CN107887526B - Display panel and preparation method thereof, display device - Google Patents
Display panel and preparation method thereof, display device Download PDFInfo
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- CN107887526B CN107887526B CN201711045206.6A CN201711045206A CN107887526B CN 107887526 B CN107887526 B CN 107887526B CN 201711045206 A CN201711045206 A CN 201711045206A CN 107887526 B CN107887526 B CN 107887526B
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- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 144
- 238000004806 packaging method and process Methods 0.000 claims abstract description 30
- 239000006223 plastic coating Substances 0.000 claims abstract description 18
- 239000004033 plastic Substances 0.000 claims abstract description 11
- 229920003023 plastic Polymers 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 77
- 125000006850 spacer group Chemical group 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 6
- 238000009738 saturating Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 12
- 238000002955 isolation Methods 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000002274 desiccant Substances 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- -1 polysiloxanes Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910017107 AlOx Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910003070 TaOx Inorganic materials 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides a kind of display panels and preparation method thereof, display device, belong to field of display technology.Wherein, display panel, including the first substrate that box is arranged and the second substrate, the first substrate and the second substrate are packaged together by packaging plastic, the first encapsulating structure is provided on the first substrate, first encapsulating structure is located between the packaging plastic coating zone and display area of the first substrate, the second encapsulating structure is provided in the second substrate, second encapsulating structure is located between the packaging plastic coating zone and display area of the second substrate, first encapsulating structure and second encapsulating structure are in contact to form the closed barricade of encirclement display area.Technical solution of the present invention can be improved display panel to the isolation effect of steam, improve service life and the yield of display device.
Description
Technical field
The present invention relates to field of display technology, a kind of display panel and preparation method thereof, display device are particularly related to.
Background technique
Common packaged type is in OLED display panel production at present, seals in lower substrate outermost coating DAM (cofferdam)
Glue is filled, the filling filling glue in packaging plastic makes to fill glue along certain side during lower substrate and upper substrate contraposition press
To spreading and fill up the gap between upper and lower base plate.
Since each luminescent layer of OLED display is organic material, it is highly prone to the influence of steam, causes the display device longevity
Life shortens, and even fails.And steam invade, what is influenced first after DAM packaging plastic is exactly outermost pixel, and gradually to
Diffusion inside display device, so the water resistance characteristic and packaging effect of DAM encapsulating structure are for improving OLED display
Service life and yield are most important.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of display panel and preparation method thereof, display device, Neng Gouti
High display panel improves service life and the yield of display device to the isolation effect of steam.
In order to solve the above technical problems, the embodiment of the present invention offer technical solution is as follows:
On the one hand, a kind of display panel is provided, including the first substrate that box is arranged and the second substrate, the first substrate
It is packaged together with the second substrate by packaging plastic, the first encapsulating structure, first encapsulation is provided on the first substrate
Structure is located between the packaging plastic coating zone and display area of the first substrate, and the second envelope is provided in the second substrate
Assembling structure, second encapsulating structure are located between the packaging plastic coating zone and display area of the second substrate, and described
One encapsulating structure and second encapsulating structure are in contact to form the closed barricade of encirclement display area.
Further, first encapsulating structure uses material identical with the functional film layer of the first substrate display area
Material is made, and second encapsulating structure is made of material identical with the functional film layer of the second substrate display area.
Further, the first flatness layer, auxiliary on first flatness layer is disposed on the first substrate
Cathodic metal cabling, the spacer material on the auxiliary cathode metal routing and entire the transparent of first substrate of covering is helped to lead
Electric layer, the auxiliary cathode metal routing include being located at the first cabling of display area and walking positioned at the second of non-display area
Line, the spacer material include the first spacer material positioned at display area and the second spacer material positioned at non-display area, and described the
Described in the transparency conducting layer composition of two cablings, second spacer material and covering second cabling and second spacer material
First encapsulating structure.
Further, the width of first cabling is less than the width of second cabling.
