slot 90, or it can be the speaker hole 80, or the sound output slot. 90.

本实施例中,壳体10包括中框11和后盖18,后盖18安装于中框11的一侧。后盖18可为电子设备1000的电池盖。后盖18设有安装孔181,安装孔181位于后盖18的顶部并贯穿后盖18。即,安装孔181沿后盖18的厚度方向(图示Z轴方向)贯穿后盖18。安装孔181为方形孔。在其他实施例中,安装孔181也可以为圆形孔或其他形状的孔。扬声孔80位于中框11的一端。本实施例中,屏幕20可以是LCD(liquid crystal display,液晶显示屏)或OLED(organic light-emitting diode,有机发光二极管显示屏)等显示屏,且用于显示图像或文字等信息。屏幕20装于中框11的另一侧,即屏幕20安装于中框11背离后盖18的一侧。出音缝90位于屏幕20的顶部。In this embodiment, the casing 10 includes a middle frame 11 and a rear cover 18 , and the rear cover 18 is installed on one side of the middle frame 11 . The rear cover 18 may be a battery cover of the electronic device 1000 . The rear cover 18 is provided with a mounting hole 181 , and the mounting hole 181 is located on the top of the rear cover 18 and passes through the rear cover 18 . That is, the mounting hole 181 penetrates the rear cover 18 in the thickness direction (the Z-axis direction in the drawing) of the rear cover 18 . The installation hole 181 is a square hole. In other embodiments, the installation hole 181 may also be a circular hole or a hole of other shapes. The speaker hole 80 is located at one end of the middle frame 11 . In this embodiment, the screen 20 may be a display screen such as LCD (liquid crystal display) or OLED (organic light-emitting diode, organic light-emitting diode display), and is used to display information such as images or text. The screen 20 is installed on the other side of the middle frame 11 , that is, the screen 20 is installed on the side of the middle frame 11 away from the back cover 18 . The sound outlet 90 is located at the top of the screen 20 .

装饰件70呈矩形罩状。装饰件70设有收容槽71和安装边72,安装边72为装饰件70的外周缘。装饰件70装于后盖18的安装孔181上,安装边72与安装孔181周缘固定卡持,装饰件70凸出后盖18的外表面。收容槽71的开口位于装饰件70的一侧。收容槽71自装饰件70的上表面向下表面(图未标)的方向(图示Z轴负方向)凹陷。其中,收容槽71的形状与支架40的形状相适配。装饰件70还可设有摄像孔(图未标),摄像孔的开口位于收容槽71的槽底壁。摄像孔自收容槽71的槽底壁向装饰件70的下表面的方向凹陷,且贯穿装饰件70的下表面。其中,外界的光线可经摄像孔进入装饰件70的收容槽71。The decoration 70 is in the shape of a rectangular cover. The decoration part 70 is provided with a receiving groove 71 and a mounting edge 72 , and the installation edge 72 is an outer peripheral edge of the decoration part 70 . The decoration part 70 is mounted on the installation hole 181 of the back cover 18 , the installation edge 72 is fixedly clamped with the periphery of the installation hole 181 , and the decoration part 70 protrudes from the outer surface of the back cover 18 . The opening of the receiving groove 71 is located on one side of the decoration part 70 . The receiving groove 71 is recessed from the upper surface of the decorative part 70 in the direction of the lower surface (not shown in the figure) (the negative direction of the Z axis in the figure). Wherein, the shape of the receiving groove 71 matches the shape of the bracket 40 . The decoration part 70 can also be provided with a camera hole (not shown in the figure), and the opening of the camera hole is located at the bottom wall of the receiving groove 71 . The imaging hole is recessed from the bottom wall of the receiving groove 71 toward the lower surface of the decorative component 70 , and penetrates through the lower surface of the decorative component 70 . Wherein, external light can enter the receiving groove 71 of the decoration part 70 through the camera hole.

请参阅图4、图5和图6,图5是图3所示电子设备1000的中框11的结构示意图,图6是图4所示中框11在另一个角度下的结构示意图。Please refer to FIG. 4 , FIG. 5 and FIG. 6 , FIG. 5 is a schematic structural diagram of the middle frame 11 of the electronic device 1000 shown in FIG. 3 , and FIG. 6 is a structural schematic diagram of the middle frame 11 shown in FIG. 4 at another angle.

中框11包括中板111和两个端部边框112和两个侧部边框(图未标),中板111包括第一表面1110和与第一表面1110背向设置的第二表面1111。两个端部边框112和两个侧部边框首位连接且均与中板111侧部连接,两个端部边框112和两个侧部边框围绕中板111周侧与中板111形成容纳槽113。第一表面1110为容纳槽113的槽底面。本实施例的中板111为矩形板,位于中板111端边的两个端部边框112可以看成是电子设备的顶部和底部外壳,通常用于设置扬声孔和连接器插口等。位于中板相对两侧的侧部边框可以看成是电子设备的两个侧部外壳,可以设置音量键、开关机键等,也是使用者手握持的部分。本实施例中,位于顶部的端部边框112上设有扬声孔80,用于与扬声器模组配合。The middle frame 11 includes a middle board 111 , two end frames 112 and two side frames (not shown), the middle board 111 includes a first surface 1110 and a second surface 1111 opposite to the first surface 1110 . The two end frames 112 and the two side frames are first connected and both are connected to the side of the middle plate 111, the two end frames 112 and the two side frames surround the middle plate 111 and form a receiving groove 113 with the middle plate 111 . The first surface 1110 is a bottom surface of the receiving groove 113 . The middle board 111 in this embodiment is a rectangular board, and the two end frames 112 located at the ends of the middle board 111 can be regarded as the top and bottom casings of electronic equipment, and are usually used to set speaker holes and connector sockets. The side frames located on the opposite sides of the middle board can be regarded as the two side shells of the electronic device, which can be equipped with volume keys, power on and off keys, etc., and are also the parts held by the user. In this embodiment, the end frame 112 at the top is provided with a speaker hole 80 for cooperating with the speaker module.

本实施例中,中框11还包括凸块114,凸块114凸设于容纳槽113的槽底面(第一表面1110)且向容纳槽113的开口方向(图示Z轴负方向)延伸。具体的,凸块114呈矩形,凸块114位于容纳槽113的顶部,凸块114连接端部边框112内侧面。其中,凸块114的高度小于容纳槽113的深度。示例性的,凸块114呈方形。在其它实施例中,凸块114也可以呈圆形或其他形状。In this embodiment, the middle frame 11 further includes a protrusion 114 protruding from the bottom surface (the first surface 1110 ) of the receiving groove 113 and extending toward the opening direction of the receiving groove 113 (the negative direction of the Z axis in the figure). Specifically, the protruding block 114 is rectangular, the protruding block 114 is located on the top of the receiving groove 113 , and the protruding block 114 is connected to the inner side of the end frame 112 . Wherein, the height of the protrusion 114 is smaller than the depth of the receiving groove 113 . Exemplarily, the bump 114 is square. In other embodiments, the protrusion 114 may also be circular or in other shapes.

请一并参阅图5和图6,中框11还设有连通槽115、安装槽117和出音槽118。出音槽118和安装槽117均位于中框11的顶部。安装槽117沿中框11的厚度方向贯穿中板111的第一表面和第二表面。出音槽118包括缝隙1181和连接区1182,缝隙1181沿着端部边框112(X轴方向)延伸,具体是凹设于端部边框112的内侧面,并贯穿端部边框112的上表面,即与第一表面1110朝向相同的面。出音槽118部分凹设于中板111的第二表面1111(自中板111的第二表面向第一表面的方向(图示Z轴负方向)凹陷),连接区1182位于安装槽117一侧并与安装槽117连通。Please refer to FIG. 5 and FIG. 6 together, the middle frame 11 is further provided with a communication slot 115 , an installation slot 117 and a sound output slot 118 . Both the sound outlet slot 118 and the installation slot 117 are located on the top of the middle frame 11 . The installation groove 117 runs through the first surface and the second surface of the middle plate 111 along the thickness direction of the middle frame 11 . The sound outlet groove 118 includes a slit 1181 and a connection area 1182. The slit 1181 extends along the end frame 112 (X-axis direction), and is specifically recessed on the inner side of the end frame 112 and runs through the upper surface of the end frame 112. That is, it faces the same surface as the first surface 1110 . The sound outlet groove 118 is partially recessed on the second surface 1111 of the middle plate 111 (depressed from the second surface of the middle plate 111 to the first surface (the negative direction of the Z axis in the figure)), and the connecting area 1182 is located in the installation groove 117- side and communicate with the mounting groove 117.

