CN107815686A - A kind of stainless steel nano method for treating - Google Patents
A kind of stainless steel nano method for treating Download PDFInfo
- Publication number
- CN107815686A CN107815686A CN201711067892.7A CN201711067892A CN107815686A CN 107815686 A CN107815686 A CN 107815686A CN 201711067892 A CN201711067892 A CN 201711067892A CN 107815686 A CN107815686 A CN 107815686A
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- Prior art keywords
- stainless steel
- nano method
- cleaning
- treating
- steel nano
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 31
- 239000010935 stainless steel Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 238000004140 cleaning Methods 0.000 claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 14
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 235000011089 carbon dioxide Nutrition 0.000 claims abstract description 12
- 238000005406 washing Methods 0.000 claims abstract description 12
- 239000003814 drug Substances 0.000 claims abstract description 9
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000006386 neutralization reaction Methods 0.000 claims abstract description 4
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 3
- 239000010959 steel Substances 0.000 claims abstract description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 6
- 239000000243 solution Substances 0.000 claims description 6
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- 239000004375 Dextrin Substances 0.000 claims description 3
- 229920001353 Dextrin Polymers 0.000 claims description 3
- 239000004115 Sodium Silicate Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 3
- 235000019425 dextrin Nutrition 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 230000007935 neutral effect Effects 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 235000013024 sodium fluoride Nutrition 0.000 claims description 3
- 239000011775 sodium fluoride Substances 0.000 claims description 3
- 235000019795 sodium metasilicate Nutrition 0.000 claims description 3
- 239000001488 sodium phosphate Substances 0.000 claims description 3
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 3
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 3
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 3
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 3
- 235000010489 acacia gum Nutrition 0.000 claims description 2
- 239000001785 acacia senegal l. willd gum Substances 0.000 claims description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 abstract description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 4
- 238000001746 injection moulding Methods 0.000 abstract description 3
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 229910001431 copper ion Inorganic materials 0.000 abstract description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 abstract 1
- 229910000403 monosodium phosphate Inorganic materials 0.000 abstract 1
- 235000019799 monosodium phosphate Nutrition 0.000 abstract 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 abstract 1
- 230000006872 improvement Effects 0.000 description 9
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- 235000011008 sodium phosphates Nutrition 0.000 description 2
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 239000002696 acid base indicator Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a kind of stainless steel nano method for treating, step includes oil removing, hot water cleaning, Dry ice cleaning, nanometered disposal, washing, Dry ice cleaning, alkaline etching, the water cleaning of two companies, neutralization, washing, and the medicament and dosage that nanometered disposal step is selected are:The 300g/L of ferric trichloride 250, hydrochloric acid 50 100g/L, Cu2+20 30g/L, the 10g/L of sodium dihydrogen phosphate 5;The temperature of nanometered disposal is 20 60 DEG C, and the used time is 60 240s.Present invention reaction is gentle, and etching speed is uniform, can form pits in stainless steel surfaces, the pit of formation is uniform, and a step is completed, and saves time cost.By using copper ion, enable to etch steady progress so that the hole depth is uniform;The pit of formation resin in injection moulding process is filled in nanometer pit, is formed close connection with stainless steel surfaces, is improved the adhesion strength of resin and steel.
Description
Technical field
The present invention relates to stainless steel surfaces processing technology field, more particularly to a kind of stainless steel nano method for treating.
Background technology
Plastic-metal composite forming technology, it is in metal surface injection molding, formation one by plastics.First in metal watch
After face forms nano aperture, pass through certain pressure so that in the pore space structure of plastic melt metal surface, surrounded and watched so as to form one kind
Interlocking.Tool is prepared in stainless steel surfaces formation nano aperture structure to acquire a certain degree of difficulty, the different in nature material being commonly used is glued
Technology, there is excessive glue and combine the drawback such as bad, and exist in structure compared with without relevant issues such as independences.