Further, set gradually in the second substrate the second flatness layer, the anode on second flatness layer,
The cathode of pixel defining layer, luminescent layer and the entire the second substrate of covering, second flatness layer include positioned at the of display area
One flatness layer part and the second flatness layer part positioned at non-display area, the pixel defining layer include being located at display area
First pixel defining layer part and the second pixel defining layer part positioned at non-display area, second flatness layer part, institute
It states the second pixel defining layer part and covers the cathode of second flatness layer part and second pixel defining layer part
Form second encapsulating structure.
Further, the orthographic projection of first encapsulating structure on the second substrate falls completely within second encapsulation
In the orthographic projection of structure on the second substrate.
The embodiment of the invention also provides a kind of display devices, including display panel as described above.
The embodiment of the invention also provides a kind of production method of display panel, the display panel includes that box is arranged
First substrate and the second substrate, the first substrate and the second substrate are packaged together by packaging plastic, the production method packet
It includes:
The first encapsulating structure is formed between the packaging plastic coating zone of the first substrate and display area；
The second encapsulating structure is formed between the packaging plastic coating zone of the second substrate and display area；
By the first substrate and the second substrate to box after, first encapsulating structure and second encapsulating structure
Be in contact the closed barricade to be formed and surround display area.
Further, include the steps that the step of forming the first substrate, forming the first substrate includes:
Form the first flatness layer；
Auxiliary cathode metal routing is formed on first flatness layer, the auxiliary cathode metal routing includes being located to show
Show first cabling in region and the second cabling positioned at non-display area；
Form spacer material on the auxiliary cathode metal routing, the spacer material include positioned at display area first every
Underbed and the second spacer material positioned at non-display area；
Form the transparency conducting layer of covering first substrate；
Wherein, second cabling, second spacer material and covering second cabling and second spacer material
Transparency conducting layer form first encapsulating structure.
Further, include the steps that the step of forming the second substrate, forming the second substrate includes:
The second flatness layer is formed, second flatness layer includes positioned at the first flatness layer part of display area and positioned at non-
Second flatness layer part of display area；
Anode is formed on second flatness layer；
Pixel defining layer is formed in the second substrate for be formed with anode, the pixel defining layer includes being located at display area
The first pixel defining layer part and the second pixel defining layer part positioned at non-display area；
Luminescent layer is formed in the second substrate for being formed with the pixel defining layer；
Form the cathode for covering entire the second substrate；
Wherein, second flatness layer part, second pixel defining layer part and covering second flatness layer
The cathode of part and second pixel defining layer part forms second encapsulating structure.
The embodiment of the present invention has the advantages that
In above scheme, it is provided with the first encapsulating structure on the first substrate, the second encapsulation is provided in the second substrate
Structure, when first substrate and the second substrate are packaged, pressing when using encapsulation is aligned, and makes the first encapsulating structure and second
Encapsulating structure presses together, and composition surrounds the closed barricade of display area, prevents steam intrusion display so as to play
The effect of panel itself improves service life and the yield of display device.Since technical solution of the present invention is not needed by increasing DAM
Glue material introduces the mode of new desiccant to improve the block-water performance of display panel, therefore can reduce technology difficulty, saves
Process costs；In addition, the first encapsulating structure and the second encapsulating structure be between packaging plastic coating zone and display area, therefore
Will not resolution ratio to display panel and display effect impact.
Detailed description of the invention
Fig. 1 is the schematic cross-section of display panel of the embodiment of the present invention；
Fig. 2 is the schematic cross-section of color membrane substrates of the embodiment of the present invention；
Fig. 3 is the schematic cross-section of array substrate of the embodiment of the present invention；
Fig. 4 is the floor map of display panel of the embodiment of the present invention.
Appended drawing reference
1 anode
2 first pixel defining layer parts
3 first flatness layer parts
4 spacer materials
5 transparent conductive oxides
6 luminescent layers
7 cathodes
8 transparency conducting layers
9 first flatness layers
10 colored light-filtering units
11 black matrix
12 auxiliary cathode metal routings
13 packaging plastics
14 second flatness layer parts
15 second pixel defining layer parts
16 display areas
Spacer material in 41 non-display areas
Spacer material in 42 display areas
Specific embodiment
To keep the embodiment of the present invention technical problems to be solved, technical solution and advantage clearer, below in conjunction with
Drawings and the specific embodiments are described in detail.
