CN107995832A - A dense heat dissipation circuit board - Google Patents

Abstract

The invention relates to the technical field of circuit board heat dissipation, in particular to a dense heat dissipation circuit board, including a circuit board case, electronic components and a circuit board; and a circulation liquid heat dissipation mechanism arranged in the circuit board case; the circulation liquid heat dissipation mechanism includes Liquid storage tank, micro water pump, hose, heat conduction plate and substrate; the heat conduction plate is arranged along the length direction of the circuit board shell, and the heat conduction plate is evenly arranged with several through holes on the end face adjacent to the micro water pump; the liquid storage tank is arranged on the heat conduction plate One end of the hose; after the hose passes through all the through holes, one end communicates with the water outlet of the liquid storage tank; the micro water pump is located at the water inlet of the liquid storage tank, the liquid outlet of the micro water pump can communicate with the liquid storage tank, and the micro water pump The liquid inlet can communicate with the other end of the hose; the substrate is set on the surface of the heat conduction plate, and there are several grooves on the substrate, and the other side of the electronic components is installed in the grooves, which can realize the electronic components on the circuit board Dissipate heat evenly.

Description

A dense heat dissipation circuit board

technical field

The invention relates to the technical field of circuit board heat dissipation, in particular to a dense heat dissipation circuit board.

Background technique

For electronic equipment, a certain amount of heat will be generated during work, which will cause the internal temperature of the equipment to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the device will fail due to overheating. The reliability of electronic equipment The performance will drop, so it is very important to heat the circuit board well.

In the heat dissipation of existing circuit boards, fans are generally used to blow heat directly to the heat dissipation plate. Due to the different degrees of heat generated by the electronic components on the circuit board, the heat dissipation is uneven, resulting in damage to electronic components, especially electronic components on the circuit board. It is more difficult to achieve the heat dissipation effect when there are many components.

Contents of the invention

The invention provides a dense heat dissipation circuit board, which can realize uniform heat dissipation of the electronic components on the circuit board.

In order to achieve the above-mentioned technical purpose, the technical solution adopted by the present invention is a dense heat dissipation circuit board, including a circuit board shell, electronic components and a circuit board; one side of the electronic components is mounted on the circuit board, and the circuit board is arranged on the circuit board shell In the body; it also includes a circulating liquid heat dissipation mechanism arranged in the circuit board shell; the circulating liquid heat dissipation mechanism includes a liquid storage tank, a micro water pump, a hose, a heat conduction plate and a substrate; the liquid storage tank is arranged at one end of the heat conduction plate; the heat conduction plate Arranged along the length direction of the circuit board shell, the heat conduction plate is evenly arranged with several through holes on the end face adjacent to the micro water pump; after the hose passes through all the through holes, one end communicates with the water outlet of the liquid storage tank; the micro water pump is located in the storage tank At the water inlet of the liquid tank, the liquid outlet of the micro-water pump can be connected with the liquid storage tank, and the liquid inlet of the micro-water pump can be connected with the other end of the hose; The groove, the other side of the electronic component is installed in the groove.

As an improved technical solution of the present invention, a heat dissipation pad is also included, the heat dissipation pad is arranged in the groove, and the electronic components are installed on the heat dissipation pad.

As an improved technical solution of the present invention, a fixing plate is also included, and the circuit board housing is arranged on the fixing plate.

As an improved technical solution of the present invention, the fixing plate is provided with threaded holes at the corners.

As an improved technical solution of the present invention, positioning pins are also included, and the circuit board is mounted on the substrate through the positioning pins.

As an improved technical solution of the present invention, the upper surface of the positioning pin is fixedly connected with a rubber pad.

As an improved technical solution of the present invention, it also includes a folded heat sink, which is arranged on the circuit board and opposite to the electronic components.

As an improved technical solution of the present invention, it also includes a blowing heat dissipation mechanism, and the blowing heat dissipation mechanism includes a motor, a central shaft, a blade and a vent; the motor is arranged in the circuit board casing and is located at one end of the circuit board casing in the length direction; The central shaft is connected to the motor and can rotate under the drive of the motor. The axis of the central shaft is arranged along the length direction of the circuit board housing; the blades are arranged on the central shaft; the air vent is provided on the end surface of the other end of the length direction of the circuit board housing .

Beneficial effect

Compared with the prior art, the dense heat dissipation circuit board of the present invention spreads the liquid in the liquid storage chamber into the heat conduction plate through the coiled hose through the cooperative connection between the liquid storage chamber and the hose, so that the circuit board generates The heat is dissipated through the flow of liquid, and the contact area between the electronic components and the aluminum substrate can be increased through the matching connection between the groove and the electronic components, so that the heat dissipation effect is better. The heat on the upper surface of the circuit board is accelerated to dissipate heat, so that the heat dissipation efficiency is higher.

In addition, the dense heat dissipation circuit board of the present application can also combine the circulating fluid heat dissipation mechanism with the blower mechanism and the folding heat dissipation plate to realize rapid heat dissipation on the circuit board.