Application number 2017100162936 discloses a kind of surface treatment method of stainless steel, is first etched with mineral acid treatment, then
Etched with fluoride, be divided into two steps, method and step is more, and fluoride environmental pollution is serious.The acidity of inorganic acid is strong, etching
Uniformity it is inadequate.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of stainless steel nano method for treating, this method solve biography
Unite method for treating stainless steel surfaces after treatment etching homogeneity not enough and method cost it is high the problem of.
The technical problems to be solved by the invention are realized using following technical scheme:
A kind of stainless steel nano method for treating, step include oil removing, hot water cleaning, Dry ice cleaning, nanometered disposal, washing,
Dry ice cleaning, alkaline etching, two connect water cleaning, neutralized, washing,
The medicament and dosage that the nanometered disposal step is selected be:
The temperature of nanometered disposal is 20-60 DEG C, used time 60-240s.
Further improvement is that medicament and dosage that the nanometered disposal step is selected are:
The temperature of nanometered disposal is 40 DEG C, used time 120s.
Further improvement is that the Cu2+One kind or more in copper sulphate, the bronze medal of sulfuric acid two, copper chloride, copper nitrate
Kind.
Further improvement is that the oil removing degreasant solution that it is 2-8% with mass concentration that the deoiling step, which is specially,
At least 10min is handled to stainless steel surfaces in 30-45 DEG C.
Further improvement is that the formula of the oil removing degreasant solution includes sodium carbonate 10-15%, hydrogen by mass percentage
Sodium oxide molybdena 5-7%, sodium metasilicate 1-5%, potassium pyrophosphate 3-4%, sodium chloride 1-5%, BTA 0.1-0.3%, nonyl phenol
APEO 1-4%, surplus are water.
Further improvement is that the hot water cleaning step is to soak 15-20min using 60-80 DEG C of water.
Further improvement is that the alkaline etching step is to use sodium hydroxide, sodium phosphate, sodium fluoride, dextrin and Arab
The mixed solution of glue corrodes 10-12min.
Further improvement is that described two connect water cleaning step to be cleaned once using electrical conductivity≤18us/cm pure water
Afterwards, 10min is crossed to clean again once.
Further improvement is that the neutralization procedure is to be put into stainless steel in the water of neutrality, then it is gradually added into acid molten
Agent, until water is changed into neutral again.
The beneficial effects of the invention are as follows:Nanometered disposal medicament of the present invention is reacted using ferric iron and iron, with the use of hydrochloric acid
Performing etching, reaction is gentle, and etching speed is uniform, can form pits in stainless steel surfaces, and the pit of formation is uniform,
One step is completed, and saves time cost.By using copper ion, enable to etch steady progress so that the hole depth is uniform.Shape
Into pit in injection moulding process resin be filled in nanometer pit, form close connection with stainless steel surfaces, improve tree
The adhesion strength of fat and steel.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below
Specific embodiment is closed, the present invention is expanded on further.
Embodiment 1
A kind of stainless steel nano method for treating, step include oil removing, hot water cleaning, Dry ice cleaning, nanometered disposal, washing,
Dry ice cleaning, alkaline etching, two connect water cleaning, neutralized, washing, and the medicament and dosage that the nanometered disposal step is selected are:
The temperature of nanometered disposal is 20 DEG C, used time 60s.
Embodiment 2
A kind of stainless steel nano method for treating, step include oil removing, hot water cleaning, Dry ice cleaning, nanometered disposal, washing,
Dry ice cleaning, alkaline etching, two connect water cleaning, neutralized, washing, and the medicament and dosage that the nanometered disposal step is selected are:
The temperature of nanometered disposal is 40 DEG C, used time 120s.
Embodiment 3
A kind of stainless steel nano method for treating, step include oil removing, hot water cleaning, Dry ice cleaning, nanometered disposal, washing,
Dry ice cleaning, alkaline etching, two connect water cleaning, neutralized, washing, and the medicament and dosage that the nanometered disposal step is selected are:
The temperature of nanometered disposal is 60 DEG C, used time 240s.
Cu in the various embodiments described above2+For copper sulphate and the mix reagent of the bronze medal of sulfuric acid two.
