CN107508018B - Multilayer ultra-wideband filter - Google Patents
Multilayer ultra-wideband filter Download PDFInfo
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- CN107508018B CN107508018B CN201710794764.6A CN201710794764A CN107508018B CN 107508018 B CN107508018 B CN 107508018B CN 201710794764 A CN201710794764 A CN 201710794764A CN 107508018 B CN107508018 B CN 107508018B
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- 239000003990 capacitor Substances 0.000 claims abstract description 65
- 230000008878 coupling Effects 0.000 claims abstract description 9
- 238000010168 coupling process Methods 0.000 claims abstract description 9
- 238000005859 coupling reaction Methods 0.000 claims abstract description 9
- 241000270295 Serpentes Species 0.000 claims abstract description 4
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 abstract description 13
- 239000000919 ceramic Substances 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
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Abstract
The invention relates to the field of microwave communication systems, in particular to a multilayer ceramic ultra-wideband high-pass filter. A multilayer ceramic filter comprises an outer electrode, an inner electrode, a plurality of laminated sheet-shaped ceramic dielectric layers; the outer electrode consists of a shielding grounded metal electrode and an input and output metal end electrode; and an inner electrode is coated on the plane of each flaky ceramic dielectric layer, and comprises: 2 layers of shielding grounding electrodes, 4 strip lead-out line electrodes and 2 snake grounding electrodes, wherein input and output coupling capacitors are formed between the strip lead-out line electrodes and the snake grounding electrodes, so that the bandwidth and cut-off frequency can be adjusted; through the structural optimization of the inner electrodes on different sheet-shaped ceramic dielectric layers, filters with different electrical properties can be designed on the same filter volume, and the consistency and reliability of the process are effectively improved.
Description
Technical Field
The invention relates to the field of microwave communication systems, in particular to a multilayer ceramic ultra-wideband high-pass filter.
Background
With the rapid development of communication technology, people have demanded wireless communication not only for simple voice communication but also for a wireless communication system with a large data volume and high security, such as high-definition video. The ultra-wideband (UWB) wireless communication technology has become a research hotspot in the wireless communication field at present due to the characteristics of simple system structure, low cost, low power consumption, high transmission rate, good confidentiality and the like. In 2002, the Federal Communications Commission (FCC) approved the use of UWB technology in the short-range wireless communications field, opening the 3.1GHz to 10.6GHz band for commercial use. The UWB technology has a wide application prospect, and is widely applied to many fields such as high-speed wireless personal area networks, wireless ethernet interface links, intelligent wireless local area networks, and the like. As one of the key devices in the UWB communication system, the ultra wide band filter has a high design difficulty.
At present, methods for realizing the ultra-wideband filter are various, and strong coupling is generally required for realizing such a wide bandwidth, so that a substrate adopted by most of the currently-realized ultra-wideband filters has a larger dielectric constant or a higher thickness, which brings larger signal delay for microwave application. While a broadband filter using cascaded 1/4 wavelength resonators has a larger size.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a multilayer ultra-wideband filter, which ingeniously utilizes three-dimensional space layout to form the ultra-wideband filter according to an improved high-low pass series equivalent circuit; the bandwidth of the passband is greatly expanded, so that the ultra-wideband filtering function is realized, and the problem of filtering of a receiving end of an ultra-wideband antenna is solved.