请一并参阅图6、图7和图8,图7是图5所示的中框11的一个角度的截面示意图;图8是图6所示的中框11的一个角度的截面示意图。连通槽115贯穿凸块114和中板111的第二表面1111并与扬声孔80连通。连通槽115的一个开口位于凸块114的上表面(图未标),另一个开口位于第二表面1111上。具体的,连通槽115包括第一连通槽115a和第二连通槽115b,第一连通槽115a的开口位于凸块114的上表面并与容纳槽113连通。第一连通槽115a包括第一槽侧壁1150,第一槽侧壁1150与端部边框112连接,第一槽侧壁1150相较于第一连通槽115a开口倾斜,部分扬声孔80贯穿第一槽侧壁1150与第一连通槽115a连通。Please refer to FIG. 6 , FIG. 7 and FIG. 8 together. FIG. 7 is a schematic cross-sectional view of the middle frame 11 shown in FIG. 5 at an angle; FIG. 8 is a schematic cross-sectional view of the middle frame 11 shown in FIG. 6 at an angle. The communication groove 115 runs through the protruding block 114 and the second surface 1111 of the middle plate 111 and communicates with the sound hole 80 . One opening of the communication groove 115 is located on the upper surface (not shown) of the protrusion 114 , and the other opening is located on the second surface 1111 . Specifically, the communication groove 115 includes a first communication groove 115 a and a second communication groove 115 b, and the opening of the first communication groove 115 a is located on the upper surface of the protrusion 114 and communicates with the receiving groove 113 . The first communication groove 115a includes a first groove side wall 1150, the first groove side wall 1150 is connected to the end frame 112, the first groove side wall 1150 is inclined compared with the opening of the first communication groove 115a, and part of the sound hole 80 runs through the first communication groove 115a. A groove side wall 1150 communicates with the first communication groove 115a.

第二连通槽115b的开口位于第二表面1111上,在X轴方向上第二连通槽115b与安装槽117间隔排列,且在Y轴方向上与出音槽118间隔设置。第二连通槽115b包括槽底壁1152和子槽1153,第二连通槽115b由第二表面1111向中板111内凹陷形成,第二连通槽115b的开口背向容纳槽113,位于中板的第二表面。槽底壁1152与第二表面1111平行。子槽1153由槽底壁1152向中板111内部凹陷形成(具体是向凸块114内凹陷),子槽1153与部分所述扬声孔80连通。实际上,第一连通槽115a在第二连通槽115b的投影范围内。The opening of the second communication groove 115 b is located on the second surface 1111 , and the second communication groove 115 b is spaced apart from the mounting groove 117 in the X-axis direction, and spaced from the sound output groove 118 in the Y-axis direction. The second communication groove 115b includes a groove bottom wall 1152 and a sub-groove 1153. The second communication groove 115b is formed by indenting the second surface 1111 into the middle plate 111. The opening of the second communication groove 115b faces away from the receiving groove 113 and is located on the second side of the middle plate. Two surfaces. The groove bottom wall 1152 is parallel to the second surface 1111 . The sub-groove 1153 is formed by recessing the bottom wall 1152 of the groove toward the inside of the middle plate 111 (specifically, recessing into the protrusion 114 ), and the sub-groove 1153 communicates with part of the speaker hole 80 . Actually, the first communication groove 115a is within the projection range of the second communication groove 115b.

具体的,子槽1153包括两个倾斜侧壁1154和与倾斜侧壁1154连接的底壁1155,扬声孔80贯穿底壁1155与子槽1153连通。第一连通槽115a贯穿一个所述倾斜侧壁1154与子槽1153连通,即第一连通槽115a的另一个开口位于倾斜侧壁1154上并朝向底壁1155。其中,子槽1153是倾斜的槽,其由中板111向凸块114内凹设,底壁1155可以是端部边框112的一部分,也可以是凸块的一部分。可以理解为,第一连通槽115a贯穿第二连通槽115b的部分槽侧壁。第二连通槽115b的面积较大,便于第一连通槽115a的加工,也可以减小第一连通槽115a的尺寸,进而减小凸块的尺寸,可以减小电路板30上的缺口的尺寸,进而增加了电路板的实际使用面积。Specifically, the sub-trough 1153 includes two inclined side walls 1154 and a bottom wall 1155 connected to the inclined side walls 1154 , and the sound hole 80 communicates with the sub-trough 1153 through the bottom wall 1155 . The first communication groove 115 a communicates with the sub-groove 1153 through one of the inclined side walls 1154 , that is, the other opening of the first communication groove 115 a is located on the inclined side wall 1154 and faces the bottom wall 1155 . Wherein, the sub-groove 1153 is an inclined groove, which is recessed from the middle plate 111 to the protrusion 114, and the bottom wall 1155 can be a part of the end frame 112 or a part of the protrusion. It can be understood that the first communication groove 115a runs through part of the groove sidewall of the second communication groove 115b. The area of the second communication groove 115b is larger, which facilitates the processing of the first communication groove 115a, and can also reduce the size of the first communication groove 115a, thereby reducing the size of the bump, and reducing the size of the gap on the circuit board 30 , thereby increasing the actual use area of the circuit board.

请参阅图9和图10,图9是图3所示电子设备1000中电路板30的结构示意图,其中包括了扬声器模组。图10是图3所示电子设备1000部分结构组装示意图。Please refer to FIG. 9 and FIG. 10 . FIG. 9 is a schematic structural diagram of the circuit board 30 in the electronic device 1000 shown in FIG. 3 , which includes a speaker module. FIG. 10 is a schematic diagram of partial structural assembly of the electronic device 1000 shown in FIG. 3 .

电路板30可为电子设备1000的主板(main board)。电路板30包括安装面31,安装面31上设有第一安装区311和与第一安装区311相邻的第二安装区312。电路板30还设有避让孔32、多个安装避让孔33及缺口34。避让孔32、多个安装避让孔33(两个或者两个以上)及缺口34沿着电路板30厚度方向(Z轴方向)贯穿电路板30,即贯穿安装面31及与安装面31背向的表面。The circuit board 30 may be a main board (main board) of the electronic device 1000 . The circuit board 30 includes a mounting surface 31 on which a first mounting area 311 and a second mounting area 312 adjacent to the first mounting area 311 are disposed. The circuit board 30 also has avoidance holes 32 , a plurality of installation avoidance holes 33 and notches 34 . Avoidance holes 32, multiple installation avoidance holes 33 (two or more) and notches 34 penetrate the circuit board 30 along the thickness direction (Z-axis direction) of the circuit board 30, that is, penetrate the mounting surface 31 and face away from the mounting surface 31. s surface.

其中,避让孔32、安装避让孔33及缺口34间隔设置;避让孔32和缺口34位于电路板30的顶部,且贯穿电路板30的顶端面(图未标)。缺口34位于避让孔32一侧。多个安装避让孔33位于电路板30的第一安装区311,缺口34和避让孔32位于第一安装区311上方。需要说明的是,电路板30中位于避让孔32和安装避让孔33之间的部分,一般用于走射频信号线和控制线等线路,避让孔32和安装避让孔33之间的距离可便于排布射频信号线和控制线等线路,保证电路板30的使用可靠性。Wherein, the avoidance hole 32 , the installation avoidance hole 33 and the notch 34 are arranged at intervals; the avoidance hole 32 and the notch 34 are located on the top of the circuit board 30 and run through the top surface of the circuit board 30 (not shown). The notch 34 is located on one side of the escape hole 32 . A plurality of installation avoidance holes 33 are located on the first installation area 311 of the circuit board 30 , and the notches 34 and the avoidance holes 32 are located above the first installation area 311 . It should be noted that the part of the circuit board 30 between the avoidance hole 32 and the installation avoidance hole 33 is generally used for routing radio frequency signal lines and control lines, and the distance between the avoidance hole 32 and the installation avoidance hole 33 can be convenient. Lines such as radio frequency signal lines and control lines are arranged to ensure the reliability of the circuit board 30 .

