CN108037647A - Real-time leveling system and method for proximity lithography machine - Google Patents
Real-time leveling system and method for proximity lithography machine Download PDFInfo
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
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- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
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- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
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Abstract
本发明公开了一种接近式光刻机实时调平系统及调平方法，主要基于白光干涉测距的原理，调平控制板定时采集3组光谱仪中的光谱数据，计算出3组间隙值，接着，根据预先建立的坐标系统，计算掩模与基片X‑Y方向的偏摆角，最后，调平系统以计算的偏摆角为输入，控制基片下方的运动台，实时调整基片姿态，保证基片与掩模间的平整度符合曝光要求。该调平方法对接近式纳米光刻及相关领域的实时调平方法具有重要的意义，不但提高了光刻机的调平效率，而且增加了光刻机的有效产能。
The invention discloses a real-time leveling system and leveling method of a proximity lithography machine, which is mainly based on the principle of white light interference distance measurement. The leveling control board regularly collects spectral data in three groups of spectrometers, and calculates three groups of gap values. Then, calculate the deflection angle between the mask and the substrate in the X-Y direction according to the pre-established coordinate system. Finally, the leveling system uses the calculated deflection angle as input to control the moving stage under the substrate to adjust the substrate in real time. posture, to ensure that the flatness between the substrate and the mask meets the exposure requirements. The leveling method is of great significance to the real-time leveling method of proximity nanolithography and related fields, which not only improves the leveling efficiency of the lithography machine, but also increases the effective production capacity of the lithography machine.
Description
技术领域technical field
本发明属于微细结构制作设备中光刻机的调平技术领域，具体涉及一种接近式光刻机的实时调平系统及调平方法。The invention belongs to the technical field of leveling a photolithography machine in microstructure manufacturing equipment, and in particular relates to a real-time leveling system and a leveling method of a proximity photolithography machine.
背景技术Background technique
光学光刻一直作为大规模集成电路工业制造技术的基础，随着高集成度电路以及相关器件的研发，IC特征尺寸越来越小，高分辨率光刻技术得到了长足的发展。由于传统光学系统无法传输倏逝波，因此其分辨力受限于衍射极限，只能达到入射光波长的一半。SP光刻技术由于激发倏逝波，从而达到了实现突破衍射极限的目的。但是，倏逝波随着掩模与样片间的工作距而急速减弱，因而，必须要保证样片处于SP倏逝波工作范围内。如果掩模与样片的面平行度不满足要求将直接影响特性尺寸，影响曝光图形的一致性，精密调平技术对于SP等接近式光刻装置核心指标的实现具有非常重要的作用。Optical lithography has always been the basis of large-scale integrated circuit industrial manufacturing technology. With the development of highly integrated circuits and related devices, IC feature sizes are getting smaller and smaller, and high-resolution lithography technology has been greatly developed. Since conventional optical systems cannot transmit evanescent waves, their resolution is limited by the diffraction limit to half the wavelength of the incident light. SP lithography achieves the goal of breaking through the diffraction limit by exciting evanescent waves. However, the evanescent wave weakens rapidly with the working distance between the mask and the sample. Therefore, it is necessary to ensure that the sample is within the working range of the SP evanescent wave. If the surface parallelism between the mask and the sample does not meet the requirements, it will directly affect the characteristic size and the consistency of the exposure pattern. Precision leveling technology plays a very important role in the realization of the core indicators of SP and other proximity lithography devices.
发明内容Contents of the invention
本发明要解决的技术问题是：克服现有技术的不足，提出一种基于白光干涉绝对间隙测量的实时调平系统及调平方法，通过光谱仪采集白光光源入射到掩模下底面与基片上表面反射的白光干涉条纹，计算掩模与基片上的3个点的间隙数据，计算机根据3个点的间隙值，计算基片与掩模的偏差角度，调平系统根据计算的偏差角，控制基片下方的运动台，实现基片与掩模的平行度调整。The technical problem to be solved by the present invention is: to overcome the deficiencies of the prior art, to propose a real-time leveling system and leveling method based on white light interference absolute gap measurement, and to collect the white light source incident on the lower bottom surface of the mask and the upper surface of the substrate through a spectrometer Reflected white light interference fringes, calculate the gap data of the three points on the mask and the substrate, the computer calculates the deviation angle between the substrate and the mask according to the gap value of the three points, and the leveling system controls the substrate according to the calculated deviation angle. The moving table under the film realizes the parallelism adjustment between the substrate and the mask.
