CN107623994A - Circuit board assemblies and chip module - Google Patents
Circuit board assemblies and chip module Download PDFInfo
- Publication number
- CN107623994A CN107623994A CN201610554776.7A CN201610554776A CN107623994A CN 107623994 A CN107623994 A CN 107623994A CN 201610554776 A CN201610554776 A CN 201610554776A CN 107623994 A CN107623994 A CN 107623994A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pinboard
- chip
- electrically connected
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000000712 assembly Effects 0.000 title claims abstract description 19
- 238000000429 assembly Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A kind of circuit board assemblies and chip module, circuit board assemblies include circuit board and pinboard.Pinboard is placed on circuit boards, and is available for chip stack thereon, and via pinboard to be electrically connected with circuit board.
Description
Technical field
The present invention is on a kind of circuit board assemblies, particularly a kind of circuit board assemblies provided with microchip.
Background technology
With the development of miniaturization of electronic products trend, more and more electronic products under light, thin, short, small design requirement,
The space that can be used to place electronic component in its inside is less and less.But under the demand that product function is constantly lifted, there is many
The setting of process chip is required, so thinking how under the confined space, increases process chip or other electronic components
Setting, become important problem.
The content of the invention
The main object of the present invention is providing a kind of circuit board assemblies, and it can combine a chip, and the wherein chip has more
Individual pin.Circuit board assemblies include circuit board and pinboard.Pinboard is stacked on the board, and the pinboard has one
Upper surface, the upper surface are available for chip stack thereon, and wherein the upper surface is provided with multiple contacts being electrically connected with circuit board,
The plurality of contact contacts with multiple pins of chip, so that chip is electrically connected with by pinboard with circuit board.
According to one embodiment of the invention, the pinboard includes an at least storage tank, and an at least storage tank can be supplied to
A few electronic component is placed therein so that an at least electronic component is directly electrically connected with the circuit board.
According to one embodiment of the invention, the pinboard further includes lower surface and multiple conductive poles, and each conductive pole has
Head end and tail end, the head end are located at the upper surface of pinboard, and tail end is located at the lower surface of pinboard；The head end of multiple conductive poles is
Multiple contacts, the tail end of multiple conductive poles are electrically connected with circuit board.
According to one embodiment of the invention, the chip just covers pinboard so that at least an electronic component is by chip
Covered.
According to one embodiment of the invention, the pinboard just covering board.
The present invention separately provides a kind of chip module, and it includes chip and circuit board assemblies.Chip has multiple pins, electricity
Road board component includes circuit board and pinboard.Pinboard is stacked on circuit boards, and pinboard has a upper surface, and the upper surface can
For chip stack thereon, wherein upper surface is provided with multiple contacts being electrically connected with circuit board, multiple contacts and multiple pins
Contact, so that chip is electrically connected with by pinboard with circuit board.
According to one embodiment of the invention, the pinboard includes an at least storage tank, and an at least storage tank is available at least
One electronic component is placed therein so that an at least electronic component is directly electrically connected with circuit board.
According to one embodiment of the invention, the pinboard further includes lower surface and multiple conductive poles, and each conductive pole has
Head end and tail end, head end are located at the upper surface of pinboard, and tail end is located at the lower surface of pinboard；The head end of multiple conductive poles is more
Individual contact, the tail end of multiple conductive poles are electrically connected with circuit board.
According to one embodiment of the invention, the chip just covers pinboard so that at least an electronic component is by chip
Covered.
According to one embodiment of the invention, the pinboard just covering board.
Brief description of the drawings
Fig. 1 is the top view of the chip module of the present invention.
Fig. 2 is the upward view of the chip module of the present invention.
Fig. 3 is the sectional view of A-A sections direction shown in Fig. 1.
Wherein, reference：
The circuit board assemblies 10 of chip module 1
The upper surface 131 of circuit board 11
The storage tank 135 of lower surface 133
The head end 1371 of conductive pole 137
The pinboard 13 of tail end 1373
The chip 20 of electronic component 15
Pin 21
Embodiment
Your, for juror can be allowed to know more about the technology contents of the present invention, it is described as follows especially exemplified by preferred embodiment.
Below please also refer to Fig. 1 to Fig. 3.Fig. 1 is the top view of the chip module of the present invention；Fig. 2 is the core of the present invention
The upward view of piece module；Fig. 3 is the sectional view of A-A sections direction shown in Fig. 1.
As shown in Figures 1 and 2, in one embodiment of this invention, chip module 1 of the invention includes circuit board assemblies
10 and chip 20.
In one embodiment of this invention, circuit board assemblies 10 include circuit board 11, pinboard 13 and multiple electronics member
Part 15, wherein circuit board 11 are provided with lead area 112.
In one embodiment of this invention, pinboard 13 has the upper and lower surface 131,133 that corresponds to each other, and comprising
Multiple storage tanks 135 and multiple conductive poles 137.Each conductive pole 137 has head end 1371 and tail end 1373, the head of conductive pole 137
End 1371 is located at the upper surface 131 of pinboard 13, and the tail end 1373 of conductive pole 137 is located at the lower surface 133 of pinboard 13, also
I.e. each conductive pole runs through monoblock pinboard 13 about 137.
Pinboard 13 is stacked on circuit board 11, and its size is substantially equal to circuit board 11, therefore can just be covered
Lid circuit board 11.Each lead area on circuit board 11 is electrically connected in the tail end 1373 of multiple conductive poles 137 of pinboard 13
112, thereby, pinboard 13 can be electrically connected with circuit board 11.
Multiple electronic components 15, such as can be the circuit of electric capacity, inductance, resistance or its composition, it is arranged on circuit board 11,
And position is in each storage tank 135 (as shown in Figure 3).
