CN107733394A - A kind of crystal oscillator and preparation method thereof and electronic equipment - Google Patents

Abstract

The invention provides a crystal oscillator and its manufacturing method and electronic equipment, wherein the crystal oscillator includes: a crystal oscillator body, a carrier board, an electrical connection element, and a buffer structure; the buffer structure includes a conductive shell and a buffer piece, and the conductive shell wraps the buffer The crystal oscillator body is stacked with the carrier board, one end of the electrical connection element is electrically connected to the carrier board, and the other end of the electrical connection element is connected to the conductive shell. The electrical connection element of the crystal oscillator is electrically connected to the circuit board of the electronic device through the conductive shell of the buffer structure. When the crystal oscillator falls along with the electronic equipment, the buffer structure buffers the stress on the crystal oscillator body, thereby achieving the technical effect of avoiding damage to the crystal oscillator body.

Description

A kind of crystal oscillator and its manufacturing method and electronic equipment

technical field

The invention relates to the technical field of communication, in particular to a crystal oscillator, a manufacturing method thereof, and electronic equipment.

Background technique

With the development of communication technology, the functions of electronic components are becoming more and more powerful. Crystal oscillators are usually used to provide basic clock signals for systems and are important components of electronic equipment. The crystal oscillator is mostly attached to a hard PCB substrate, and the solder pad of the crystal oscillator is generally made of a harder metal material. When the crystal oscillator falls with the whole machine, the stress is easily transmitted to the inside of the crystal oscillator, causing damage to the internal material of the crystal oscillator, resulting in failure of the crystal oscillator function. It can be seen that the existing crystal oscillator has the technical problem that it is easy to be damaged when the whole machine is dropped.

Contents of the invention

The purpose of the embodiments of the present invention is to provide a crystal oscillator and its manufacturing method and electronic equipment, so as to solve the technical problem that the existing crystal oscillator is easily damaged when the whole machine is dropped.

In order to achieve the above object, the specific solutions provided by the embodiments of the present invention are as follows:

In a first aspect, an embodiment of the present invention provides a crystal oscillator, which includes: a crystal oscillator body, a carrier board, an electrical connection element, and a buffer structure;

The buffer structure includes a conductive shell and a buffer, and the conductive shell wraps the buffer;

The crystal oscillator body is stacked with the carrier board, one end of the electrical connection element is electrically connected to the carrier board, and the other end of the electrical connection element is connected to the conductive shell.

In a second aspect, an embodiment of the present invention provides an electronic device, the electronic device includes: a device body, a circuit board, and the crystal oscillator as described in the first aspect, the device body is electrically connected to the circuit board, The first end of the buffer structure is electrically connected to the carrier board of the crystal oscillator, and the second end of the buffer structure is electrically connected to the circuit board.

In a third aspect, an embodiment of the present invention also provides a method for manufacturing a crystal oscillator, the method for manufacturing a crystal oscillator includes:

Coating an adhesive layer on the outer surface of the buffer;

Wrapping the conductive shell on the surface of the buffer member to form a buffer structure;

Harness the snubber structure to the electrical connection elements of the crystal.

Embodiments of the present invention provide a crystal oscillator, a manufacturing method thereof, and electronic equipment, wherein the crystal oscillator is electrically connected to a circuit board of the electronic equipment. The crystal oscillator includes a crystal oscillator body, an electrical connection element and a buffer structure, and the buffer structure includes a buffer member and a conductive shell arranged on the buffer member. The electrical connection element of the crystal oscillator is electrically connected with the circuit board of the electronic device through the conductive shell of the buffer structure. When the crystal oscillator falls along with the electronic equipment, the buffer structure buffers the stress on the crystal oscillator body, thereby achieving the technical effect of avoiding damage to the crystal oscillator body.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments of the present invention. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of a crystal oscillator provided by an embodiment of the present invention;

2 is a schematic flow diagram of a crystal oscillator manufacturing method provided by an embodiment of the present invention;

FIG. 3 is a schematic diagram of a buffer structure of a crystal oscillator provided by an embodiment of the present invention.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a crystal oscillator provided by an embodiment of the present invention. As shown in FIG. 1 , a crystal oscillator 100 is applied to electronic equipment. The crystal oscillator 100 includes: a crystal oscillator body 110, a carrier board 120, an electrical connection element 130 and a buffer structure 140, the crystal oscillator body 110 and the carrier board 120 are stacked, and the buffer structure 140 includes a conductive shell 142 and a buffer member 141 , the conductive shell 142 wraps the buffer member 141 and is arranged. One end of the electrical connection element 130 is electrically connected to the carrier board 120 , and the other end of the electrical connection element 130 is connected to the conductive shell 142 .

