CN107613652A - The manufacture method of high-density interconnected printed circuit board - Google Patents
The manufacture method of high-density interconnected printed circuit board Download PDFInfo
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- CN107613652A CN107613652A CN201710854980.5A CN201710854980A CN107613652A CN 107613652 A CN107613652 A CN 107613652A CN 201710854980 A CN201710854980 A CN 201710854980A CN 107613652 A CN107613652 A CN 107613652A
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Abstract
The invention discloses the manufacture method of high-density interconnected printed circuit board, and it comprises the following steps：S1, element circuit plate making；S2, fin is made, first take double faced adhesive tape（3）, in double faced adhesive tape（3）Inside open up serpentine channel（7）, in serpentine channel（7）Import and export clog plug（5）, cooling oil is closed in two plugs（5）Between, it is achieved thereby that the making of fin；S3, high-density interconnected printed circuit board making.The beneficial effects of the invention are as follows：The heat dissipation for circuit board effect that manufacture craft is simple, producing efficiency is high, yields is high, produces is good, service life length.
Description
Technical field
The present invention relates to the technical field that high-density interconnected printed circuit board makes, particularly high density interconnection printed circuit
The manufacture method of plate.
Background technology
High-density interconnected printed circuit board（HDI plates）Preparation method it is as follows：Internal layer circuit is made first, then delivers to pressure
Close station superposition heat curing-type semi-solid preparation film and copper foil carries out first time pressing, after making middle level and boring buried via hole, electroplated in buried via hole
Copper, then stopple is got up with resin, then by resin baking-curing, it is convex then to grind off middle layer surface using the mode of belt-sanding
The resin to get up, then make middle level circuit（Second secondary line makes）After the completion of deliver to again pressing station superposition heat curing-type semi-curing glue
Piece and copper foil carry out second and pressed, if there is the design of the micro- guide hole in middle level, need to carry out laser punching again, and electroplate in hole
Copper, middle level circuit is made again（Third time circuit makes）, after the completion of carry out third time pressing again after, then carry out machine drilling,
The process such as electro-coppering, outer-layer circuit, welding resisting layer making, surface coating layer making, shaping, electrical measurement in laser punching, hole.
Following defect be present in existing preparation method：Need through multiple electro-coppering, increase dirty control cost, it is not environmentally friendly enough；
Need, through multiple hot pressing, mass energy need to be consumed；Production procedure need to be circulated repeatedly, production hour increase, cause competitiveness
Decline.On the line layer of middle part circuit board caused heat can not normal discharge to the external world, cause middle part circuit board burn
Ruin, influence the quality of product.
The content of the invention
The shortcomings that it is an object of the invention to overcome prior art, there is provided the manufacturer of high-density interconnected printed circuit board
Method.
The purpose of the present invention is achieved through the following technical solutions：The manufacture method of high-density interconnected printed circuit board, it
Comprise the following steps：
S1, element circuit plate making, in the compound 0.5 ~ 1mm of the upper and lower surface of circuit substrate copper foil；To two copper after compound
Paper tinsel surface carries out ultrasonic wave cleaning；2min ~ 6min in acid deoiling liquid is put into after ultrasonic wave cleaning, is removed using the method for spray
The grease gone on copper foil pollutes and oxide layer；Drying and processing ensures that copper foil surface is bright and clean after cleaning；Circuit substrate top will be located at
Copper foil sequentially pass through etching, exposure, leveling handle to obtain required line layer, then use same treatment method, will be located at
The copper foil of circuit substrate bottom sequentially passes through etching, exposure, leveling handle to obtain another line layer, it is achieved thereby that element circuit plate
Making；
S2, fin is made, first take double faced adhesive tape, serpentine channel is opened up in the inside of double faced adhesive tape, in the inlet and outlet of serpentine channel
Place clogs plug, cooling oil is closed between two plugs, it is achieved thereby that the making of fin；
S3, high-density interconnected printed circuit board making, it is concretely comprised the following steps：
S31, element circuit plate described in multiple step S1 is taken according to the design needs, put per two neighboring element circuit plate
The fin described in a step S2 is put, element circuit plate is stacked with fin, smooth placement；
S32, uniform, vertical load using forcing press to the superiors 40 ~ 78N of element circuit plate surface application, while using another
One forcing press to most lower level unit circuit board surface apply 40 ~ 78NN uniform, vertical load so that each unit circuit board with
Fin is compound more firmly, realizes the making of semi-finished product high-density interconnected printed circuit board；
S33, the semi-finished product high-density interconnected printed circuit board in step S32 is positioned on welding post, and in semi-finished product height
The copper bar of vertical setting is placed in the both sides of density interconnection printed circuit board (PCB), ensures that copper bar connects with the line layer on each unit circuit board
Touch, copper bar is welded on semi-finished product high-density interconnected printed circuit board by bonding machine, it is achieved thereby that high density interconnection print
The making of printed circuit board.
