CN107437654A - Antenna device - Google Patents

Abstract

An antenna device comprises a package and at least one antenna. The package comprises at least one radio frequency chip and a molding adhesive. The molding adhesive contacts at least one side wall of the radio frequency chip. The antenna has at least one conductor. The conductor is at least partially in the molding adhesive, and the conductor is operably connected to the radio frequency chip.

Description

Antenna device

technical field

The present disclosure relates to an antenna device.

Background technique

System in package (SiP) is a package of multiple integrated circuits in a single module. A system-in-package can perform multiple functions in an electronic device, and is commonly used in mobile phones, digital music players, and the like. Dies in a system-in-package can be stacked on a substrate and connected with wires. Alternatively, using flip chip technology, solder balls are used to connect the stacked chips, which means that the multi-function unit can be placed in a multi-chip package, so that the package only needs a small number of external components to operate.

Contents of the invention

According to various embodiments of the present disclosure, an antenna device includes a package and at least one antenna. The package body includes at least one radio frequency chip and molding glue. The stamping glue is in contact with at least one side wall of the radio frequency chip. The antenna includes at least one conductor. The conductor is at least partially within the molding compound, and the conductor is operatively connected to the RF die.

Description of drawings

Aspects of the present disclosure will be more readily understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion.

FIG. 1 shows a top view of an antenna device according to various embodiments of the present disclosure;

FIG. 2 shows a cross-sectional view of the antenna device of FIG. 1 along a line segment 2;

FIG. 3 illustrates a perspective view of the first antenna of FIG. 1;

4-13 illustrate cross-sectional views of antenna device manufacturing methods according to various embodiments of the present disclosure;

FIG. 14 is a top view of the first antenna shown in FIG. 13;

FIG. 15 shows a cross-sectional view of the first antenna of FIG. 14 along a line segment 15;

16-21 illustrate top views of a first antenna according to various embodiments of the present disclosure;

22 to 26 illustrate cross-sectional views of the manufacturing method of the antenna device shown in FIG. 13;

FIG. 27 illustrates a cross-sectional view of an antenna device according to various embodiments of the present disclosure;

FIG. 28 illustrates a cross-sectional view of an antenna device according to various embodiments of the present disclosure;

FIG. 29 shows a cross-sectional view of an antenna device according to various embodiments of the present disclosure;

FIG. 30 shows a cross-sectional view of an antenna device according to various embodiments of the present disclosure;

FIG. 31 shows a partial cross-sectional view of a radiation element according to various embodiments of the present disclosure;

32 is a top view of a redistribution layer, a ground element, and a radiation element according to various embodiments of the present disclosure;

FIG. 33 is a three-dimensional perspective view of the redistribution layer, the ground element and the radiation element of FIG. 32;

34 is a perspective view illustrating a redistribution layer, a ground element, and a radiation element according to various embodiments of the present disclosure;

35 is a perspective view illustrating a redistribution layer, a ground element, and a radiation element according to various embodiments of the present disclosure;

36 is a top view of a redistribution layer, a ground element, a radiation element, and a director according to various embodiments of the present disclosure;

FIG. 37 is a three-dimensional perspective view of the redistribution layer, the ground element, the radiation element and the director of FIG. 36 .

detailed description

The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these examples are examples only and are not intended to be limiting. For example, in the following description, forming a first feature over or on a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where the first and second features may be formed in direct contact. An embodiment where additional features are formed between features such that the first and second features may not be in direct contact. In addition, the present disclosure may repeat element symbols and/or letters in each example. This repetition is for the purposes of brevity and clarity and does not in itself indicate a relationship between the various embodiments and/or configurations discussed.

Further, for ease of description, spatially relative terms (such as "under", "under", "lower", "above", "upper" and the like may be used herein to describe an element depicted in the figures. The relationship of a feature or feature to another element (or elements) or feature (or features). Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and thus the spatially relative descriptors used herein should be interpreted similarly.

FIG. 1 illustrates a top view of an antenna device 100 according to various embodiments of the present disclosure. FIG. 2 is a cross-sectional view of the antenna device 100 in FIG. 1 along the line segment 2 . Referring to FIG. 1 and FIG. 2 at the same time, the antenna device 100 includes a package body 110 and at least one first antenna 120 . The package body 110 includes at least one radio frequency (RF) chip 114 and a molding compound 116 , and the molding compound 116 contacts at least one sidewall 111 of the RF chip 114 . The molding rubber material 116 has at least one through hole 112 therein. The first antenna 120 has at least one conductor 122 . The conductor 122 is located in the through hole 112 of the molding compound 116 , and the conductor 122 is operatively connected to the RF chip 114 . In other words, the first antenna 120 has at least one conductive element or conductive channel (ie, the conductor 122 ) in the molding compound 116 .

