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CN107855910A - Twp-sided polishing machine driving structure - Google Patents

Twp-sided polishing machine driving structure Download PDF

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Publication number
CN107855910A
CN107855910A CN201711084522.4A CN201711084522A CN107855910A CN 107855910 A CN107855910 A CN 107855910A CN 201711084522 A CN201711084522 A CN 201711084522A CN 107855910 A CN107855910 A CN 107855910A
Authority
CN
China
Prior art keywords
workpiece
drive mechanism
twp
workpiece plate
driving structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711084522.4A
Other languages
Chinese (zh)
Inventor
聂凤明
王大森
张广平
裴宁
李晓静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Weapon Science Academy Ningbo Branch
Chinese Academy of Ordnance Science Ningbo Branch
Original Assignee
Chinese Academy of Ordnance Science Ningbo Branch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chinese Academy of Ordnance Science Ningbo Branch filed Critical Chinese Academy of Ordnance Science Ningbo Branch
Priority to CN201711084522.4A priority Critical patent/CN107855910A/en
Publication of CN107855910A publication Critical patent/CN107855910A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/10Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/20Drives or gearings; Equipment therefor relating to feed movement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A kind of Twp-sided polishing machine driving structure, including base, upper polishing disk, lower polishing disk, the first drive mechanism and the workpiece plate that workpiece to be processed can be housed, first drive mechanism is arranged on base, between the upper polishing disk and lower polishing disk, the workpiece plate can move back and forth the workpiece plate in the presence of the first drive mechanism;The second drive mechanism and tumbler are additionally provided with the workpiece plate, the second drive mechanism driving tumbler drives workpiece to rotate, in process, workpiece itself can not only rotate, linear motion can also be realized in the presence of the first drive mechanism drives workpiece plate, and then workpiece rotation and the combination of linear motion are completed, more comprehensively, finely workpiece to be processed can be polished.

