CN107516708A - A kind of LED device and manufacturing method thereof - Google Patents

Abstract

The invention discloses an LED device, comprising: a first electrode and a second electrode connected by an insulating colloid, the first electrode and the second electrode constitute a support bottom plate, and reflective cups are arranged around the support bottom plate; on the first electrode LED chips are installed; a groove is provided on the upper surface of any one of the first electrode and the second electrode, and a Zener diode is installed in the groove; the groove is filled with a reflective adhesive layer, and the reflective adhesive layer covers the stabilized voltage diode, and the height of the Zener diode is lower than the height of the groove; the reflective cup is filled with a light conversion layer, and the light conversion layer covers the LED chip. The invention also discloses a manufacturing method of the LED device. The LED device and the manufacturing method of the LED device of the present invention can realize the installation of voltage-stabilizing diodes in the installation area of the small reflective cup, and can improve the light extraction efficiency of the LED device while ensuring the anti-static protection capability of the LED device.

Description

A kind of LED device and manufacturing method thereof

technical field

The invention relates to the technical field of LEDs, in particular to an LED device and a manufacturing method thereof.

Background technique

Since LED devices are electrostatic sensitive devices, they are easily damaged by static electricity or high-voltage surges during use. Therefore, in order to prevent damage to LED devices caused by static electricity and high-voltage surges, the existing LED devices are packaged The general practice in the process is to connect a Zener diode in parallel at both ends of the LED chip. However, because Zener diodes are silicon-based doped diodes, they will absorb the light emitted by the LED chip, resulting in a decrease in the brightness of the LED device.

In order to prevent the Zener diode from absorbing the light emitted by the LED chip, measures to prevent the Zener diode from absorbing light have been proposed. For example, the invention patent CN100543985C proposes a high-brightness light-emitting diode with anti-static discharge impact protection function, which can improve the brightness of the light-emitting diode. However, in this light-emitting diode, the LED chip and the Zener diode are installed in adjacent positions, and the total area of the LED chip and the Zener diode becomes the overall component installation area, which leads to a large LED volume; in addition, the existing The installation area of the LED packaging carrier is shown in Figure 1. After placing the LED chip in the installation area of the reflector, there is no room for bonding wires. Therefore, this invention patent cannot realize the anti-static protection of the LED device under the existing LED packaging carrier. Function.

Contents of the invention

In view of the above problems, an LED device and its manufacturing method of the present invention can effectively prevent the Zener diode from occupying a large installation area, and can realize the installation of the Zener diode in the installation area of the small reflector cup, and ensure that the LED device has In addition to the anti-static protection ability, it can also improve the light extraction efficiency of the LED device.

In order to solve the above-mentioned technical problems, a kind of LED device of the present invention comprises:

The first electrode and the second electrode connected by insulating colloid, the first electrode and the second electrode constitute a support bottom plate, and reflective cups are arranged around the support bottom plate;

An LED chip is installed on the first electrode, the positive end of the LED chip is electrically connected to the first electrode, and the negative end of the LED chip is electrically connected to the second electrode;

A groove is provided on the upper surface of any one of the first electrode and the second electrode, and a Zener diode is installed in the groove; wherein, the Zener diode is connected in parallel with the LED chip;

The groove is filled with a reflective adhesive layer, the reflective adhesive layer covers the Zener diode, and the height of the Zener diode is lower than the height of the groove;

The reflective cup is filled with a light conversion layer, and the light conversion layer covers the LED chip.

Compared with the prior art, a LED device of the present invention has the following beneficial effects:

By providing a groove for accommodating the Zener diode on the upper surface of any one of the first electrode and the second electrode, the installation space for the Zener diode can be made, and the Zener diode is prevented from occupying the adjacent position of the LED chip, so that the overall The component installation area is miniaturized; at the same time, since the Zener diode is accommodated in the groove, the LED chip is installed on the first electrode, so that after the LED chip and the Zener diode are installed, there is still space in the component installation area for die bonding Welding wires, so that Zener diodes can be installed in the installation area of the small reflector;

Since the groove is filled with reflective colloid, and the reflective colloid covers the Zener diode, the reflective colloid can isolate the groove from the area where the LED chip is installed, and the light emitted by the LED chip can pass through the reflective cup and the reflective colloid. Reflection can effectively prevent the Zener diode from absorbing the light emitted by the LED chip, thereby ensuring that the LED device has anti-static protection capabilities, and at the same time improving the light extraction efficiency of the LED device.

