CN107470255A - A kind of full-automatic IC Wafer Cleaning equipment - Google Patents
A kind of full-automatic IC Wafer Cleaning equipment Download PDFInfo
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- CN107470255A CN107470255A CN201710743955.XA CN201710743955A CN107470255A CN 107470255 A CN107470255 A CN 107470255A CN 201710743955 A CN201710743955 A CN 201710743955A CN 107470255 A CN107470255 A CN 107470255A
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- Prior art keywords
- full
- automatic
- cleaning equipment
- wafer cleaning
- cleaning
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/007—Heating the liquid
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a kind of full-automatic IC Wafer Cleaning equipment, its drip irrigation device is：Including body, the body is provided with cleaning area, and the cleaning area includes acid storage, and the side wall of the acid storage overthe openings is provided with the fan-shaped exhaust outlet towards opening exhausting, and shown fan-shaped exhaust outlet is connected with exhausting system.It is an advantage of the invention that the influence of acid solution or alkali lye volatilization to working environment is reduced in cleaning process.
Description
Technical field
The present invention relates to Wafer Cleaning field, and in particular to a kind of full-automatic IC Wafer Cleaning equipment.
Background technology
Silicon chip must be through strict cleaning in semiconductor devices production, it is therefore intended that the pollution impurity of silicon chip surface is removed, these
Impurity some is with state of atom or ionic condition, and some is in the form of a film or particle form is present in silicon chip surface.Need to silicon
Piece surface carries out Chemical cleaning and physical cleaning, and Chemical cleaning mainly utilizes acid solution, alkali lye, the surface of hydro-peening silicon chip.
Chinese patent if publication No. is CN104226626A discloses a kind of wiper mechanism of silicon chip, includes the first acid
Groove, alkali groove, fast emissions groove, the first flusher, draining valve, overflow launder, the second flusher and pump installation.Fast emissions groove is positioned at the
Between one acid tank and alkali groove.First flusher is located in fast emissions groove.Fast emissions groove is applicable to accept to be entered using the first flusher
The first cleaning fluid after row cleaning.Draining valve connects with fast emissions groove.First cleaning fluid is discharged through draining valve.Overflow launder is positioned at fast row
Between groove and alkali groove.Second flusher is located in overflow launder.Overflow launder is applicable to be carried out clearly with accepting using the second flusher
The second cleaning fluid after washing.Pump installation is applicable and used so that the second cleaning fluid is recycled into fast emissions groove for the first flusher.
The first acid tank, the alkali groove of the wiper mechanism are open type structure, and acid solution, alkali lye can be to Back stroke in cleaning process
Hair, influences working environment.
The content of the invention
It is an object of the invention to provide a kind of full-automatic IC Wafer Cleaning equipment, its advantage is that acid is reduced in cleaning process
The influence that liquid or alkali lye volatilize to working environment.
The present invention above-mentioned technical purpose technical scheme is that：A kind of full-automatic IC Wafer Cleaning
Equipment, including body, the body are provided with cleaning area, and the cleaning area includes acid storage, the acid storage overthe openings
Side wall is provided with the fan-shaped exhaust outlet towards opening exhausting, and shown fan-shaped exhaust outlet is connected with exhausting system.
Pass through above-mentioned technical proposal, fan-shaped exhaust outlet carry out exhausting, the acid that will can be volatilized upwards towards overthe openings
Gas is taken away, and then reduces corrosion of the acid gas to external working environment.
The present invention is further arranged to：The fan-shaped exhaust outlet is the double-layer circular harden structure being mutually rotatablely connected, circular
Some sector opens are respectively equipped with plate.
Pass through above-mentioned technical proposal, by the relative rotation of circular slab, the size of sector open is adjusted, and then adjusted fan-shaped
The area of exhaust outlet opening, control exhausting amount number.
The present invention is further arranged to：The transparent PVC protective cover for isolating cleaning area is provided with above the cleaning area.
Pass through above-mentioned technical proposal, transparent PVC protective cover are isolated to cleaning area, further stop that the acid gas to volatilize upwards is dirty
Contaminate working environment；Transparent PVC protective cover is also convenient for observing the working condition of cleaning area simultaneously.
