[go: up one dir, main page]

CN107834845A - A kind of booster circuit, step-up method and electronic equipment - Google Patents

A kind of booster circuit, step-up method and electronic equipment Download PDF

Info

Publication number
CN107834845A
CN107834845A CN201711130908.4A CN201711130908A CN107834845A CN 107834845 A CN107834845 A CN 107834845A CN 201711130908 A CN201711130908 A CN 201711130908A CN 107834845 A CN107834845 A CN 107834845A
Authority
CN
China
Prior art keywords
charge pump
boost
circuit
switch
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711130908.4A
Other languages
Chinese (zh)
Inventor
易鹏程
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meizu Technology Co Ltd
Original Assignee
Meizu Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meizu Technology Co Ltd filed Critical Meizu Technology Co Ltd
Priority to CN201711130908.4A priority Critical patent/CN107834845A/en
Publication of CN107834845A publication Critical patent/CN107834845A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of DC power input into DC power output
    • H02M3/02—Conversion of DC power input into DC power output without intermediate conversion into AC
    • H02M3/04—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters
    • H02M3/06—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider
    • H02M3/07—Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode, e.g. charge pumps
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0048—Circuits or arrangements for reducing losses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
    • Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)

Abstract

It is related to field of circuit technology, more particularly to a kind of booster circuit, step-up method and electronic equipment, charge pump boost module is provided with before Boost boost modules to carry out pre-loading to the input voltage of Boost boost modules, so that compared with carrying out boosting only with Boost circuit, the input of Boost boost modules, the pressure difference of output voltage reduce, and then the loss of Boost boost modules is reduced；In addition, not including inductive element in charge pump boost module, only realized and boosted by capacitive element discharge and recharge, high conversion efficiency, loss are low；Therefore, when the amplitude of boosting is larger, the conversion efficiency of whole booster circuit is still higher, loss is still relatively low, avoids the loss of booster circuit and can become big with boosting amplitude and become the problem of big.

