CN104112767B - Array substrate, organic light emitting diode display panel and display device - Google Patents

Abstract

The present invention relates to a kind of array base palte, a kind of organic LED display panel and a kind of display device, wherein, the array base palte includes：Array substrate, structure sheaf, the Organic Light Emitting Diode being laid at the top of structure sheaf layer, it is characterised in that also include：Passivation layer, is covered in the non-light-emitting area of Organic Light Emitting Diode layer and the side of structure sheaf in array base palte.By technical scheme, true color can realized using WOLED, and while overlapping electrode in spacer material mode, it is ensured that display panel has good electric conductivity and block-water performance, and higher panel reliability.

Description

Array substrate, organic light emitting diode display panel and display device

technical field

The present invention relates to the technical field of organic light emitting diode packaging, in particular, to an array substrate, an organic light emitting diode display panel and a display device.

Background technique

Organic electroluminescent devices have favorable characteristics such as active light emission, wide viewing angle, high contrast ratio, and fast response speed, and are known as a new generation of display technology.

Full-color organic light-emitting diode (OLED) displays can be realized by using WOLED plus COA (Color-filteron Array, color filter integrated with array substrate) or CF (Color-filter color filter), which can specifically include Bottom-emitting WOLED plus COA and top-emitting WOLED plus CF. Among them, the method of top-emitting WOLED plus CF has the advantages of high aperture ratio and relatively simple backplane manufacturing process.

However, the way of top-emitting WOLED plus CF is that the upper electrode is a penetrating electrode, whether it is thin metal or TCO (Transparent Conductive Oxide, transparent conductive oxide film), the sheet resistance value is too large, resulting in a large area. For OLED displays, IR Drop (resistance voltage drop) is likely to occur, resulting in uneven brightness of the panel. Although the auxiliary electrode can be made on the CF cover plate, and the photo spacer (spacer) can be used to overlap the upper electrode to reduce IR. Drop, but in order to achieve a good electrical overlap, there should be no insulating layer between the upper electrode and the PS, which will lead to poor water resistance of the display panel and lower reliability of the panel.

Contents of the invention

The technical problem to be solved by the present invention is how to ensure the water resistance of the array substrate, and further, how to ensure the water resistance and reliability of the display panel with the array substrate while using spacers to overlap the upper electrode layer. Spend.

For this purpose, the present invention provides an array substrate, including: an array substrate, a structural layer, an organic light-emitting diode layer arranged on the top of the structural layer, and a passivation layer covering the organic light-emitting diode layer in the array substrate. The non-light-emitting area of the diode layer and the side faces of the structural layer.

Preferably, a chip-on-film area or a soft board welding area is provided on the outside of the array substrate, and the passivation layer is arranged between the organic light emitting diode layer and the chip-on-film area or the soft board welding area .

Preferably, the passivation layer is a single-layer structure or a multi-layer stack structure.

Preferably, the passivation layer is silicon nitride, silicon oxide, aluminum oxide and/or titanium oxide.

The present invention also proposes an organic light emitting diode display panel, comprising the array substrate described in any one of the above items, an upper electrode layer is formed on the organic light emitting diode layer of the array substrate, and a color filter substrate, wherein the color filter The film substrate includes a color film base, a color film layer is formed on the side of the color film base facing the array substrate, an auxiliary electrode layer is formed on the color film layer, a spacer is formed in the auxiliary electrode layer or a spacer is formed on the color film layer. spacer, the auxiliary electrode layer on top of the spacer is in contact with the upper electrode layer.

Preferably, a first sealant is filled between the color filter substrate and the array substrate, and the passivation layer is sealed by the first sealant.

Preferably, it further includes: a second sealant disposed on the periphery of the first sealant for sealing the first sealant.

Preferably, the viscosity of the first sealant is less than the viscosity of the second sealant.

Preferably, it further includes: a metal wire disposed at the bottom of the spacer and in contact with the auxiliary electrode layer.

Preferably, the metal traces are metals or metal alloys such as aluminum, molybdenum or silver.

Preferably, the auxiliary electrode layer is a transparent conductive film.

Preferably, the upper electrode layer includes at least one of the following: a silver layer, a magnesium-silver alloy layer, an indium tin oxide layer, an indium zinc oxide layer, and a composite layer covered with a transparent conductive film on the metal layer.

The present invention also proposes a display device, comprising the organic light emitting diode display panel described in any one of the above.

Through the above technical solution, a passivation layer covering the non-light-emitting area of the organic light-emitting diode layer and the side of the structural layer is provided on the array substrate, and full-color can be realized by using WOLED, and the upper electrode layer is overlapped by a spacer. At the same time, it ensures that the array substrate and the display panel with the array substrate have good electrical conductivity and water resistance, as well as high panel reliability.