The present invention has advantages below：The electricity that manufacture craft of the present invention is simple, producing efficiency is high, yields is high, produces
Road plate good heat dissipation effect, service life length.
Brief description of the drawings
Fig. 1 is the circuit substrate that upper and lower surface is compounded with copper foil；
Fig. 2 is the structural representation of element circuit plate；
Fig. 3 is the structural representation of fin；
Fig. 4 is the top view of fin；
Fig. 5 is the structural representation of semi-finished product high-density interconnected printed circuit board；
Fig. 6 is the structural representation of finished product high-density interconnected printed circuit board；
In figure, 1- circuit substrates, 2- copper foils, 3- double faced adhesive tapes, 4- line layers, 5- plugs, 6- copper bars, 7- serpentine channels.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings, and protection scope of the present invention is not limited to as described below：
Embodiment one：As shown in Fig. 1 ~ 6, the manufacture method of high-density interconnected printed circuit board, it comprises the following steps：
S1, element circuit plate making, in the compound 0.5mm of the upper and lower surface of circuit substrate 1 copper foil；To two copper foils after compound
2 surfaces carry out ultrasonic wave cleaning；2min in acid deoiling liquid is put into after ultrasonic wave cleaning, copper foil 2 is removed using the method for spray
On grease pollution and oxide layer；Drying and processing ensures any surface finish of copper foil 2 after cleaning；By positioned at the copper on the top of circuit substrate 1
Paper tinsel 2 sequentially passes through etching, exposure, leveling handle to obtain required line layer 4, then uses same treatment method, will be located at electricity
The copper foil 2 of the bottom of base board 1 sequentially passes through etching, exposure, leveling handle to obtain another line layer 4, it is achieved thereby that element circuit
The making of plate；
S2, fin is made, first take double faced adhesive tape 3, serpentine channel 7 is opened up in the inside of double faced adhesive tape 3, in entering for serpentine channel 7
Exit clogs plug 5, cooling oil is closed between two plugs 5, it is achieved thereby that the making of fin；
S3, high-density interconnected printed circuit board making, it is concretely comprised the following steps：
S31, element circuit plate described in multiple step S1 is taken according to the design needs, put per two neighboring element circuit plate
The fin described in a step S2 is put, element circuit plate is stacked with fin, smooth placement；
S32, uniform, vertical load using forcing press to the superiors element circuit plate surface application 40N, while use another pressure
Power machine applies 40NN uniform, vertical load to most lower level unit circuit board surface, so that each unit circuit board and fin
It is compound more firmly to realize the making of semi-finished product high-density interconnected printed circuit board, while ensure element circuit plate and radiating
Piece is mutually compound；
S33, the semi-finished product high-density interconnected printed circuit board in step S32 is positioned on welding post, and in semi-finished product height
The copper bar 6 of vertical setting is placed in the both sides of density interconnection printed circuit board (PCB), ensures copper bar 6 and the line layer on each unit circuit board
Copper bar, is welded on semi-finished product high-density interconnected printed circuit board by 4 contacts by bonding machine, it is achieved thereby that high density interconnects
The making of printed circuit board (PCB).By the high-density interconnected printed circuit board that the technique is produced when long-time operates, line layer 4
On heat be delivered to through circuit substrate 1 on fin, then by serpentine channel in fin 7 cooling oil absorb heat and will
Heat is delivered to the external world from fin basal surface, it is achieved thereby that the conduction and release of heat, make the product be in normal temperature all the time
Under state, be not in the phenomenon for burning circuit connection, greatly extend the service life of circuit board, the life-span is up to 5 ~ 8
Year.Because coolant is distributed in circuit substrate 1 according to snakelike, ensure that has bigger area of dissipation, and radiating effect is more preferable,
Radiated compared to using fin, radiator structure is simpler, and cost of manufacture is lower.
