CN107876971A - A kind of laser cutting device and method - Google Patents
A kind of laser cutting device and method Download PDFInfo
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- CN107876971A CN107876971A CN201610874609.0A CN201610874609A CN107876971A CN 107876971 A CN107876971 A CN 107876971A CN 201610874609 A CN201610874609 A CN 201610874609A CN 107876971 A CN107876971 A CN 107876971A
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- system controller
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 238000007493 shaping process Methods 0.000 claims abstract description 23
- 239000004606 Fillers/Extenders Substances 0.000 claims abstract description 17
- 238000012360 testing method Methods 0.000 claims abstract description 6
- 238000011835 investigation Methods 0.000 claims abstract description 5
- 238000005520 cutting process Methods 0.000 claims description 10
- 230000009471 action Effects 0.000 claims description 4
- 230000008844 regulatory mechanism Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 8
- 238000002224 dissection Methods 0.000 abstract description 7
- 238000002789 length control Methods 0.000 abstract description 5
- 230000008859 change Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 241000931526 Acer campestre Species 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010606 normalization Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser cutting device and method, the device includes system controller and the laser, collimator and extender unit, beam shaping unit and the work stage that are set gradually along light path；Work stage is provided with sucking disc mechanism and beam profile measuring unit, and the test surface of beam profile measuring unit is vertical highly identical with sucking disc mechanism surface；Collimator and extender unit includes the microscope group of multiplying power continuously adjustabe, the beam energy intensity for the beam profile measuring unit feedback that system controller receives, while according to the thickness of object to be cut, adjusts the multiplying power of microscope group.Vertical upper Bessel light beams three-dimensional energy strength investigation is realized by beam profile measuring unit, and the data detected are uploaded to system controller, system controller adjusts the diameter of beam shaping unit incident beam according to the thickness control governor motion of the data and cut object detected, realize the length control of dissection light beam, laser energy is made full use of, improves processing efficiency.
Description
Technical field
The present invention relates to semiconductor cutting technique field, and in particular to a kind of laser cutting device and method.
Background technology
With the continuous expansion of consumption electronic product market, people are constantly being lifted to the demand of electronic product performance, raw
Existing production technology faces many-sided challenge during production.The demand of cut quality and performance causes manufacturer to use laser cutting
There is mechanical cutting mode in technical substitution processing procedure Central Plains.
With the continuous maturation of ultrafast laser technique in recent years, Duo Jia lasers supplier is proposed the ultrafast of technical grade and swashed
Radiant, utilization of the laser cutting technique in general semiconductor applications is promoted.Why ultrafast laser can cause that people's is extensive
When interest is due to that light is propagated in the material, thermal diffusion depth is directly proportional to the square root of pulsewidth, therefore can using ultrafast laser
Greatly to reduce the thermal diffusion region in process, so as to avoid influence of the heat to crudy.Meanwhile ultrafast laser meeting
Cause the very strong non-linear absorption of material so as to increase absorption of the material to laser, reduce processing threshold value and energy in the material
Volume is deposited, lifts crudy.
In transparent material cutting, due to the variable thickness of cutting substrate, therefore control, the cutting for depth of cut are imitated
The control of rate and cut quality is particularly important, but cutting can not once be sexually revised now by changing normal Gaussian laser depth of focus
Shape, improve the purpose of processing efficiency and optimizing incision technique.
The content of the invention
The invention provides a kind of laser cutting device and method, to solve problems of the prior art.
In order to solve the above-mentioned technical problem, the technical scheme is that：A kind of laser cutting device, including：System control
Device processed and the laser set gradually along light path, collimator and extender unit, beam shaping unit and work stage；In the work stage
Provided with sucking disc mechanism and beam profile measuring unit, the sucking disc mechanism adsorbs object to be cut, and the beam profile measurement is single
The test surface of member is vertical highly identical with the sucking disc mechanism surface；The system controller receives the beam profile measurement
The signal of unit, and control the laser, collimator and extender unit, work stage and the work of beam profile measuring unit；It is described
Collimator and extender unit includes the microscope group of multiplying power continuously adjustabe, and the beam profile measuring unit that the system controller receives is anti-
The beam energy intensity of feedback, while according to the thickness of the object to be cut, adjust the multiplying power of the microscope group.
Further, in addition to governor motion, the system controller are adjusted by controlling the driving of the governor motion
Save the multiplying power of the microscope group.
Further, in addition to stage control device, the system controller is by sending a signal to the work stage control
Device processed controls the work stage vertically with level to motion.
Further, in addition to laser controller, the system controller is by sending a signal to the laser controller
To control the laser works.
Further, in addition to motor drive mechanism controller, the system controller is by sending a signal to the motor
Structure controller controls the action of the governor motion, drives the governor motion to adjust the multiplying power of the microscope group.
Further, the beam shaping unit includes cone prism.