Description

Boosting circuit, boosting method and electronic equipment
Technical Field
The present invention relates to the field of circuit technologies, and in particular, to a voltage boosting circuit, a voltage boosting method, and an electronic device.
Background
At present, most of portable electronic devices, such as smart phones and tablet computers, use lithium batteries for power supply, and in a circuit system of the electronic device, power supply voltages of some modules are higher than a battery voltage, so that a boost circuit needs to be arranged in the circuit system of the electronic device to support operations of the modules.
Most of Boost circuits in the prior art adopt a Boost circuit, which is a topological structure schematic diagram of the Boost circuit as shown in fig. 1; the circuit comprises an inductor L, capacitors C1 and C2, and switches S1 and S2. The working process of the Boost circuit is divided into two stages: in the first stage, S1 is conducted, S2 is disconnected, L stores energy, and C2 discharges to provide electric energy for a load; in the second phase, S1 is off, S2 is on, and L provides power to the load and charges C2. Assuming that the on-time of S1 is T1 and the off-time is T2, the duty cycle T is T1+ T2, the duty cycle D is T1/T, and the output voltage V _ out is V _ in/1-D, where V _ in is the input voltage.
Fig. 2 is a schematic circuit structure diagram of a specific Boost voltage circuit, where the switch S1 is a MOS (Metal-Oxide-Semiconductor) transistor Q, and the switch S2 is a schottky diode D1, and for a current continuous mode, the loss in the circuit is:
loss of the inductor:wherein, IoIn order to output the current, the current is,is copper loss, PcIs the iron loss; loss of the switch Q:wherein R isDS(on)Is the on-resistance of the switch Q, trAnd tfSwitching times, f, for the on and off of the switch Q, respectivelysFor the switching frequency of the switch Q, QGateIs the equivalent capacitance of the switch Q;
loss of schottky diode D1: pD1＝VDF·Io(ii) a Wherein, VDFIs the forward conduction voltage of schottky diode D1.
As can be seen from V _ out being V _ in/1-D, the larger the difference between the input voltage and the output voltage of the Boost circuit is, that is, the larger the Boost amplitude is, the smaller the value of 1-D is, and then the loss of the inductor and the loss of the switch Q are also increased under the condition that other conditions are not changed; that is, the conventional booster circuit has a problem that the loss of the booster circuit is large when the boosting width is large.
Disclosure of Invention
The embodiment of the invention provides a booster circuit, a boosting method and electronic equipment, which are used for solving the problem that the loss of the booster circuit is larger when the boosting amplitude of the booster circuit of the existing electronic equipment is larger.
The embodiment of the invention provides a booster circuit, which comprises a charge pump boosting module and a Boost boosting module, wherein:
the charge pump boosting module is used for boosting the voltage of a set input power supply to a set voltage value and outputting the voltage to the Boost module;
and the Boost module is used for boosting the set voltage value to a set target voltage value.
Optionally, the charge pump boost module comprises a charge pump boost sub-circuit, wherein:
in the first stage, the first capacitor module is connected in series with the direct current input of any charge pump boosting sub-circuit and discharges to charge the second capacitor module and provide output direct current; in the second stage, the direct current input of any charge pump boosting sub-circuit charges the first capacitor module, and the second capacitor module discharges to provide output direct current; wherein the dc input of any charge pump boosting sub-circuit is the dc output of the set input power supply or a preceding charge pump boosting sub-circuit of any charge pump boosting sub-circuit.
Preferably, the charge pump boost module comprises more than two charge pump boost sub-modules connected in series; any charge pump boosting submodule comprises one charge pump boosting sub-circuit or more than two parallel charge pump boosting sub-circuits; or,
the charge pump boosting module comprises a charge pump boosting submodule; any charge pump boosting submodule comprises more than two parallel charge pump boosting submodules.
Preferably, any one of the charge pump boost sub-circuits further comprises a first switch, a second switch, a third switch, and a fourth switch, wherein:
the input end of the first switch is connected with the input end of the third switch, and the connected terminal is the input end of any charge pump booster sub-circuit; the output end of the first switch is connected with the input end of the second switch and one end of the first capacitor module; the output end of the third switch is connected with the other end of the first capacitor module and the input end of the fourth switch; the output end of the second switch is connected with one end of the second capacitor module, and the connected wiring end is the output end of any charge pump booster sub-circuit; the output end of the fourth switch and the other end of the second capacitor module are grounded;
the charge pump booster sub-circuit is used for turning off the first switch and the fourth switch and turning on the second switch and the third switch in a first stage; in a second stage, the second switch and the third switch are turned off, and the first switch and the fourth switch are turned on.
Further optionally, the any charge pump boost sub-circuit further includes a third capacitor module, one end of the third capacitor module is connected to the input end of the any charge pump boost sub-circuit, and the other end of the third capacitor module is grounded;
and the third capacitor module is used for stabilizing the direct current input of any charge pump boosting sub-circuit.
Preferably, the Boost module comprises a Boost sub-circuit or more than two Boost sub-circuits connected in parallel.
Correspondingly, the embodiment of the invention also provides electronic equipment comprising the boost circuit.
Correspondingly, an embodiment of the present invention further provides a boosting method, which is applied to a boosting circuit, where the boosting circuit includes a charge pump boosting module and a Boost boosting module, and the method includes:
the charge pump boosting module is controlled to Boost the voltage of a set input power supply to a set voltage value and output the voltage to the Boost module;
and controlling the Boost module to Boost the set voltage value to a set target voltage value.
Optionally, the charge pump voltage boost module includes a charge pump voltage boost sub-circuit, any charge pump voltage boost sub-circuit includes a first capacitor module and a second capacitor module, and the control of the charge pump voltage boost module to boost the voltage of the set input power supply to the set voltage value is implemented in the following manner:
for any charge pump boosting sub-circuit, in a first stage, controlling the first capacitor module to be connected in series with a direct current input of the charge pump boosting sub-circuit and to discharge so as to charge the second capacitor module and provide an output direct current; in the second stage, the direct current input of any charge pump boosting sub-circuit is controlled to charge the first capacitor module, and the second capacitor module discharges to provide output direct current;
wherein the dc input of any charge pump boosting sub-circuit is the dc output of the set input power supply or a preceding charge pump boosting sub-circuit of any charge pump boosting sub-circuit.
Preferably, the controlling the charge pump boosting module to Boost the voltage of the set input power to the set voltage value and output the boosted voltage value to the Boost module specifically includes:
controlling more than two charge pump boosting sub-modules connected in series to Boost the voltage of a set input power supply to a set voltage value and output the voltage to the Boost module; any charge pump boosting submodule comprises one charge pump boosting sub-circuit or more than two parallel charge pump boosting sub-circuits; or,
controlling a charge pump boosting submodule block to Boost the voltage of a set input power supply to a set voltage value and outputting the voltage to a Boost module; any charge pump boosting submodule comprises more than two parallel charge pump boosting submodules.
Preferably, the any charge pump boost sub-circuit further comprises a first switch, a second switch, a third switch and a fourth switch, an input end of the first switch is connected with an input end of the third switch, and a connected terminal is an input end of the any charge pump boost sub-circuit; the output end of the first switch is connected with the input end of the second switch and one end of the first capacitor module; the output end of the third switch is connected with the other end of the first capacitor module and the input end of the fourth switch; the output end of the second switch is connected with one end of the second capacitor module, and the connected wiring end is the output end of any charge pump booster sub-circuit; the output end of the fourth switch and the other end of the second capacitor module are grounded;
the method for controlling the charge pump boosting module to Boost the voltage of the set input power supply to a set voltage value and output the set voltage value to the Boost module specifically comprises the following steps:
for any charge pump boosting sub-circuit, in a first stage, the first switch and the fourth switch are controlled to be turned off, and the second switch and the third switch are controlled to be turned on; and in the second stage, the second switch and the third switch are controlled to be turned off, and the first switch and the fourth switch are controlled to be turned on.
Optionally, the controlling the Boost module to Boost the set voltage value to a set target voltage value specifically includes:
and controlling one Boost sub-circuit or more than two parallel Boost sub-circuits to Boost the set voltage value to a set target voltage value.
The invention has the following beneficial effects:
the embodiment of the invention provides a booster circuit, a boosting method and electronic equipment.A charge pump boosting module can Boost the voltage of a set input power supply to a set voltage value and output the voltage to a Boost module; the Boost module may Boost the set voltage value to a set target voltage value. That is to say, a charge pump boosting module is arranged in front of the Boost boosting module to pre-Boost the input voltage of the Boost boosting module, so that the voltage difference between the input voltage and the output voltage of the Boost boosting module is reduced compared with the voltage boosting by only adopting a Boost boosting circuit, and further the loss of the Boost boosting module is reduced; in addition, the charge pump boosting module does not comprise an inductive element, and boosting is realized only by charging and discharging of a capacitive element, so that the conversion efficiency is high and the loss is low; therefore, when the boosting amplitude is large, the conversion efficiency of the whole boosting circuit is still high, the loss is still low, and the problem that the loss of the boosting circuit becomes large along with the increase of the boosting amplitude is avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive efforts.
FIG. 1 is a schematic diagram of a topology of a prior art Boost circuit;
fig. 2 is a schematic diagram of a specific circuit structure of a Boost circuit in the prior art;
FIG. 3 is a schematic diagram of a boost circuit according to an embodiment of the present invention;
FIG. 4(a) is a schematic diagram of an equivalent circuit of the charge pump boost sub-circuit in the first stage according to the embodiment of the present invention;
FIG. 4(b) is a schematic diagram of an equivalent circuit of the charge pump boosting sub-circuit in the second stage according to the embodiment of the present invention;
FIG. 5 is a schematic diagram of a charge pump boost sub-circuit according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of another exemplary embodiment of a charge pump boost sub-circuit;
FIG. 7(a) is a schematic diagram of another equivalent circuit of the charge pump boost sub-circuit in the first stage according to the embodiment of the present invention;
FIG. 7(b) is a schematic diagram of another equivalent circuit of the charge pump boosting sub-circuit in the second stage according to the embodiment of the present invention;
fig. 8 is a flowchart illustrating steps of a boosting method according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the embodiment of the invention provides a boosting circuit which can be applied to electronic equipment such as a smart phone, a tablet personal computer, a smart watch and an electronic reader. Specifically, as shown in fig. 3, which is a schematic structural diagram of the voltage Boost circuit according to the first embodiment of the present invention, the voltage Boost circuit may include a charge pump voltage Boost module 301 and a Boost voltage Boost module 302, where:
the charge pump boosting module 301 may be configured to Boost a voltage of a set input power to a set voltage value, and output the voltage to the Boost boosting module 302;
the Boost module 302 may be configured to Boost the set voltage value to a set target voltage value.
Preferably, the charge pump boost module 301 may include a charge pump boost sub-circuit; any charge pump boost sub-circuit comprises a first capacitor module C1 and a second capacitor module C2, which is an equivalent circuit schematic diagram of the any charge pump boost sub-circuit at T1 in a first stage T1 as shown in fig. 4(a), wherein the first capacitor module is connected in series with the dc input of the any charge pump boost sub-circuit and discharges to charge the second capacitor module and provide an output dc; a second stage T2, shown in fig. 4(b), which is an equivalent circuit diagram of the any charge pump boost sub-circuit at T2, where the dc input of the any charge pump boost sub-circuit charges the first capacitor module C1, and the second capacitor module C2 discharges to provide the output dc; wherein the dc input of any charge pump boosting sub-circuit is the dc output of the set input power supply or a preceding charge pump boosting sub-circuit of any charge pump boosting sub-circuit.