Description

Twp-sided polishing machine driving structure
Technical field
The present invention relates to grinding and polishing technical field, more particularly to a kind of Twp-sided polishing machine.
Background technology
The high speed development of optical instrument proposes higher requirement to optical element, and wherein optical elements of large caliber processing will Asking has very high surface configuration precision, it is also necessary to surface microscopic quality is significantly improved by the elimination of manufacturing defect, so as to Ultra-smooth optical surface is obtained, traditional Twp-sided polishing machine driving structure typically uses motor driven, passes through centre wheel and external tooth Circle drives planetary transmission system to realize that workpiece plate passively rotates, rotation speed of the speed than determining workpiece of centre wheel and external toothing Degree, the scope that can be adjusted is narrower, can not machining high-precision optical element, so being difficult to meet modern science and technology to optical element High-precision requirement.
Patent No. CN201610227367.6 (open notification number is CN106312778A) Chinese invention patent just carries Go out《A kind of optical elements of large caliber Twp-sided polishing machine》, it uses the upthrow compact disk structure that can swing and can rotation, made Polishing disk carries out swinging polishing and annular polishing to workpiece simultaneously, improves polishing efficiency, and makes polishing locus more uniform, Solve the problems, such as that face shape easily steps on side, rake angle, although the polishing machine improves the precision of processing to a certain extent, its The degree of polishing is still not comprehensive enough, fine, still can not meet industry requirement.
The content of the invention
The technical problems to be solved by the invention be for the above-mentioned state of the art and workpiece to be processed can be made by providing one kind The Twp-sided polishing machine driving structure of rotation and linear motion is carried out simultaneously.
Technical scheme is used by the present invention solves above-mentioned technical problem:A kind of Twp-sided polishing machine driving structure, including Base, upper polishing disk, lower polishing disk, the first drive mechanism and the workpiece plate that workpiece to be processed can be housed, first driving Mechanism is arranged on base, and for the workpiece plate between the upper polishing disk and lower polishing disk, the workpiece plate can be first Moved back and forth in the presence of drive mechanism;The second drive mechanism and tumbler, described rotation are additionally provided with the workpiece plate Part is provided with the setting area of workpiece, and the second drive mechanism driving tumbler drives workpiece to rotate.
To realize the linear motion of workpiece to be processed, it is preferable that first drive mechanism includes the first motor and transmission Part, first motor connect the workpiece plate by the driving member and drive workpiece plate to translate.
Specifically, the driving member is leading screw, and described leading screw one end connects the workpiece plate, the silk by feed screw nut The thick stick other end is connected by shaft coupling with the first motor output shaft.
To coordinate the workpiece plate displacement for being equipped with workpiece to be processed, it is preferable that slide rail is additionally provided with the base, it is foregoing Workpiece tray bottom is provided with the sliding block of the corresponding slide rail, the workpiece plate the first motor driving lower band movable slider described Slided in slide rail.
To realize the rotation of workpiece to be processed, it is preferable that the tumbler is arranged at the workpiece plate side, and described second Drive mechanism includes travelling gear and the second motor, and the tumbler connects second motor by travelling gear.
Preferably, the through hole of accommodating workpiece to be processed is offered on the workpiece plate, the through hole is the setting area of workpiece Domain.
For ease of the distance of regulation and control linear motion, it is preferable that be additionally provided with grating scale, the grating scale end on the base Portion is provided with grating reading head.
Preferably, the upper polishing disk can be moved up and down by lowering or hoisting gear (not shown) above workpiece plate, so, no Only it is easy to pick and place workpiece to be processed, the spacing of its processing space of the workpiece of different height can also be adjusted, the lowering or hoisting gear is normal Rule technology, is not described extensively herein.
Compared with prior art, the advantage of the invention is that:Workpiece plate is located at the upper polishing disk and lower throwing in the present apparatus Between CD, workpiece plate is loaded with workpiece to be processed, and in process, tumbler drives workpiece rotation, the first drive mechanism band Part of starting building checks and regulates body linear motion, and then completes workpiece rotation and the combination of linear motion, can more comprehensively, fine treat Workpieces processing is polished.
Brief description of the drawings
Fig. 1 is that the top view after upper polishing disk is omitted in the embodiment of the present invention;
Fig. 2 is the first drive mechanism and workpiece plate operating diagram in the embodiment of the present invention;
Fig. 3 is profiles of the Fig. 2 along A-A directions;
Fig. 4 is workpiece plate structural representation in the embodiment of the present invention.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing embodiment.
As shown in Figures 1 to 4, Twp-sided polishing machine driving structure in the present embodiment includes base 1, upper polishing disk 2, lower throwing CD 3, the first drive mechanism 4 and the workpiece plate 5 that can house workpiece to be processed, upper polishing disk 2 can be in work by lowering or hoisting gear The top of part disk 5 is moved up and down, and the first drive mechanism 4 is arranged on base 1, and workpiece plate 5 is located at upper polishing disk 2 and lower polishing disk 3 Between, workpiece plate 5 can move back and forth in the presence of the first drive mechanism 4;The second drive mechanism 53 is additionally provided with workpiece plate 5 With tumbler 51, the second drive mechanism 53 driving tumbler 51 drives workpiece to rotate, accommodating work to be processed is offered on workpiece plate 5 The through hole 52 of part, specifically, through hole 52 is arranged on tumbler 51, and grating scale is additionally provided with base 1, is set on grating scale 8 There is grating reading head 81.
First drive mechanism 4 includes the first motor 41 and driving member 42, and the first motor 41 connects workpiece by driving member 42 Disk 5 simultaneously drives workpiece plate 5 to translate, and driving member 42 is leading screw, and leading screw one end is led to by the workpiece plate 5 of connecting plate 421, the leading screw other end Feed screw nut 422 and shaft coupling 423 is crossed with the output shaft of the first motor 41 to be connected.
Slide rail 6 is additionally provided with base 1, the bottom of said workpiece disk 5 is provided with the sliding block 7 of corresponding slide rail 6, and workpiece plate 5 exists The driving lower band movable slider 7 of first motor 41 slides in slide rail 6.
Tumbler 51 is arranged at the side of workpiece plate 5, and the second drive mechanism 53 includes the motor 532 of travelling gear 531 and second, Tumbler 51 connects the second motor 532 by travelling gear 531.
During work, workpiece to be processed is put into through hole 54, and lower polishing disk 3 rotates, and the second motor 532 starts, and drives transmission Gear 531 rotates, and the tumbler 51 being engaged with also begins to rotate, and workpiece to be processed turns together with the rotation of tumbler 51 Dynamic, now upper polishing disk 2 starts to rotate, and upper polishing disk 2 drops to relevant position by lowering or hoisting gear, makes upper and lower polishing disk same When twin polishing workpiece;Its startup of subsequent first motor 41, drive leading screw 42 straight by feed screw nut 422 and shaft coupling 423 Line moves, and under the drive of leading screw 42, workpiece plate 5 and accommodating workpiece to be processed in the inner are together along the straight of lower polishing disk 3 Translational motion is done in footpath direction, for workpiece, while own rotation, is also being moved along a straight line, and these motions are common to be completed The two-sided high accuracy polishing of workpiece to be processed.