In order to achieve the purpose, the invention adopts the following technical scheme:
a multi-layer ultra-wideband filter, comprising:
the multilayer structure comprises a multilayer body and a plurality of insulating medium layers, wherein a first external input and output electrode, a second external input and output electrode, a first external grounding electrode and a second external grounding electrode are arranged on the surface of the multilayer body;
the first shielding grounding electrode is respectively connected with the first external grounding electrode and the second external grounding electrode; the second shielding grounding electrode is respectively connected with the first external grounding electrode and the second external grounding electrode; the first snake-shaped input and output capacitor plate, the second snake-shaped input and output capacitor plate, the third snake-shaped input and output capacitor plate and the fourth snake-shaped input and output capacitor plate, wherein 4 snake-shaped input and output capacitor plates are respectively positioned on different insulating medium layers, 4 snake-shaped input and output capacitor plates are respectively coupled with the first shielding grounding electrode and the second shielding grounding electrode layer to form an input and output capacitor C1 and a small inductor L1 equivalent to a snake-shaped line of the input and output capacitor C1 and the snake-shaped line of the snake-shaped input and output capacitor plate, the first snake-shaped input and output capacitor plate and the second snake-shaped input and output capacitor plate are connected with a first external input and output electrode, and the third snake-shaped input and output capacitor plate and the fourth snake;
the two serpentine grounding electrodes are connected with a first external grounding electrode through a first inductance line and a second inductance line which are thin to form an equivalent inductance L2, and the lower end of the inductance L2 is grounded; the two snake-shaped grounding electrodes, the first snake-shaped input and output capacitor plate, the second snake-shaped input and output capacitor plate, the third snake-shaped input and output capacitor plate and the fourth snake-shaped input and output capacitor plate form a coupling input capacitor C2, and partial snake-shaped lines arranged on the two snake-shaped grounding electrodes form upper and lower coupling, and form an equivalent inductor L3 and an equivalent capacitor C3 by adding the equivalent inductance effect of the two snake-shaped grounding electrodes;
the laminated body consists of 7 insulating medium layers which are respectively a first insulating medium layer, a second insulating medium layer, a third insulating medium layer, a fourth insulating medium layer, a fifth insulating medium layer, a sixth insulating medium layer and a seventh insulating medium layer from bottom to top; the first shielding grounding electrode is arranged on the upper surface of the first insulating medium layer, and the second shielding grounding electrode is arranged on the upper surface of the sixth insulating medium layer; the first snake-shaped input and output capacitor plate is positioned on the left side of the upper surface of the second insulating medium layer, and the second snake-shaped input and output capacitor plate is positioned on the left side of the upper surface of the fourth insulating medium layer; the third snake-shaped input and output capacitor plate is positioned on the right side of the upper surface of the third insulating medium layer; the fourth snake-shaped input and output capacitor plate is positioned on the right side of the upper surface of the fifth insulating medium layer; the first serpentine grounding electrode is positioned on the left side of the upper surface of the third insulating medium layer, and the second serpentine grounding electrode is positioned on the right side of the upper surface of the fourth insulating medium layer.
Preferably, each pattern coated on each insulating dielectric layer is a metal conductor.
The invention designs the ultra-wideband filter with good passband characteristic, high passband selectivity and ultrahigh stop band suppression effect characteristic by adopting a novel high-low pass series coupling mode and utilizing the advantage of three-dimensional layout in the LTCC device, and the ultra-wideband filter is particularly suitable for being applied to an ultra-wideband communication system in short-distance wireless communication.
Drawings
FIG. 1 is an exploded perspective view of a multilayer ceramic filter according to a preferred embodiment of the present invention;
FIG. 2 is a schematic view of the outer surface structure of a multilayer ceramic filter according to the present invention;
FIG. 3 is a frequency characteristic graph of the multilayer ceramic filter shown in FIG. 1;
fig. 4 is an equivalent electrical schematic of a ceramic filter implemented in accordance with the present invention.
Detailed Description
The following describes a detailed embodiment of the present invention with reference to the accompanying drawings.
