CN107579721A - GPS and BDS SAW filters and its small-sized encapsulated technique - Google Patents
GPS and BDS SAW filters and its small-sized encapsulated technique Download PDFInfo
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- CN107579721A CN107579721A CN201710397451.7A CN201710397451A CN107579721A CN 107579721 A CN107579721 A CN 107579721A CN 201710397451 A CN201710397451 A CN 201710397451A CN 107579721 A CN107579721 A CN 107579721A
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 33
- 239000010931 gold Substances 0.000 claims description 33
- 229910052737 gold Inorganic materials 0.000 claims description 32
- 239000000919 ceramic Substances 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 16
- 238000003466 welding Methods 0.000 claims description 11
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims description 3
- 229910012463 LiTaO3 Inorganic materials 0.000 claims description 3
- 102000002151 Microfilament Proteins Human genes 0.000 claims description 3
- 108010040897 Microfilament Proteins Proteins 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 210000003632 microfilament Anatomy 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000002463 transducing effect Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 101000825914 Homo sapiens Small nuclear ribonucleoprotein Sm D3 Proteins 0.000 description 4
- 102100022775 Small nuclear ribonucleoprotein Sm D3 Human genes 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention discloses GPS and BDS SAW filters and its small-sized encapsulated technique, it is related to SAW filter field.GPS the and BDS SAW filters include piezoelectric substrate and the input transducer being arranged on piezoelectric substrate, output transducer, frequency band control transducer.The invention also discloses the small-sized encapsulated technique of GPS and BDS SAW filters.GPS the and BDS SAW filters can realize that GPS and BDS communications are compatible without producing interference.
Description
Technical field
The present invention relates to SAW filter field, in particular it relates to which a kind of can be with compatible with GPS and the sound of BDS frequency bands
The technique of face wave filter and its small-sized encapsulated.
Background technology
The navigation system of global main flow have the U.S. GPS, Russia " Ge Lunasi ", Europe " Galileo " and in
The BDS of state is Beidou satellite navigation system.Wherein, Russian " Ge Lunasi " navigation system was just opened in Soviet Union's period
Exhibition is originated, but this navigation system is also declined with the disintegration of the Soviet Union；For " Galileo " navigation system in Europe, because European Union
This navigation system of the variety of problems of inside is also that preceding road is bumpy.And the GPS navigation system in the U.S., then be industrial chain layout it is ripe and
Completely, the status of monopolization is achieved in the civilian and commercial kitchen area in the whole world.According to the data statistics of worldwide navigation positioning association,
China Satecom's navigation current scale in market has more than 1,200 hundred million yuan, and GPS navigation system then occupies 95% market share.
As BDS is that Beidou satellite navigation system is constantly perfect, BDS positioning precision and time service precision is in geographic area
In terms of service already close to or the not defeated GPS in the U.S., and exclusive " message " services of BDS are even more the spy not available for GPS
Color service.BDS industrialized development, it is the national present and following project given priority to.
SAW filter is indispensable in Navigation System Design as the core component in GPS and BDS
, but SAW filter is because frequency range is different it is difficult to compatibility in GPS and BDS；In addition, current SAW filter
Encapsulating structure be mostly focused on SMD3*3 or encapsulating structure more than SMD3*3, chi the reason for because of its design structure itself
Very little is difficult to minimize again.
The content of the invention
GPS and BDS are proposed the invention aims to solve the above problems with sound table and wave filter and its small-sized
Change packaging technology；GPS the and BDS SAW filters can realize that GPS and BDS communications are compatible dry without producing
Disturb, and for the small-sized encapsulated technique of GPS and BDS SAW filters, using SMD2520 encapsulating structures, reduce
The package dimension of the GPS and BDS SAW filters.
Technical scheme is as follows：
The present invention proposes GPS and BDS SAW filters, and it includes piezoelectric substrate and is arranged on piezoelectric substrate
Input transducer, output transducer, frequency band control transducer；
The input transducer is made up of the first transducer being mutually in series and the 5th transducer；
The output transducer is made up of the 4th transducer being mutually in series and the 6th transducer；
The frequency band control transducer includes second transducer and the 3rd transducer；
5th transducer is connected with the 6th transducer；Described second transducer one end is connected in first transducer and the 5th transducing
On the line of device, other end ground connection；Described 3rd transducer one end is connected on the line of 4th transducer and the 6th transducer, separately
One end is grounded.
