CN107995832A - 一种密集散热电路板 - Google Patents
一种密集散热电路板 Download PDFInfo
- Publication number
- CN107995832A CN107995832A CN201711303593.9A CN201711303593A CN107995832A CN 107995832 A CN107995832 A CN 107995832A CN 201711303593 A CN201711303593 A CN 201711303593A CN 107995832 A CN107995832 A CN 107995832A
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- CN
- China
- Prior art keywords
- circuit board
- heat
- heat dissipation
- hose
- liquid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title abstract description 43
- 239000007788 liquid Substances 0.000 claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims description 17
- 239000012530 fluid Substances 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000007664 blowing Methods 0.000 description 4
- 206010028347 Muscle twitching Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000036461 convulsion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711303593.9A CN107995832A (zh) | 2017-12-11 | 2017-12-11 | 一种密集散热电路板 |
Applications Claiming Priority (1)
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CN201711303593.9A CN107995832A (zh) | 2017-12-11 | 2017-12-11 | 一种密集散热电路板 |
Publications (1)
Publication Number | Publication Date |
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CN107995832A true CN107995832A (zh) | 2018-05-04 |
Family
ID=62037106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711303593.9A Pending CN107995832A (zh) | 2017-12-11 | 2017-12-11 | 一种密集散热电路板 |
Country Status (1)
Country | Link |
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CN (1) | CN107995832A (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108762459A (zh) * | 2018-05-31 | 2018-11-06 | 郑州秉茂达电子科技有限公司 | 一种计算机电源 |
CN111587028A (zh) * | 2019-02-18 | 2020-08-25 | 成都立心天地电子科技有限公司 | 一种数字电路控制系统 |
CN111800938A (zh) * | 2020-07-29 | 2020-10-20 | 东莞权利得工业设计有限公司 | 一种具有散热结构的pcb基板及其工作方法 |
CN111902033A (zh) * | 2020-09-09 | 2020-11-06 | 南京工业职业技术大学 | 一种带有电路板散热结构的无人机 |
CN115182888A (zh) * | 2022-08-15 | 2022-10-14 | 常州市东南电器电机有限公司 | 一种附带隔水和减震结构的电子水泵 |
CN115580979A (zh) * | 2022-12-08 | 2023-01-06 | 扬州创客自动化设备有限公司 | 一种电子元器件测试用散热设备 |
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US20040190250A1 (en) * | 2003-03-31 | 2004-09-30 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
CN1980562A (zh) * | 2006-12-07 | 2007-06-13 | 华南理工大学 | 一种液体冷却式电子器件散热器 |
US20080024981A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
US20080024978A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
CN101203115A (zh) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | 液冷散热系统及其吸热元件 |
CN101336061A (zh) * | 2007-06-29 | 2008-12-31 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101415310A (zh) * | 2007-10-19 | 2009-04-22 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN201601938U (zh) * | 2009-12-30 | 2010-10-06 | 上海研祥智能科技有限公司 | 一种散热装置及其电路板 |
US20120033385A1 (en) * | 2009-04-16 | 2012-02-09 | Molex Incorporated | Cooling device, electronic substrate and electronic device |
US20130329367A1 (en) * | 2012-06-07 | 2013-12-12 | Askey Computer Corp. | Electronic device having heat-dissipating structure |
CN203537659U (zh) * | 2013-09-30 | 2014-04-09 | 虞小生 | 具有水冷功能的电路板 |
US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
CN203871967U (zh) * | 2014-04-05 | 2014-10-08 | 湖北华恩机车科技有限公司 | 一种无刷直流电机的散热结构 |
CN104144591A (zh) * | 2013-05-09 | 2014-11-12 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及设有该散热装置的服务器机柜 |
CN204065990U (zh) * | 2014-07-03 | 2014-12-31 | 佳木斯大学 | 散热器 |
CN204794749U (zh) * | 2015-07-21 | 2015-11-18 | 开县正品诚赢科技发展有限责任公司 | 一种逆变电源 |
CN205303618U (zh) * | 2015-11-28 | 2016-06-08 | 重庆永重重工有限公司 | 一种电动车电池模块的散热装置 |
US20160309618A1 (en) * | 2015-04-17 | 2016-10-20 | Cooler Master Co., Ltd. | Liquid cooling heat dissipation structure and method of manufacturing the same |
CN205720980U (zh) * | 2016-04-29 | 2016-11-23 | 深圳市晶联讯电子有限公司 | 一种液晶显示屏散热系统 |
US20170042066A1 (en) * | 2015-08-05 | 2017-02-09 | Tdk Corporation | Electronic circuit device and heat sink structure for the same |
