CN107586047B - Sky blue double-silver low-emissivity coated glass and preparation method thereof - Google Patents
Sky blue double-silver low-emissivity coated glass and preparation method thereof Download PDFInfo
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- 229910052709 silver Inorganic materials 0.000 title claims description 37
- 239000004332 silver Substances 0.000 title claims description 37
- 239000011521 glass Substances 0.000 title claims description 34
- 235000012736 patent blue V Nutrition 0.000 title claims description 10
- 238000002360 preparation method Methods 0.000 title claims description 6
- 239000010410 layer Substances 0.000 claims description 187
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 94
- 239000007789 gas Substances 0.000 claims description 51
- 229910052786 argon Inorganic materials 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 46
- 230000008569 process Effects 0.000 claims description 45
- 239000013077 target material Substances 0.000 claims description 43
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 40
- 238000004544 sputter deposition Methods 0.000 claims description 39
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 29
- 239000001301 oxygen Substances 0.000 claims description 29
- 229910052760 oxygen Inorganic materials 0.000 claims description 29
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 27
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 24
- 239000010936 titanium Substances 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 13
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000011247 coating layer Substances 0.000 claims description 11
- 239000011241 protective layer Substances 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 230000000903 blocking effect Effects 0.000 claims description 8
- 239000002346 layers by function Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 7
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 6
- 229910004205 SiNX Inorganic materials 0.000 claims description 6
- 229910000611 Zinc aluminium Inorganic materials 0.000 claims description 6
- 229910001882 dioxygen Inorganic materials 0.000 claims description 6
- 229910007717 ZnSnO Inorganic materials 0.000 claims description 3
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 claims description 3
- 238000000149 argon plasma sintering Methods 0.000 claims description 3
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 claims 1
- 238000002474 experimental method Methods 0.000 description 6
- 230000004075 alteration Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004737 colorimetric analysis Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention provides sky blue double-silver low-emissivity coated glass and a preparation method thereof, and belongs to the technical field of magnetron sputtering coating. It solves the technical problems that the chromaticity of the existing double-silver glass is not pure, and the like. A sky blue double-silver low-emissivity coated glass comprises a glass substrate layer and coating layers, wherein the coating layers are sequentially compounded with eleven layers from the glass substrate layer to the outside, the first layer is a ZnSnO layer, the second layer is a TiO2 layer, the third layer is a NiCr fourth layer which is an Ag layer, the fifth layer is a NiCr layer, the sixth layer is a SiNx layer, the seventh layer is a ZnO layer, the eighth layer is an Ag layer, the ninth layer is a NiCr layer, the tenth layer is a TiO2 layer, and the eleventh layer is a SiNx layer; and the coating layers are sequentially coated on the glass substrate layer in a magnetron sputtering mode. The invention has the advantages of pure color and the like.
Description
Technical Field
The invention belongs to the technical field of magnetron sputtering coating, and relates to sky blue double-silver low-emissivity coated glass and a preparation method thereof.
Background
The Low-E glass production process in the prior art is to plate a multilayer film system which takes Ag as a functional layer and comprises a dielectric layer and other metal layers on a high-quality float substrate. If the functional layers are divided according to the number of the silver layers, the Low-E glass can be divided into single-silver Low-E glass, double-silver Low-E glass and triple-silver Low-E glass. At present, single silver and double silver are mature energy-saving schemes in the field of building glass, the energy-saving effect of the three-silver energy-saving glass is superior to that of the double silver and the single silver, but the three-silver glass has a complex film structure and high process control difficulty, so that the cost is high. In recent years, in the market, a few manufacturers capable of producing the three-silver products in mass production are available, and the three-silver products are not as abundant as the double-silver products and the single-silver products.
Along with the gradual maturity of the market, homogenization competition is obvious day by day, and the requirement of customer to the outward appearance colour of curtain is also higher and higher, and on the other hand is how to build more comfortable human settlements environment with the color to the city of population density for it is blue, water greener to become the new sighting rod of building city ecological environment. Therefore, blue-green glass becomes the mainstream color of the curtain wall appearance, which is not difficult to understand, but for most Low-e double-silver glasses in the market, the appearance color of the glass cannot meet the depth requirement of a customer, the conventional double-silver color is often not clear enough with the sky as the background, and the side surface is generally discolored at a small angle, so that the improvement of the existing blue-green film double-silver color is very necessary.
The prior art has the following disadvantages:
1) although blue double-silver products exist in the market at present, the color is not pure enough, the color tone of the film surface is heavy, and the types of choices are not many.