FIG. 3 is a perspective view of the first antenna 120 in FIG. 1 . As shown in FIG. 3 , in various embodiments, the first antenna 120 is a dipole antenna (Dipole antenna), which includes two conductors 122 in the molding compound 116 . The top view shape of at least one of the conductors 122 is substantially L-shaped. That is, the conductor 122 is an L-shaped conductive wall in the molding compound 116 . In various embodiments, at least one of the conductors 122 includes a radiating element 122r and a connecting element 122c. The connecting element 122c is connected to the radiating element 122r to form an L-shaped conductive wall.

Referring to FIG. 1 and FIG. 2 at the same time, since the radio frequency chip 114 is disposed in the molding compound 116 , a miniaturized design of the antenna device 100 can be achieved. In various embodiments, the total thickness of the antenna device 100 may range from about 400 μm to 700 μm, such as 600 μm.

The radio frequency chip 114 can be, for example, a millimeter wave (Millimeter wave; MMW) semiconductor chip, such as a 60GHz radio frequency chip, which can be used in a WiFi transmission module. In addition, the antenna device 100 may include other types of chips (not shown) to increase other functions. With such a design, the antenna device 100 is a millimeter wave system-in-package.

In various embodiments, the first antenna 120 further includes at least one director 125 . The director 125 is adjacent to the radiating element 122r, and the radiating element 122r is located between the director 125 and the RF chip 114 (see FIG. 1 ). The top view shape of the guide 125 is substantially straight, and the guide 125 is a conductive wall in the molding compound 116 . The director 125 can enhance the gain of the first antenna 120 at high frequencies.

Referring to FIG. 2 , the antenna device 100 further includes at least one dielectric layer 150a. The dielectric layer 150 a is located above the RF chip 114 and the molding compound 116 . In addition, the antenna device 100 further includes at least one redistribution layer 160a. The redistribution layer 160 a is located in the dielectric layer 150 a, and the redistribution layer 160 a is electrically connected to the radio frequency chip 114 and the conductor 122 of the first antenna 120 . The radio frequency chip 114 has two opposing surfaces 117 , 118 . The RF chip 114 has at least one conductive pillar 115 . The conductive pillars 115 are located on the surface 118 of the RF chip 114 facing the dielectric layer 150a. The redistribution layer 160 a is electrically connected to the conductive pillar 115 of the radio frequency chip 114 . The connecting element 122c (see FIG. 3 ) of the conductor 122 is electrically connected to the redistribution layer 160a so that the first antenna 120 is electrically connected to the radio frequency chip 114 . That is to say, the radio frequency chip 114 can receive the signal from the first antenna 120 through the redistribution layer 160a, or can transmit the signal to the first antenna 120 through the redistribution layer 160a. Since there is no solder bump between the radio frequency chip 114 and the radiation element 122r (see FIG. 3 ) of the first antenna 120 , the power consumption between the radio frequency chip 114 and the first antenna 120 can be reduced.

In various embodiments, the antenna device 100 may further include at least one second antenna, and the second antenna includes at least one feeding line 162 , at least one ground element 164 , at least one dielectric layer 150 b and at least one radiation element 140 . The feeding line 162 and the grounding element 164 may be located in different layers. Alternatively, in various embodiments, the feeding line 162 and the grounding element 164 may be substantially located on the same plane or in the same layer, and the feeding line 162 and the grounding element 164 may be part of the redistribution layer 160a. The feeding line 162 is located in the dielectric layer 150 a, and the feeding line 162 is electrically connected to the radio frequency chip 114 . The ground element 164 is located in the dielectric layer 150 a and has at least one hole 166 therein. The projection of the radiation element 140 on the ground element 164 overlaps with the hole 166 of the ground element 164 . The dielectric layer 150b is located above the ground element 164 and the dielectric layer 150a. The radiation element 140 is located on the dielectric layer 150 b, and the radiation element 140 is operatively connected to the radio frequency chip 114 . Through such a configuration, the ground element 164 is used as a ground plane of the radiation element 140 , and the radiation element 140 , the ground element 164 and the feeding line 162 can function as a patch antenna. For example, area A in FIG. 2 can be regarded as a panel antenna.