The embodiment of the present invention provides a kind of display panel and preparation method thereof, display device, can be improved display panel
To the isolation effect of steam, improve service life and the yield of display device.
The embodiment of the present invention provides a kind of display panel, the first substrate including box is arranged and the second substrate, and described
One substrate and the second substrate are packaged together by packaging plastic, are provided with the first encapsulating structure on the first substrate, and described
One encapsulating structure is located between the packaging plastic coating zone and display area of the first substrate, is provided in the second substrate
Second encapsulating structure, second encapsulating structure are located between the packaging plastic coating zone and display area of the second substrate,
First encapsulating structure and second encapsulating structure are in contact to form the closed barricade of encirclement display area.
In the present embodiment, it is provided with the first encapsulating structure on the first substrate, the second encapsulation is provided in the second substrate
Structure, when first substrate and the second substrate are packaged, pressing when using encapsulation is aligned, and makes the first encapsulating structure and second
Encapsulating structure presses together, and composition surrounds the closed barricade of display area, prevents steam intrusion display so as to play
The effect of panel itself improves service life and the yield of display device.Since technical solution of the present invention is not needed by increasing DAM
Glue material introduces the mode of new desiccant to improve the block-water performance of display panel, therefore can reduce technology difficulty, saves
Process costs；In addition, the first encapsulating structure and the second encapsulating structure be between packaging plastic coating zone and display area, therefore
Will not resolution ratio to display panel and display effect impact.
Further, first encapsulating structure uses material identical with the functional film layer of the first substrate display area
Material is made, and second encapsulating structure is made of material identical with the functional film layer of the second substrate display area.This
Sample can be increased without special manufacture craft to make the first encapsulating structure and the second encapsulating structure, in production display area
The first encapsulating structure and the second encapsulating structure can be made while functional film layer, can reduce being produced into for display panel
This.
Further, when display panel is OLED display panel, as Figure 1-Figure 4, on the first substrate successively
It is provided with the first flatness layer 9, the auxiliary cathode metal routing 12 on first flatness layer 9, is located at the auxiliary cathode
The transparency conducting layer 8 of spacer material 4 and the entire first substrate of covering on metal routing 12, the auxiliary cathode metal routing 12
Including being located at the first cabling of display area and positioned at the second cabling of non-display area, the spacer material 4 includes being located at display
First spacer material 41 in region and the second spacer material 42 positioned at non-display area, second cabling, second spacer material
It 42 and covers the transparency conducting layer 8 of second cabling and second spacer material 42 and forms first encapsulating structure.
Further, the width of first cabling is less than the width of second cabling.Due to the first of display area
Cabling is limited by display panel resolution ratio and aperture opening ratio arbitrarily to be widened, and the width of the second cabling of non-display area
It is not limited by display panel resolution ratio and aperture opening ratio, it therefore, can be by the width design of the second cabling of non-display area
It is wider, the problem of pressure drop of cathode 7 can be reduced in this way, reduce the Vss potential difference of display panel different location.
Further, when display panel is OLED display panel, as Figure 1-Figure 4, in the second substrate successively
Second flatness layer, the anode 1 on second flatness layer, pixel defining layer 2, luminescent layer 6 and covering entire second are set
The cathode 7 of substrate, cathode 7 can specifically use transparent conductive oxide 5, and second flatness layer includes being located at display area
First flatness layer part 3 and the second flatness layer part 14 positioned at non-display area, the pixel defining layer 2 include being located at display
The first pixel defining layer part 2 in region and the second pixel defining layer part 15 positioned at non-display area, described second is flat
Layer part 14, second pixel defining layer part 15 and covering second flatness layer part 14 and second pixel circle
The cathode 7 of given layer part 15 forms second encapsulating structure.
