CN107438855B - Fingerprint chip packaging module, fingerprint identification module and packaging method - Google Patents

Abstract

the embodiment of the application provides a fingerprint chip packaging module, a fingerprint identification module and a packaging method, and the fingerprint identification chip packaging module comprises: the fingerprint identification chip and the N piezoresistive sensors are arranged on the substrate; the first surface of the fingerprint identification chip is provided with a bonding pad, and the first surface is the upper surface or the lower surface of the fingerprint identification chip; part or all of the N piezoresistive sensors are attached to the first surface of the fingerprint identification chip; each of the N piezoresistive sensors is connected to the pad. According to the technical scheme, the pressure of the user acting on the fingerprint identification chip can be acquired by using the piezoresistive sensor. In addition, the number of times the piezoresistive sensor is calibrated and noise may be reduced. Furthermore, the sensitivity of the piezoresistive sensor used can be increased, so that more levels of pressure can be identified.

Description

Fingerprint chip packaging module, fingerprint identification module and packaging method

technical field

The embodiment of the present application relates to the field of chip technology, and more specifically, relates to a fingerprint chip packaging module, a fingerprint recognition module and a packaging method.

Background technique

More and more electronic devices use fingerprint recognition technology to verify whether the user is a legitimate user. Fingerprint recognition is realized through the fingerprint recognition module. The fingerprint identification module can be connected to the mainboard through a flexible printed circuit (FPC), and send output signals to other components on the mainboard through the FPC. The current fingerprint identification module can only realize the function of identifying fingerprints. If the fingerprint identification module can provide more functions, the user experience will be greatly improved.

Contents of the invention

The embodiment of the present application provides a fingerprint chip packaging module, a fingerprint recognition module and a packaging method, which can be used to acquire the pressure that a user acts on the fingerprint recognition chip.

In the first aspect, the embodiment of the present application provides a fingerprint recognition chip packaging module, the fingerprint recognition chip packaging module includes: a fingerprint recognition chip and N piezoresistive sensors, where N is a positive integer greater than or equal to 1; The first surface of the fingerprint identification chip has a pad, and the first surface is the upper surface or the lower surface of the fingerprint identification chip; part or all of the N piezoresistive sensors are attached to the first surface of the fingerprint identification chip; Each piezoresistive sensor in the N piezoresistive sensors is connected to the pad.

With reference to the first aspect, in a first possible implementation of the first aspect, the N piezoresistive sensors are divided into two layers and attached to the first surface of the fingerprint recognition chip, wherein the first of the two layers A layer of piezoresistive sensors and a second layer of piezoresistive sensors each include at least one piezoresistive sensor; the fingerprint recognition chip package module also includes insulating layer between.

With reference to the first possible implementation manner of the first aspect, in a second possible implementation manner of the first aspect, the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form a bridge.

In combination with the first aspect or any of the above possible implementations of the first aspect, in the third possible implementation of the first aspect, if the first surface is the upper surface of the fingerprint recognition chip, the first surface There is a fingerprint identification area, and part or all of the N piezoresistive sensors are attached to the area outside the fingerprint identification area.

In the second aspect, the embodiment of the present application provides a fingerprint recognition module, which includes: a fingerprint recognition chip, N piezoresistive sensors, a packaging substrate and a plastic packaging material, where N is a positive integer greater than or equal to 1 , the fingerprint identification chip is bonded on the upper surface of the packaging substrate; the plastic packaging material covers the packaging substrate and the fingerprint identification chip, and the lower surface of the packaging substrate is not covered by the plastic packaging material; the N piezoresistive sensors are located on the Above or below the fingerprint identification chip.

With reference to the second aspect, in a first possible implementation manner of the second aspect, the N piezoresistive sensors are located inside the package substrate; the package substrate includes pads, and each of the N piezoresistive sensors A piezoresistive sensor is connected to this pad.

With reference to the first possible implementation manner of the second aspect, in a second possible implementation manner of the second aspect, the packaging substrate includes a support layer, and the N piezoresistive sensors are located under the support layer.

With reference to the second possible implementation of the second aspect, in a third possible implementation of the second aspect, the N piezoresistive sensors are divided into two layers and attached to the lower surface of the support layer, wherein, The piezoresistive sensor of the first layer and the piezoresistive sensor of the second layer in the two layers both include at least one piezoresistive sensor; Insulation layer between piezoresistive sensors.

With reference to the second aspect, in a fourth possible implementation manner of the second aspect, each of the N piezoresistive sensors is connected to the packaging substrate; some of the N piezoresistive sensors Or all of them are pasted on the upper surface of the molding material.

With reference to the fourth possible implementation of the second aspect, in the fifth possible implementation of the second aspect, the upper surface of the molding material has a fingerprint recognition area, and some or all of the N piezoresistive sensors are attached to combined in the area outside the fingerprint recognition area.