本发明所采用的技术方案是：一种接近式光刻机实时调平系统，包括工件运动台，基片，预留检测窗口的掩模，准直镜筒，准直透镜，光纤耦合单元，半透半反镜组，光源准直透镜，白光光源，投影光阑，光谱仪，调平控制板，准直镜架，真空吸附盘和计算机；光源经光源准直透成为平行光束，经过半透半反镜照射后耦合后经光纤传输，经掩模上方的准直镜准直为平行光，垂直照射到掩模的预留检测口上，从掩模下表面与基片上表面的反射光相互发生干涉，干涉信号经原光路返回，最后进入光谱仪；控制板定时通过USB传输线采集光谱仪的光谱数据，信号处理模块对光谱信号数字处理后，间隙检测模块分别计算各检测点的掩模与基片间隙，控制模块根据3组间隙值，计算基片X-Y方向的偏角，运动控制模块控制基片下方的运动台，实时调平基片，保证曝光时基片的平整性要求，调平控制板通过USB口同计算机通信，计算机可以对控制板进行初始化配置以及相关控制命令的交互通信。The technical solution adopted in the present invention is: a real-time leveling system of a proximity lithography machine, including a workpiece moving table, a substrate, a mask for a reserved detection window, a collimating lens barrel, a collimating lens, an optical fiber coupling unit, Semi-transparent mirror group, light source collimating lens, white light source, projection diaphragm, spectrometer, leveling control board, collimating mirror frame, vacuum adsorption disk and computer; After the half-mirror is irradiated, it is coupled and then transmitted through the optical fiber. It is collimated into parallel light by the collimator above the mask, and it is irradiated vertically to the reserved detection port of the mask. The reflected light from the lower surface of the mask and the upper surface of the substrate interacts with each other. Interference, the interference signal returns through the original optical path, and finally enters the spectrometer; the control board regularly collects the spectral data of the spectrometer through the USB transmission line, and after the signal processing module digitally processes the spectral signal, the gap detection module calculates the gap between the mask and the substrate at each detection point , the control module calculates the deflection angle of the substrate in the X-Y direction according to the 3 sets of gap values, the motion control module controls the motion table below the substrate, and real-time leveling the substrate to ensure the flatness requirements of the substrate during exposure, the leveling control board passes The USB port communicates with the computer, and the computer can perform initial configuration on the control board and interactive communication of related control commands.
一种接近式光刻机实时调平方法，利用上述的接近式光刻机的实时调平系统，该方法的步骤如下：A method for real-time leveling of a proximity lithography machine, using the above-mentioned real-time leveling system of a proximity lithography machine, the steps of the method are as follows:
步骤1、计算机对控制板进行初始化配置，并下发调平控制精度、采样时间等控制参数，为后续的调平控制做好准备；Step 1. The computer initializes the configuration of the control board, and issues control parameters such as leveling control accuracy and sampling time to prepare for the subsequent leveling control;
步骤2、光源经准直透镜成为平行光束，经过半透半反镜组经光纤照射到准直透镜上，经准直镜成为平行光垂直照射到掩模预留孔上，光进一步照射到掩模下表面与基片上表面，经掩模下表面的反射光与基片上表面反射的白光发生干涉，干涉信号经准直透镜耦合进入光纤，经半透半反镜透射后经成像透镜耦合进入光谱仪；Step 2. The light source becomes a parallel light beam through the collimator lens, and irradiates the collimator lens through the half-transparent and half-reflective mirror group through the optical fiber. The collimator becomes parallel light and irradiates the reserved hole of the mask vertically, and the light further irradiates the mask The lower surface of the mold and the upper surface of the substrate, the reflected light from the lower surface of the mask interferes with the white light reflected from the upper surface of the substrate, the interference signal is coupled into the optical fiber through the collimator lens, transmitted through the half-transparent mirror, and then coupled into the spectrometer through the imaging lens ;
步骤3、调平控制板定时采集3组光谱仪的光谱数据，信号处理模块对光谱信号进行相应的处理，然后间隙检测模块计算出3组间隙值；Step 3. The leveling control board regularly collects the spectral data of 3 groups of spectrometers, the signal processing module performs corresponding processing on the spectral signals, and then the gap detection module calculates 3 groups of gap values;
步骤4、最后根据公式：θx＝Zm2/d-Zm3/d和分别计算基片相对于掩模的X-Y方向的偏摆角度，然后控制基片下方的驱动器，调整基片的姿态，使基片与掩模的平行度符合曝光工艺的要求。Step 4, finally according to the formula: θ x = Z m2 /dZ m3 /d and Calculate the deflection angle of the substrate relative to the XY direction of the mask, and then control the driver below the substrate to adjust the posture of the substrate so that the parallelism between the substrate and the mask meets the requirements of the exposure process.