The present invention also provides a kind of laser cutting method of laser cutting device, comprises the following steps：
S1：The collimated expand unit of light beam that the laser is sent is expanded, and is formed by beam shaping unit
Bessel light beams, incide in cut object and the beam profile measuring unit of the work stage；
S2：The beam profile measuring unit detects to three-dimensional energy intensity of the Bessel light beams on vertical, and
The data detected are uploaded to system controller；
S3：The data and the thickness control of object to be cut that the system controller detects according to beam profile measuring unit
The multiplying power of microscope group is adjusted in governor motion collimation expand unit processed, so as to adjust the straight of beam shaping unit incident beam
Footpath.
Further, the system controller is driven in governor motion collimation expand unit by motor drive mechanism controller
The multiplying power of microscope group is adjusted.
Further, the system controller drives work stage vertically to move by stage control device, so that light
Beam profile measurement unit carries out vertical scanning, realizes vertical upper Bessel light beams three-dimensional energy strength investigation.
Laser cutting device provided by the invention and method, the device include system controller and set gradually along light path
Laser, collimator and extender unit, beam shaping unit and work stage；The work stage is provided with sucking disc mechanism and beam profile
Measuring unit, the sucking disc mechanism adsorb object to be cut, test surface and the sucker machine of the beam profile measuring unit
Structure surface it is vertical highly identical；The system controller receives the signal of the beam profile measuring unit, and described in control
Laser, collimator and extender unit, work stage and the work of beam profile measuring unit；The collimator and extender unit connects including multiplying power
Continue adjustable microscope group, the beam energy intensity for the beam profile measuring unit feedback that the system controller receives, simultaneously
According to the thickness of the object to be cut, the multiplying power of the microscope group is adjusted.It is single by setting beam profile to measure in work stage
Member, vertical upper Bessel light beams three-dimensional energy strength investigation is realized, and the data detected are uploaded to system controller, system
Controller is according to times of microscope group in the thickness control governor motion collimation expand units of the data and object to be cut detected
Rate is adjusted, and so as to adjust the diameter of beam shaping unit incident beam, the length control of dissection light beam is realized, with suitable
Answer object thickness to be cut to change, make full use of laser energy, improve processing efficiency, optimizing incision technique.
Brief description of the drawings
Fig. 1 is the structural representation of laser cutting device of the present invention；
Fig. 2 is the principle of Bessel light beams of the present invention；
Fig. 3 is variation diagram of the normalization light axis center energy density of the present invention with propagation distance.
Shown in figure：1st, laser；2nd, collimator and extender unit；3rd, beam shaping unit；31st, cone prism；4th, work stage；
5th, beam profile measuring unit；6th, system controller；7th, governor motion；8th, it is cut object；9th, sucking disc mechanism；10th, work stage
Controller；11st, laser controller；12nd, motor drive mechanism controller.
Embodiment
The present invention is described in detail below in conjunction with the accompanying drawings：
As shown in figure 1, the invention provides a kind of laser cutting device, including：The laser 1 that is set gradually along light path,
Collimator and extender unit 2, beam shaping unit 3 and work stage 4, the beam profile measuring unit 5 in the work stage 4, with
And the system controller being connected respectively with the laser 1, collimator and extender unit 2, work stage 4 and beam profile measuring unit 5
6, the collimator and extender unit 2 includes the microscope group of a multiplying power continuously adjustabe, is provided between the system controller 6 and the microscope group
One governor motion 7.The work stage 4 is provided with sucking disc mechanism 9, adsorbs object 8 to be cut, it is preferred that the beam profile is surveyed
The test surface for measuring unit 5 is vertical highly identical with the surface of sucking disc mechanism 9.Specifically, object 8 to be cut can be transparent
Material, such as glass material material, but this is not limited to, in work stage 4, the laser 1 is ultrafast laser, and pulsewidth is small
In 10ps, wave-length coverage is 1000nm~1100nm, sends the collimated expand unit 2 of Gaussian laser beam and is expanded, and passes through
Beam shaping unit 3 forms Bessel (Bezier) light beam, on the cut object 8 for inciding the work stage 4, the light beam
Profile measurement unit 5 is detected to three-dimensional energy intensity of the Bessel light beams on vertical, and the data detected are uploaded
To system controller 6；Data that the system controller 6 detects according to beam profile measuring unit 5 and object to be cut 8
The multiplying power of microscope group is adjusted in the collimation expand unit 2 of thickness control governor motion 7, so as to adjust beam shaping unit 3
The diameter of incident beam, the length control to Bessel light beams is realized, to adapt to the thickness change of cutting object 8, is made full use of sharp
Light energy, improve processing efficiency, optimizing incision technique.