Embodiment two：The manufacture method of high-density interconnected printed circuit board, it comprises the following steps：
S1, element circuit plate making, in the compound 0.7mm of the upper and lower surface of circuit substrate 1 copper foil；To two copper foils after compound
2 surfaces carry out ultrasonic wave cleaning；4min in acid deoiling liquid is put into after ultrasonic wave cleaning, copper foil 2 is removed using the method for spray
On grease pollution and oxide layer；Drying and processing ensures any surface finish of copper foil 2 after cleaning；By positioned at the copper on the top of circuit substrate 1
Paper tinsel 2 sequentially passes through etching, exposure, leveling handle to obtain required line layer 4, then uses same treatment method, will be located at electricity
The copper foil 2 of the bottom of base board 1 sequentially passes through etching, exposure, leveling handle to obtain another line layer 4, it is achieved thereby that element circuit
The making of plate；
S2, fin is made, first take double faced adhesive tape 3, serpentine channel 7 is opened up in the inside of double faced adhesive tape 3, in entering for serpentine channel 7
Exit clogs plug 5, cooling oil is closed between two plugs 5, it is achieved thereby that the making of fin；
S3, high-density interconnected printed circuit board making, it is concretely comprised the following steps：
S31, element circuit plate described in multiple step S1 is taken according to the design needs, put per two neighboring element circuit plate
The fin described in a step S2 is put, element circuit plate is stacked with fin, smooth placement；
S32, uniform, vertical load using forcing press to the superiors element circuit plate surface application 63N, while use another pressure
Power machine applies 63NN uniform, vertical load to most lower level unit circuit board surface, so that each unit circuit board and fin
It is compound more firmly to realize the making of semi-finished product high-density interconnected printed circuit board, can be recessed by semi-finished product by the step
Convex flattens, to improve product quality；
S33, the semi-finished product high-density interconnected printed circuit board in step S32 is positioned on welding post, and in semi-finished product height
The copper bar 6 of vertical setting is placed in the both sides of density interconnection printed circuit board (PCB), ensures copper bar 6 and the line layer on each unit circuit board
Copper bar, is welded on semi-finished product high-density interconnected printed circuit board by 4 contacts by bonding machine, it is achieved thereby that high density interconnects
The making of printed circuit board (PCB).
Embodiment three：The manufacture method of high-density interconnected printed circuit board, it comprises the following steps：
S1, element circuit plate making, in the compound 1mm of the upper and lower surface of circuit substrate 1 copper foil；To two copper foils 2 after compound
Surface carries out ultrasonic wave cleaning；6min in acid deoiling liquid is put into after ultrasonic wave cleaning, copper foil 2 is removed using the method for spray
On grease pollution and oxide layer；Drying and processing ensures any surface finish of copper foil 2 after cleaning；By positioned at the copper on the top of circuit substrate 1
Paper tinsel 2 sequentially passes through etching, exposure, leveling handle to obtain required line layer 4, then uses same treatment method, will be located at electricity
The copper foil 2 of the bottom of base board 1 sequentially passes through etching, exposure, leveling handle to obtain another line layer 4, it is achieved thereby that element circuit
The making of plate；
S2, fin is made, first take double faced adhesive tape 3, serpentine channel 7 is opened up in the inside of double faced adhesive tape 3, in entering for serpentine channel 7
Exit clogs plug 5, cooling oil is closed between two plugs 5, it is achieved thereby that the making of fin；
S3, high-density interconnected printed circuit board making, it is concretely comprised the following steps：
S31, element circuit plate described in multiple step S1 is taken according to the design needs, put per two neighboring element circuit plate
The fin described in a step S2 is put, element circuit plate is stacked with fin, smooth placement；
S32, uniform, vertical load using forcing press to the superiors element circuit plate surface application 78N, while use another pressure
Power machine applies 78NN uniform, vertical load to most lower level unit circuit board surface, so that each unit circuit board and fin
It is compound more firm, realize the making of semi-finished product high-density interconnected printed circuit board；
S33, the semi-finished product high-density interconnected printed circuit board in step S32 is positioned on welding post, and in semi-finished product height
The copper bar 6 of vertical setting is placed in the both sides of density interconnection printed circuit board (PCB), ensures copper bar 6 and the line layer on each unit circuit board
Copper bar, is welded on semi-finished product high-density interconnected printed circuit board by 4 contacts by bonding machine, it is achieved thereby that high density interconnects
The making of printed circuit board (PCB).