其中，所述步骤2中的多层膜结构的白光干涉光谱信号检测，所述光源为白光光源。Wherein, the white light interference spectrum signal detection of the multi-layer film structure in the step 2, the light source is a white light source.
其中，所述步骤3中的通过3组间隙值计算基片偏摆角度的方法。Wherein, the method of calculating the substrate deflection angle by using three sets of gap values in the step 3.
其中，所述步骤4中根据计算出的基片的偏摆角度，不限于调整基片，也可以调整掩模，最终实现掩模与基片的精密调平方法。Wherein, according to the calculated deflection angle of the substrate in the step 4, not limited to adjusting the substrate, the mask can also be adjusted, and finally realize the precise leveling method of the mask and the substrate.
本发明的原理在于：Principle of the present invention is:
本发明公开了基于白光干涉测距的光刻机实时调平系统及调平方法，该方法首先是在透明基底上通过纳米加工方法得到预留观察孔的掩模；通过平坦化工艺实现基片面层结构的平坦化；然后使用白光作为光源，光谱仪采集掩模、空气隙与基片间的白光干涉信号，控制系统采集光谱信号并通过干涉信号匹配的方法，计算出掩模与基片之间的间隙；然后，调平系统根据布置在掩模上方的3组间隙值，计算出基片与掩模之间的偏角，最后调平系统通过基片台下执行机构，实现掩模或基片的姿态控制。本发明采用白光关涉测距方法，从而实现基片与掩模的调平操作，可满足光刻机掩模与基片的调平需求。The invention discloses a real-time leveling system and a leveling method of a lithography machine based on white light interference ranging. The method first obtains a mask with a reserved observation hole on a transparent substrate through a nano-processing method; The flattening of the layer structure; then using white light as the light source, the spectrometer collects the white light interference signal between the mask, the air gap and the substrate, and the control system collects the spectral signal and calculates the distance between the mask and the substrate by matching the interference signal. Then, the leveling system calculates the deflection angle between the substrate and the mask according to the three sets of gap values arranged above the mask, and finally the leveling system realizes the mask or substrate through the actuator under the substrate stage. Piece gesture control. The invention adopts the white light correlation distance measuring method, thereby realizing the leveling operation of the substrate and the mask, and meeting the leveling requirements of the mask and the substrate of the lithography machine.
本发明与现有的技术相比具有以下优点：Compared with the prior art, the present invention has the following advantages:
1、传统的间隙测量或者投影光刻中的检焦技术主要采用狭缝投影测量等方法。主要在掩模上设置狭缝，光路通过基片底面的反射，将基片垂直位移量转化为探测器像面上个狭缝光斑的平移，然后该方法主要应用于早期的较低分辨力光刻，精度提高的程度有限。1. The traditional gap measurement or focus detection technology in projection lithography mainly uses methods such as slit projection measurement. Slits are mainly set on the mask, and the optical path passes through the reflection of the bottom surface of the substrate, and the vertical displacement of the substrate is converted into the translation of a slit spot on the image surface of the detector, and then this method is mainly applied to early low-resolution light engraved, the degree of accuracy improvement is limited.