That is to say, the charge pump Boost module 301 is arranged before the Boost module 302 to pre-Boost the input voltage of the Boost module 302, so that the voltage difference between the input voltage and the output voltage of the Boost module 302 is reduced compared with the case of boosting only by using a Boost circuit, and further the loss of the Boost module 302 is reduced; in addition, the charge pump boosting module 301 does not include inductive elements, and boosting is realized only by charging and discharging capacitive elements, so that the conversion efficiency is high and the loss is low; therefore, when the boosting amplitude is large, the conversion efficiency of the whole boosting circuit is still high, the loss is still low, and the problem that the loss of the boosting circuit becomes large along with the increase of the boosting amplitude is avoided.
Specifically, a set working period T of any charge pump voltage boost sub-circuit is set (which can be flexibly set according to actual conditions), the first stage T1 and the second stage T2 each account for 1/2 of the set working period T, and the charge-discharge duty cycle of the second capacitor module C2 is 50%, so that the voltage value of the second capacitor module C2 is equal to the sum of the voltage value of the dc input of any charge pump voltage boost sub-circuit and the voltage value of the first capacitor module C1, and therefore, the voltage value of the second capacitor module C2 is equal to 2 times of the voltage value of the dc input of any charge pump voltage boost sub-circuit, that is, the output voltage value of any charge pump voltage boost sub-circuit is 2 times of the voltage value of the dc input of any charge pump voltage boost sub-circuit.
Preferably, the setting input power supply may specifically be a battery module in the electronic device, and may also be another functional module that can be used for supplying power in the electronic device, which is not limited in this embodiment.
Also optionally, the first capacitance module C1 may include one capacitor, or may include a plurality of capacitors combined together in series, parallel, or a combination thereof; the second capacitor module C2 may include one capacitor, or may include a plurality of capacitors combined together in a series manner, a parallel manner, or a combination of series and parallel, which is not limited herein.
Preferably, the charge pump boost module 301 may include more than two charge pump boost sub-modules connected in series; any one of the charge pump boosting sub-modules can comprise one charge pump boosting sub-circuit or more than two parallel charge pump boosting sub-circuits; alternatively, the charge pump boost module 301 may include a charge pump boost submodule; any one of the charge pump boosting sub-modules can comprise more than two parallel charge pump boosting sub-circuits.
That is, the charge pump boost module 301 may include only one charge pump boost sub-circuit, and may be formed by combining a plurality of charge pump boost sub-circuits in a cascade and/or parallel manner. The charge pump boosting sub-circuits at the same stage form a charge pump boosting sub-module, which is used for doubling the output voltage of the previous stage charge pump boosting sub-module or the voltage of the set input power supply, and outputting the voltage to the next stage or serving as the output of the charge pump boosting module 301; the cascade of multiple charge pump boost sub-modules may result in a larger magnitude of boost for the charge pump boost module 301. The plurality of charge pump boosting sub-circuits connected in parallel in any charge pump boosting sub-module can shunt the total current in the boosting circuit, so that the current flowing through each charge pump boosting sub-circuit is small, the loss of equivalent impedance in the charge pump boosting sub-circuits is low, and the loss of the charge pump boosting module 301 can be reduced.
Optionally, as shown in fig. 5, it is a schematic structural diagram of any charge pump boost sub-circuit, which may further include a first switch S1, a second switch S2, a third switch S2 and a fourth switch S4, where:
the input end of the first switch S1 is connected with the input end of the third switch S3, and the connected terminal is the input end of any charge pump booster sub-circuit; the output end of the first switch S1 is connected with the input end of the second switch S2 and one end of the first capacitor module C1; the output end of the third switch S3 is connected with the other end of the first capacitor module C1 and the input end of the fourth switch S4; the output end of the second switch S2 is connected to one end of the second capacitor module C2, and the connected terminal is the output end of any charge pump boost sub-circuit; the output end of the fourth switch S4 and the other end of the second capacitor module C2 are both grounded;
either charge pump boost sub-circuit is operable, during a first phase T1, to turn off the first switch S1 and the fourth switch S4, and turn on the second switch S2 and the third switch S3; at this time, an equivalent circuit diagram of any one of the charge pump boosting sub-circuits is as shown in fig. 4(a) (assuming that the equivalent impedances of the second switch S2 and the third switch S3 are both zero); in a second phase T2, turn off the second switch S2 and the third switch S3, turn on the first switch S1 and the fourth switch S4; at this time, an equivalent circuit diagram of any one of the charge pump boosting sub-circuits is as shown in fig. 4(b) (assuming that the equivalent impedances of the first switch S1 and the fourth switch S4 are both zero).
Preferably, the first switch S1, the second switch S2, the third switch S3 and the fourth switch S4 may be MOS transistors; since the on-resistances of the first switch S1, the second switch S2, the third switch S3 and the fourth switch S4 are very low, the loss and heat generation of any charge pump boost sub-circuit are very small, and the power conversion efficiency is very high; further, the conversion efficiency of the booster circuit and the safety of the electronic device can be further improved. In addition, other types of switching devices may be used for the switches, and the present embodiment is not limited in any way.
Further optionally, as shown in fig. 6, the any charge pump boost sub-circuit may further include a third capacitance module C3, where one end of the third capacitance module C3 is connected to the input terminal of the any charge pump boost sub-circuit, and the other end is grounded;
the third capacitor module C3 may be configured to stabilize the dc input of any of the charge pump boost sub-circuits.