请参阅图10,电路板30、摄像模组(图未示)和扬声器模组均安装于中框11的容纳槽113。具体的,电路板30安装于容纳槽113的槽底壁(图未标)。电路板30的缺口34避让中框11的凸块114。摄像模组安装于容纳槽113的槽底壁,且穿设于电路板30的多个安装避让孔33。摄像模组与电路板30电连接,以实现与处理器之间的电连接。摄像模组可通过电路板30接收处理器发送的信息采集信号,并采集电子设备1000外部的光线,以形成对应的图像数据。Please refer to FIG. 10 , the circuit board 30 , the camera module (not shown) and the speaker module are installed in the receiving groove 113 of the middle frame 11 . Specifically, the circuit board 30 is installed on the bottom wall of the receiving groove 113 (not shown). The notch 34 of the circuit board 30 avoids the protrusion 114 of the middle frame 11 . The camera module is mounted on the bottom wall of the receiving groove 113 and passes through a plurality of installation escape holes 33 of the circuit board 30 . The camera module is electrically connected to the circuit board 30 to realize the electrical connection with the processor. The camera module can receive the information collection signal sent by the processor through the circuit board 30 , and collect light outside the electronic device 1000 to form corresponding image data.

扬声器模组的第二扬声器单元63位于电子设备1000的顶部,第二扬声器单元63安装于安装槽117。具体的,第二扬声器单元63穿设于电路板30的安装避让孔33,且与电路板30电连接,以实现与处理器之间的电连接。其中,第二扬声器单元63可为高频单元,且可用作电子设备1000的听筒。第二扬声器单元63可通过电路板30接收处理器发送的音频信号,并根据音频信号振动发声,声音扩散至外界环境中,实现电子设备1000的听筒发声。The second speaker unit 63 of the speaker module is located on the top of the electronic device 1000 , and the second speaker unit 63 is installed in the installation groove 117 . Specifically, the second speaker unit 63 passes through the installation avoidance hole 33 of the circuit board 30 and is electrically connected with the circuit board 30 to realize an electrical connection with the processor. Wherein, the second speaker unit 63 can be a high-frequency unit, and can be used as an earpiece of the electronic device 1000 . The second speaker unit 63 can receive the audio signal sent by the processor through the circuit board 30 , and vibrate and sound according to the audio signal, and the sound diffuses into the external environment, so that the earpiece of the electronic device 1000 can emit sound.

第一扬声器单元62安装于电路板30的第二安装区312,也就是安装面31上,且与电路板30电连接,以实现与处理器之间的电连接。沿X轴方向上,第一扬声器单元62与摄像模组间隔设置。本实施例中的第一扬声器单元62直接设置于电路板30的安装面31上,不需要在电路板30上设置贯穿电路板的避让孔,可以节省电路板30的空间。其中,第一扬声器单元62可为全频单元,且可用作电子设备1000的喇叭;当然还可以作为低音单元使用。第一扬声器单元62可通过电路板30接收处理器发送的音频信号,并根据音频信号振动发声,声音扩散至外界环境中,实现电子设备1000的喇叭发声。此时,第一扬声器单元62可与第二扬声器单元63协同发声,可降低扬声器模组的功耗,有助于延长电子设备1000的续航时间。The first speaker unit 62 is installed on the second installation area 312 of the circuit board 30 , that is, on the installation surface 31 , and is electrically connected to the circuit board 30 to realize an electrical connection with the processor. Along the X-axis direction, the first speaker unit 62 is spaced apart from the camera module. In this embodiment, the first speaker unit 62 is directly disposed on the mounting surface 31 of the circuit board 30 , and there is no need to provide an avoidance hole penetrating the circuit board 30 on the circuit board 30 , which can save the space of the circuit board 30 . Wherein, the first speaker unit 62 can be a full-range unit, and can be used as a speaker of the electronic device 1000; of course, it can also be used as a bass unit. The first speaker unit 62 can receive the audio signal sent by the processor through the circuit board 30 , and vibrate and sound according to the audio signal, and the sound diffuses into the external environment, so that the speaker of the electronic device 1000 can sound. At this time, the first speaker unit 62 can cooperate with the second speaker unit 63 to produce sound, which can reduce the power consumption of the speaker module and help prolong the battery life of the electronic device 1000 .

此外,电子设备1000还可包括另一扬声器模组(图未示),另一扬声器模组位于电子设备1000的底部,且用作电子设备1000的底部扬声器模组。此时,电子设备1000可同时采用顶部扬声器模组和底部扬声器模组发声,以实现电子设备1000的“双喇叭”发声模式,有助于提升电子设备1000的发声质量。In addition, the electronic device 1000 may further include another speaker module (not shown in the figure), which is located at the bottom of the electronic device 1000 and used as a bottom speaker module of the electronic device 1000 . At this time, the electronic device 1000 can simultaneously use the top speaker module and the bottom speaker module to produce sound, so as to realize the "dual speakers" sounding mode of the electronic device 1000, which helps to improve the sound quality of the electronic device 1000.

请参阅图11和图12,图11是图3所示电子设备1000中支架40的结构示意图,图12是图11所示支架40在另一个角度下的结构示意图,图13是图12所示支架40的平面结构示意图。Please refer to FIG. 11 and FIG. 12. FIG. 11 is a schematic structural view of the bracket 40 in the electronic device 1000 shown in FIG. 3. FIG. 12 is a schematic structural diagram of the bracket 40 shown in FIG. A schematic diagram of the planar structure of the bracket 40 .

本实施例中,支架40包括支架本体41、凸台42、装配槽43、避让槽45以及安装凸起46以及通音孔47,凸台42和安装凸起46固定连接于支架本体41。支架本体41与中框11的容纳槽113(如图4所示)的形状相适配。支架本体41包括第一面411和与第一面411背向设置的第二面412。In this embodiment, the bracket 40 includes a bracket body 41 , a boss 42 , an assembly groove 43 , an escape groove 45 , a mounting protrusion 46 and a sound hole 47 , and the boss 42 and the mounting protrusion 46 are fixedly connected to the bracket body 41 . The shape of the bracket body 41 is adapted to the shape of the receiving groove 113 (shown in FIG. 4 ) of the middle frame 11 . The bracket body 41 includes a first surface 411 and a second surface 412 opposite to the first surface 411 .

凸台42固定连接于支架本体41的第二面412。凸台42自支架本体41的第二面412向远离第二面412的方向(图示Z轴正方向)凸出。装配槽43贯穿第一面411和第二面412上的凸台42,即装配槽43为通槽,其两个开口分别位于第一面411和凸台42背向第二面412的一侧。装配槽43的形状与摄像模组的形状相适配。The boss 42 is fixedly connected to the second surface 412 of the bracket body 41 . The boss 42 protrudes from the second surface 412 of the bracket body 41 in a direction away from the second surface 412 (the positive direction of the Z axis in the figure). The assembly groove 43 runs through the boss 42 on the first surface 411 and the second surface 412, that is, the assembly groove 43 is a through groove, and its two openings are respectively located on the side of the first surface 411 and the boss 42 facing away from the second surface 412 . The shape of the fitting groove 43 is adapted to the shape of the camera module.

避让槽45凹设于第一面411上,沿Z轴方向,避让槽45由第一面411向第二面412方向凹陷;沿着X轴方向,避让槽45与装配槽43间隔设置。避让槽45的形状与第一扬声器单元62形状相适配,用于容纳第一扬声器单元62。避让槽45平行于第一面411的槽底壁450上凹设有功能槽451,第一扬声器单元覆盖功能槽451,功能槽451作为第一扬声器单元62的前音腔。The avoidance groove 45 is recessed on the first surface 411 . Along the Z-axis direction, the avoidance groove 45 is recessed from the first surface 411 to the second surface 412 ; along the X-axis direction, the avoidance groove 45 is spaced apart from the assembly groove 43 . The shape of the escape groove 45 is adapted to the shape of the first speaker unit 62 for accommodating the first speaker unit 62 . A functional groove 451 is recessed on the groove bottom wall 450 of the escape groove 45 parallel to the first surface 411 , the first speaker unit covers the functional groove 451 , and the functional groove 451 serves as the front sound cavity of the first speaker unit 62 .

安装凸起46凸设于支架本体41的第一面411上,在Y方向,安装凸起46与避让槽45相邻设置;沿Z轴方向,安装凸起46与凸台42部分重合。安装凸起46的长度延伸方向与Y轴方向之间的夹角θ大于等于0度且小于90度。The installation protrusion 46 protrudes from the first surface 411 of the bracket body 41 . In the Y direction, the installation protrusion 46 is adjacent to the avoidance groove 45 ; along the Z axis direction, the installation protrusion 46 partially overlaps with the boss 42 . The included angle θ between the length extension direction of the installation protrusion 46 and the Y-axis direction is greater than or equal to 0 degrees and less than 90 degrees.