2) Most of the existing double-silver products are blue silver and blue gray, and the decorative effect is poor.
3)TiO2The coating is applied as a bottom coating in the early years, the sputtering speed is low, and the application cost is highCurrently, there are few uses.
Disclosure of Invention
The invention aims to provide sky blue double-silver low-emissivity coated glass aiming at the problems in the prior art, and the technical problem to be solved by the invention is how to improve the color purity through the design of a coating layer.
The purpose of the invention can be realized by the following technical scheme: the sky blue double-silver low-emissivity coated glass is characterized by comprising a glass substrate layer and a coated layer, wherein eleven layers are sequentially compounded on the coated layer from the glass substrate layer outwards, the first layer is a ZnSnO layer, and the second layer is TiO2The third layer is a NiCr layer, the fourth layer is a Ag layer, the fifth layer is a NiCr layer, the sixth layer is a SiNx layer, the seventh layer is a ZnO layer, the eighth layer is an Ag layer, the ninth layer is a NiCr layer, and the tenth layer is TiO2The eleventh layer is a SiNx layer;
wherein the first layer is a first dielectric layer and the second layer is TiO2A blue light reflecting layer, a third layer being a barrier protective layer for preventing TiO2Oxygen in the layer migrates to the Ag layer, the fourth layer is a low-radiation functional layer, the fifth layer is a blocking protective layer, the sixth layer and the seventh layer are second dielectric layers, the eighth layer is a low-radiation functional layer, the ninth layer is a blocking protective layer, and the tenth layer is TiO2Blue light scattering layer, and the eleventh layer is the third dielectric layer.
A preparation method of sky blue double-silver low-emissivity coated glass is characterized by comprising the following steps:
1) forming a magnetron sputtering coating layer;
A. magnetron sputtering of the first layer:
the number of the targets is 1, the targets are configured to be zinc tin (ZnSn), the process gas proportion is argon to oxygen, the proportion of argon to oxygen is 1:1.14, the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 10-15 nm;
B. magnetron sputtering the second layer:
the number of the targets is as follows: 2-3 alternating current rotating targets; the target material is configured as titanium (Ti); the process gas proportion is as follows: argon and oxygen, argonThe ratio of gas to oxygen is 15:1, the sputtering pressure is (3-5) × 10-3mbar; the thickness of the plated film is 8-12 nm;
C. magnetron sputtering the third layer:
the number of the targets is 1, the targets are configured to be nickel chromium (NiCr), the process gas proportion is argon to oxygen, the proportion of the argon to the oxygen is 1:2, and the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 1-4 nm;
D. magnetron sputtering the fourth layer:
the number of the target materials is 1 direct current plane target, the target materials are configured to be silver (Ag), the process gas is pure argon, the sputtering pressure is (2-3) × 10-3mbar; the thickness of the plated film is 3.5-6.5 nm;
E. performing magnetron sputtering on a fifth layer:
the number of the target materials is 1 alternating current rotating target, the target materials are configured to be nickel chromium (NiCr), the process gas is pure argon, the sputtering pressure is (2-3) × 10-3mbar; the thickness of the coating film is 1.5-3 nm;
F. magnetron sputtering a sixth layer:
3-4 alternating current rotating targets, zinc aluminum (ZnAl) as the target material, argon and oxygen in a process gas ratio of 1:2, and × 10 under a sputtering pressure of 3-5-3mbar; the thickness of the plated film is 24-28 nm;
G. magnetron sputtering a seventh layer:
the number of the target materials is 3-4 of alternating current rotating targets, the target materials are configured to be silicon aluminum (SiAl), the ratio of the process gas to argon to oxygen is 1:1.14, the sputtering pressure is (3-5) × 10-3mbar; the thickness of the plated film is 28-32 nm;
H. magnetron sputtering an eighth layer:
the number of the target materials is 1 alternating current rotating target, the target materials are configured to be silver (Ag), the process gas is pure argon, and the sputtering pressure is (2-3) × 10-3mbar; the thickness of the coating film is 1-3 nm;
the magnetron sputtering of the eighth layer can also be a process as follows:
the number of the targets is as follows: 1 direct current plane target; the target material is configured to be silver (Ag); the process gas is pure argon gas,the sputtering pressure is (2-3) × 10-3mbar; the thickness of the plated film is 4-8 nm;
I. magnetron sputtering the ninth layer:
the number of the target materials is 1 alternating current rotating target, the target materials are configured to be nickel chromium (NiCr), the process gas is pure argon, and the sputtering pressure is (2-3) × 10-3mbar; the thickness of the coating film is 0.5-1.5 nm;
J. magnetron sputtering the tenth layer:
the number of the targets is 1, the alternating current rotating targets are arranged, the targets are titanium (Ti), the process gas proportion is argon gas to oxygen gas, the proportion of the argon gas to the oxygen gas is 15:2, and the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 2-3.5 nm;
K. magnetron sputtering the eleventh layer:
4-5 alternating current rotary targets, silicon aluminum (SiAl) as the target material, 1:1.14 of process gas ratio of argon to oxygen, 3-5 of sputtering pressure of × 10-3mbar; the thickness of the coating film is 45-50 nm;
2) the total thickness of the coating layer is controlled to be 135-155 nm.