When any charge pump boost sub-circuit further includes a third capacitor module C3, in the first stage T1, the equivalent circuit of any charge pump boost sub-circuit is as shown in fig. 7(a), where R2 and R3 are the on equivalent impedances of the second switch S2 and the third switch S3, respectively; in the second stage T2, the equivalent circuit of any one of the charge pump boosting sub-circuits is shown in fig. 7(b), where R1 and R4 are the on equivalent resistances of the first switch S1 and the fourth switch S4, respectively. The operation principle of the equivalent circuit shown in fig. 7(a) and 7(b) is similar to that of the equivalent circuit shown in fig. 4(a) and 4(b), and the description of this embodiment is omitted here.
Further optionally, the third capacitor module C3 may include one capacitor, or may include a plurality of capacitors combined together in a series manner, a parallel manner, or a combination of series and parallel, which is not limited herein.
It should be noted that, the boost circuit may further include a control module, configured to send a first control signal to the charge pump boost module 301 to turn off the first switch S1 and the fourth switch S4 and turn on the second switch S2 and the third switch S3 in a first phase T1; for sending a second control signal to the charge pump boost module 301 to turn off the second switch S2 and the third switch S3 and turn on the first switch S1 and the fourth switch S4 in a second phase T2.
Preferably, the Boost module 302 includes one Boost sub-circuit or more than two Boost sub-circuits connected in parallel. That is to say, the Boost module 302 may also adopt a structure in which more than two Boost sub-circuits are connected in parallel, so as to reduce the current flowing through each path of Boost sub-circuit, and further reduce the loss of the equivalent impedance in the Boost module 302. The specific circuit structure of the Boost sub-circuit is similar to that of the prior art, as shown in fig. 1 or fig. 2, and the detailed description of the present embodiment is omitted here.
It should be noted that the set target voltage value may be flexibly set according to a rated voltage value of a load of the Boost circuit, and a specific operating principle of the Boost sub-circuit is similar to that in the prior art, which is not described herein again.
Optionally, the control module may be further configured to send a third control signal to the Boost module 302 according to a rated voltage value of a load of the Boost circuit, so that the Boost module 302 boosts the set voltage value output by the charge pump Boost module 301 to the rated voltage value.
It should be noted that the control module may be implemented by a set function module in an application processor of the electronic device, or may be implemented by a specially configured processor chip, and this embodiment is not limited in any way herein.
In summary, the Boost circuit provided in the embodiment of the present invention may include a charge pump Boost module and a Boost module; the charge pump boosting module can be used for boosting the voltage of a set input power supply to a set voltage value and outputting the voltage to the Boost module; and the Boost module can be used for boosting the set voltage value to a set target voltage value. That is to say, a charge pump boosting module is arranged in front of the Boost boosting module to pre-Boost the input voltage of the Boost boosting module, so that the voltage difference between the input voltage and the output voltage of the Boost boosting module is reduced compared with the voltage boosting by only adopting a Boost boosting circuit, and further the loss of the Boost boosting module is reduced; in addition, the charge pump boosting module does not comprise an inductive element, and boosting is realized only by charging and discharging of a capacitive element, so that the conversion efficiency is high and the loss is low; therefore, when the boosting amplitude is large, the conversion efficiency of the whole boosting circuit is still high, the loss is still low, and the problem that the loss of the boosting circuit becomes large along with the increase of the boosting amplitude is avoided.
Based on the same inventive concept, the embodiment of the invention also provides electronic equipment comprising the boost circuit.
Example two:
based on the same inventive concept, the second embodiment of the invention provides a boosting method, which can be applied to boosting control of a boosting circuit in electronic equipment such as a smart phone, a tablet computer, a smart watch, an electronic reader and the like; as shown in fig. 3, the Boost circuit includes a charge pump Boost module 301 and a Boost module 302; specifically, as shown in fig. 8, which is a flowchart of steps of the boosting method according to the second embodiment of the present invention, the method may include:
step 801: the charge pump boosting module 301 is controlled to Boost the voltage of the set input power supply to a set voltage value and output the voltage to the Boost boosting module 302.
Step 802: and controlling the Boost module 302 to Boost the set voltage value to a set target voltage value.
That is to say, the charge pump Boost module 301 is arranged before the Boost module 302 to pre-Boost the input voltage of the Boost module 302, so that the voltage difference between the input voltage and the output voltage of the Boost module 302 is reduced compared with the case of boosting only by using a Boost circuit, and further the loss of the Boost module 302 is reduced; in addition, the charge pump boosting module 301 does not include inductive elements, and boosting is realized only by charging and discharging capacitive elements, so that the conversion efficiency is high and the loss is low; therefore, when the boosting amplitude is large, the conversion efficiency of the whole boosting circuit is still high, the loss is still low, and the problem that the loss of the boosting circuit becomes large along with the increase of the boosting amplitude is avoided.
Preferably, the charge pump boost module 301 comprises a charge pump boost sub-circuit, either of which comprises a first capacitive module C1 and a second capacitive module C2;
the control of the charge pump boosting module 301 to boost the voltage of the set input power supply to the set voltage value is implemented by:
for any charge pump boost sub-circuit, in the first stage, as shown in fig. 4(a), the first capacitor module C1 is controlled to be connected in series with the dc input of any charge pump boost sub-circuit and to be discharged, so as to charge the second capacitor module C2 and provide an output dc current; in the second stage, as shown in fig. 4(b), the dc input of any one of the charge pump boost sub-circuits is controlled to charge the first capacitor module C1, and the second capacitor module C2 is discharged to provide the output dc power; wherein the dc input of any charge pump boosting sub-circuit is the dc output of the set input power supply or a preceding charge pump boosting sub-circuit of any charge pump boosting sub-circuit.
Preferably, step 801 controls the charge pump boosting module 301 to Boost the voltage of the set input power to a set voltage value and output the boosted voltage value to the Boost boosting module 302, which may specifically include:
controlling more than two charge pump boosting sub-modules connected in series to Boost the voltage of a set input power supply to a set voltage value and output the voltage to the Boost module 302; any charge pump boosting submodule comprises one charge pump boosting sub-circuit or more than two parallel charge pump boosting sub-circuits; or,
controlling a charge pump boosting submodule block to Boost the voltage of a set input power supply to a set voltage value and outputting the voltage to the Boost module 302; any charge pump boosting submodule comprises more than two parallel charge pump boosting submodules.
That is, the charge pump boost module 301 may include only one charge pump boost sub-circuit, and may be formed by combining a plurality of charge pump boost sub-circuits in a cascade and/or parallel manner. The charge pump boosting sub-circuits at the same stage form a charge pump boosting sub-module, which is used for doubling the output voltage of the previous stage charge pump boosting sub-module or the voltage of the set input power supply, and outputting the voltage to the next stage or serving as the output of the charge pump boosting module 301; the cascade of multiple charge pump boost sub-modules may result in a larger magnitude of boost for the charge pump boost module 301. The plurality of charge pump boosting sub-circuits connected in parallel in any charge pump boosting sub-module can shunt the total current in the boosting circuit, so that the current flowing through each charge pump boosting sub-circuit is small, the loss of equivalent impedance in the charge pump boosting sub-circuits is low, and the loss of the charge pump boosting module 301 can be reduced.
Further optionally, as shown in fig. 5, the any charge pump boost sub-circuit further includes a first switch S1, a second switch S2, a third switch S3, and a fourth switch S4, an input terminal of the first switch S1 is connected to an input terminal of the third switch S3, and a connected terminal is an input terminal of the any charge pump boost sub-circuit; the output end of the first switch S1 is connected with the input end of the second switch S2 and one end of the first capacitor module C1; the output end of the third switch S3 is connected with the other end of the first capacitor module C1 and the input end of the fourth switch S4; the output end of the second switch S2 is connected to one end of the second capacitor module C2, and the connected terminal is the output end of any charge pump boost sub-circuit; the output end of the fourth switch S4 and the other end of the second capacitor module C2 are both grounded;
correspondingly, step 801 controls the charge pump boosting module 301 to Boost the voltage of the set input power to the set voltage value and output the boosted voltage value to the Boost boosting module 302, which may specifically include:
for any charge pump boosting sub-circuit, in a first phase, the first switch S1 and the fourth switch S4 are controlled to be turned off, and the second switch S2 and the third switch S3 are controlled to be turned on; in the second phase, the second switch S2 and the third switch S3 are controlled to be turned off, and the first switch S1 and the fourth switch S4 are controlled to be turned on.
Preferably, the first switch S1, the second switch S2, the third switch S3 and the fourth switch S4 may be MOS transistors; since the on-resistances of the first switch S1, the second switch S2, the third switch S3 and the fourth switch S4 are very low, the loss and heat generation of any charge pump boost sub-circuit are very small, and the power conversion efficiency is very high; further, the conversion efficiency of the booster circuit and the safety of the electronic device can be further improved. In addition, other types of switching devices may be used for the switches, and the present embodiment is not limited in any way.
Optionally, the step 802 of controlling the Boost module 302 to Boost the set voltage value to the set target voltage value may specifically include:
and controlling one Boost sub-circuit or more than two parallel Boost sub-circuits to Boost the set voltage value to a set target voltage value.
That is to say, the Boost module 302 may also adopt a structure in which more than two Boost sub-circuits are connected in parallel, so as to reduce the current flowing through each path of Boost sub-circuit, and further reduce the loss of the equivalent impedance in the Boost module 302. The specific circuit structure of the Boost sub-circuit is similar to that of the prior art, as shown in fig. 1 or fig. 2, and the detailed description of the present embodiment is omitted here.
The set target voltage value can be flexibly set according to the rated voltage value of the load of the Boost circuit, the specific control principle of the Boost sub-circuit is similar to that of the prior art, and the detailed description is omitted here.
Also optionally, the controlling the Boost module 302 to Boost the set voltage value to the set target voltage value may specifically include:
according to the rated voltage value of the load of the Boost circuit, the Boost module 302 is controlled to Boost the set voltage value output by the charge pump Boost module 301 to the rated voltage value.
It should be noted that the implementation main body of the boost circuit provided in this embodiment may be a set function module in an application processor of an electronic device, or may be a specially-configured processor chip, and this embodiment is not limited in any way herein.
In summary, the boosting method provided by the embodiment of the invention is applied to a boosting circuit, and the boosting circuit comprises a charge pump boosting module and a Boost boosting module; the charge pump boosting module can be controlled to Boost the voltage of a set input power supply to a set voltage value and output the voltage to the Boost module; and controlling the Boost module to Boost the set voltage value to a set target voltage value. That is to say, a charge pump boosting module is arranged in front of the Boost boosting module to pre-Boost the input voltage of the Boost boosting module, so that the voltage difference between the input voltage and the output voltage of the Boost boosting module is reduced compared with the voltage boosting by only adopting a Boost boosting circuit, and further the loss of the Boost boosting module is reduced; in addition, the charge pump boosting module does not comprise an inductive element, and boosting is realized only by charging and discharging of a capacitive element, so that the conversion efficiency is high and the loss is low; therefore, when the boosting amplitude is large, the conversion efficiency of the whole boosting circuit is still high, the loss is still low, and the problem that the loss of the boosting circuit becomes large along with the increase of the boosting amplitude is avoided.
Furthermore, any number of elements in the drawings and description are to be regarded as illustrative in nature and not as restrictive, and any naming is intended to be distinguishing rather than limiting.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, apparatus (device), or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention has been described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (devices) and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (12)