In one embodiment of this invention, chip 20, such as micro-chip processor, there are multiple pins 21.Chip 20 is folded
Put in the upper surface 131 of pinboard 13, and its size is substantially equal to the size of pinboard 13, therefore can just cover
Pinboard 13.Multiple pins 21 of chip 20 contact the head end 1371 of each conductive pole 137 of pinboard 13 respectively, and using makes chip
20 can be electrically connected with by the conductive pole 137 of pinboard 13 with circuit board 11.
Understood by explanation is preceding taken off, the setting that the present invention passes through pinboard 13, it is possible to provide the larger chip 20 of area is set
Thereon, and by conductive pole 137 so that chip 20 is electrically connected with circuit board 11, thereby, can reduce needed for circuit board 11
Area.
To sum up institute is old, and no matter the present invention is showing its totally different spy in prior art with regard to purpose, means and effect
Sign, earnestly asks that your juror perceives, and grants quasi patent early, and in order to Jiahui society, true feeling moral is just.It is only it should be noted that above-mentioned many
Embodiment is illustrated only for the purposes of explanation, and the interest field advocated of the present invention from should be to be described in claim
Standard, rather than it is only limitted to above-described embodiment.
Claims (10)
1. a kind of circuit board assemblies, can combine a chip, the chip has multiple pins, it is characterised in that the circuit board assemblies
Including：
One circuit board；And
One pinboard, it is stacked on the board, the pinboard has a upper surface, and the upper surface is available for the chip stack in it
On, wherein the upper surface is provided with multiple contacts being electrically connected with the circuit board, and the plurality of contact contacts with the plurality of pin, with
The chip is set to pass through the pinboard to be electrically connected with the circuit board.
2. circuit board assemblies as claimed in claim 1, it is characterised in that the pinboard includes an at least storage tank, and this is at least
One storage tank is available for an at least electronic component to be placed therein so that at least an electronic component directly electrically connects with the circuit board for this
Connect.
3. circuit board assemblies as claimed in claim 1 or 2, it is characterised in that the pinboard further includes a lower surface and multiple
Conductive pole, respectively the conductive pole there is a head end and a tail end, the head end is located at the upper surface, and the tail end is located at the lower surface；Should
The head end of multiple conductive poles is the plurality of contact, and the tail end of the plurality of conductive pole is electrically connected with the circuit board.
4. circuit board assemblies as claimed in claim 3, it is characterised in that the chip just covers the pinboard so that this is extremely
A few electronic component is covered by the chip.
5. circuit board assemblies as claimed in claim 4, it is characterised in that the pinboard just covers the circuit board.
A kind of 6. chip module, it is characterised in that including：
One chip, there are multiple pins；And
One circuit board assemblies, including：
One circuit board；And
One pinboard, it is stacked on the board, the pinboard has a upper surface, and the upper surface is available for the chip stack in it
On, wherein the upper surface is provided with multiple contacts being electrically connected with the circuit board, and the plurality of contact contacts with the plurality of pin, with
The chip is set to pass through the pinboard to be electrically connected with the circuit board.
7. chip module as claimed in claim 6, it is characterised in that the pinboard includes an at least storage tank, and this at least one
Storage tank is available for an at least electronic component to be placed therein so that at least an electronic component directly electrically connects with the circuit board for this
Connect.
8. chip module as claimed in claims 6 or 7, it is characterised in that the pinboard further includes a lower surface and multiple led
Electric post, respectively the conductive pole there is a head end and a tail end, the head end is located at the upper surface, and the tail end is located at the lower surface；This is more
The head end of individual conductive pole is the plurality of contact, and the tail end of the plurality of conductive pole is electrically connected with the circuit board.
9. chip module as claimed in claim 8, it is characterised in that the chip just covers the pinboard so that this is at least
One electronic component is covered by the chip.
10. chip module as claimed in claim 9, it is characterised in that the pinboard just covers the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610554776.7A CN107623994A (en) | 2016-07-14 | 2016-07-14 | Circuit board assemblies and chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610554776.7A CN107623994A (en) | 2016-07-14 | 2016-07-14 | Circuit board assemblies and chip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107623994A true CN107623994A (en) | 2018-01-23 |
Family
ID=61087503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610554776.7A Withdrawn CN107623994A (en) | 2016-07-14 | 2016-07-14 | Circuit board assemblies and chip module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107623994A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3881543T2 (en) * | 1987-03-11 | 1993-12-23 | Ibm | Detachable bracket and method for mounting a flexible film carrier for a semiconductor chip on a circuit substrate. |
| US20110080718A1 (en) * | 2009-10-02 | 2011-04-07 | Fujitsu Limited | Interconnect board, printed circuit board unit, and method |
| TW201417642A (en) * | 2012-10-26 | 2014-05-01 | Zhen Ding Technology Co Ltd | Connecting substrate and package on package structure |
| CN104766840A (en) * | 2014-01-03 | 2015-07-08 | 三星电机株式会社 | Electric component module |
-
2016
- 2016-07-14 CN CN201610554776.7A patent/CN107623994A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3881543T2 (en) * | 1987-03-11 | 1993-12-23 | Ibm | Detachable bracket and method for mounting a flexible film carrier for a semiconductor chip on a circuit substrate. |
| US20110080718A1 (en) * | 2009-10-02 | 2011-04-07 | Fujitsu Limited | Interconnect board, printed circuit board unit, and method |
| TW201417642A (en) * | 2012-10-26 | 2014-05-01 | Zhen Ding Technology Co Ltd | Connecting substrate and package on package structure |
| CN104766840A (en) * | 2014-01-03 | 2015-07-08 | 三星电机株式会社 | Electric component module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180123 |