Further, the orthographic projection of first encapsulating structure on the second substrate falls completely within second encapsulation
In the orthographic projection of structure on the second substrate.It can guarantee in this way when first substrate and the second substrate are packaged together,
First encapsulating structure can be entirely fallen on the second encapsulating structure, be unlikely to generate dislocation and weaken block-water effect.
The embodiment of the invention also provides a kind of display devices, including display panel as described above.The display device
It can be with are as follows: any products or components having a display function such as TV, display, Digital Frame, mobile phone, tablet computer, wherein
The display device further includes flexible circuit board, printed circuit board and backboard.
The embodiment of the invention also provides a kind of production method of display panel, the display panel includes that box is arranged
First substrate and the second substrate, the first substrate and the second substrate are packaged together by packaging plastic 13, the production method
Include:
The first encapsulating structure is formed between the packaging plastic coating zone of the first substrate and display area；
The second encapsulating structure is formed between the packaging plastic coating zone of the second substrate and display area；
By the first substrate and the second substrate to box after, first encapsulating structure and second encapsulating structure
Be in contact the closed barricade to be formed and surround display area.
In the present embodiment, it is provided with the first encapsulating structure on the first substrate, the second encapsulation is provided in the second substrate
Structure, when first substrate and the second substrate are packaged, pressing when using encapsulation is aligned, and makes the first encapsulating structure and second
Encapsulating structure presses together, and composition surrounds the closed barricade of display area, prevents steam intrusion display so as to play
The effect of panel itself improves service life and the yield of display device.Since technical solution of the present invention is not needed by increasing DAM
Glue material introduces the mode of new desiccant to improve the block-water performance of display panel, therefore can reduce technology difficulty, saves
Process costs；In addition, the first encapsulating structure and the second encapsulating structure be between packaging plastic coating zone and display area, therefore
Will not resolution ratio to display panel and display effect impact.
Further, include the steps that forming the first substrate, when display panel is OLED display panel, form institute
The step of stating first substrate include:
Form the first flatness layer 9；
Auxiliary cathode metal routing 12 is formed on first flatness layer 9, the auxiliary cathode metal routing 12 includes
The first cabling positioned at display area and the second cabling positioned at non-display area；
Spacer material 4 is formed on the auxiliary cathode metal routing 12, the spacer material 4 includes positioned at the of display area
One spacer material 41 and the second spacer material 42 positioned at non-display area；
Form the transparency conducting layer 8 of covering first substrate；
Wherein, second cabling, second spacer material 42 and covering second cabling and second dottle pin
The transparency conducting layer 8 of object 42 forms first encapsulating structure.
Further, include the steps that forming the second substrate, when display panel is OLED display panel, form institute
The step of stating the second substrate include:
The second flatness layer is formed, second flatness layer includes being located at the first flatness layer part 3 of display area and being located at
Second flatness layer part 14 of non-display area；
Anode 1 is formed on second flatness layer；
Pixel defining layer 2 is formed in the second substrate for being formed with anode 1, the pixel defining layer 2 includes being located at display
The first pixel defining layer part 2 in region and the second pixel defining layer part 15 positioned at non-display area；
Luminescent layer 6 is formed in the second substrate for being formed with the pixel defining layer 2；
Form the cathode 7 for covering entire the second substrate；
Wherein, second flatness layer part 14, second pixel defining layer part 15 and covering described second are flat
The cathode 7 of smooth layer part 14 and second pixel defining layer part 15 forms second encapsulating structure.
It describes in detail with reference to the accompanying drawing to display panel and preparation method thereof of the invention, the display of the present embodiment
The production method of panel the following steps are included:
Step 1, as shown in Fig. 2, provide a underlay substrate, black matrix 11, colorized optical filtering are sequentially formed on underlay substrate
Unit 10 forms the first flatness layer 9 of covering black matrix 11 and colored light-filtering units 10 later, wherein the first flatness layer 9 of production
Material including but not limited to polysiloxanes based material, acrylic based material, polyimides based material etc..