Preferably, stage control device 10, the system control are provided between the system controller 6 and the work stage 4
Device 6 processed controls the work stage 4 vertically with level to motion by sending a signal to the stage control device 10, its
In, work stage 4, which is vertically moved, drives beam profile measuring unit 5 to carry out vertical scanning, realizes vertical upper Bessel light beams three
Tie up energy intensity detection；Work stage 4 is horizontally moved the cut object 8 of drive and moved along desired trajectory, so as to carry out laser
Cutting.
Preferably, laser controller 11 is provided between the system controller 6 and the laser 1, control laser 1 is sent out
Penetrate the light beam for cutting.
Preferably, motor drive mechanism controller 12, the system are provided between the system controller 6 and the governor motion 7
System controller 6 controls the action of the governor motion 7 by sending a signal to the motor drive mechanism controller 12, described in driving
Governor motion 7 adjusts the multiplying power of the microscope group, so as to adjust the diameter of the incident beam of beam shaping unit 3.
Preferably, the beam shaping unit 3 includes cone prism 31, and the principle of Bessel light beams is as shown in Fig. 2 Gauss
After laser beam is incident from the front end of cone prism (left side), the Bessel light beams on right side are formed from after being concerned with, Bessel light beams
Key parameter includes center spot diameter dfWith propagation distance zr, it is defined as follows：
In above-mentioned formula, k is the related parameter of optical maser wavelength, and D is incident beam beam waist, i.e., incident beam is straight
Footpath, n are the refractive index of cone prism 31, and α is the angle of wedge of cone prism 31, and after laser 1 is selected, optical maser wavelength is definite value,
Therefore k is definite value, and the refractive index n of cone prism 31 is definite value, the diameter d of center spotfDetermined by the locking angle of cone prism 31
Fixed, locking angle also determines after cone prism 31 is selected, therefore, Bessel beam center spot diameters dfIn locking angle and swash
The wavelength of light device 1 is certain value after determining；And propagation distance zrAspect is also influenceed by incident beam diameter, therefore passes through change
The diameter of inputs light beam can change the propagation distance of Bessel light beams, axial action beam length and the propagation distance of cut place
It is directly proportional, so as to have the function that to change dissection beam length.
Normalization light axis center energy density is as shown in Figure 3 with the change of propagation distance.Relative parameters setting is as follows：The angle of wedge
α is 1 °, and cone prism 31 scales 15 times, and n takes 1.5.Understand the propagation distance of Bessel light beams with incident light according to formula (2)
Beam size increases, linear increment.It is respectively 2.2mm with beam waist D, 3.2mm, 4.2mm are tested, and are assumed to normalize
Energy density 0.5 is line of demarcation, represents that dissection can effectively occur more than 0.5.Pass through cone governor it can be seen from Fig. 3
The diameter of the incident beam of shape prism 31, the length in effective dissection region can be effectively adjusted, i.e., by adjusting light beam
Beam waist adapts to the cutting object of different-thickness；Dissection boundary position and energy density occurs most on the direction of propagation
High position changes also with the reflection of beam sizes, therefore, calibration is adjusted by beam profile measuring unit 5, to adapt to
Process requirements.
Present invention also offers a kind of laser cutting method of laser cutting device as described above, comprise the following steps：
S1：The collimated expand unit 2 of light beam that the laser 1 is sent is expanded, and by beam shaping unit 3 after
Bessel light beams are formed, progress laser on the cut object 8 and beam profile measuring unit 5 of the work stage 4 is incided and cuts
Cut.
S2：The beam profile measuring unit 5 detects to three-dimensional energy intensity of the Bessel light beams on vertical, and
The data detected are uploaded to system controller 6；Specifically, the system controller 6 is driven by stage control device 10
Work stage 4 is vertically moved, so that beam profile measuring unit 5 carries out vertical scanning, realizes vertical upper Bessel light beams three
Tie up energy intensity detection.
S3：The data and the thickness of object to be cut that the system controller 6 detects according to beam profile measuring unit 5
The multiplying power for controlling to adjust the microscope group in the collimation expand unit 2 of mechanism 7 is adjusted, incident so as to adjust beam shaping unit 3
The diameter of light beam.Specifically, the system controller 6 drives the collimation of governor motion 7 to expand by motor drive mechanism controller 12
The multiplying power of microscope group is adjusted in unit 2, so as to adjust the diameter of the incident beam of beam shaping unit 3, realizes to Bessel
The length control of light beam, to adapt to be cut the thickness change of object 8, laser energy is made full use of, improves processing efficiency, optimization is cut
Cut technique.