2、本发明将调平控制算法集成在调平控制板中，充分利用可编程逻辑器件的高速并行特性，有效的提高了光刻机工作中的实时调平效率，提高了光刻机工作效率。2. The present invention integrates the leveling control algorithm into the leveling control board, makes full use of the high-speed parallel characteristics of programmable logic devices, effectively improves the real-time leveling efficiency in the work of the lithography machine, and improves the working efficiency of the lithography machine .
3、本发明将大量的数据处理过程放在调平控制板处理，计算机只进行初始化设置等相关的简单操作，减轻了上位计算机的负荷。3. In the present invention, a large amount of data processing is placed on the leveling control panel, and the computer only performs related simple operations such as initialization settings, which reduces the load on the host computer.
附图说明Description of drawings
图1为本发明的接近式光刻机的实时调平系统结构原理图，其中，1样片运动台，2为基片，3为预留检测口的掩模，4准直镜筒，5为准直透镜，6为光纤耦合单元，7为半透半反镜组，8为光源准直镜，9为白光光源，10为成像投影，11为光谱仪，12为调平控制板，13为计算机，15为准直镜架，16为真空吸附装置。Fig. 1 is a schematic structural diagram of the real-time leveling system of the proximity lithography machine of the present invention, wherein, 1 is a sample motion table, 2 is a substrate, 3 is a mask for a reserved detection port, 4 is a collimating lens barrel, and 5 is Collimation lens, 6 is the fiber coupling unit, 7 is the semi-transparent mirror group, 8 is the light source collimator, 9 is the white light source, 10 is the imaging projection, 11 is the spectrometer, 12 is the leveling control board, 13 is the computer , 15 is a collimating mirror frame, and 16 is a vacuum adsorption device.
图2为光刻机调平装置简化图，其中，图2(a)为基片相对于掩模坐标系偏转角示意图，图2(b)为基片绕Y轴偏转角度计算示意图。Figure 2 is a simplified diagram of a leveling device for a lithography machine, wherein Figure 2(a) is a schematic diagram of the deflection angle of the substrate relative to the mask coordinate system, and Figure 2(b) is a schematic diagram of the calculation of the deflection angle of the substrate around the Y-axis.
图3为控制板的调平控制流程图。Figure 3 is a flow chart of the leveling control of the control panel.
具体实施方式Detailed ways
下面结合附图及具体实施方式详细介绍本发明。但本发明的保护范围并不仅限于以下实例，应包含权利要求书中的全部内容。The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. But the scope of protection of the present invention is not limited to the following examples, and should include all content in the claims.
为了更好地理解本发明的技术方案，以下结合附图做进一步的详细描述。如图1所示的一种适用接近式光刻机的实时调平系统，包括1样片运动台，2为基片，3为预留检测口的掩模，4准直镜筒，5为准直透镜，6为光纤耦合单元，7为半透半反镜组，8为光源准直镜，9为白光光源，10为成像投影，11为光谱仪，12为调平控制板，13为计算机，15为准直镜架，16为真空吸附装置。由白光光源9经准直透镜成为平行光束，经过半透半反镜照射后耦合后经光纤传输，经掩模上方的准直透镜5准直为平行光，垂直照射到掩模的预留检测口上，从掩模下表面与基片上表面的反射光相互发生干涉，干涉信号经相反的光路，最后进入光谱仪；控制板定时通过USB传输线采集光谱数据，光谱数据经信号处理后，计算出掩模与基片之间的间隙，进而计算出基片的偏转角，通过控制基片下方的驱动器，实时调平基片台，保证曝光时基片与掩模的平整度符合要求。In order to better understand the technical solution of the present invention, a further detailed description will be made below in conjunction with the accompanying drawings. As shown in Figure 1, a real-time leveling system suitable for proximity lithography machines, including 1 sample motion table, 2 is the substrate, 3 is the mask for the reserved detection port, 4 is the collimator barrel, and 5 is the standard Straight lens, 6 is an optical fiber coupling unit, 7 is a half-transparent mirror group, 8 is a light source collimator, 9 is a white light source, 10 is an imaging projection, 11 is a spectrometer, 12 is a leveling control board, 13 is a computer, 15 is a collimating mirror frame, and 16 is a vacuum adsorption device. The white light source 9 becomes a parallel beam through the collimator lens, and after being irradiated by the half-transparent mirror, it is coupled and then transmitted through the optical fiber. It is collimated into parallel light by the collimator lens 5 above the mask, and is irradiated vertically to the reserved detection area of the mask. On the mouth, the reflected light from the lower surface of the mask and the upper surface of the substrate interferes with each other, and the interference signal passes through the opposite optical path, and finally enters the spectrometer; the control board regularly collects spectral data through the USB transmission line, and after signal processing, the spectral data is calculated. The gap between the substrate and the substrate, and then calculate the deflection angle of the substrate. By controlling the driver below the substrate, the substrate stage is leveled in real time to ensure that the flatness of the substrate and the mask meets the requirements during exposure.