Claims (8)

1. a kind of Twp-sided polishing machine driving structure, including base (1), upper polishing disk (2), lower polishing disk (3), the first drive mechanism (4) and the workpiece plate (5) of workpiece to be processed can be housed, first drive mechanism (4) is arranged on base (1), the work Part disk (5) is between the upper polishing disk (2) and lower polishing disk (3), it is characterised in that:The workpiece plate (5) can be first Drive mechanism moves back and forth in the presence of (4);The second drive mechanism (53) and tumbler are additionally provided with the workpiece plate (5) (51), described tumbler is provided with the setting area of workpiece, and the second drive mechanism (53) driving tumbler (51) drives Workpiece rotates.
2. Twp-sided polishing machine driving structure according to claim 1, it is characterised in that:First drive mechanism (4) bag The first motor (41) and driving member (42) are included, first motor (41) connects the workpiece plate by the driving member (42) (5) and workpiece plate (5) is driven to translate.
3. Twp-sided polishing machine driving structure according to claim 2, it is characterised in that:The driving member (42) is leading screw, Described leading screw one end by connecting plate (421) workpiece plate (5), the leading screw other end by feed screw nut (422) and Shaft coupling (423) is connected with the first motor (41) output shaft.
4. Twp-sided polishing machine driving structure according to claim 3, it is characterised in that:It is additionally provided with the base (1) Slide rail (6), said workpiece disk (5) bottom are provided with the sliding block (7) of the corresponding slide rail (6), and the workpiece plate (5) is in the first electricity The driving lower band movable slider (7) of machine (41) slides in the slide rail (6).
5. Twp-sided polishing machine driving structure according to claim 1, it is characterised in that:The tumbler (51) is arranged at institute Workpiece plate (5) side is stated, second drive mechanism (53) includes travelling gear (531) and the second motor (532), the rotation Part (51) connects second motor (532) by travelling gear (531).
6. according to the Twp-sided polishing machine driving structure described in any one claim of claim 1 to 5, it is characterised in that:Institute State and through hole (52) is offered on workpiece plate (5), the through hole is the setting area of workpiece.
7. Twp-sided polishing machine driving structure according to claim 1, it is characterised in that:It is additionally provided with the base (1) Grating scale, grating reading head (81) is provided with the grating scale (8).
8. Twp-sided polishing machine driving structure according to claim 1, it is characterised in that:The upper polishing disk (2) passes through liter Falling unit can move up and down above workpiece plate (5).
CN201711084522.4A 2017-11-07 2017-11-07 Twp-sided polishing machine driving structure Pending CN107855910A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711084522.4A CN107855910A (en) 2017-11-07 2017-11-07 Twp-sided polishing machine driving structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711084522.4A CN107855910A (en) 2017-11-07 2017-11-07 Twp-sided polishing machine driving structure

Publications (1)

Publication Number Publication Date
CN107855910A true CN107855910A (en) 2018-03-30

Family

ID=61701166

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711084522.4A Pending CN107855910A (en) 2017-11-07 2017-11-07 Twp-sided polishing machine driving structure

Country Status (1)

Country Link
CN (1) CN107855910A (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3520088A (en) * 1966-12-20 1970-07-14 Spectrum Diamonds Pty Ltd Gem stone polishing machine
SU1430236A1 (en) * 1986-08-26 1988-10-15 Московское Специальное Конструкторско-Технологическое Бюро Металлорежущего Инструмента И Оборудования Method of bilateral grinding of bearing surfaces of unround carbide alloy plates
CN1441713A (en) * 2000-05-31 2003-09-10 三菱住友硅晶株式会社 Method of polishing semiconductor wafer by using double-sided polisher
CN1643658A (en) * 2002-03-28 2005-07-20 信越半导体株式会社 Double side polishing device for wafer and double side polishing method
JP2006075986A (en) * 2005-11-25 2006-03-23 Topcon Corp Workpiece polishing method and polishing apparatus therefor
CN202240796U (en) * 2011-08-19 2012-05-30 上海中晶企业发展有限公司 High-precision double-sided polishing machine
JP5663733B2 (en) * 2010-02-22 2015-02-04 秋田県 Flat double-sided finishing method and flat double-sided finishing apparatus
CN106312778A (en) * 2016-04-07 2017-01-11 东莞市兰光光学科技有限公司 A double-sided polishing machine for large-diameter optical components

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3520088A (en) * 1966-12-20 1970-07-14 Spectrum Diamonds Pty Ltd Gem stone polishing machine
SU1430236A1 (en) * 1986-08-26 1988-10-15 Московское Специальное Конструкторско-Технологическое Бюро Металлорежущего Инструмента И Оборудования Method of bilateral grinding of bearing surfaces of unround carbide alloy plates
CN1441713A (en) * 2000-05-31 2003-09-10 三菱住友硅晶株式会社 Method of polishing semiconductor wafer by using double-sided polisher
CN1643658A (en) * 2002-03-28 2005-07-20 信越半导体株式会社 Double side polishing device for wafer and double side polishing method
JP2006075986A (en) * 2005-11-25 2006-03-23 Topcon Corp Workpiece polishing method and polishing apparatus therefor
JP5663733B2 (en) * 2010-02-22 2015-02-04 秋田県 Flat double-sided finishing method and flat double-sided finishing apparatus
CN202240796U (en) * 2011-08-19 2012-05-30 上海中晶企业发展有限公司 High-precision double-sided polishing machine
CN106312778A (en) * 2016-04-07 2017-01-11 东莞市兰光光学科技有限公司 A double-sided polishing machine for large-diameter optical components

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Application publication date: 20180330