The present invention is further arranged to：The cleaning area includes overflow launder, and overflow launder includes spill cavity and the lower floor on upper strata
Water filling arrange chamber soon, spill cavity and water filling are separated between arranging chamber soon by dividing plate, and the water injection hole sprayed water upwards is placed with dividing plate,
The bottom that chamber is arranged in water filling soon is communicated with high pressure water injection pipe and the second drainpipe, and fast-discharge valve is provided with the second drainpipe.
Pass through above-mentioned technical proposal, the water purification for soaking and washing are rapidly injected water filling from high pressure water injection pipe and arrange chamber soon, and
Spill cavity is filled by water injection hole upwards at a high speed, soaking and washing is carried out to the piece basket in spill cavity, makes the trickle miscellaneous of silicon chip surface
Matter swims in the surface of overflow launder, as current are from the outflow of spill cavity surrounding after filling, is discharged.
The present invention is further arranged to：The sidewall edge of the spill cavity is provided with a circle overfall.
Pass through above-mentioned technical proposal, overfall can play a part of drainage to the current that overflow goes out, make in spill cavity
Water to surrounding, more smoothly go out by overflow.
The present invention is further arranged to：The cleaning area also includes fast emissions groove, is provided with cleaning case in fast emissions groove, is additionally provided with court
The sparge pipe of hydrojet into cleaning case.
Pass through above-mentioned technical proposal, cleaned by sparge pipe towards the piece basket in cleaning case, into tentatively washing
The acid solution of silicon chip surface.
The present invention is further arranged to：The cleaning area includes upper material position, and the upper material position, which is provided with, to be used to deposit silicon chip
Piece basket and the positioning component positioned to piece basket.
Pass through above-mentioned technical proposal, piece basket is positioned, so that the gripping to piece basket is more accurate, reduces work and miss
Difference.
The present invention is further arranged to：Described basket is square, and the positioning component includes being arranged on the L-type of piece basket surrounding
Frame.
Pass through above-mentioned technical proposal, the L-type side frame of surrounding carry out spacing, anti-limited step basket shift position to the surrounding of piece basket.
The present invention is further arranged to：The upper material position is additionally provided with the photoelectricity whether sensing chip basket is placed in positioning component
Inductive component, the optoelectronic induction component include the optoelectronic switch and reflector set along same straight line, and positioning component is located at light
Between electric switch and reflector.
Pass through above-mentioned technical proposal, optoelectronic switch send ray to reflector, when piece basket is put into positioning component, light
Ray between electric switch and reflector is obstructed by piece basket, so as to trigger signal, shows to be placed with positioning component to be cleaned
Silicon chip, start cleaning procedure.
The present invention is further arranged to：The positioning component is provided with the cleaning case.
Pass through above-mentioned technical proposal, the positioning component that is positioned to piece basket is set in cleaning case, can be to piece basket
During water spray, piece basket is set to place ground more stable.
In summary, the invention has the advantages that：
1st, the acid gas volatilized in acid storage is evacuated by fan-shaped exhaust outlet, reducing acid gas and volatilizing upwards influences building ring
The possibility in border；
2nd, transparent PVC protective cover can obstruct to the acid gas volatilized in acid storage, reduce acid gas to extraneous building ring
The influence in border；
3rd, piece basket is positioned, so that the gripping to piece basket is more accurate, reduces operating error.
Brief description of the drawings
Fig. 1 is the structural representation of embodiment 1；
Fig. 2 is the schematic diagram that cleaning plot structure is embodied in embodiment 1；
Fig. 3 is the enlarged drawing at A in Fig. 2；
Fig. 4 is the schematic diagram that robot device structure is embodied in embodiment 1；
Fig. 5 is the schematic diagram that storage tank structure is embodied in embodiment 1；
Fig. 6 is the schematic diagram that open-and-close mechanism structure is embodied in embodiment 1；
Fig. 7 is the schematic diagram that fan-shaped outlet structure is embodied in embodiment 1；
Fig. 8 is the schematic diagram that fast emissions groove structure is embodied in embodiment 1；
Fig. 9 is the schematic diagram that fast emissions groove internal structure is embodied in embodiment 1；
Figure 10 is the schematic diagram that overflow groove structure is embodied in embodiment 1；
Figure 11 is the schematic diagram that overflow launder internal structure is embodied in embodiment 1；
Figure 12 is the schematic diagram that open-and-close mechanism structure is embodied in embodiment 2.