Auxiliary cathode metal routing 12 is formed on first flatness layer 9, the auxiliary cathode metal routing 12 includes
The first cabling positioned at display area and the second cabling positioned at non-display area, wherein the width of the first cabling is less than second
The width of cabling, auxiliary cathode metal routing 12 can be common metal material, such as Ag, Cu, Al, Mo etc. or multiple layer metal
The alloy material of such as MoNb/Cu/MoNb or above-mentioned metal, such as AlNd, MoNb.
Spacer material 4 is formed on the auxiliary cathode metal routing 12, the spacer material 4 includes positioned at the of display area
One spacer material 41 and the second spacer material 42 positioned at non-display area, the first spacer material 41 are located on the first cabling, the second dottle pin
Object 42 is located on the second cabling；Specifically, spacer material material can be coated on auxiliary cathode metal routing 12, formed after development
Spacer material 4.As shown in figure 4, the first spacer material 41 for being located at display area is in certain density (um2/mm2) distribution, it is cylindric；
The second spacer material 42 positioned at non-display area is at closed rectangle barricade shape, wherein 16 be display area.
The transparency conducting layer 8 of covering first substrate is formed later, transparency conducting layer 8 can use transparent conductive oxide 5,
Stack architecture such as ITO/Ag/ITO etc. also can be used in such as ITO, AZO.
In Fig. 2, dotted line represents the line of demarcation of first substrate non-display area and display area, described in non-display area
The transparency conducting layer 8 of second cabling, second spacer material 42 and covering second cabling and second spacer material 42
Form first encapsulating structure.
Step 2, as shown in figure 3, provide a underlay substrate, thin film transistor (TFT) array is formed on underlay substrate, and formed
Cover the second flatness layer of thin film transistor (TFT) array.Wherein, thin film transistor (TFT) can be for using oxide, silicon materials and organic
The active layer of top gate type thin film transistor of the object material as active layer, thin film transistor (TFT) can use a-IGZO, ZnON,
IZTO, a-Si, p-Si, six thiophene, a variety of materials such as polythiophene make the material of the second flatness layer including but not limited to poly- silicon oxygen
Methane series material, acrylic based material, polyimides based material etc.；In Fig. 3, dotted line represents the second substrate non-display area and display
The line of demarcation in region, second flatness layer include positioned at the first flatness layer part 3 of display area and positioned at non-display area
The second flatness layer part 14, wherein the width of the second flatness layer part 14 can be slightly larger than the first encapsulating structure width, this
Sample can guarantee that the first encapsulating structure is fallen completely in the second flatness layer part 14 in the orthographic projection on the second flatness layer.
Anode 1 is formed on second flatness layer, anode 1 can cover the second flatness layer part 14 or not cover
Second flatness layer part 14；The material of anode 1 can be common metal material, such as Ag, and Cu, Al, Mo etc. or multiple layer metal are such as
The alloy material of MoNb/Cu/MoNb etc. or above-mentioned metal, such as AlNd, MoNb；Transparent conductive oxide can also be used, such as
Stack architecture such as ITO/Ag/ITO etc. also can be used in ITO, AZO etc..
Pixel defining layer 2 is formed in the second substrate for being formed with anode 1, the pixel defining layer 2 includes being located at display
The first pixel defining layer part 2 in region and the second pixel defining layer part 15 positioned at non-display area, the second pixel define
Layer part 15 be located on the second flatness layer part 14, specifically, the second pixel defining layer part 15 on the second flatness layer just
Projection can be completely coincident with the second flatness layer part 14.
Luminescent layer 6 is formed in the second substrate for being formed with the pixel defining layer 2.
Form the cathode 7 for covering entire the second substrate；Cathode 7 can use transparent conductive oxide 5, such as ITO, AZO,
Also stack architecture such as ITO/Ag/ITO etc. can be used.
Wherein, second flatness layer part 14, second pixel defining layer part 15 and covering described second are flat
The cathode 7 of smooth layer part 14 and second pixel defining layer part 15 forms second encapsulating structure.