Description of drawings

Figure 1 Schematic diagram of the structure of the intensive heat dissipation circuit board of this application;

Fig. 2 is the right view of Fig. 1;

In the figure: 1 circuit board shell, 2 heat conduction plate, 3 through hole, 4 liquid storage tank, 5 water inlet pipe, 6 water outlet pipe, 7 hose, 8 micro water pump, 9 water inlet, 10 base plate, 11 groove, 12 Locating pins, 13 circuit boards, 14 folding heat sinks, 15 electronic components, 16 motors, 17 central shafts, 18 blades, 19 air vents, 20 fixing plates, 21 threaded holes, 22 cooling pads.

Detailed ways

In order to make the purpose and technical solutions of the embodiments of the present application clearer, the technical solutions of the present application will be clearly and completely described below in conjunction with the embodiments of the present application. Apparently, the described embodiments are some of the embodiments of the present application, but not all of them. Based on the described embodiments of the present application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with the meaning in the context of the prior art, and will not be interpreted in an idealized or overly formal sense unless defined as herein explain.

The meaning of "inside and outside" in this application means that relative to the device itself, the direction pointing to the inside of the device is inside, and vice versa is outside, but not a specific limitation on the device mechanism of this application.

The meaning of "connection" in this application may be a direct connection between components or an indirect connection between components through other components.

A kind of intensive heat dissipation circuit board as shown in Figure 1, comprises circuit board housing 1, electronic component 15 and circuit board 13; One side of electronic component 15 is installed on the circuit board 13, and circuit board 13 is arranged on circuit board housing 1 In the middle; it also includes a circulating fluid cooling mechanism located in the circuit board housing 1; the circulating fluid cooling mechanism includes a liquid storage tank 4, a micro water pump 8, a hose 7, a heat conducting plate 2 and a substrate 10; the liquid storage tank 4 is fixed on the heat conducting One end of the plate 2; the heat conduction plate 2 is arranged along the length direction of the circuit board housing 1, and the heat conduction plate 2 is evenly arranged with several through holes 3 on the end face near the micro water pump 8; after the hose 7 passes through all the through holes 3, its two ends The ends communicate with the respective liquid storage tanks 4; at the same time, when the hose 7 passes through the through hole 3, the outer wall of the hose 7 is socketed with the inner wall of the through hole 3, and the hose 7 conducts heat under the limit of the through hole 3. Circular distribution in the plate 2; in fact, when the water-cooling liquid circulates in the hose 7, the heat on the circuit board 13 can also be taken away evenly; the base plate 10 is arranged on the surface of the heat conducting plate 2, and there are several concave The groove 11 and the other side of the electronic component 15 are installed in the groove 11; when the heat is dissipated, the electronic component dissipates heat indirectly through the substrate 10, which avoids the excessive temperature difference of the electronic component 15. In order to ensure that the substrate 10 has good heat transfer performance, this application involves The substrate 10 is an aluminum substrate;

Specifically, the liquid storage tank 4 is provided with a water inlet pipe 5 and a water outlet pipe 6; one end of the hose 7 communicates with the water inlet pipe 5 of the liquid storage tank 4, and in detail, a micro water pump 8 is located at the water inlet 9 of the liquid storage tank 4 , the liquid inlet of miniature water pump 8 can be communicated with water inlet pipe 5, and water inlet pipe 5 is communicated with one end of flexible pipe 7; One end is connected; the liquid in the liquid storage tank 4 is water cooling liquid, which can play the role of heat conduction, and the water cooling liquid in the liquid storage tank 4 should be sufficient, and the water cooling liquid should overflow the liquid outlet of the micro water pump 8 and the water outlet pipe 6 , through the matching connection between the micro water pump 8 and the hose 7, the liquid in the liquid storage tank 4 is spread into the heat conducting plate 2 through the coiled hose 7, so that the heat generated by the circuit board 13 is dissipated through the flow of the liquid and passes through the groove 11 and the electronic component 15 can be connected to increase the contact area between the electronic component 15 and the aluminum substrate 10, so that the heat dissipation effect is better. The surface heat is accelerated to dissipate heat, making the heat dissipation more efficient.

In order to facilitate the fixing of the circuit board 13, the four corners of the substrate 10 are provided with positioning pins 12, and the circuit board 13 is mounted on the substrate 10 through the positioning pins 12. Based on the foregoing, the circuit board 13 is installed on the side with the electronic components 15. On the substrate 10; and for the convenience of heat dissipation, the other side of the circuit board 13 is provided with a folded heat sink 14, the folded heat sink 14 is directly installed on the circuit board 13, and is arranged opposite to the electronic component 15.

As an improved technical solution of the present invention, a heat dissipation pad 22 is also included, the heat dissipation pad 22 is arranged in the groove 11 , and the electronic component 15 is installed on the heat dissipation pad 22 . Specifically, the heat dissipation pad 22 can be fixed on the lower surface of the electronic component 15, and the lower surface of the heat dissipation pad 22 is attached to the bottom surface of the groove 11, so that the heat generated by the electronic component 15 can be quickly transferred to the aluminum substrate 10, Make heat transfer faster.