The crystal oscillator body 110 is the main functional part of the crystal oscillator 100, the crystal oscillator body 110 may include an iron shell 111, a quartz crystal 112, a device layer 113 and ceramics, the quartz crystal 112, the device layer 113 and the Ceramics are all disposed in the iron case 111 , and the carrier 120 of the crystal oscillator 100 is also disposed in the iron case 111 . The end of the iron shell 111 close to the electrical connection element 130 is set as a first end, and the end far away from the electrical connection element 130 is set as a second end. Materials stacked sequentially from the second end to the first end in the iron shell 111 are: the quartz crystal 112 layer, the device layer 113 , the ceramic layer 114 and the carrier plate 120 . In other implementations, the casing of the crystal oscillator 100 can also be a shell made of other materials except the iron shell 111, and there can be other implementations of the internal material layers constituting the crystal oscillator body 110 and their stacking order. It is not limited here.

The carrier board 120 is a circuit board for the crystal oscillator 100 to realize the clock signal function, the carrier board 120 is stacked with the crystal oscillator body 110 , and the signal input and output are realized through the electrical connection element 130 . The carrier board 120 is connected to one end of the electrical connection element 130 , and the other end of the electrical connection element 130 is electrically connected to the conductive shell 142 of the buffer structure 140 , and the conductive shell 142 of the buffer structure 140 is connected to the circuit board of the electronic device. Signal transmission between the carrier board 120 and the circuit board of the electronic device is realized through the electrical connection element 130 and the buffer structure 140 .

In one embodiment, the electrical connection element 130 may include two pads, which are set as a first pad and a second pad, and the first pad is connected to the positive output terminal of the carrier board 120, The second pad is connected to the negative output terminal of the carrier board 120 . Correspondingly, the number of the buffer structures 140 is two, which can be set as the first buffer structure 140 and the second buffer structure 140 . The first pad is electrically connected to the conductive shell 142 of the first buffer structure 140 , and the second pad is electrically connected to the conductive shell 142 of the second buffer structure 140 . The first buffer structure 140 and the second buffer structure 140 are correspondingly connected to the two signal transmission ends of the circuit board of the electronic device, so as to realize the signal transmission between the carrier board 120 of the crystal oscillator 100 and the circuit board of the electronic device. transmission.

The buffer structure 140 includes a conductive shell 142 and a buffer piece 141 , and the conductive shell 142 wraps around the buffer piece 141 . The buffer member 141 realizes the function of stress buffering, and the conductive shell 142 realizes the function of electric signal transmission. The conductive shell 142 of the buffer structure 140 is connected to the electrical connection element 130 of the carrier board 120 of the crystal oscillator 100 and the output end of the circuit board of the electronic device, so as to realize the connection between the carrier board 120 of the crystal oscillator 100 and the circuit board of the electronic device. Electrical signal transmission. There are many ways for the conductive shell 142 to wrap the buffer member 141 . The conductive shell 142 can be directly wrapped on the entire outer surface of the buffer member 141, or only wrapped at the connection position between the buffer member 141 and the electronic connection element of the carrier board 120 of the crystal oscillator 100 and the output end of the circuit board of the electronic device. The manner of wrapping the buffer member 141 by the conductive shell 142 that realizes the conductive function can be applicable to this embodiment, and is not limited here.

On the basis of the above embodiments, the buffer 141 of the buffer structure 140 can be a soft structure such as a silicone buffer 141 or a foam buffer 141 with better elasticity and better shock absorption. In one embodiment, the buffer member 141 may include at least one of silica gel foam, polyethylene (PE) foam or polyurethane (PU) foam, and other materials that can achieve stress buffering The buffer member 141 can be applied to this embodiment, and is not limited here. The buffer member 141 is set to reduce the mechanical stress of the crystal oscillator 100, so that the buffer member 141 can effectively buffer the stress transmitted to the crystal oscillator 100 when the electronic device falls, reduces the sensitivity of the crystal oscillator 100 to mechanical stress, and greatly slows down the The stress on the friable and fragile components inside the crystal oscillator body 110 of the crystal oscillator 100 reduces the failure rate of the crystal oscillator 100 and prolongs the service life of the crystal oscillator 100 .

On the basis of the above embodiments, the conductive shell 142 can be a metal foil shell, which realizes the conductive function and reduces the volume and weight of the crystal oscillator 100 at the same time. The metal foil applied to the conductive shell 142 may include at least one of tin foil, copper foil and nickel foil, and the thickness of the metal foil shell may range from 5 microns to 10 microns to achieve basic electrical connection functions, and It is easy to be soldered to the pad, which further improves the convenience of manufacturing the crystal oscillator 100 .