CN206517668U (zh) * | 2017-02-21 | 2017-09-22 | 广州市宏亿电子有限公司 | 一种垂直安装在电路板上的散热结构 |
CN207604118U (zh) * | 2017-12-11 | 2018-07-10 | 南京邮电大学 | 一种密集散热电路板 |
-
2017
- 2017-12-11 CN CN201711303593.9A patent/CN107995832A/zh active Pending
Patent Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040190250A1 (en) * | 2003-03-31 | 2004-09-30 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
US20080024981A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
US20080024978A1 (en) * | 2006-07-25 | 2008-01-31 | Fujitsu Limited | Electronic apparatus |
CN1980562A (zh) * | 2006-12-07 | 2007-06-13 | 华南理工大学 | 一种液体冷却式电子器件散热器 |
CN101203115A (zh) * | 2006-12-13 | 2008-06-18 | 富准精密工业(深圳)有限公司 | 液冷散热系统及其吸热元件 |
CN101336061A (zh) * | 2007-06-29 | 2008-12-31 | 富准精密工业(深圳)有限公司 | 散热装置 |
CN101415310A (zh) * | 2007-10-19 | 2009-04-22 | 富准精密工业(深圳)有限公司 | 散热装置 |
US20120033385A1 (en) * | 2009-04-16 | 2012-02-09 | Molex Incorporated | Cooling device, electronic substrate and electronic device |
CN201601938U (zh) * | 2009-12-30 | 2010-10-06 | 上海研祥智能科技有限公司 | 一种散热装置及其电路板 |
US20140118954A1 (en) * | 2011-06-28 | 2014-05-01 | Telefonaktiebolaget L M Ericsson (Publ) | Electronic device with heat-dissipating structure |
US20130329367A1 (en) * | 2012-06-07 | 2013-12-12 | Askey Computer Corp. | Electronic device having heat-dissipating structure |
CN104144591A (zh) * | 2013-05-09 | 2014-11-12 | 鸿富锦精密工业(深圳)有限公司 | 散热装置及设有该散热装置的服务器机柜 |
CN203537659U (zh) * | 2013-09-30 | 2014-04-09 | 虞小生 | 具有水冷功能的电路板 |
CN203871967U (zh) * | 2014-04-05 | 2014-10-08 | 湖北华恩机车科技有限公司 | 一种无刷直流电机的散热结构 |
CN204065990U (zh) * | 2014-07-03 | 2014-12-31 | 佳木斯大学 | 散热器 |
US20160309618A1 (en) * | 2015-04-17 | 2016-10-20 | Cooler Master Co., Ltd. | Liquid cooling heat dissipation structure and method of manufacturing the same |
CN204794749U (zh) * | 2015-07-21 | 2015-11-18 | 开县正品诚赢科技发展有限责任公司 | 一种逆变电源 |
US20170042066A1 (en) * | 2015-08-05 | 2017-02-09 | Tdk Corporation | Electronic circuit device and heat sink structure for the same |
CN205303618U (zh) * | 2015-11-28 | 2016-06-08 | 重庆永重重工有限公司 | 一种电动车电池模块的散热装置 |
CN205720980U (zh) * | 2016-04-29 | 2016-11-23 | 深圳市晶联讯电子有限公司 | 一种液晶显示屏散热系统 |
CN206517668U (zh) * | 2017-02-21 | 2017-09-22 | 广州市宏亿电子有限公司 | 一种垂直安装在电路板上的散热结构 |
CN207604118U (zh) * | 2017-12-11 | 2018-07-10 | 南京邮电大学 | 一种密集散热电路板 |
Non-Patent Citations (2)
Title |
---|
何伟: "《电子设备散热特性分析与仿真方法研究》", 《中国优秀硕士学位论文全文数据库 信息科技辑》, no. 01, pages 135 - 1 * |
李庆友;王文;周根明;: "电子元器件散热方法研究", 电子器件, no. 04, pages 93941 * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108762459A (zh) * | 2018-05-31 | 2018-11-06 | 郑州秉茂达电子科技有限公司 | 一种计算机电源 |
CN111587028A (zh) * | 2019-02-18 | 2020-08-25 | 成都立心天地电子科技有限公司 | 一种数字电路控制系统 |
CN111587028B (zh) * | 2019-02-18 | 2024-03-15 | 湖南硕特电子科技有限公司 | 一种数字电路控制系统 |
CN111800938A (zh) * | 2020-07-29 | 2020-10-20 | 东莞权利得工业设计有限公司 | 一种具有散热结构的pcb基板及其工作方法 |
CN111902033A (zh) * | 2020-09-09 | 2020-11-06 | 南京工业职业技术大学 | 一种带有电路板散热结构的无人机 |
CN111902033B (zh) * | 2020-09-09 | 2024-08-20 | 南京工业职业技术大学 | 一种带有电路板散热结构的无人机 |
CN115182888A (zh) * | 2022-08-15 | 2022-10-14 | 常州市东南电器电机有限公司 | 一种附带隔水和减震结构的电子水泵 |
CN115580979A (zh) * | 2022-12-08 | 2023-01-06 | 扬州创客自动化设备有限公司 | 一种电子元器件测试用散热设备 |
CN115580979B (zh) * | 2022-12-08 | 2023-03-24 | 扬州创客自动化设备有限公司 | 一种电子元器件测试用散热设备 |
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Address after: No. 9 Wenyuan Road, Yadong New District, Nanjing, Jiangsu Province, 210012 Applicant after: NANJING University OF POSTS AND TELECOMMUNICATIONS Applicant after: NANJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS NANTONG INSTITUTE Co.,Ltd. Address before: 210023 9 Wen Yuan Road, Ya Dong new town, Qixia District, Nanjing, Jiangsu. Applicant before: NANJING University OF POSTS AND TELECOMMUNICATIONS Applicant before: NANJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS NANTONG INSTITUTE Co.,Ltd. |
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RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20180504 |