Description of drawings

The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the invention in any way. In the accompanying drawings:

FIG. 1 shows a schematic structural diagram of an array substrate according to an embodiment of the present invention;

Fig. 2 shows a schematic diagram of the position of a passivation layer according to an embodiment of the present invention;

FIG. 3A shows a schematic structural view of an organic light emitting diode display panel according to an embodiment of the present invention;

FIG. 3B shows a schematic structural view of an OLED display panel according to another embodiment of the present invention;

FIG. 4 shows a schematic structural diagram of an OLED display panel according to another embodiment of the present invention.

Explanation of reference numbers:

1-structure layer; 10-array substrate; 2-color filter substrate; 20-color filter layer; 3-passivation layer; 4-spacer; 5-auxiliary electrode layer; 6-organic light-emitting diode layer; 7-metal Wiring; 8-chip-on-chip film area or soft board soldering area; 9-anisotropic conductive film.

detailed description

In order to more clearly understand the above objects, features and advantages of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

FIG. 1 shows a schematic structural diagram of an array substrate according to an embodiment of the present invention.

As shown in FIG. 1, an array substrate according to an embodiment of the present invention includes: an array substrate 10, a structural layer 1, an organic light emitting diode layer 6 arranged on the top of the structural layer 1, and a passivation layer 3 covering the array substrate. The non-light-emitting area of the organic light-emitting diode layer 6, and the side of the structure layer 1.

It should be noted that the first sealant is filled between the array substrate and the color filter substrate, and the array substrate includes the array substrate 10, the structure layer 1 and the organic light emitting diode layer 6, wherein the structure layer 1 is not a single layer, Rather, it is a collection of layers for realizing the functions of the array substrate, which may include: gate, gate insulating layer, active layer, etch stop layer, source-drain layer, resin insulating layer, pixel electrode layer (pixel electrode layer) Can be used as anode), pixel defining layer and other layers, but not limited thereto. The passivation layer 3 covers the non-light-emitting area of the OLED layer 6 , that is, the edge of the OLED layer 6 , and covers both sides of the structure layer 1 .

By covering the passivation layer 3 on the non-luminous area of the organic light-emitting diode layer 6 and the side of the structural layer 1, it can be ensured that WOLED can be used to achieve full color, and the upper electrode layer can be overlapped in the form of a spacer 4, while reducing the The water infiltrating from the side of the sealing structure ensures that the display panel made of the array substrate has good water-blocking performance and high panel reliability.

As shown in Figure 2 (wherein only the chip-on-chip region or the flexible board welding region 8 on one side of the array substrate 10 is drawn, the other side of the array substrate 10 may also be provided with the chip-on-chip region or the flexible board welding region 8) , preferably, the outside of the array substrate 10 is provided with a chip-on-film region (COF) or a flexible board soldering region (FPC) 8, which is arranged on the anisotropic conductive film 9 (that is, ACF), and the passivation layer 3 is arranged on Between the light-emitting area of the organic light emitting diode layer 6 and the chip-on-film area or the soldering area 8 of the soft board.

Because the passivation layer 3 is between the light-emitting area of the organic light emitting diode layer 6 and the chip-on-chip area or the soft board welding area 8, it can be ensured that the passivation layer 3 is in the first encapsulant and does not cover the organic light emitting diode layer 6. Luminous area.

Preferably, the passivation layer 3 is a single-layer structure or a multi-layer stack structure.

Preferably, the passivation layer 3 is silicon nitride, silicon oxide, aluminum oxide and/or titanium oxide.

As shown in FIG. 3A and FIG. 3B, an organic light emitting diode display panel according to an embodiment of the present invention includes an array substrate in any of the above items, and an upper electrode layer (not shown in the figure) is formed on the organic light emitting diode layer 6 of the array substrate. Specifically, it is a layer of thin electrode layer arranged on the upper surface of the array organic light emitting diode layer 6), and also includes a color filter substrate, wherein the color filter substrate includes a color filter base 2, and the side of the color filter base 2 facing the array substrate is formed with Color filter layer 20, an auxiliary electrode layer 5 is formed on the color filter layer 20, a spacer 4 is formed in the auxiliary electrode layer 5 (as shown in FIG. 3A ), or a spacer 4 is formed on the color filter layer 20 (such as As shown in FIG. 3B ), the auxiliary electrode layer 5 on the top of the spacer 4 is in contact with the upper electrode layer of the array substrate.

Preferably, a first sealant is filled between the color filter substrate 2 and the array substrate, and the passivation layer 3 is sealed by the first sealant.

Preferably, it further includes: a second sealant disposed on the periphery of the first sealant for sealing the first sealant.

Preferably, the viscosity of the first sealant is less than the viscosity of the second sealant.