图2为光刻机调平装置简化图，其中，图2(a)为基片相对于掩模坐标系偏转角示意图，图2(b)为基片绕Y轴偏转角度计算示意图。其中三个检测点之间的边长相等，以掩模台的质心为中心，建立如图2所示的坐标系统，假定三组检测值分别为Zm1，Zm2，Zm3。根据间隙值，可以计算出基片偏离掩模平行位置的绕X方向的偏角θx和绕Y方向的偏角θy。Figure 2 is a simplified diagram of a leveling device for a lithography machine, wherein Figure 2(a) is a schematic diagram of the deflection angle of the substrate relative to the mask coordinate system, and Figure 2(b) is a schematic diagram of the calculation of the deflection angle of the substrate around the Y-axis. The side lengths between the three detection points are equal, and the coordinate system shown in Figure 2 is established with the center of mass of the mask table as the center, assuming that the three sets of detection values are Z m1 , Z m2 , and Z m3 . According to the gap value, the off-angle θ x around the X direction and the off-angle θ y around the Y direction for the substrate to deviate from the parallel position of the mask can be calculated.
实施例1，一种适用于投影光刻机的实时调平系统的调平方法，具体步骤如下：Embodiment 1, a leveling method suitable for a real-time leveling system of a projection lithography machine, the specific steps are as follows:
步骤1、计算机对控制板进行初始化配置，并下发调平控制精度、采样时间等控制参数，为后续调平控制做好准备；Step 1. The computer initializes the configuration of the control board, and issues control parameters such as leveling control accuracy and sampling time to prepare for the subsequent leveling control;
步骤2、白光光源9经准光源直透镜8成为平行光束，经过半透半反镜组7经光纤照射到准直透镜5上，经准直透镜5成为平行光垂直照射到掩模预留孔上，并进一步照射到掩模下表面与基片上表面，经掩模下表面的反射光与基片上表面反射的光发生干涉，干涉信号经过准直透镜5进入光纤，经半透半反镜透射后经成像投影10进入光谱仪11；Step 2. The white light source 9 passes through the collimating light source straight lens 8 to become a parallel light beam, passes through the half-transparent mirror group 7 and irradiates the collimating lens 5 through the optical fiber, and then passes through the collimating lens 5 to become parallel light and irradiates vertically to the reserved hole of the mask , and further irradiated to the lower surface of the mask and the upper surface of the substrate, the reflected light from the lower surface of the mask interferes with the light reflected from the upper surface of the substrate, and the interference signal enters the optical fiber through the collimator lens 5 and is transmitted through the half-transparent mirror Then enter the spectrometer 11 through the imaging projection 10;
步骤3、调平控制板定时采集3组光谱仪的光谱信息，并对光谱信号进行相应的处理，然后计算得出3组间隙值：Zm1，Zm2，Zm3；Step 3. The leveling control board regularly collects the spectral information of 3 groups of spectrometers, and performs corresponding processing on the spectral signals, and then calculates 3 groups of gap values: Z m1 , Z m2 , Z m3 ;
步骤4、最后根据公式：θx＝Zm2/d-Zm3/d和计算出基片相对于掩模的X、Y方向的偏摆角度θx和θy，然后控制基片下方的驱动器，调整基片的姿态，使基片的平整度符合曝光工艺的要求。Step 4, finally according to the formula: θ x = Z m2 /dZ m3 /d and Calculate the deflection angles θ x and θ y of the substrate relative to the X and Y directions of the mask, and then control the driver under the substrate to adjust the posture of the substrate so that the flatness of the substrate meets the requirements of the exposure process.