When the antenna device is in operation, the radio frequency chip 114 can receive the signal from the radiating element 140 through the feeding line 162 , or the radio frequency chip 114 can transmit the signal to the radiating element 140 through the feeding line 162 . Since there is no solder bump between the RF chip 114 and the radiating element 140 , the power consumption between the RF chip 114 and the panel antenna (that is, the area A including the feeding line 162 , the grounding element 164 and the radiating element 140 ) can be reduced.

In various embodiments, the antenna device 100 may further include a dielectric layer 150c. The dielectric layer 150c is located above the dielectric layer 150b, and the radiation element 140 is located in the dielectric layer 150c. The dielectric layer 150c can prevent two adjacent radiation elements 140 from being in electrical contact with each other.

Referring to FIG. 1 , the antenna device 100 includes a plurality of first antennas 120 and a plurality of radiation elements 140 . The first antenna 120 is disposed close to the edge of the molding compound 116 , so that the radiation element 140 is surrounded by the first antenna 120 , thereby reducing the size of the antenna device 100 . It should be understood that the numbers of the first antenna 120 and the radiating elements 140 in FIG. 1 are for illustration and are not intended to limit various implementations of the present disclosure.

Referring to FIG. 2 , the antenna device 100 may further include a heat conducting plate 180 . The heat conduction plate 180 is thermally coupled to the surface 117 of the radio frequency chip 114 facing away from the dielectric layer 150a, for example, through the heat conduction interface material 36 . Surface 117 is located on the backside of radio frequency die 114 .

In addition, the antenna device 100 may further include at least one buffer layer 24 and an under-bump metallurgy (UBM) 191 . The buffer layer 24 is located on the surface of the package body 110 facing away from the dielectric layer 150 a , and the UBM layer 191 is located in the buffer layer 24 . Some UBM layers 191 contact the heat conducting plate 180 , and other UBM layers 191 contact through integrated fan-out vias (TIVs) 121 .

The heat conduction bump 190 and the electrical connector 195 are respectively located on the UBM layer 191 . The electrical connector 195 is electrically connected to the integrated fan-out channel 121 , and the heat conduction bump 190 is thermally coupled to the heat conduction plate 180 . The heat conducting plate 180 can conduct heat from the RF chip 114 to the heat conducting bump 190 , thereby reducing the working temperature of the RF chip 114 . In various embodiments, the thermally conductive plate 180 may cover the surface 117 of the radio frequency die 114 . That is to say, the area of the heat conducting plate 180 may be substantially the same as the area of the surface 117 of the RF chip 114 , or larger than the area of the surface 117 of the RF chip 114 . With such a design, the radio frequency chip 114 can have a larger thermal expansion area through the thermally conductive plate 180 and the thermally conductive bump 190 below and adjacent to it.

4 to 13 illustrate cross-sectional views of antenna device manufacturing methods according to various embodiments of the present disclosure. Referring to FIG. 4 , the adhesive layer 22 is formed on the carrier 230 . The carrier 230 may be a blank glass carrier, a blank ceramic carrier, or the like. The adhesive layer 22 can be made of adhesive, such as ultraviolet adhesive, light-to-heat conversion (LTHC) adhesive or the like, and other types of adhesive can also be used. The buffer layer 24 is formed on the adhesive layer 22 . The buffer layer 24 is a dielectric layer, which may be a polymer layer. The polymer layer may include, for example, polyimide (Polyimide), polybenzoxazole (Polybenzoxazole; PBO), benzocyclobutene (Benzocyclobutene; BCB), ABF (Ajinomoto buildup film) film, solder resist (Solder resist ; SR) film or the like. The buffer layer 24 may be a substantially planar layer with a substantially uniform thickness, which may be greater than about 2 μm, and may range from 2 μm to 40 μm. In various embodiments, the upper and lower surfaces of the package body 110 may also be planar. Next, a thermally conductive plate 180 may be formed and patterned on the buffer layer 24 . The material of the heat conducting plate 180 may include copper, silver or gold.

Referring to FIG. 5 , the seed layer 26 is formed on the buffer layer 24 and the thermally conductive plate 180 , for example, by physical vapor deposition (PVD) or metal foil lamination. The seed layer 26 may comprise copper, copper alloys, aluminum, titanium, titanium alloys, or combinations thereof. In various embodiments, the seed layer 26 includes a titanium layer and a copper layer over the titanium layer. Alternatively, the seed layer 26 is a copper layer.