On the basis of the above-mentioned embodiments, there may be various ways of connecting the conductive shell 142 and the buffer member 141 . The conductive shell 142 may be fixed on the buffer member 141 by a fixing member, for example, the conductive shell 142 may be fixed on the buffer member 141 by buckles or wires. An adhesive layer 143 can also be coated on the buffer member 141 , and the conductive shell 142 is pasted on the buffer member 141 through the adhesive layer 143 . The adhesive layer 143 can be hot melt adhesive, and after the metal foil is wrapped on the outer surface of the foam, a press is used for hot pressing to make the hot melt adhesive flow and become viscous, and the metal foil is adhered to the foam.

In the above-mentioned crystal oscillator provided by the embodiments of the present invention, a buffer structure is provided to be electrically connected to the electrical connection element. The buffer structure includes a buffer and a conductive shell arranged on the buffer. The electrical connection element of the crystal oscillator is electrically connected with the circuit board of the electronic device through the conductive shell of the buffer structure. When the crystal oscillator falls along with the electronic equipment, the buffer structure buffers the stress on the crystal oscillator body, thereby achieving the technical effect of avoiding damage to the crystal oscillator body.

Please refer to FIG. 2 , which is a schematic flowchart of a method for manufacturing a crystal oscillator provided by an embodiment of the present invention. As shown in FIG. 2 , a method for manufacturing a crystal oscillator is used to manufacture the crystal oscillator of the above embodiment. The crystal oscillator manufacturing method includes:

Step 201, coating an adhesive layer on the outer surface of the buffer;

Step 202, wrapping the conductive shell on the surface of the buffer member to form a buffer structure;

Step 203, welding the buffer structure to the electrical connection element of the crystal oscillator.

In the above steps, the implementation process of welding the buffer structure 140 to the electrical connection element 130 of the crystal oscillator 100 may include:

printing solder paste on the surface of the electrical connection element;

Mounting the buffer structure 140 on the solder paste;

The buffer structure 140 is soldered to the electrical connection element 130 by a reflow soldering process.

In the above steps, the buffer is foam, the conductive shell is metal foil, and the buffer structure is foam wrapped in metal foil. The preparation process of metal foil-wrapped foam is as follows: foam raw material die-cutting, foam coated with hot melt adhesive, foam wrapped with metal foil and metal foil-wrapped foam die-cut. The preparation process specifically includes:

Die-cutting of foam raw materials: foam can be made of high temperature resistant and elastic silica gel and other materials. The foam can be die-cut into long strips of a specific size with a flat knife or round knife die-cutting machine, and the high temperature resistance condition can be set to withstand a high temperature environment above 350°C.

Foam coated with hot-melt adhesive: the die-cut strip foam raw material is coated with high-temperature-resistant hot-melt adhesive. The coating process can be brushing, spraying or dipping. Set to withstand high temperature environments above 350°C.

Foam-wrapped metal foil: The metal foil can be made of tin, copper, nickel and other metal materials that can be used for reflow soldering. After the foam wraps the metal foil, it is hot-pressed with a press to make the hot-melt adhesive flow and become sticky, and the metal foil is bonded to the Foam on.

Metal foil-wrapped foam die-cutting: use a flat knife or round knife die-cutting machine to die-cut the foam into a shape of a specific size.

For the welding of metal foil foam, you can use SMT to weld the die-cut metal foil foam patch to the pad of the crystal oscillator, as shown in Figure 3. SMT is the English abbreviation of Surface Mounting Technology. Automatic assembly equipment is used to paste and solder chip-type, miniaturized non-lead or short-lead surface mount components/devices (referred to as SMC\SMD, referred to as chip components) directly to the surface of the carrier board. Or an electronic assembly technology at a specified position on the surface of other substrates. The general process is: printing solder paste, patch components, reflow soldering, and inspection. The description of each station is as follows:

Printing solder paste: Its function is to print the solder paste at a 45-degree angle with a scraper to the pad of the crystal oscillator to prepare for the welding of the metal foil-wrapped foam. The equipment used is a printing machine (solder paste printing machine), which is located at the forefront of the SMT production line.

Parts mounting: Its function is to accurately install the surface mount components to the fixed position of the crystal oscillator. The equipment used is a placement machine, which is located behind the printing machine in the SMT production line. Generally, a high-speed machine and a general-purpose machine are used in combination according to production needs.

Reflow soldering: Its function is to melt the solder paste, so that the surface mount components and crystal oscillator pads are firmly welded together. The equipment used is a reflow oven, which is located behind the placement machine in the SMT production line. The temperature requirements are quite strict, and real-time temperature measurement is required. The measured temperature is reflected in the form of a profile.

On the basis of the above steps, an inspection link can also be added to inspect the welding quality of the crystal oscillator welded with metal foil wrapped foam. The equipment used is automatic optical inspection machine (AOI), and the position can be arranged in a suitable place of the production line according to the needs of inspection. Some are before reflow soldering, some are after reflow soldering.