请一并参阅图14和图15,图14是图2所示的电子设备1000的一个角度的部分结构剖视图,图15是图2所示的电子设备1000的另一个角度的部分结构剖视图。Please refer to FIG. 14 and FIG. 15 together. FIG. 14 is a partial structural sectional view of the electronic device 1000 shown in FIG. 2 , and FIG. 15 is a partial structural sectional view of the electronic device 1000 shown in FIG. 2 .

通音孔47包括第一音孔471、第二音孔472和第三音孔473,第一音孔471、第二音孔472和第三音孔473沿着通音孔47延伸方向依次连接。功能槽451与安装凸起46相邻的侧槽壁(图未标)上设有第一音孔471,第一音孔471的延伸方向与Y轴方向平行。第二音孔472在凸台42内沿着Z轴延伸至安装凸起46内部后,在安装凸起46内部沿着安装凸起46的延伸方向延伸;可以理解,第二音孔472为穿过凸台42和安装凸起46的阶梯孔,其整体是沿着Z轴方向延伸的。第二音孔472只要连通第一音孔471和第三音孔473即可,其路径不做限定。第三音孔473沿着Z轴方向贯穿安装凸起46的外表面,并位于安装凸起46远离避让槽45的一端;第三音孔473延伸方向与Z轴方向平行。在其他一些实施例中,通音孔47中各个部分也可以采用其他的结构,本申请对通音孔47的结构不作具体限制。第一音孔471、第二音孔472和第三音孔473可以是圆孔,也可以是方孔,也可以是通槽结构构成,不限定其形状。The sound hole 47 includes a first sound hole 471, a second sound hole 472 and a third sound hole 473, and the first sound hole 471, the second sound hole 472 and the third sound hole 473 are sequentially connected along the extending direction of the sound hole 47 . A first sound hole 471 is provided on the side wall (not shown) of the functional groove 451 adjacent to the installation protrusion 46 , and the extension direction of the first sound hole 471 is parallel to the Y-axis direction. After the second sound hole 472 extends to the inside of the installation protrusion 46 along the Z axis in the boss 42, it extends along the extension direction of the installation protrusion 46 inside the installation protrusion 46; The stepped hole passing through the boss 42 and the mounting protrusion 46 extends along the Z axis as a whole. The second sound hole 472 only needs to be connected to the first sound hole 471 and the third sound hole 473 , and its path is not limited. The third sound hole 473 runs through the outer surface of the installation protrusion 46 along the Z-axis direction, and is located at the end of the installation protrusion 46 away from the escape groove 45 ; the extension direction of the third sound hole 473 is parallel to the Z-axis direction. In some other embodiments, various parts in the sound hole 47 may also adopt other structures, and the present application does not specifically limit the structure of the sound hole 47 . The first sound hole 471 , the second sound hole 472 and the third sound hole 473 can be round holes, square holes, or through-slot structures, and their shapes are not limited.

一种实施例中,第一扬声器单元62的前音腔,也就是功能槽451可以是沙漏形状,即槽侧壁在Z轴方向上的会有部分相对靠近,在Z轴方向上的功能槽451位于开口和槽底壁之间的部分区域截面小于开口的面积以及槽底壁的面积,可以理解为功能槽451槽内部有部分是变窄的。或者,所述的第二音孔472在其出音方向上部分区域截面面积小于连接第一音孔471和第三音孔473的开口的面积,可以理解为第二音孔472出音方向上部分区域变窄。如此,可以提升第一扬声器单元62高频性能。可以理解,第一扬声器单元62的出声通道,不限于在第二音孔位置设置变窄的区域,第一音孔471和第三音孔473也可以设置窄区域。In one embodiment, the front sound cavity of the first speaker unit 62, that is, the functional slot 451 may be in an hourglass shape, that is, the side walls of the slot in the Z-axis direction will be relatively close to each other, and the functional slot 451 in the Z-axis direction The section of the part of 451 located between the opening and the bottom wall of the groove is smaller than the area of the opening and the bottom wall of the groove. It can be understood that the inside of the functional groove 451 is partially narrowed. Or, the cross-sectional area of the second sound hole 472 is smaller than the area of the opening connecting the first sound hole 471 and the third sound hole 473 in the direction of its sound output, which can be understood as the sound output direction of the second sound hole 472 Some areas are narrowed. In this way, the high-frequency performance of the first speaker unit 62 can be improved. It can be understood that the sound output channel of the first speaker unit 62 is not limited to the narrowed area at the second sound hole, and the first sound hole 471 and the third sound hole 473 may also be provided with narrow areas.

支架40安装于中框11的容纳槽113。具体的,支架40安装于电路板30背离中框11的表面(即电路板30的安装面31)。支架40可通过螺钉等紧固件安装于电路板30。其中,支架40覆盖第二扬声器单元63。摄像模组穿设于装配槽43,第一扬声器单元62安装于避让槽45内,且覆盖第一音孔471。此外,支架本体41的第二面412可与中框11的表面齐平,以便于后续后盖18与中框11的装配。The bracket 40 is installed in the receiving groove 113 of the middle frame 11 . Specifically, the bracket 40 is installed on the surface of the circuit board 30 away from the middle frame 11 (ie, the installation surface 31 of the circuit board 30 ). The bracket 40 can be installed on the circuit board 30 through fasteners such as screws. Wherein, the bracket 40 covers the second speaker unit 63 . The camera module passes through the assembly slot 43 , and the first speaker unit 62 is installed in the escape slot 45 and covers the first sound hole 471 . In addition, the second surface 412 of the bracket body 41 can be flush with the surface of the middle frame 11 , so as to facilitate subsequent assembly of the back cover 18 and the middle frame 11 .

请参阅图15、图16和图17,图16是图1所示电子设备1000一角度的剖面结构示意图,图17是图1所示电子设备1000另一角度的剖面结构示意图。Please refer to FIG. 15 , FIG. 16 and FIG. 17 , FIG. 16 is a schematic cross-sectional structural view of the electronic device 1000 shown in FIG. 1 from one angle, and FIG. 17 is a schematic cross-sectional structural schematic view of the electronic device 1000 shown in FIG. 1 from another angle.

装饰件70安装于支架40背离中框11的表面,且覆盖支架40和摄像模组。其中,支架40、摄像模组和装饰件70均穿设于后盖18的安装孔181。具体的,装饰件70的收容槽71收容支架40的凸台42。此外,装饰件70的摄像孔与摄像模组相对设置。摄像模组可经摄像孔采集电子设备1000外部的光线,并形成对应的图像数据,以实现摄像。The decorative part 70 is installed on the surface of the bracket 40 facing away from the middle frame 11 and covers the bracket 40 and the camera module. Wherein, the bracket 40 , the camera module and the decoration 70 are all passed through the installation hole 181 of the rear cover 18 . Specifically, the accommodating groove 71 of the decoration part 70 accommodates the boss 42 of the bracket 40 . In addition, the camera hole of the decorative part 70 is set opposite to the camera module. The camera module can collect the light outside the electronic device 1000 through the camera hole, and form corresponding image data to realize the camera.

屏幕装于中框11的另一侧,并密封安装槽117以及连通槽115的第二连通槽115b,安装槽117形成第二扬声器单元63的前音腔63a,本实施例中的第二扬声器单元63相较于第一扬声器单元62体积小,相应的减小第二扬声器单元63的前音腔63a体积,在外放场景下第二扬声器单元63可以作为高音单元使用。其中,屏幕20与出音槽118的缝隙1181形成出音缝90,出音缝90通过出音槽118的连接区1182与第二扬声器单元63的前音腔63a连通。第二扬声器单元63工作时发出的声音,可从前音腔63a经部分出音槽118和出音缝90传递至电子设备1000的外部,即可以理解为第二扬声器单元63工作时发出的声音依次经中框11的安装槽117、出音槽118传递至电子设备1000的外部,实现第二扬声器单元63的发声。所述的出音缝为中框的出音槽与屏幕20围成,出音缝也可为屏幕20切槽与中框围成。The screen is mounted on the other side of the middle frame 11, and seals the installation groove 117 and the second communication groove 115b of the communication groove 115. The installation groove 117 forms the front sound cavity 63a of the second speaker unit 63, the second speaker in this embodiment The unit 63 is smaller than the first speaker unit 62, and correspondingly reduces the volume of the front sound chamber 63a of the second speaker unit 63, and the second speaker unit 63 can be used as a tweeter unit in an external playback scene. The gap 1181 between the screen 20 and the sound outlet 118 forms a sound outlet 90 , and the sound outlet 90 communicates with the front sound chamber 63 a of the second speaker unit 63 through the connection area 1182 of the sound outlet 118 . The sound that the second speaker unit 63 emits when it works can be transmitted from the front sound chamber 63a to the outside of the electronic device 1000 through part of the sound outlet groove 118 and the sound outlet slit 90, that is, it can be understood that the sound that the second speaker unit 63 emits when it works sequentially The sound is transmitted to the outside of the electronic device 1000 through the installation slot 117 and the sound output slot 118 of the middle frame 11 to realize the sound generation of the second speaker unit 63 . The sound output seam is formed by the sound output groove of the middle frame and the screen 20, and the sound output seam can also be formed by the screen 20 cutting groove and the middle frame.