Referring to FIG. 6, a photoresist 28 is coated over the seed layer 26 and then patterned. In this way, the opening 30 can be formed in the photoresist 28 , so that part of the seed layer 26 is exposed from the opening 30 .

Referring to FIG. 7 , the conductive element 32 is formed in the photoresist 28 through plating, which may be electroplating or electro-less plating. Conductive member 32 is plated on exposed seed layer 26 . The conductive member 32 may include copper, aluminum, tungsten, nickel, solder or alloys of the above materials. The height of the conductive member 32 is determined by the thickness of the RF chip 114 (see FIG. 10 ) placed in the subsequent process. In various embodiments, the height of the conductive member 32 is greater than the thickness of the RF die 114 . After the conductive member 32 is plated, the photoresist 28 is removed to obtain the structure of FIG. 8 . After the photoresist 28 is removed, part of the seed layer 26 is exposed.

Referring to FIG. 9 , an etching step is performed to remove the exposed portion of the seed layer 26 , wherein the etching step may include anisotropic etching. After this etching step, the thermally conductive plate 180 is bare. Portions of the seed layer 26 are covered by conductive members 32 . On the other hand, the seed layer 26 covered by the conductive member 32 is still unetched. Herein, the combination of the conductive element 32 and the seed layer 26 remaining therebeneath can be regarded as an integrated fan-out via (TIV) 121 , which can also be referred to as a via. Some integrated fan-out channels 121 form conductors 122 and guides 125 of the first antenna 120 . Although the seed layer 26 and the conductive member 32 are shown as two separate layers, when the material of the seed layer 26 is similar or substantially the same as that of the underlying conductive member 32, the seed layer 26 can be fused with the conductive member 32, and Make the interface indistinguishable between the two. In other embodiments, a discernible interface exists between the seed layer 26 and the underlying conductive member 32 .

FIG. 10 shows that the RF chip 114 is disposed above the heat conducting plate 180 . The radio frequency chip 114 can be bonded to the heat conduction plate 180 through the heat conduction interface material 36 . The radio frequency die 114 may be a logic device die containing logic transistors therein. The RF chip 114 includes a semiconductor substrate (such as a silicon substrate) contacting the thermal interface material 36 . The back surface of the RF chip 114 is in contact with the thermal interface material 36 .

In various embodiments, conductive pillars 115 (such as copper pillars) are formed on top of the RF chip 114 and are electrically coupled to devices such as transistors (not shown) in the RF chip 114 . In various embodiments, the dielectric layer 38 is formed on the top surface of the RF die 114 , and the conductive pillars 115 are at least bottomed in the dielectric layer 38 . In various embodiments, the top surfaces of the conductive pillars 115 and the top surfaces of the dielectric layer 38 may be substantially at the same level. Alternatively, the dielectric layer 38 is not formed, and the conductive pillars 115 protrude from the upper dielectric layer (not shown) of the radio frequency chip 114 .

Referring to FIG. 11 , the molding compound 116 is molded on the RF chip 114 , the integrated fan-out channel 121 , the conductor 122 and the guide 125 . The molding compound 116 fills the gap between the RF chip 114 , the integrated fan-out channel 121 , the conductor 122 and the guide 125 , and can contact the buffer layer 24 . In addition, when the conductive pillars 115 are protruding conductive pillars (this design is not shown), the molding glue 116 fills the gaps between the conductive pillars 115 . The top surface of the molding adhesive 116 is higher than the tops of the conductive pillars 115 , the integrated fan-out channels 121 , the conductors 122 and the guides 125 .

In various embodiments, the molding compound 116 comprises a polymeric material. "Polymer" can mean a thermoset polymer, a thermoplastic polymer, or a combination of the foregoing. Polymer materials can include, for example, plastic materials, epoxy resins, polyimides, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polymethyl methacrylate (PMMA), doped in Polymer components, clays, ceramics, inorganic molecules, or combinations of the above in fillers containing fibers.