Wherein the control of the ratio of argon to oxygen process gas and the amount of introduction of the Ti target can significantly influence the TiO target2The crystal grain diameter of the particles is determined by multiple test debugging and spectrophotometer color measurement experiment2The optimal gas ratio and sputtering power of the film scattering and refracting film.
Double layer TiO by die2The interference and scattering of the film layer realize the sky-like pure color; determining the thickness of each film layer through software design, process debugging and experiments; and determining the stable titanium target process gas proportion through repeated experiments and simulation parameters of the film layer design software under the condition of corresponding gas proportion.
The invention has the advantages that:
1. the appearance color is sky blue, the small-angle color change is small, the outdoor observation is fresh and natural, and the environment integration is good.
2. The Lab color space colorimetry results are as follows: a 6mm single-chip transmission color T e [55, 58], a e [ 3.5, -2.0], b e [ 6, 4.5 ]; and the glass surface color L is from [45, 50], a is from [ 1.5,0], b is from [ 7.0, -5.5 ]. The surface emissivity E of the glass belongs to [0.05, 0.07], and the low emissivity is excellent.
3. The multi-angle (10-75 ℃) chromatic aberration delta a of the glass surface is less than 2.5.
Drawings
FIG. 1 is a schematic view of a layered structure of the sky blue double-silver low-emissivity coated glass.
In the figure, a glass substrate layer; 1. a first layer; 2. a second layer; 3. a third layer; 4. a fourth layer; 5. a fifth layer; 6. a sixth layer; 7. a seventh layer; 8. an eighth layer; 9. a ninth layer; 10. a tenth layer; 11. the eleventh layer.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in figure 1, the coated glass comprises a glass substrate layer a and a coating layer, wherein the coating layer is sequentially compounded with eleven layers from the glass substrate layer a to the outside, wherein the first layer 1 is a ZnSnO layer, and the second layer 2 is TiO2Layer, the third layer 3 is NiCr fourth layer 4 is a layer Ag layer, the fifth layer 5 is a NiCr layer, the sixth layer 6 is a SiNx layer, the seventh layer 7 is a ZnO layer, the eighth layer 8 is an Ag layer, the ninth layer 9 is a NiCr layer, and the tenth layer 10 is a TiO layer2The eleventh layer 11 is a SiNx layer;
wherein the first layer 1 is a first dielectric layer and the second layer 2 is TiO2The blue light reflecting layer and the third layer 3 are blocking protective layers capable of preventing TiO2Oxygen in the layer migrates to the Ag layer, the fourth layer 4 is a low-radiation functional layer, the fifth layer 5 is a blocking protective layer, the sixth layer 6 and the seventh layer 7 are second dielectric layers, the eighth layer 8 is a low-radiation functional layer, the ninth layer 9 is a blocking protective layer, and the tenth layer 10 is TiO2The blue light scattering layer and the eleventh layer 11 is a third dielectric layer.