More preferably, the piezoelectric substrate materials are lithium tantalate LiTaO3；The first transducer, second transducer, the 3rd
Transducer, 4th transducer, the 5th transducer and the 6th transducer are interdigital transducer, wherein, first transducer and the 4th
The finger logarithm of transducer is 75 pairs, aperture AP=18* λ1, λ1=2.5 μm；The finger logarithm of 5th transducer and the 6th transducer
It is 52 pairs, aperture AP=18.5* λ2, λ2=2.4 μm；The finger logarithm of second transducer and the 3rd transducer is 280 pairs, hole
Footpath AP=17.1* λ3, λ3=2.6 μm.
More preferably, the GPS and BDS with SAW filter also include be used for anti-high-pressure electrostatic destroy first resistor and
Second resistance；The first resistor is connected in parallel on first transducer both ends, and second resistance is connected in parallel on the 5th transducer both ends.
The invention also discloses the small-sized encapsulated technique of GPS and BDS SAW filters, this small-sized encapsulated work
Skill comprises the following steps：
The first step, plant gold goal：Struck sparks at the top of chopper capillary and melt ball, then reducing chopper makes melted gold goal be connect with chip welding spot
Touch；After chip is heated, along with pressure and ultrasonic power, it is allowed to deform and is bonded together that to form gold convex with chip welding spot
Point；Chopper capillary is lifted again to break spun gold above melted gold goal, only remains a small amount of microfilament in au bump upper end；Pass through
Chopper is downwardly applied to pressure to au bump, makes the top of au bump become flat；
Second step, upside-down mounting paster and ultrasonic bonding：The chip that gold goal has been planted in the first step is cut into some small chips, then it is right
These small chips carry out upside-down mounting paster and welding, wherein, these are welded on ceramic base by the small chip of upside-down mounting paster；
3rd step, the cap for being coated with golden tin layers is covered on ceramic base；
4th step, the cap for being coated with golden tin layers is merged with ceramic base.
More preferably, in the step of first step plants gold goal, chip is heated to 150 degrees Celsius.
More preferably, in the step of second step, specifically small chip is sent on the full-automatic chip mounter of flip chip bonding, then
Ultrasonic bonding is carried out to the small chip that these have been mounted.
More preferably, the size of the ceramic base is 2.5mm*2mm*0.65mm；The length of the cap for being coated with golden tin layers
Spend for 2.35mm, width 1.85mm, the thickness of golden tin layers is 0.26um.
More preferably, in the step of four step, specifically cap and ceramic base are combined using Reflow Soldering.
Beneficial effects of the present invention：
1. 6PS and BDS SAW filters of the present invention can not only cover two frequency ranges of GPS and BDS communications,
The insertion loss of whole wave filter can also be made reduce, and improve Out-of-band rejection；
2. the introducing of the first grounding resistance and the second grounding resistance so that GPS the and BDS SAW filters it is antistatic
The ability of burning greatly enhances；
3.GPS and BDS causes GPS the and BDS SAW filters with the small-sized encapsulated technique of SAW filter
Package dimension greatly diminish, the package dimension from traditional SMD3*3 or more than SMD3*3 narrow down to SMD2520 encapsulation
Size, that is, the package dimension of the GPS and BDS SAW filters is reduced, the GPS and BDS is used so as to reduce
The size of the correlation machines such as the navigator with SAW filter.
Brief description of the drawings
Fig. 1 is the chip circuit structure figure of GPS and BDS SAW filters of the present invention；
Fig. 2 is the circuit diagram of GPS and BDS SAW filters of the present invention；
Fig. 3 is the frequency response chart of GPS and BDS SAW filters of the present invention；
Fig. 4 is by the chip after plant gold goal；
Fig. 5 is upside-down mounting paster and supersonic welding map interlinking；
Fig. 6 is the positive pictorial diagram of ceramic base；
Fig. 7 is the side schematic view of ceramic base；
Fig. 8 is the schematic diagram for the cap for being coated with golden tin layers；
Fig. 9 is the encapsulation schematic diagram of GPS and BDS SAW filters.
Embodiment
In order to which the present invention is better described, it is described further in conjunction with embodiment and accompanying drawing.
The present invention proposes GPS and BDS SAW filters.It is GPS the and BDS surface acoustic waves as shown in Figure 1
The chip circuit structure figure of wave filter, Fig. 2 are the circuit diagram of the GPS and BDS SAW filters.