As an improved technical solution of the present invention, it also includes a fixing plate 20, on which the circuit board housing 1 is arranged, and the fixing plate 20 is provided with threaded holes 21 at the corners; the specific performance is as follows: the lower surface of the circuit board housing 1 The four corners of the circuit board are fixedly connected with fixing plates 20 respectively, and the upper surface of the fixing plate 20 is provided with threaded holes 21 to facilitate the fixing of the circuit board housing 1 .

The upper surface of the positioning pin 12 is fixedly connected with a rubber pad to protect the circuit board 13 in order to prevent the circuit board 13 from colliding with the positioning pin 12 .

As an improved technical solution of the present invention, it also includes a blowing heat dissipation mechanism, and the blowing heat dissipation mechanism includes a motor 16, a central shaft 17, blades 18 and vents 19; One end of the body 1 in the length direction; the central shaft 17 is connected to the motor 16 and can rotate under the drive of the motor 16, and the axis of the central shaft 17 is arranged along the length direction of the circuit board housing 1; the blades 18 are arranged on the central shaft 17; ventilation The port 19 is provided on the end surface of the other end of the circuit board housing 1 in the length direction.

Working principle: When the circuit board 13 is in the working state, the micro-water pump 8 and the motor 16 are energized, and then the micro-water pump 8 is pumped through the water inlet pipe 5 to pump the water cooling liquid from the water outlet pipe 6 through the hose 7 into the hose 7, and then the The water-cooling liquid in the liquid storage tank 4 circulates and twitches, and the water-cooling liquid flowing in the hose 7 takes away the heat of the electronic components 15 on the circuit board 13, so that the heat is transferred, and then achieves the effect of heat dissipation. The contact between the electronic components 15 and the groove 11 The heat dissipation effect can be increased, and the folded heat sink 14 can quickly diffuse the heat that cannot be taken away by the water cooling liquid circulation at the upper end of the circuit board 13, and the rotation of the blade 18 driven by the motor 16 can circulate the air in the circuit board housing 1, so that The temperature of the air in the circuit board case 1 is uniform, and the vent 19 releases the air in the circuit board case 1 to maximize heat dissipation.

It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, but that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and not restrictive in all points of view, and the scope of the application is defined by the appended claims rather than the foregoing description, and it is intended that the scope of the present application be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in this application.

In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only contains an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole , the technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.

Claims (8)

1. a kind of intensive cooling circuit board, including circuit board housing, electronic component and circuit board；The one side installation of electronic component In on circuit board, circuit board is arranged in circuit board housing；It is characterized in that, the circulation fluid further included in circuit board housing dissipates Heat engine structure；Circulation fluid cooling mechanism includes liquid reserve tank, micro pump, hose, heat-conducting plate and substrate；Heat-conducting plate is along circuit board shell The length direction arrangement of body, heat-conducting plate have several through holes the end face for closing on micro pump is uniformly distributed；Liquid reserve tank is arranged on and leads One end of hot plate；After hose passes through all through holes, one end is connected with the water outlet of liquid reserve tank；Micro pump be arranged on liquid reserve tank into At the mouth of a river, the liquid outlet of micro pump can be connected with liquid reserve tank, and the inlet of micro pump can be connected with the other end of hose；Base Plate is arranged on the surface of heat-conducting plate, and substrate is equipped with several grooves, the another side of electronic component is installed in groove.

2. a kind of intensive cooling circuit board according to claim 1, it is characterised in that further include cooling pad, cooling pad is set In groove, electronic component is installed on cooling pad.

3. a kind of intensive cooling circuit board according to claim 1, it is characterised in that further include fixed plate, circuit board shell Body is arranged in fixed plate.

4. a kind of intensive cooling circuit board according to claim 3, it is characterised in that fixed plate is equipped with screw thread in edge Hole.

5. a kind of intensive cooling circuit board according to claim 1, it is characterised in that further include positioning pin, circuit board leads to Positioning pin is crossed to be installed on substrate.

6. a kind of intensive cooling circuit board according to claim 5, it is characterised in that the upper surface of positioning pin is fixedly connected There is rubber cushion.

A kind of 7. intensive cooling circuit board according to claim 1, it is characterised in that further include and fold shape heat sink, folding Folded shape heat sink is arranged on circuit board, and is oppositely arranged with electronic component.

8. a kind of intensive cooling circuit board according to claim 1, it is characterised in that further include air blast cooling mechanism, drum Wind cooling mechanism includes motor, central shaft, blade and ventilating opening；Motor is arranged in circuit board housing, and is located at circuit board shell The one end in body length direction；Central shaft driven connection motor can simultaneously rotate under the drive of motor, and the axis of central shaft is along circuit The length direction arrangement of plate housing；Blade is arranged on central shaft；Ventilating opening is arranged on the end of the circuit board shell length direction other end On face.