As an improvement to the above solution, the inner side wall of the reflective cup extends inwardly along the upper surface of the support bottom plate to cover the edge of the upper surface of the support bottom plate.

As an improvement of the above scheme, the voltage stabilizing diode is a vertical voltage stabilizing diode, one end of the vertical voltage stabilizing diode is electrically connected to the bottom of the groove through conductive colloid, and the other end of the vertical voltage stabilizing diode It is connected with the other electrode of the first electrode and the second electrode through a wire.

As an improvement of the above solution, the voltage stabilizing diode is a unidirectional voltage stabilizing diode or a bi-phase voltage stabilizing diode.

As an improvement of the above solution, the reflective colloid is reflective colloid with high reflectivity.

As an improvement to the above solution, the LED chip is a front-mounted LED chip or a vertical LED chip.

In order to solve the above technical problems, the present invention also provides a method for manufacturing an LED device, comprising the following steps:

Etching the metal copper sheet into a first electrode and a second electrode;

forming a groove on the upper surface of any one of the first electrode and the second electrode by using an etching process or a punching process;

Using a mold injection molding process, filling insulating colloid between the first electrode and the second electrode to form a support bottom plate, and making reflective cups around the support bottom plate;

Installing an LED chip on the first electrode; wherein, the positive end of the LED chip is electrically connected to the first electrode, and the negative end of the LED chip is electrically connected to the second electrode;

installing a Zener diode in the groove, the Zener diode is connected in parallel with the LED chip, and the height of the Zener diode is lower than the groove;

Dispensing a reflective adhesive layer in the groove to cover the Zener diode by using a dispensing process, so that the groove is isolated from the area for installing the LED chip in the reflective cup;

A light-converting adhesive layer is applied to the reflective cup by a dispensing process to cover the LED chip.

Compared with the prior art, a method for manufacturing an LED device of the present invention has the following beneficial effects:

By making a groove for accommodating the Zener diode on the upper surface of any one of the first electrode and the second electrode, the installation space for the Zener diode can be made, and the Zener diode can be prevented from occupying the adjacent position of the LED chip, so that The installation area of the overall component is miniaturized; at the same time, since the Zener diode is accommodated in the groove, the LED chip is installed on the first electrode, so that after the LED chip and the Zener diode are installed, there is still space in the component installation area for fixing. Crystal bonding wires, and then the Zener diode can be installed in the installation area of the small reflector;

By filling the groove with reflective colloid and covering the Zener diode with the reflective colloid, the reflective colloid can isolate the groove from the area where the LED chip is installed, and the light emitted by the LED chip can be transmitted through the reflective cup and the reflective colloid. Reflection can effectively prevent the Zener diode from absorbing the light emitted by the LED chip, thereby ensuring that the LED device has anti-static protection capabilities, and at the same time improving the light output efficiency of the LED device;

The LED manufacturing method of the present invention is simple, and the adopted process is simple, easy and mature, and is suitable for assembly line work, and can effectively realize the integration of voltage stabilizing diodes in the small reflective cup, so that the manufactured LED device can be miniaturized.

As an improvement of the above scheme, the voltage stabilizing diode is a vertical type voltage stabilizing diode; the installation of the voltage stabilizing diode in the groove includes the following steps:

One end of the vertical Zener diode is electrically connected to the bottom of the groove through conductive colloid;

The other end of the vertical Zener diode is connected to the other electrode of the first electrode and the second electrode through a wire by using a wire bonding process.

As an improvement to the above solution, the LED chip is a front-mounted LED chip or a vertical LED chip.

Description of drawings

FIG. 1 is a schematic structural view of the mounting area of an LED packaging carrier in the prior art of the present invention.

Fig. 2 is a schematic structural diagram of an LED device according to Embodiment 1 of the present invention.

Fig. 3 is a schematic structural diagram of an LED device according to Embodiment 2 of the present invention.

Fig. 4 is a schematic structural diagram of an LED device when the LED chip is a vertical LED chip in Embodiment 2 of the present invention.

Fig. 5 is a schematic structural view of the LED device when the groove is provided on the second electrode in Embodiment 2 of the present invention.

detailed description

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from this description, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

The technical solution of the present invention will be clearly and completely described below in combination with specific embodiments and accompanying drawings.