通音孔47的第三音孔473与凸块114的连通槽115相对并连通,通音孔47通过连通槽115与扬声孔80连通。支架40的避让槽45内的功能槽451形成第一扬声器单元62的前音腔62a并通过后盖18或者装饰件密封。其中,通音孔47的第一音孔471与第一扬声器单元62的前音腔62a连通。第一扬声器单元62工作时发出的声音,可从前音腔62a经通音孔47传递至电子设备1000的外部,即,可依次经过支架40的通音孔47、中框11的连通槽115和扬声孔80传递至电子设备1000的外部,实现第一扬声器单元62的发声。可以理解为,通音孔47、连通槽115及扬声孔80沟通第一扬声器单元62的扬声通道。The third sound hole 473 of the sound hole 47 is opposite to and communicated with the communication groove 115 of the protrusion 114 , and the sound hole 47 communicates with the sound hole 80 through the communication groove 115 . The functional slot 451 in the avoidance slot 45 of the bracket 40 forms the front sound chamber 62a of the first speaker unit 62 and is sealed by the rear cover 18 or the decoration. Wherein, the first sound hole 471 of the sound hole 47 communicates with the front sound cavity 62 a of the first speaker unit 62 . The sound emitted by the first speaker unit 62 during work can be transmitted from the front sound cavity 62a to the outside of the electronic device 1000 through the sound hole 47, that is, it can pass through the sound hole 47 of the bracket 40, the communication groove 115 of the middle frame 11 and the The sound hole 80 transmits to the outside of the electronic device 1000 to realize sound emission from the first speaker unit 62 . It can be understood that the sound hole 47 , the communication groove 115 and the sound hole 80 communicate with the sound channel of the first speaker unit 62 .

所述出音缝90可作为通话时出音的缝隙,由于人耳无法与出音缝完全贴合密封,因此出音缝的声音会向外扩散,变为漏音,影响通话隐私性,对于此问题,第一扬声器单元62的前音腔62a可通过顶部扬声孔80发出与出音缝90相位相反的声波,以抵消出音缝的漏音,提升通话隐私性。The sound output slit 90 can be used as a gap for sound output during a call. Since the human ear cannot completely fit and seal the sound output slit, the sound from the sound output slit will spread outward and become sound leakage, which affects the privacy of the call. For this problem, the front sound chamber 62a of the first speaker unit 62 can emit a sound wave with a phase opposite to that of the sound outlet 90 through the top speaker hole 80, so as to offset the sound leakage from the sound outlet and improve the privacy of the call.

电子设备1000还包括第一粘接层、第二粘接层和第三粘接层和第四粘接层。第一粘接层粘接于第一扬声器单元62与支架40之间。具体的,第一粘接层的上表面(图未标)粘接第一扬声器单元62,第一粘接层的下表面(图未标)粘接支架40的避让槽45的槽底壁。其中,第一粘接层设有通孔(图未标),通孔沿第一粘接层的厚度方向贯穿第一粘接层,以保证第一粘接层不会阻碍第一扬声器单元62的发声。第二粘接层连接中框的凸块114与安装凸起46之间密封连通槽115和第三音孔473。The electronic device 1000 further includes a first adhesive layer, a second adhesive layer, a third adhesive layer, and a fourth adhesive layer. The first adhesive layer is bonded between the first speaker unit 62 and the bracket 40 . Specifically, the upper surface (not shown) of the first adhesive layer is bonded to the first speaker unit 62 , and the lower surface (not shown) of the first adhesive layer is bonded to the bottom wall of the escape groove 45 of the bracket 40 . Wherein, the first adhesive layer is provided with a through hole (not marked in the figure), and the through hole penetrates the first adhesive layer along the thickness direction of the first adhesive layer, so as to ensure that the first adhesive layer will not hinder the first speaker unit 62 voice. The second adhesive layer connects the protrusion 114 of the middle frame and the installation protrusion 46 to seal the communication groove 115 and the third sound hole 473 .

在其他一些实施例中,第一扬声器单元62也可以不安装于电路板30,而通过第一粘接层安装于支架40。此时,沿Z轴方向上,第一扬声器单元62与电路板30间隔设置,电子设备1000的电子器件可以安装于电路板30,且位于第一扬声器单元62与电路板30之间,以提高电子设备1000的内部的空间利用率,提高电子设备1000的集成度。In some other embodiments, the first speaker unit 62 may not be installed on the circuit board 30 , but installed on the bracket 40 through the first adhesive layer. At this time, along the Z-axis direction, the first speaker unit 62 is spaced apart from the circuit board 30, and the electronic components of the electronic device 1000 can be mounted on the circuit board 30 and positioned between the first speaker unit 62 and the circuit board 30, so as to improve The utilization rate of space inside the electronic device 1000 improves the integration degree of the electronic device 1000 .

第三粘接层100c粘接屏幕20和中框11的中板111之间,围绕安装槽117和出音槽118,第四粘接层(图未标)粘接第二扬声器单元63与中板111安装槽117之间且保证不会阻碍第二扬声器单元63的发声。The third adhesive layer 100c is bonded between the screen 20 and the middle plate 111 of the middle frame 11, and surrounds the installation groove 117 and the sound outlet groove 118, and the fourth adhesive layer (not shown in the figure) is bonded between the second speaker unit 63 and the middle The board 111 is installed between the grooves 117 and ensures that it will not hinder the sound generation of the second speaker unit 63 .

请参阅图18和图19,图18是本申请第二实施例提供的电子设备1000的分解结构示意图,图19是图18所示电子设备1000的支架的另一个角度下的结构示意图。Please refer to FIG. 18 and FIG. 19. FIG. 18 is a schematic exploded view of the electronic device 1000 provided by the second embodiment of the present application, and FIG. 19 is a schematic structural view of the bracket of the electronic device 1000 shown in FIG. 18 at another angle.

本实施例所示电子设备1000与上述实施例所示电子设备1000的不同之处在于,中框11的连通槽115是凹设于凸块114表面的凹槽,并不贯穿中板111,扬声孔80贯穿端部边框112和连通槽115的槽侧壁,实际上端部边框112为连通槽115的槽侧壁。可以理解为,连通槽115具有槽底壁,且在Y方向上的槽侧壁并非斜面,可以与中板111垂直或者大致垂直的平面。The difference between the electronic device 1000 shown in this embodiment and the electronic device 1000 shown in the above embodiments is that the connecting groove 115 of the middle frame 11 is a groove recessed on the surface of the protrusion 114, and does not penetrate through the middle plate 111. The sound hole 80 runs through the end frame 112 and the groove sidewall of the communication groove 115 , in fact, the end frame 112 is the groove sidewall of the communication groove 115 . It can be understood that the communication groove 115 has a groove bottom wall, and the side wall of the groove in the Y direction is not a slope, but may be a plane perpendicular or substantially perpendicular to the middle plate 111 .

支架40的安装凸起46还包括延伸部分461,延伸部分461为安装凸起46远离避让槽45的一端沿着X轴方向延伸形成。通音孔47的第三音孔473开设于延伸部分461上,通音孔47的开口位于安装凸起46的上表面(与第一面411朝向相同)且第三音孔473的孔壁为垂直或者大致垂直于支架本体41的平面。可以理解为第三音孔473沿着X方向的长度大于第一实施例所述的第三音孔473的长度。延伸部分461和第三音孔473均满足凸块114的长度和连通槽115的长度。本实施例的连通槽115和第三音孔473的面积增大,更利于声音的释放。The installation protrusion 46 of the bracket 40 further includes an extension portion 461 , and the extension portion 461 is formed by extending the end of the installation protrusion 46 away from the escape groove 45 along the X-axis direction. The third sound hole 473 of the sound hole 47 is opened on the extension part 461, the opening of the sound hole 47 is located on the upper surface of the mounting protrusion 46 (the same orientation as the first surface 411), and the hole wall of the third sound hole 473 is Vertical or approximately vertical to the plane of the bracket body 41 . It can be understood that the length of the third sound hole 473 along the X direction is greater than the length of the third sound hole 473 described in the first embodiment. Both the extension portion 461 and the third sound hole 473 meet the length of the protrusion 114 and the length of the communication groove 115 . In this embodiment, the areas of the communication groove 115 and the third sound hole 473 are increased, which is more conducive to the release of sound.