The method comprises the following steps:
1) forming a magnetron sputtering coating layer;
A. magnetron sputtering of the first layer 1:
the number of the targets is as follows: 1 alternating current rotating target; the target material is configured to be zinc tin (ZnSn); process gasThe ratio of argon to oxygen is 1:1.14, the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 10-15 nm;
B. magnetron sputtering of the second layer 2:
2-3 alternating current rotating targets, titanium (Ti) as the target material, 15:1 ratio of argon to oxygen as the process gas, and × 10 (3-5) as the sputtering pressure-3mbar; the thickness of the plated film is 8-12 nm;
C. magnetron sputtering of the third layer 3:
the number of the targets is 1, the targets are configured to be nickel chromium (NiCr), the process gas proportion is argon to oxygen, the proportion of the argon to the oxygen is 1:2, and the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 1-4 nm;
D. magnetron sputtering of the fourth layer 4:
the number of the target materials is 1 direct current plane target, the target materials are configured to be silver (Ag), the process gas is pure argon, the sputtering pressure is (2-3) × 10-3mbar; the thickness of the plated film is 3.5-6.5 nm;
E. magnetron sputtering of the fifth layer 5:
the number of the target materials is 1 alternating current rotating target, the target materials are configured to be nickel chromium (NiCr), the process gas is pure argon, the sputtering pressure is (2-3) × 10-3mbar; the thickness of the coating film is 1.5-3 nm;
F. magnetron sputtering the sixth layer 6:
3-4 alternating current rotating targets, zinc aluminum (ZnAl) as the target material, argon and oxygen in a process gas ratio of 1:2, and × 10 under a sputtering pressure of 3-5-3mbar; the thickness of the plated film is 24-28 nm;
G. magnetron sputtering of the seventh layer 7:
the number of the target materials is 3-4 of alternating current rotating targets, the target materials are configured to be silicon aluminum (SiAl), the ratio of the process gas to argon to oxygen is 1:1.14, the sputtering pressure is (3-5) × 10-3mbar; the thickness of the plated film is 28-32 nm;
H. magnetron sputtering the eighth layer 8:
the number of the targets is as follows: making a business1 flow rotating target, silver (Ag) as the target material, pure argon as the process gas, × 10 (2-3) as the sputtering pressure-3mbar; the thickness of the coating film is 1-3 nm;
the magnetron sputtering of the eighth layer 8 may also be a process as follows:
the number of the target materials is 1 direct current plane target, the target materials are configured to be silver (Ag), the process gas is pure argon, and the sputtering pressure is (2-3) × 10-3mbar; the thickness of the plated film is 4-8 nm;
I. magnetron sputtering the ninth layer 9:
the number of the target materials is 1 alternating current rotating target, the target materials are configured to be nickel chromium (NiCr), the process gas is pure argon, and the sputtering pressure is (2-3) × 10-3mbar; the thickness of the coating film is 0.5-1.5 nm;
J. magnetron sputtering the tenth layer 10:
the number of the targets is 1, the alternating current rotating targets are arranged, the targets are titanium (Ti), the process gas proportion is argon gas to oxygen gas, the proportion of the argon gas to the oxygen gas is 15:2, and the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 2-3.5 nm;
K. magnetron sputtering the eleventh layer 11:
4-5 alternating current rotary targets, silicon aluminum (SiAl) as the target material, 1:1.14 of process gas ratio of argon to oxygen, 3-5 of sputtering pressure of × 10-3mbar; the thickness of the coating film is 45-50 nm;
2) the total thickness of the coating layer is controlled to be 135-155 nm.
Wherein the control of the ratio of argon to oxygen process gas and the amount of introduction of the Ti target can significantly influence the TiO target2The crystal grain diameter of the particles is determined by multiple test debugging and spectrophotometer color measurement experiment2The optimal gas ratio and sputtering power of the film scattering and refracting film.
Double layer TiO by die2The interference and scattering of the film layer realize the sky-like pure color; determining the thickness of each film layer through software design, process debugging and experiments; and determining the stable titanium target process gas proportion through repeated experiments and simulation parameters of the film layer design software under the condition of corresponding gas proportion.
The invention has the advantages that:
1. the appearance color is sky blue, the small-angle color change is small, the outdoor observation is fresh and natural, and the environment integration is good.
2. The Lab color space colorimetry results are as follows: a 6mm single-chip transmission color T e [55, 58], a e [ 3.5, -2.0], b e [ 6, 4.5 ]; and the glass surface color L is from [45, 50], a is from [ 1.5,0], b is from [ 7.0, -5.5 ]. The surface emissivity E of the glass belongs to [0.05, 0.07], and the low emissivity is excellent.