Example 1

As shown in FIG. 2 , it is an LED device 1 according to Embodiment 1 of the present invention, comprising: a first electrode 11 and a second electrode 12 connected by an insulating colloid 13, and the first electrode 11 and the second electrode 12 form a support bottom plate, A reflective cup 14 is arranged around the bottom plate of the bracket, and the reflective cup 14 is made of white plastic; an LED chip 15 is installed on the first electrode 11, and the positive end of the LED chip 15 is electrically connected to the first electrode 11, and the LED chip 15 The negative end of the negative terminal is electrically connected to the second electrode 12; a groove 16 is arranged on the upper surface of any electrode in the first electrode 11 and the second electrode 12, and a Zener diode 161 is installed in the groove 16; wherein, the voltage regulator The diode 161 is connected in parallel with the LED chip 15; the groove 16 is filled with reflective colloid 162, the reflective colloid 162 covers the Zener diode 161, and the height of the Zener diode 161 is lower than the height of the groove 16; the reflective cup 14 is filled with light conversion Layer 141 , the light conversion layer 141 covers the LED chip 15 .

Compared with the prior art, an LED device 1 of the present invention has the following beneficial effects:

(1) By setting the groove 16 for accommodating the Zener diode 161 on the upper surface of any one of the first electrode 11 and the second electrode 12, the installation space can be reserved for the Zener diode 161, avoiding the occupation of the Zener diode 161 The adjacent position of the LED chip 15 makes the installation area of the overall component miniaturized; meanwhile, since the Zener diode 161 is accommodated in the groove 16, the LED chip 15 is installed on the first electrode 11, so that the installation of the LED chip 15 and the stability After pressing the diode 161, there is still space in the component installation area for bonding wires, so that the Zener diode 161 can be installed in the installation area of the small reflector;

(2) Since the groove 16 is filled with reflective colloid 162, and the reflective colloid 162 covers the Zener diode 161, so that the reflective colloid 162 can isolate the groove 16 from the area where the LED chip 15 is installed, and the LED chip 15 emits The light can be reflected by the reflective cup 14 and the reflective colloid 162, which can effectively prevent the Zener diode 161 from absorbing the light emitted by the LED chip 15, thereby ensuring that the LED device 1 has anti-static protection capabilities, and can also improve the performance of the LED device 1. light extraction efficiency.

Preferably, in the LED device 1 of Embodiment 1, the inner side wall of the reflective cup 14 extends inwardly along the upper surface of the support bottom plate to cover the edge of the upper surface of the support bottom plate, so that the bottom of the reflective cup 14 wraps the side of the support bottom plate The wall and the upper surface edge increase the contact area and mutual cooperation relationship between the reflective cup 14 and the support bottom plate, thereby enhancing the bonding force between the reflective cup 14 and the support bottom plate; at the same time, the top diameter of the reflective cup 14 is greater than the bottom diameter, so that The inner wall of the reflective cup 14 has a certain inclination, which can improve the reflective effect of the LED device 1 .

Preferably, in the LED device 1 of Embodiment 1, the insulating colloid 13 is an insulating colloid with a high reflection effect, which can prevent the insulating colloid 13 from absorbing the light emitted by the LED chip 15, and can emit the LED chip 15 through the insulating colloid 13. The light is reflected to improve the light extraction efficiency of the LED device 1 .

Preferably, the reflective colloid 162 in Embodiment 1 is a reflective colloid with high reflectivity.

Example 2

Embodiment 2 of the present invention is improved on the basis of the technical solution involved in Embodiment 1: the Zener diode is a vertical Zener diode, one end of the vertical Zener diode is electrically connected to the bottom of the groove through a conductive colloid, and the vertical The other end of the type Zener diode is connected to the other electrode of the first electrode and the second electrode through a wire. Specifically, the zener diode may be a unidirectional zener diode or a bi-phase zener diode. The LED chip is a front-mounted LED chip or a vertical LED chip.

Next, the embodiment will be described in detail by taking the zener diode as a vertical unidirectional zener diode, the LED chip as a front-mounted LED chip, and the groove disposed on the first electrode as an example. Since the configuration of the bi-phase zener diode is similar to that of the unidirectional zener diode, it will not be listed here.