In combination with the fourth possible implementation of the second aspect or the fifth possible implementation of the second aspect, in the sixth possible implementation of the second aspect, the N piezoresistive sensors are divided into two layers Attached to the upper surface of the molding material, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors in the two layers both include at least one piezoresistive sensor; the fingerprint identification module also includes a An insulating layer between the first layer of piezoresistive sensors and the second layer of piezoresistive sensors.

With reference to the third possible implementation of the second aspect or the sixth possible implementation of the second aspect, in a seventh possible implementation of the second aspect, the first layer of piezoresistive sensors and the first layer of piezoresistive sensors Two layers of piezoresistive sensors form a bridge.

In the third aspect, the embodiment of the present application provides a wafer-level fingerprint identification chip packaging method, the method includes: arranging N piezoresistive sensors on the first surface of the fingerprint identification chip, wherein the first surface is the fingerprint identification chip On the upper surface or the lower surface of the chip, N is a positive integer greater than or equal to 1; the N piezoresistive sensors are connected to the pads of the fingerprint chip through connecting lines.

With reference to the third aspect, in the first possible implementation of the third aspect, arranging N piezoresistive sensors on the first surface of the fingerprint recognition chip includes: arranging the first A layered piezoresistive sensor; an insulating layer is coated on the lower surface of the first layer of piezoresistive sensor; a second layer of piezoresistive sensor is arranged on the lower surface of the insulating layer, wherein the first layer of piezoresistive sensor and The second layer of piezoresistive sensors each includes at least one piezoresistive sensor.

With reference to the third aspect, in a second possible implementation of the third aspect, arranging N piezoresistive sensors on the first surface of the fingerprint identification chip includes: arranging the first A layered piezoresistive sensor; an insulating layer is coated on the upper surface of the first layer of piezoresistive sensor; a second layer of piezoresistive sensor is arranged on the upper surface of the insulating layer, wherein the first layer of piezoresistive sensor and The second layer of piezoresistive sensors each includes at least one piezoresistive sensor.

With reference to the first possible implementation of the third aspect or the second possible implementation of the third aspect, in a third possible implementation of the third aspect, the first layer of piezoresistive sensors and the first layer of piezoresistive sensors Two layers of piezoresistive sensors form a bridge.

In a fourth aspect, the embodiment of the present application provides a method for packaging a fingerprint identification module, the method comprising: attaching the fingerprint identification chip to the upper surface of the package substrate through an adhesive layer; covering the fingerprint identification chip and the package with a plastic sealing material A substrate, wherein the lower surface of the packaging substrate is not covered by the plastic encapsulation material; N piezoresistive sensors are arranged above or below the fingerprint identification chip, where N is a positive integer greater than or equal to 1.

With reference to the fourth aspect, in a first possible implementation of the fourth aspect, arranging the N piezoresistive sensors above or below the fingerprint identification chip includes: arranging the N piezoresistive sensors It is arranged inside the packaging substrate; the N piezoresistive sensors are connected to the pads of the packaging substrate through connecting lines.

With reference to the first possible implementation of the fourth aspect, in the second possible implementation of the fourth aspect, arranging N piezoresistive sensors inside the packaging substrate includes: The piezoresistive sensor is arranged under the supporting layer of the packaging substrate.

With reference to the second possible implementation of the fourth aspect, in a third possible implementation of the fourth aspect, arranging the N piezoresistive sensors under the support layer of the packaging substrate includes: A first layer of piezoresistive sensors is arranged on the lower surface of the support layer of the packaging substrate; an insulating layer is coated on the lower surface of the first layer of piezoresistive sensors; a second layer of piezoresistive sensors is arranged on the lower surface of the insulating layer sensor, wherein the first layer of piezoresistive sensor and the second layer of piezoresistive sensor each comprise at least one piezoresistive sensor.

With reference to the fourth aspect, in a fourth possible implementation of the fourth aspect, arranging the N piezoresistive sensors above or below the fingerprint identification chip includes: arranging the N piezoresistive sensors distributed on the upper surface of the molding material, wherein the N piezoresistive sensors are connected to the packaging substrate through connection channels.

With reference to the fourth possible implementation of the fourth aspect, in the fifth possible implementation of the fourth aspect, arranging N piezoresistive sensors on the upper surface of the plastic packaging material includes: A first layer of piezoresistive sensors is arranged on the upper surface of the material; an insulating layer is coated on the upper surface of the first layer of piezoresistive sensors; a second layer of piezoresistive sensors is arranged on the upper surface of the insulating layer, wherein the The first layer of piezoresistive sensors and the second layer of piezoresistive sensors each include at least one piezoresistive sensor.

With reference to the third possible implementation of the fourth aspect or the fifth possible implementation of the fourth aspect, in a sixth possible implementation of the fourth aspect, the first layer of piezoresistive sensors and the first layer of piezoresistive sensors Two layers of piezoresistive sensors form a bridge.

The above technical solution can use the piezoresistive sensor to acquire the pressure that the user acts on the fingerprint recognition chip. The terminal device can use the obtained pressure to perform corresponding operations. In addition, the piezoresistive sensor receives less pressure from temperature changes in the material attached to the piezoresistive sensor. In this way, the number of calibration piezoresistive sensors and the noise can be reduced. In addition, the sensitivity of the piezoresistive sensors used can be increased, so that more pressure levels can be recognized.