Next, a grinding step is performed to thin the molding compound 116 until the conductive posts 115 , the integrated fan-out channels 121 , the conductors 122 and the guides 125 are exposed. The structure after grinding is shown in FIG. 12 , the molding adhesive 116 contacts the sidewall of the RF chip 114 , integrates the fan-out channel 121 , the conductor 122 and the guide 125 . Due to the grinding step, the tops of the integrated fan-out channels 121, conductors 122, and guides 125 are approximately on the same level (coplanar) as the tops of the conductive posts 115, and are also approximately on the same level as the top surface of the molding adhesive 116. (coplanar). The thickness of the molding compound 116 is approximately the same as that of the integrated fan-out channel 121 , conductor 122 and guide 125 . That is, the integrated fan-out channel 121 , the conductor 122 and the guide 125 extend through the molding compound 116 . After grinding, a cleaning step may be performed, eg, wet etching to remove conductive residues.

Next, please refer to FIG. 13 , the redistribution layer 160 a , the feeding line 162 and the grounding element 164 are formed above the molding compound 116 . According to various embodiments, the dielectric layer 150a and the redistribution layer 160a formed in the dielectric layer 150a, the feeding line 162 and the grounding element 164 are formed on the radio frequency chip 114, the molding compound 116, and the integrated fan-out channel 121 , above the conductor 122 and the guide 125 . In various embodiments, the steps of forming the redistribution layer 160a, the feeding line 162 and the grounding element 164 include forming a first dielectric layer on the package body 110, patterning the first dielectric layer, forming the redistribution layer 160a and the ground element 164. The feeding line 162 is on the patterned first dielectric layer, the second dielectric layer is formed on the first dielectric layer, the redistribution layer 160a and the feeding line 162 are formed, and the ground element 164 is formed on the second dielectric layer . Next, a third dielectric layer can be formed to cover the ground element 164 and the second dielectric layer. The first dielectric layer, the second dielectric layer and the third dielectric layer jointly form the dielectric layer 150 a in FIG. 13 .

In various embodiments, the steps of forming the redistribution layer 160a, the feeding line 162 and the ground element 164 include forming a copper seed layer (Blanket copper seed layer), forming and patterning a mask layer (Mask layer) on the overlying Above the copper seed layer, electroplating is applied to form the redistribution layer 160a, the feeding line 162 and the grounding element 164, the mask layer is removed and flash etching is performed to remove the unredistributed layer 160a, the feeding The copper clad seed layer covered by the incoming line 162 and the ground element 164 . In other embodiments, the redistribution layer 160a, the feeding line 162 and the ground element 164 are formed by depositing at least one metal layer, patterning the metal layer, and filling the gap between the patterned metal layers with the dielectric layer 150a .

The redistribution layer 160a, the feeding line 162 and the grounding element 164 may include metal or an alloy, such as aluminum, copper, tungsten, and/or an alloy of the aforementioned materials. The dielectric layer 150a in various embodiments may comprise a polymer such as polyimide, benzocyclobutene, polybenzoxazole or the like. Alternatively, the dielectric layer 150a may include an inorganic dielectric material, such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride. or similar.

FIG. 14 is a top view of the first antenna 120 in FIG. 13 . FIG. 15 is a cross-sectional view of the first antenna 120 in FIG. 14 along the line segment 15 . Referring to FIG. 14 and FIG. 15 at the same time, the redistribution layer 160a is electrically connected to the connecting element 122c via the conductive channel 161 . In various embodiments, a single director 125 is in close proximity to the radiating element 122r, but this is not intended to limit the various embodiments of the present disclosure. In other multiple implementations, as shown in FIG. 16 , the two guides 125 are adjacent to the radiation element 122r. In other various embodiments, as shown in FIG. 17, no director is immediately adjacent to the radiating element 122r.

Referring to FIG. 18 , in various embodiments, the angle θ between the radiating element 122r and the connecting element 122c is greater than about 90 degrees. In many embodiments, the included angle θ ranges from 100 degrees to 150 degrees, such as 120 degrees, but it is not limited to various embodiments of the present disclosure. In various embodiments, a single director 125 is in close proximity to the radiating element 122r, but this is not intended to limit the various embodiments of the present disclosure. In other various embodiments, as shown in FIG. 19, no director is immediately adjacent to the radiating element 122r.

Referring to FIG. 20 , in various embodiments, the conductor 122 does not have the connection element 122c, and the redistribution layer 160a is electrically connected to the radiation element 122r at the end of the radiation element 122r. Each conductor 122 of FIG. 20 may have a rectilinear top shape. In various embodiments, a single director 125 is in close proximity to the radiating element 122r, but this is not intended to limit the various embodiments of the present disclosure. In other various embodiments, as shown in FIG. 21 , the three directors 125 are in close proximity to the radiating element 122r.