请参阅图20和图21,图20是本申请第二实施例提供的电子设备1000部分结构组装示意图。图21是图17所示的电子设备1000的组装后的截面示意图。Please refer to FIG. 20 and FIG. 21 . FIG. 20 is a schematic diagram of a partial structure and assembly of an electronic device 1000 provided in the second embodiment of the present application. FIG. 21 is a schematic cross-sectional view of the assembled electronic device 1000 shown in FIG. 17 .

电路板30、扬声器模组均安装于中框11的容纳槽113。电路板30安装于容纳槽113的槽底壁(图未标)。电路板30的缺口34避让中框11的凸块114。第一扬声器单元62位于电路板30的安装面31,支架装于容纳槽113上,具体是支架40安装于电路板30背离中框11的表面。第二扬声器单元63安装于安装槽117,支架40覆盖第二扬声器单元63。第一扬声器单元62安装于避让槽45内,且覆盖第一音孔471。装饰件70安装于支架40背离中框11的表面,且覆盖支架40。安装槽117形成第二扬声器单元63的前音腔63a。其中,出音缝90通过出音槽118与第二扬声器单元63的前音腔63a连通。通音孔47的第三音孔473与凸块114的连通槽115相对并连通,第三音孔473的孔壁与连通槽115的槽侧壁在Z方向对齐,通音孔47通过连通槽115与扬声孔80连通。本实施例的连通槽115结构简单。通音孔47、连通槽115及扬声孔80沟通第一扬声器单元62的扬声通道。Both the circuit board 30 and the speaker module are installed in the receiving slot 113 of the middle frame 11 . The circuit board 30 is installed on the bottom wall (not shown) of the containing groove 113 . The notch 34 of the circuit board 30 avoids the protrusion 114 of the middle frame 11 . The first speaker unit 62 is located on the installation surface 31 of the circuit board 30 , and the bracket is installed on the receiving groove 113 , specifically, the bracket 40 is installed on the surface of the circuit board 30 away from the middle frame 11 . The second speaker unit 63 is installed in the installation slot 117 , and the bracket 40 covers the second speaker unit 63 . The first speaker unit 62 is installed in the escape groove 45 and covers the first sound hole 471 . The decoration part 70 is installed on the surface of the bracket 40 away from the middle frame 11 and covers the bracket 40 . The installation groove 117 forms the front sound cavity 63 a of the second speaker unit 63 . Wherein, the sound outlet slot 90 communicates with the front sound cavity 63 a of the second speaker unit 63 through the sound outlet slot 118 . The third sound hole 473 of the sound hole 47 is opposite to and communicated with the communication groove 115 of the protrusion 114, the hole wall of the third sound hole 473 is aligned with the side wall of the communication groove 115 in the Z direction, and the sound hole 47 passes through the communication groove 115 communicates with the sound hole 80 . The communication groove 115 in this embodiment has a simple structure. The sound hole 47 , the communication groove 115 and the sound hole 80 communicate with the sound channel of the first speaker unit 62 .

请参阅图22和图23,图22是本申请第三实施例提供的电子设备1000的分解结构示意图,图23是图22所示电子设备1000的支架的一个角度下的结构示意图;图24是图22所示电子设备1000的支架的另一个角度下的结构示意图。Please refer to FIG. 22 and FIG. 23. FIG. 22 is a schematic exploded view of the electronic device 1000 provided in the third embodiment of the present application. FIG. 23 is a schematic view of the structure of the bracket of the electronic device 1000 shown in FIG. 22 at an angle; FIG. 24 is FIG. 22 is a schematic structural diagram of the bracket of the electronic device 1000 at another angle.

本实施例所示电子设备1000与上述实施例所示电子设备1000的不同之处在于,中框11的凸块114包括第一斜面1141,第一斜面1141背向所述端部边框且与中板111的第一表面1110连接并呈夹角,夹角大于90度小于180度。连通槽115凹设于第一斜面1141上并与扬声孔80连通。支架40的安装凸起46包括本体461和延伸部分462,延伸部分462包括第二斜面463,第三音孔473设于第二斜面463上。本体461与第一实施例的安装凸起46倾斜角度相同。The difference between the electronic device 1000 shown in this embodiment and the electronic device 1000 shown in the above embodiments is that the protrusion 114 of the middle frame 11 includes a first slope 1141, and the first slope 1141 faces away from the end frame and is aligned with the middle frame. The first surface 1110 of the board 111 is connected and forms an included angle, and the included angle is greater than 90 degrees and less than 180 degrees. The communication slot 115 is recessed on the first slope 1141 and communicates with the sound hole 80 . The installation protrusion 46 of the bracket 40 includes a body 461 and an extension portion 462 , the extension portion 462 includes a second slope 463 , and the third sound hole 473 is disposed on the second slope 463 . The inclination angle of the body 461 is the same as that of the installation protrusion 46 of the first embodiment.

具体的,连通槽115由第一斜面1141向端部边框112方向凹陷,及有第一斜面1141向Y方向凹陷形成。连通槽115的槽底壁为端部边框112的朝向容纳槽113的内侧面,扬声孔80贯穿连通槽115的槽底壁与连通槽115连通。Specifically, the communication groove 115 is formed by the first inclined surface 1141 being recessed toward the direction of the end frame 112 , and the first inclined surface 1141 is recessed toward the Y direction. The bottom wall of the communication groove 115 is the inner surface of the end frame 112 facing the receiving groove 113 , and the speaker hole 80 passes through the bottom wall of the communication groove 115 to communicate with the communication groove 115 .

本实施例中,延伸部分462位于安装凸起46远离避让槽45的一端,延伸部分462大致为棱柱体,其长度方向平行于X轴方向,且部分延伸部分461与安装凸起46连接。延伸部分462包括第二斜面463、抵持面464和连接面465。抵持面464连接第二斜面463和连接面465。第二斜面463位于支架本体41的端部并与端面(连接第一面411和第二面412)连接,且第二斜面463背向第一面411。连接面465朝向第一面411用于与电路板30装配。连接面465用于抵持容纳槽113的槽底壁。In this embodiment, the extension portion 462 is located at the end of the installation protrusion 46 away from the escape groove 45 , the extension portion 462 is roughly a prism, and its length direction is parallel to the X-axis direction, and part of the extension portion 461 is connected to the installation protrusion 46 . The extension portion 462 includes a second inclined surface 463 , a resisting surface 464 and a connecting surface 465 . The resisting surface 464 connects the second inclined surface 463 and the connecting surface 465 . The second slope 463 is located at the end of the bracket body 41 and connected to the end surface (connecting the first surface 411 and the second surface 412 ), and the second slope 463 faces away from the first surface 411 . The connection surface 465 faces the first surface 411 for assembly with the circuit board 30 . The connecting surface 465 is used for abutting against the bottom wall of the receiving groove 113 .

第二斜面463上设有通音孔47的第三音孔473,第三音孔的一个开口位于第二斜面463上,另一个开口与第二音孔472联通;实际上第三音孔473的两个开口面积不同,与第二音孔472联通的开口面积较小,与扬声孔80相对接的开口面积较大,更利于声音的播放。第二音孔472的一部分沿着本体461长度方向延伸,并且与第三音孔473连通;第二音孔472的另一部分沿着Z轴延伸至凸台42内且向避让槽45方向延伸,与第一音孔471连通。实际上,第二音孔472为穿过凸台42和安装凸起46的阶梯孔,其整体是沿着Z轴方向延伸。The third sound hole 473 of the sound hole 47 is provided on the second slope 463, an opening of the third sound hole is located on the second slope 463, and the other opening communicates with the second sound hole 472; in fact the third sound hole 473 The area of the two openings is different, the area of the opening communicating with the second sound hole 472 is smaller, and the area of the opening connected to the sound hole 80 is larger, which is more conducive to the playback of sound. A part of the second sound hole 472 extends along the length direction of the body 461 and communicates with the third sound hole 473; the other part of the second sound hole 472 extends into the boss 42 along the Z axis and extends toward the escape groove 45, It communicates with the first sound hole 471. In fact, the second sound hole 472 is a stepped hole passing through the boss 42 and the installation protrusion 46 , and the whole extends along the Z-axis direction.