Description of drawings

Figure 1 is a schematic block diagram of the structure of a common fingerprint recognition module at present.

Fig. 2 is a schematic block diagram of the structure of a fingerprint chip packaging module provided according to an embodiment of the present application.

Fig. 3 is a schematic block diagram of another fingerprint chip packaging module provided according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of another fingerprint identification chip package module provided according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of another fingerprint identification chip packaging module provided according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a fingerprint recognition module provided according to an embodiment of the present application.

FIG. 7 is a schematic structural diagram of another fingerprint identification module provided according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of a fingerprint recognition module provided according to an embodiment of the present application.

FIG. 9 is a schematic structural diagram of another fingerprint identification module provided according to an embodiment of the present application.

Fig. 10 is a schematic bottom view of a fingerprint identification chip packaging module.

Fig. 11 is a schematic flowchart of a wafer-level fingerprint identification chip packaging method provided according to an embodiment of the present application.

Fig. 12 is a schematic flowchart of a method for packaging a fingerprint recognition module according to an embodiment of the present application.

Fig. 13 is a schematic flowchart of a method for packaging a fingerprint recognition module according to an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

In the description of the embodiments of the present application, the terms "upper", "lower", "upper surface", "lower surface", etc. indicate the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings.

The fingerprint recognition chip referred to in the embodiment of the present application may be a capacitive fingerprint recognition chip, a photoelectric fingerprint recognition chip, or other types of fingerprint recognition chips, which is not limited in the embodiment of the present application.

Figure 1 is a schematic block diagram of the structure of a common fingerprint recognition module at present. As shown in FIG. 1 , the lower surface of the fingerprint identification chip 101 in the fingerprint identification module 100 is adhered to the upper surface of the packaging substrate 104 through the adhesive layer 102 . The plastic packaging material 103 covers the fingerprint recognition chip 101 , the adhesive layer 102 and the packaging substrate 104 , and the lower surface of the packaging substrate 104 is not covered by the plastic packaging material 103 .

The fingerprint identification module 100 is usually located above a flexible printed circuit (FPC). Placing the piezoresistive sensor under the FPC can obtain the pressure when the user presses the fingerprint identification module. However, the production of FPC materials is greatly affected by temperature. Specifically, the FPC material may be deformed due to the influence of temperature. In this way, even if the user's finger does not press the fingerprint recognition module, the FPC will exert pressure on the piezoresistive sensor, which may cause problems such as misoperation.

Fig. 2 is a schematic block diagram of the structure of a fingerprint chip packaging module provided according to an embodiment of the present application. As shown in FIG. 2 , the fingerprint recognition chip packaging module 200 includes: a fingerprint recognition chip 201 and two piezoresistive sensors 202 .

As shown in FIG. 2 , two piezoresistive sensors 202 are attached to the lower surface of the fingerprint recognition chip 201 .

The lower surface of the fingerprint identification chip 201 may include pads (not shown in the figure). Both piezoresistive sensors 202 are connected to this pad.

In addition, the fingerprint identification chip packaging module shown in FIG. 2 may further include an insulating layer 203 . The insulating layer 203 is located on the lower surface of the fingerprint identification chip and exposes the pads on the lower surface of the fingerprint identification chip.

Fig. 3 is a schematic block diagram of another fingerprint chip packaging module provided according to an embodiment of the present application. As shown in FIG. 3 , the fingerprint recognition chip packaging module 300 includes a fingerprint recognition chip 301 and two piezoresistive sensors 302 .

As shown in FIG. 3 , two piezoresistive sensors 302 are bonded on the upper surface of the fingerprint recognition chip 301 .

The upper surface of the fingerprint identification chip 301 may include pads (not shown in the figure). Both piezoresistive sensors 302 are connected to the pads.

Further, the fingerprint identification chip 301 includes a fingerprint identification area. The piezoresistive sensor 302 included in the fingerprint identification chip packaging module shown in FIG. 3 can be attached to an area other than the fingerprint identification area.

In addition, the fingerprint identification chip packaging module shown in FIG. 3 may further include an insulating layer 303 . The insulating layer 303 is pasted on the lower surface of the fingerprint identification chip and exposes the pads on the lower surface of the fingerprint identification chip.

Fig. 4 is a schematic structural diagram of another fingerprint identification chip package module provided according to an embodiment of the present application. As shown in FIG. 4 , the fingerprint recognition chip package module 400 includes: a fingerprint recognition chip 401 , a first insulating layer 402 , a piezoresistive sensor 411 , a piezoresistive sensor 412 , a piezoresistive sensor 413 and a piezoresistive sensor 414 .

As shown in FIG. 4 , the piezoresistive sensor 411 and the piezoresistive sensor 412 are attached to the lower surface of the fingerprint recognition chip 401 . The piezoresistive sensor 411 and the piezoresistive sensor 412 are bonded on the upper surface of the first insulating layer 402 . The piezoresistive sensor 413 and the piezoresistive sensor 414 are attached to the lower surface of the first insulating layer 402 .