In figure, 1, body；11st, cleaning area；111st, transparent PVC protective cover；112nd, maintenance door；12nd, compartment；13rd, vertical plate；
131st, groove；14th, original liquid box；15th, storage tank；16th, infrared heating pipe；17th, level sensor；2nd, upper material position；21st, positioning group
Part；22nd, frame；23rd, optoelectronic induction component；231st, optoelectronic switch；232nd, reflector；3rd, piece basket；31st, flange；32nd, neck；4、
First acid storage；41st, liquid level sensor；42nd, temperature sensor；43rd, open-and-close mechanism；431st, drive component；4311st, cylinder；
4312nd, connector；4313rd, rotary shaft；44th, fix bar；45th, fan-shaped exhaust outlet；451st, sector open；46th, cover plate；5th, the second acid
Liquid bath；6th, fast emissions groove；61st, cleaning case；62nd, sparge pipe；621st, nozzle；63rd, the first drainpipe；631st, fast-discharge valve；7th, overflow launder；
71st, spill cavity；711st, overfall；72nd, dividing plate；721st, water injection hole；73rd, chamber is arranged in water filling soon；731st, high pressure water injection pipe；732nd, second
Drainpipe；74th, floss hole；8th, robot device；81st, gripper assembly；811st, pickup folder；812nd, rotating shaft；82nd, motor；9th, image
Head；91st, alarm.
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
Embodiment 1：A kind of full-automatic IC Wafer Cleaning equipment, as depicted in figs. 1 and 2, including body 1, body 1 are provided with
Cleaning area 11, cleaning area 11 is provided with multiple groove positions, successively including upper material position 2, the first acid storage 4, the second acid storage 5, fast emissions groove 6
With overflow launder 7.Overflow launder 7 is used as lower material position.Silicon chip to be cleaned is stored in piece basket 3 first, then passes through robot device 8
Piece basket 3 is gripped, is moved in the first acid storage 4 or the second acid storage 5 and carries out acid solution cleaning, be then moved to successively fast
Physical cleaning is carried out in emissions groove 6, overflow launder 7, blanking is finally carried out in overflow launder 7.
As shown in Figures 2 and 3, piece basket 3 is square box structure and is provided with cavity, and its cavity inner wall is symmetrically arranged with neck
32 are fixed, it is necessary to which silicon chip both ends are caught in neck 32 when cleaning.
Upper material position 2 is located at one end of body 1, including two groups of positioning components 21 being arranged side by side, and positioning component 21 includes four
Individual L-type side frame 22, when piece basket 3 is put into frame 22, frame 22 3 four jiaos of piece basket contradict it is spacing, so that it is determined that piece basket 3 is put
The position put.
Upper material position 2 is additionally provided with optoelectronic induction component 23, including optoelectronic switch 231 and reflector 232, optoelectronic induction component 23
For sensing to piece basket 3, when piece basket 3 is put into positioning component 21, hindered between optoelectronic switch 231 and reflector 232
Every, signal is sent, shows to be placed with silicon chip to be cleaned in positioning component 21, startup cleaning procedure.
As shown in Figure 1 and Figure 4, robot device 8 is arranged on body 1, including a pair of gripper assemblies 81, by cross
Slide unit is driven, and can be moved, can also be lifted in vertical direction along the parallel direction in cleaning area 11.Gripper assembly
81 include the rotating shaft 812 that motor 82 drives and the pickup folder 811 being fixed in rotating shaft 812, and pickup folder 811 is square framework knot
Structure, drive pickup folder 811 to rotate by rotating shaft 812, pickup folder 811 is clamped the flange 31 of evagination on the edge of piece basket 3, band moving plate
Basket 3 moves.