The GPS and BDS includes piezoelectric substrate with SAW filter；The input for also including being arranged on piezoelectric substrate is changed
Can device, output transducer and frequency band control transducer.Wherein, transducer is inputted by the first transducer 1 and the 5th that is mutually in series
Transducer 5 forms；Output transducer is made up of the transducer 6 of 4th transducer 4 and the 6th being mutually in series；Frequency band controls transducer
Including the transducer 3 of second transducer 2 and the 3rd.
5th transducer 5 is connected with the 6th transducer 6；Described one end of second transducer 2 is connected in the He of first transducer 1
On the line of 5th transducer 5, other end ground connection；Described one end of 3rd transducer 3 is connected in the transducer of 4th transducer 4 and the 6th
On 6 line, other end ground connection.
Six above-mentioned transducers --- first transducer 1, second transducer 2, the 3rd transducer 3,4th transducer 4,
5th transducer 5 and the 6th transducer 6, their typical structures are the transducer of interdigital structure.
Above-mentioned piezoelectric substrate materials are lithium tantalate LiTaO3；First transducer 1, second transducer 2, the 3rd transducer 3,
Four transducers 4, the 5th transducer 5 and the 6th transducer 6 are interdigital transducer, wherein, first transducer 1 and 4th transducer
4 finger logarithm is 75 pairs, aperture AP=18* λ1, λ1=2.5 μm；The finger logarithm of 5th transducer 5 and the 6th transducer 6 is
52 pairs, aperture AP=18.5* λ2, λ2=2.4 μm；The finger logarithm of the transducer 3 of second transducer 2 and the 3rd is 280 pairs, aperture
AP=17.1* λ3, λ3=2.6 μm.
Six above-mentioned transducers --- first transducer 1, second transducer 2, the 3rd transducer 3,4th transducer 4,
5th transducer 5 and the 6th transducer 6, the transducer 5 of first transducer 1 and the 5th of composition input transducer, composition output are changed
Center of this four transducers of the transducer 6 of 4th transducer 4 and the 6th of energy device to GPS the and BDS SAW filters
Frequency plays a decisive role, and forms the transducer 3 of second transducer 2 and the 3rd of frequency band control transducer then to the GPS and BDS
Played a decisive role with the pass band width of SAW filter.
As knowable to Fig. 3 frequency response chart, the structure design more than, GPS the and BDS SAW filters
Communications band can realize covering GPS frequency ranges and BDS frequency ranges, wherein, GPS frequency ranges are：Centre frequency is 1575.4MHz, bandwidth
For 4M, frequency range 1573.4M~1577.4MHZ；BDS frequency ranges are：Centre frequency is 1561MHz, with a width of 4M, frequency range
155941563MHz。
In addition, by more than structure design, GPS the and BDS SAW filters can not only cover GPS and
Two frequency ranges of BDS, and can reduce the insertion loss of whole wave filter, and improve Out-of-band rejection.
In order to improve the ability that anti-high-pressure electrostatic destroys, the GPS and BDS also include first resistor with SAW filter
7 and second resistance 8, wherein first resistor 7 be connected in parallel on the both ends of first transducer 1, second resistance 8 is connected in parallel on the 5th transducer 5
Both ends.
In order to reduce the package dimension of sound table and wave filter, the present invention proposes SMD2520 packaging technologies.Specifically,
The present invention is to propose the small-sized encapsulated technique of GPS and BDS SAW filters, this small-sized encapsulated technique include with
Lower step：
The first step, plant gold goal：Struck sparks at the top of chopper capillary and melt ball, then reducing chopper makes melted gold goal be connect with chip welding spot
Touch；After chip is heated, along with pressure and ultrasonic power, it is allowed to deform and is bonded together that to form gold convex with chip welding spot
Point；Chopper capillary is lifted again to break spun gold above melted gold goal, only remains a small amount of microfilament in au bump upper end；Pass through
Chopper is downwardly applied to pressure to au bump, makes the top of au bump become flat；More preferably, the first step plant gold goal the step of
In, chip is heated to 150 degrees Celsius, this heating temperature be depending on chip finger spacing, if temperature is too high, core
Struck sparks between piece finger serious, it may occur that serious electrostatic breakdown.In Fig. 4, circle is gold goal, and other parts are chip.