Referring to FIG. 22, a dielectric layer 150b is formed on the dielectric layer 150a. In various embodiments, the dielectric layer 150b is molded on the dielectric layer 150a and then ground to reduce the thickness of the dielectric layer 150b. The dielectric layer 150b may include a molding compound, such as plastic material, epoxy resin, polyimide, polyethylene terephthalate, polyvinyl chloride, polymethyl methacrylate, doped in fiber-containing Polymer components in fillers, clays, ceramics, inorganic molecules, or combinations of the above.

Referring to FIG. 23 , the dielectric layer 150c and the radiating element 140 therein are formed on the dielectric layer 150b such that the dielectric layer 150b is located between the dielectric layer 150a and the dielectric layer 150c. In this way, the radiation element 140 is located above the RF chip 114 and the molding compound 116 , and the radiation element 140 , the ground element 164 and the feeding line 162 can function as a flat panel antenna. In various implementations, the radiation element 140 can be formed by electroplating or deposition, but this is not intended to limit the various implementations of the present disclosure.

23 and 24, after the radiation element 140 and the dielectric layer 150c are formed on the dielectric layer 150b, the package body 110 is peeled off from the carrier 230, and the adhesive layer 22 is also cleaned and removed from the package body 110. Referring to FIG. Then, the structure peeled off from the carrier 230 is further attached to another carrier 240 , wherein the dielectric layer 150 c faces the carrier 240 , and the dielectric layer 150 c can contact the carrier 240 .

Referring to FIG. 25 , an opening is formed in the buffer layer 24 , and then the UBM layer 191 may be selectively formed in the opening of the buffer layer 24 . In various embodiments, some UBM layers 191 are formed on the thermally conductive plate 180 while other UBM layers 191 are formed on the integrated fan-out channel 121 . According to various embodiments, the openings are formed in the buffer layer 24 by laser drilling. In addition, photolithography can also be used to form the openings of the buffer layer 24 .

Referring next to FIG. 26 , the heat conduction bump 190 and the electrical connector 195 are formed on the UBM layer 191 . The forming steps of the thermally conductive bump 190 and the electrical connector 195 may include disposing solder balls on the UBM layer 191 (if the UBM layer 191 is not formed, the solder balls may be disposed on the exposed thermally conductive plate 180 and integrated fan-out type via 121), then reflow the solder balls.

After the thermal bumps 190 and the electrical connectors 195 are formed, the carrier 240 is removed, and a dicing process may be performed to cut the structure of FIG. 26 , so that at least one antenna device 100 of FIG. 2 is produced.

FIG. 27 is a cross-sectional view of the antenna device 100a according to various embodiments of the present disclosure. In various embodiments, the antenna device 100a further includes dielectric layers 150d, 150e and at least one director 125a. The dielectric layer 150d is located above the dielectric layer 150c and the radiation element 140, and the dielectric layer 150e is located above the dielectric layer 150d. The director 125a is located in the dielectric layer 150e and overlaps the radiating element 140 . The director 125a can enhance the high-frequency gain of the panel antenna (eg, the area A including the feeding line 162 , the grounding element 164 and the radiating element 140 ). In various embodiments, the dielectric layer 150d can be made of a dielectric material, such as a low dissipation factor (Df) material, glass, organic material, or the like. In other embodiments, the dielectric layer 150d can be made of molded adhesive.

FIG. 28 is a cross-sectional view of an antenna device 100b according to various embodiments of the present disclosure. The antenna device 100b further includes a surface-mount device 210 (Surface-mount device; SMD). The surface mount device 210 is disposed on the buffer layer 24 . In various embodiments, the thermally conductive plate 180 is located above the surface mount device 210 . The surface mount device 210 can be a passive element, such as a resistor, a capacitor, or an inductor, but it is not intended to limit various embodiments of the present disclosure.

FIG. 29 is a cross-sectional view of an antenna device 100c according to various embodiments of the present disclosure. In various embodiments, the dielectric layer 150b is not made of molding compound. That is to say, the dielectric layer 150b and the molding compound 116 are made of different materials. The dielectric layer 150b can be made, for example, of low dissipation factor (Df) material, glass, organic material or the like. In various embodiments, the low dissipation factor of the dielectric layer 150b is less than about 0.01, but it is not intended to limit the various embodiments of the present disclosure.