3. The multi-angle (10-75 ℃) chromatic aberration delta a of the glass surface is less than 2.5.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (1)
1. The preparation method of sky blue double-silver low-emissivity coated glass is characterized in that the coated glass comprises a glass substrate layer (a) and a coating layer, wherein eleven coating layers are sequentially compounded from the glass substrate layer (a) to the outside, the first layer (1) is a ZnSnO layer, and the second layer (2) is a TiO layer2The multilayer ceramic capacitor comprises a first layer, a third layer (3) is NiCr, a fourth layer (4) is an Ag layer, a fifth layer (5) is a NiCr layer, a sixth layer (6) is a SiNx layer, a seventh layer (7) is a ZnO layer, an eighth layer (8) is an Ag layer, a ninth layer (9) is a NiCr layer, and a tenth layer (10) is TiO layer2The eleventh layer (11) is a SiNx layer;
wherein the first layer (1) is a first dielectric layer and the second layer (2) is TiO2The blue light reflecting layer and the third layer (3) are blocking protective layers capable of preventing TiO2Oxygen in the layer migrates to the Ag layer, the fourth layer (4) is a low-radiation functional layer, the fifth layer (5) is a blocking protective layer, the sixth layer (6) and the seventh layer (7) are second dielectric layers, the eighth layer (8) is a low-radiation functional layer, the ninth layer (9) is a blocking protective layer, and the tenth layer (10) is TiO2A blue light scattering layer, and an eleventh layer (11) is a third dielectric layer;
the preparation method comprises the following steps:
1) forming a magnetron sputtering coating layer;
A. magnetron sputtering of the first layer (1):
the number of the targets is 1, the targets are configured to be zinc tin (ZnSn), the process gas proportion is argon to oxygen, the proportion of argon to oxygen is 1:1.14, the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 10-15 nm;
B. magnetron sputtering of the second layer (2):
2-3 alternating current rotating targets, titanium (Ti) as the target material, 15:1 ratio of argon to oxygen as the process gas, and × 10 (3-5) as the sputtering pressure-3mbar; the thickness of the plated film is 8-12 nm;
C. magnetron sputtering third layer (3):
the number of the targets is 1, the targets are configured to be nickel chromium (NiCr), the process gas proportion is argon to oxygen, the proportion of the argon to the oxygen is 1:2, and the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 1-4 nm;
D. magnetron sputtering fourth layer (4):
the number of the target materials is 1 direct current plane target, the target materials are configured to be silver (Ag), the process gas is pure argon, the sputtering pressure is (2-3) × 10-3mbar; the thickness of the plated film is 3.5-6.5 nm;
E. magnetron sputtering fifth layer (5):
the number of the target materials is 1 alternating current rotating target, the target materials are configured to be nickel chromium (NiCr), the process gas is pure argon, the sputtering pressure is (2-3) × 10-3mbar; the thickness of the coating film is 1.5-3 nm;
F. magnetron sputtering sixth layer (6):
3-4 alternating current rotating targets, zinc aluminum (ZnAl) as the target material, argon and oxygen in a process gas ratio of 1:2, and × 10 under a sputtering pressure of 3-5-3mbar; the thickness of the plated film is 24-28 nm;
G. magnetron sputtering seventh layer (7):
the number of the targets is as follows: 3-4 alternating current rotary targets; the target material is configured to be silicon aluminum (SiAl); the process gas proportion is as follows: argon and oxygenThe ratio of the argon to the oxygen is 1:1.14, and the sputtering pressure is (3-5) × 10-3mbar; the thickness of the plated film is 28-32 nm;
H. magnetron sputtering eighth layer (8):
the number of the target materials is 1 alternating current rotating target, the target materials are configured to be silver (Ag), the process gas is pure argon, and the sputtering pressure is (2-3) × 10-3mbar; the thickness of the coating film is 1-3 nm;
the magnetron sputtering of the eighth layer (8) can also be a process as follows:
the number of the target materials is 1 direct current plane target, the target materials are configured to be silver (Ag), the process gas is pure argon, and the sputtering pressure is (2-3) × 10-3mbar; the thickness of the plated film is 4-8 nm;
I. magnetron sputtering ninth layer (9):
the number of the target materials is 1 alternating current rotating target, the target materials are configured to be nickel chromium (NiCr), the process gas is pure argon, and the sputtering pressure is (2-3) × 10-3mbar; the thickness of the coating film is 0.5-1.5 nm;
J. magnetron sputtering tenth layer (10):
the number of the targets is 1, the alternating current rotating targets are arranged, the targets are titanium (Ti), the process gas proportion is argon gas to oxygen gas, the proportion of the argon gas to the oxygen gas is 15:2, and the sputtering pressure is (3-5) × 10-3mbar; the thickness of the coating film is 2-3.5 nm;
K. magnetron sputtering the eleventh layer (11):
4-5 alternating current rotary targets, silicon aluminum (SiAl) as the target material, 1:1.14 of process gas ratio of argon to oxygen, 3-5 of sputtering pressure of × 10-3mbar; the thickness of the coating film is 45-50 nm;
2) the total thickness of the coating layer is controlled to be 135-155 nm.
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| CN115594415A (en) * | 2022-09-26 | 2023-01-13 | 晓睿真空设备（嘉兴）有限公司（Cn） | Film structure for building single-silver Low-E glass and manufacturing process thereof |
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