As shown in Fig. 2 it is fixed with vertical plate 13, the correspondence of vertical plate 13 close to the position of robot device 8 in cleaning area 11
The position of each groove is provided with groove 131, for gripper assembly 81 rotating shaft 812 in groove 131 raising and lowering.
As shown in figure 5, the upper end of body 1 is provided with original liquid box 14, it is connected to by pipeline in the first acid storage 4, and pass through confession
Liquid pump is driven.As shown in fig. 6, being provided with liquid level sensor 41, temperature sensor 42 in the first acid storage 4, monitor respectively
Liquid level and temperature in groove.
Outwards volatilized to reduce acid solution, robot device 8 and miscellaneous part are caused to corrode, in the first acid storage 4
It is interior to be provided with symmetrically arranged a pair of open-and-close mechanisms 43.The drive component that open-and-close mechanism 43 includes cover plate 46 and drives cover plate 46 to rotate
431, the size of cover plate 46 is the half of the openings of sizes of the first acid storage 4, and drive component 431 includes cylinder 4311, connector
4312 and rotary shaft 4313.Cylinder 4311 is hinged in the compartment 12 of the front end of body 1 and set upward, and cylinder 4311 is another
End is be hinged with connector 4312, and the one end of connector 4312 away from cylinder 4311 is fixed with rotary shaft 4313, and rotary shaft 4313 is set
Put inside the first acid storage 4, and formed and be rotatablely connected with the inwall of the first acid storage 4.Cover plate 46 passes through a pair of fix bars 44
It is fixed in rotary shaft 4313, when cylinder 4311 shrinks, pulls downward on connector 4312, drive rotary shaft 4313 to rotate, cover plate
46 are rotated down therewith, keep level, and a pair of cover plates 46 are just inconsistent, and the first acid storage 4 opening is blocked, hindered
Only acid solution is outwards volatilized.
The side wall of the overthe openings of first acid storage 4 is provided with fan-shaped exhaust outlet 45, and fan-shaped exhaust outlet 45 is communicated with exhausting system
System, by exhausting system to carrying out exhausting in fast emissions groove 6, further the residual acid gas evaporated is purged.Such as Fig. 7 institutes
Show, fan-shaped exhaust outlet 45 is the double-layer circular harden structure being mutually rotatablely connected, and some sector opens are respectively equipped with circular slab
451, the size of sector open 451 can be adjusted by rotating circular slab, and then adjust exhausting amount.
Second acid storage 5 is identical with the structure of the first acid storage 4, also is provided with open-and-close mechanism 43 and fan-shaped exhaust outlet 45.
As shown in Figure 8 and Figure 9, cleaning case 61 is fixed with fast emissions groove 6, the bottom of cleaning case 61 is again provided with a pair of positioning
Component 21, for placing piece basket 3.A pair of the sparge pipes 62 sprayed water towards piece basket 3 are additionally provided with, sparge pipe 62 is symmetricly set on fast row
The inwall upper end of groove 6, row's nozzle 621 is which is provided with, sparge pipe 62 connects with the storage tank 15 on the top of body 1, passes through water pump
Driving, hydrojet is carried out, the piece basket 3 in groove is cleaned.The bottom of cleaning case 61 is communicated with the first drainpipe 63, the first drainpipe
63 are controlled by fast-discharge valve 631, and the sewage after cleaning quickly is discharged by the first drainpipe 63.
As shown in figure 5, being provided with the infrared heating pipe 16 for heating in storage tank 15, and it is provided with level sensor
17, the liquid level change of detection storage tank 15.
As shown in Figure 10 and Figure 11, the silicon chip surface after being cleaned in fast emissions groove 6 may be attached with the fine impurity of residual,
The immersion in overflow launder 7 is needed to remove.Overflow launder 7 is double-decker, including the water filling of the spill cavity 71 and lower floor on upper strata is arranged soon
Chamber 73, separated by dividing plate 72 between levels, water injection hole 721 is uniformly placed with dividing plate 72, the bottom of chamber 73 is arranged in water filling soon
The drainpipe 732 of high pressure water injection pipe 731 and second is communicated with, the second drainpipe 732 is again provided with fast-discharge valve 631.Spill cavity 71
Sidewall edge be provided with one circle overfall 711, for soaking and washing water purification from using water pump by high pressure water injection pipe 731 under
Square water filling is arranged chamber 73 and is rapidly injected upwards soon, and now fast-discharge valve 631 is closed, and water purification vertically upward, is quickly noted by water injection hole 721
Full spill cavity 71, soaking and washing is carried out to the piece basket 3 in spill cavity 71, the fine impurity of silicon chip surface is swum in overflow launder 7
Surface, as current flow out from overfall 711 after filling, be emitted into by floss hole 74 outside cleaning equipment.