As shown in FIG. 3 , the Zener diode 161 is a vertical unidirectional voltage stabilizer diode, and the negative end of the Zener diode 161 is directly electrically connected to the bottom of the groove 16 through the first conductive colloid 163 . The positive terminal is electrically connected to the second electrode 12 through a wire to realize the antiparallel connection with the LED chip 15. The connection makes the negative terminal of the Zener diode 161 have a larger contact area with the bottom of the groove 16, which can effectively improve the welding process yield of the Zener diode 161. The positive end of the front-mount LED chip 151 is electrically connected to the first electrode 11 through a wire, and the negative end of the front-mount LED chip 151 is electrically connected to the second electrode 12 through a wire.

Further, as shown in FIG. 4, when the LED chip 15 is a vertical LED chip 152, the positive terminal of the vertical LED chip 152 is directly connected to the first electrode 11 through the second conductive gel 153, and the vertical LED chip 152 The negative terminal of the vertical LED chip 152 is electrically connected to the bottom of the groove 16 through the second conductive colloid 152, so that the negative terminal of the vertical LED chip 152 is connected to the concave electrode 12 through a wire. The bottom of the groove 16 has a larger contact area, which can effectively improve the welding process yield of the vertical LED chip 152 .

It can be understood that, as shown in FIG. 5 , the groove 16 can also be arranged on the second electrode 12. When the groove 16 is arranged on the second electrode 12, the positive end of the Zener diode 161 passes through the first conductive gel 163 is directly electrically connected to the bottom of the groove 16, and the negative end of the Zener diode 161 is electrically connected to the second electrode 12 through a wire.

Example 3

The present invention also provides a method for manufacturing an LED device, comprising the following steps:

S1. Etching the metal copper sheet into a first electrode and a second electrode;

S2. Making a groove on the upper surface of any one of the first electrode and the second electrode by using an etching process or a stamping process;

S3. Using a mold injection molding process, filling insulating colloid between the first electrode and the second electrode to form a support bottom plate, and making reflective cups around the support bottom plate;

S4. Install the LED chip on the first electrode; wherein, the positive end of the LED chip is electrically connected to the first electrode, and the negative end of the LED chip is electrically connected to the second electrode;

S5. Install the Zener diode in the groove, connect the Zener diode and the LED chip in parallel, and the height of the Zener diode is lower than the groove;

S6. Use a dispensing process to apply a reflective adhesive layer in the groove to cover the Zener diode, so that the groove and the area for installing the LED chip in the reflective cup are isolated from each other;

S7. Using a dispensing process to apply a light conversion adhesive layer in the reflective cup to cover the LED chip.

Wherein, the order of steps S4 and S5 can be exchanged.

Compared with the prior art, a method for manufacturing an LED device of the present invention has the following beneficial effects:

(1) By making a groove for accommodating the Zener diode on the upper surface of any one of the first electrode and the second electrode, the installation space for the Zener diode can be made, and the Zener diode can be prevented from occupying the adjacent LED chip. Position, so that the installation area of the overall component is miniaturized; at the same time, since the Zener diode is accommodated in the groove, the LED chip is installed on the first electrode, so that after the LED chip and the Zener diode are installed, there is still space in the component installation area It is used for solid crystal bonding wire, and then can realize the installation of Zener diode in the installation area of the small reflector;

(2) By filling the reflective colloid in the groove and covering the Zener diode with the reflective colloid, the reflective colloid can isolate the groove from the area where the LED chip is installed, and the light emitted by the LED chip can pass through the reflective cup and the LED chip. The reflection of the reflective colloid can effectively prevent the Zener diode from absorbing the light emitted by the LED chip, thereby ensuring that the LED device has anti-static protection capabilities, and can also improve the light output efficiency of the LED device;

(3) The LED manufacturing method of the present invention is simple, and the adopted process is simple, easy and mature, and is suitable for assembly line work, and can effectively realize the integration of voltage-stabilizing diodes in small reflective cups, making the manufactured LED devices miniaturized.

Preferably, in Embodiment 4, the LED chip is a front-mounted LED chip, and step S4 installs the LED chip on the first electrode, specifically:

The positive end of the LED chip is connected to the first electrode through a wire, and the negative end of the LED chip is connected to the second electrode through a wire by using a wire bonding process.

Further, the LED chip can also be a vertical LED chip, and the step S4 is to install the LED chip on the first electrode, including:

S41. Connect the positive end of the LED chip to the first electrode through the conductive colloid;

S42. Connect the negative terminal of the LED chip to the second electrode through a wire by using a wire bonding process.