本发明所述的适用接近式光刻机的实时调平系统，检测精度高，实时性好，结构简洁，能有效的提高光刻工艺的质量与效率。The real-time leveling system suitable for proximity photolithography machines described in the present invention has high detection accuracy, good real-time performance, simple structure, and can effectively improve the quality and efficiency of photolithography processes.
Claims (5)
- A kind of 1. Proximity stepper real-time leveling system, it is characterised in that：Including print sports platform (1), substrate (2), is reserved The mask (3) of detection window, collimation lens barrel (4), collimation lens (5), optic fiber coupling unit (6), semi-transparent semi-reflecting microscope group (7), light Source collimation lens (8), white light source (9), projection (10), spectrometer (11), leveling control panel (12), collimates mirror holder (15), vacuum absorption device (16) and computer (13)；White light source (9) becomes collimated light beam through light source collimating mirror (8), passes through Transmitted after being coupled after semi-transparent semi-reflecting lens irradiation through optical fiber, it is directional light to be collimated through the collimation lens (5) above mask, vertical irradiation Onto the reserved detection mouth of mask, interfered with each other from the reflected light of mask lower surface and substrate upper surface, interference signal warp Original optical path returns, and finally enters spectrometer；Control panel timing gathers the spectroscopic data of spectrometer by USB transmission line, at signal After module is managed to spectral signal digital processing, gap detection module calculates the mask and substrate gap of each test point respectively, control Module calculates the drift angle in substrate X-Y directions according to 3 groups of gap widths, the sports platform below moving control module for controlling substrate, in real time Leveling substrate, ensures the planarization requirement of substrate during exposure, and leveling control panel is communicated by the same computer of USB port (13), calculated Machine can carry out control panel the interactive communication of initial configuration and concerned control command.
- 2. a kind of Proximity stepper real-time leveling method, utilizes the Proximity stepper real-time leveling system described in claim 1 System, it is characterised in that：This method step is as follows：Step 1, computer carry out initial configuration to control panel, and issue the control parameters such as leveling control accuracy, sampling time, It is ready for follow-up leveling control；Step 2, white light source (9) become collimated light beam through light source collimating mirror (8), are shone by semi-transparent semi-reflecting microscope group (7) through optical fiber It is mapped on collimation lens (5), collimated lens (5) become directional light vertical irradiation to mask preformed hole, and light further irradiates To mask lower surface and substrate upper surface, the white light that the reflected light through mask lower surface is reflected with substrate upper surface interferes, The collimated lens of interference signal (5) are coupled into optical fiber, and light is coupled into through projection (10) after semi-transparent semi-reflecting lens transmit Spectrometer；The spectroscopic data of step 3, leveling control panel 3 groups of spectrometers of timing acquiring, signal processing module carry out phase to spectral signal The processing answered, then gap detection module calculate 3 groups of gap widths；Step 4, finally according to formula：θx=Zm2/d-Zm3/ d andSubstrate is calculated respectively Relative to the deflection angle in the X-Y directions of mask, the driver below substrate is then controlled, the posture of substrate is adjusted, makes substrate Meet the requirement of exposure technology with the depth of parallelism of mask.
- 3. leveling method according to claim 2, it is characterised in that：The white light of multi-layer film structure in the step 2 is done Spectral signal detection is related to, the light source is white light source.
- 4. leveling method according to claim 2, it is characterised in that：In the step 3 base is calculated by 3 groups of gap widths The method of piece deflection angle.
- 5. leveling method according to claim 2, it is characterised in that：According to the inclined of the substrate calculated in the step 4 Swinging, is not limited to adjustment substrate, can also adjust mask, finally realize the accurate leveling method of mask and substrate.
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