In the present embodiment, material used by the dielectric layer of thin film transistor (TFT) and the dielectric layer of capacitor includes in the second substrate
But it is not limited to conventional such as SiOx, SiNx, SiON inorganic material or organic insulating material or High k material such as AlOx,
HfOx, TaOx etc.；Each electrode and capacitor plate, signal lead material can be common metal material, such as Ag in the second substrate,
The alloy material of Cu, Al, Mo etc. or multiple layer metal such as MoNb/Cu/MoNb etc. or above-mentioned metal, such as AlNd, MoNb, can also
To be transparent conductive oxide 5, such as ITO, AZO or stack architecture such as ITO/Ag/ITO etc.；The second substrate of the present embodiment can
Think metal oxide thin-film transistor array substrate, silicon substrate or organic electroluminescent LED display base plate etc..
After step 3, coating DAM packaging plastic 13 and Filler glue, first substrate and the second substrate contraposition are pressed, so that the
The first encapsulating structure on one substrate and the second encapsulating structure in the second substrate closely press, and form the envelope for surrounding display area
Enclosed barricade, the display panel after pairing are as shown in Figure 4.
In the present embodiment, the closed barricade of the first encapsulating structure and the second encapsulating structure composition can prevent steam from invading
Inside display panel, improve service life and the yield of display device.Due to not needing by increasing DAM glue material or introducing new drying
The mode of agent improves the block-water performance of display panel, therefore can reduce technology difficulty, saves process costs；In addition, first
Encapsulating structure and the second encapsulating structure will not divide display panel between packaging plastic coating zone and display area
Resolution and display effect impact.
Unless otherwise defined, the technical term or scientific term that the disclosure uses should be tool in fields of the present invention
The ordinary meaning for thering is the personage of general technical ability to be understood." first ", " second " used in the disclosure and similar word are simultaneously
Any sequence, quantity or importance are not indicated, and are used only to distinguish different component parts." comprising " or "comprising" etc.
Similar word means that the element or object before the word occur covers the element or object for appearing in the word presented hereinafter
And its it is equivalent, and it is not excluded for other elements or object.The similar word such as " connection " or " connected " is not limited to physics
Or mechanical connection, but may include electrical connection, it is either direct or indirectly."upper", "lower",
"left", "right" etc. is only used for indicating relative positional relationship, and after the absolute position for being described object changes, then the relative position is closed
System may also correspondingly change.
It is appreciated that ought such as layer, film, region or substrate etc element be referred to as be located at another element "above" or "below"
When, which " direct " can be located at "above" or "below" another element, or may exist intermediary element.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (6)
1. a kind of display panel, including the first substrate that box is arranged and the second substrate, the first substrate and the second substrate are logical
It crosses packaging plastic to be packaged together, which is characterized in that be provided with the first encapsulating structure, the first encapsulation knot on the first substrate
Structure is located between the packaging plastic coating zone and display area of the first substrate, and the second encapsulation is provided in the second substrate
Structure, second encapsulating structure are located between the packaging plastic coating zone and display area of the second substrate, and described first
Encapsulating structure and second encapsulating structure are in contact to form the closed barricade of encirclement display area；
First encapsulating structure is made of material identical with the functional film layer of the first substrate display area, and described the
Two encapsulating structures are made of material identical with the functional film layer of the second substrate display area；
The first flatness layer is disposed on the first substrate, the auxiliary cathode metal on first flatness layer is walked
The transparency conducting layer of line, the spacer material on the auxiliary cathode metal routing and the entire first substrate of covering, it is described auxiliary
Helping cathodic metal cabling includes the second cabling positioned at the first cabling of display area and positioned at non-display area, the spacer material
Including being located at the first spacer material of display area and positioned at the second spacer material of non-display area, second cabling, described the
Two spacer materials and transparency conducting layer composition first encapsulating structure for covering second cabling and second spacer material；
The width of first cabling is less than the width of second cabling.