The lower surface of the fingerprint recognition chip 401 may include pads (not shown in the figure). The piezoresistive sensor 411 , the piezoresistive sensor 412 , the piezoresistive sensor 413 and the piezoresistive sensor 414 are all connected to the pads.

In addition, the fingerprint identification chip packaging module shown in FIG. 4 may further include a second insulating layer 403 . The second insulating layer 403 is pasted on the lower surface of the fingerprint identification chip and exposes the pads on the lower surface of the fingerprint identification chip. The second insulating layer 403 may include a space in which the piezoresistive sensor and the insulating layer between the piezoresistive sensors are located.

Fig. 5 is a schematic structural diagram of another fingerprint identification chip packaging module provided according to an embodiment of the present application. As shown in FIG. 5 , the fingerprint recognition chip packaging module 500 includes: a fingerprint recognition chip 501 , a first insulating layer 502 , a piezoresistive sensor 511 , a piezoresistive sensor 512 , a piezoresistive sensor 513 and a piezoresistive sensor 514 .

As shown in FIG. 5 , the piezoresistive sensor 511 and the piezoresistive sensor 512 are bonded on the upper surface of the fingerprint identification chip 501 . The piezoresistive sensor 511 and the piezoresistive sensor 512 are attached to the lower surface of the first insulating layer 502 . The piezoresistive sensor 513 and the piezoresistive sensor 514 are adhered to the upper surface of the first insulating layer 502 .

The upper surface of the fingerprint recognition chip 501 may include pads. The piezoresistive sensor 511 , the piezoresistive sensor 512 , the piezoresistive sensor 513 and the piezoresistive sensor 514 are all connected to the pads.

Further, the fingerprint identification chip 501 includes a fingerprint identification area. The piezoresistive sensor 511 , the piezoresistive sensor 512 , the piezoresistive sensor 513 and the piezoresistive sensor 514 are pasted on areas other than the fingerprint recognition area.

In addition, the fingerprint identification chip packaging module shown in FIG. 5 may further include a second insulating layer 503 . The second insulating layer 503 is attached to the lower surface of the fingerprint recognition chip and exposes the pads on the lower surface of the fingerprint recognition chip.

The fingerprint identification chip packaging module shown in FIGS. 2 to 5 directly attaches the piezoresistive sensor to the surface of the fingerprint chip. In this way, the piezoresistive sensor can be used to obtain the user's pressure on the fingerprint identification chip. The terminal device can use the obtained pressure to perform corresponding operations. In addition, the piezoresistive sensor is directly attached to the surface of the fingerprint chip, so there is no material between the piezoresistive sensor and the fingerprint recognition chip that may be easily deformed by temperature. In this way, the piezoresistive sensor is not subject to pressure from the material attached above the piezoresistive sensor due to temperature changes. In this way, the number of calibration piezoresistive sensors and the noise can be reduced. In addition, the sensitivity of the piezoresistive sensors used can be increased, so that more pressure levels can be recognized.

When the fingerprint identification chip shown in Figure 3 to Figure 5 is packaged into a fingerprint identification module with a package substrate, the pad connected to the piezoresistive sensor is connected to the package substrate, so that it can be connected to a power supply and a processing module to operate according to the piezoresistive sensor. The signal acquired by the sensor determines the pressure or pressure level. More specifically, if the piezoresistive sensor is pasted on the fingerprint identification chip, the pad connected to the piezoresistive sensor can be connected to the substrate through the connection channel. The connection channel may be a connection channel formed by using Through Silicon Via technology (Through Silicon Via, TSV), or may be an electrical connection line directly used to connect to the substrate, which is not limited in the embodiment of the present application.

Fig. 6 is a schematic structural diagram of a fingerprint recognition module provided according to an embodiment of the present application. As shown in FIG. 6 , the fingerprint recognition module 600 includes a fingerprint recognition chip 601 , two piezoresistive sensors 602 and a packaging substrate 603 .

The fingerprint identification chip 601 is pasted on the upper surface of the package substrate 603 through the adhesive layer 604 . Two piezoresistive sensors 602 are located inside the packaging substrate 603 .

The packaging substrate 603 includes pads, and the piezoresistive sensor is connected to the pads.

The package substrate 603 includes a support layer 605 . Optionally, in some embodiments piezoresistive sensors may be located below the support layer.

FIG. 7 is a schematic structural diagram of another fingerprint identification module provided according to an embodiment of the present application. As shown in FIG. 7 , the fingerprint recognition module includes a fingerprint recognition chip 701 , a packaging substrate 702 , an insulating layer 703 , a piezoresistive sensor 711 , a piezoresistive sensor 712 , a piezoresistive sensor 713 and a piezoresistive sensor 714 .

The fingerprint identification chip 701 is pasted on the upper surface of the packaging substrate 702 through the adhesive layer 704 .