In the crystal oscillator manufacturing method provided by the above embodiments of the present invention, the manufacturing and welding operations of the buffer structure are added. The conductive shell of the buffer structure is wrapped around the buffer, and the conductive shell electrically connects the electrical connection element of the crystal oscillator with the circuit board of the electronic device. When the manufactured crystal oscillator falls along with the electronic equipment, the buffer structure of the crystal oscillator buffers the stress on the crystal oscillator body, thereby achieving the technical effect of avoiding damage to the crystal oscillator body. For the specific implementation process of the method for manufacturing the crystal oscillator provided in the embodiment of the present invention, reference may be made to the manufacturing process of the crystal oscillator provided in the above embodiment, and details will not be repeated here.

The embodiment of the present invention also provides an electronic device. The electronic device includes a device body, a circuit board, and a crystal oscillator. The crystal oscillator includes a crystal oscillator body, a carrier board, an electrical connection element, and a buffer structure. The buffer structure includes a buffer member and A conductive shell arranged on the buffer member. The crystal oscillator body is stacked with the carrier board, the carrier board is electrically connected to the electrical connection element, and the electrical connection element is connected to the first end of the buffer structure. The device body is electrically connected to the circuit board, and the circuit board is connected to the second end of the conductive shell of the buffer structure.

In the electronic device provided in this embodiment, the electrical connection element of the crystal oscillator is connected to the circuit board of the electronic device through the buffer structure. When the electronic equipment falls, when the stress suffered by the electronic equipment reaches the crystal oscillator, the buffer structure of the crystal oscillator absorbs the shock, which reduces the sensitivity of the crystal oscillator body to mechanical stress, reduces the failure rate of the crystal oscillator when the electronic equipment falls, and prolongs the use of electronic equipment life. For the specific implementation process of the electronic device provided in the embodiment of the present invention, reference may be made to the specific implementation process of the crystal oscillator provided in the foregoing embodiments, and details will not be repeated here.

Those skilled in the art can appreciate that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed by hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may use different methods to implement the described functions for each specific application, but such implementation should not be regarded as exceeding the scope of the present invention.

Those skilled in the art can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, mobile terminal and unit can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

In the embodiments provided in this application, it should be understood that the disclosed mobile terminal and method can be implemented in other ways. For example, the mobile terminal embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined Or it can be integrated into another system, or some features can be ignored, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of mobile terminals or units may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment of the present invention.

In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. a kind of crystal oscillator, it is characterised in that the crystal oscillator includes：Crystal oscillator body, support plate, electrical connecting element and buffer structure；

The buffer structure includes external conductive casing and bolster, and the external conductive casing wraps up the bolster and set；

The crystal oscillator body is stacked with the support plate and set, and one end of the electrical connecting element is electrically connected with the support plate, institute The other end for stating electrical connecting element is connected with the external conductive casing.

2. crystal oscillator according to claim 1, it is characterised in that the electrical connecting element includes two pads, the buffering The quantity of structure is two, and each pad is electrically connected with the external conductive casing of a buffer structure.

3. crystal oscillator according to claim 1, it is characterised in that the bolster includes silica gel bolster or foam buffers Part.

4. crystal oscillator according to claim 1, it is characterised in that the external conductive casing is metal foil shell.

5. crystal oscillator according to claim 4, it is characterised in that the thickness range of the metal foil shell is 5 microns to 10 Micron.

6. crystal oscillator according to claim 1, it is characterised in that adhesive layer is coated with outside the bolster, it is described conductive outer Shell is fitted on the bolster by the adhesive layer.

7. crystal oscillator according to claim 1, it is characterised in that the crystal oscillator body includes iron-clad, quartz crystal, device layer And ceramic layer, the quartz crystal, the device layer, the ceramic layer and the support plate are set in turn in the iron-clad.

8. a kind of electronic equipment, it is characterised in that the electronic equipment includes apparatus body, circuit board, and such as claim 1 To the crystal oscillator any one of 7, the apparatus body and the circuit board are electrically connected with, the first end of the buffer structure with The support plate of the crystal oscillator is electrically connected with, and the second end and the circuit board of the buffer structure are electrically connected with.

9. a kind of crystal oscillator preparation method, it is characterised in that the crystal oscillator preparation method includes：

Adhesive layer is coated in bolster outer surface；

External conductive casing is wrapped in the bolster surface, buffer structure is made；

The buffer structure is welded to the electrical connecting element of crystal oscillator.

10. crystal oscillator preparation method according to claim 9, it is characterised in that the buffer structure is welded to crystal oscillator The step of electrical connecting element, includes：

In the electrical connecting element surface printing tin cream；

By in buffer structure attachment to the tin cream；

The buffer structure is welded to by the electrical connecting element by solder reflow process.