1. A Boost circuit, comprising a charge pump Boost module and a Boost module, wherein:
the charge pump boosting module is used for boosting the voltage of a set input power supply to a set voltage value and outputting the voltage to the Boost module;
and the Boost module is used for boosting the set voltage value to a set target voltage value.
2. The boost circuit of claim 1, wherein the charge pump boost module comprises a charge pump boost sub-circuit, wherein:
in the first stage, the first capacitor module is connected in series with the direct current input of any charge pump boosting sub-circuit and discharges to charge the second capacitor module and provide output direct current; in the second stage, the direct current input of any charge pump boosting sub-circuit charges the first capacitor module, and the second capacitor module discharges to provide output direct current; wherein the dc input of any charge pump boosting sub-circuit is the dc output of the set input power supply or a preceding charge pump boosting sub-circuit of any charge pump boosting sub-circuit.
3. The booster circuit of claim 2,
the charge pump boosting module comprises more than two charge pump boosting sub-modules which are connected in series; any charge pump boosting submodule comprises one charge pump boosting sub-circuit or more than two parallel charge pump boosting sub-circuits; or,
the charge pump boosting module comprises a charge pump boosting submodule; any charge pump boosting submodule comprises more than two parallel charge pump boosting submodules.
4. A boost circuit in accordance with claim 2 or 3, wherein any of the charge pump boost sub-circuits further comprises a first switch, a second switch, a third switch, and a fourth switch, wherein:
the input end of the first switch is connected with the input end of the third switch, and the connected terminal is the input end of any charge pump booster sub-circuit; the output end of the first switch is connected with the input end of the second switch and one end of the first capacitor module; the output end of the third switch is connected with the other end of the first capacitor module and the input end of the fourth switch; the output end of the second switch is connected with one end of the second capacitor module, and the connected wiring end is the output end of any charge pump booster sub-circuit; the output end of the fourth switch and the other end of the second capacitor module are grounded;
the charge pump booster sub-circuit is used for turning off the first switch and the fourth switch and turning on the second switch and the third switch in a first stage; in a second stage, the second switch and the third switch are turned off, and the first switch and the fourth switch are turned on.
5. The booster circuit of claim 4, wherein the any charge pump booster sub-circuit further comprises a third capacitive module, one end of the third capacitive module being connected to the input terminal of the any charge pump booster sub-circuit, the other end of the third capacitive module being connected to ground;
and the third capacitor module is used for stabilizing the direct current input of any charge pump boosting sub-circuit.
6. The Boost circuit of claim 1, wherein the Boost module comprises one Boost sub-circuit or more than two Boost sub-circuits connected in parallel.
7. An electronic device comprising the booster circuit according to any one of claims 1 to 6.
8. A boosting method is applied to a boosting circuit, the boosting circuit comprises a charge pump boosting module and a Boost boosting module, and the method is characterized by comprising the following steps:
the charge pump boosting module is controlled to Boost the voltage of a set input power supply to a set voltage value and output the voltage to the Boost module;
and controlling the Boost module to Boost the set voltage value to a set target voltage value.
9. A boosting method according to claim 8, wherein said charge pump boosting module comprises a charge pump boosting sub-circuit, any charge pump boosting sub-circuit comprises a first capacitance module and a second capacitance module, and said charge pump boosting module is controlled to boost the voltage of the set input power supply to the set voltage value by:
for any charge pump boosting sub-circuit, in a first stage, controlling the first capacitor module to be connected in series with a direct current input of the charge pump boosting sub-circuit and to discharge so as to charge the second capacitor module and provide an output direct current; in the second stage, the direct current input of any charge pump boosting sub-circuit is controlled to charge the first capacitor module, and the second capacitor module discharges to provide output direct current;
wherein the dc input of any charge pump boosting sub-circuit is the dc output of the set input power supply or a preceding charge pump boosting sub-circuit of any charge pump boosting sub-circuit.
10. A boosting method according to claim 9, wherein controlling the charge pump boosting module to Boost a voltage of a set input power supply to a set voltage value and output the boosted voltage value to the Boost boosting module specifically comprises:
controlling more than two charge pump boosting sub-modules connected in series to Boost the voltage of a set input power supply to a set voltage value and output the voltage to the Boost module; any charge pump boosting submodule comprises one charge pump boosting sub-circuit or more than two parallel charge pump boosting sub-circuits; or,
controlling a charge pump boosting submodule block to Boost the voltage of a set input power supply to a set voltage value and outputting the voltage to a Boost module; any charge pump boosting submodule comprises more than two parallel charge pump boosting submodules.
11. A boosting method according to claim 9 or 10, wherein said any charge pump boosting sub-circuit further comprises a first switch, a second switch, a third switch and a fourth switch, an input terminal of said first switch is connected to an input terminal of said third switch, and a connected terminal is an input terminal of said any charge pump boosting sub-circuit; the output end of the first switch is connected with the input end of the second switch and one end of the first capacitor module; the output end of the third switch is connected with the other end of the first capacitor module and the input end of the fourth switch; the output end of the second switch is connected with one end of the second capacitor module, and the connected wiring end is the output end of any charge pump booster sub-circuit; the output end of the fourth switch and the other end of the second capacitor module are grounded;
the method for controlling the charge pump boosting module to Boost the voltage of the set input power supply to a set voltage value and output the set voltage value to the Boost module specifically comprises the following steps:
for any charge pump boosting sub-circuit, in a first stage, the first switch and the fourth switch are controlled to be turned off, and the second switch and the third switch are controlled to be turned on; and in the second stage, the second switch and the third switch are controlled to be turned off, and the first switch and the fourth switch are controlled to be turned on.
12. A boosting method according to claim 8, wherein said controlling said Boost module to Boost said set voltage value to a set target voltage value specifically comprises:
and controlling one Boost sub-circuit or more than two parallel Boost sub-circuits to Boost the set voltage value to a set target voltage value.
CN201711130908.4A 2017-11-15 2017-11-15 A kind of booster circuit, step-up method and electronic equipment Pending CN107834845A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711130908.4A CN107834845A (en) 2017-11-15 2017-11-15 A kind of booster circuit, step-up method and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711130908.4A CN107834845A (en) 2017-11-15 2017-11-15 A kind of booster circuit, step-up method and electronic equipment