The package substrate 702 includes a support layer 705 . Optionally, in some embodiments, the piezoresistive sensor 711 and the piezoresistive sensor 712 can be attached to the lower surface of the support layer 705, and the insulating layer 703 is attached below the piezoresistive sensor 711 and the piezoresistive sensor 712 , the piezoresistive sensor 713 and the piezoresistive sensor 714 are attached to the lower surface of the insulating layer 703 .

The package substrate 702 includes pads, and the piezoresistive sensors are connected to the pads.

The piezoresistive sensors shown in Figures 6 and 7 are located inside the substrate. In this way, the piezoresistive sensor can be used to obtain the user's pressure on the fingerprint identification chip. The terminal device can use the obtained pressure to perform corresponding operations. In addition, the piezoresistive sensor is located inside the substrate and the deformation of the substrate due to the influence of temperature is small, so the piezoresistive sensor receives less pressure from the material attached above the piezoresistive sensor due to temperature changes. In this way, the number of calibration piezoresistive sensors and the noise can be reduced. In addition, the sensitivity of the piezoresistive sensors used can be increased, so that more pressure levels can be recognized.

Fig. 8 is a schematic structural diagram of a fingerprint recognition module provided according to an embodiment of the present application. As shown in FIG. 8 , the fingerprint identification module 800 includes a fingerprint identification chip 801 , two piezoresistive sensors 802 , a packaging substrate 803 and a plastic packaging material 804 .

The fingerprint identification chip 801 is pasted on the upper surface of the packaging substrate 803 through the adhesive layer 805 . The plastic packaging material 804 covers the packaging substrate 803 and the fingerprint identification chip 801 , and the lower surface of the packaging substrate 803 is not covered by the plastic packaging material 804 .

Two piezoresistive sensors 802 are pasted on the upper surface of the molding material 804 .

FIG. 9 is a schematic structural diagram of another fingerprint identification module provided according to an embodiment of the present application. As shown in Figure 9, the fingerprint recognition chip packaging module 900 includes: a fingerprint recognition chip 901, an insulating layer 902, a packaging substrate 903, a plastic packaging material 904, a piezoresistive sensor 911, a piezoresistive sensor 912, a piezoresistive sensor 913 and piezoresistive sensor 914 .

The fingerprint identification chip 901 is pasted on the upper surface of the packaging substrate 903 through the adhesive layer 905 . The plastic packaging material 904 covers the packaging substrate 903 and the fingerprint identification chip 901 , and the lower surface of the packaging substrate 903 is not covered by the plastic packaging material 904 .

The piezoresistive sensor 911 and the piezoresistive sensor 912 are bonded on the upper surface of the molding material 904 . The piezoresistive sensor 911 and the piezoresistive sensor 912 are attached to the lower surface of the insulating layer 902 . The piezoresistive sensor 913 and the piezoresistive sensor 914 are bonded on the upper surface of the insulating layer 902 .

Further, the molding material includes a fingerprint recognition area. The piezoresistive sensors shown in FIG. 8 and FIG. 9 can be pasted on areas other than the fingerprint recognition area.

The piezoresistive sensors shown in Figures 8 and 9 are attached to the substrate. Specifically, the piezoresistive sensor is connected to the pad on the upper surface of the plastic packaging material, and the pad is connected to the substrate through the connection channel. The connection channel may be an electrical connection channel inside the molding material. The connection channel can also be an electrical connection channel outside the encapsulation material.

The fingerprint identification chip packaging module shown in Fig. 8 and Fig. 9 directly attaches the piezoresistive sensor to the upper surface of the plastic packaging material. In this way, the piezoresistive sensor can be used to obtain the user's pressure on the fingerprint identification chip. The terminal device can use the obtained pressure to perform corresponding operations. In addition, the piezoresistive sensor is directly attached to the upper surface of the molding material, so there is no material above the piezoresistive sensor that may be easily deformed by temperature. In this way, the piezoresistive sensor is not subject to pressure from the material attached above the piezoresistive sensor due to temperature changes. In this way, the number of calibration piezoresistive sensors and the noise can be reduced. In addition, the sensitivity of the piezoresistive sensors used can be increased, so that more pressure levels can be recognized.

The piezoresistive sensors in the embodiments shown in FIGS. 2 to 9 may be connected to the pad through a redistribution layer (Redistribution Layer, RDL). Of course, the piezoresistive sensor can also be connected to the pad in other ways.

For example, FIG. 10 is a schematic bottom view of a fingerprint identification chip packaging module. The fingerprint recognition chip packaging module shown in FIG. 10 is a schematic bottom view of the fingerprint recognition packaging module shown in FIG. 4 . As shown in Figure 10, the piezoresistive sensor 411 is connected to the pad 421 of the fingerprint recognition chip 401, the piezoresistive sensor 412 is connected to the pad 422 of the fingerprint recognition chip 401, and the soldering of the piezoresistive sensor 413 and the fingerprint recognition chip 401 The pad 423 is connected, and the piezoresistive sensor 414 is connected to the pad 424 of the fingerprint recognition chip 401 .