FIG. 30 is a cross-sectional view of an antenna device 100d according to various embodiments of the present disclosure. The RF die 114a of FIG. 30 faces away from the dielectric layer 150a. That is to say, the lower surface 118 is the front side of the RF chip 114a. The thermal interface material 36a is disposed on the surface 117 of the radio frequency chip 114a facing the dielectric layer 150a. In various embodiments, the ground element 164 in the dielectric layer 150a can act as a thermally conductive plate to expand the thermal expansion area. The heat generated by the radio frequency chip 114 a can be transmitted to the grounding element 164 through the thermal interface material 36 a, and then the heat can be transmitted to the electrical connection 195 through the integrated fan-out channel 121 and the UBM layer 191 .

FIG. 31 shows a partial cross-sectional view of a radiation element 122r according to various embodiments of the present disclosure. In various embodiments, the radiating element 122r includes a plurality of integrated fan-out channels 122t, a plurality of segments of redistribution layers 160a, and a plurality of segments of redistribution layers 160b. The integrated fan-out channel 122t is connected to each other through the segment of the redistribution layer 160a and the segment of the redistribution layer 160b to form the radiating element 122r. With such a design, because the radiating element 122r has an integrated fan-out channel 122t at least longitudinally penetrating the molding compound 116 , the plan view size of the radiating element 122r is reduced.

In various embodiments, a second antenna (eg, a panel antenna) may also be at least partially formed in the molding compound 116 . FIG. 32 shows a top view of the redistribution layer 160a, the ground element 164a and the radiation element 140a according to various embodiments of the present disclosure. FIG. 33 shows a three-dimensional perspective view of the redistribution layer 160 a , the ground element 164 a and the radiation element 140 a of FIG. 32 . Referring to FIG. 32 and FIG. 33 at the same time, the radiation element 140a and the ground element 164a are conductive walls in the molding compound 116, and the top view shape of the ground element 164a and the top view shape of the radiation element 140a are straight lines. The radiating element 140a is separated from the grounding element 164a by at least a portion of the molding compound 116 . The redistribution layer 160a is electrically connected to the radiation element 140a via the channel 161a. With such a design, the radiating element 140 a and the grounding element 164 a in the molding compound 116 can function as a flat panel antenna. In various embodiments, the radiation element 140a may be substantially parallel to the ground element 164a, but this is not intended to limit the various embodiments of the present disclosure.

In various embodiments, as shown in FIG. 34, another ground element 164b is formed in the dielectric layer 150b. The ground element 164b is electrically connected to the ground element 164a via the via 161b in the dielectric layer 150a.

In various embodiments, as shown in FIG. 35, another radiating element 140b is formed in a dielectric layer 150b. The radiation element 140b is electrically connected to the radiation element 140a via the channel 161c in the dielectric layer 150a.

In various embodiments, the second antenna has at least one director proximate to the radiating element 140a. FIG. 36 shows a top view of the redistribution layer 160a, the ground element 164a, the radiation element 140a and the director 125b according to various embodiments of the present disclosure. FIG. 37 shows a three-dimensional perspective view of the redistribution layer 160 a , the ground element 164 a , the radiation element 140 a and the director 125 b of FIG. 36 . In various embodiments, as shown in FIGS. 36 and 37 , the director 125b is immediately adjacent to the radiating element 140a, and the radiating element 140a is located between the director 125b and the ground element 164a. The guide 125b is a conductive wall in the molding compound 116, and the top view shape of the guide 125b can be, for example, a straight line. The director 125b can enhance the gain of the high frequency of the second antenna. In various embodiments, the director 125b is in close proximity to the radiating element 140a, but this is not intended to limit the various embodiments of the present disclosure. In other various embodiments, more than two directors are in close proximity to the radiating element 140a.

In various embodiments of the present disclosure, by embedding the antenna at least partially in the molding compound 116 , the antenna can have at least one thick portion, and the thick portion of the antenna can enhance the efficiency and bandwidth of the antenna.

According to various embodiments of the present disclosure, an antenna device includes a package and at least one antenna. The package body includes at least one radio frequency chip and molding glue. The stamping glue is in contact with at least one side wall of the radio frequency chip. The antenna includes at least one conductor. The conductor is at least partially within the molding compound, and the conductor is operatively connected to the RF die.

In various embodiments of the present disclosure, the thickness of the molding adhesive is substantially the same as the thickness of the conductor.

In various embodiments of the present disclosure, the above-mentioned conductor is a conductive wall in the molding compound.

In various embodiments of the present disclosure, the above-mentioned antenna is a dipole antenna.