Second step, upside-down mounting paster and ultrasonic bonding：The chip that gold goal has been planted in the first step is cut into some small chips,
Upside-down mounting paster and welding are carried out to these small chips again, wherein, these are welded on ceramic base by the small chip of upside-down mounting paster
On.It is to be sent into small chip on the full-automatic chip mounter of flip chip bonding, then these have been mounted small more preferably in this step
Chip carries out ultrasonic bonding.In FIG. 5, it can be seen that small chip 10, gold goal 20 and ceramic base 30, in addition, Fig. 6 is ceramics
The front schematic view of base 30, Fig. 7 are the side schematic view of ceramic base 30.
3rd step, the cap for being coated with golden tin layers is covered on ceramic base；Fig. 8 is the signal for the cap for being coated with golden tin layers
Figure, wherein golden tin of the circle of outside one for plating.
4th step, the cap for being coated with golden tin layers is merged with ceramic base.Specifically using Reflow Soldering by cap
Lid combines with ceramic base.Fig. 9 is the encapsulation schematic diagram of GPS and BDS SAW filters, where it can be seen that
Small chip 10, gold goal 20, ceramic base 30 and the cap 40 for being coated with golden tin layers.
In view of package dimension, more preferably, the size of above-mentioned ceramic base is 2.5mm*2mm*0.65mm；It is described to be coated with gold
The length of the cap of tin layers is 2.35mm, and width 1.85mm, the thickness of golden tin layers is 0.26um.
It is actual in the plant gold goal step of the first step of the small-sized encapsulated technique of the GPS and BDS SAW filters
On can be summarized as four-stage, be the molten ball of sparking respectively, be bonded, break spun gold and form au bump and leveling au bump this four ranks
Section.Plant gold goal manufacturing process and gold wire bonder mechanism is essentially identical.In addition, in the au bump of chip makes, whole chip
The uniformity of upper au bump height is a very crucial parameter, can be caused if highly inconsistent, during flip-chip
Au bump damages or open circuit.In order to obtain highly consistent au bump, it is necessary to be flattened to au bump, by chopper to gold
While salient point is downwardly applied to pressure and the top of au bump is become flat, it is also necessary to which complex optimum includes temperature, power and pressure
The various process parameters such as power.
The upside-down mounting paster and ultrasonic wave of the second step of the small-sized encapsulated technique of the GPS and BDS SAW filters
In welding step, the chip for having planted gold goal is sent on automatic scribing machine and is cut into small chip one by one, cut the small chip of completion
Into on the full-automatic chip mounter of flip chip bonding, in fact, why flip-chip is referred to as " upside-down mounting ", is relative to traditional metal
Line bonding connected mode (Wire Bonding) with plant the technique after ball for, it is traditional by metal wire key and substrate connection
Chip is electrically face-up, and flip-chip it is electric down, equivalent to the former is turned, therefore be referred to as " flip-chip ".
Chip has been planted after gold goal, it is necessary to overturn, and is sent into anti-chip mounter in order to mount, is then carried out ultrasonic bonding.This
The process of two steps is the committed step of small-sized encapsulated technique disclosed by the invention, is allowed to be different from other relatively large chis
The critical process of very little encapsulation.
In summary, the invention discloses GPS and BDS SAW filters, it leads to GPS and BDS aeronautical satellites
Two frequency ranges of letter are integrated in a SAW filter, can realize that GPS and BDS navigational communications are compatible without producing
Raw interference；In addition, the invention also discloses the small-sized encapsulated technique of GPS and BDS SAW filters, use
SMD2520 encapsulating structure techniques, length 2.5mm, width 2.0mm, thickness 0.65mm, reduce SAW filter
Such as package dimension of the GPS and BDS SAW filters, this GPS is used and BDS is filtered with surface acoustic wave so as to reduce
The package size of the machines such as the navigator of device.
Claims (8)
- The small-sized encapsulated technique of 1.GPS and BDS SAW filters, it is characterised in that：Comprise the following steps：The first step, plant gold goal：Struck sparks at the top of chopper capillary and melt ball, then reducing chopper makes melted gold goal be connect with chip welding spot Touch；After chip is heated, along with pressure and ultrasonic power, it is allowed to deform and is bonded together that to form gold convex with chip welding spot Point；Chopper capillary is lifted again to break spun gold above melted gold goal, only remains a small amount of microfilament in au bump upper end；Pass through Chopper is downwardly applied to pressure to au bump, makes the top of au bump become flat；Second step, upside-down mounting paster and ultrasonic bonding：The chip that gold goal has been planted in the first step is cut into some small chips, then it is right These small chips carry out upside-down mounting paster and welding, wherein, these are welded on ceramic base by the small chip of upside-down mounting paster；3rd step, the cap for being coated with golden tin layers is covered on ceramic base；4th step, the cap for being coated with golden tin layers is merged with ceramic base.