2. display panel according to claim 1, which is characterized in that it is flat to set gradually second in the second substrate
The cathode of layer, the anode on second flatness layer, pixel defining layer, luminescent layer and the entire the second substrate of covering, it is described
Second flatness layer includes the second flatness layer part positioned at the first flatness layer part of display area and positioned at non-display area, institute
Stating pixel defining layer includes the second pixel circle positioned at the first pixel defining layer part of display area and positioned at non-display area
Given layer part, second flatness layer part, second pixel defining layer part and covering second flatness layer part
Second encapsulating structure is formed with the cathode of second pixel defining layer part.
3. display panel according to claim 1, which is characterized in that first encapsulating structure is on the second substrate
Orthographic projection fall completely in the orthographic projection of second encapsulating structure on the second substrate.
4. a kind of display device, which is characterized in that including display panel as claimed in any one of claims 1-3.
5. a kind of production method of display panel, the display panel includes the first substrate and the second substrate to box setting, institute
It states first substrate and the second substrate is packaged together by packaging plastic, which is characterized in that the production method includes:
The first encapsulating structure is formed between the packaging plastic coating zone of the first substrate and display area；
The second encapsulating structure is formed between the packaging plastic coating zone of the second substrate and display area；
By the first substrate and the second substrate to box after, first encapsulating structure and second encapsulating structure connect
Touching forms the closed barricade for surrounding display area；
First encapsulating structure is made of material identical with the functional film layer of the first substrate display area, and described the
Two encapsulating structures are made of material identical with the functional film layer of the second substrate display area；
The step of forming the first substrate include:
Form the first flatness layer；
Auxiliary cathode metal routing is formed on first flatness layer, the auxiliary cathode metal routing includes being located at viewing area
First cabling in domain and the second cabling positioned at non-display area；
Spacer material is formed on the auxiliary cathode metal routing, the spacer material includes the first spacer material positioned at display area
With the second spacer material for being located at non-display area；
Form the transparency conducting layer of covering first substrate；
Wherein, second cabling, second spacer material and the saturating of second cabling and second spacer material is covered
Bright conductive layer forms first encapsulating structure；
The width of first cabling is less than the width of second cabling.
6. the production method of display panel according to claim 5, which is characterized in that including forming the second substrate
Step, the step of forming the second substrate include:
The second flatness layer is formed, second flatness layer includes positioned at the first flatness layer part of display area and positioned at non-display
The second flatness layer part in region；
Anode is formed on second flatness layer；
Form pixel defining layer in the second substrate for be formed with anode, the pixel defining layer includes positioned at the of display area
One pixel defining layer part and the second pixel defining layer part positioned at non-display area；
Luminescent layer is formed in the second substrate for being formed with the pixel defining layer；
Form the cathode for covering entire the second substrate；
Wherein, second flatness layer part, second pixel defining layer part and covering second flatness layer part
Second encapsulating structure is formed with the cathode of second pixel defining layer part.
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| CN109067950B (en) * | 2018-10-19 | 2020-07-17 | 信利光电股份有限公司 | Display screen assembly attaching method |
| CN109686775B (en) * | 2019-01-10 | 2021-08-03 | 昆山国显光电有限公司 | Organic light-emitting display panel, preparation method and display device |
| CN110085750B (en) * | 2019-04-09 | 2020-06-30 | 深圳市华星光电半导体显示技术有限公司 | Organic light emitting diode device and manufacturing method thereof |
| CN110444689B (en) * | 2019-08-19 | 2021-11-16 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN110459580A (en) * | 2019-08-22 | 2019-11-15 | 合肥鑫晟光电科技有限公司 | Display device, display panel and its manufacturing method |
| CN110767663B (en) * | 2019-10-23 | 2021-12-14 | 京东方科技集团股份有限公司 | Organic light-emitting backplane and manufacturing method thereof, touch display screen and touch display device |
| US12282219B2 (en) | 2021-09-15 | 2025-04-22 | Beijing Boe Display Technology Co., Ltd. | Liquid crystal display panel and method of manufacturing the same, and display apparatus |
| CN114864639A (en) * | 2022-04-20 | 2022-08-05 | 京东方科技集团股份有限公司 | Display substrate and display device |
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