In various embodiments of the present disclosure, the top view shape of the conductor of the antenna is substantially L-shaped.

In various embodiments of the present disclosure, the conductor includes a radiation element. The radiating element is at least partially within the molding compound. The antenna includes at least one director. The guide is at least partially within the die compound and spaced from the radiating element by at least a portion of the die compound.

In various embodiments of the present disclosure, the conductor includes a radiation element. The radiating element is at least partially within the molding compound. The antenna includes at least one ground element. The ground element is at least partially within the molded compound and is separated from the radiating element by at least a portion of the molded compound.

In various embodiments of the present disclosure, the conductor includes a radiation element. The radiating element is at least partially within the molding compound. The antenna includes at least one ground element and at least one director. The radiating element is located between the ground element and the director.

In various embodiments of the present disclosure, the above-mentioned antenna device further includes at least one first dielectric layer, at least one feeding line, at least one ground element, at least one second dielectric layer, and at least one radiation element. The first dielectric layer is located above the radio frequency chip and the molding compound. The feeding line is located in the first dielectric layer and is electrically connected to the radio frequency chip. The ground element is located in the first dielectric layer and has at least one hole therein. The second dielectric layer is located above the ground element. The radiating element is on the second dielectric layer. The radiating element is operatively connected to the radio frequency chip.

In various embodiments of the present disclosure, the above-mentioned antenna device further includes a heat conducting plate. The heat conducting plate is thermally coupled to the radio frequency chip.

In various embodiments of the present disclosure, the above-mentioned antenna device further includes at least one heat conduction bump. The heat conduction bump is thermally coupled to the heat conduction plate.

In various embodiments of the present disclosure, the above-mentioned antenna device further includes at least one redistribution layer. The redistribution layer is electrically connected to the conductor of the radio frequency chip and the antenna.

According to various embodiments of the present disclosure, an antenna device includes a package body, at least one first dielectric layer, at least one feeding line, at least one ground element, at least one second dielectric layer and at least one radiation element. The package body includes at least one radio frequency chip and molding glue. The stamping glue is in contact with at least one side wall of the radio frequency chip. The first dielectric layer is located above the radio frequency chip and the molding compound. The feeding line is located in the first dielectric layer and is electrically connected to the radio frequency chip. The ground element is located in the first dielectric layer and has at least one hole therein. The second dielectric layer is located above the ground element. The radiating element is on the second dielectric layer. The radiating element is operatively connected to the radio frequency chip.

In various embodiments of the present disclosure, there is no solder bump between the radio frequency chip and the radiation element.

In various embodiments of the present disclosure, the above-mentioned antenna device further includes at least one third dielectric layer and at least one director. A third dielectric layer is over the radiating element. The director is on the third dielectric layer.

In various embodiments of the present disclosure, the above-mentioned second dielectric layer and the molding adhesive are made of different materials.

In various embodiments of the present disclosure, the projection of the radiation element on the ground element overlaps with the hole of the ground element.

According to various embodiments of the present disclosure, a manufacturing method of an antenna device includes: forming at least one radiation element on a buffer layer. At least one radio frequency chip is arranged on the buffer layer. The molded rubber material is molded so that the radio frequency chip and the radiation element are located therein.

In various embodiments of the present disclosure, the manufacturing method of the antenna device further includes forming at least one heat conduction plate on the buffer layer, and the radio frequency chip is disposed on the heat conduction plate.

In various embodiments of the present disclosure, the manufacturing method of the antenna device further includes forming at least one redistribution layer, and the redistribution layer is electrically connected to the radio frequency chip and the radiation element.

Although the disclosure has been described in some detail with reference to certain embodiments of the disclosure, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

It will be apparent to those skilled in the art that various modifications and changes can be made in the structures of the present disclosure without departing from the scope or spirit of the disclosure. In view of the above, it is intended that the present disclosure cover modifications and variations of this disclosure provided these come within the scope of the appended claims.

The foregoing summarizes features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that the present disclosure may be readily used as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments described herein. Those skilled in the art should also realize that such equivalent structures do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions and modifications herein can be made without departing from the spirit and scope of the present disclosure.

Claims (1)

1. a kind of antenna assembly, it is characterised in that include：

One packaging body, comprising an at least RF chip and a pressing mold glue material, the pressing mold glue material contacts at least the one of the RF chip Side wall；And

An at least antenna, comprising an at least conductor, the conductor is at least partially in the pressing mold glue material, and the conductor operationally connects Connect the RF chip.