Publications (1)

Publication Number Publication Date
CN107834845A true CN107834845A (en) 2018-03-23

Family

ID=61651713

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711130908.4A Pending CN107834845A (en) 2017-11-15 2017-11-15 A kind of booster circuit, step-up method and electronic equipment

Country Status (1)

Country Link
CN (1) CN107834845A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111462708A (en) * 2020-04-29 2020-07-28 深圳市华星光电半导体显示技术有限公司 Voltage conversion circuit, voltage conversion method and display device
CN113783421A (en) * 2021-10-15 2021-12-10 澳门大学 A DC boost converter
CN114597983A (en) * 2020-12-04 2022-06-07 华为技术有限公司 A wireless charging circuit and system, electronic device and control method
CN115037148A (en) * 2022-07-04 2022-09-09 禹创半导体(深圳)有限公司 A small-size driver panel without capacitors based on PUMP design
CN115134436A (en) * 2021-03-25 2022-09-30 北京小米移动软件有限公司 Power supply units and electronic equipment
CN117614088A (en) * 2024-01-24 2024-02-27 荣耀终端有限公司 Power processing circuits, methods and electronic devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1893245A (en) * 2005-07-05 2007-01-10 恩益禧电子股份有限公司 Power equipment incorporating
US20150364992A1 (en) * 2014-06-16 2015-12-17 Samsung Electro-Mechanics Co., Ltd. Charge pump system and charge pump protection circuit
CN106961214A (en) * 2017-04-17 2017-07-18 京东方科技集团股份有限公司 A kind of boost control circuit, its driving method and display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1893245A (en) * 2005-07-05 2007-01-10 恩益禧电子股份有限公司 Power equipment incorporating
US20150364992A1 (en) * 2014-06-16 2015-12-17 Samsung Electro-Mechanics Co., Ltd. Charge pump system and charge pump protection circuit
CN106961214A (en) * 2017-04-17 2017-07-18 京东方科技集团股份有限公司 A kind of boost control circuit, its driving method and display device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111462708A (en) * 2020-04-29 2020-07-28 深圳市华星光电半导体显示技术有限公司 Voltage conversion circuit, voltage conversion method and display device
CN114597983A (en) * 2020-12-04 2022-06-07 华为技术有限公司 A wireless charging circuit and system, electronic device and control method
WO2022117052A1 (en) * 2020-12-04 2022-06-09 华为技术有限公司 Wireless charging circuit and system, electronic device, and control method
CN115134436A (en) * 2021-03-25 2022-09-30 北京小米移动软件有限公司 Power supply units and electronic equipment
CN113783421A (en) * 2021-10-15 2021-12-10 澳门大学 A DC boost converter
CN113783421B (en) * 2021-10-15 2025-02-21 澳门大学 A DC boost converter
CN115037148A (en) * 2022-07-04 2022-09-09 禹创半导体(深圳)有限公司 A small-size driver panel without capacitors based on PUMP design
CN117614088A (en) * 2024-01-24 2024-02-27 荣耀终端有限公司 Power processing circuits, methods and electronic devices

Similar Documents

Publication Publication Date Title
CN107834845A (en) A kind of booster circuit, step-up method and electronic equipment
US10978898B2 (en) Charging circuit, system and method, and electronic device
US8258857B2 (en) Charge pump circuits and methods
CN107465339B (en) Method and circuit for soft starting high-power charge pump
WO2019120295A1 (en) Power supply circuit, series power supply method and computing system thereof
US9768682B2 (en) Switched capacitors with inverted break-before-make without external filtering load capacitor
EP3334024B1 (en) Voltage regulator having boost and charge pump functionality
JP2007257813A5 (en)
EP2337200B1 (en) A sub-stage for a charge pump
CN105207316A (en) Battery voltage control chip and method
US11527951B2 (en) Reverse X2 mode charge pump soft start
CN113824196B (en) Battery charging circuit, device and terminal equipment
US10305308B2 (en) Power supply module and power supply method using the same
CN102290992A (en) DC-DC boost converter circuit and method for driving the same
CN114400890B (en) Power conversion structure, system, method, electronic device including the same, and chip unit
CN107017758B (en) Controller
CN207853759U (en) A kind of booster circuit and electronic equipment
TWI481174B (en) Power supply, system for switching between input voltage and output voltage, and method for converting voltage
US20130294123A1 (en) Charge pump
Liu et al. A current-mode buck converter with a pulse-skipping soft-start circuit
CN101917042A (en) Lithium battery charger and DC booster integrated circuit system
CN216900809U (en) Test circuit and test system of chip
CN104426347A (en) Switch circuit
US6738273B2 (en) Charge pump drive signal recovery circuit
CN112003472B (en) Buck conversion circuit

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20180323

RJ01 Rejection of invention patent application after publication