请参阅图25和图26,图25是本申请第三实施例提供的电子设备1000部分结构组装示意图;图26是图25所示的电子设备1000的组装后的一角度的截面示意图。Please refer to FIG. 25 and FIG. 26. FIG. 25 is a schematic assembly diagram of a partial structure of the electronic device 1000 provided by the third embodiment of the present application; FIG. 26 is a schematic cross-sectional view of an angle after assembly of the electronic device 1000 shown in FIG.

电路板30、扬声器模组均安装于中框11的容纳槽113。电路板30安装于容纳槽113的槽底壁(图未标)。电路板30的缺口34避让中框11的凸块114,连通槽115位于电路板上方。第一扬声器单元62位于电路板30的安装面31,支架40装于容纳槽113上,具体是支架40安装于电路板30背离中框11的表面。其中,支架40的安装凸起46的第二斜面463与中框11的凸块114的第一斜面1141平行相对,通音孔47的第三音孔473通过连通槽115与扬声孔80连通。延伸部分462的抵持面464与中板111抵持,连接面465与电路板30设有缺口的端部抵持。第二扬声器单元63安装于安装槽117,支架40覆盖第一扬声器单元62和第二扬声器单元63。第一扬声器单元62安装于避让槽45内,且覆盖第一音孔471。装饰件70安装于支架40背离中框11的表面,且覆盖支架40。Both the circuit board 30 and the speaker module are installed in the receiving slot 113 of the middle frame 11 . The circuit board 30 is installed on the bottom wall (not shown) of the containing groove 113 . The notch 34 of the circuit board 30 avoids the protrusion 114 of the middle frame 11 , and the communication groove 115 is located above the circuit board. The first speaker unit 62 is located on the installation surface 31 of the circuit board 30 , and the bracket 40 is installed on the receiving groove 113 , specifically, the bracket 40 is installed on the surface of the circuit board 30 away from the middle frame 11 . Wherein, the second slope 463 of the installation protrusion 46 of the bracket 40 is parallel to the first slope 1141 of the protrusion 114 of the middle frame 11, and the third sound hole 473 of the sound hole 47 communicates with the sound hole 80 through the communication groove 115 . The abutting surface 464 of the extension portion 462 is abutted against the middle board 111 , and the connecting surface 465 is abutted against an end portion of the circuit board 30 provided with a notch. The second speaker unit 63 is installed in the installation slot 117 , and the bracket 40 covers the first speaker unit 62 and the second speaker unit 63 . The first speaker unit 62 is installed in the escape groove 45 and covers the first sound hole 471 . The decoration part 70 is installed on the surface of the bracket 40 away from the middle frame 11 and covers the bracket 40 .

需要说明的是以上任一实施例的用于通音部分的周缘,包括槽和孔的周缘,通过密封胶体密封连接,以保证密封性能,防止漏音。以上任意实施例的第一扬声器单元62的后腔为电路板、后盖18和中框11密封部分形成。第二扬声器的后腔为后盖18和中框11密封部分形成,再次不再赘述。It should be noted that the periphery of the sound-passing part in any of the above embodiments, including the periphery of the groove and the hole, is sealed and connected by sealing colloid to ensure the sealing performance and prevent sound leakage. The rear cavity of the first speaker unit 62 in any of the above embodiments is formed by the sealing part of the circuit board, the rear cover 18 and the middle frame 11 . The rear cavity of the second speaker is formed by the sealing part of the rear cover 18 and the middle frame 11 , which will not be described again.

以上描述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内;在不冲突的情况下,本申请的实施例及实施例中的特征可以相互组合。因此,本申请的保护范围应以权利要求的保护范围为准。The above description is only the specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application, and should It falls within the protection scope of the present application; in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (14)