- 2. small-sized encapsulated technique as claimed in claim 1, it is characterised in that：In the step of first step plants gold goal, by core Piece is heated to 150 degrees Celsius.
- 3. small-sized encapsulated technique as claimed in claim 1, it is characterised in that：In the step of second step, specifically will be small Chip is sent on the full-automatic chip mounter of flip chip bonding, then carries out ultrasonic bonding to the small chip that these have been mounted.
- 4. small-sized encapsulated technique as claimed in claim 1, it is characterised in that：The size of the ceramic base is 2.5mm* 2mm*0.65mm；The length of the cap for being coated with golden tin layers is 2.35mm, and width 1.85mm, the thickness of golden tin layers is 0.26 μm。
- 5. small-sized encapsulated technique as claimed in claim 1, it is characterised in that：In the step of four steps, specifically using Reflow Soldering combines cap and ceramic base.
- 6.GPS and BDS SAW filters, it is characterised in that including：Piezoelectric substrate；Input transducer, output transducer and the frequency band control transducer being arranged on piezoelectric substrate；The input transducer is made up of the first transducer being mutually in series and the 5th transducer；The output transducer is made up of the 4th transducer being mutually in series and the 6th transducer；The frequency band control transducer includes second transducer and the 3rd transducer；5th transducer is connected with the 6th transducer；Described second transducer one end is connected in first transducer and the 5th transducing On the line of device, other end ground connection；Described 3rd transducer one end is connected on the line of 4th transducer and the 6th transducer, separately One end is grounded.The first transducer, second transducer, the 3rd transducer, 4th transducer, the 5th transducer are interdigital transducer, Wherein, the finger logarithm of first transducer and 4th transducer is 75 pairs, aperture AP=18* λ1, λ1=2.5 μm；5th transducer Finger logarithm with the 6th transducer is 52 pairs, aperture AP=18.5* λ2, λ2=2.4 μm；Second transducer and the 3rd transducer Finger logarithm be 280 pairs, aperture AP=17.1* λ3, λ3=2.6 μm.
- 7. GPS and BDS SAW filters as claimed in claim 6, it is characterised in that：The piezoelectric substrate materials are lithium tantalate LiTaO3；The first transducer, second transducer, the 3rd transducer, 4th transducer, the 5th transducer and the 6th transducer are equal For interdigital transducer, wherein, the finger logarithm of first transducer and 4th transducer is 75 pairs, aperture AP=18* λ1, λ1=2.5 μm；The finger logarithm of 5th transducer and the 6th transducer is 52 pairs, aperture AP=18.5* λ2, λ2=2.4 μm；Second transducer Finger logarithm with the 3rd transducer is 280 pairs, aperture AP=17.1* λ3, λ3=2.6 μm.
- 8. GPS and BDS SAW filters as claimed in claim 6, it is characterised in that：Also include being arranged at piezoelectricity base The first resistor and second resistance that are used for anti-high-pressure electrostatic and destroy on piece；The first resistor is connected in parallel on first transducer two End, second resistance are connected in parallel on the 5th transducer both ends.
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| CN201710397451.7A CN107579721A (en) | 2014-11-07 | 2014-11-07 | GPS and BDS SAW filters and its small-sized encapsulated technique |
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| CN201710397451.7A CN107579721A (en) | 2014-11-07 | 2014-11-07 | GPS and BDS SAW filters and its small-sized encapsulated technique |
| CN201410621766.1A CN104467734B (en) | 2014-11-07 | 2014-11-07 | GPS and BDS SAW filters and its small-sized encapsulated technique |
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| CN104467734B (en) * | 2014-11-07 | 2017-10-20 | 深圳华远微电科技有限公司 | GPS and BDS SAW filters and its small-sized encapsulated technique |
| CN109286386A (en) * | 2018-12-03 | 2019-01-29 | 全讯射频科技(无锡)有限公司 | The filter of integrated varistor |
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| CN104467734A (en) | 2015-03-25 |
| CN104467734B (en) | 2017-10-20 |
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