As shown in figure 1, being provided with transparent PVC protective cover 111 in cleaning area 11, further obstruct acid gas and outwards volatilize, simultaneously
Robot device 8 is protected.Groove position in addition to upper material position 2, corresponding inspection is provided with all on transparent PVC protective cover 111
Door 112 is repaiied, transparent PVC protective cover 111 can be passed through and observe the working condition of cleaning area 11, and open maintenance door when needed
112, corresponding groove position is overhauled.
The front end of body 1 is provided with the camera 9 that detection cleaning area 11 works, can be in favor of remotely being supervised to cleaning situation
Control.Alarm 91 is provided with simultaneously, once device fails, alarm 91 can be alarmed in time.
The course of work：First by silicon chip proper alignment to be cleaned, it is fixed in the first pack basket 3, two piece baskets 3 are same
When be placed on material position 2, now optoelectronic induction component 23 detects that piece basket 3 is put into, and sends signal, driving manipulator device 8 is right
Piece basket 3 is gripped simultaneously, is first placed into the first acid storage 4, and then robot device 8 unclamps piece basket 3 and risen, and startup is opened
Mechanism 43 is closed, the first acid storage 4 is open closing.Acid liquid corrosion is carried out, starts exhausting system in the process, is arranged by sector
Further acid gas is taken away to carrying out exhausting in the first acid storage 4 in air port 45.The process of immersion corrosion in the first acid storage 4
In, the second pack of manipulator clamping basket 3, and place it in the second acid storage 5 and soaked, so as to utilize the time of immersion
Difference, increase efficiency.In the first acid storage 4 or the second acid storage 5 after immersion corrosion, piece basket 3 is therefrom gripped and come out, placed
In fast emissions groove 6, it is rinsed using water purification, is finally placed in overflow launder 7, is soaked, and by a small amount of of surfactant suspension
Impurity is drained by overfall 711, using noting soon soon arranging, is repeatedly soaked and is cleaned, and makes the more efficient of cleaning, effect more
It is good.
Embodiment 2：A kind of full-automatic IC Wafer Cleaning equipment, difference from Example 1 be, as shown in figure 12, only
Provided with an open-and-close mechanism 43, the area of cover plate 46 is identical with the openings of sizes of the first acid storage 4, only by one piece of cover plate 46 to first
The acid storage 5 of acid storage 4/ second opening is blocked.
This specific embodiment is only explanation of the invention, and it is not limitation of the present invention, people in the art
Member can make the modification of no creative contribution to the present embodiment as needed after this specification is read, but as long as at this
All protected in the right of invention by Patent Law.
Claims (10)
1. a kind of full-automatic IC Wafer Cleaning equipment, including body（1）, the body（1）It is provided with cleaning area（11）, it is described clear
Wash area（11）Including acid storage, it is characterized in that：The side wall of the acid storage overthe openings is provided with the sector towards opening exhausting
Exhaust outlet（45）, shown fan-shaped exhaust outlet（45）It is connected with exhausting system.
2. a kind of full-automatic IC Wafer Cleaning equipment according to claim 1, it is characterized in that：The fan-shaped exhaust outlet（45）
For the double-layer circular harden structure being mutually rotatablely connected, some sector opens are respectively equipped with circular slab（451）.
3. a kind of full-automatic IC Wafer Cleaning equipment according to claim 1, it is characterized in that：The cleaning area（11）Top
It is provided with for isolating cleaning area（11）Transparent PVC protective cover（111）.