Described above is only the preferred embodiment of the present invention, it should be understood that the present invention is not limited to described herein
Form, the exclusion to other embodiment is not to be taken as, and can be used for various other combinations, modification and environment, and can be at this
In the text contemplated scope, it is modified by the technology or knowledge of above-mentioned teaching or association area.And those skilled in the art are entered
Capable change and change does not depart from the spirit and scope of the present invention, then all should be in the protection domain of appended claims of the present invention
It is interior.
Claims (1)
1. the manufacture method of high-density interconnected printed circuit board, it is characterised in that：It comprises the following steps：
S1, element circuit plate making, in circuit substrate（1）The compound 0.5 ~ 1mm of upper and lower surface copper foil；To two after compound
Copper foil（2）Surface carries out ultrasonic wave cleaning；2min ~ 6min in acid deoiling liquid is put into after ultrasonic wave cleaning, using the side of spray
Method removes copper foil（2）On grease pollution and oxide layer；Drying and processing ensures copper foil after cleaning（2）Any surface finish；Electricity will be located at
Base board（1）The copper foil on top（2）Sequentially pass through etching, exposure, leveling handle to obtain required line layer（4）, then use
Same treatment method, circuit substrate will be located at（1）The copper foil of bottom（2）Sequentially pass through etching, exposure, leveling handle to obtain another line
Road floor（4）, it is achieved thereby that the making of element circuit plate；
S2, fin is made, first take double faced adhesive tape（3）, in double faced adhesive tape（3）Inside open up serpentine channel（7）, in serpentine channel
（7）Import and export clog plug（5）, cooling oil is closed in two plugs（5）Between, it is achieved thereby that fin
Make；
S3, high-density interconnected printed circuit board making, it is concretely comprised the following steps：
S31, element circuit plate described in multiple step S1 is taken according to the design needs, put per two neighboring element circuit plate
The fin described in a step S2 is put, element circuit plate is stacked with fin, smooth placement；
S32, uniform, vertical load using forcing press to the superiors 40 ~ 78N of element circuit plate surface application, while using another
One forcing press to most lower level unit circuit board surface apply 40 ~ 78NN uniform, vertical load so that each unit circuit board with
Fin is compound more firmly, realizes the making of semi-finished product high-density interconnected printed circuit board；
S33, the semi-finished product high-density interconnected printed circuit board in step S32 is positioned on welding post, and in semi-finished product height
Place the copper bar of vertical setting in the both sides of density interconnection printed circuit board (PCB)（6）, ensure copper bar（6）With the line on each unit circuit board
Road floor（4）Copper bar, is welded on semi-finished product high-density interconnected printed circuit board, it is achieved thereby that highly dense by contact by bonding machine
The making of degree interconnection printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710854980.5A CN107613652A (en) | 2017-09-20 | 2017-09-20 | The manufacture method of high-density interconnected printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710854980.5A CN107613652A (en) | 2017-09-20 | 2017-09-20 | The manufacture method of high-density interconnected printed circuit board |
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| CN107613652A true CN107613652A (en) | 2018-01-19 |
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| CN201710854980.5A Pending CN107613652A (en) | 2017-09-20 | 2017-09-20 | The manufacture method of high-density interconnected printed circuit board |
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Cited By (3)
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| CN109526157A (en) * | 2018-11-30 | 2019-03-26 | 四川海英电子科技有限公司 | A kind of high-frequency high-speed high density circuit board manufacturing process |
| CN111328189A (en) * | 2020-03-17 | 2020-06-23 | 万安裕维电子有限公司 | Salt mist resistant PCB |
| CN114158205A (en) * | 2021-11-15 | 2022-03-08 | 广德宝达精密电路有限公司 | Method for manufacturing high-density interconnected printed circuit board |
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| CN114158205A (en) * | 2021-11-15 | 2022-03-08 | 广德宝达精密电路有限公司 | Method for manufacturing high-density interconnected printed circuit board |
| CN114158205B (en) * | 2021-11-15 | 2023-09-05 | 广德宝达精密电路有限公司 | Manufacturing method of high-density interconnection printed circuit board |
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Application publication date: 20180119 |
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