It can be understood that, in addition to the four pads shown in FIG. 10 , the lower surface of the fingerprint identification chip 401 may also include other pads, and the fingerprint identification chip 401 may be connected to the packaging substrate through these pads. In addition, in order to illustrate the connection relationship between the first layer of piezoresistive sensors and the pads, FIG. 10 does not show the insulating layer between the two layers of piezoresistive sensors.

The connection relationship between the piezoresistive sensor and the pad shown in FIG. 2 , FIG. 3 , and FIG. 5 to FIG. 9 is similar to that shown in FIG. 10 , so it is unnecessary to repeat them here.

It can be understood that the shape of the pad shown in FIG. 10 , the connection form of the pad and the piezoresistive sensor, and the shape of the piezoresistive sensor are only schematic diagrams.

It can be understood that the fingerprint identification chip package modules shown in FIGS. 2 to 9 are only intended to help those skilled in the art better understand the embodiments listed in this application. For example, the number of piezoresistive sensors in the fingerprint recognition chip packaging module shown in FIG. 2 , FIG. 3 , FIG. 6 and FIG. 8 may be one or more than two. The number of piezoresistive sensors per layer in the fingerprint identification chip packaging module shown in Fig. 4, Fig. 5, Fig. 7 and Fig. 9 can also be one or more than two.

The four piezoresistive sensors shown in Figure 4, Figure 5, Figure 7 and Figure 9 can form a bridge. In this way, the amount of pressing signals can be doubled, the range of pressure that can be detected can be increased, and the signal-to-noise ratio (Signal-Noise Ratio, SNR) can be increased.

The four piezoresistive sensors shown in FIG. 4 , FIG. 5 , FIG. 7 and FIG. 9 form a three-layer structure with the insulating layer, that is, an insulating layer is included between two layers of piezoresistive sensors. The insulating layer can be made of a material that is less deformed by temperature, for example, green oil or the like.

Fig. 11 is a schematic flowchart of a wafer-level fingerprint identification chip packaging method provided according to an embodiment of the present application.

1101. Arrange N piezoresistive sensors on the first surface of the fingerprint identification chip, where the first surface is the upper or lower surface of the fingerprint identification chip, where N is a positive integer greater than or equal to 1.

1102. Connect the N piezoresistive sensors to the pads of the fingerprint chip through connection lines.

Optionally, in some embodiments, arranging N piezoresistive sensors on the first surface of the fingerprint identification chip includes: arranging a first layer of piezoresistive sensors on the lower surface of the fingerprint chip; The lower surface of one layer of piezoresistive sensors is coated with an insulating layer; a second layer of piezoresistive sensors is arranged on the lower surface of the insulating layer, wherein both the first layer of piezoresistive sensors and the second layer of piezoresistive sensors are At least one piezoresistive sensor is included.

Optionally, in some embodiments, arranging N piezoresistive sensors on the first surface of the fingerprint identification chip includes: arranging a first layer of piezoresistive sensors on the upper surface of the fingerprint chip; The upper surface of one layer of piezoresistive sensors is coated with an insulating layer; a second layer of piezoresistive sensors is arranged on the upper surface of the insulating layer, wherein both the first layer of piezoresistive sensors and the second layer of piezoresistive sensors are At least one piezoresistive sensor is included.

Further, the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form an electric bridge.

The fingerprint identification chip packaging module packaged by the method shown in FIG. 11 directly attaches the piezoresistive sensor to the surface of the fingerprint chip. The embodiment and beneficial effects of the specific structure of the fingerprint recognition chip packaging module manufactured according to the method shown in FIG. 11 can refer to the fingerprint recognition chip packaging module shown in FIG. 2 to FIG. 5 , which need not be repeated here.

Fig. 12 is a schematic flowchart of a method for packaging a fingerprint recognition module according to an embodiment of the present application.

1201. Attach the fingerprint identification chip to the upper surface of the packaging substrate through an adhesive layer.

1202. Arrange N piezoresistive sensors inside the packaging substrate, where N is a positive integer greater than or equal to 1.

1203. Connect the N piezoresistive sensors to the pads of the packaging substrate through connecting lines.

Optionally, in some embodiments, arranging the N piezoresistive sensors inside the package substrate includes: arranging the N piezoresistive sensors under the supporting layer of the package substrate.

Optionally, in some embodiments, arranging the N piezoresistive sensors under the support layer of the package substrate includes: arranging a first layer of piezoresistive sensors on the lower surface of the support layer of the package substrate sensor; an insulating layer is coated on the lower surface of the first layer of piezoresistive sensor; a second layer of piezoresistive sensor is arranged on the lower surface of the insulating layer, wherein the first layer of piezoresistive sensor and the second layer The piezoresistive sensors each include at least one piezoresistive sensor.

The fingerprint identification module packaged by the method shown in FIG. 12 can place the piezoresistive sensor inside the packaging substrate. The embodiment and beneficial effect of the specific structure of the fingerprint identification module produced according to the method shown in FIG. 12 can refer to the fingerprint identification chip package module shown in FIGS.