4. a kind of full-automatic IC Wafer Cleaning equipment according to claim 1, it is characterized in that：The cleaning area（11）Including
Overflow launder（7）, overflow launder（7）Spill cavity including upper strata（71）Chamber is arranged in water filling with lower floor soon（73）, spill cavity（71）With note
Water arranges chamber soon（73）Between pass through dividing plate（72）Separate, dividing plate（72）On be placed with the water injection hole sprayed water upwards（721）, water filling is fast
Arrange chamber（73）Bottom be communicated with high pressure water injection pipe（731）With the second drainpipe（732）, the second drainpipe（732）On be provided with
Fast-discharge valve（631）.
5. a kind of full-automatic IC Wafer Cleaning equipment according to claim 4, it is characterized in that：The spill cavity（71）Side
Wall edge is provided with a circle overfall（711）.
6. according to any described a kind of full-automatic IC Wafer Cleaning equipment in claim 1 to 5, it is characterized in that：The cleaning
Area（11）Also include fast emissions groove（6）, fast emissions groove（6）It is interior to be provided with cleaning case（61）, it is additionally provided with towards cleaning case（61）Interior hydrojet
Sparge pipe（62）.
7. according to any described a kind of full-automatic IC Wafer Cleaning equipment in claim 1 to 5, it is characterized in that：The cleaning
Area（11）Including upper material position（2）, the upper material position（2）Provided with the piece basket for depositing silicon chip（3）With to piece basket（3）Positioned
Positioning component（21）.
8. a kind of full-automatic IC Wafer Cleaning equipment according to claim 7, it is characterized in that：Described basket（3）To be square,
The positioning component（21）Including being arranged on piece basket（3）The L-type side frame of surrounding（22）.
9. a kind of full-automatic IC Wafer Cleaning equipment according to claim 8, it is characterized in that：The upper material position（2）Also set
There is sensing chip basket（3）Whether positioning component is placed on（21）Interior optoelectronic induction component（23）, the optoelectronic induction component（23）
Including the optoelectronic switch set along same straight line（231）And reflector（232）, positioning component（21）Positioned at optoelectronic switch（231）
With reflector（232）Between.
10. a kind of full-automatic IC Wafer Cleaning equipment according to claim 6, it is characterized in that：The cleaning case（61）It is interior
Provided with the positioning component（21）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710743955.XA CN107470255A (en) | 2017-08-25 | 2017-08-25 | A kind of full-automatic IC Wafer Cleaning equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710743955.XA CN107470255A (en) | 2017-08-25 | 2017-08-25 | A kind of full-automatic IC Wafer Cleaning equipment |
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| CN107470255A true CN107470255A (en) | 2017-12-15 |
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| CN201710743955.XA Pending CN107470255A (en) | 2017-08-25 | 2017-08-25 | A kind of full-automatic IC Wafer Cleaning equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108480277A (en) * | 2018-04-10 | 2018-09-04 | 绍兴文理学院 | A kind of Wafer Cleaning drying unit |
| CN110600409A (en) * | 2019-10-08 | 2019-12-20 | 安徽宏实自动化装备有限公司 | Tank body overall structure for wafer cleaning |
| CN118002546A (en) * | 2024-04-08 | 2024-05-10 | 江苏英思特半导体科技有限公司 | Automatic cleaning device for silicon wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108480277A (en) * | 2018-04-10 | 2018-09-04 | 绍兴文理学院 | A kind of Wafer Cleaning drying unit |
| CN110600409A (en) * | 2019-10-08 | 2019-12-20 | 安徽宏实自动化装备有限公司 | Tank body overall structure for wafer cleaning |
| CN110600409B (en) * | 2019-10-08 | 2024-08-20 | 四川仁寿旌凯科技有限公司 | Be used for abluent cell body overall structure of wafer |
| CN118002546A (en) * | 2024-04-08 | 2024-05-10 | 江苏英思特半导体科技有限公司 | Automatic cleaning device for silicon wafer |
| CN118002546B (en) * | 2024-04-08 | 2024-06-04 | 江苏英思特半导体科技有限公司 | Automatic cleaning device for silicon wafer |
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Application publication date: 20171215 |