Deoiling step in the various embodiments described above is specially the oil removing degreasant solution for using mass concentration to be 5%, in 35 DEG C
10min is handled to stainless steel surfaces.
The formula of oil removing degreasant solution in the various embodiments described above includes sodium carbonate 12%, sodium hydroxide by mass percentage
6%th, sodium metasilicate 3%, potassium pyrophosphate 3%, sodium chloride 2%, BTA 0.2%, NPE 2%, and
Water 71.8%.
Hot water cleaning step in the various embodiments described above is to soak 20min using 65 DEG C of water.
Alkaline etching step in the various embodiments described above is to use sodium hydroxide, sodium phosphate, sodium fluoride, dextrin and Arabic gum
Mixed solution corrodes 11min.
After the pure water cleaning once that it is 18us/cm using electrical conductivity that two company's water cleaning steps in the various embodiments described above, which are,
10min is crossed to clean again once.
Neutralization procedure in the various embodiments described above is to be put into stainless steel in the water of neutrality, then is gradually added into acid flux material,
Detect the acid-base value of water during dropwise addition in real time by pH test paper or acid-base indicator, stop being added dropwise when water is in neutral.
The basic principles, principal features and advantages of the present invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, the original for simply illustrating the present invention described in above-described embodiment and specification
Reason, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (9)
- A kind of 1. stainless steel nano method for treating, it is characterised in that:Step includes oil removing, hot water cleaning, Dry ice cleaning, nanometers Reason, washing, Dry ice cleaning, alkaline etching, two connect water cleaning, neutralized, washing,The medicament and dosage that the nanometered disposal step is selected be:The temperature of nanometered disposal is 20-60 DEG C, used time 60-240s.
- A kind of 2. stainless steel nano method for treating according to claim 1, it is characterised in that:The nanometered disposal step choosing Medicament and dosage are:The temperature of nanometered disposal is 40 DEG C, used time 120s.
- A kind of 3. stainless steel nano method for treating according to claim 1, it is characterised in that:The Cu2+Selected from copper sulphate, One or more in the bronze medal of sulfuric acid two, copper chloride, copper nitrate.
- A kind of 4. stainless steel nano method for treating according to claim 1, it is characterised in that:The deoiling step is specially The oil removing degreasant solution for being 2-8% with mass concentration, at least 10min is handled to stainless steel surfaces in 30-45 DEG C.
- A kind of 5. stainless steel nano method for treating according to claim 4, it is characterised in that:The oil removing degreasant solution Formula includes sodium carbonate 10-15%, sodium hydroxide 5-7%, sodium metasilicate 1-5%, potassium pyrophosphate 3-4%, chlorine by mass percentage Change sodium 1-5%, BTA 0.1-0.3%, NPE 1-4%, surplus is water.
- A kind of 6. stainless steel nano method for treating according to claim 4, it is characterised in that:The hot water cleaning step is 15-20min is soaked using 60-80 DEG C of water.
- A kind of 7. stainless steel nano method for treating according to claim 4, it is characterised in that:The alkaline etching step is use Sodium hydroxide, sodium phosphate, sodium fluoride, the mixed solution of dextrin and Arabic gum corrode 10-12min.
- A kind of 8. stainless steel nano method for treating according to claim 4, it is characterised in that:Described two connect water cleaning step After using the cleaning once of electrical conductivity≤18us/cm pure water, cross 10min and clean again once.
- A kind of 9. stainless steel nano method for treating according to claim 4, it is characterised in that:The neutralization procedure is will not Rust steel is put into the water of neutrality, then is gradually added into acid flux material, until water is changed into neutral again.
Priority Applications (1)
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CN201711067892.7A CN107815686A (en) | 2017-11-03 | 2017-11-03 | A kind of stainless steel nano method for treating |
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CN201711067892.7A CN107815686A (en) | 2017-11-03 | 2017-11-03 | A kind of stainless steel nano method for treating |
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Cited By (1)
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CN109628932A (en) * | 2018-11-19 | 2019-04-16 | 歌尔股份有限公司 | Composite material and preparation method |
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Cited By (1)
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