Fig. 13 is a schematic flowchart of a method for packaging a fingerprint recognition module according to an embodiment of the present application.

1301. Attach the fingerprint identification chip to the upper surface of the packaging substrate through an adhesive layer.

1302. Cover the fingerprint identification chip and the packaging substrate with a plastic packaging material, wherein the lower surface of the packaging substrate is not covered by the plastic packaging material.

1303. Arrange N piezoresistive sensors on the upper surface of the molding material, where the N piezoresistive sensors are connected to the packaging substrate through connection channels, where N is a positive integer greater than or equal to 1.

Optionally, in some embodiments, arranging N piezoresistive sensors on the upper surface of the molding material includes: arranging a first layer of piezoresistive sensors on the upper surface of the molding material; The upper surface of one layer of piezoresistive sensors is coated with an insulating layer; a second layer of piezoresistive sensors is arranged on the upper surface of the insulating layer, wherein both the first layer of piezoresistive sensors and the second layer of piezoresistive sensors are At least one piezoresistive sensor is included.

Further, the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form an electric bridge.

Further, when the fingerprint recognition chip and the packaging substrate are covered with a plastic packaging material, an electrical connection channel can be formed in the plastic packaging material, and one end of the electrical connection channel is connected to the packaging substrate. The other end of the electrical connection channel is exposed on or close to the upper surface of the molding material. If the electrical connection channel is not exposed on the upper surface of the molding material, before arranging the N piezoresistive sensors on the upper surface of the molding material, the electrical connection channel can be exposed by grinding or laser engraving, etc. .

The above is only a specific embodiment of the application, but the scope of protection of the application is not limited thereto. Any person familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application. All should be covered within the protection scope of the present application, so the protection scope of the present application should be based on the protection scope of the claims.

Claims (19)