Setting the first sealant on the outside of the first sealant can further ensure the sealing performance of the display panel, and can improve the surface uniformity of the first sealant, and because the first sealant directly contacts the organic light emitting diode layer 6, during the curing process In the process, the organic light emitting diode layer 6 will be damaged due to the tension of the contact surface. By setting the viscosity of the first sealant to be lower than the viscosity of the second sealant, it can ensure that the first sealant and the organic light emitting diode layer 6 are in contact during the curing process. The contact surface has only a small tension, which reduces the damage of the organic light emitting diode layer 6. At the same time, the second sealant adopts a relatively high viscosity, which can ensure strong water resistance to the outside world and improve the overall sealing performance.

As shown in FIG. 4 , metal wires 7 are added to the structure of FIG. 3A . Preferably, the organic light emitting diode display panel may further include: metal wires 7 disposed at the bottom of the spacer 4 and in contact with the auxiliary electrode layer 5 . touch.

Preferably, the metal wiring 7 is made of metal or metal alloy such as aluminum, molybdenum or silver.

By arranging the metal wiring 7 at the bottom of the spacer 4, the conductivity of the auxiliary electrode layer 5 can be increased, and the IR drop on the front of the OLED display panel can be reduced.

The auxiliary electrode layer 5 is a transparent conductive film, which can be made of metal oxides such as In, Sn, Zn and Cd and their composite multi-element oxide film materials, such as ITO (indium tin oxide) or IZO (indium zinc oxide).

Preferably, the upper electrode layer includes at least one of the following: a silver layer, a magnesium-silver alloy layer, an indium tin oxide layer, an indium zinc oxide layer, and a composite layer covered with a transparent conductive film on the metal layer.

The present invention also proposes a display device comprising any one of the organic light emitting diode display panels described above.

The display device in the embodiment of the present invention can be, for example, any product or component with a display function, such as electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, and navigator.

The technical solution of the present invention has been described in detail above with reference to the accompanying drawings. Considering that in the related art, it is difficult to ensure the water-blocking performance of the display panel and the reliability of the panel when the electrodes are overlapped by means of spacers. Through the technical solution of the present application, while using WOLED to achieve full color and overlapping electrodes in the form of spacers, it is possible to ensure that the display panel has good electrical conductivity and water resistance, as well as high panel reliability.

In addition, those skilled in the art should know that, according to actual needs, the OLED display panel of the present invention may also include other structures and components, and the method for manufacturing an OLED display panel may also include other steps and details, which are only consistent with the present invention. The improvements are irrelevant and will not be repeated here.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (11)

1. An array substrate, comprising: an array base, a structural layer and an organic light emitting diode layer arranged on the top of the structural layer, characterized in that it also includes: a passivation layer covering the non-light-emitting area of the organic light-emitting diode layer in the array substrate and the side surfaces of the structural layer; The outer side of the array substrate is provided with a chip-on-film region or a flexible board welding region arranged on the anisotropic conductive adhesive film, and the passivation layer is arranged on the light-emitting region of the organic light-emitting diode layer and the chip-on-film area or between the soft board soldering areas. 2. The array substrate according to claim 1, wherein the passivation layer is a single-layer structure or a multi-layer stack structure. 3. The array substrate according to claim 1, wherein the passivation layer is silicon nitride, silicon oxide, aluminum oxide and/or titanium oxide. 4. An organic light emitting diode display panel, characterized in that it comprises the array substrate according to any one of claims 1 to 3, an upper electrode layer is formed on the organic light emitting diode layer of the array substrate, and a color filter substrate is also included , Wherein, the color filter substrate includes a color filter base, a color filter layer is formed on a side of the color filter base facing the array substrate, an auxiliary electrode layer is formed on the color filter layer, and an auxiliary electrode layer is formed in the auxiliary electrode layer. A spacer is formed on the spacer or the color filter layer, and the auxiliary electrode layer on the top of the spacer is in contact with the upper electrode layer. 5. The OLED display panel according to claim 4, wherein a first sealant is filled between the color filter substrate and the array substrate, and the passivation layer is sealed by the first sealant . 6. The OLED display panel according to claim 5, further comprising: The second sealant is arranged on the periphery of the first sealant and is used to seal the first sealant. 7. The organic light emitting diode display panel according to claim 6, wherein the viscosity of the first sealant is smaller than the viscosity of the second sealant. 8. The OLED display panel according to claim 4, further comprising: The metal wiring is arranged at the bottom of the spacer and is in contact with the auxiliary electrode layer. 9. The organic light emitting diode display panel according to any one of claims 4 to 8, wherein the auxiliary electrode layer is a transparent conductive film. 10. The organic light emitting diode display panel according to any one of claims 4 to 8, wherein the upper electrode layer comprises at least one of the following: The silver layer, the magnesium-silver alloy layer, the indium tin oxide layer, the indium zinc oxide layer, and the metal layer are covered with a composite layer of transparent conductive film. 11. A display device, comprising the organic light emitting diode display panel according to any one of claims 4 to 10.