In summary, laser cutting device provided by the invention and method, the device include system controller 6 and along light
Laser 1, collimator and extender unit 2, beam shaping unit 3 and the work stage 4 that road is set gradually；The work stage 4, which is provided with, inhales
Disc mechanism 9 and beam profile measuring unit 5, the sucking disc mechanism 9 adsorb object 8 to be cut, the beam profile measuring unit 5
Test surface it is vertical highly identical with the surface of sucking disc mechanism 9；The system controller 6 receives the beam profile measurement
The signal of unit 5, and control the laser 1, collimator and extender unit 2, work stage 4 and beam profile measuring unit 5 to work；
The collimator and extender unit 2 includes the microscope group of multiplying power continuously adjustabe, the beam profile measurement that the system controller 6 receives
The beam energy intensity that unit 5 feeds back, while according to the thickness of the object 8 to be cut, adjust the multiplying power of the microscope group.Pass through
Beam profile measuring unit 5 is set in work stage 4, realizes vertical upper Bessel light beams three-dimensional energy strength investigation, and will visit
The data measured are uploaded to system controller 6, and system controller 6 is according to the data detected and the thickness control of object to be cut 8
The multiplying power of microscope group is adjusted in the collimation expand unit 2 of governor motion 7 processed, so as to adjust the incident beam of beam shaping unit 3
Diameter, realize dissection light beam length control, with adapt to be cut object thickness change, make full use of laser energy,
Improve processing efficiency, optimizing incision technique.
Although embodiments of the present invention are illustrated in specification, these embodiments are intended only as prompting,
It should not limit protection scope of the present invention.It is equal that various omission, substitution, and alteration are carried out without departing from the spirit and scope of the present invention
It should include within the scope of the present invention.
Claims (9)
- A kind of 1. laser cutting device, it is characterised in that including：System controller and the laser set gradually along light path, Collimator and extender unit, beam shaping unit and work stage；The work stage is provided with sucking disc mechanism and beam profile measuring unit, The sucking disc mechanism adsorbs object to be cut, and the test surface of the beam profile measuring unit hangs down with the sucking disc mechanism surface To highly identical；The system controller receives the signal of the beam profile measuring unit, and controls the laser, collimation Expand unit, work stage and the work of beam profile measuring unit；The collimator and extender unit includes the mirror of multiplying power continuously adjustabe Group, the beam energy intensity for the beam profile measuring unit feedback that the system controller receives, while treated according to described The thickness of cutting object, adjust the multiplying power of the microscope group.
- 2. laser cutting device according to claim 1, it is characterised in that also including governor motion, the system control Device adjusts the multiplying power of the microscope group by controlling the driving of the governor motion.
- 3. laser cutting device according to claim 2, it is characterised in that also including motor drive mechanism controller, the system System controller controls the action of the governor motion by sending a signal to the motor drive mechanism controller, drives the regulation Mechanism adjusts the multiplying power of the microscope group.
- 4. laser cutting device according to claim 1, it is characterised in that also including stage control device, the system Controller controls the work stage vertically with level to motion by sending a signal to the stage control device.
- 5. laser cutting device according to claim 1, it is characterised in that also including laser controller, the system control Device processed controls the laser works by sending a signal to the laser controller.
- 6. laser cutting device according to claim 1, it is characterised in that the beam shaping unit includes taper rib Mirror.
- 7. a kind of laser cutting method of laser cutting device, it is characterised in that comprise the following steps：S1：The collimated expand unit of light beam that the laser is sent is expanded, and is formed by beam shaping unit Bessel light beams, incide in cut object and the beam profile measuring unit of the work stage；S2：The beam profile measuring unit detects to three-dimensional energy intensity of the Bessel light beams on vertical, and will visit The data measured are uploaded to system controller；S3：The data and the thickness control of object to be cut that the system controller detects according to beam profile measuring unit are adjusted The multiplying power of microscope group is adjusted in section mechanism collimation expand unit, so as to adjust the diameter of beam shaping unit incident beam.
- 8. laser cutting method according to claim 7, it is characterised in that the system controller passes through motor drive mechanism control The multiplying power of microscope group is adjusted in device driving governor motion collimation expand unit processed.
- 9. laser cutting method according to claim 7, it is characterised in that the system controller passes through stage control Device drives work stage vertically to move, so that beam profile measuring unit carries out vertical scanning, realizes vertical upper Bessel light Beam three-dimensional energy strength investigation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610874609.0A CN107876971A (en) | 2016-09-30 | 2016-09-30 | A kind of laser cutting device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610874609.0A CN107876971A (en) | 2016-09-30 | 2016-09-30 | A kind of laser cutting device and method |
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| Publication Number | Publication Date |
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| CN107876971A true CN107876971A (en) | 2018-04-06 |
Family
ID=61769623
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610874609.0A Pending CN107876971A (en) | 2016-09-30 | 2016-09-30 | A kind of laser cutting device and method |
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| CN (1) | CN107876971A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109759722A (en) * | 2019-02-27 | 2019-05-17 | 大族激光科技产业集团股份有限公司 | A kind of the LED chip system of processing and method of double process combinations |
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Application publication date: 20180406 |
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