1. A fingerprint identification chip packaging module, characterized in that, the fingerprint identification chip packaging module comprises: a fingerprint identification chip and N piezoresistive sensors, wherein N is a positive integer greater than or equal to 1; The first surface of the fingerprint identification chip has a pad, and the first surface is the upper surface of the fingerprint identification chip; Part or all of the N piezoresistive sensors are attached to the first surface of the fingerprint recognition chip; Each piezoresistive sensor in the N piezoresistive sensors is connected to the pad; The N piezoresistive sensors are divided into two layers and attached to the first surface of the fingerprint identification chip, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors in the two layers both include at least one piezoresistive sensor; The fingerprint identification chip packaging module further includes an insulating layer between the first layer of piezoresistive sensors and the second layer of piezoresistive sensors. 2 . The fingerprint recognition chip packaging module according to claim 1 , wherein the piezoresistive sensor of the first layer and the piezoresistive sensor of the second layer form an electric bridge. 3. The fingerprint identification chip packaging module according to claim 1 or 2, wherein the first surface has a fingerprint identification area, and part or all of the N piezoresistive sensors are attached to the fingerprint area. Areas outside the recognition area. 4. A fingerprint identification chip packaging module, characterized in that, the fingerprint identification chip packaging module comprises: a fingerprint identification chip and N piezoresistive sensors, wherein N is a positive integer greater than or equal to 1; The first surface of the fingerprint identification chip has a pad, and the first surface is the lower surface of the fingerprint identification chip; Part or all of the N piezoresistive sensors are attached to the first surface of the fingerprint identification chip; Each piezoresistive sensor in the N piezoresistive sensors is connected to the pad; The N piezoresistive sensors are divided into two layers and attached to the first surface of the fingerprint identification chip, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors in the two layers both include at least one piezoresistive sensor; The fingerprint identification chip packaging module further includes an insulating layer between the first layer of piezoresistive sensors and the second layer of piezoresistive sensors. 5 . The fingerprint identification chip packaging module according to claim 4 , wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form an electrical bridge. 6. A fingerprint recognition module, characterized in that the fingerprint recognition module comprises: a fingerprint recognition chip, N piezoresistive sensors, a packaging substrate and a plastic packaging material, wherein N is a positive integer greater than or equal to 1, The fingerprint identification chip is attached to the upper surface of the packaging substrate; The molding material covers the packaging substrate and the fingerprint identification chip, and the lower surface of the packaging substrate is not covered by the molding material; The N piezoresistive sensors are located inside the packaging substrate; Each piezoresistive sensor in the N piezoresistive sensors is connected to the packaging substrate; The packaging substrate includes a pad, and each piezoresistive sensor in the N piezoresistive sensors is connected to the pad; The package substrate includes a support layer, and the N piezoresistive sensors are located below the support layer; The N piezoresistive sensors are divided into two layers and attached to the lower surface of the support layer, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors in the two layers each include at least one piezoresistive sensor; The fingerprint recognition module further includes an insulating layer between the first layer of piezoresistive sensors and the second layer of piezoresistive sensors. 7. The fingerprint recognition module according to claim 6, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form an electric bridge. 8. A fingerprint recognition module, characterized in that the fingerprint recognition module comprises: a fingerprint recognition chip, N piezoresistive sensors, a packaging substrate and a plastic packaging material, wherein N is a positive integer greater than or equal to 1, The fingerprint identification chip is attached to the upper surface of the packaging substrate; The molding material covers the packaging substrate and the fingerprint identification chip, and the lower surface of the packaging substrate is not covered by the molding material; Part or all of the N piezoresistive sensors are attached to the upper surface of the molding material; Each piezoresistive sensor in the N piezoresistive sensors is connected to the packaging substrate; The N piezoresistive sensors are divided into two layers and attached to the upper surface of the plastic sealing material, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors in the two layers each include at least one piezoresistive sensor; The fingerprint recognition module further includes an insulating layer between the first layer of piezoresistive sensors and the second layer of piezoresistive sensors. 9. The fingerprint identification module according to claim 8, wherein the upper surface of the plastic sealing material has a fingerprint identification area, and part or all of the N piezoresistive sensors are attached to the fingerprint identification area outside the area. 10. The fingerprint identification module according to claim 8 or 9, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form an electric bridge. 11. A wafer-level fingerprint identification chip packaging method, characterized in that the method comprises: N piezoresistive sensors are arranged on the first surface of the fingerprint identification chip, wherein the first surface is the upper surface of the fingerprint identification chip, and N is a positive integer greater than or equal to 1; Connecting the N piezoresistive sensors to the pads of the fingerprint chip through connecting lines; The arrangement of N piezoresistive sensors on the first surface of the fingerprint recognition chip includes: Arranging a first layer of piezoresistive sensors on the upper surface of the fingerprint chip; Coating an insulating layer on the upper surface of the first piezoresistive sensor; A second layer of piezoresistive sensors is arranged on the upper surface of the insulating layer, wherein both the first layer of piezoresistive sensors and the second layer of piezoresistive sensors include at least one piezoresistive sensor. 12. The method of claim 11, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form a bridge. 13. A wafer-level fingerprint identification chip packaging method, characterized in that the method comprises: N piezoresistive sensors are arranged on the first surface of the fingerprint identification chip, wherein the first surface is the lower surface of the fingerprint identification chip, and N is a positive integer greater than or equal to 1; Connecting the N piezoresistive sensors to the pads of the fingerprint chip through connecting lines; Wherein, the arrangement of N piezoresistive sensors on the first surface of the fingerprint recognition chip includes: A first layer of piezoresistive sensors is arranged on the lower surface of the fingerprint chip; Coating an insulating layer on the lower surface of the first piezoresistive sensor; A second layer of piezoresistive sensors is arranged on the lower surface of the insulating layer, wherein both the first layer of piezoresistive sensors and the second layer of piezoresistive sensors include at least one piezoresistive sensor. 14. The method of claim 13, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form a bridge. 15. A method for encapsulating a fingerprint identification module, characterized in that the method comprises: Attach the fingerprint identification chip to the upper surface of the packaging substrate through the adhesive layer; Covering the fingerprint identification chip and the packaging substrate with a plastic packaging material, wherein the lower surface of the packaging substrate is not covered by the plastic packaging material; Arranging N piezoresistive sensors inside the packaging substrate, where N is a positive integer greater than or equal to 1; Connecting the N piezoresistive sensors to the pads of the packaging substrate through connecting lines; Wherein, N piezoresistive sensors are arranged inside the packaging substrate, including: Arranging a first layer of piezoresistive sensors on the lower surface of the support layer of the packaging substrate; Coating an insulating layer on the lower surface of the first piezoresistive sensor; A second layer of piezoresistive sensors is arranged on the lower surface of the insulating layer, wherein both the first layer of piezoresistive sensors and the second layer of piezoresistive sensors include at least one piezoresistive sensor. 16. The method of claim 15, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form a bridge. 17. A method for encapsulating a fingerprint identification module, characterized in that the method comprises: Attach the fingerprint identification chip to the upper surface of the packaging substrate through the adhesive layer; Covering the fingerprint identification chip and the packaging substrate with a plastic packaging material, wherein the lower surface of the packaging substrate is not covered by the plastic packaging material; Arranging N piezoresistive sensors on the upper surface of the molding material, wherein the N piezoresistive sensors are connected to the packaging substrate through connection channels, and N is a positive integer greater than or equal to 1; Arranging N piezoresistive sensors on the upper surface of the molding material, including: Arranging a first layer of piezoresistive sensors on the upper surface of the molding material; Coating an insulating layer on the upper surface of the first piezoresistive sensor; A second layer of piezoresistive sensors is arranged on the upper surface of the insulating layer, wherein both the first layer of piezoresistive sensors and the second layer of piezoresistive sensors include at least one piezoresistive sensor. 18. The method according to claim 17, wherein the upper surface of the molding material has a fingerprint recognition area, Arranging N piezoresistive sensors on the upper surface of the molding material, including: Part or all of the N piezoresistive sensors are pasted on areas other than the fingerprint identification area. 19. The method according to claim 17 or 18, wherein the first layer of piezoresistive sensors and the second layer of piezoresistive sensors form a bridge.