1.一种电子设备,其特征在于,包括摄像模组、中框、电路板、支架和第一扬声器单元,所述电路板包括安装面,所述支架包括避让槽;所述避让槽沿着所述支架厚度方向向所述支架内凹陷,所述第一扬声器单元定位于所述安装面上并与所述电路板电性连接,所述电路板和所述支架层叠且装于所述中框,所述安装面背向所述中框,所述支架固定于所述安装面,所述摄像模组装于所述中框并与所述电路板电性连接,且所述摄像模组穿过所述支架,并通过所述支架定位于所述中框,在所述电子设备厚度方向上,所述第一扬声器单元收容于所述避让槽内。1. An electronic device, characterized in that it includes a camera module, a middle frame, a circuit board, a bracket and a first speaker unit, the circuit board includes a mounting surface, and the bracket includes an avoidance groove; the avoidance groove is along the The thickness direction of the bracket is recessed into the bracket, the first speaker unit is positioned on the mounting surface and electrically connected to the circuit board, and the circuit board and the bracket are stacked and installed in the middle frame, the installation surface faces away from the middle frame, the bracket is fixed on the installation surface, the camera module is assembled in the middle frame and electrically connected with the circuit board, and the camera module Passing through the bracket and being positioned on the middle frame through the bracket, the first speaker unit is accommodated in the escape groove in the thickness direction of the electronic device. 2.根据权利要求1所述的电子设备,其特征在于,所述电子设备包括第二扬声器单元和出音缝,所述中框包括安装槽,所述电路板包括避让孔,所述避让孔沿所述电路板的厚度方向贯穿所述电路板,所述安装槽沿着所述中框厚度方向贯穿所述中框,所述第二扬声器单元穿设于所述避让孔,且覆盖所述安装槽的开口,所述安装槽形成所述第二扬声器单元的前音腔,所述出音缝连通所述第二扬声器单元的前音腔与所述电子设备的外部。2. The electronic device according to claim 1, characterized in that the electronic device comprises a second speaker unit and a sound outlet, the middle frame comprises a mounting slot, the circuit board comprises an avoidance hole, and the avoidance hole penetrating through the circuit board along the thickness direction of the circuit board, the installation groove penetrating through the middle frame along the thickness direction of the middle frame, the second speaker unit passing through the escape hole, and covering the The opening of the installation groove, the installation groove forms the front sound chamber of the second speaker unit, and the sound outlet connects the front sound chamber of the second speaker unit with the outside of the electronic device. 3.根据权利要求2所述的电子设备,其特征在于,所述第二扬声器单元的体积小于所述第一扬声器单元的体积。3. The electronic device according to claim 2, wherein the volume of the second speaker unit is smaller than the volume of the first speaker unit. 4.根据权利要求3所述的电子设备,其特征在于,所述第一扬声器单元为高音单元或全频单元,所述第二扬声器单元为全频单元。4. The electronic device according to claim 3, wherein the first speaker unit is a tweeter unit or a full-range unit, and the second speaker unit is a full-range unit. 5.根据权利要求1-4任一项所述的电子设备,其特征在于,所述中框设有端部边框和设于所述端部边框的扬声孔,所述避让槽包括槽底壁,所述槽底壁上凹陷有功能槽,所述第一扬声器单元覆盖所述功能槽,以使所述功能槽形成所述第一扬声器的前音腔,所述扬声孔连通所述第一扬声器单元的前音腔和所述中框的外部。5. The electronic device according to any one of claims 1-4, wherein the middle frame is provided with an end frame and a speaker hole provided on the end frame, and the avoidance groove includes a groove bottom wall, a functional groove is recessed on the bottom wall of the groove, the first speaker unit covers the functional groove, so that the functional groove forms the front sound cavity of the first speaker, and the sound hole communicates with the The front sound cavity of the first speaker unit and the outside of the middle frame. 6.根据权利要求5所述的电子设备,其特征在于,所述中框包括凸块,所述凸块上设有连通槽,所述连通槽沿着所述中框厚度方向延伸,所述连通槽与所述扬声孔连通,所述支架包括通音孔,所述通音孔连通所述第一扬声器单元的前音腔和所述连通槽。6. The electronic device according to claim 5, wherein the middle frame comprises a protrusion, and the protrusion is provided with a communication groove, and the communication groove extends along the thickness direction of the middle frame, and the The communication slot communicates with the sound hole, the bracket includes a sound hole, and the sound hole communicates with the front sound cavity of the first speaker unit and the communication slot. 7.根据权利要求6所述的电子设备,其特征在于,所述支架包括支架本体和凸台,所述支架本体包括第一面和与所述第一面背向设置的第二面,所述凸台位于所述第二面,所述避让槽凹设于所述第一面;7. The electronic device according to claim 6, wherein the bracket comprises a bracket body and a boss, the bracket body includes a first surface and a second surface opposite to the first surface, the The boss is located on the second surface, and the avoidance groove is recessed on the first surface; 所述第一面上还凸设有安装凸起,所述通音孔包括依次连通的第一音孔、第二音孔和第三音孔,所述第一音孔沿着所述支架长度方向贯穿所述功能槽的槽侧壁,所述第二音孔设于所述凸台和所述安装凸起内部并沿着所述支架厚度方向延伸,所述第三音孔贯穿所述安装凸起,所述凸块与所述安装凸起对接,所述第三音孔与所述连通槽相对并连通。There is also a mounting protrusion protruding from the first surface, and the sound hole includes a first sound hole, a second sound hole and a third sound hole connected in sequence, and the first sound hole is along the length of the bracket The direction runs through the groove side wall of the functional groove, the second sound hole is arranged inside the boss and the installation protrusion and extends along the thickness direction of the bracket, and the third sound hole passes through the installation The protrusion is in contact with the installation protrusion, and the third sound hole is opposite to and communicated with the communication groove. 8.根据权利要求7所述的电子设备,其特征在于,所述安装凸起一端沿着所述支架宽度方向延伸有延伸部分,所述延伸部分位于所述安装凸起远离所述避让槽的一端,所述第三音孔由所述安装凸起端部延伸至所述延伸部分,且沿着所述延伸部分长度方向延伸;8. The electronic device according to claim 7, wherein one end of the installation protrusion has an extension part extending along the width direction of the bracket, and the extension part is located at the side of the installation protrusion away from the avoidance groove. At one end, the third sound hole extends from the end of the installation protrusion to the extension part, and extends along the length direction of the extension part; 所述连通槽由所述凸块的上表面向所述凸块内凹陷,所述连通槽的开口位于所述凸块的表面,且所述连通槽沿着所述中框宽度方向延伸,所述扬声孔贯穿所述连通槽的一个槽侧壁。The communication groove is recessed from the upper surface of the protrusion to the inside of the protrusion, the opening of the communication groove is located on the surface of the protrusion, and the communication groove extends along the width direction of the middle frame, so The sound hole runs through a side wall of the communicating groove. 9.根据权利要求7所述的电子设备,其特征在于,所述凸块包括第一斜面,所述第一斜面背向所述端部边框倾斜设置,所述扬声孔贯穿连通槽的槽底壁并与所述连通槽连通;9. The electronic device according to claim 7, wherein the protrusion includes a first slope, the first slope is inclined away from the end frame, and the sound hole runs through the groove of the communication groove The bottom wall communicates with the communication groove; 所述安装凸起设有延伸部分,所述延伸部分位于所述安装凸起远离所述避让槽的一端,所述延伸部分包括第二斜面,所述第二斜面背向所述安装凸起且相较于所述支架的第一面倾斜,所述第三音孔贯穿所述第二斜面,所述第一斜面和所述第二斜面相对接,所述第三音孔与所述连通槽相对并连通。The installation protrusion is provided with an extension part, the extension part is located at the end of the installation protrusion away from the escape groove, the extension part includes a second slope, the second slope faces away from the installation protrusion and Compared with the first surface of the bracket, the third sound hole runs through the second slope, the first slope and the second slope are in contact, and the third sound hole is connected to the communication groove relative and connected. 10.根据权利要求7所述的电子设备,其特征在于,所述中框包括中板和与所述中板连接的所述端部边框,所述中板包括第一表面和与所述第一表面背向设置的第二表面,所述凸块凸设于所述中板的第一表面并与所述端部边框连接;10. The electronic device according to claim 7, wherein the middle frame includes a middle board and the end frame connected to the middle board, the middle board includes a first surface and a connection with the second One surface faces away from the second surface, and the bump protrudes from the first surface of the middle plate and connects with the end frame; 所述连通槽包括第一连通槽和与所述第一连通槽连通的第二连通槽,所述第一连通槽的一个开口位于所述凸块背向所述中板的表面,所述第一连通槽的另一个开口位于所述第二连通槽的一个槽侧壁上;第二连通槽的开口位于所述中板的第二表面。The communication groove includes a first communication groove and a second communication groove connected with the first communication groove, an opening of the first communication groove is located on the surface of the protrusion facing away from the middle plate, the first communication groove The other opening of a communication groove is located on a groove side wall of the second communication groove; the opening of the second communication groove is located on the second surface of the middle plate. 11.根据权利要求10所述的电子设备,其特征在于,所述第一连通槽包括第一槽侧壁,所述第一槽侧壁相较于所述第一连通槽的开口倾斜,部分所述扬声孔贯穿第一槽侧壁;11. The electronic device according to claim 10, wherein the first communication groove comprises a first groove side wall, and the first groove side wall is inclined compared with the opening of the first communication groove, and partly The sound hole runs through the side wall of the first slot; 所述第二连通槽由所述第二表面向所述中板内凹陷形成,所述第二连通槽包括槽底壁和子槽,所述子槽由所述槽底壁向中板内部凹陷形成,所述子槽包括两个倾斜侧壁和连接两个所述倾斜侧壁的底壁,另一部分所述扬声孔贯穿所述底壁,所述第一连通槽的另一个开口位于一个所述倾斜侧壁上并朝向所述扬声孔。The second communication groove is formed by indenting the second surface into the middle plate, the second communication groove includes a groove bottom wall and a sub-groove, and the sub-groove is formed by indenting the groove bottom wall into the middle plate , the sub-trough includes two inclined side walls and a bottom wall connecting the two inclined side walls, another part of the sound hole runs through the bottom wall, and the other opening of the first communication slot is located at one of the on the sloped side wall and towards the sound hole. 12.根据权利要求9所述的电子设备,其特征在于,所述第三音孔的一个开口位于所述第二斜面上,所述第三音孔包括孔壁,所述孔壁的延伸方向与所述第三音孔的延伸方向相交,所述第二音孔的一个开口贯穿所述孔壁与所述第三音孔连通。12. The electronic device according to claim 9, wherein an opening of the third sound hole is located on the second slope, the third sound hole includes a hole wall, and the extension direction of the hole wall Intersecting with the extension direction of the third sound hole, an opening of the second sound hole passes through the hole wall and communicates with the third sound hole. 13.根据权利要求7所述的电子设备,其特征在于,所述电子设备包括摄像头模组和装饰件,所述装饰件包括收容槽,所述电路板还包括安装避让孔,所述安装避让孔沿着所述电路板厚度方向贯穿所述电路板,所述安装避让孔与所述第一扬声器单元间隔设置;13. The electronic device according to claim 7, characterized in that, the electronic device comprises a camera module and a decorative part, the decorative part comprises a receiving groove, the circuit board further comprises a mounting avoidance hole, and the mounting avoidance A hole runs through the circuit board along the thickness direction of the circuit board, and the installation avoidance hole is spaced apart from the first speaker unit; 所述摄像头模组穿设所述安装避让孔,所述装饰件装于中框上,所述摄像头模组和所述支架的凸台收容于所述收容槽内。The camera module passes through the installation avoidance hole, the decorative part is installed on the middle frame, and the camera module and the boss of the bracket are accommodated in the receiving groove. 14.根据权利要求2所述的电子设备,其特征在于,所述电子设备包括屏幕,所述中框包括中板、与中框连接的端部边框和出音槽,所述中板包括第一表面和与所述第一表面背向设置的第二表面,所述出音槽凹设于所述第二表面,所述出音槽包括凹设于所述端部边框的内侧面的缝隙和与所述安装槽连通的连接区,所述屏幕装于所述第二表面并覆盖所述连接区,所述屏幕与所述缝隙形成所述出音缝。14. The electronic device according to claim 2, wherein the electronic device includes a screen, the middle frame includes a middle plate, an end frame connected to the middle frame, and a sound outlet, and the middle plate includes a second A surface and a second surface facing away from the first surface, the sound outlet groove is recessed on the second surface, and the sound outlet groove includes a gap recessed on the inner surface of the end frame and a connection area communicating with the installation groove, the screen is mounted on the second surface and covers the connection area, and the screen and the slit form the sound output slot.
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