A multi-layer ultra-wideband filter as shown in fig. 1 and 2, the multi-layer ultra-wideband filter comprising:
the laminated body 201 is composed of a plurality of insulating medium layers, the laminated body 201 is composed of 7 insulating medium layers, and the laminated body 201 is composed of a first insulating medium layer 101, a second insulating medium layer 102, a third insulating medium layer 103, a fourth insulating medium layer 104, a fifth insulating medium layer 105, a sixth insulating medium layer 106 and a seventh insulating medium layer 107 from bottom to top; a first external input/output electrode 204, a second external input/output electrode 205, a first external ground electrode 202, and a second external ground electrode 203 are provided on the surface of the laminate 201;
a first shielding ground electrode 1011 and a second shielding ground electrode 1061, wherein the first shielding ground electrode 1011 and the second shielding ground electrode 1061 are respectively arranged on the upper surfaces of the first insulating medium layer 101 and the sixth insulating medium layer 106, and the two layers of shielding ground electrodes are connected with the first external ground electrode 202 and the second external ground electrode 203;
the first snake-shaped input and output capacitor plate 1021, the second snake-shaped input and output capacitor plate 1043, the third snake-shaped input and output capacitor plate 1031 and the fourth snake-shaped input and output capacitor plate 1051, wherein the first snake-shaped input and output capacitor plate 1021 and the second snake-shaped input and output capacitor plate 1043 are respectively positioned on the left side of the upper surfaces of the second insulating medium layer 102 and the fourth insulating medium layer 104; the third serpentine input/output capacitor plate 1031 and the fourth serpentine input/output capacitor plate 1051 are respectively located on the right sides of the upper surfaces of the third insulating medium layer 103 and the fifth insulating medium layer 105; the 4 serpentine input/output capacitor plates are respectively coupled with the first shielding grounding electrode 1011 and the second shielding grounding electrode 1061 layer to form an input/output capacitor C1 and a small inductor L1 (as shown in fig. 4) equivalent to a serpentine line of the serpentine line, the first serpentine input/output capacitor plate 1021 and the second serpentine input/output capacitor plate 1043 are connected with the first external input/output electrode 204, and the third serpentine input/output capacitor plate 1031 and the fourth serpentine input/output capacitor plate 1051 are connected with the second external input/output electrode 205;
a first serpentine ground electrode 1034 and a second serpentine ground electrode 1041, wherein the first serpentine ground electrode 1034 is located on the left side of the upper surface of the third dielectric layer 103, and the second serpentine ground electrode 1041 is located on the right side of the upper surface of the fourth dielectric layer 104. The two serpentine ground electrodes are connected to the first external ground electrode 202 through the thin first inductor strip 1033 and the second inductor strip 1042 to form an equivalent lower ground inductor L2; the two serpentine ground electrodes, the first serpentine input/output capacitor plate 1021, the second serpentine input/output capacitor plate 1043, the third serpentine input/output capacitor plate 1031, and the fourth serpentine input/output capacitor plate 1051 form a coupling input capacitor C2 (as shown in fig. 4), and the serpentine lines 1032 and 1044 disposed on the two serpentine ground electrodes form an up-down coupling, and then form an equivalent inductor L3 and an equivalent capacitor C3 (as shown in fig. 4) by adding their equivalent inductance effects.
In fig. 1, hatched areas are metal conductors, for example, Ag, Cu, Au, or other metal compounds, and are formed by printing, evaporation coating, or other techniques.
While this patent has been particularly shown and described with reference to preferred embodiments, it will be understood by those skilled in the art that other changes in form and details may be made therein without departing from the spirit and scope of the patent.
Claims (2)
1. A multi-layer ultra-wideband filter, comprising:
the multilayer structure comprises a multilayer body and a plurality of insulating medium layers, wherein a first external input and output electrode, a second external input and output electrode, a first external grounding electrode and a second external grounding electrode are arranged on the surface of the multilayer body;
the first shielding grounding electrode is respectively connected with the first external grounding electrode and the second external grounding electrode; the second shielding grounding electrode is respectively connected with the first external grounding electrode and the second external grounding electrode; the first snake-shaped input and output capacitor plate, the second snake-shaped input and output capacitor plate, the third snake-shaped input and output capacitor plate and the fourth snake-shaped input and output capacitor plate, wherein 4 snake-shaped input and output capacitor plates are respectively positioned on different insulating medium layers, 4 snake-shaped input and output capacitor plates are respectively coupled with the first shielding grounding electrode and the second shielding grounding electrode layer to form an input and output capacitor C1 and a small inductor L1 equivalent to a snake-shaped line of the input and output capacitor C1 and the snake-shaped line of the snake-shaped input and output capacitor plate, the first snake-shaped input and output capacitor plate and the second snake-shaped input and output capacitor plate are connected with a first external input and output electrode, and the third snake-shaped input and output capacitor plate and the fourth snake;
the two serpentine grounding electrodes are connected with a first external grounding electrode through a first inductance line and a second inductance line which are thin to form an equivalent inductance L2, and the lower end of the inductance L2 is grounded; the two snake-shaped grounding electrodes, the first snake-shaped input and output capacitor plate, the second snake-shaped input and output capacitor plate, the third snake-shaped input and output capacitor plate and the fourth snake-shaped input and output capacitor plate form a coupling input capacitor C2, and partial snake-shaped lines arranged on the two snake-shaped grounding electrodes form upper and lower coupling, and form an equivalent inductor L3 and an equivalent capacitor C3 by adding the equivalent inductance effect of the two snake-shaped grounding electrodes;
the laminated body consists of 7 insulating medium layers which are respectively a first insulating medium layer, a second insulating medium layer, a third insulating medium layer, a fourth insulating medium layer, a fifth insulating medium layer, a sixth insulating medium layer and a seventh insulating medium layer from bottom to top; the first shielding grounding electrode is arranged on the upper surface of the first insulating medium layer, and the second shielding grounding electrode is arranged on the upper surface of the sixth insulating medium layer; the first snake-shaped input and output capacitor plate is positioned on the left side of the upper surface of the second insulating medium layer, and the second snake-shaped input and output capacitor plate is positioned on the left side of the upper surface of the fourth insulating medium layer; the third snake-shaped input and output capacitor plate is positioned on the right side of the upper surface of the third insulating medium layer; the fourth snake-shaped input and output capacitor plate is positioned on the right side of the upper surface of the fifth insulating medium layer; the first serpentine grounding electrode is positioned on the left side of the upper surface of the third insulating medium layer, and the second serpentine grounding electrode is positioned on the right side of the upper surface of the fourth insulating medium layer.