Preferably, in Embodiment 4, the Zener diode is a vertical Zener diode; step S5 installing the Zener diode in the groove includes the following steps:

S51, electrically connecting one end of the vertical Zener diode to the bottom of the groove through the conductive colloid;

S52. Connect the other end of the vertical Zener diode to the other electrode of the first electrode and the second electrode through a wire by using a wire bonding process.

More specifically, the zener diode can be a unidirectional zener diode or a bi-phase zener diode.

Preferably, the wires in the above embodiments are gold wires.

The above is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Therefore, any content that does not depart from the technical solution of the present invention, any changes made to the above embodiments according to the technical essence of the present invention Simple modifications, equivalent changes and modifications all still fall within the scope of the technical solutions of the present invention.

Claims (10)

1. A kind of 1. LED component, it is characterised in that including：

   The first electrode and second electrode connected by the colloid that insulate, the first electrode and the second electrode form support bottom Plate, the surrounding of the support bottom plate are surrounded with reflector；

   LED chip is installed on the first electrode, the positive terminal of the LED chip electrically connects with the first electrode, institute The negative pole end for stating LED chip electrically connects with the second electrode；

   The upper surface of any electrode in the first electrode and the second electrode is provided with a groove, is installed in the groove There is voltage-regulator diode；Wherein, the voltage-regulator diode is in parallel with the LED chip；

   In the groove voltage-regulator diode, and the voltage-regulator diode are covered filled with reflection glue-line, the reflection glue-line Height be less than the groove height；

   Light conversion layer is filled with the reflector, the light conversion layer covers the LED chip.
2. 2. LED component as claimed in claim 1, it is characterised in that support bottom described in the madial wall to interior edge of the reflector The upper surface extension of plate, to cover the top surface edge of the support bottom plate.
3. 3. LED component as claimed in claim 1, it is characterised in that the voltage-regulator diode is vertical-type voltage-regulator diode, institute The one end for stating vertical-type voltage-regulator diode is electrically connected by conductive rubber with the bottom of the groove, the pole of vertical-type voltage stabilizing two The other end of pipe is connected with another electrode in the first electrode and the second electrode by wire.
4. 4. LED component as claimed in claim 1, it is characterised in that the voltage-regulator diode is unidirectional voltage-regulator diode or double Phase voltage-regulator diode.
5. 5. LED component as claimed in claim 1, it is characterised in that the reflection colloid is the reflection glue with high reflectance Body.
6. 6. LED component as claimed in claim 1, it is characterised in that the LED chip is formal dress type LED chip or vertical-type LED chip.
7. 7. a kind of preparation method of LED component, it is characterised in that comprise the following steps：

   Metallic copper piece is etched into first electrode and second electrode；

   Using etch process or Sheet Metal Forming Technology, the upper surface system of any electrode in the first electrode and the second electrode Make a groove；

   Using mold injection molding technique, filling insulation colloid is propped up with forming between the first electrode and the second electrode Frame bottom plate, and it surround making reflector in the surrounding of the support bottom plate；

   By LED chip installation on the first electrode；Wherein, the positive terminal of the LED chip is electrically connected with the first electrode Connect, the negative pole end of the LED chip electrically connects with the second electrode；

   Voltage-regulator diode is arranged in the groove, the voltage-regulator diode is in parallel with the LED chip, the pole of voltage stabilizing two The height of pipe is less than the groove；

   Gluing process spot printing in the groove is used to reflect glue-line to cover the voltage-regulator diode so that the groove and institute State mutually isolated for installing the region of LED chip in reflector；

   Using gluing process, spot printing light changes glue-line in the reflector, to cover the LED chip.
8. 8. the preparation method of LED component as claimed in claim 7, it is characterised in that the voltage-regulator diode is that vertical-type is steady Press diode；It is described that voltage-regulator diode is arranged in the groove, comprise the following steps：

   One end of the vertical-type voltage-regulator diode is electrically connected by conductive rubber with the bottom of the groove；

   Using bonding wire craft by the other end of the vertical-type voltage-regulator diode and the first electrode and the second electrode Another electrode connected by wire.
9. 9. the preparation method of LED component as claimed in claim 7, it is characterised in that the LED chip is formal dress type LED core Piece or vertical-type LED chip.
10. 10. the preparation method of LED component as claimed in claim 7, it is characterised in that the reflection colloid is with high reflection The reflection colloid of rate.