2. The multi-layer ultra-wideband filter of claim 1, wherein each pattern coated on each dielectric layer is a metallic conductor.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710794764.6A CN107508018B (en) | 2017-09-06 | 2017-09-06 | Multilayer ultra-wideband filter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710794764.6A CN107508018B (en) | 2017-09-06 | 2017-09-06 | Multilayer ultra-wideband filter |
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| CN107508018A CN107508018A (en) | 2017-12-22 |
| CN107508018B true CN107508018B (en) | 2020-11-17 |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110429920A (en) * | 2019-09-04 | 2019-11-08 | 研创光电科技（赣州）有限公司 | A kind of miniature multilayer ceramic band-pass filter |
| CN115377633B (en) * | 2022-08-09 | 2023-12-08 | 中国电子科技集团公司第四十三研究所 | High-pass filter with out-of-band rapid attenuation and ultra-wideband performance |
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| CN1701509A (en) * | 2003-08-25 | 2005-11-23 | 松下电器产业株式会社 | surface acoustic wave filter |
| CN200956397Y (en) * | 2006-08-21 | 2007-10-03 | 浙江正原电气股份有限公司 | Multi-layer LC filter |
| CN101421918A (en) * | 2006-04-14 | 2009-04-29 | 株式会社村田制作所 | Layered band pass filter |
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| CN103762407A (en) * | 2014-01-10 | 2014-04-30 | 嘉兴佳利电子股份有限公司 | Miniaturization multi-layer ceramic bridge |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5219858B2 (en) * | 2009-01-29 | 2013-06-26 | 京セラ株式会社 | BANDPASS FILTER, RADIO COMMUNICATION MODULE AND COMMUNICATION DEVICE DEVICE USING THE SAME |
| JP5489745B2 (en) * | 2010-01-25 | 2014-05-14 | 京セラ株式会社 | Filter device |
| US9653212B2 (en) * | 2013-08-13 | 2017-05-16 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board for mounting thereof |
| KR102029499B1 (en) * | 2014-11-14 | 2019-10-07 | 삼성전기주식회사 | Composite electronic component and board for mounting the same |
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- 2017-09-06 CN CN201710794764.6A patent/CN107508018B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701509A (en) * | 2003-08-25 | 2005-11-23 | 松下电器产业株式会社 | surface acoustic wave filter |
| CN101421918A (en) * | 2006-04-14 | 2009-04-29 | 株式会社村田制作所 | Layered band pass filter |
| CN200956397Y (en) * | 2006-08-21 | 2007-10-03 | 浙江正原电气股份有限公司 | Multi-layer LC filter |
| CN102132490A (en) * | 2008-11-11 | 2011-07-20 | 株式会社村田制作所 | Laminated balance filter |
| CN102291100A (en) * | 2010-06-16 | 2011-12-21 | 三星电机株式会社 | Multilayer filter |
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| CN207732059U (en) * | 2017-09-06 | 2018-08-14 | 嘉兴佳利电子有限公司 | A kind of multilayer ultra-wide band filter |
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| CN107508018A (en) | 2017-12-22 |
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